Fine circuit repairing method and system based on liquid flow self-assembly positioning and circuit board

Abstract

The invention discloses a fine circuit repairing method and system based on liquid flow self-assembly positioning and a circuit board. The fine circuit repairing method comprises the following steps: determining an open circuit defect position to be repaired in a metal circuit of a circuit board; cleaning and processing the area where the open-circuit defect position is located in the circuit board to enable the open-circuit defect position to form a groove structure; cutting a plurality of metal short wires from the metal wire, wherein the size of the metal short wires is matched with the inner diameter of the groove structure; dispersing the metal short wires in the copper electroplating hole-filling liquid medicine, and stirring to form eddy current; placing the cleaned and processed circuit board in eddy current, and keeping stirring until the metal stub is filled in the groove structure; and reinforcing the original metal circuit and the metal short line, filling a gap between the original metal circuit and the metal short line, and completing the repair of the circuit board. According to the scheme, the repair process of the fine line can be simplified, the repair quality can be ensured, the defect positioning is accurate, and the problems of high operation difficulty and high cost in the fine line repair technology can be solved.

Description

Technical Field

[0001] The present invention relates to the field of circuit boards, and in particular to a fine circuit repair method, system and circuit board based on liquid flow self-assembly positioning. Background Art

[0002] Printed circuit boards (PCBs) support electronic components and act as electrical connections. When used in electronic devices, PCBs ensure consistency across similar boards, reducing errors associated with manual wiring. They also enable automated insertion or placement, soldering, and testing of electronic components, ensuring the quality of electronic equipment, improving productivity, reducing costs, and facilitating repair. With advances in electronic circuit technology, circuits are becoming increasingly dense, precise, and sophisticated. These increasingly sophisticated circuits present a greater challenge in repair, making conventional manual labor and machine repairs difficult to meet.

[0003] At present, the existing fine circuit repair technology has high operational difficulty. On the one hand, the excess copper paste is not easy to remove, and the unsintered copper paste has a sticky property, which easily leaves tiny particles during the removal process, forming potential short-circuit points; on the other hand, the copper paste is difficult to position, mainly because the repair area of ​​high-density circuits is usually at the micron level, and traditional mechanical positioning methods cannot achieve precise coating, and the copper paste is prone to offset or covering adjacent circuits; at the same time, the existing fine circuit repair technology also has the problems of complex sintering process and poor performance. Summary of the Invention

[0004] The purpose of the present invention is to propose a fine circuit repair method based on liquid flow self-assembly positioning, which can simplify the fine circuit repair process, ensure the repair quality, and has the advantage of accurate defect positioning.

[0005] The present invention also proposes a fine line repair method based on liquid flow self-assembly positioning, which includes: a detection and positioning device, a line cleaning device, a cutting device, an eddy current container, a stirring device and a line reinforcement device.

[0006] The present invention also provides a circuit board, which is repaired by the above-mentioned fine circuit repair method based on liquid flow self-assembly positioning.

[0007] To achieve this object, the present invention adopts the following technical solutions:

[0008] A fine line repair method based on liquid flow self-assembly positioning includes the following steps:

[0009] (1) Determine the location of the open circuit defect to be repaired in the metal circuit of the circuit board;

[0010] (2) Cleaning and processing the area where the open circuit defect is located in the circuit board to form a groove structure at the open circuit defect location;

[0011] (3) cutting a plurality of metal short wires from the metal wire, wherein the size of the metal short wires matches the inner diameter of the groove structure;

[0012] (4) Dispersing the metal short wires in the copper electroplating hole filling solution and stirring to form a vortex;

[0013] (5) placing the circuit board cleaned and processed in step (2) in the vortex formed in step (4), and fixing the circuit board in a relative position in the vortex, and maintaining stirring until the metal short wires are filled in the groove structure;

[0014] (6) The original metal circuit and the metal short wire are reinforced and the gap between them is filled, and the circuit board is repaired.

[0015] Optimally, in step (2), part of the groove structure is processed into a groove body of a specific size;

[0016] In the step (3), some of the metal short wires are cut into specific sizes, and each size of the metal short wire corresponds to a groove structure of one or more sizes.

