Wafer automatic loading equipment and use method thereof

Abstract

The invention relates to the technical field of wafer processing, in particular to automatic wafer loading equipment and a using method thereof.The automatic wafer loading equipment comprises a mounting frame, a loading platform, an opening and closing lifting mechanism and a box opening and closing mechanism, and the box opening and closing mechanism is used for clamping a box cover on a wafer box and enabling the box cover to cover or be separated from the open end of the wafer box in the front-back direction; the opening and closing lifting mechanism is in driving connection with the box body opening and closing mechanism, the opening and closing lifting mechanism is used for driving the box body opening and closing mechanism to ascend and descend, and the opening and closing lifting mechanism is located below or above the box body opening and closing mechanism. According to the invention, an effective wafer box operation space can be conveniently provided, the space occupation is ingeniously saved through the arrangement position of the opening and closing lifting mechanism, the waiting time of wafer processing is reduced, and the wafer transfer efficiency is improved.

Description

Technical Field

[0001] The present invention relates to the technical field of wafer processing, and in particular to an automatic wafer loading device and a method for using the same. Background Art

[0002] Wafer cassettes are used to temporarily store wafers during the wafer transfer process and maintain their sealed state. Wafer cassettes typically consist of a box body with a side opening and a lid that seals the side opening and can be completely detached from the box body.

[0003] Usually, a loading and opening mechanism (Loadport) for wafer boxes is set in front of the wafer process equipment, and cooperates with the wafer box transfer robot and the process equipment wafer transfer robot to realize wafer picking and placing. Taking the removal of wafers as an example, the following steps are implemented in a cycle: the wafer box transfer robot places the wafer box on the loading and opening mechanism → the loading and opening mechanism opens the box and inspects it → the process equipment wafer transfer robot transfers the wafer → until the wafer box is empty, and then the loading and opening mechanism closes the box → the wafer box transfer robot takes away the wafer box.

[0004] However, in this cycle step, the lateral occupied space increases, making it difficult to effectively utilize the vertical space, resulting in a reduction in storage stations and a low wafer transfer efficiency. Summary of the Invention

[0005] In response to the deficiencies in the prior art, the present invention provides an automatic wafer loading device and a method of using the same, which facilitates providing an effective wafer box operating space, cleverly saves space occupancy by arranging the opening and closing lifting mechanism, reduces the long waiting time of the wafer transfer robot arm after completing the wafer transfer and the next round of wafer transfer, and improves the wafer transfer efficiency.

[0006] In order to solve the above technical problems, the present invention adopts the following technical solutions:

[0007] The present invention provides a wafer automatic loading device, comprising a mounting frame, a loading platform arranged on the mounting frame, and an opening and closing lifting mechanism, wherein the loading platform is used to mount a wafer box and drive the wafer box away from or close to the mounting frame in the front-to-back direction, the mounting frame is equipped with a box body opening and closing mechanism opposite to the opening side of the wafer box on the loading platform, the box body opening and closing mechanism is used to clamp the box cover on the wafer box and make the box cover cover or detach from the opening end of the wafer box in the front-to-back direction, the opening and closing lifting mechanism is drivingly connected to the box body opening and closing mechanism, the opening and closing lifting mechanism is used to drive the box body opening and closing mechanism to rise and fall, and the opening and closing lifting mechanism is located below or above the box body opening and closing mechanism.

[0008] The loading platform includes a loading mechanism and a loading locking mechanism. The loading mechanism is connected to the mounting frame. The loading locking mechanism includes a positioning member and a clamping mechanism. The positioning member and the clamping mechanism are both installed on the loading mechanism. The positioning member cooperates with the positioning hole of the wafer box. After the wafer box is positioned on the loading mechanism using the positioning member, it is locked by the clamping mechanism.

[0009] The loading mechanism includes a base plate, a support body and a driving member. The support body is installed on the mounting frame. The base plate is slidably connected to the support body along the front and rear directions. The positioning member and the clamping mechanism are both installed on the base plate. The driving member is installed on the support body. The driving member is connected to the base plate so that the base plate drives the wafer box to move forward and backward away from or closer to the mounting frame.

[0010] Among them, the clamping mechanism includes a clamping frame and a clamping cylinder. The bottom of the wafer box has a clamping cavity. The clamping cylinder is installed on the base plate. The clamping cylinder is driven and connected to the clamping frame. When the clamping cylinder is in an extended state, one end of the clamping frame extends into the clamping cavity and presses the inner wall of the clamping cavity. When the clamping cylinder is in a contracted state, the inner wall of the clamping cavity is released.

[0011] In which, the clamping frame includes a clamping drive block and a clamping pressing member connected to the clamping drive block, the clamping drive block is connected to the output end of the clamping cylinder, the clamping drive block has a first limiting part and a second limiting part arranged parallel to the first limiting part, the first limiting part is installed with a first limit switch, and a second limit switch is arranged between the first limiting part and the second limiting part.

[0012] Wherein, the clamping and pressing member is equipped with at least three rollers, which are distributed in a triangular shape. When the clamping cylinder is in an extended state, the rollers press the inner side wall of the clamping cavity, and when the clamping cylinder is in a contracted state, the rollers release the inner side wall of the clamping cavity.

