Electronic device

Abstract

The invention discloses an electronic device which comprises a frame body and a sensing element, the frame body comprises a frame, the frame comprises a plastic part, a first radiator and a second radiator, the first radiator and the second radiator are embedded in the plastic part, the plastic part forms a plastic surface on the inner side of the frame, the first radiator comprises a first metal surface, and the second radiator comprises a second metal surface. The first radiator comprises a first metal surface, the second radiator comprises a second metal surface, the first metal surface and the second metal surface are exposed out of the plastic surface on the inner side of the frame, a breaking joint is arranged between the first radiator and the second radiator, and the breaking joint is filled with the plastic part; wherein the frame is provided with a through hole and a bonding surface, the through hole is at least partially arranged at the breaking joint, the bonding surface at least comprises a first metal surface and a plastic surface, the plastic surface corresponding to the bonding surface surrounds the first metal surface and the through hole, and the sensing element is bonded to the bonding surface and is arranged opposite to the through hole.

Description

Technical Field

[0001] The present application belongs to the technical field of electronic equipment, and specifically relates to an electronic equipment. Background Art

[0002] Currently, infrared sensor elements are installed inside electronic devices, so that electronic devices have infrared remote control functions. Figure 1 As shown, in the electronic device in the related art, the through hole of the sensor element 2' is opened on the frame 1', but in order to meet the waterproof requirement, the sensor element 2' needs to be installed on the pure plastic surface of the frame 1', which limits the installation of the sensor element 2'. Summary of the Invention

[0003] The present application aims to provide an electronic device that at least solves the problem of limitations on the installation position of a sensing element.

[0004] In order to solve the above technical problems, this application is implemented as follows:

[0005] An embodiment of the present application proposes an electronic device, including: a frame and a sensor element, the frame including a frame, the frame including a plastic part, a first radiator and a second radiator, the first radiator and the second radiator are embedded in the plastic part, the plastic part forms a plastic surface on the inner side of the frame, the first radiator includes a first metal surface, the second radiator includes a second metal surface, the first metal surface and the second metal surface are both exposed on the plastic surface on the inner side of the frame, a gap is provided between the first radiator and the second radiator, and the plastic part fills the gap; wherein, the frame is provided with a through hole and a bonding surface, the through hole is at least partially provided at the gap, the bonding surface includes at least the first metal surface and the plastic surface, and the plastic surface corresponding to the bonding surface surrounds the first metal surface and the through hole, and the sensor element is bonded to the bonding surface and arranged opposite to the through hole.

[0006] In an embodiment of the present application, an electronic device includes a frame and a sensor element. The frame includes a frame, which includes a plastic part and a first radiator and a second radiator. The first radiator and the second radiator are embedded in the plastic part. On the basis of realizing the antenna function, the space inside the electronic device can be freed up, thereby improving the space utilization rate inside the electronic device. The first radiator and the second radiator are separated at a break, and the break is filled with a plastic part to ensure the integrity of the appearance of the electronic device. At the same time, the frame is provided with a through hole, at least a portion of which is provided at the break, which can ensure the stability of the sensor element in transmitting and receiving signals. In addition, the through hole is located on the frame, so when a user uses the corresponding function of the sensor element, the user does not need to flip the electronic device, thereby improving the convenience of use. Among them, the first radiator includes a first metal surface, the second radiator includes a second metal surface, the plastic part forms a plastic surface on the inner side of the frame, the bonding surface of the sensor element includes at least the first metal surface and the plastic surface, and the plastic surface corresponding to the bonding surface surrounds the first metal surface and the through hole. In this way, after the sensor element is bonded to the bonding surface, the circumference of the through hole can be sealed by bonding with the plastic surface, thereby preventing liquid from entering the interior of the electronic device through the through hole, thereby improving the waterproof level of the electronic device and improving the flexibility of the installation position of the sensor element.

[0007] Additional aspects and advantages of the present application will be given in part in the description below, and in part will become obvious from the description below, or will be learned through practice of the present application. BRIEF DESCRIPTION OF THE DRAWINGS

[0008] The above and / or additional aspects and advantages of the present application will become apparent and easily understood from the description of the embodiments in conjunction with the following drawings, in which:

[0009] Figure 1 It is a structural diagram of an electronic device in the related art;

[0010] Reference numerals:

[0011] 1'frame, 2'sensing element.

