Method for improving multi-layer flexible Cavity uncovering

Abstract

The invention discloses a method for improving multi-layer flexible Cavity uncovering, relates to a flexible FPC (Flexible Printed Circuit) manufacturing process, and provides a scheme aiming at the problems of low uncovering efficiency, easiness in damage and the like in the prior art. Performing laser cutting on the lower half part; performing laser cutting on the upper half part to form a cover body to be uncovered; and finally, the cut pressing plate is placed on a jig provided with ejector pins, and all the PCS inner cover bodies in the pressing plate are ejected out through the ejector pins. The rear uncovering jig has the advantages that the rear uncovering process is improved by using the jig, the operation of uncovering with a hard object is completely avoided, the problem of scratches caused by the operation is avoided, and the rate of finished products is improved. And meanwhile, all the cover bodies can be operated at a time through the jig, dozens of PCSs are generally arranged in a pressing plate, and therefore the cover opening efficiency is improved by dozens of times.

Description

Technical Field

[0001] The invention relates to a flexible FPC manufacturing process, in particular to a method for improving multi-layer flexible Cavity uncovering. Background Art

[0002] The multi-layer flexible board cavity uncovering process means that the cover is surrounded by complete circuit patterns, and some materials are removed in specific areas of the multi-layer flexible board to form a groove structure of a specific size, so that electronic components can be embedded in the cavity area, and there are depth requirements, such as Figures 1 to 4 Compared with the rigid-flexible board cover and the multi-layer flexible board cover, which are usually only used to make the local area thinner and softer, and achieve better bending effect, the process is more complicated and the production difficulty increases. The multi-layer flexible board Cavity cover process is divided into two processes: front cover and back cover.

[0003] Advantages of the front-opening process include high production efficiency and reduced manual uncapping processes per PC. Disadvantages include a wide tolerance (0.2mm) in the cavity opening area, resulting in stepped and non-overlapping windows. Front-opening involves cutting and opening windows before assembling the panels, then laminating and pressing them together. Because multi-layer panels require multiple assembly steps, this can lead to misalignment and inaccuracy, resulting in substandard dimensions.

[0004] Advantages of the back-opening process: The cavity area has high dimensional accuracy (0.05mm). The cavity window area is laser cut by laser cutting, and then the waste is removed one by one using a knife pen to form the cavity lid. The specific process is as follows Figure 5 As shown: S11. Combine the unopened L1 to L6 layers and press them together, then laser cut the window areas from L to L3. S12. Use a hard object, such as a knife or pen, to lift off the waste materials one by one to form the cavity cover. S13. Use a mold to punch out L4 to L6 to obtain the finished product. Disadvantages: Because the waste materials need to be manually lifted off one by one with a knife or pen after laser cutting, there are bruises and scratches on the surface of the cavity area, which is not good. Figure 6 As shown, the production efficiency of single PCS lidding is extremely low.

[0005] The distribution and description of PCS on the laminate are recorded in the prior document CN208029180U. Summary of the Invention

[0006] The present invention aims to provide a method for improving a multi-layer flexible cavity cover to solve the above-mentioned problems in the prior art.

[0007] The method for improving multi-layer flexible cavity cover of the present invention comprises the following steps:

[0008] S21. Place the laminate bottom side up and laser cut the lower half.

[0009] S22 flip the pressing plate, laser cutting the upper half to form a cover to be opened; and the cutting area of ​​the upper half is larger than the corresponding area of ​​the lower half;

[0010] S23. Place the cut pressed plate on a jig with ejector pins, and use the ejector pins to push in and out all the PCS inner covers in the pressed plate.

[0011] A plurality of positioning holes are punched out in advance on the press plate before laser cutting; and positioning posts are provided on the fixture at the positions where the positioning holes are fitted.

[0012] The laminate is provided with N layers, wherein N is an even number, the upper half is the first layer to the N / 2th layer, and the lower half is the N / 2+1th layer to the Nth layer.

[0013] The PCS in the pressing plate are distributed in an array; the ejector pins in the fixture are distributed on the substrate in the same array; each ejector pin corresponds to a corresponding position of the inner cover of each PCS.

[0014] The method for improving multi-layer flexible cavity lid removal described in this invention has the advantage of utilizing the jig to improve the rear lid opening process, completely eliminating the need for hard objects to remove the lid, eliminating the scratching problem caused by this operation and improving the yield rate. Furthermore, the jig can perform a single operation on all lids. Typically, a press plate contains dozens of PCS, significantly increasing lid removal efficiency by several dozen times. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] Figure 1 It is a structural schematic diagram of the pressing plate before the cover is opened in the prior art.

[0016] Figure 2 It is a structural schematic diagram of the pressing plate after the cover is removed in the prior art.