[0013] Among them, the box opening and closing mechanism includes an opening and closing frame, an opening and closing plate, a clamping component and a first linear module. The opening and closing frame is driven and connected to the opening and closing lifting mechanism. The opening and closing plate slides on the opening and closing frame along the front and back directions. The clamping component is installed on the opening and closing plate. The clamping component is arranged opposite to the open end of the wafer box on the loading platform. The first linear module is installed on the opening and closing frame and is driven and connected to the opening and closing plate. The first linear module drives the opening and closing plate to move forward and backward. When the opening and closing plate approaches the wafer box on the loading platform, the clamping component is used to clamp the box cover.

[0014] The clamping component includes a suction cup and a clamping piece. The suction cup is installed on one side of the opening end of the wafer box on the opening and closing plate close to the loading platform. The clamping piece is installed on the opening and closing plate, and one end of the clamping piece corresponds to the opening end of the wafer box.

[0015] The clamping member is rotatably connected to the opening and closing plate, and the clamping member is connected to a movable frame, and the movable frame drives the clamping member to rotate when it moves.

[0016] Among them, the movable frame is provided with a guide groove, and the clamping part includes a clamping positioning block and a rocker arm connected to the clamping positioning block. The rocker arm is rotatably connected to the opening and closing plate, and one end of the rocker arm cooperates with the guide groove. When the movable frame moves, it drives one end of the rocker arm to swing in the guide groove, thereby causing the clamping positioning block to rotate.

[0017] There is an accommodating space between the movable frame and the opening and closing plate. The opening and closing plate is equipped with a driving cylinder connected to the movable frame. The driving cylinder is located in the accommodating space. The driving cylinder drives the movable frame to move and thus drives the clamping piece to rotate.

[0018] The opening and closing frame includes an opening and closing seat and a movable frame connected to the opening and closing seat. The opening and closing seat is connected to the output end of the opening and closing lifting mechanism. A detection member for detecting wafers in the wafer box on the loading platform is installed on the top of the movable frame. The opening and closing plate slides on the opening and closing seat in the front-back direction, and the opening and closing plate corresponds to the movable frame.

[0019] The movable frame is connected to a second linear module, the second linear module is installed on the opening and closing seat, and the second linear module drives the movable frame to move forward and backward.

[0020] Wherein, a detection bracket extending toward the wafer box is provided on the top of the movable frame, and the detection component is installed at one end of the detection bracket close to the wafer box.

[0021] Among them, the opening and closing plate is connected to the opening and closing support, and the opening and closing plate is slidably connected to the opening and closing frame through the opening and closing support. A first driving space is enclosed within the opening and closing support. The first linear module is located in the first driving space. The first linear module is driven and connected to the opening and closing support and drives the opening and closing support to move forward and backward, so that the opening and closing plate moves forward and backward to approach or move away from the wafer box.

[0022] The movable frame is connected to the opening and closing seat in a sliding manner along the front-back direction. A second driving space is formed inside the opening and closing seat. The second linear module is located in the second driving space.

[0023] Among them, the opening and closing lifting mechanism includes a lifting bracket, a lifting guide rail and a lifting module. The lifting bracket is installed on the mounting frame. The lifting guide rail is longitudinally arranged on the lifting bracket. The box body opening and closing mechanism is slidably connected to the lifting guide rail. The lifting module is installed on the lifting bracket and is located on the side of the box body opening and closing mechanism. The lifting module is driven and connected to the box body opening and closing mechanism to enable the box body opening and closing mechanism to move longitudinally.

[0024] The present invention also provides a method for using the wafer automatic loading device, comprising the following steps:

[0025] S01. Install the wafer cassette using a loading platform so that the opening side of the wafer cassette corresponds to the cassette opening and closing mechanism, and move the wafer cassette toward the cassette opening and closing mechanism;

[0026] S02, using the opening and closing lifting mechanism to drive the box body opening and closing mechanism to rise and fall, so that the box body opening and closing mechanism is directly opposite the opening side of the wafer box;

[0027] S03, using the box body opening and closing mechanism to clamp the box cover on the wafer box, and then move the box cover away from the wafer box;

[0028] S04. Using the opening and closing lifting mechanism to drive the box body opening and closing mechanism to move downward to free up space at the opening end of the wafer box. During the descent of the box body opening and closing mechanism with the box cover, the detection unit is used to detect the wafers in the wafer box and transmit the wafer information to other processing devices.

[0029] S05. Other processing devices clamp and process the wafers, and then place the wafers back into the wafer box;

[0030] S06, the opening and closing lifting mechanism drives the box body opening and closing mechanism and the box cover to rise to the opening end of the wafer box, and the first linear module drives the box cover to move toward the wafer box. After the box cover is closed on the wafer box, the box body opening and closing mechanism releases the box cover;

[0031] S07 , repeat the above steps S01 to S06 to operate on the next wafer box.

[0032] Beneficial effects of the present invention:

[0033] The present invention clamps the box cover and moves the box cover away from the wafer box through the box opening and closing mechanism, and the opening and closing lifting mechanism drives the box opening and closing mechanism to move downward, so as to provide an effective wafer box operation space. The setting position of the opening and closing lifting mechanism cleverly saves space occupancy, reduces the long waiting time of the wafer transfer robot arm after completing the wafer transfer and performing the next round of wafer transfer, and improves the wafer transfer efficiency. BRIEF DESCRIPTION OF THE DRAWINGS

[0034] Figure 1 Schematic diagram of the separation state of the wafer box and the box cover.