[0012] Figure 2 One of the structural schematic diagrams of an electronic device according to an embodiment of the present application is shown;

[0013] Figure 3 A second structural diagram of an electronic device according to an embodiment of the present application is shown;

[0014] Figure 4 yes Figure 3 A schematic diagram of a portion of the structure of an electronic device according to the embodiment shown;

[0015] Figure 5 A schematic diagram showing a process flow of an electronic device according to an embodiment of the present application is shown;

[0016] Figure 6 It shows one of the structural schematic diagrams during the frame preparation process of one embodiment of the present application;

[0017] Figure 7 The second structural diagram of the frame preparation process of one embodiment of the present application is shown;

[0018] Figure 8 The third structural diagram shows the process of preparing a frame according to an embodiment of the present application;

[0019] Figure 9 A fourth structural diagram showing a process of preparing a frame according to an embodiment of the present application is shown;

[0020] Figure 10 One of the structural schematic diagrams of a frame body of an embodiment of the present application is shown;

[0021] Figure 11 The second structural diagram of the frame of one embodiment of the present application is shown;

[0022] Figure 12 The fifth structural diagram shows a process of preparing a frame according to an embodiment of the present application;

[0023] Figure 13 The sixth structural diagram shows a process of preparing a frame according to an embodiment of the present application;

[0024] Figure 14 The seventh structural diagram shows a process of preparing a frame according to an embodiment of the present application;

[0025] Figure 15 The third structural diagram of the frame of one embodiment of the present application is shown;

[0026] Figure 16 A fourth structural diagram of a frame body according to an embodiment of the present application is shown;

[0027] Figure 17 A third structural diagram of an electronic device according to an embodiment of the present application is shown;

[0028] Figure 18 Shown Figure 17 A schematic diagram of a portion of the structure of an electronic device according to the embodiment shown;

[0029] Figure 19 A fourth structural diagram of an electronic device according to an embodiment of the present application is shown;

[0030] Figure 20 Shown Figure 19 A schematic diagram of a portion of the structure of an electronic device according to the embodiment shown.

[0031] Reference numerals:

[0032] 1 Frame, 2 Border, 20 Plastic parts, 200 Plastic surface, 201 First plastic surface, 202 Second plastic surface, 22 First radiator, 220 First radiating portion, 222 First connecting portion, 224 First metal surface, 24 Second radiator, 240 Air avoidance groove, 242 Second radiating portion, 244 Second connecting portion, 246 Second metal surface, 26 Break, 28 Through hole, 3 Bonding surface, 4 Sensing element, 40 Cover, 42 Light guide column, 44 Sensor, 5 Bonding parts, 6 Connecting structure, 7 Installation area, 8 Middle plate. DETAILED DESCRIPTION

[0033] The embodiments of the present application will be described in detail below. Examples of the embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals throughout represent the same or similar elements or elements having the same or similar functions. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain the present application and are not to be construed as limiting the present application. Based on the embodiments in the present application, all other embodiments obtained by ordinary technicians in this field without making creative efforts are within the scope of protection of this application.

[0034] The terms "first" and "second" in the specification and claims of this application may explicitly or implicitly refer to one or more of the features. Throughout the description of this application, unless otherwise specified, "plurality" means two or more. Furthermore, "and / or" in the specification and claims refers to at least one of the connected entities, and the character " / " generally indicates an "or" relationship between the connected entities.

[0035] In the description of this application, it should be understood that the terms "length", "width", "top", "bottom", "inside", "outside", "axial", "radial", "circumferential", etc., indicating the orientation or position relationship, are based on the orientation or position relationship shown in the accompanying drawings. They are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation. Therefore, they cannot be understood as limitations on this application.

[0036] In the description of this application, it should be noted that, unless otherwise expressly specified or limited, the terms "mounted," "connected," and "connected" should be understood in a broad sense. For example, they can refer to fixed connections, detachable connections, or integral connections; mechanical connections or electrical connections; direct connections or indirect connections through an intermediate medium; and internal connections between two components. Those skilled in the art will understand the specific meanings of the above terms in this application based on the specific circumstances.

[0037] The following combination Figure 2-Figure 20 An electronic device according to an embodiment of the present application is described.

