Packaging laminating film applied to SDBG (Sodium Dodecyl Boron Glass) manufacturing process as well as preparation method and use method of packaging laminating film

Abstract

The invention provides a packaging laminating film applied to an SDBG process, a preparation method and a use method thereof, the elongation rate of the packaging laminating film is less than 100%, the stress is less than or equal to 2MPa, the packaging laminating film comprises 10-22wt% of water-based resin, the water-based resin comprises epoxy resin, acrylic acid copolymer and a silane coupling agent, and the water-based resin comprises the epoxy resin, the acrylic acid copolymer and the silane coupling agent. And 78 wt.% to 90 wt.% of the metal oxide powder having a solid content selected from at least one of CuO, Al2O3, ZnO or AlN. The preparation method of the packaging laminating film comprises the following steps: grinding and dispersing the mixed sizing material by three rollers, and coating, forming and drying the packaging laminating sizing material to obtain the packaging laminating film.

Description

Technical Field

[0001] The present invention relates to a packaging film material, a preparation method and a use method thereof, in particular to a packaging laminating film applied to a SDBG process, a preparation method and a use method thereof. Background Art

[0002] Semiconductor packaging involves coating the separated dies with packaging materials after the wafers have undergone processes such as sawing, pick-up, die bonding, and wire bonding. This protects the durability and service life of the completed integrated circuit (IC) components (e.g., chips) and facilitates a wide range of circuit board assembly applications.

[0003] With the widespread adoption of 5G, terminal electronic products are increasingly demanding thinner, lighter, and smaller designs. Consequently, packaging technologies are evolving towards miniaturization, higher density, and thinner designs. As current density increases, so do the demands for heat dissipation and insulation, placing increasing demands on the thermal conductivity of packaging materials. Furthermore, small-sized products are prone to problems such as flying materials, water seepage, edge chipping, and adhesive residue during the cutting process.

[0004] Existing packaging film materials are primarily filled with micron-sized SiO2 or Al2O3 powders. These are then combined with dicing tape to perform wafer dicing, and then ejector pins are used to separate the DAF from the dicing tape. However, the dicing tape itself is difficult to securely bond to the wafer, resulting in issues like flying material and water seepage during the dicing process.

[0005] To improve wafer utilization and simplify the process of wafer dicing, stealth dicing (SDBG) has been introduced into the manufacturing process. This technology focuses laser light inside the wafer, creating a metamorphic layer. This layer is then separated into dies by methods such as expanding a film.

[0006] Therefore, providing a packaging and bonding film for use in the SDBG process and a preparation method thereof, and providing a packaging and bonding film with excellent wafer adhesion and brittle fracture resistance at low temperatures are important research topics that the inventors of this case have devoted themselves to researching. Summary of the Invention

[0007] The main purpose of the present invention is to provide a packaging and bonding film for use in the SDBG process, which has the characteristics of good adhesion to the wafer, easy brittle fracture at low temperature, etc. The packaging and bonding film is made of a packaging and bonding adhesive, and the total weight of the packaging and bonding adhesive is 100wt.%, and the packaging and bonding adhesive includes: 10wt.% to 22wt.% of a water-based resin, which includes an epoxy resin, an acrylic copolymer and a silane coupling agent; and 78wt.% to 90wt.% of a metal oxide powder with a solid content, and the metal oxide powder is selected from at least one or a combination of CuO, Al2O3, ZnO or AlN, and is surface-modified with a silane coupling agent; wherein the elongation of the packaging and bonding film is less than 100% and the stress is less than or equal to 2MPa.

[0008] In one embodiment of the present invention, the epoxy resin is at least one selected from bisphenol A epoxy resin, bisphenol F epoxy resin, and cyanuric acid epoxy resin, or a combination thereof.

[0009] In one embodiment of the present invention, the acrylic copolymer is methyl methacrylate or polymethyl methacrylate.

[0010] In one embodiment of the present invention, the silane coupling agent is selected from at least one of methacryloxysilane, epoxysilane, isocyanatesilane, or a combination thereof.

[0011] In one embodiment of the present invention, based on the total weight of the water-based resin being 100 wt.%, the weight percentages of the epoxy resin: the silane coupling agent: the acrylic copolymer are in the range of 90-95 wt.%, 3-5 wt.%, and 1-7 wt.%.