[0035] Figure 2 This is a bottom view of the wafer box.

[0036] Figure 3 A cross-sectional view of a wafer box.

[0037] Figure 4 This is a side view of the wafer automatic loading equipment.

[0038] Figure 5 A side view of the loading platform.

[0039] Figure 6 Schematic diagram of the loading mechanism.

[0040] Figure 7 It is a structural diagram of the loading locking mechanism.

[0041] Figure 8 It is a schematic diagram of the installation structure of the opening and closing plate and the opening and closing frame.

[0042] Figure 9 Schematic diagram of the structure of the opening and closing panel Figure 1 .

[0043] Figure 10 Schematic diagram of the structure of the opening and closing panel Figure 2 .

[0044] Figure 11 It is a top view of the installation structure of the opening and closing plate and the clamping component.

[0045] Figure 12 This is a schematic diagram of the installation structure of the opening and closing frame and the opening and closing support.

[0046] Figure 13 It is a schematic diagram of the three-dimensional structure of the moving frame and the mounting frame.

[0047] Figure 14 This is a schematic diagram of the three-dimensional structure of the first linear module and the second linear module installed on the opening and closing frame.

[0048] Figure 15 It is a schematic diagram of the installation structure of the opening and closing lifting mechanism and the mounting frame.

[0049] 01. Wafer box; 02. Box cover; 03. Positioning hole; 04. Clamping cavity;

[0050] 1. Mounting frame;

[0051] 2. Loading platform;

[0052] 21. Loading mechanism; 211. Bottom plate; 212. Support body; 213. Driving member;

[0053] 221. Positioning member; 222. Clamping mechanism;

[0054] 2221, clamping frame; 2222, clamping cylinder;

[0055] 22211, clamping drive block; 22212, clamping pressing member; 222121, roller;

[0056] 222111, first limit portion; 222112, second limit portion; 222113, second limit switch;

[0057] 2221111, first limit switch;

[0058] 3. Box opening and closing mechanism;

[0059] 31. Opening and closing frame; 311. Opening and closing seat; 3111. Second driving space; 312. Moving frame; 3121. Detection member; 3122. Second linear module; 3123. Detection bracket;

[0060] 32. Opening and closing plate; 321. Driving cylinder; 322. Opening and closing support; 3221. First driving space;

[0061] 33. Clamping parts;

[0062] 331. Suction cup; 332. Clamping piece;

[0063] 3321, clamping positioning block; 3322, swing rod;

[0064] 34. The first linear module;

[0065] 301, movable frame; 3011, guide groove;

[0066] 302. Accommodation space;

[0067] 4. Opening and closing lifting mechanism;

[0068] 401. Lifting bracket; 402. Lifting guide rail; 403. Lifting module. DETAILED DESCRIPTION

[0069] In order to facilitate the understanding of those skilled in the art, the present invention is further described below in conjunction with the examples and drawings. The specific embodiments of the present invention will be described below. It should be noted that in the specific description of these embodiments, in order to provide a concise description, this specification cannot provide a detailed description of all the features of the actual embodiments. It should be understood that in the actual implementation of any embodiment, it should be understood that for ordinary technicians in the field related to the content disclosed by the present invention, some changes in design, manufacturing or production based on the technical content disclosed in this disclosure are just conventional technical means and should not be understood as the content of this disclosure being insufficient. The present invention is described in detail below in conjunction with the drawings.

[0070] refer to Figures 1 to 4As shown, the present invention provides a wafer automatic loading device, comprising a mounting frame 1, a loading platform 2 arranged on the mounting frame 1 and an opening and closing lifting mechanism 4, wherein the loading platform 2 is used to mount a wafer box 01 and drive the wafer box 01 away from or close to the mounting frame 1 in the front-to-back direction, and the mounting frame 1 is equipped with a box body opening and closing mechanism 3 opposite to the opening side of the wafer box 01 on the loading platform 2, and the box body opening and closing mechanism 3 is used to clamp the box cover 02 on the wafer box 01 and make the box cover 02 cover or separate from the opening end of the wafer box 01 in the front-to-back direction, and the opening and closing lifting mechanism 4 is used to clamp the box cover 02 on the wafer box 01 and make the box cover 02 cover or separate from the opening end of the wafer box 01 in the front-to-back direction. The lowering mechanism 4 is driven and connected with the box body opening and closing mechanism 3. The opening and closing lifting mechanism 4 is used to drive the box body opening and closing mechanism 3 to rise and fall. The opening and closing lifting mechanism 4 is located below or above the box body opening and closing mechanism 3. In actual application, the loading platform 2 is first used to install the wafer box 01 so that the opening side of the wafer box 01 corresponds to the box body opening and closing mechanism 3, and the wafer box 01 is moved toward the box body opening and closing mechanism 3. The opening and closing lifting mechanism 4 is used to drive the box body opening and closing mechanism 3 to rise and fall so that the box body opening and closing mechanism 3 is facing the opening side of the wafer box 01. The box body opening and closing mechanism 3 is used to clamp the wafer box 01, and then move the box cover 02 away from the wafer box 01; the opening and closing lifting mechanism 4 is used to drive the box body opening and closing mechanism 3 to move downward to make room for the opening end of the wafer box 01. During the process of the box body opening and closing mechanism 3 and the box cover 02 descending, the detection part 3121 is used to detect the wafers in the wafer box 01, and the wafer information is transmitted to other processing devices; after the other processing devices clamp and process the wafers, the wafers are placed in the wafer box 01 again; finally, the opening and closing lifting mechanism 4 drives the box body opening and closing mechanism 3 and the box cover 02 to rise to the wafer box At the open end of 01, the box body opening and closing mechanism 3 is used to drive the box cover 02 to move toward the wafer box 01. After the box cover 02 is closed on the wafer box 01, the box body opening and closing mechanism 3 releases the box cover 02; and the opening and closing lifting mechanism 4 can be set below the box body opening and closing mechanism 3, or the opening and closing lifting mechanism 4 can be set above the box body opening and closing mechanism 3, both of which can cleverly save space occupancy, avoid the reduction of storage stations, and reduce the long waiting time of the wafer transfer robot arm after completing the wafer transfer before the next round of wafer transfer, thereby improving the wafer transfer efficiency.