[0038] like Figure 2 、 Figure 3 、 Figure 4 、 Figure 17 、 Figure 18 、 Figure 19 and Figure 20 As shown, according to some embodiments of the present application, the electronic device includes: a frame 1 and a sensor element 4, the frame 1 includes a frame 2, the frame 2 includes a plastic part 20, a first radiator 22 and a second radiator 24, the first radiator 22 and the second radiator 24 are embedded in the plastic part 20, the plastic part 20 forms a plastic surface 200 on the inner side of the frame 2, the first radiator 22 includes a first metal surface 224, the second radiator 24 includes a second metal surface 246, the first metal surface 224 and the second metal surface 24 6 are exposed on the plastic surface 200 on the inner side of the frame 2, a gap 26 is provided between the first radiator 22 and the second radiator 24, and the plastic part 20 fills the gap 26; wherein, the frame 2 is provided with a through hole 28 and a bonding surface 3, the through hole 28 is at least partially provided at the gap 26, the bonding surface 3 includes at least a first metal surface 224 and a plastic surface 200, and the plastic surface 200 corresponding to the bonding surface 3 surrounds the first metal surface 224 and the through hole 28, and the sensor element 4 is bonded to the bonding surface 3 and arranged opposite to the through hole 28.

[0039] In an embodiment of the present application, an electronic device includes a frame 1 and a sensor element 4. The frame 1 includes a frame 2. The frame 2 includes a plastic part 20 and a first radiator 22 and a second radiator 24. The first radiator 22 and the second radiator 24 are embedded in the plastic part 20. On the basis of realizing the antenna function, the space inside the electronic device can be freed up, thereby improving the space utilization rate inside the electronic device. Among them, the first radiator 22 and the second radiator 24 are separated at a slit 26, and the slit 26 is filled with the plastic part 20 to ensure the integrity of the appearance of the electronic device. At the same time, the frame 2 is provided with a through hole 28. At least a portion of the through hole 28 is provided at the slit 26 to ensure the stability of the signal transmission and reception of the sensor element 4. In addition, the through hole 28 is located on the frame 2. When the user uses the corresponding function of the sensor element 4, the user does not need to flip the electronic device, thereby improving the convenience of use. Among them, the first radiator 22 includes a first metal surface 224, the second radiator 24 includes a second metal surface 246, the plastic part 20 forms a plastic surface 200 on the inner side of the frame 2, and the bonding surface 3 of the sensor element 4 includes at least the first metal surface 224 and the plastic surface 200, and the plastic surface 200 corresponding to the bonding surface 3 surrounds the first metal surface 224 and the through hole 28. In this way, after the sensor element 4 is bonded to the bonding surface 3, the circumference of the through hole 28 can be bonded and sealed by the plastic surface 200, thereby preventing liquid from entering the interior of the electronic device through the through hole 28, thereby improving the waterproof level of the electronic device and improving the flexibility of the installation position of the sensor element 4.

[0040] It can be understood that in the process of preparing the first radiator 22 and the second radiator 24, a connecting structure 6 needs to be set to connect the first radiator 22 and the second radiator 24 together. After the plastic part 20 and the first radiator 22 and the second radiator 24 are injection molded, at least a portion of the connecting structure 6 is removed, so that the first radiator 22 and the second radiator 24 are disconnected at the break 26. Therefore, the space corresponding to the connecting structure 6 is vacated, and at least a portion of the through hole 28 is opened at the break 26, which enables the sensor element 4 to make full use of the space left after the connecting structure 6 is removed, thereby improving the utilization rate of the space. That is, this arrangement does not need to occupy the installation space of other components of the electronic device, nor does it require adaptive improvements to other components to adapt to the installation of the sensor element 4, thereby reducing manufacturing costs.

[0041] Optionally, the through hole 28 is provided at the top of the frame 2 .

[0042] It can be understood that the first radiator 22 and the second radiator 24 are both antennas. Specifically, the first radiator 22 and the second radiator 24 are made of metal.

[0043] Optionally, the sensing element 4 is an infrared remote control sensor.

[0044] Optionally, the frame 1 further includes a middle plate 8 , the frame 2 is arranged around the middle plate 8 , and the middle plate 8 is used to support the main board.

[0045] like Figure 2 and Figure 4 As shown, according to some embodiments of the present application, optionally, the electronic device further includes: an adhesive 5, the sensing element 4 is bonded to the adhesive surface 3 through the adhesive 5, and the adhesive 5 at least covers the first metal surface 224, the plastic surface 200, and the connection between the first metal surface 224 and the plastic surface 200.