[0017] Optimally, in step (2), part of the groove structure is processed into a groove body of a specific groove type;

[0018] In the step (3), some of the metal short wires are cut into specific shapes, and each shape of the metal short wire corresponds to a groove structure of a groove type.

[0019] Optimally, in step (3), the amount of metal short wires added is 10-200 wires / mL.

[0020] Optimally, in step (6), the circuit board is placed in an electrolyte, energized, and electroplated to fill the gap between the original metal circuit and the metal short line, thereby completing the repair of the circuit board.

[0021] Optimally, in step (6), the original metal circuit and the metal short wire are reinforced and the gap therebetween is filled by at least one of laser sintering, nano-copper hot pressing and arc pulse welding.

[0022] Optimally, in step (3), the material of the metal short wire is at least one of copper, silver and gold, or an alloy of at least two of copper, silver and gold.

[0023] Optimally, in step (3), the size of the metal short wire is smaller than that of the groove structure, and the size difference between the two is 1-10 μm; the size of the metal short wire is 5-1000 μm.

[0024] A circuit board is modified by the above-mentioned fine circuit repair method based on liquid flow self-assembly positioning.

[0025] A fine line repair system based on liquid flow self-assembly positioning, comprising: a detection and positioning device, a line cleaning device, a cutting device, an eddy current container, a stirring device and a line reinforcement device;

[0026] The detection and positioning device is used to determine the position of the open circuit defect to be repaired in the metal circuit of the circuit board;

[0027] The circuit cleaning device is used to clean the area where the open circuit defect is located in the circuit board, so that a groove structure is formed at the open circuit defect location;

[0028] The cutting device is used to cut a plurality of metal short wires from the metal wire, and the size of the metal short wires matches the inner diameter of the groove structure;

[0029] The eddy current container is used to be filled with copper electroplating hole filling solution and to receive metal short wires;

[0030] The stirring device is installed in the vortex container and is used to form a vortex in the vortex container, so that the cleaned circuit board moves relative to the metal short wire in the vortex until the groove structure is filled with the metal short wire;

[0031] The circuit reinforcement device is used to reinforce the original metal circuit and the metal short wire and fill the gap between them.

[0032] Compared with the prior art, one of the above technical solutions has the following beneficial effects:

[0033] This solution provides a fine line repair method based on liquid flow self-assembly positioning, which can simplify the fine line repair process and ensure the repair quality. It has the advantage of accurate defect positioning and can solve the problems of high difficulty and high cost in fine line repair technology. BRIEF DESCRIPTION OF THE DRAWINGS

[0034] Figure 1 This is a schematic structural diagram of one embodiment of a repair method using electroplating as a reinforcement treatment;

[0035] Figure 2 It is a structural schematic diagram of one embodiment of a repair method using laser sintering, nano-copper hot pressing or arc pulse welding as reinforcement treatment.

[0036] in:

[0037] Circuit board 1, metal circuit 2, metal short wire 3; copper electroplating hole filling solution 4; eddy current 5; reinforcement treatment 6; electrolyte 7; open circuit defect location 21; groove structure 22. DETAILED DESCRIPTION

[0038] The following describes embodiments of the present invention in detail. Examples of the embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals throughout represent the same or similar elements or elements having the same or similar functions. The embodiments described below with reference to the accompanying drawings are exemplary and are intended only to explain the present invention and are not to be construed as limiting the present invention.

[0039] For ease of understanding of the present invention, the present invention will be described more fully below. The present invention can be implemented in many different forms and is not limited to the embodiments described herein. On the contrary, the purpose of providing these embodiments is to make the understanding of the disclosure of the present invention more thorough and comprehensive. Where specific techniques or conditions are not indicated in the embodiments, they are carried out according to the techniques or conditions described in the literature in this area or according to the product specifications. Where the manufacturer of the reagents or instruments is not indicated, they are all conventional products that can be obtained commercially.