[0071] refer to Figures 5 to 7As shown, in this embodiment, the loading platform 2 includes a loading mechanism 21 and a loading locking mechanism. The loading mechanism 21 is connected to the mounting frame 1, and the loading locking mechanism includes a positioning member 221 and a clamping mechanism 222. The positioning member 221 and the clamping mechanism 222 are both installed on the loading mechanism 21, and the positioning member 221 cooperates with the positioning hole 03 of the wafer box 01. The wafer box 01 is positioned on the loading mechanism 21 by the positioning member 221 and is locked by the clamping mechanism 222; the loading mechanism 21 includes a base plate 211, a support body 212 and a driving member 213, and the support body 212 is installed on the mounting frame 1. The base plate 211 is slidably connected to the support body 212 along the front and rear directions, and the positioning member 221 and the clamping mechanism 222 are both installed on the base plate 211, and the driving member 213 is installed on the support body 212. The driving member 213 is driven and connected to the base plate 211 so that the base plate 211 drives the wafer box 01 to move forward and backward away from or close to the mounting frame 1.

[0072] refer to Figure 5 、 7 As shown, in actual application, the number of positioning members 221 is three, the positioning members 221 are pins, and the positioning holes 03 are long strip structures, which improve the positioning efficiency of the positioning members 221 and the positioning holes 03; after the wafer box 01 is positioned on the loading mechanism 21, it is locked by the clamping mechanism 222, and the wafer box 01 and the base plate 211 remain relatively fixed, and the driving member 213 can smoothly drive the base plate 211 to move, driving the wafer box 01 to move back and forth away from or close to the mounting frame 1.

[0073] refer to Figure 3 、 7 As shown, in this embodiment, the clamping mechanism 222 includes a clamping frame 2221 and a clamping cylinder 2222. The bottom of the wafer box 01 has a clamping cavity 04. The clamping cylinder 2222 is installed on the base plate 211. The clamping cylinder 2222 is driven and connected to the clamping frame 2221. When the clamping cylinder 2222 is in an extended state, one end of the clamping frame 2221 extends into the clamping cavity 04 and presses the inner wall of the clamping cavity 04. When the clamping cylinder 2222 is in a contracted state, the inner wall of the clamping cavity 04 is released. The clamping frame 2221 is driven to move by the clamping cylinder 2222, which effectively controls the pressing and releasing of the clamping cavity 04, and automatically controls the locking and unlocking of the wafer box 01, saving labor and fast operation.

[0074] refer to Figure 7As shown, in this embodiment, the clamping frame 2221 includes a clamping drive block 22211 and a clamping pressing member 22212 connected to the clamping drive block 22211, the clamping drive block 22211 is connected to the output end of the clamping cylinder 2222, the clamping drive block 22211 has a first limiting portion 222111 and a second limiting portion 222112 arranged parallel to the first limiting portion 222111, the first limiting portion 222111 is installed with a first limit switch 2221111, and a second limit switch 222113 is arranged between the first limiting portion 222111 and the second limiting portion 222112. In actual application, when the clamping cylinder 2222 is in a retracted state, the second limit switch 222113 acts on the second limit part 222112, effectively limiting the clamping cylinder 2222; when the clamping cylinder 2222 is in an extended state, the first limit switch 2221111 acts on the installation end of the second limit switch 222113, effectively limiting the clamping cylinder 2222. Specifically, the clamping drive block 22211 has a makeshift space directly opposite to the second limit switch 222113. When the clamping cylinder 2222 is in use, the second limit switch 222113 can smoothly shuttle in the makeshift space. The structure is compact, space saving, cost reduction and practicality are strong.