[0046] In this embodiment, the electronic device further includes an adhesive member 5, through which the sensing element 4 is bonded to the frame 2, thereby improving the ease of installation of the sensing element 4. Furthermore, the adhesive member 5 is disposed around the through-hole 28, enabling the adhesive member 5 to achieve a sealed connection with the frame 2 around the through-hole 28, thereby reducing the risk of water leakage into the interior of the electronic device through the through-hole 28. Furthermore, the adhesive member 5 covers at least the first metal surface 224, the plastic surface 200, and the connection between the first metal surface 224 and the plastic surface 200, thereby preventing water from entering the interior of the electronic device through the connection between the first metal surface 224 and the plastic surface 200.

[0047] Optionally, the adhesive member 5 includes double-sided tape, sealing glue, etc.

[0048] It can be understood that the adhesive member 5 is a waterproof adhesive member, so that the adhesive member 5 has waterproof performance.

[0049] According to some embodiments of the present application, optionally, along the circumference of the through hole 28 , the width of the adhesive 5 bonded to the plastic surface 200 is greater than or equal to a preset width.

[0050] In this embodiment, the width of the adhesive member 5 bonded to the plastic surface 200 is greater than or equal to a preset width to ensure waterproof performance and reduce the risk of leakage.

[0051] Optionally, the preset width can be set according to actual conditions, for example, the preset width is greater than 0.5 mm. For example, the preset width is greater than 0.5 mm and less than or equal to 5 mm.

[0052] It can be understood that along the circumference of the through hole 28, the width between the outer edge of the adhesive 5 and the inner wall surface of the through hole 28 is greater than or equal to the preset width, and the width between the outer edge of the adhesive 5 and the outer side wall of the first metal surface 224 is greater than or equal to the preset width, so that the bonding width between the adhesive 5 and the plastic surface 200 at any position is greater than or equal to the preset width, thereby ensuring the waterproof effect along the circumference of the through hole 28.

[0053] like Figure 4As shown, according to some embodiments of the present application, optionally, the second metal surface 246 and the inner wall surface of the through hole 28 are spaced apart by a plastic surface 200 .

[0054] In this embodiment, the inner wall surface of the through hole 28 and the second metal surface 246 are spaced apart by the plastic surface 200, so that the second metal surface 246 is sufficiently far away from the inner wall surface of the through hole 28, thereby ensuring a waterproof distance between the adhesive 5 and the plastic surface 200 to improve the waterproof performance.

[0055] like Figure 4 、 Figure 6 、 Figure 10 、 Figure 12 、 Figure 13 、 Figure 17 、 Figure 19 and Figure 20 As shown, according to some embodiments of the present application, optionally, the second radiator 24 is provided with an air avoidance groove 240, which is recessed from the second metal surface 246 into the second radiator 24, and the air avoidance groove 240 extends to an end of the second radiator 24 close to the first radiator 22; wherein, the air avoidance groove 240 is filled with a plastic part 20 to form a part of the bonding surface 3.

[0056] In this embodiment, the second radiator 24 is provided with a gas avoidance groove 240, which is recessed from the second metal surface 246 into the second radiator 24, and extends to an end of the second radiator 24 close to the first radiator 22, so that the gas avoidance groove 240 is connected to the slit 26, and thus the plastic part 20 can extend from the slit 26 to the position of the gas avoidance groove 240. That is, the width of the plastic part 20 surrounding the through hole 28 is increased along the radial direction of the through hole 28. In this way, when the adhesive 5 is bonded to the plastic surface 200 of the plastic part 20, the waterproof width between the adhesive 5 and the plastic surface 200 of the plastic part 20 can be increased, thereby improving the waterproof performance.

[0057] It is understandable that if the air avoidance groove 240 is not provided, the position of the second metal surface 246 corresponding to the air avoidance groove 240 will be exposed to the plastic part 20, thereby causing the adhesive component 5 to adhere to the second metal surface 246 at this position, which will reduce the waterproof width of the adhesive component 5 and increase the risk of water leakage.

[0058] According to some embodiments of the present application, optionally, the wall surface of the air-avoiding groove 240 is arranged in an arc shape along the circumference of the through hole 28 .

