Antenna device and antenna device assembly

Abstract

The present invention discloses an antenna device, comprising: a substrate including a first main surface, a second main surface opposite to the first main surface, and at least one side surface connecting the first main surface and the second main surface; an antenna pattern formed on at least one of the first main surface and the second main surface; and an antenna pad extending from the antenna pattern and formed at least on the side surface for soldering the antenna device to a printed circuit board mainboard. The invention further discloses an antenna device assembly comprising the antenna device.

Description

Technical Field

[0001] Embodiments of the present invention generally relate to antenna devices and antenna device assemblies, and more particularly, to antenna devices and antenna device assemblies suitable for automated assembly. Background Art

[0002] Existing antenna device installation technology usually uses manual installation to install the antenna device on the circuit board mainboard. For example, for antennas made of materials such as stamped metal and printed circuit board assemblies (PCBAs) that are commonly found on the market, they are usually installed on the printed circuit board mainboard in a vertical mode by manual insertion. For another example, for chip antennas, coaxial cable flexible printed circuits (FPCs), and printed circuit board (PCB) antennas that are common on the market, chip antennas are usually installed on the printed circuit board mainboard in a horizontal installation mode using surface mounting technology, while FPC and PCB antennas are usually manually assembled to the device plastic housing using double-sided tape on the production line. The installation of FPC and PCB antennas can be either horizontal or vertical, depending on the actual situation.

[0003] However, the existing antennas mentioned above are only suitable for manual assembly on production lines and cannot meet the requirements for automated assembly on production lines. In addition, some existing antenna types cannot meet the requirements for dual-mode (horizontal / vertical) selective assembly due to their inherent structure. Summary of the Invention

[0004] The purpose of the present invention is to solve at least one aspect of the above-mentioned problems and defects in the prior art.

[0005] According to one aspect of the present invention, there is provided an antenna device, comprising:

[0006] a substrate comprising a first main surface, a second main surface opposite to the first main surface, and at least one side surface connecting the first main surface and the second main surface;

[0007] an antenna pattern formed on at least one of the first main surface and the second main surface; and

[0008] An antenna pad extends from the antenna pattern and is formed at least on the side surface, for soldering the antenna device to a printed circuit board main board.

[0009] According to an exemplary embodiment of the present invention, the antenna pad further includes: a first pad portion, which is formed on the side surface and is used for the antenna device to be soldered to the printed circuit board mainboard in a vertical installation mode in which it is placed vertically relative to the printed circuit board mainboard; and a second pad portion, which is formed on the first main surface or the second main surface and is used for the antenna device to be soldered to the printed circuit board mainboard in a horizontal installation mode in which it is placed horizontally relative to the printed circuit board mainboard.

[0010] According to an exemplary embodiment of the present invention, the first pad portion extends from the antenna pattern, and the second pad portion extends from the first pad portion or the antenna pattern.

[0011] According to an exemplary embodiment of the present invention, grooves are formed on both sides of the first pad portion.

[0012] According to an exemplary embodiment of the present invention, the antenna pattern further includes at least one signal pattern and at least one ground pattern separated from each other; the antenna pad further includes at least one signal pad and at least one ground pad separated from each other; wherein the at least one signal pad extends from the at least one signal pattern, and the at least one ground pad extends from the at least one ground pattern.

[0013] According to an exemplary embodiment of the present invention, the antenna device further comprises: at least one fixing pad, the fixing pad being formed at least on the side surface and being used to fix the antenna device to a printed circuit board mainboard.

[0014] According to an exemplary embodiment of the present invention, the antenna device is adapted to be mounted on a printed circuit board motherboard by surface mounting technology.

[0015] According to another aspect of the present invention, there is provided an antenna device assembly, the antenna device assembly comprising:

[0016] The antenna device according to any one of the preceding embodiments; and

[0017] The bracket is coupled to the antenna device and is used to carry the antenna device so that the antenna device can be automatically assembled to the printed circuit board mainboard in a vertical installation mode in which the antenna device is vertically placed relative to the printed circuit board mainboard.

