Radiator for high-power computing chip

Abstract

The invention relates to a radiator for a high-power computing chip, which comprises a fixed cover plate, a splitter plate and a radiating cold plate, the top surface of the cover plate is provided with a pair of working medium flowing ports, a cover plate concave cavity is arranged between the bottom surface of the cover plate and the radiating cold plate, and the splitter plate is arranged in the cover plate concave cavity; a hollow heat exchange cavity is formed in the splitter plate, a splitter cavity and a collector cavity which are located at the two opposite ends of the heat exchange cavity respectively are further formed in the same side face, a plurality of strip blocks which are arranged side by side at intervals and sequentially connected end to end are arranged in the heat exchange cavity, and the connecting part of every two adjacent strip blocks is further connected with the side wall of the heat exchange cavity. The two adjacent strip blocks form a flow dividing flow channel with an opening facing the flow dividing concave cavity or a flow collecting flow channel with an opening facing the flow collecting concave cavity; and micro-structure fins which correspond to the heat exchange concave cavities and are used for enhancing heat exchange are arranged on the heat dissipation cold plate. Compared with the prior art, through innovative flow channel optimization and a modular structure, the problems that a traditional heat dissipation technology is low in efficiency, unstable in flowing, complex in machining and the like are solved, and efficient heat dissipation is achieved.

Description

Technical Field

[0001] The present invention relates to the technical field of chip heat dissipation, and in particular to a radiator for a high-power computing chip. Background Art

[0002] High-power computing chips generate a large amount of heat during operation. If heat isn't dissipated promptly and effectively, the chip's temperature will rise sharply, affecting its performance stability and lifespan. Traditional cooling technologies, such as air cooling and simple liquid cooling, are unable to meet the heat dissipation requirements in high-power density scenarios, resulting in high thermal resistance, low heat dissipation efficiency, and uneven temperature distribution.

[0003] While existing microchannel heat sinks can improve heat dissipation efficiency, their simple flow channel design can easily lead to flow separation and excessive pressure drop. Furthermore, their complex manufacturing process makes it difficult to achieve both efficient heat dissipation and structural stability. Therefore, a new type of heat sink is needed that can achieve stable flow, low thermal resistance, and simple processing under high-pressure differential conditions. Summary of the Invention

[0004] The purpose of the present invention is to overcome the defects of the prior art and provide a heat sink for high-power computing chips.

[0005] The purpose of the present invention can be achieved by the following technical solutions:

[0006] The technical solution of the present invention is to provide a heat sink for high-power computing chips, comprising: a fixed cover plate, a diverter plate, and a heat dissipation cold plate.

[0007] The top surface of the cover plate is provided with a pair of working medium flow ports, which serve as the working medium flow inlet and working medium flow outlet of the radiator respectively. A cover plate cavity is provided between the bottom surface of the cover plate and the heat dissipation cold plate as a heat dissipation space, and a diverter plate is provided in the cover plate cavity;

[0008] The diverter plate is provided with a hollow heat exchange cavity, and a diverter cavity and a collecting cavity are provided on the same side, which are respectively located at the opposite ends of the heat exchange cavity. The diverter cavity is communicated with the working medium inlet, and the collecting cavity is communicated with the working medium outlet.

[0009] The heat exchange cavity is provided with a plurality of strips arranged in parallel and spaced apart and connected end to end in sequence, and the connecting portion of two adjacent strips is also connected to the side wall of the heat exchange cavity, so that the two adjacent strips form a diversion channel opening toward the diversion cavity, or a collecting channel opening toward the collecting cavity;

[0010] After the working medium flows into the diverter cavity through the working medium inlet, it flows into the heat exchange cavity from the diverter channel to exchange heat, then flows into the collecting cavity through the collecting channel, and finally flows out through the working medium outlet;

[0011] The heat dissipation cold plate is provided with microstructured fins corresponding to the heat exchange cavity and used to enhance heat exchange.