[0040] like Figure 1 A fine line repair method based on liquid flow self-assembly positioning comprises the following steps:

[0041] (1) Determine the location of the open circuit defect to be repaired in the metal circuit of the circuit board;

[0042] The metal circuit may be an embedded circuit, a portion of which is located inside the circuit board;

[0043] Confirming the location of the open circuit defect can be achieved through well-known methods, such as visual inspection, or resistance measurement with a multimeter; it can also be achieved through circuit diagram analysis and signal path tracing, or infrared thermal imaging detection; as long as the location of the open circuit defect is determined; in a preferred embodiment, an AOI device uses a machine vision algorithm to identify the defect location; during the automatic detection process, the AOI device automatically scans the metal circuit through a camera, collects images, and compares the tested solder joints with qualified parameters in a database; after image processing, the defects on the metal circuit are detected and the defects are displayed and / or marked.

[0044] (2) Cleaning and processing the area where the open circuit defect is located in the circuit board to form a groove structure at the open circuit defect location;

[0045] After the open circuit defect location is found, the open circuit defect location or its surrounding locations are cleaned and processed. The cleaning is mainly to remove residual impurities, such as some residual metal circuits; the processing is mainly to process a groove structure, which is a groove structure with a certain length and depth.

[0046] (3) cutting a plurality of metal short wires from the metal wire, wherein the size of the metal short wires matches the inner diameter of the groove structure;

[0047] A plurality of short metal wires are cut out of a metal wire, and the size of the short metal wires matches the size of the groove structure of step (2), that is, the outer diameter of the short metal wires can at least be accommodated in the groove structure, and the length of the short metal wires does not exceed the length of the groove structure. A single or multiple short metal wires can be accommodated in the same groove structure; the short metal wires can be completely accommodated in the groove structure, or partially extend out of the groove structure; and since the length of the short metal wires does not exceed the length of the groove structure, a gap is formed between the groove structure and the short metal wires;

[0048] (4) Dispersing the metal short wires in the copper electroplating hole filling solution and stirring to form a vortex;

[0049] After the copper electroplating hole filling solution is applied to the metal short wire, the copper electroplating hole filling solution is stirred in a known manner to form a vortex, which will give the metal short wire a certain fluidity. The copper electroplating hole filling solution is a solution used in known electroplating. Its main salt can be selected as copper sulfate, cyanide copper plating, copper pyrophosphate, copper carbonate, etc., which can ionize divalent copper ions, and a leveling agent, accelerator and inhibitor can be added as needed, accounting for no more than 1% of the total mass. The formula can be adjusted as needed.

[0050] (5) placing the circuit board cleaned and processed in step (2) in the vortex formed in step (4), and fixing the circuit board in a relative position in the vortex, and maintaining stirring until the metal short wires are filled in the groove structure;

[0051] After the circuit board is fixed in the vortex, the metal short wires are fluid; the size of the metal short wires is slightly smaller than the groove structure, for example, the length of the metal short wires is 1 to 10 μm shorter than the length and / or width of the groove structure, so the metal short wires will flow relatively and embed into the groove structure and will not be easily carried out by the liquid; during stirring, the metal short wires will also gather toward the center of the vortex during the stirring process, so the random stirring used in this solution can also make the circuit board and the metal short wires close to each other. The relative position of the fixed circuit board in the vortex can be determined as needed, for example, it can be vertically distributed in the center of the vortex, or horizontally distributed below the vortex. Keep stirring, and you can also control the stirring parameters during the period, for example, by controlling the vortex through stirring rate, angle or position, so that the vortex can more easily send the metal short wires into the groove structure.

[0052] (6) The original metal circuit and the metal short wire are reinforced and the gap between them is filled, and the circuit board is repaired.

[0053] In this step, the original metal circuit and the newly filled metal short line of the groove structure can be reinforced in a known manner, and the gap between the two can be filled to finally obtain a repaired circuit board.

[0054] This solution provides a fine line repair method based on liquid flow self-assembly positioning, which can simplify the fine line repair process and ensure the repair quality. It has the advantage of accurate defect positioning and can solve the problems of high difficulty and high cost in fine line repair technology.

[0055] Optimally, in step (2), part of the groove structure is processed into a groove body of a specific size;

[0056] In the step (3), some of the metal short wires are cut into specific sizes, and each size of the metal short wire corresponds to a groove structure of one or more sizes.

