Circuit board, grounding structure and interactive equipment

Abstract

The invention discloses a circuit board, a grounding structure and interactive equipment. The circuit board is applied to the interactive equipment with the grounding structure. The grounding structure is provided with a clamping groove used for installing a circuit board. The circuit board comprises a base layer and a first GND network layer, the base layer comprises a main body part and two plugging parts located on the two opposite sides of the main body part in the first direction, the first GND network layer extends in the second direction forming an included angle with the first direction, at least one plugging part is provided with the first GND network layer, and the circuit board is matched with the clamping groove in a plugging mode. And the first GND network layer is in conductive contact with the groove wall of the clamping groove so as to be grounded. By means of the design, the stability of the circuit board installed in the clamping groove can be achieved, the grounding path of the circuit board can be shortened, impedance between a GND network in the circuit board and the ground of the whole machine is reduced, and stable transmission of analog signals in the circuit board is guaranteed.

Description

Technical Field

[0001] The present application relates to the technical field of circuit board grounding, and in particular to a circuit board, a grounding structure, and an interactive device. Background Art

[0002] Circuit boards are one of the most important components of electronic products. Circuit boards are usually assembled using screws, clips, and slots.

[0003] In the related art, when the circuit board is fixed and limited by the slot assembly method, it is only connected by the wires in the connector of the circuit board and the ground of the whole machine. The long grounding path and small grounding area of ​​the circuit board can easily cause the impedance between the GND network in the circuit board and the ground of the whole machine to increase seriously, thereby interfering with the analog signal in the circuit board and ultimately affecting the normal operation of the circuit board. Summary of the Invention

[0004] The embodiments of the present application provide a circuit board, a grounding structure, and an interactive device, which can solve the problem that the impedance between the GND network in the circuit board and the ground of the entire machine increases due to the long grounding path of the circuit board, causing interference to the analog signal in the circuit board, and ultimately leading to communication abnormalities.

[0005] In a first aspect, an embodiment of the present application provides a circuit board;

[0006] The circuit board is applied to an interactive device with a grounding structure, and the grounding structure is provided with a card slot for installing the circuit board; the circuit board includes a base layer and a first GND network layer, the base layer includes a main body and two plug-in parts located on opposite sides of the main body in a first direction, the first GND network layer is extended along a second direction at an angle to the first direction, and at least one plug-in part is provided with the first GND network layer; wherein, the circuit board is plugged into and matched with the card slot, and the first GND network layer is in conductive contact with the slot wall of the card slot for grounding.

[0007] In some embodiments of the present application, there are two first GND network layers, and both plug-in parts are provided with the first GND network layer. Due to the provision of two first GND network layers, the grounding area of ​​the circuit board is increased.

[0008] In some embodiments of the present application, a gap exists between the edge of the first GND network layer and the edge of the plug-in portion along the first direction. By setting this gap, when cutting multiple spliced ​​circuit boards, it is possible to avoid cutting the network layer and generating burrs.

[0009] In some embodiments of the present application, the circuit board further includes a conductive protective layer, which is attached to the surface of the first GND network layer. By providing the conductive protective layer, oxidation of the first GND network layer can be prevented.

[0010] In some embodiments of the present application, the circuit board includes at least one conductive block, the first GND network layer is a copper clad layer, and in the second direction, the copper clad layer includes a first part and a second part, an insulating layer is attached to the surface of the first part, the conductive block protrudes from the second part and is electrically connected to the copper clad layer, and the conductive block is conductively connected to the slot wall of the card slot.

[0011] In some embodiments of the present application, the second portion is provided with a window, and the conductive block is disposed in the window. The location of the window allows for a reflow soldering process. Solder has electrical properties that allow the first GND network layer to be electrically connected to the slot wall through the solder, thereby ensuring stable installation of the circuit board in the slot.

[0012] In some embodiments of the present application, there are multiple windows, and the spacing between each window in the second direction is less than 1 cm. By providing multiple conductive blocks in the multiple windows, the first GND network layer and the card slot are connected at multiple points, thereby enabling low-impedance communication between the circuit board's GND network and the entire device ground, ensuring stable transmission of analog signals on the circuit board.