[0059] In this embodiment, the wall of the air-avoiding groove 240 is arranged in an arc shape along the circumference of the through hole 28 , which can ensure the radial width of the plastic part 20 around the through hole 28 and further ensure the waterproof distance between the adhesive 5 and the plastic part 20 .

[0060] It can be understood that the wall surface of the air avoidance groove 240 is set to be an arc shape along the circumference of the through hole 28, so that the plastic surface 200 between the inner wall surface of the through hole 28 and the arc-shaped wall surface of the air avoidance groove 240 surrounds a part of the circular ring of the through hole 28, and then after the adhesive 5 is bonded to the plastic surface 200 of this part of the plastic part 20, the waterproof width of each part can be made consistent, thereby improving the waterproof performance.

[0061] According to some embodiments of the present application, optionally, the bonding surface 3 also includes at least a portion of the second metal surface 246; the first metal surface 224, the second metal surface 246 and the plastic surface 200 corresponding to the bonding surface 3 are arranged flush on the inner side of the frame.

[0062] In this embodiment, the bonding surface 3 also includes at least a portion of the second metal surface 246, which increases the bonding area between the adhesive 5 and the frame 2, thereby increasing the bonding strength between the sensor element 4 and the frame 2 and preventing the sensor element 4 from falling off. In addition, the first metal surface 224, the second metal surface 246, and the plastic surface 200 corresponding to the bonding surface 3 are arranged flush on the inner side of the frame 2, which can ensure the flatness of the bonding surface 3 and thus ensure the sealing performance between the sensor element 4 and the bonding surface 3.

[0063] It can be understood that in some embodiments of the present application, the first radiator 22 and the second radiator 24 are located in the same plane of the frame 2, and part of the plastic part 20 is located on the plane where the first radiator 22 and the second radiator 24 face the inside of the electronic device to form a plastic layer. The plane where the first radiator 22 and the second radiator 24 are located is parallel to the plastic layer. At the break 26 between the first radiator 22 and the second radiator 24, the surface of the first radiator 22 close to the break facing the inside of the electronic device has a first connecting portion 222, and the surface of the second radiator 24 close to the break facing the inside of the electronic device has a second connecting portion 244. The first connecting portion 222 and the second connecting portion 244 are embedded in the plastic layer and exposed in the plastic layer to form a first metal surface 224 and a second metal surface 246.

[0064] It is understandable that the through hole 28 passes through the first connecting portion 222 and the plastic layer and is formed near the break 26 .

[0065] like Figure 12 、 Figure 13 、 Figure 18 and Figure 20As shown, according to some embodiments of the present application, optionally, the first radiator 22 includes: a first radiating portion 220, embedded in the plastic part 20; a first connecting portion 222, arranged in the first radiating portion 220, the first connecting portion 222 is embedded in the plastic part 20, and is exposed to the plastic part 20 on the inner side of the frame 2 to form a first metal surface 224, the first radiating portion 220 and the first connecting portion 222 are both disconnected from the second radiator 24 at the break 26; wherein, a portion of the through hole 28 passes through the first radiating portion 220 and the first connecting portion 222, and another portion of the through hole 28 passes through the plastic part 20 at the break 26.

[0066] In this embodiment, the first radiator 22 includes a first radiating portion 220 and a first connecting portion 222. The first radiating portion 220 and the first connecting portion 222 are embedded in the plastic component 20 and are disconnected from the second radiator 24 at a slit 26. When preparing the metal structure of the frame 2, the connecting structure 6 is used to connect multiple metal structures, such as the first radiator 22 and the second radiator 24, so that the first radiator 22 and the second radiator 24 are connected as a whole. In further preparation, the connecting structure 6 is processed to disconnect the first radiator 22 from the second radiator 24 and form the first connecting portion 222. The first connecting portion 222 is located inside the first radiating portion 220, and the surface of the first connecting portion 222 facing the inside of the frame 2 is exposed on the plastic component 20 to form a first metal surface 224. A portion of the through hole 28 passes through the first radiating portion 220 and the first connecting portion 222, while another portion of the through hole 28 passes through the plastic component 20 at the slit 26. As a result, a portion of the through hole 28 is formed on the first radiator 22, and another portion is formed on the plastic component 20. As a result, the inner wall of the through hole 28 is formed by the first radiator 22 and the plastic component 20. In some embodiments, the first connecting portion 222 is located at the end of the first radiator 22 near the slit 26.