[0012] In some specific embodiments, the flow-dividing channel and the flow-collecting channel are arranged adjacent to each other.

[0013] In some specific embodiments, the structure of the strip includes a multi-segment structure, a tangent structure, a cotangent structure, a sine structure, and a cosine structure.

[0014] In some specific embodiments, when the strip is a multi-segment structure, the strip includes three fold segments, and the lengths of each fold segment are L1, L3, and L2, respectively, and at least one of L1, L2, and L3 is non-zero. 1 / 2 of the width of the flow channel opening is defined as W1, and 1 / 2 of the width of the closed end of the flow channel is defined as W2. The angles between two adjacent fold segments are θ1 and θ2, respectively.

[0015] When W1 and W2 are equal, L3 is 0, and the flow channel is a uniform rectangular structure;

[0016] When W1 and W2 are not equal and non-zero, L1 and L2 are both 0, and the flow channel is a trapezoidal structure;

[0017] When W2 is 0, the flow channel is a pointed mouth structure;

[0018] When W2 is 0, and L1 and L2 are both 0, the flow channel is a triangular structure;

[0019] When all parameters are non-zero and the angles θ1 and θ2 are right angles, the flow channel is a quasi-convex structure;

[0020] When the strip structure is a tangent structure or a cotangent structure, the distance from the center line of the strip to the center line of the flow channel is defined as E, the total length of the flow channel is L4, and the amplitude of the tangent or cotangent is A.

[0021] When the strip structure is a sine structure or a cosine structure, the distance from the strip centerline to the flow channel centerline is defined as F, the total length of the flow channel is L5, the amplitude of the sine / cosine is B, and the wavelength of the sine or cosine is λ.

[0022] In some specific embodiments, a second gasket for sealing is further provided between the diverter plate and the fixed cover plate.

[0023] In some specific embodiments, a first gasket for adjusting the assembly gap is further provided between the heat exchange cavity of the diverter plate and the heat dissipation cold plate.

[0024] In some specific embodiments, the microstructured fins include a plurality of fin capillary structures, and the thickness ratio of the fin capillary structures is ≥0;

[0025] When the thickness of the fin capillary structure in the microstructure fin accounts for 0%, the microstructure fin is a completely solid fin;

[0026] When the thickness of the fin capillary structure in the microstructured fin accounts for 100%, the microstructured fin is composed of a complete porous capillary structure.

[0027] In some specific embodiments, the heat dissipation cold plate is provided with a multi-layer fin bottom surface capillary structure on a side surface provided with microstructured fins, and the number of layers of the fin bottom surface capillary structure is ≥0;

[0028] When the number of layers of the capillary structure on the bottom surface of the fin is 0, the surface of the heat dissipation cold plate on the side where the microstructured fins are provided is a smooth surface.

[0029] In some specific embodiments, the heat dissipation cold plate, the diverter plate, and the fixed cover plate are connected by threaded connection, snap connection, riveting, or welding.

[0030] In some specific embodiments, the radiator further includes a pair of radiator joints, each connected to the pair of working medium flow ports.

[0031] Compared with the prior art, the present invention has the following beneficial effects:

[0032] (1) The flow diversion and collection channels of this application can be designed in a variety of shapes, which can guide the fluid to achieve laminar transition, effectively reduce the risk of flow separation, and also enable a smooth conversion of fluid kinetic energy. This design helps to improve the flow stability of the microchannel heat sink under high pressure difference conditions and reduce chip junction temperature fluctuations.

[0033] (2) The shape of the flow channel can be customized into rectangle, trapezoid, beak, triangle, convex, sine / cotangent structure or sine / cosine structure to meet different heat dissipation requirements;

[0034] (3) The capillary structure ratio and number of layers of the microstructured fins are adjustable, and the phase change heat dissipation capability is enhanced through the porous capillary structure.