[0057] This solution can process at least one groove structure of a specific length in step (2), and the groove structures are different in size. Each size of metal short wire corresponds to at least one groove structure with an inner diameter, so a metal short wire of a certain size can be directionally filled in one or more specific groove structures; a large-sized groove structure can also be compatible with a small-sized metal short wire; thus, the filling type of the metal short wire in this solution is not single, and the shape and size of both the metal short wire and the groove structure can be designed according to needs. A single groove structure can also be compatible with a smaller-sized metal short wire, and a targeted directional filling design can be performed on the location of a specific defect on the circuit board to complete the filling of multiple specific defects at one time, simplifying the repair process of fine circuits, and ensuring the repair quality, with the advantage of accurate defect positioning. For example, all defects on the same substrate can be cleaned up by circuits to form open circuit defects into specific groove structures of three sizes, and three metal short wires of different sizes are added, and the three metal short wires are matched with the size of one of the groove structures respectively; due to size restrictions, a metal short wire of a specific size can only enter one of the groove structures. For example, all defects on the same substrate can be cleaned up through circuits to form open circuit defects into three specific groove structures of different sizes, and three different sizes of metal short wires can be added. The large-sized groove structure can be filled with the other two small-sized metal short wires.

[0058] Optimally, in step (2), part of the groove structure is processed into a groove body of a specific groove type;

[0059] In the step (3), some of the metal short wires are cut into specific shapes, and each shape of the metal short wire corresponds to a groove structure of a groove type.

[0060] In step (2), this solution can process at least one specific groove body, such as a long round groove, a rectangular groove, a trapezoidal groove, or other regular or irregular groove bodies. Each shape of the metal short wire corresponds to a specific groove body, so only one shape of the metal short wire can be directionally filled in a specific groove body; thus, the filling type of the metal short wire in this solution is not single, and the shape and size of both the metal short wire and the groove structure can be designed according to needs, and targeted processing can be performed on the location of specific defects on the circuit board, so that multiple specific defects can be filled at once, simplifying the repair process of fine circuits, ensuring the repair quality, and having the advantage of accurate defect positioning.

[0061] Optimally, in step (3), the amount of metal short wires added is 10-200 wires / mL.

[0062] The amount of metal short wires added can be determined according to needs. This solution preferably targets groove structures in the length range of 5-1000 μm, and selects an addition amount of 10-200 wires / mL. At this addition amount, the number of metal short wires gathered in the vortex center is appropriate, and the metal short wires have the best filling effect in the groove structure, with the highest filling effect.

[0063] In the step (2), the area where the open circuit defect is located in the circuit board is cleaned by at least one of laser cleaning, chemical etching and fine cutting.

[0064] Laser cleaning is non-abrasive, non-contact, heat-free, and suitable for cleaning a wide range of materials. Chemical etching removes material through chemical reactions or physical impact; fine cutting can be performed by laser cutting, water jet cutting, and plasma cutting. This solution is compatible with a variety of different cleaning methods.

[0065] Optimally, in step (6), the circuit board is placed in an electrolyte, energized, and electroplated to fill the gap between the original metal circuit and the metal short line, thereby completing the repair of the circuit board.

[0066] like Figure 1, place the circuit board in electrolyte 7, use direct current to energize the circuit board, connect the positive electrode to the metal plate, and the negative electrode to the circuit board, and electroplate the circuit board; in the copper electroplating hole filling solution, electroplating occurs preferentially at the location of the holes and grooves, and can fill the gap between the original metal circuit and the newly filled metal short wires in the groove structure, and finally obtain a repaired circuit board. According to common knowledge of electroplating, for example, based on mechanisms such as uneven current density distribution, edge effect and difference in electrolyte fluidity, a barrier film is formed in the high current density area (hole mouth), inhibiting metal deposition, while promoting ion migration and reduction in the low current density area (inside the hole), thereby achieving electroplating preferentially at the location of the holes and grooves, thereby filling the gap between the original circuit and the metal short wires.

[0067] Optimally, in step (6), the original metal circuit and the metal short wire are reinforced and the gap therebetween is filled by at least one of laser sintering, nano-copper hot pressing and arc pulse welding.