[0075] In this embodiment, the clamping and pressing member 22212 is equipped with at least three rollers 222121, and the rollers 222121 are distributed in a triangular manner. When the clamping cylinder 2222 is in an extended state, the rollers 222121 press the inner side wall of the clamping cavity 04, and when the clamping cylinder 2222 is in a retracted state, the rollers 222121 release the inner side wall of the clamping cavity 04. The triangularly distributed rollers 222121 effectively support the bottom of the wafer box 01. When the wafer box 0 After positioning, the roller 222121 acts closely on the inner wall of the clamping cavity 01, effectively limiting the movement of the wafer box 01 and achieving a good positioning effect. Similarly, when the clamping cylinder 2222 is in a retracted state, the roller 222121 releases the inner wall of the clamping cavity 04, and the wafer box 01 can be quickly removed, making disassembly and assembly convenient. During specific installation, a distance sensor can be installed on the side of the mounting frame 1 close to the wafer box 01 to accurately control the moving position of the wafer box 01, so as to facilitate the subsequent rapid clamping of the box cover 02.

[0076] refer to Figure 1 、 8As shown in Figure 12, in this embodiment, the box opening and closing mechanism 3 includes an opening and closing frame 31, an opening and closing plate 32, a clamping component 33 and a first linear module 34. The opening and closing frame 31 is driven and connected to the opening and closing lifting mechanism 4. The opening and closing plate 32 slides on the opening and closing frame 31 in the front and rear directions. The clamping component 33 is installed on the opening and closing plate 32. The clamping component 33 is arranged opposite to the open end of the wafer box 01 on the loading platform 2. The first linear module 34 is installed on the opening and closing frame 31 and is connected to the opening and closing plate 32 drive connection, the first linear module 34 drives the opening and closing plate 32 to move forward and backward, and the clamping component 33 is used to clamp the box cover 02 when the opening and closing plate 32 approaches the wafer box 01 on the loading platform 2; in actual application, the first linear module 34 drives the opening and closing plate 32 to move forward and backward, and when the opening and closing plate 32 approaches the wafer box 01 on the loading platform 2, the clamping component 33 is used to clamp the box cover 02, and then the first linear module 34 drives the clamping component 33 and the box cover 02 to move away from the wafer box 01.

[0077] refer to Figure 9 、 10 As shown, in this embodiment, the clamping component 33 includes a suction cup 331 and a clamping piece 332, the suction cup 331 is installed on the side of the opening end of the wafer box 01 on the opening and closing plate 32 close to the loading platform 2, and the clamping piece 332 is installed on the opening and closing plate 32, and one end of the clamping piece 332 corresponds to the opening end of the wafer box 01; the wafer box 01 has a concave cavity matching the clamping piece, when the opening and closing plate 32 and the wafer box 01 on the loading platform 2 are close to each other, the suction cup 331 absorbs the box cover 02 through negative pressure, and the clamping piece 332 adapts to the concave cavity to effectively fix the wafer box 01.

[0078] In this embodiment, the clamping member 332 is rotatably connected to the opening and closing plate 32, and the clamping member 332 is connected to the movable frame 301. When the movable frame 301 moves, it drives the clamping member 332 to rotate. During actual installation, the movable frame 301 drives the clamping member 332 to rotate. The clamping member 332 rotates to different angles to adapt to a variety of concave cavities, thereby improving the positioning versatility.

[0079] refer to Figure 9 、 11 As shown, in this embodiment, the movable frame 301 is provided with a guide groove 3011, and the clamping member 332 includes a clamping positioning block 3321 and a rocker arm 3322 connected to the clamping positioning block 3321, and the rocker arm 3322 is rotatably connected to the opening and closing plate 32, and one end of the rocker arm 3322 cooperates with the guide groove 3011. When the movable frame 301 moves, it drives one end of the rocker arm 3322 to swing in the guide groove 3011, thereby rotating the clamping positioning block 3321. Specifically, clamping members 332 can be set at both ends of the movable frame 301, and both ends of the wafer box 01 are positioned by the clamping members 332, thereby improving the positioning stability of the wafer box 01.

[0080] refer to Figure 11 As shown, in this embodiment, there is an accommodating space 302 between the movable frame 301 and the opening and closing plate 32, and the opening and closing plate 32 is installed with a driving cylinder 321 that is driven and connected to the movable frame 301. The driving cylinder 321 is located in the accommodating space 302, and the driving cylinder 321 drives the movable frame 301 to move, thereby driving the clamping member 332 to rotate. By driving the movable frame 301 to move by the driving cylinder 321, the rotation of the clamping member 332 is automatically controlled, and the rotation accuracy of the clamping member 332 is improved. The driving cylinder 321 is hidden between the movable frame 301 and the opening and closing plate 32, which effectively saves space.

[0081] refer to Figure 12 、 13 As shown, in this embodiment, the opening and closing frame 31 includes an opening and closing seat 311 and a movable frame 312 connected to the opening and closing seat 311, the opening and closing seat 311 is connected to the output end of the opening and closing lifting mechanism 4, and a detection member 3121 for detecting the wafers in the wafer box 01 on the loading platform 2 is installed on the top of the movable frame 312, and the opening and closing plate 32 slides on the opening and closing seat 311 along the front and rear directions, and the opening and closing plate 32 corresponds to the movable frame 312; the movable frame 312 is connected to a second linear module 3122, and the second linear module 3122 is installed on the opening and closing seat 311, and the second linear module 3122 drives the movable frame 312 to move back and forth; in actual application, after the opening and closing plate 32 takes the box cover 02 out of the wafer box 01, the first linear module 34 makes The box cover 02 moves away from the wafer box 01, and then the box body opening and closing mechanism 3 is driven to move downward as a whole through the opening and closing lifting mechanism. While the box body opening and closing mechanism 3 moves downward, the second linear module 3122 smoothly drives the moving frame 312 to move toward the opening end of the wafer box 01, so that the detection part 3121 can be used to detect the wafers in the wafer box 01 in time, and the moving space of the opening and closing plate 32 and the moving space of the detection part 3121 are cleverly spliced, and at the same time, the movement of the box cover 02 and the detection of the wafers are independent of each other, thereby improving the safety of the structure. Specifically, the detection part 3121 has a wafer mapping function, which can automatically detect the status of the wafers in each slot in the wafer box 01, such as single wafer, cross-wafer, and has the function of automatically identifying the size of the wafer in the box when opening the box, which is quick to use.