[0035] (4) The heat sink of the present application not only reduces the complexity of processing the heat dissipation cold plate, but also makes the phase change heat dissipation technology more efficient, thereby improving the overall performance of the heat sink. BRIEF DESCRIPTION OF THE DRAWINGS

[0036] Figure 1 This is an exploded view of the overall structure of the heat sink welding method according to an embodiment of the present application.

[0037] Figure 2 This is a heat sink packaging diagram of an embodiment of the present application.

[0038] Figure 3 Schematic diagram of the top surface structure of the heat dissipation cold plate according to an embodiment of the present application.

[0039] Figure 4 Schematic diagram of the bottom structure of the heat dissipation cold plate according to an embodiment of the present application.

[0040] Figure 5 This is a structural schematic diagram of the top surface of the diverter plate according to an embodiment of the present application.

[0041] Figure 6 This is a structural schematic diagram of the bottom surface of the diverter plate in an embodiment of the present application.

[0042] Figure 7 This is a schematic structural diagram of the top surface of the fixed cover plate according to an embodiment of the present application.

[0043] Figure 8 This is a structural schematic diagram of the bottom surface of the fixed cover plate according to an embodiment of the present application.

[0044] Figure 9 This is a schematic structural diagram of the top surface of the first gasket in an embodiment of the present application.

[0045] Figure 10 This is a schematic structural diagram of the bottom surface of the first gasket in an embodiment of the present application.

[0046] Figure 11 This is a schematic structural diagram of the top surface of the second gasket in an embodiment of the present application.

[0047] Figure 12 This is a schematic structural diagram of the bottom surface of the second gasket in an embodiment of the present application.

[0048] Figure 13 This is a structural diagram of a radiator joint according to an embodiment of the present application.

[0049] Figure 14 Schematic diagram of the flow diversion / collection structure of an embodiment of the present application.

[0050] Figure 15 Schematic diagram of the capillary structure of the heat dissipation cold plate of this application.

[0051] Figure 16 This is a cross-sectional view of the overall structure of the radiator according to an embodiment of the present application.

[0052] Figure 17 This is a structural diagram of the thread method of the radiator joint according to an embodiment of the present application.

[0053] The following are marked in the figure:

[0054] 1-heat dissipation cold plate; 101-top surface of heat dissipation cold plate; 102-bottom surface of heat dissipation cold plate; 12-microstructure fin; 13-first countersunk through hole of cold plate; 14-second countersunk through hole of cold plate; 111-fin capillary structure; 112-fin bottom surface capillary structure.

[0055] 2-diverter plate; 21-diverter cavity; 22-collector cavity; 23-diverter channel; 24-collector channel; 25-transition zone; 26-diverter plate countersunk through hole; 27-diverter plate threaded hole; 28-diverter plate sealing groove; 29-heat exchange cavity; 201-diverter plate top surface; 202-diverter plate bottom surface.

[0056] 3-Fixed cover plate; 31-Working medium flow port; 32-Fixed mounting hole; 33-Cover plate cavity; 34-First screw hole of cover plate; 35-Second screw hole of cover plate; 36-Cover plate sealing groove; 301-Top surface of cover plate; 302-Bottom surface of cover plate.

[0057] 4- Radiator joint; 41- Joint structure; 42- Bottom structure.

[0058] 5- First washer.

[0059] 6-Second washer.

[0060] 7-first gasket; 71-gasket fluid channel; 701-first gasket top surface; 702-first gasket bottom surface.

[0061] 8-second gasket; 81-second gasket through hole; 82-second gasket threaded through hole; 801-second gasket top surface; 802-second gasket bottom surface.

[0062] 9-First screw.

[0063] 10-Second screw.

[0064] 11-Third screw.

[0065] 100-Heat exchange chamber.

[0066] 230-shunt cavity.