[0068] As an alternative to electroplating, the present invention can use laser sintering, nano copper hot pressing and arc pulse welding for reinforcement and filling; in some embodiments, such as Figure 2 , reinforcement treatment 6 can be strengthened and filled by laser sintering, nano copper hot pressing and arc pulse welding as needed.

[0069] Laser sintering is a layered processing technology that first slices a three-dimensional model into multiple layers of two-dimensional cross-sections. The laser beam then scans the powder material (such as metal or polymer powder) layer by layer according to the slicing data, causing it to melt and solidify into a solid layer. After each layer is sintered, the powder bed descends and new powder is laid, and the process is repeated until the entire three-dimensional object is manufactured. Specifically, a laser is used to irradiate the metal short wires and the original circuit at the gap in the groove structure. The circuits near the gap are remelted and connected together.

[0070] Nanocopper hot pressing combines nanocopper materials with a substrate through heat and pressure. Nanocopper particles, due to their small size, large surface area, and high activity, are more susceptible to plastic deformation during the hot pressing process. Applying pressure at high temperatures breaks down the surface oxide layer, promoting interatomic diffusion bonding and forming a dense connection. Specifically, after plastic deformation, the metal short wire and the original circuit are connected at the location of the gap.

[0071] Arc pulse welding, based on the principles of arc welding, uses pulsed current to periodically modulate arc energy. During the high-energy pulse phase, the arc instantly melts both the weld metal and the base metal. Specifically, a pulsed current is passed through the conductors, causing the conductors near the gap to remelt and connect.

[0072] Optimally, in step (3), the material of the metal short wire is at least one of copper, silver and gold, or an alloy of at least two of copper, silver and gold.

[0073] When choosing single copper, silver and gold as metal short-circuit wires, the main considerations are:

[0074] Copper is the cheapest material among the three, suitable for low-cost repair scenarios, and its welding performance is stable when the surface is not oxidized, making it suitable for general circuit connections;

[0075] Silver has the lowest resistivity and is suitable for repairing high-frequency or high-precision circuits. It also has better heat dissipation performance than copper and gold, making it suitable for repairing components that are prone to heat.

[0076] Gold hardly oxidizes and can maintain its conductive properties after long-term use, making it suitable for high-reliability repairs. Gold also has strong resistance to chemical corrosion and is suitable for harsh environments or scenarios with high durability requirements.

[0077] For alloys of copper, silver and gold, their properties can be adjusted by adjusting the composition ratio to meet different needs.

[0078] Optimally, in step (3), the size of the metal short wire is smaller than the size of the groove structure, and the size difference between the two is: the size of the metal short wire is 5-1000 μm.

[0079] The metal stub is slightly smaller than the groove structure, with a preferred size difference of 1-10 μm. This size difference ensures that once the metal stub enters the groove structure, it is sterically hindered by the structure and is not easily released. The size difference here refers to the dimensions of the metal stub and the groove structure in the same direction, such as the difference in length, width, and thickness. The metal stub can have regular shapes such as strips and rods, or irregular shapes.

[0080] A circuit board is modified by a fine circuit repair method based on liquid flow self-assembly positioning according to any of the above embodiments.

[0081] A fine line repair system based on liquid flow self-assembly positioning, comprising: a detection and positioning device, a line cleaning device, a cutting device, an eddy current container, a stirring device and a line reinforcement device;

[0082] The detection and positioning device is used to determine the position of the open circuit defect to be repaired in the metal circuit of the circuit board;

[0083] The circuit cleaning device is used to clean the area where the open circuit defect is located in the circuit board, so that a groove structure is formed at the open circuit defect location;

[0084] The cutting device is used to cut a plurality of metal short wires from the metal wire, and the size of the metal short wires matches the inner diameter of the groove structure;

[0085] The eddy current container is used to be filled with copper electroplating hole filling solution and to receive metal short wires;

[0086] The stirring device is installed in the vortex container and is used to form a vortex in the vortex container, so that the cleaned circuit board moves relative to the metal short wire in the vortex until the groove structure is filled with the metal short wire;

[0087] The circuit reinforcement device is used to reinforce the original metal circuit and the metal short wire and fill the gap between them.