[0012] In order to achieve the above-mentioned objectives, the present invention also provides a method for preparing a packaging bonding film with an elongation less than 100% and a stress less than or equal to 2 MPa, comprising: mixing 10wt.% to 22wt.% of an aqueous resin and 78wt.% to 90wt.% of a metal oxide powder with a solid content to obtain a mixed adhesive; grinding and dispersing the mixed adhesive with three rollers to obtain a packaging bonding adhesive; and coating, forming, and drying the packaging bonding adhesive to obtain a packaging bonding film; wherein the aqueous resin includes an epoxy resin, a silane coupling agent, and an acrylic copolymer, and the metal oxide powder is selected from at least one or a combination of CuO, Al2O3, ZnO, or AlN, and is surface-modified by a silane coupling agent.

[0013] In order to achieve the above-mentioned purpose, the present invention also provides a method for using a packaging bonding film, which includes: providing a wafer, which includes a first surface and a second surface; attaching a substrate film layer to the first surface of the wafer; performing invisible laser cutting on the second surface of the wafer to form multiple grains and gaps between the multiple grains; grinding the second surface of the wafer; attaching a packaging bonding film to the second surface of the wafer and removing the substrate film layer; and performing a film expansion and splitting step on the packaging bonding film and the wafer at low temperature to expand the gaps between the multiple grains; wherein the elongation of the packaging bonding film is less than 100% and the stress is less than or equal to 2MPa.

[0014] The present invention will be described in detail below with reference to the accompanying drawings and specific embodiments, but this does not limit the present invention. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] Figure 1 is a flow chart of a method for preparing a packaging laminating film of the present invention; and

[0016] Figure 2 The figure is a flow chart of the method for using the packaging laminating film of the present invention.

[0017] Wherein, the reference numerals:

[0018] S102~S106: Steps

[0019] S201~S206: Steps DETAILED DESCRIPTION

[0020] The following is a detailed description of the encapsulation laminating film and its preparation method disclosed in the present invention in conjunction with the drawings in accordance with the specific embodiments of the present invention. Those with ordinary knowledge in the relevant field can understand the advantages and effects of the present invention through the contents disclosed in this specification. The present invention can also be implemented or applied through other different specific embodiments, and the details in this specification can also be modified and changed in various ways based on different viewpoints and applications without departing from the concept of the present invention. The following embodiments will further explain the relevant technical content of the present invention in detail, but the disclosed content is not intended to limit the scope of protection of the present invention.

[0021] The primary objective of the present invention is to provide a packaging and laminating film for use in SDBG processes, exhibiting excellent wafer adhesion and structural brittleness at low temperatures. The film is made from a packaging and laminating adhesive compound. The total weight of the packaging and laminating adhesive compound is 100 wt.%, comprising: 10 to 22 wt.% of a water-based resin comprising an epoxy resin, an acrylic copolymer, and a silane coupling agent; and 78 to 90 wt.% of a metal oxide powder having a solids content selected from at least one of CuO, Al2O3, ZnO, and AlN, or a combination thereof, and surface-modified with 1 to 10 wt.% of a silane coupling agent. Furthermore, the packaging and laminating film exhibits an elongation of less than 100% and a stress of less than or equal to 2 MPa.

[0022] To specifically compare the effects of metal oxide powders with varying solid contents, thermally conductive adhesives were prepared in Examples 1-2 and Comparative Examples 1-5 by mixing metal oxide powders with varying solid contents with a 20 wt.% water-based resin. The water-based resin consisted of 90 wt.% bisphenol F epoxy resin, 3 wt.% epoxysilane coupling agent, and 7 wt.% methyl methacrylate. Elongation, stress, and cracking tests were performed, as shown in Table 1.

[0023] Table 1

[0024]

[0025]

[0026] As shown in Table 1, at the same water-based resin ratio, the solid content of the metal oxide powder affects the feasibility of the product's splitting operation. Generally speaking, when using high-solids metal oxide powder in a mixed production process, the powder tends to be difficult to evenly disperse and easily agglomerate. The oxide powder filler of the present invention is first surface-modified with a silane coupling agent to improve the compatibility between the resin and the metal oxide powder and reduce powder agglomeration. At a metal oxide powder ratio of 78 wt.% to 90 wt.% solids content, an elongation of less than 100% and a stress of greater than or equal to 2 MPa can be achieved.

[0027] Preferably, the metal oxide powder is at least one selected from CuO, Al2O3, ZnO or AlN, or a combination thereof. More preferably, the metal oxide powder is selected from CuO3 or ZnO.

[0028] Epoxy resin has excellent electrical properties, low curing shrinkage, low volatile byproducts, high temperature resistance, solvent resistance and other characteristics, and is widely used in packaging materials for semiconductor components.