[0067] 240-Manifold. DETAILED DESCRIPTION

[0068] The present invention is described in detail below with reference to the accompanying drawings and specific embodiments. This embodiment is implemented based on the technical solution of the present invention, and provides a detailed implementation method and specific operation process, but the protection scope of the present invention is not limited to the following embodiments.

[0069] It should be noted that similar reference numerals and letters denote similar items in the following drawings, and therefore, once an item is defined in one drawing, it does not require further definition or explanation in subsequent drawings.

[0070] The following describes some embodiments of the present invention in detail with reference to the accompanying drawings. In the absence of conflict, the following embodiments and features in the embodiments may be combined with each other.

[0071] In the following embodiments, unless otherwise specified, functional components or structures are conventional components or structures used in the art to achieve corresponding functions.

[0072] Example 1

[0073] like Figures 1-2 , 16 shows a heat sink for high-power computing chips, comprising: a fixed cover plate 3, a diverter plate 2, a heat dissipation cold plate 1 and a heat sink connector 4.

[0074] like Figures 7-8 As shown in , 11-12 , a pair of working fluid flow ports 31 are provided on the top surface 301 of the fixed cover plate, which serve as the working fluid flow inlet and working fluid flow outlet of the radiator respectively. A cover plate cavity 33 is provided between the bottom surface 302 of the cover plate and the heat dissipation cold plate 1 as a heat dissipation space, and a diverter plate 2 is provided in the cover plate cavity 33.

[0075] The fixed cover plate 3 is screwed to the heat dissipation cold plate 1. A cover sealing groove 36 is provided on the bottom surface 302 of the cover plate for mounting and securing the first gasket 5. The fixed cover plate 3 and the heat dissipation cold plate 1 are sealed by the first gasket 5. A first threaded hole 37 is provided on the bottom surface 34 of the cover plate, corresponding to the first countersunk hole 13 of the heat dissipation cold plate 1. The fixed cover plate 3 and the heat dissipation cold plate 1 are tightly secured together by the first screw 9.

[0076] The fixed cover plate 3 is provided with a fixed installation hole 32 so that the bottom surface 102 of the heat dissipation cold plate and the chip are tightly fitted through the connection structure.

[0077] The fixed cover plate 3 is connected to the manifold plate 2 by screws. The manifold plate 2 is provided with a manifold countersunk through hole 2, which corresponds to the second threaded hole 35 provided on the fixed cover plate 3 and is fixedly connected by a third screw 11. The manifold plate 2 and the fixed cover plate 3 are also sealed by a second gasket 8.

[0078] The fixed cover plate 3 is connected to the radiator connector 4 by welding. A working medium flow port 31 is provided on the top surface 301 of the cover plate for connecting to the radiator connector 4 .

[0079] like Figures 5-6 As shown, the manifold plate 2 is provided with a hollowed-out heat exchange cavity 29. Also located on the same side are a diverter cavity 21 and a collector cavity 22, located at opposite ends of the heat exchange cavity 29. The diverter cavity 21 communicates with the working fluid inlet, while the collector cavity 22 communicates with the working fluid outlet. The diverter cavity 21 is screwed to the bottom surface 302 of the cover plate to form a diverter cavity 230. The collector cavity 22 is screwed to the bottom surface 302 of the cover plate to form a collector cavity 240. The heat exchange cavity 29 is screwed to the top surface 101 of the heat dissipation cold plate to form a heat exchange cavity 100.

[0080] The heat exchange cavity 29 is provided with a plurality of strips arranged in parallel and spaced apart and connected end to end. The connecting portion of two adjacent strips is also connected to the side wall of the heat exchange cavity 29, so that the two adjacent strips form a diverter channel 23 opening toward the diverter cavity 21 or a collecting channel 24 opening toward the collecting cavity 22.

[0081] After the working medium flows into the diversion cavity 21 through the working medium inlet, it flows into the heat exchange cavity 29 from the diversion channel 23 to exchange heat, then flows into the collecting cavity 22 through the collecting channel 24, and finally flows out through the working medium outlet.