[0018] According to an exemplary embodiment of the present invention, the bracket includes: at least one positioning pin, and the at least one positioning pin is used to cooperate with a positioning hole formed on a printed circuit board mainboard to position the bracket and the antenna device on the printed circuit board mainboard.

[0019] According to an exemplary embodiment of the present invention, the support comprises a pick-up platform having a pick-up area of ​​at least about 5 mm x 5 mm.

[0020] According to an exemplary embodiment of the present invention, the picking platform is made of a temperature-resistant material capable of withstanding at least about 260 degrees Celsius.

[0021] According to an exemplary embodiment of the present invention, the bracket is detachably or integrally coupled to the antenna device.

[0022] The antenna devices and antenna device assemblies provided by the aforementioned exemplary embodiments of the present invention enable selective implementation of automated surface mounting technology for either a horizontal or vertical antenna device installation on a production line. This provides flexibility in the use of the antenna device, optimizes its performance, and reduces automated assembly costs on the production line. Furthermore, for example, when the antenna device according to the present invention is arranged in a vertical installation mode, the solder pads formed on the side surfaces can reduce the number of solder pads required on the main surface of the printed circuit board. Furthermore, the vertical installation mode of the antenna device is more conducive to automated manufacturing.

[0023] Other objects and advantages of the present invention will become apparent from the following description of the present invention with reference to the accompanying drawings, which will help to provide a comprehensive understanding of the present invention. BRIEF DESCRIPTION OF THE DRAWINGS

[0024] Figure 1 is a schematic structural diagram of an antenna device according to an exemplary embodiment of the present invention, mainly showing the structures of the first main surface and side surfaces of the antenna device;

[0025] Figure 2 is another schematic structural diagram of an antenna device according to an exemplary embodiment of the present invention, mainly showing the structure of the second main surface of the antenna device;

[0026] Figure 3 A schematic diagram showing the structure of an antenna device according to an exemplary embodiment of the present invention when it is mounted on a printed circuit board in a horizontal installation mode;

[0027] Figure 4 A schematic diagram showing the structure of an antenna device according to an exemplary embodiment of the present invention when it is mounted on a printed circuit board in a vertical installation mode;

[0028] Figure 5 A schematic diagram showing a state before the antenna device assembly according to an exemplary embodiment of the present invention is assembled to a printed circuit board main board;

[0029] Figure 6A schematic diagram showing a state where the antenna device assembly according to an exemplary embodiment of the present invention is mounted on a printed circuit board main board. DETAILED DESCRIPTION

[0030] The technical solution of the present invention will be further described in detail below through examples and in conjunction with the accompanying drawings. In the specification, the same or similar reference numerals indicate the same or similar components. The following description of the embodiments of the present invention with reference to the accompanying drawings is intended to explain the overall inventive concept of the present invention and should not be construed as limiting the present invention.

[0031] In addition, in the following detailed description, for ease of explanation, numerous specific details are set forth to provide a comprehensive understanding of the disclosed embodiments. However, it is apparent that one or more embodiments can be practiced without these specific details. In other cases, well-known structures and devices are shown in diagrammatic form to simplify the accompanying drawings.

[0032] According to one general technical concept of the present invention, an antenna device is provided. The antenna device includes: a substrate including a first main surface, a second main surface opposite the first main surface, and at least one side surface connecting the first and second main surfaces; an antenna pattern formed on at least one of the first and second main surfaces; and an antenna pad extending from the antenna pattern and formed on at least the side surface for soldering the antenna device to a printed circuit board.

[0033] According to another general technical concept of the present invention, an antenna assembly is provided. The antenna assembly includes: the antenna assembly described above; and a bracket. The bracket is coupled to the antenna assembly to support the antenna assembly, facilitating automated assembly of the antenna assembly to a printed circuit board (PCB) in a vertical mounting configuration, wherein the antenna assembly is positioned vertically relative to the PCB.