[0067] Among them, a part of the side wall of the first connecting part 222 constitutes the inner wall of the through hole 28, and the other part of the side wall of the first connecting part 222 is surrounded by the plastic part 20, so that the side of the frame 2 facing the sensor element 4 has a junction between the first metal surface 224 and the plastic surface. In order to ensure waterproof performance, the adhesive 5 covers the plastic part 20 and the first connecting part 222 on the side of the through hole 28 to achieve waterproofing around the through hole 28. At the same time, the adhesive 5 also covers the connection between the first metal surface and the plastic surface 200. This arrangement can prevent liquid from entering the interior of the electronic device through the gap between the plastic part 20 and the first connecting part 222.

[0068] In addition, a portion of the through hole 28 is set on the first radiator 22, and the other portion is set at the break 26, so that the installation of the sensor element 4 can make full use of the space occupied by the connecting structure 6 between the first radiator 22 and the second radiator 24 during the preparation of the frame 1. There is no need to adjust the setting positions of other components inside the electronic device, making the components inside the electronic device more compact.

[0069] like Figure 18 and Figure 20 As shown, according to some embodiments of the present application, optionally, the second radiator 24 includes: a second radiating portion 242, embedded in the plastic part 20; a second connecting portion 244, arranged in the second radiating portion 242, the second connecting portion 244 is embedded in the plastic part 20, and is exposed to the plastic part 20 on the inner side of the frame 2 to form a second metal surface 246; the second radiating portion 242 and the second connecting portion 244 are both disconnected from the first radiator 22 at the break 26.

[0070] In this embodiment, the second radiator 24 includes a second radiating portion 242 and a second connecting portion 244. The second radiating portion 242 and the second connecting portion 244 are embedded in the plastic component 20 and are separated from the first radiator 22 at the slit 26. When manufacturing the metal structure of the frame 1, the connecting structure 6 is used to connect multiple metal structures, such as the first radiator 22 and the second radiator 24, so that the first radiator 22 and the second radiator 24 are connected as a whole. In further manufacturing, the connecting portion is processed to form the first connecting portion 222 located on the first radiating portion 220 and the second connecting portion 244 located on the second radiating portion 242. The second connecting portion 244 is disposed inside the second radiating portion 242. The surface of the second connecting portion 244 facing the inside of the frame 1 is exposed from the plastic component 20 to form a second metal surface 246. This allows the installation of the sensor element 4 to fully utilize the space occupied by the connecting structure 6 between the first radiator 22 and the second radiator 24 during the preparation of the frame 2. This eliminates the need to adjust the positions of other components within the electronic device, making the components within the electronic device more compact. In some embodiments, the second connecting portion 244 is located at the end of the second radiator 24 that is closest to the antenna slit 26.

[0071] Optionally, a portion of the air avoidance groove 240 is provided on the second connecting portion 244, and the other portion is provided on the second radiating portion 242, thereby increasing the depth of the air avoidance groove 240 and thereby increasing the thickness of the plastic part 20 in the air avoidance groove 240 to enhance the bonding force between the plastic part 20 and the second radiator 24. At the same time, the air avoidance groove 240 is also connected to the fracture 26, thereby enabling the plastic part 20 to extend from the fracture 26 to the position of the air avoidance groove 240, that is, the width of the plastic part 20 surrounding the through hole 28 is increased along the radial direction of the through hole 28. In this way, when the adhesive 5 is bonded to the plastic surface 200 of the plastic part 20, the waterproof width between the adhesive 5 and the plastic surface 200 of the plastic part 20 can be increased, thereby enhancing the waterproof performance.

[0072] Specifically, after the metal component and the plastic component 20 are injection molded, the connecting structure 6 between the first radiator 22 and the second radiator 24 is processed to disconnect the connecting structure 6, thereby ensuring that the antenna functions of the first radiator 22 and the second radiator 24 are not affected. A portion of the connecting structure 6 is removed to form the first connecting portion 222 and the second connecting portion 244, which in turn form the first metal surface 224 and the second metal surface 246, respectively.

[0073] like Figure 2 and Figure 4 As shown, according to some embodiments of the present application, optionally, the sensing element 4 includes: a cover body 40, the cover body 40 is bonded to the bonding surface 3; a light guide column 42, provided in the cover body 40 and arranged opposite to the through hole 28, and the light guide column 42 and the cover body 40 are sealed.