[0082] The cooling medium is selected from one or more mixtures of water, alcohols, ammonia, hydrocarbons, refrigerants, mineral oils, transformer oils or fluorinated liquids.

[0083] like Figures 3-4 As shown, microstructured fins 12 are arranged on the heat dissipation cold plate 1, corresponding to the heat exchange cavities 29 and used to enhance heat exchange. The bottom surface 102 of the heat dissipation cold plate is the heat exchange surface in contact with the chip.

[0084] like Figures 3 to 6 As shown in Figures 9 and 10, the assembly between the manifold 2 and the heat dissipation cold plate 1 is further characterized by a first gasket 7 for adjusting the assembly gap between the heat exchange cavity 29 and the heat dissipation cold plate 1, ensuring structural stability. A manifold sealing groove 28 is provided on the bottom surface 202 of the manifold for mounting and securing a second gasket 6, which is used to achieve sealing. The heat dissipation cold plate 1 is provided with a second countersunk through-hole 14 corresponding to the manifold threaded hole 27 provided on the manifold 2. A second screw 10 is used to secure the manifold 2 to the heat dissipation cold plate 1.

[0085] like Figure 13 As shown, the radiator joint 4 is provided with a joint structure 41 and a bottom surface structure 42 for realizing pipeline connection and joint installation respectively. The radiator joint 4 is used for input and output of cooling medium.

[0086] like Figure 5 、 14 As shown, in one embodiment of the present invention, the flow-dividing channel and the flow-collecting channel are arranged adjacent to each other.

[0087] The structure of the strips includes multi-segment structure, tangent structure, cotangent structure, sine structure and cosine structure.

[0088] When the strip is a multi-segment structure, the strip includes three fold segments, and the lengths of each fold segment are L1, L3, and L2, respectively, and at least one of L1, L2, and L3 is non-zero. 1 / 2 of the width of the flow channel opening is defined as W1, and 1 / 2 of the width of the closed end of the flow channel is defined as W2. The angles between two adjacent fold segments are θ1 and θ2, respectively, and the strip width is D1.

[0089] When W1 and W2 are equal, L3 is 0, and the flow channel is a uniform rectangular structure;

[0090] When W1 and W2 are not equal and non-zero, L1 and L2 are both 0, and the flow channel is a trapezoidal structure;

[0091] When W2 is 0, the flow channel is a pointed mouth structure;

[0092] When W2 is 0, and L1 and L2 are both 0, the flow channel is a triangular structure;

[0093] When all parameters are non-zero and the angles θ1 and θ2 are right angles, the flow channel is a quasi-convex structure;

[0094] When the strip structure is a tangent structure or a cotangent structure, the distance from the strip centerline (the coordinate axis y in the figure) to the flow channel centerline is defined as E, the total flow channel length is L4, the amplitude of the tangent or cotangent is A, and the strip width is D2.

[0095] When the strip structure is a sine structure or a cosine structure, the distance from the strip centerline (the coordinate axis in the figure is the x-axis) to the flow channel centerline is defined as F, the total length of the flow channel is L5, the amplitude of the sine / cosine is B, the wavelength of the sine or cosine is λ, and the strip width is D3.

[0096] like Figure 15 As shown, in one embodiment of the present invention, the microstructured fin 12 includes a plurality of fin capillary structures 111, and the thickness ratio of the fin capillary structure 111 is ≥0; when the thickness ratio of the fin capillary structure 111 in the microstructured fin 12 is 0%, the microstructured fin 12 is a completely solid fin; when the thickness ratio of the fin capillary structure 111 in the microstructured fin 12 is 100%, the microstructured fin 12 is composed of a complete porous capillary structure.