[0034] See also Figures 1 to 4According to an exemplary embodiment of the present invention, an antenna device 100 is provided. The antenna device 100 primarily includes a substrate 110, an antenna pattern 120 formed on the substrate 110, and an antenna pad 130. According to an exemplary embodiment of the present invention, the substrate 110 is generally planar and has a first main surface 111, a second main surface 112 opposite the first main surface 111, and at least one side surface 113 connecting the first and second main surfaces 111 and 112. The antenna pattern 120 is formed on at least one of the first and second main surfaces 111 and 112. In the illustrated embodiment, the antenna pattern 120 is formed only on the first main surface 111. However, according to the inventive concept of the present invention, the antenna pattern 120 may also be formed on the second main surface 112, or on both the first and second main surfaces 111 and 112. Taking the illustrated embodiment as an example, the antenna pattern 120 may be a printed circuit formed on the first main surface 111 of the substrate 110, including, for example, but not limited to, a signal circuit and a ground circuit. The antenna pad 130 extends from the antenna pattern 120 and is formed at least on the side surface 113 , for soldering the antenna device 100 to the printed circuit board main board 300 via the antenna pad 130 .

[0035] According to an embodiment of the present invention, Figures 1 to 4 As shown, the antenna pad 130 further includes a first pad portion 131 and a second pad portion 132. Specifically, as Figure 1 As shown, the first pad portion 131 is formed on the side surface 113 for soldering the antenna device 100 to the printed circuit board main board 300 in a vertical mounting mode in which the antenna device 100 is vertically placed relative to the printed circuit board main board 300. Figure 2 As shown, the second solder pad portion 132 is formed on the second main surface 112, and is used for the antenna device 100 to be soldered to the printed circuit board main board 300 in a horizontal installation mode placed horizontally relative to the printed circuit board main board 300. According to the inventive concept of the present invention, in other embodiments not shown, the second solder pad portion 132 is also formed on the first main surface 111 having the antenna pattern 120. Herein, the "horizontal installation mode" refers to a state in which the plane where the antenna pattern 120 of the antenna device 100 is located is parallel to the installation surface of the printed circuit board main board 300 (e.g., Figure 3 As shown), the “vertical installation mode” is a state in which the plane where the antenna pattern 120 of the antenna device 100 is located is perpendicular to the installation surface of the printed circuit board mainboard 300 (as shown). Figure 4). That is, in the horizontal mounting mode, various types of circuits in antenna pattern 120 of antenna device 100 can be connected to corresponding circuits on printed circuit board main board 300 via second pad portions 132 formed on second main surface 112. In the vertical mounting mode, various types of circuits in antenna pattern 120 of antenna device 100 can be connected to corresponding circuits on printed circuit board main board 300 via first pad portions 131 formed on side surface 113. Furthermore, by employing first pad portions 131 and second pad portions 132 formed on side surface 113 and second main surface 112, respectively, antenna device 100 is suitable for being mounted on printed circuit board main board 300 using surface mount technology.

[0036] According to one embodiment of the present invention, first pad portion 131 extends from antenna pattern 120, and second pad portion 132 extends from first pad portion 131. According to another embodiment of the present invention, first pad portion 131 and second pad portion 132 may also extend from antenna pattern 120. In addition, grooves are formed on both sides of first pad portion 131.

[0037] Through the above configuration, the present invention provides an antenna device that can selectively implement a horizontal installation mode or a vertical installation mode on a production line, which provides flexibility in the use of the antenna device.