[0013] In some embodiments of the present application, the circuit board includes an insulating layer, wherein the insulating layer is attached to a surface of the first GND network layer;

[0014] The slot wall of the card slot is provided with a conductive piercing body capable of cutting through the insulating layer, so that the first GND network layer is conductively connected to the slot wall of the card slot.

[0015] In a second aspect, an embodiment of the present application provides a grounding structure; the grounding structure includes a device frame and a circuit board, the device frame has a card slot, and the circuit board is inserted into the card slot.

[0016] In a third aspect, an embodiment of the present application provides an interactive device; the interactive device includes a grounding structure.

[0017] Based on the circuit board in the embodiment of the present application, by setting the circuit board and the card slot to be plugged in, the first GND network layer can be in conductive contact with the slot wall of the card slot. On the one hand, the relative fixation of the position between the circuit board and the card slot can be achieved, thereby improving the stability of the circuit board fixed in the card slot; on the other hand, the impedance between the GND network in the circuit board and the ground of the entire machine can be reduced, ensuring the stable transmission of the analog signal in the circuit board. At the same time, the short grounding path reduces interference signals and improves the noise resistance of the circuit. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] In order to more clearly illustrate the embodiments of the present application or the technical solutions in the prior art, the following briefly introduces the drawings required for use in the embodiments or the description of the prior art. Obviously, the drawings described below are only some embodiments of the present application. For those skilled in the art, other drawings can be obtained based on these drawings without paying any creative work.

[0019] Figure 1 This is a schematic diagram of a top view of a circuit board in one embodiment of the present application;

[0020] Figure 2 This is a schematic diagram of a top view of a circuit board in another embodiment of the present application;

[0021] Figure 3 This is a schematic cross-sectional view of a circuit board in another embodiment of the present application;

[0022] Figure 4 This is a schematic cross-sectional view of a card slot in a device frame in one embodiment of the present application;

[0023] Figure 5 This is a schematic cross-sectional structure diagram of a card slot in a device frame in another embodiment of the present application.

[0024] Figure numerals: 1, circuit board; 10, base layer; 11, main body; 12, plug-in part; 20, first GND network layer; 21, copper cladding layer; 30, conductive block; 30a, window; 40, insulating layer; 50, electronic component; 60, conductive piercing body; 7, equipment frame; 71, card slot; 71a, slot wall. DETAILED DESCRIPTION

[0025] In order to make the purpose, technical solutions and advantages of this application more clearly understood, the present application is further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain this application and are not intended to limit this application.

[0026] In the related art, when the circuit board is fixed and limited by the slot assembly method, it is only connected by the wires in the connector of the circuit board and the ground of the whole machine. The long grounding path and small grounding area of ​​the circuit board can easily cause the impedance between the GND network in the circuit board and the ground of the whole machine to increase seriously, thereby interfering with the analog signal in the circuit board and ultimately affecting the normal operation of the circuit board.

[0027] The embodiment of the present application sets a first GND network layer on the plug-in part on the end side of the circuit board, so that when the circuit board is plugged into the card slot of the interactive device, the first GND network layer is conductively connected to the slot wall, thereby reducing the impedance between the GND network of the circuit board and the ground of the entire machine, thereby ensuring the stable transmission of analog signals in the circuit board.

[0028] like Figure 1 As shown, a circuit board 1 proposed in the first aspect of the present application, the first GND network layer 20 of the circuit board 1 can be conductively connected to the card slot 71, so that the ground impedance of the circuit board 1 is reduced, thereby shortening the noise return path to avoid interference with the analog signal in the circuit board 1.

[0029] The circuit board 1 is applied to an electronic device (not shown) having a grounding structure (not shown in the figure). The grounding structure is provided with a slot 71 for mounting the circuit board 1. The circuit board 1 includes a base layer 10 and a first GND network layer 20. The base layer 10 includes a main body 11 and two plug-in portions 12 located on opposite sides of the main body 11 in a first direction. The first GND network layer 20 extends along a second direction at an angle to the first direction, and at least one plug-in portion 12 is provided with the first GND network layer 20. The circuit board 1 and the slot 71 are plugged and mated in the second direction, and the first GND network layer 20 is in conductive contact with the slot wall 71a of the slot 71 for grounding. The slot 71 has a depth in the first direction and a length in the second direction. The length of the slot can be adapted to the length of the circuit board.