[0017] Figure 3 yes Figure 2 A local enlarged view of point K in the middle.

[0018] Figure 4 yes Figure 3 Cross-sectional view along the AA axis.

[0019] Figure 5 It is a schematic diagram of a process of uncovering in the prior art.

[0020] Figure 6 This is a real picture of the product after the cover is manually opened using a hard object in the prior art.

[0021] Figure 7It is a structural schematic diagram of the fixture described in the present invention.

[0022] Figure 8 It is a structural schematic diagram of the pressing plate before the cover is opened in the present invention.

[0023] Figure 9 It is a schematic diagram of the assembled usage state of the pressing plate and the jig of the present invention.

[0024] Figure 10 yes Figure 9 A partial enlarged view of point J in the middle.

[0025] Figure 11 It is a schematic flow chart of the method described in the present invention.

[0026] Figure 12 It is a schematic structural diagram of the pressing plate after the cover is removed in the present invention.

[0027] Figure 13 This is a real picture of the product after the cover is opened using the method described in the present invention.

[0028] Reference numerals:

[0029] 10-pressing plate, 11-PCS, 12-positioning hole, 13-cover;

[0030] L1-first floor, L2-second floor, L3-third floor, L4-fourth floor, L5-fifth floor, L6-sixth floor;

[0031] 20-base plate, 21-positioning column, 22-thrust pin. DETAILED DESCRIPTION

[0032] Fixture structure such as Figure 7 As shown, it includes a substrate 20. On the substrate 20, ejector pins 22 are arranged in an array, and a plurality of positioning posts 21 are arranged on the periphery of the array.

[0033] The structure of the front pressing plate 10 is as follows: Figure 8 As shown, it includes PCS11 arranged in an array, and a plurality of positioning holes 12 are provided on the periphery of the array. The array spacing and number of PCS11 are the same as those of the ejector pins 22, and the positioning holes 12 are adapted for use with the positioning posts 21. When the positioning holes 12 coincide with the positioning posts 21, there is a corresponding ejector pin 22 under each PCS11. The pressed plate 10 is provided with N layers, where N is an even number, the upper half is the first to N / 2 layers, and the lower half is the N / 2+1 to N layers. In this embodiment, N is 6, that is, from top to bottom, they are L1 to L6, L1 to L3 are the upper half, and L4 to L6 are the lower half.

[0034] The specific steps of the method for improving multi-layer flexible Cavity uncovering of the present invention are as follows: Figures 9 to 11 As shown:

[0035] S21. The bottom surface of the laminate 10 is facing upward, and L4 to L6 are laser cut;

[0036] S22 flip the pressing plate 10, L1 to L3 laser cutting, forming a cover to be opened 13; and L1 to L3 cutting area is larger than the corresponding area L4 to L6;

[0037] S23. Place the cut pressed plate 10 on a fixture provided with a ejector pin 22, and use the ejector pin 22 to push in and out all the PCS11 inner covers 13 in the pressed plate 10, and finally obtain the following Figure 12 The structure shown. The cover effect is as follows Figure 13 As shown, compared Figure 6 , completely avoiding scratches from hard objects.

[0038] Those skilled in the art can make various other corresponding changes and deformations based on the technical solutions and concepts described above, and all of these changes and deformations should fall within the scope of protection of the claims of the present invention.

Claims

1. A method for improving multi-layer flexible cavity cover, characterized in that: The following steps are involved: S21. Place the bottom surface of the press plate (10) upward and perform laser cutting on the lower half; S22. Turn over the pressed plate (10), and perform laser cutting on the upper portion to form a cover (13) to be opened; and the cutting area of ​​the upper portion is larger than the corresponding area of ​​the lower portion; S23. Place the cut pressed plate (10) on a jig provided with ejector pins (22), and use the ejector pins (22) to push in and out the inner covers (13) of all PCS (11) in the pressed plate (10).

2. The method for improving multi-layer flexible cavity cover according to claim 1, characterized in that: A plurality of positioning holes (12) are punched out in advance on the pressing plate (10) before laser cutting; and the jig is provided with positioning posts (21) at the fitting positions of the positioning holes (12).

3. The method for improving multi-layer flexible cavity cover according to claim 1, characterized in that: The pressed plate (10) is provided with N layers, wherein N is an even number, the upper half is the first layer to the N / 2th layer, and the lower half is the N / 2+1th layer to the Nth layer.

4. The method for improving multi-layer flexible cavity cover according to claim 1, characterized in that: The PCS (11) in the pressing plate (10) is distributed in an array; the ejector pins (22) in the fixture are distributed on the substrate (20) in the same array; each ejector pin (22) corresponds to a corresponding position of the inner cover (13) of each PCS (11).

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