[0038] like Figures 1 to 4 As shown, in the antenna device 100 provided according to an embodiment of the present invention, the antenna pattern 120 further includes at least one signal pattern 120a and at least one ground pattern 120b separated from each other; the antenna pad 130 further includes at least one signal pad 130a and at least one ground pad 130b separated from each other; wherein, at least one signal pad 130a extends from at least one signal pattern 120a, and at least one ground pad 130b extends from at least one ground pattern 120b. Specifically, in the example Figures 1 to 4 In the exemplary embodiment shown, the antenna pattern 120 includes a pair of signal patterns 120a and a ground pattern 120b. Figure 1 and Figure 2As shown, extending from each of the pair of signal patterns 120a is a signal pad 130a (i.e., a first pad portion 131) located on the side surface 113 and a signal pad 130a (i.e., a second pad portion 132) located on the second main surface 112. Extending from the ground pattern 120b is a ground pad 130b (i.e., a first pad portion 131) located on the side surface 113 and a ground pad 130b (i.e., a second pad portion 132) located on the second main surface 112. Of course, in other embodiments not shown, the number, position, and / or layout of the signal patterns 120a, ground patterns 120b, signal pads 130a, and ground pads 130b are not limited thereto.

[0039] In addition, the antenna pattern 120 further includes: at least one fixing pad 130c. The fixing pad 130c is formed at least on the side surface 113 (and the second main surface 112) and is used to fix the antenna device 100 to the printed circuit board main board 300. Specifically, in the case of Figures 1 to 4 In the exemplary embodiment shown, one fixing pad 130c is located on the side surface 113 and one fixing pad 130c is located on the second main surface 112. Of course, in other embodiments not shown, the number, position and / or layout of the fixing pads 130c are not limited thereto.

[0040] See also Figures 5 and 6 According to an exemplary embodiment of the present invention, an antenna assembly 1000 is further provided. The antenna assembly 1000 includes: the antenna assembly 100 as described in any of the aforementioned embodiments; and a bracket 200. The bracket 200 is coupled to the antenna assembly 100 to support the antenna assembly 100, so that the antenna assembly 100 can be automatically assembled to the printed circuit board 300 in a vertical installation mode in which the antenna assembly 100 is placed vertically relative to the printed circuit board 300.

[0041] According to an embodiment of the present invention, the bracket 220 includes at least one positioning pin 210. The positioning pin 210 is used to cooperate with a positioning hole 310 formed on the printed circuit board main board 300 to position the bracket 200 and the antenna device 100 on the printed circuit board main board 300. Figures 5 and 6 In the exemplary embodiment shown, legs are formed on both sides of the bottom of the bracket 220, and each leg is formed with the aforementioned positioning pin 210. The provision of legs and positioning pins 210 on the bottom of the bracket 220 ensures that the antenna device 100 will not tip over or be mispositioned during vertical mounting on the printed circuit board main board 300.

[0042] According to an embodiment of the present invention, the support 220 includes a pick-up platform 220. Figure 5 and Figure 6As shown, the pick-up platform 220 is formed on the top of the bracket 330. The pick-up platform 220 has a pick-up area of ​​at least about 5 mm x 5 mm to facilitate the pick-up action of the pick-up nozzle on the production line. The pick-up platform 220 can be made of a temperature-resistant material that can withstand at least about 260 degrees Celsius.

[0043] According to an embodiment of the present invention, the bracket 200 is detachably or integrally coupled to the antenna device 100. Figures 5 and 6 In the exemplary embodiment shown, the bracket 200 is detachably coupled to the antenna device 100 via a hook structure 230. In other embodiments not shown, the bracket 200 may also be detachably coupled to the antenna device 100 via other suitable detachable structures.

[0044] The antenna devices and antenna device assemblies provided by the aforementioned exemplary embodiments of the present invention enable selective implementation of automated surface mounting technology for either a horizontal or vertical antenna device installation on a production line. This provides flexibility in the use of the antenna device, optimizes its performance, and reduces automated assembly costs on the production line. Furthermore, for example, when the antenna device according to the present invention is arranged in a vertical installation mode, the solder pads formed on the side surfaces can reduce the number of solder pads required on the main surface of the printed circuit board. Furthermore, the vertical installation mode of the antenna device is more conducive to automated manufacturing.

[0045] Those skilled in the art will appreciate that the embodiments described above are exemplary and that they may be improved upon. The structures described in the various embodiments may be freely combined without causing any conflict in structure or principle.