[0030] The following combination Figure 1-Figure 5 The specific structure of the circuit board 1 is introduced in detail.

[0031] The circuit board 1 is applied to electronic equipment with a grounding structure. The structure of the circuit board 1 is understood to be a structure that can, but is not limited to, integrate electronic components 50 such as resistors, capacitors, inductors, and the like with a substrate, and is widely used in electronic interactive devices. Such electronic interactive devices include smart blackboards, all-in-one conference machines, and all-in-one educational machines. Here, there is no limitation on the specific form of expression and application scenario of the circuit board 1, and designers can make reasonable designs based on actual needs. For example, the circuit board 1 can be a flexible printed circuit 1 (FPC), a rigid printed circuit board 1 (PCB), or a rigid-flexible combined circuit board 1 (FPCB); for example, the circuit board 1 can be, but is not limited to, a microphone board, a camera board, or a button board.

[0032] The grounding structure is provided with a slot 71 for mounting the circuit board 1. Slot 71 is a recessed notch formed in the conductive metal frame 7 of the electronic interactive device (not shown). As will be readily understood, the circuit board 1 is assembled into the slot 71 using a slot mechanism, making it easy and quick to install and stable.

[0033] like Figure 1As shown, the circuit board 1 includes a base layer 10 and a first GND network layer 20 .

[0034] Base layer 10 includes a main portion 11 and two plug-in portions 12 located on opposite sides of main portion 11 in a first direction. Base layer 10, also known as the substrate of circuit board 1, serves as a carrier for electronic components 50, such as resistors, capacitors, or inductors, within the circuit board 1 structure. When circuit board 1 is secured in place using a slot or other means, the first direction here refers to the width of circuit board 1, facilitating installation, as the board itself has a large aspect ratio, even exceeding 10:1.

[0035] It is worth mentioning that conventional circuit boards 1 are divided into single-layer boards and multi-layer boards. Based on this, there can be many specific grounding forms for the circuit board 1, which are not limited here. Designers can reasonably design according to actual needs. For example, the upper and lower sides of the base layer 10 both include a main body 11 and two plug-in parts 12 located on opposite sides of the main body 11 in the first direction, and the surface of the plug-in part 12 on the upper side of the base layer 10 is provided with a first GND network layer 20 that is conductively connected to the card slot 71. In this case, the circuit board 1 is conductively connected to the card slot 71 through the first GND network layer 20 provided on its upper surface; or the surface of the plug-in part 12 on the lower side of the base layer 10 is provided with a first GND network layer 20 that is conductively connected to the card slot 71. In this case, the circuit board 1 is conductively connected to the card slot 71 through the first GND network layer 20 provided on its lower surface; or the surfaces of the plug-in part 12 on both the upper and lower sides of the base layer 10 are provided with a first GND network layer 20 that is conductively connected to the card slot 71. In this case, the circuit board 1 is conductively connected to the card slot 71 through the first GND network layer 20 on its upper and lower surfaces. In this design, the circuit board 1 can achieve conductive connection with the card slot 71 through the first GND network layer 20 set on either the upper surface or the lower surface, or through the first GND network layer 20 set on both the upper surface and the lower surface, further increasing the grounding area of ​​the circuit board 1 to effectively reduce the ground impedance of the circuit board 1.

[0036] The first GND network layer 20 is a key structural component within the circuit board 1, used to connect electronic components 50, conductive wires, and external devices. Introducing multiple first GND network layers 20 in the system not only simplifies system wiring and addresses signal crosstalk caused by ground impedance mismatch, but also allows for smooth current return within the electronic components 50, eliminating interference and ensuring proper circuit operation. The specific implementation of the first GND network layer 20 will be discussed in detail below.