[0029] In one embodiment of the present invention, the epoxy resin used is selected from at least one of bisphenol A epoxy resin, bisphenol F epoxy resin, and cyanuric acid epoxy resin, or a combination thereof. Preferably, the epoxy resin is bisphenol F epoxy resin. Specifically, bisphenol F epoxy resin, also known as bisphenol F diglycidyl ether (BPF), exhibits low viscosity, corrosion resistance, adhesion, thermal stability, and insulation properties.

[0030] Silane coupling agents are compounds composed of organic matter and silicon. They contain two or more different reactive groups within their molecules, allowing them to chemically react with both inorganic and organic materials. Specifically, the silane coupling agent of the present invention can improve the bond between copper oxide and epoxy resin, preventing defects such as voids at the interface and maintaining optimal thermal conductivity.

[0031] In one embodiment of the present invention, the silane coupling agent is selected from at least one of methacryloxysilane, epoxysilane, and isocyanatesilane, or a combination thereof. More specifically, the silane coupling agent of the present invention can be a commercially available product. For example, the methacryloxysilane can be a combination of 3-methacryloxypropyl and other silanes, such as methyldimethoxysilane, trimethoxysilane, methyldiethoxysilane, and triethoxysilane; the epoxysilane can be 2-(3,4-epoxycyclohexylethyltrimethoxysilane), (3-glycidoxypropyl)trimethoxysilane, (3-glycidoxypropyl)methyldiethoxysilane, and (3-glycidoxypropyl)triethoxysilane; and the isocyanatesilane can be 3-isocyanatepropyltriethoxysilane.

[0032] To specifically compare the thermal conductivity of thermally conductive adhesives prepared using the silane coupling agent selected in the present invention, Examples 4 to 6 of thermally conductive adhesives were prepared by mixing 80 wt.% solid content of metal oxide powder with 20 wt.% of a water-based resin. The water-based resin was composed of bisphenol F epoxy resin and methyl methacrylate. Roughness testing was performed. The composition and ratio of the water-based resin are shown in Table 2.

[0033] Table 2

[0034]

[0035] As shown in Table 3, epoxysilane exhibits the best roughness. Specifically, the encapsulation bonding film produced with (3-glycidoxypropyl)trimethoxysilane exhibits the best roughness. Excessive roughness indicates uneven powder dispersion, leading to poor adhesion between the DAF and the wafer and potentially affecting wafer cracking.

[0036] The acrylic copolymer may be a resin polymer derived from acrylic monomers, which may be selected from methyl acrylate, ethyl acrylate, n-butyl acrylate, methyl methacrylate, n-butyl methacrylate, etc. The acrylic resin may be selected from thermosetting acrylic resins or thermoplastic acrylic resins as required.

[0037] Specifically, thermosetting acrylic resins are infusible acrylic polymers based on acrylic monomers, crosslinked to form a network structure. In addition to possessing the general properties of acrylic resins, they exhibit superior heat resistance, water resistance, solvent resistance, abrasion resistance, and scratch resistance. They are available in a variety of forms, including bulk casting materials, solution-based, emulsion-based, and water-based formulations. More specifically, thermoplastic acrylic resins are a class of thermoplastic resins made by polymerizing acrylic acid, methacrylic acid, and their derivatives (such as esters, nitriles, and amides). They can be softened by repeated heating and solidified by cooling. They are generally linear polymers, either homopolymers or copolymers, and possess excellent physical and mechanical properties, including weather resistance, chemical resistance, and water resistance, as well as high gloss and color retention. Thermoplastic acrylic resins used in the coatings industry typically have a molecular weight of 75,000 to 120,000. They are often used in combination with cellulose nitrate, cellulose acetate butyrate, and vinyl chloride resins to improve coating film properties. Thermoplastic acrylic resin is a type of solvent-based acrylic resin that can be melted and dissolved in appropriate solvents. Coatings formulated with it form films through the aggregation of macromolecules after solvent evaporation. No cross-linking occurs during film formation, making it a non-reactive coating. To achieve optimal physical and chemical properties, the molecular weight of the resin should be increased. However, to ensure that the total amount of non-volatile matter is not too low and the molecular weight is not too high, a molecular weight of tens of thousands generally achieves a good balance between physical and chemical properties and workability.

[0038] In the embodiment of the present invention, the acrylic copolymer may be methyl methacrylate (MMA) or poly methyl methacrylate (PMMA).

[0039] The water-based resin used in the present invention includes an epoxy resin, a silane coupling agent, and an acrylic copolymer. In one embodiment of the present invention, the water-based resin comprises a specific ratio, where the weight percentages of epoxy resin, silane coupling agent, and acrylic copolymer are 90-95 wt.%, 3-5 wt.%, and 1-7 wt.%, respectively, based on 100 wt.% of the total weight of the water-based resin.