[0097] The heat dissipation cold plate 1 is provided with a multi-layer fin bottom surface capillary structure 112 on the side surface provided with the microstructured fins 12, and the number of layers of the fin bottom surface capillary structure 112 is ≥0; when the number of layers of the fin bottom surface capillary structure 112 is 0, the heat dissipation cold plate 1 on the side surface provided with the microstructured fins 12 is a smooth surface.

[0098] The fin capillary structure 111 and the fin bottom capillary structure 112 are both porous capillary structures, and the porous capillary structure is formed by a method selected from metal powder sintering, metal wire sintering, or a mixed sintering method of metal powder and metal wire.

[0099] The materials of the heat dissipation cold plate 1, the manifold plate 2, the fixed cover plate 3, and the radiator joint 4 are selected from one or more of copper, aluminum, aluminum alloy, stainless steel, aluminum nitride, silicon carbide, gallium nitride, resin, plastic, ceramic or glass; the first gasket 5 and the second gasket 6 are selected from one or more of rubber, silicone, fluororubber, resin or plastic; the first gasket 7 and the second gasket 8 are selected from one or more of rubber, silicone, fluororubber, resin, plastic, copper, aluminum, aluminum alloy, stainless steel, aluminum nitride, silicon carbide, gallium nitride, resin, plastic, ceramic or glass.

[0100] The basic application principle of the radiator provided in this embodiment is as follows: the low-temperature cooling medium enters the diverter cavity 21 through the radiator connector 4 on one side, enters the heat exchange cavity 100 along the diverter channel 23, takes away the heat conducted from the high-temperature chip to the heat dissipation cold plate 1, and enters the manifold cavity 22 along the manifold channel 24, and finally is discharged to the external circulation pipeline through the radiator connector 4 on the other side.

[0101] Example 2:

[0102] like Figure 17 As shown, this embodiment differs from Example 1 in that the radiator connector 4 is threadedly connected to the fixed cover plate 3, the working fluid flow ports 31 are all threaded holes, and the radiator connector 4 is selected from a standard threaded quick-connect connector, a pagoda connector, a quick water-stop connector, or a ferrule connector. This is intended to ensure that the threaded connection can be repeatedly disassembled and assembled, facilitating repair or replacement, and allowing for angle or position adjustment to accommodate different piping layouts, reducing assembly errors, and improving the compatibility and overall adaptability of the cooling system.

[0103] The above description of the embodiments is intended to facilitate understanding and use of the invention by those skilled in the art. It will be apparent that those skilled in the art can readily make various modifications to these embodiments and apply the general principles described herein to other embodiments without requiring inventive effort. Therefore, the present invention is not limited to the above-described embodiments. Improvements and modifications made by those skilled in the art based on the disclosure of the present invention, without departing from the scope of the present invention, should be within the scope of protection of the present invention.

Claims

1. A heat sink for a high-power computing chip, characterized in that: include: Fixed cover plate (3), diverter plate (2), heat dissipation cold plate (1), The top surface (301) of the cover plate is provided with a pair of working medium flow ports (31), which serve as a working medium flow inlet and a working medium flow outlet of the radiator respectively; a cover plate cavity (33) is provided between the bottom surface (302) of the cover plate and the heat dissipation cold plate (1) as a heat dissipation space; a diverter plate (2) is provided in the cover plate cavity (33); The diverter plate (2) is provided with a hollow heat exchange cavity (29), and a diverter cavity (21) and a collecting cavity (22) are provided on the same side, respectively located at opposite ends of the heat exchange cavity (29). The diverter cavity (21) is communicated with the working medium inlet, and the collecting cavity (22) is communicated with the working medium outlet. The heat exchange cavity (29) is provided with a plurality of strips arranged in parallel and spaced apart and connected end to end in sequence, and the connecting portion of two adjacent strips is also connected to the side wall of the heat exchange cavity (29), so that the two adjacent strips form a diversion channel (23) opening toward the diversion cavity (21) or a collecting channel (24) opening toward the collecting cavity (22); After the working medium flows into the diversion cavity (21) through the working medium inlet, it flows into the heat exchange cavity (29) from the diversion channel (23) to exchange heat, then flows into the collecting cavity (22) through the collecting channel (24), and finally flows out through the working medium outlet; Microstructured fins (12) corresponding to the heat exchange cavity (29) and used to enhance heat exchange are arranged on the heat dissipation cold plate (1).