[0082] In this embodiment, a detection bracket 3123 extending toward the wafer box 01 is provided on the top of the movable frame 312, and the detection component 3121 is installed on one end of the detection bracket 3123 close to the wafer box 01. When the movable frame 312 is located on the opening side of the wafer box 01, the detection component 3121 can be smoothly extended into the wafer box 01, thereby increasing the detection area of ​​the wafer and improving the detection quality.

[0083] refer to Figure 12As shown, in this embodiment, the opening and closing plate 32 is connected to the opening and closing support 322, and the opening and closing plate 32 is slidably connected to the opening and closing frame 31 through the opening and closing support 322. The opening and closing support 322 is surrounded by a first driving space 3221, and the first linear module 34 is located in the first driving space 3221. The first linear module 34 is driven and connected to the opening and closing support 322 and drives the opening and closing support 322 to move back and forth, so that the opening and closing plate 32 moves back and forth close to or away from the wafer box 01, and the opening and closing support 322 is driven by the first linear module 34 to move, and the opening and closing support 322 is driven to move synchronously with the opening and closing plate 32; through the set first driving space 3221, the first linear module 34 is cleverly hidden in the opening and closing support 322, the structural arrangement is compact, and the space occupancy of the structure is reduced.

[0084] refer to Figure 12 、 14 As shown, in this embodiment, the movable frame 312 is connected to the opening and closing seat 311 in a sliding manner along the front-to-back direction. The opening and closing seat 311 is surrounded by a second driving space 3111. The second linear module 3122 is located in the second driving space 3111. The second linear module 3122 is cleverly hidden in the opening and closing seat 311, saving space and having a compact structure.

[0085] refer to Figure 4 、 15 As shown, in this embodiment, the opening and closing lifting mechanism 4 includes a lifting bracket 401, a lifting guide rail 402 and a lifting module 403. The lifting bracket 401 is installed on the mounting frame 1, and the lifting guide rail 402 is longitudinally arranged on the lifting bracket 401. The box body opening and closing mechanism 3 is slidably connected to the lifting guide rail 402. The lifting module 403 is installed on the lifting bracket 401 and is located on the side of the box body opening and closing mechanism 3. The lifting module 403 is driven and connected to the box body opening and closing mechanism 3 to enable the box body opening and closing mechanism 3 to move longitudinally. The box body opening and closing mechanism 3 is driven to move longitudinally by the lifting module 403. During the downward movement of the box body opening and closing mechanism 3, the space at the open end of the wafer box 01 can be vacated to provide more operating space for other processing devices to operate on the wafer. Since the lifting module 403 is located on the side of the box body opening and closing mechanism 3, the structural arrangement is compact, which reduces space occupancy.

[0086] refer to Figures 1 to 4 , Figure 13 As shown, the present invention also provides a method for using a wafer automatic loading device, comprising the following steps:

[0087] S01, using the loading platform 2 to install the wafer box 01 so that the opening side of the wafer box 01 corresponds to the box body opening and closing mechanism 3, and moving the wafer box 01 toward the box body opening and closing mechanism 3;

[0088] S02, using the opening and closing lifting mechanism 4 to drive the box body opening and closing mechanism 3 to rise and fall, so that the box body opening and closing mechanism 3 is facing the opening side of the wafer box 01;

[0089] S03, using the box body opening and closing mechanism 3 to clamp the box cover 02 on the wafer box 01, and then move the box cover 02 away from the wafer box 01;

[0090] S04. The opening and closing lifting mechanism 4 is used to drive the box opening and closing mechanism 3 to move downward to free up space at the opening end of the wafer box 01. During the process of the box opening and closing mechanism 3 and the box cover 02 descending, the detection component 3121 is used to detect the wafers in the wafer box 01 and transmit the wafer information to other processing devices;

[0091] S05: After other processing devices clamp and process the wafer, the wafer is placed back into the wafer box 01;

[0092] S06, the opening and closing lifting mechanism 4 drives the box body opening and closing mechanism 3 and the box cover 02 to rise to the opening end of the wafer box 01, and uses the first linear module 34 to drive the box cover 02 to move toward the wafer box 01. After the box cover 02 is closed on the wafer box 01, the box body opening and closing mechanism 3 releases the box cover 02;

[0093] S07 , repeat the above steps S01 to S06 to operate on the next wafer box 01 .