[0040] To specifically compare the differences in surface roughness across the various water-based resin formulations of the present invention, thermally conductive adhesive Examples 6 to 14 were prepared by mixing a metal oxide powder having a solid content of 80% with a 20 wt.% water-based resin. The water-based resins were composed of bisphenol F epoxy resin, epoxysilane coupling agent (KBM-403), and acrylic copolymer (methyl methacrylate). Surface roughness (Ra) tests were performed. The composition ratios and roughness values ​​of the water-based resins are shown in Table 3.

[0041] Table 3

[0042]

[0043]

[0044] As can be seen from Table 3, the ratio of Example 7 has a better roughness. Optimally, the weight percentage of epoxy resin: silane coupling agent: acrylic copolymer is 90 wt. %: 3 wt. %: 7 wt. %.

[0045] In order to achieve the above-mentioned purpose, the present invention also provides a method for preparing a packaging laminating film, see Figure 1 , which are steps S102 to S106 of the method for preparing the packaging laminating film of the present invention.

[0046] S102: Mixing 10 to 22 wt% of a water-based resin with 78 to 90 wt% of a metal oxide powder having a solid content to obtain a mixed rubber compound. The water-based resin comprises an epoxy resin, a silane coupling agent, and an acrylic copolymer. The selection of these components is as described in the present invention specification and will not be repeated here. More specifically, the metal oxide powder of the present invention is selected from at least one of CuO, Al2O3, ZnO, or AlN, or a combination thereof, and is surface-modified with a silane coupling agent. This surface modification increases the compatibility between the resin and the metal oxide powder particles, reduces powder agglomeration, and effectively reduces the roughness of the finished product.

[0047] S104 uses a three-roller mill to grind and disperse the mixed adhesive to obtain a sealing adhesive. The three-roller mill uses three parallel rollers rotating in opposite directions and at different speeds to generate shear force, thereby achieving the purpose of mixing, refining, dispersing, or evenly equalizing the viscosity of the object.

[0048] S106: coating, forming, and drying the packaging and bonding adhesive material to obtain a packaging and bonding film.

[0049] Furthermore, the present invention also provides a method for using the encapsulation laminating film, comprising:

[0050] S201 provides a wafer comprising a first surface and a second surface;

[0051] S202 attaching a substrate film layer to the first surface of the wafer;

[0052] S203: performing invisible laser cutting on the second surface of the wafer to form a plurality of dies and gaps between the dies;

[0053] S204 grinding the second surface of the wafer;

[0054] S205: attaching a packaging bonding film to the second surface of the wafer and removing the substrate film layer; and

[0055] S206 performs a film expansion and splitting step on the packaging bonding film and the wafer at a low temperature to expand the gap between the plurality of dies.

[0056] One of the beneficial effects of the present invention is that the packaging bonding film provided by the present invention for use in the SDBG process is obtained by adopting the specific composition and formula ratio of "10wt.% to 22wt.% of a water-based resin, which includes an epoxy resin, a silane coupling agent and an acrylic copolymer; and 78wt.% to 90wt.% of a metal oxide powder with a solid content" to obtain a packaging bonding film with an elongation of less than 100% and a stress of less than or equal to 2MPa.

[0057] Furthermore, the composition and formulation ratio of the present invention effectively reduce the roughness of the encapsulation film prepared by the present invention. Moreover, the encapsulation film of the present invention improves the fluidity of the metal oxide powder and increases the contact area, thereby increasing the solid content of the metal oxide powder in the composition.

[0058] Furthermore, the packaging laminating film and preparation method thereof of the present invention effectively improves powder contact, reduces powder agglomeration, and reduces the surface roughness of the laminating film, thereby facilitating the subsequent cutting process and avoiding flying materials, water seepage, and the like.

[0059] Furthermore, the encapsulation and laminating film of the present invention exhibits excellent wafer adhesion, effectively maintaining die alignment, and exhibits low-temperature brittle fracture resistance, making it suitable for SDBG processes. The encapsulation and laminating film of the present invention utilizes invisible laser cutting to expand and cleave the film at low temperatures, thereby alleviating issues such as flying material, water seepage, and burrs that occur during the wafer dicing process.

[0060] The above description is merely a preferred embodiment of the present invention and does not limit the scope of the present invention. Therefore, all equivalent changes made by applying the contents of the present invention are similarly included in the scope of the present invention and are hereby stated.