[0088] The detection and positioning device, circuit cleaning device, cutting device, eddy current container, stirring device, and circuit reinforcement device are substituted for devices involved in the known circuit repair process, and they only need to perform the corresponding functions. For example, the detection and positioning device only needs to identify the location of the open circuit defect to be repaired; the circuit cleaning device only needs to form a groove structure; the cutting device only needs to cut out the metal short wire; the eddy current container only needs to be able to be loaded with copper electroplating hole filling solution; the stirring device only needs to perform the stirring function to form eddy currents; the circuit reinforcement device can be one of the electroplating processing line, laser sintering processing line, nano copper hot pressing processing line, and arc pulse welding processing line.

[0089] Example 1:

[0090] (1) Use AOI equipment to determine the location of the open circuit defect to be repaired in the metal circuit of the circuit board;

[0091] (2) Using a laser cleaning method to clean the area where the open circuit defect is located in the circuit board, so that a groove structure is formed at the open circuit defect location; the groove structure is a rectangular groove;

[0092] (3) Cutting a plurality of metal short wires from the metal wire, wherein the size of the metal short wires matches the inner diameter of the groove structure; the size of the metal short wires is controlled to be 3-4 μm less than the inner diameter of the groove structure; the amount of the metal short wires added is 50 pieces / mL; the material of the metal short wires is copper; the copper is in the shape of a long strip, with an outer diameter of 20 μm and a length of 100 μm;

[0093] (4) Dispersing the metal short wires in the copper electroplating hole filling solution, stirring the copper electroplating hole filling solution with a stirring device to form a vortex; the main salt of the copper electroplating hole filling solution is copper sulfate, and the copper ion concentration is 30g / L;

[0094] (5) placing the circuit board cleaned and processed in step (2) in the vortex formed in step (4), and fixing the circuit board in a relative position in the vortex, and maintaining stirring until the metal short wires are filled in the groove structure;

[0095] (6) Place the circuit board in an electrolyte, energize the circuit board, and perform electroplating to fill the gap between the original metal circuit and the metal short line, and the circuit board is repaired.

[0096] Example 2:

[0097] (1) Use AOI equipment to determine the location of the open circuit defect to be repaired in the metal circuit of the circuit board;

[0098] (2) using a chemical etching method to clean the area where the open circuit defect is located in the circuit board, so that a groove structure is formed at the open circuit defect location; the groove structure is a rectangular groove;

[0099] (3) Cutting a plurality of metal short wires from the metal wire, wherein the size of the metal short wires matches the inner diameter of the groove structure; the size of the metal short wires is controlled to be 2-5 μm less than the inner diameter of the groove structure; the amount of the metal short wires added is 10 pieces / mL; the material of the metal short wires is gold; the gold is in the form of long strips with an outer diameter of 20 μm and a length of 50 μm;

[0100] (4) Dispersing the metal short wires in the copper electroplating hole filling solution, stirring the copper electroplating hole filling solution with a stirring device to form a vortex; the main salt of the copper electroplating hole filling solution is copper pyrophosphate, and the copper ion concentration is 70g / L;

[0101] (5) placing the circuit board cleaned and processed in step (2) in the vortex formed in step (4), and fixing the circuit board in a relative position in the vortex, and maintaining stirring until the metal short wires are filled in the groove structure;

[0102] (6) Use laser sintering to reinforce the original metal circuit and the metal short wire, fill the gap between the two, and the circuit board is repaired.

[0103] Example 3:

[0104] (1) Use AOI equipment to determine the location of the open circuit defect to be repaired in the metal circuit of the circuit board;

[0105] (2) Using a fine cutting method to clean and process the area where the open circuit defect is located in the circuit board, so that a groove structure is formed at the open circuit defect location; the groove structure is a rectangular groove;

[0106] (3) Cutting a plurality of metal short wires from the metal wire, wherein the size of the metal short wires matches the inner diameter of the groove structure; the size of the metal short wires is controlled to be 7-10 μm less than the inner diameter of the groove structure; the amount of the metal short wires added is 200 pieces / mL; the material of the metal short wires is silver; the silver is in the shape of long strips, with an outer diameter of 25 μm and a length of 100 μm;

[0107] (4) Dispersing the metal short wires in the copper electroplating hole filling solution, stirring the copper electroplating hole filling solution with a stirring device to form a vortex; the main salt of the copper electroplating hole filling solution is copper carbonate, and the copper ion concentration is 70g / L;

[0108] (5) placing the circuit board cleaned and processed in step (2) in the vortex formed in step (4), and fixing the circuit board in a relative position in the vortex, and maintaining stirring until the metal short wires are filled in the groove structure;

[0109] (6) Use arc pulse welding to reinforce the original metal circuit and the metal short wire, fill the gap between the two, and the circuit board is repaired.