[0037] The first GND network layer 20 extends along a second direction at an angle to the first direction. It should be noted that the first GND network layer 20 extends along the second direction, meaning that the second direction includes at least a first component perpendicular to the first direction. This second direction can be the length of the circuit board 1. This design increases the grounding area of ​​the circuit board 1.

[0038] The circuit board 1 is plugged into the card slot 71, and the first GND network layer 20 is in conductive contact with the slot wall 71a of the card slot 71 for grounding. It can be understood that the circuit board 1 is installed in the card slot 71 by plugging the first GND network layer 20. When the circuit board 1 is in operation, the first GND network layer 20 is in conductive contact with the slot wall 71a of the card slot 71 to reduce the ground impedance of the circuit board 1. It should be noted that the conductive contact between the first GND network layer 20 and the slot wall 71a of the card slot 71 actually means that the first GND network layer 20 has a copper clad layer 21, and the circuit board 1 is conductively grounded to the slot wall 71a of the card slot 71 through the copper clad layer 21.

[0039] Based on the circuit board 1 in the embodiment of the present application, by setting the circuit board 1 and the card slot 71 to be plugged together, the first GND network layer 20 can be in conductive contact with the slot wall 71a of the card slot 71. On the one hand, the relative fixation of the position between the circuit board 1 and the card slot 71 can be achieved, thereby improving the stability of the circuit board 1 fixed in the card slot 71; on the other hand, the impedance between the GND network in the circuit board 1 and the ground of the entire machine can be reduced, ensuring the stable transmission of the analog signal in the circuit board 1. At the same time, the short grounding path reduces interference signals and improves the noise resistance of the circuit.

[0040] Furthermore, at least one of the plug-in portions 12 is provided with a first GND network layer 20. Considering that the first GND network layer 20 provided on the two plug-in portions 12 can have many specific forms, the specific connection methods of the first GND network layer 20 with different forms and the card slot 71 are also different. The specific forms of the first GND network layer 20 can include, but are not limited to, the following embodiments.

[0041] like Figure 1 As shown, in some embodiments, there are two first GND network layers 20, and both plug-in parts 12 are provided with a first GND network layer 20. In this design, by providing the first GND network layer 20 on both plug-in parts 12, the two first GND network layers 20 are in direct conductive contact with the slot wall 71a of the card slot 71, thereby increasing the grounding area of ​​the circuit board 1.

[0042] Of course, in some other embodiments, there is only one first GND network layer 20 (not shown in the figure), and one of the two plug-in parts 12 is provided with the first GND network layer 20. In this design, by providing the first GND network layer 20 in a single plug-in part 12, and then conductively contacting the first GND network layer 20 with the slot wall 71a of the card slot 71 to achieve grounding, the grounding impedance of the circuit board 1 is reduced, thereby effectively ensuring the normal operation of the circuit board 1.

[0043] It is worth mentioning that in the above two embodiments, the first GND network layer 20 and the card slot 71 are directly conductively connected, and the connection form between the first GND network layer 20 and the card slot 71 is more suitable for surface contact to maximize the grounding area of ​​the circuit board 1.

[0044] like Figures 2 to 4 As shown, in some embodiments, along the first direction, there is a gap between the edge of the first GND network layer 20 and the edge of the plug-in portion 12. It should be noted that there are various design forms when preparing the circuit board 1. For example, the conductor layer (i.e., the first GND network layer 20) of the conventional circuit board 1 can be retracted by a preset distance of A mm along the first direction (the preset retraction distance is not limited here, for example, A mm can be, but is not limited to, 0.3 mm, and the designer can reasonably design it according to actual needs), and then a portion of the conductive layer (such as copper foil) is exposed at the inner edge. The left and right portions of the circuit board 1 along the second direction (i.e., the left and right sides of the first GND network layer 20) are covered with insulating materials such as insulating ink. At this time, there is a gap between the edge of the first GND network layer 20 and the edge of the plug-in portion 12. Here, the depth of the interface slot 71 in the first direction needs to be greater than A mm to ensure that the first GND network layer 20 at the edge of the circuit board 1 and the slot wall 71a of the slot 71 are in conductive contact. In this design, by designing the first GND network layer 20 of the circuit board 1 to be retracted by a preset distance, while ensuring that the first GND network layer 20 can be conductively connected to the slot wall 71a of the card slot 71, when cutting multiple spliced ​​circuit boards 1, it is possible to avoid cutting the above-mentioned copper foil to produce burrs that affect the use of the circuit board 1.