[0046] Although the present invention has been described in conjunction with the accompanying drawings, the embodiments disclosed in the drawings are intended to exemplify the preferred embodiments of the present invention and should not be construed as limiting the present invention.

[0047] Although some embodiments of the present general inventive concept have been shown and described, it will be appreciated by those skilled in the art that changes may be made to these embodiments without departing from the principles and spirit of the present general inventive concept, the scope of which is defined in the claims and their equivalents.

[0048] It should be noted that the word "comprising" does not exclude other elements or steps, and the word "a" or "an" does not exclude a plurality. In addition, any element reference in the claims should not be construed as limiting the scope of the invention.

Claims

1. An antenna device (100), comprising: A substrate (110), the substrate (110) comprising a first main surface (111), a second main surface (112) opposite to the first main surface (111), and at least one side surface (113) connecting the first main surface (111) and the second main surface (112); an antenna pattern (120) formed on at least one of the first main surface (111) and the second main surface (112); and An antenna pad (130) extends from the antenna pattern (120) and is formed at least on the side surface (113), and is used for soldering the antenna device (100) to a printed circuit board mainboard (300).

2. The antenna device (100) according to claim 1, wherein The antenna pad (130) further comprises: a first soldering pad portion (131) formed on the side surface (113) for soldering the antenna device (100) to the printed circuit board main board (300) in a vertical mounting mode in which the antenna device (100) is vertically positioned relative to the printed circuit board main board (300); and A second solder pad portion (132) is formed on the first main surface (111) or the second main surface (112) and is used for soldering the antenna device (100) to the printed circuit board main board (300) in a horizontal mounting mode in which the antenna device (100) is horizontally placed relative to the printed circuit board main board (300).

3. The antenna device (100) according to claim 2, wherein The first pad portion (131) extends from the antenna pattern (120), and the second pad portion (132) extends from the first pad portion (131) or the antenna pattern (120).

4. The antenna device (100) according to claim 3, wherein Grooves are formed on both sides of the first pad portion (131).

5. The antenna device (100) according to claim 1, wherein The antenna pattern (120) further includes at least one signal pattern (120a) and at least one ground pattern (120b) separated from each other; The antenna pad (130) further includes at least one signal pad (130a) and at least one ground pad (130b) separated from each other; The at least one signal pad (130a) extends from the at least one signal pattern (120a), and the at least one ground pad (130b) extends from the at least one ground pattern (120b).

6. The antenna device (100) according to claim 5, further comprising: At least one fixing pad (130c) is formed at least on the side surface (113) and is used to fix the antenna device (100) to a printed circuit board mainboard (300).

7. The antenna device (100) according to claim 1, wherein The antenna device (100) is suitable for being mounted on a printed circuit board mainboard (300) by surface mounting technology.

8. An antenna device assembly (1000), comprising: The antenna device (100) according to any one of claims 1 to 7; and A bracket (200) is coupled to the antenna device (100) and is used to carry the antenna device (100) so that the antenna device (100) can be automatically assembled to the printed circuit board mainboard (300) in a vertical installation mode in which the antenna device (100) is placed vertically relative to the printed circuit board mainboard (300).

9. The antenna device assembly (1000) of claim 8, wherein: The support (220) comprises: At least one positioning pin (210) is provided, wherein the at least one positioning pin (210) is used to cooperate with a positioning hole (310) formed on a printed circuit board mainboard (300) to position the bracket (200) and the antenna device (100) on the printed circuit board mainboard (300).

10. The antenna device assembly (1000) of claim 8, wherein: The support (200) comprises: A pick-up platform (220) having a pick-up area of ​​at least 5 mm x 5 mm.

11. The antenna device assembly (1000) of claim 10, wherein: The picking platform (220) is made of a temperature-resistant material capable of withstanding at least 260 degrees Celsius.

12. The antenna device assembly (1000) of claim 8, wherein: The bracket (200) is detachably or integrally coupled to the antenna device (100).

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