[0110] Example 4:

[0111] (1) Use AOI equipment to determine the location of the open circuit defect to be repaired in the metal circuit of the circuit board;

[0112] (2) Using a laser cleaning method to clean the area where the open circuit defect is located in the circuit board, so that a groove structure is formed at the open circuit defect location;

[0113] (3) cutting a plurality of metal short wires from the metal wire, wherein the size of the metal short wires matches the inner diameter of the groove structure;

[0114] One of the metal short wires is controlled to have a size 3-4 μm smaller than the inner diameter of the groove structure. The metal short wires are added at a rate of 50 pieces / mL and are made of copper. The copper is in the form of a long strip with an outer diameter of 20 μm and a length of 100 μm. The corresponding groove structure is a rectangular groove.

[0115] One of the metal short wires is controlled to have a size 1-2 μm smaller than the inner diameter of the groove structure. The amount of the metal short wire added is 50 pieces / mL and the material is silver. The silver is in the form of a long strip with an outer diameter of 25 μm and a length of 60 μm. The corresponding groove structure is a rectangular groove.

[0116] One of the metal short wires is controlled to have a size 2-3 μm smaller than the inner diameter of the groove structure. The amount of the metal short wire added is 100 pieces / mL and the material is silver. The silver is in the form of a long strip with an outer diameter of 10 μm and a length of 20 μm. The corresponding groove structure is a rectangular groove.

[0117] (4) Dispersing the metal short wires in the copper electroplating hole filling solution, stirring the copper electroplating hole filling solution with a stirring device to form a vortex; the main salt of the copper electroplating hole filling solution is copper sulfate, and the copper ion concentration is 30g / L;

[0118] (5) placing the circuit board cleaned and processed in step (2) in the vortex formed in step (4), and fixing the circuit board in a relative position in the vortex, and maintaining stirring until the metal short wires are filled in the groove structure;

[0119] (6) Place the circuit board in an electrolyte, energize the circuit board, and perform electroplating to fill the gap between the original metal circuit and the metal short line, and the circuit board is repaired.

[0120] Example 5:

[0121] (1) Use AOI equipment to determine the location of the open circuit defect to be repaired in the metal circuit of the circuit board;

[0122] (2) Using a laser cleaning method to clean the area where the open circuit defect is located in the circuit board, so that a groove structure is formed at the open circuit defect location;

[0123] (3) cutting a plurality of metal short wires from the metal wire, wherein the size of the metal short wires matches the inner diameter of the groove structure;

[0124] The size of one of the metal short wires is controlled to be 3-4 μm smaller than the inner diameter of the groove structure. The amount of the metal short wire added is 50 pieces / mL and the material is copper. The copper is a regular hexahedron with a length, width and height of 30 μm respectively. The corresponding groove structure is a square groove.

[0125] One of the metal short wires is controlled to have a size 5-10 μm smaller than the inner diameter of the groove structure. The amount of the metal short wire added is 10 pieces / mL and the material is copper. The copper is in the form of a long strip with an outer diameter of 100 μm and a length of 500 μm. The corresponding groove structure is a rectangular groove.

[0126] (4) Dispersing the metal short wires in the copper electroplating hole filling solution, stirring the copper electroplating hole filling solution with a stirring device to form a vortex; the main salt of the copper electroplating hole filling solution is copper sulfate, and the copper ion concentration is 30g / L;

[0127] (5) placing the circuit board cleaned and processed in step (2) in the vortex formed in step (4), and fixing the circuit board in a relative position in the vortex, and maintaining stirring until the metal short wires are filled in the groove structure;

[0128] (6) Place the circuit board in an electrolyte, energize the circuit board, and perform electroplating to fill the gap between the original metal circuit and the metal short line, and the circuit board is repaired.