[0074] In this embodiment, the sensor element 4 includes a housing 40 and a light guide 42. The housing 40 is bonded to the frame 2. The light guide 42 is mounted on the housing 40 and positioned relative to the through hole 28, thereby receiving or transmitting signals through the through hole 28. The light guide 42 and the housing 40 are sealed, preventing liquid from entering the electronic device through the through hole 28 and the gap between the light guide 42 and the housing 40, thereby improving the electronic device's waterproof rating.

[0075] It can be understood that the cover body 40 is bonded to the bonding surface 3 via the adhesive member 5 .

[0076] Optionally, the sensing element 4 further includes a sensor 44 , which is an infrared sensor.

[0077] According to one embodiment of the present application, the plastic surface 200 (eg Figure 17 and Figure 19 The first plastic surface 201 in the middle), the first connecting portion 222, the plastic surface 200 on the right side of the first connecting portion 222 (for example Figure 17 and Figure 19The second plastic surface 202) and the second connecting portion 244 form an aluminum-plastic staggered waterproof structure with the adhesive 5, wherein the adhesive 5 is a waterproof adhesive, and the first connecting portion 222 and the second connecting portion 244 are both metal parts.

[0078] Specifically, the gaps between the plastic part 20, the metal part and the light guide column 42 can be sealed by the waterproof adhesive. When liquid enters the through hole 28, the liquid can enter through the connection between the plastic surface 200 on the left side of the first connecting part 222 (that is, the side of the first connecting part 222 away from the second connecting part 244) and the first connecting part 222, and the connection between the plastic surface 200 on the right side of the first connecting part 222 (that is, the side of the first connecting part 222 close to the second connecting part 244) and the first connecting part 222. Since there is a certain effective waterproof width between the plastic surface 200 on the left side of the first connecting part 222 and the plastic surface 200 on the right side of the first connecting part 222 and the waterproof adhesive, the liquid cannot enter the mainboard area after staying at the aluminum-plastic position (such as Figure 17 As shown by the dotted wavy arrow in the figure, water vapor circulates inside and cannot enter the motherboard area). In addition, liquid can enter from the plastic surface 200 on the right side of the first connecting part 222. However, there is a certain effective width between the plastic surface 200 on the right side of the first connecting part 222 and the back adhesive surface. Therefore, the liquid cannot enter the position of the second connecting part 244, thereby forming an aluminum-plastic staggered waterproof structure. At the same time, the first connecting part 222 and the second connecting part 244 are disconnected, forming an antenna break.

[0079] like Figure 5 As shown, the manufacturing process of the frame 1 is as follows: Starting from sequence number ①, metal profiles or metal ingots are die-cast or CNC (Computer Numerical Control) processed to form sequence number ②, then injection molded to form sequence number ③. Finally, CNC machining is used to remove the connecting material and other structures to form sequence number ④. At this time, the antenna breakpoint (i.e., break 26) and the staggered aluminum-plastic waterproof structure are also formed. Sequence number ⑤ shows the assembly diagram of the waterproof adhesive, light guide 42, and frame 1.

[0080] Specifically, if Figure 6 、 Figure 7 and Figure 8 As shown, the die casting process (usually die casting process, CNC or other processes can also be used) forms the continuous material metal, which plays the role of injection molding reinforcement. The second radiator 24 is provided with a clearance groove 240, which can achieve the avoidance of the second radiator 24 to the plastic part 20 around the through hole 28 after subsequent CNC processing. Figure 9 As shown, the metal part and the plastic part 20 are then formed into an injection molded body by mold injection. In this process, the injection molded structure has the antenna metal connecting material structure 6 and the plastic part 20. Figure 10、 Figure 11 、 Figure 12 、 Figure 13 and Figure 14 As shown, the adhesive surface 3 of the waterproof adhesive is formed by CNC processing. Optionally, a gap 240 is prepared to form an arc-shaped adhesive surface 3, thereby forming a waterproof structure with aluminum and plastic staggered, and forming an antenna gap. Figure 15 and Figure 16 As shown, the cover 40 of the infrared sensor is assembled to the frame 1, and the light guide 42 is assembled on the cover 40 by rotating clockwise. Optionally, a mounting area 7 is provided on the frame 1 for installing screws to fix the infrared sensor to the frame 1.