[0061] Of course, the present invention may have many other embodiments. Without departing from the spirit and essence of the present invention, those skilled in the art may make various corresponding changes and modifications based on the present invention, but these corresponding changes and modifications should all fall within the scope of protection of the claims of the present invention.

Claims

1. A packaging bonding film used in SDBG process, characterized in that: The invention is made of a packaging and bonding adhesive material, wherein the total weight of the packaging and bonding adhesive material is 100 wt.%, and the packaging and bonding adhesive material comprises: 10 wt.% to 22 wt.% of an aqueous resin comprising an epoxy resin, an acrylic copolymer, and a silane coupling agent; and 78 wt.% to 90 wt.% solid content of metal oxide powder, wherein the metal oxide powder is selected from at least one of CuO, Al2O3, ZnO, and AlN, or a combination thereof, and has been surface-modified with 1 wt.% to 10 wt.% of a silane coupling agent; Wherein, the elongation of the packaging laminating film is less than 100% and the stress is less than or equal to 2 MPa.

2. The packaging bonding film used in the SDBG process according to claim 1, characterized in that: The epoxy resin is at least one selected from bisphenol A epoxy resin, bisphenol F epoxy resin and cyanuric acid epoxy resin or a combination thereof.

3. The packaging bonding film for use in SDBG process according to claim 1, characterized in that: The acrylic copolymer is methyl methacrylate or polymethyl methacrylate.

4. The packaging bonding film for use in SDBG process according to claim 1, wherein: The silane coupling agent is selected from at least one of methacryloxysilane, epoxysilane, isocyanatesilane, or a combination thereof.

5. The packaging bonding film used in the SDBG process according to claim 1, characterized in that: Taking the total weight of the water-based resin as 100 wt.%, the weight percentages of the epoxy resin: the silane coupling agent: the acrylic copolymer are between 90-95 wt.%, 3-5 wt.%, and 1-7 wt.%.

6. A method for preparing a packaging lamination film used in a SDBG process, characterized in that: include: Mixing 10 wt.% to 22 wt.% of a water-based resin and 78 wt.% to 90 wt.% of a metal oxide powder with a solid content of 78 wt.% to 90 wt.% to obtain a mixed rubber material; Grinding and dispersing the mixed adhesive material with three rollers to obtain a packaging and bonding adhesive material; as well as coating, shaping, and drying the packaging and laminating adhesive to obtain a packaging and laminating film; The water-based resin comprises an epoxy resin, a silane coupling agent and an acrylic copolymer, and the metal oxide powder is selected from at least one of CuO, Al2O3, ZnO and AlN or a combination thereof, and is surface-modified by a silane coupling agent; Wherein, the elongation of the packaging laminating film is less than 100% and the stress is less than or equal to 2 MPa.

7. The method for preparing the encapsulation laminating film according to claim 6, wherein: The epoxy resin is selected from at least one of bisphenol A epoxy resin, bisphenol F epoxy resin and cyanuric acid epoxy resin or a combination thereof; the silane coupling agent is selected from at least one of methacryloxysilane, epoxysilane and isocyanate silane or a combination thereof.

8. The method for preparing the encapsulation laminating film according to claim 6, wherein: Taking the total weight of the water-based resin as 100 wt.%, the weight percentages of the epoxy resin: the silane coupling agent: the acrylic copolymer are between 90-95 wt.%, 3-5 wt.%, and 1-7 wt.%.

9. A method for using a packaging laminating film, characterized in that: include: Providing a wafer comprising a first surface and a second surface; attaching a substrate film layer to the first surface of the wafer; Performing invisible laser cutting on the second surface of the wafer to form a plurality of dies and gaps between the dies; grinding the second surface of the wafer; attaching a packaging bonding film to the second surface of the wafer and removing the substrate film layer; as well as Performing a film expansion and splitting step on the packaging bonding film and the wafer at low temperature to expand the gaps between the plurality of dies; Wherein, the elongation of the packaging laminating film is less than 100% and the stress is less than or equal to 2 MPa.

10. The method for using the encapsulation laminating film according to claim 9, wherein: The packaging laminating film is made of a packaging laminating adhesive, with the total weight of the packaging laminating adhesive being 100wt.%. The packaging laminating adhesive includes: 10wt.% to 22wt.% of a water-based resin, which includes an epoxy resin, an acrylic copolymer, and a silane coupling agent; and 78wt.% to 90wt.% of a metal oxide powder with a solid content, and the metal oxide powder is selected from at least one or a combination of CuO, Al2O3, ZnO, or AlN, and has been surface-modified with 1wt.% to 10wt.% of a silane coupling agent.

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