[0094] The above description is only a preferred embodiment of the present invention and does not limit the present invention in any form. Although the present invention is disclosed as a preferred embodiment as above, it is not used to limit the present invention. Any technician familiar with this profession can make some changes or modifications to equivalent embodiments of equivalent changes by using the technical content disclosed above without departing from the scope of the technical solution of the present invention. However, any simple modifications, equivalent changes and modifications made to the above embodiments according to the technology of the present invention are all within the scope of the technical solution of the present invention without departing from the content of the technical solution of the present invention.

Claims

1. A wafer automatic loading device, characterized in that: The invention comprises a mounting frame (1), a loading platform (2) arranged on the mounting frame (1), and an opening and closing lifting mechanism (4); the loading platform (2) is used to mount a wafer box (01) and drive the wafer box (01) away from or close to the mounting frame (1) in the front-back direction; the mounting frame (1) is provided with a box body opening and closing mechanism (3) opposite to the opening side of the wafer box (01) on the loading platform (2); the box body opening and closing mechanism (3) is used to clamp the box cover (02) on the wafer box (01) and make the box cover (02) cover or detach from the opening end of the wafer box (01) in the front-back direction; the opening and closing lifting mechanism (4) is connected to the box body opening and closing mechanism (3) in driving connection; the opening and closing lifting mechanism (4) is used to drive the box body opening and closing mechanism (3) to rise and fall; the opening and closing lifting mechanism (4) is located below or above the box body opening and closing mechanism (3).

2. The wafer automatic loading equipment according to claim 1, characterized in that: The loading platform (2) includes a loading mechanism (21) and a loading locking mechanism, the loading mechanism (21) is connected to the mounting frame (1), the loading locking mechanism includes a positioning member (221) and a clamping mechanism (222), the positioning member (221) and the clamping mechanism (222) are both installed on the loading mechanism (21), the positioning member (221) cooperates with the positioning hole (03) of the wafer box (01), and the wafer box (01) is positioned on the loading mechanism (21) by the positioning member (221) and is locked by the clamping mechanism (222); The loading mechanism (21) comprises a base plate (211), a support body (212) and a driving member (213); the support body (212) is mounted on the mounting frame (1); the base plate (211) is connected to the support body (212) in a sliding manner along the front-rear direction; the positioning member (221) and the clamping mechanism (222) are both mounted on the base plate (211); the driving member (213) is mounted on the support body (212); and the driving member (213) is connected to the base plate (211) in a driving manner so that the base plate (211) drives the wafer box (01) to move forward and backward away from or closer to the mounting frame (1).

3. The wafer automatic loading equipment according to claim 2, characterized in that: The clamping mechanism (222) includes a clamping frame (2221) and a clamping cylinder (2222). The bottom of the wafer box (01) is provided with a clamping cavity (04). The clamping cylinder (2222) is mounted on the base plate (211). The clamping cylinder (2222) is drive-connected to the clamping frame (2221). When the clamping cylinder (2222) is in an extended state, one end of the clamping frame (2221) extends into the clamping cavity (04) and presses the inner side wall of the clamping cavity (04). When the clamping cylinder (2222) is in a contracted state, the inner side wall of the clamping cavity (04) is released.

4. The wafer automatic loading equipment according to claim 3, characterized in that: The clamping frame (2221) comprises a clamping drive block (22211) and a clamping pressing member (22212) connected to the clamping drive block (22211); the clamping drive block (22211) is connected to the output end of the clamping cylinder (2222); the clamping drive block (22211) comprises a first limiting portion (222111) and a second limiting portion (222112) arranged parallel to the first limiting portion (222111) and spaced apart; the first limiting portion (222111) is provided with a first limit switch (2221111); and a second limit switch (222113) is provided between the first limiting portion (222111) and the second limiting portion (222112).

5. The wafer automatic loading equipment according to claim 4, characterized in that: The clamping and pressing member (22212) is equipped with at least three rollers (222121), and the rollers (222121) are distributed in a triangular shape. When the clamping cylinder (2222) is in an extended state, the rollers (222121) press the inner side wall of the clamping cavity (04), and when the clamping cylinder (2222) is in a contracted state, the rollers (222121) release the inner side wall of the clamping cavity (04).

6. The wafer automatic loading equipment according to claim 1, characterized in that: The box body opening and closing mechanism (3) includes an opening and closing frame (31), an opening and closing plate (32), a clamping component (33) and a first linear module (34). The opening and closing frame (31) is connected to the opening and closing lifting mechanism (4) by driving. The opening and closing plate (32) slides on the opening and closing frame (31) in the front-back direction. The clamping component (33) is installed on the opening and closing plate (32). The clamping component (33) is arranged opposite to the opening end of the wafer box (01) on the loading platform (2). The first linear module (34) is installed on the opening and closing frame (31) and connected to the opening and closing plate (32). The first linear module (34) drives the opening and closing plate (32) to move forward and backward. When the opening and closing plate (32) and the wafer box (01) on the loading platform (2) are close to each other, the clamping component (33) is used to clamp the box cover (02).

7. The wafer automatic loading equipment according to claim 6, characterized in that: The clamping component (33) includes a suction cup (331) and a clamping member (332), wherein the suction cup (331) is mounted on one side of the opening end of the wafer box (01) on the opening and closing plate (32) close to the loading platform (2), and the clamping member (332) is mounted on the opening and closing plate (32), and one end of the clamping member (332) corresponds to the opening end of the wafer box (01).