[0045] It's worth noting that other design options exist for preparing the circuit board 1 of this design solution. For example, the left and right portions of the circuit board 1 along the second direction, where they contact the card slot 71 of the entire frame, are not covered with insulating material, leaving the copper foil at the edge of the first GND network layer 20 exposed. This allows the circuit board 1 to be trimmed and then polished to avoid burrs. This design can meet the practical need for conductive contact between the circuit board 1 and the card slot 71, thereby reducing the ground impedance of the circuit board 1.

[0046] Considering that the copper foil of the first GND network layer 20 is usually oxidized by the external environment when exposed to the external environment, thereby causing adverse effects on the grounding of the circuit board 1, such as Figure 1-2 As shown, in some embodiments, the circuit board 1 further includes a conductive protective layer (not shown in the figure), which is attached to the surface of the first GND network layer 20. The conductive protective layer can further cover the copper clad layer 21 of the first GND network layer 20 to prevent copper oxidation. The specific implementation method of the conductive protection is not limited here; for example, the first GND network layer 20 can be protected by conventional gold plating, tin plating, etc. In this design, the conductive protective layer is reasonably designed to be attached to the surface of the first GND network layer 20, thereby blocking direct contact between the atmosphere and the conductive copper foil to protect the conductive copper foil from oxidation damage. Moreover, since materials such as tin and gold have electrical properties, the electrical properties of the above-mentioned grounding layers will not be affected.

[0047] Furthermore, it is considered that the first GND network layer 20 and the card slot 71 can be stably connected using the above-mentioned surface contact method, or can also use point contact, line contact, or other contact methods. Based on this, the specific form of the card slot 71 is also different for the first GND network layer 20 with different settings. The specific setting method of the first GND network layer 20 can be, but is not limited to, the following embodiments.

[0048] like Figures 2 to 4 As shown, in a first embodiment, the circuit board 1 includes at least one conductive block 30. The first GND network layer 20 is a copper clad layer 21. In the second direction, the copper clad layer 21 includes a first portion and a second portion. The surface of the first portion is attached with an insulating layer 40. The conductive block 30 protrudes from the second portion and is electrically connected to the copper clad layer 21. The conductive block 30 is also electrically connected to the slot wall 71a of the slot 71. The surface of the second portion can be attached with an insulating layer 40, with the conductive block 30 electrically connected to the copper clad layer 21 and protruding from the insulating layer 40 of the second portion. Alternatively, the surface of the second portion can be free of an insulating layer 40, with the conductive block 30 protruding directly from the second portion. It is understood that the copper clad layer 21 includes a first portion with the insulating layer 40 attached to its surface, and a second portion with the conductive block 30 disposed thereon. The conductive block 30 is electrically connected to the copper clad layer 21 and the slot wall 71a of the slot 71, respectively, thereby indirectly achieving an electrically conductive connection between the first GND network layer 20 of the circuit board 1 and the slot wall 71a of the slot 71. In this design, by dividing the copper clad layer 21 into an insulating area and a conductive area, the circuit board 1 can be conductively connected to the card slot 71 through the conductive block 30 in the conductive area.

[0049] It should be noted that there is no limitation on the specific number of conductive blocks 30, and designers can design it reasonably according to actual needs; for example, the number of conductive blocks 30 can be set to one or more. In this design, the circuit board 1 realizes electrical connection between the conductive blocks 30 and the card slots 71 through multi-point contact between the two. Based on the height of the conductive blocks 30, other positions of the copper cladding layer 21 (positions without conductive blocks 30) can be covered with, but not limited to, conventional insulating ink to avoid short circuits between signals or short circuits with other metal parts, which may cause abnormalities.