[0129] The above-described embodiments merely illustrate several implementations of the present invention, and while their descriptions are relatively specific and detailed, they should not be construed as limiting the scope of the patent. It should be noted that a person skilled in the art would be able to make numerous variations and improvements without departing from the spirit of the present invention, all of which fall within the scope of protection of the present invention. Therefore, the scope of protection of the patent for this invention shall be determined by the appended claims.

Claims

1. A fine line repair method based on liquid flow self-assembly positioning, characterized in that: The steps include: (1) Determine the location of the open circuit defect to be repaired in the metal circuit of the circuit board; (2) Cleaning and processing the area where the open circuit defect is located in the circuit board to form a groove structure at the open circuit defect location; (3) cutting a plurality of metal short wires from the metal wire, wherein the size of the metal short wires matches the inner diameter of the groove structure; (4) Dispersing the metal short wires in the copper electroplating hole filling solution and stirring to form a vortex; (5) placing the circuit board cleaned and processed in step (2) in the vortex formed in step (4), and fixing the circuit board in a relative position in the vortex, and maintaining stirring until the metal short wires are filled in the groove structure; (6) The original metal circuit and the metal short wire are reinforced and the gap between them is filled, and the circuit board is repaired.

2. A fine line repair method based on liquid flow self-assembly positioning according to claim 1, characterized in that: In the step (2), part of the groove structure is processed into a groove body of a specific size; In the step (3), some of the metal short wires are cut into specific sizes, and each size of the metal short wire corresponds to a groove structure of one or more sizes.

3. The fine line repair method based on liquid flow self-assembly positioning according to claim 1, characterized in that: In the step (2), part of the groove structure is processed into a groove body of a specific groove type; In the step (3), some of the metal short wires are cut into specific shapes, and each shape of the metal short wire corresponds to a groove structure of a groove type.

4. The fine line repair method based on liquid flow self-assembly positioning according to claim 1, characterized in that: In the step (3), the amount of metal short wires added is 10-200 pieces / mL.

5. The fine line repair method based on liquid flow self-assembly positioning according to claim 1, characterized in that: In step (6), the circuit board is placed in an electrolyte, energized, and electroplated to fill the gap between the original metal circuit and the metal short line, thereby completing the repair of the circuit board.

6. The fine line repair method based on liquid flow self-assembly positioning according to claim 1, characterized in that: In the step (6), the original metal circuit and the metal short wire are reinforced and the gap between them is filled by at least one of laser sintering, nano copper hot pressing and arc pulse welding.

7. The fine line repair method based on liquid flow self-assembly positioning according to claim 1, characterized in that: In step (3), the material of the metal short wire is at least one of copper, silver and gold, or an alloy of at least two of copper, silver and gold.

8. A fine line repair method based on liquid flow self-assembly positioning according to any one of claims 1 to 7, characterized in that: In the step (3), the size of the metal short wire is smaller than the size of the groove structure, and the size difference between the two is 1-10 μm; the size of the metal short wire is 5-1000 μm.

9. A circuit board, characterized in that: The modification process is performed by a fine line repair method based on liquid flow self-assembly positioning as described in any one of claims 1-8.

10. A fine line repair system based on liquid flow self-assembly positioning, characterized in that: include: Detection and positioning devices, line cleaning devices, cutting devices, eddy current containers, stirring devices and line reinforcement devices; The detection and positioning device is used to determine the position of the open circuit defect to be repaired in the metal circuit of the circuit board; The circuit cleaning device is used to clean the area where the open circuit defect is located in the circuit board, so that a groove structure is formed at the open circuit defect location; The cutting device is used to cut a plurality of metal short wires from the metal wire, and the size of the metal short wires matches the inner diameter of the groove structure; The eddy current container is used to be filled with copper electroplating hole filling solution and to receive metal short wires; The stirring device is installed in the vortex container and is used to form a vortex in the vortex container, so that the cleaned circuit board moves relative to the metal short wire in the vortex until the groove structure is filled with the metal short wire; The circuit reinforcement device is used to reinforce the original metal circuit and the metal short wire and fill the gap between them.

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