8. The wafer automatic loading equipment according to claim 7, characterized in that: The clamping member (332) is rotatably connected to the opening and closing plate (32), and the clamping member (332) is connected to the moving frame (301). When the moving frame (301) moves, it drives the clamping member (332) to rotate.

9. The wafer automatic loading equipment according to claim 8, characterized in that: The movable frame (301) is provided with a guide groove (3011), and the clamping member (332) comprises a clamping positioning block (3321) and a rocker (3322) connected to the clamping positioning block (3321); the rocker (3322) is rotatably connected to the opening and closing plate (32), and one end of the rocker (3322) cooperates with the guide groove (3011). When the movable frame (301) moves, it drives one end of the rocker (3322) to swing in the guide groove (3011), thereby causing the clamping positioning block (3321) to rotate.

10. The wafer automatic loading equipment according to claim 8, characterized in that: An accommodating space (302) is provided between the movable frame (301) and the opening and closing plate (32). The opening and closing plate (32) is provided with a driving cylinder (321) connected to the movable frame (301). The driving cylinder (321) is located in the accommodating space (302). The driving cylinder (321) drives the movable frame (301) to move, thereby driving the clamping member (332) to rotate.

11. The wafer automatic loading equipment according to claim 6, characterized in that: The opening and closing frame (31) comprises an opening and closing seat (311) and a movable frame (312) connected to the opening and closing seat (311); the opening and closing seat (311) is connected to the output end of the opening and closing lifting mechanism (4); a detection member (3121) for detecting wafers in a wafer box (01) on a loading platform (2) is installed on the top of the movable frame (312); the opening and closing plate (32) slides on the opening and closing seat (311) in a front-to-rear direction; the opening and closing plate (32) corresponds to the movable frame (312); The movable frame (312) is connected to a second linear module (3122), and the second linear module (3122) is installed on the opening and closing seat (311). The second linear module (3122) drives the movable frame (312) to move forward and backward.

12. The wafer automatic loading equipment according to claim 11, characterized in that: A detection bracket (3123) extending toward the wafer box (01) is provided on the top of the movable frame (312), and the detection member (3121) is installed on one end of the detection bracket (3123) close to the wafer box (01).

13. The wafer automatic loading equipment according to claim 6, characterized in that: The opening and closing plate (32) is connected to an opening and closing support (322), and the opening and closing plate (32) is slidably connected to the opening and closing frame (31) through the opening and closing support (322). A first driving space (3221) is formed inside the opening and closing support (322), and the first linear module (34) is located in the first driving space (3221). The first linear module (34) is drivingly connected to the opening and closing support (322) and drives the opening and closing support (322) to move forward and backward, so that the opening and closing plate (32) moves forward and backward to approach or move away from the wafer box (01).

14. The wafer automatic loading equipment according to claim 11, characterized in that: The movable frame (312) is connected to the opening and closing seat (311) in a sliding manner along the front-back direction. A second driving space (3111) is formed inside the opening and closing seat (311), and the second linear module (3122) is located in the second driving space (3111).

15. The wafer automatic loading equipment according to claim 1, characterized in that: The opening and closing lifting mechanism (4) comprises a lifting bracket (401), a lifting guide rail (402) and a lifting module (403); the lifting bracket (401) is mounted on the mounting frame (1); the lifting guide rail (402) is longitudinally arranged on the lifting bracket (401); the box body opening and closing mechanism (3) is slidably connected to the lifting guide rail (402); the lifting module (403) is mounted on the lifting bracket (401) and is located on the side of the box body opening and closing mechanism (3); the lifting module (403) is drivingly connected to the box body opening and closing mechanism (3) so as to enable the box body opening and closing mechanism (3) to move longitudinally.

16. A method for using an automatic wafer loading device, characterized in that: The following steps are involved: S01, using the loading platform (2) to install the wafer box (01), so that the opening side of the wafer box (01) corresponds to the box body opening and closing mechanism (3), and moving the wafer box (01) toward the box body opening and closing mechanism (3); S02, using the opening and closing lifting mechanism (4) to drive the box body opening and closing mechanism (3) to rise and fall, so that the box body opening and closing mechanism (3) is facing the opening side of the wafer box (01); S03, using the box body opening and closing mechanism (3) to clamp the box cover (02) on the wafer box (01), and then move the box cover (02) away from the wafer box (01); S04, using the opening and closing lifting mechanism (4) to drive the box body opening and closing mechanism (3) to move downward to free up space at the opening end of the wafer box (01); during the process of the box body opening and closing mechanism (3) and the box cover (02) descending, using the detection component (3121) to detect the wafers in the wafer box (01), and transmitting the wafer information to other processing devices; S05, other processing devices clamp and process the wafer, and then put the wafer into the wafer box (01) again; S06, the opening and closing lifting mechanism (4) drives the box body opening and closing mechanism (3) and the box cover (02) to rise to the opening end of the wafer box (01), and the first linear module (34) drives the box cover (02) to move toward the wafer box (01). After the box cover (02) is closed on the wafer box (01), the box body opening and closing mechanism (3) releases the box cover (02); S07, repeat the above steps S01 to S06 to operate on the next wafer box (01).

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