[0050] Furthermore, based on the conductive connection between the circuit board 1 and the card slot 71, in order to stably install the circuit board 1 in the card slot 71, as shown in FIG. Figure 2-4 As shown, in one embodiment, the second portion is provided with a window 30a, and the conductive block 30 is provided at the window 30a. The window 30a refers to an opening on the insulating layer 40 of the circuit board 1 (that is, the solder resist area of ​​the circuit board 1) so that reflow soldering can be performed at the position of the opening to connect the first GND network layer 20 to the slot wall 71a of the slot 71 through solder. The conductive block 30 is also the solder here. In this design, by adopting the reflow soldering process at the position of the window 30a, the solder has electrical properties, so that the first GND network layer 20 is conductively connected to the slot wall 71a of the slot 71 through the solder, thereby achieving stable installation of the circuit board 1 in the slot 71.

[0051] It is worth mentioning that, in order to ensure that the circuit board 1 is stably installed in the card slot 71, in another embodiment, the first GND network layer 20 is connected to the location of the copper clad layer 21 with a conductive double-sided tape (not shown in the figure), and the conductive double-sided tape is mixed with a metal substance, so that the circuit board 1 can be bonded to the slot wall 71a of the card slot 71 through the conductive double-sided tape. This design, on the one hand, ensures the stability of the connection between the circuit board 1 and the card slot 71, preventing the occurrence of poor grounding due to loose connection; on the other hand, the conductive double-sided tape is mixed with a metal substance, so that the conductive double-sided tape has a thermal conductivity function in addition to the electrical conductivity, thereby improving the heat dissipation efficiency of the circuit board 1 during operation.

[0052] like Figure 2-4As shown, in some embodiments, there are multiple windows 30a, and in the second direction, the spacing between at least two adjacent windows 30a among all the windows 30a is less than or equal to 10 cm. There is no requirement for the number or specific form of the windows 30a, and designers can reasonably design according to actual needs; for example, the windows 30a can be, but are not limited to, rectangular or circular. It should be noted that due to design requirements and specifications, the spacing between at least two adjacent windows 30a among all the windows 30a must be less than or equal to 10 cm, that is, the spacing between two adjacent windows 30a among all the windows 30a must be less than or equal to 10 cm, and there is no requirement for the spacing between the remaining adjacent windows 30a. In this design, by arranging multiple conductive blocks 30 in multiple windows 30a, multi-point connection is achieved between the first GND network layer 20 and the card slot 71, thereby enabling the GND network of the circuit board 1 to be connected to the whole machine ground with low impedance, so as to ensure stable transmission of analog signals in the circuit board 1.

[0053] In the second embodiment, Figure 5 As shown, the circuit board 1 includes an insulating layer 40, which is attached to the surface of the first GND network layer 20; the slot wall 71a of the card slot 71 has a conductive piercing body 60 that can cut through the insulating layer 40, so that the first GND network layer 20 is conductively connected to the slot wall 71a of the card slot 71. There is no requirement for the specific form of the conductive piercing body 60 here, and designers can reasonably design it according to actual needs; for example, the conductive piercing body 60 can be, but is not limited to, a conical or prism shape. It is understandable that the surface of the first GND network layer 20 is attached with an insulating layer 40 such as insulating ink. During the plug-in process of the circuit board 1, the conductive piercing body 60 cuts through the insulating layer 40 to expose the first GND network layer 20, so that the first GND network layer 20 is indirectly conductively connected to the card slot 71 through the conductive piercing body 60. In this design, a conductive piercing body 60 is provided on the slot wall 71a of the card slot 71. During the insertion process of the circuit board 1, the insulating layer 40 is scratched to expose a linear portion of the first GND network layer 20, thereby achieving conductive connection between the first GND network layer 20 and the slot wall 71a of the card slot 71 through the conductive piercing body 60, thereby reducing the grounding impedance of the circuit board 1.