2. The heat sink for high-power computing chips according to claim 1, characterized in that: The flow-dividing channel (23) and the flow-collecting channel (24) are arranged adjacent to each other.

3. The heat sink for high-power computing chips according to claim 1, characterized in that: The structure of the strips includes a multi-segment structure, a tangent structure, a cotangent structure, a sine structure, and a cosine structure.

4. The heat sink for high-power computing chips according to claim 3, characterized in that: When the strip is a multi-segment structure, the strip includes three fold segments, and the lengths of each fold segment are L1, L3 and L2, respectively, and at least one of L1, L2 and L3 is not zero. 1 / 2 of the width of the flow channel opening is defined as W1, and 1 / 2 of the width of the closed end of the flow channel is defined as W2. The angles between two adjacent fold segments are θ1 and θ2 respectively. When W1 and W2 are equal, L3 is 0, and the flow channel is a uniform rectangular structure; When W1 and W2 are not equal and non-zero, L1 and L2 are both 0, and the flow channel is a trapezoidal structure; When W2 is 0, the flow channel is a pointed mouth structure; When W2 is 0, and L1 and L2 are both 0, the flow channel is a triangular structure; When all parameters are non-zero and the angles θ1 and θ2 are right angles, the flow channel is a quasi-convex structure; When the strip structure is a tangent structure or a cotangent structure, the distance from the center line of the strip to the center line of the flow channel is defined as E, the total length of the flow channel is L4, and the amplitude of the tangent or cotangent is A. When the strip structure is a sine structure or a cosine structure, the distance from the strip centerline to the flow channel centerline is defined as F, the total length of the flow channel is L5, the amplitude of the sine / cosine is B, and the wavelength of the sine or cosine is λ.

5. The heat sink for high-power computing chips according to claim 1, characterized in that: A second gasket (8) for sealing is also provided between the diverter plate (2) and the fixed cover plate (3).

6. The heat sink for high-power computing chips according to claim 1, characterized in that: A first gasket (7) for adjusting the assembly gap is also provided between the heat exchange cavity (29) of the diverter plate (2) and the heat dissipation cold plate (1).

7. The heat sink for high-power computing chips according to claim 1, characterized in that: The microstructured fin (12) includes a plurality of fin capillary structures (111), and the thickness ratio of the fin capillary structures (111) is ≥0; When the thickness of the fin capillary structure (111) in the microstructured fin (12) accounts for 0%, the microstructured fin (12) is a completely solid fin; When the thickness of the fin capillary structure (111) in the microstructured fin (12) accounts for 100%, the microstructured fin (12) is composed of a complete porous capillary structure.

8. The heat sink for high-power computing chips according to claim 1, characterized in that: The heat dissipation cold plate (1) is provided with a multi-layer fin bottom surface capillary structure (112) on a side surface provided with microstructured fins (12), and the number of layers of the fin bottom surface capillary structure (112) is ≥0; When the number of layers of the capillary structure (112) on the bottom surface of the fin is 0, the surface of the heat dissipation cold plate (1) on the side provided with the microstructured fins (12) is a smooth surface.

9. The heat sink for high-power computing chips according to claim 1, characterized in that: The heat dissipation cold plate (1), the diverter plate (2) and the fixed cover plate (3) are connected by threaded connection, snap connection, riveting or welding.

10. The heat sink for high-power computing chips according to claim 1, characterized in that: The radiator further comprises a pair of radiator joints (4) respectively connected to a pair of working medium flow ports (31).

Images