[0054] The second aspect of the present application proposes a grounding structure (not shown in the figure), including a device frame 7 and a circuit board 1. The device frame 7 has a card slot 71, and the circuit board 1 is inserted into the card slot 71. It can be understood that the device frame 7 has an accommodating space, and the card slot 71 is formed by a recessed wall of the accommodating space. The circuit board 1 is placed in the accommodating space and connected to the card slot 71. In this design, with the grounding structure of the above-mentioned circuit board 1, the device frame 7 and the circuit board 1 are in conductive contact, which increases the grounding points of the circuit board 1, thereby enhancing the anti-interference performance of the circuit board 1 during operation.

[0055] The third aspect of the present application provides an interactive device (not shown in the figure), which includes a grounding structure. In this design, the interactive device with the above-mentioned grounding structure has good anti-interference performance when the circuit board 1 is in operation, so that the interactive device as a whole has a good interactive effect.

[0056] The same or similar numbers in the drawings of this embodiment correspond to the same or similar parts; in the description of this application, it should be understood that if the terms "upper", "lower", "left", "right", etc. indicate an orientation or position relationship, they are based on the orientation or position relationship shown in the drawings. This is only for the convenience of describing this application and simplifying the description, and does not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operate in a specific orientation. Therefore, the terms describing the position relationship in the drawings are only used for illustrative purposes and cannot be understood as a limitation on this patent. For ordinary technicians in this field, the specific meanings of the above terms can be understood according to specific circumstances.

[0057] The above description is only a preferred embodiment of the present application and is not intended to limit the present application. Any modifications, equivalent replacements and improvements made within the spirit and principles of the present application should be included in the scope of protection of the present application.

Claims

1. A circuit board, characterized in that: Applicable to an interactive device having a grounding structure, wherein the grounding structure is provided with a slot for mounting the circuit board; The circuit board (1) comprises: A base layer (10) comprises a main body portion (11) and two plug-in portions (12) located on opposite sides of the main body portion (11) in a first direction; a first GND network layer (20), the first GND network layer (20) extending along a second direction forming an angle with the first direction, and at least one of the plug-in parts (12) being provided with the first GND network layer (20); The circuit board (1) is plugged into the card slot (71), and the first GND network layer (20) is in conductive contact with a slot wall (71a) of the card slot (71) for grounding.

2. The circuit board according to claim 1, wherein: There are two first GND network layers (20), and both of the two plug-in parts (12) are provided with the first GND network layer (20).

3. The circuit board according to claim 1, wherein: Along the first direction, there is a gap between the edge of the first GND network layer (20) and the edge of the plug-in portion (12).

4. The circuit board according to claim 1, wherein: The circuit board (1) further comprises a conductive protective layer, wherein the conductive protective layer is attached to the surface of the first GND network layer (20).

5. The circuit board according to claim 1, wherein: The circuit board (1) comprises at least one conductive block (30), the first GND network layer (20) is a copper clad layer (21), in the second direction, the copper clad layer (21) comprises a first portion and a second portion, an insulating layer (40) is attached to the surface of the first portion, the conductive block (30) is protruding from the second portion and electrically connected to the copper clad layer (21), and the conductive block (30) is electrically connected to a slot wall (71a) of the slot (71).

6. The circuit board according to claim 5, wherein: The second portion is provided with a window (30a), and the conductive block (30) is arranged in the window (30a).

7. The circuit board according to claim 6, wherein: There are a plurality of windows (30a), and in the second direction, among all the windows (30a), a distance between at least two adjacent windows (30a) is less than or equal to 10 centimeters.

8. The circuit board according to claim 1, wherein: The circuit board (1) comprises an insulating layer (40), wherein the insulating layer (40) is attached to the surface of the first GND network layer (20); The slot wall (71a) of the card slot (71) is provided with a conductive piercing body (60) capable of cutting through the insulating layer (40), so that the first GND network layer (20) is conductively connected to the slot wall (71a) of the card slot (71).

9. A grounding structure, characterized in that: include: A device frame (7) having a card slot (71); and The circuit board (1) according to any one of claims 1 to 8, wherein the circuit board (1) is inserted into the card slot (71).

10. An interactive device, characterized in that: Comprising the grounding structure as claimed in claim 9.

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