[0081] Specifically, if Figure 17 and Figure 18 As shown, the external liquid enters the through hole 28 along the arrow at the through hole 28 and reaches the first connecting part 222. Due to the poor bonding strength between the aluminum and plastic in the integrated plastic middle frame, the liquid will also enter the first connecting part 222 and the aluminum-plastic position between them (for example Figure 17 and Figure 18 Therefore, the actual first connecting portion 222 cannot block external liquids, but the plastic surface 200 on the left side of the first connecting portion 222 and the waterproof adhesive have a certain effective waterproof width, so Figure 17 The liquid at the position indicated by the dotted wavy arrow in the figure cannot enter the interior of the device due to the resistance of the bonding width between the waterproof adhesive and the plastic part 20, thus ensuring the waterproof effect.

[0082] Specifically, if Figure 19 and Figure 20 As shown, the external liquid along Figure 19 The arrow at the through hole 28 enters the through hole 28 and reaches the plastic surface 200 on the right side of the through hole 28 (that is, the side of the through hole 28 close to the second connecting portion 244). Since there is a certain effective waterproof width between the plastic surface 200 on the right side of the through hole 28 and the waterproof adhesive, Figure 19 Liquid at the location indicated by the dashed wavy arrow is prevented from entering the device due to resistance from the combined width of the waterproof adhesive and plastic surface 200. Due to the presence of antenna gaps (e.g., gap 26), which are filled with plastic component 20, liquid is prevented from entering the connection between the second connecting portion 244 and the plastic component 20, thus forming a waterproof structure. Furthermore, the presence of the airtight groove 240 ensures that the effective waterproof width of the plastic surface 200 on the right side of the first connecting portion 222 meets the required waterproof resistance length, thus ensuring a waterproof effect.

[0083] The electronic device proposed in this application utilizes an aluminum-plastic interlaced waterproofing structure, suitable for antenna slot locations, facilitating spatial arrangement. A clockwise assembly method also allows for a more compact design, making it suitable for structures equipped with front lights and auxiliary MICs (microphones). The frame 1 is manufactured using CNC machining, eliminating the need for an inverted mold, facilitating assembly and waterproofing consistency.

[0084] Optionally, the electronic device includes a mobile phone, a watch, a tablet computer, etc.

[0085] Optionally, the sensing element 4 may be an infrared remote control sensor or other sensors.

[0086] Optionally, the electronic device proposed in this application can achieve a higher waterproof structure such as IP68, IP69, etc.

[0087] Throughout this specification, reference to terms such as "one embodiment," "some embodiments," "illustrative embodiments," "examples," "specific examples," or "some examples" means that the specific features, structures, materials, or characteristics described in conjunction with the embodiment or example are included in at least one embodiment or example of the present application. In this specification, the illustrative expressions of the above terms do not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples.

[0088] Although the embodiments of the present application have been shown and described, those skilled in the art will appreciate that various changes, modifications, substitutions, and variations may be made to the embodiments without departing from the principles and intent of the present application, and that the scope of the present application is defined by the claims and their equivalents.

Claims

1. An electronic device, characterized in that: include: A frame and a sensor element, wherein the frame includes a frame, the frame includes a plastic component, a first radiator and a second radiator, the first radiator and the second radiator are embedded in the plastic component, the plastic component forms a plastic surface on the inner side of the frame, the first radiator includes a first metal surface, the second radiator includes a second metal surface, the first metal surface and the second metal surface are both exposed on the plastic surface on the inner side of the frame, a gap is provided between the first radiator and the second radiator, and the plastic component fills the gap; In which, the frame is provided with a through hole and a bonding surface, the through hole is at least partially provided at the fracture, the bonding surface at least includes the first metal surface and the plastic surface, and the plastic surface corresponding to the bonding surface surrounds the first metal surface and the through hole, and the sensing element is bonded to the bonding surface and arranged opposite to the through hole.

2. The electronic device according to claim 1, wherein Also includes: An adhesive component, through which the sensing element is bonded to the bonding surface, and the adhesive component at least covers the first metal surface, the plastic surface, and a connection between the first metal surface and the plastic surface.

3. The electronic device according to claim 2, wherein: Along the circumference of the through hole, the width of the adhesive member bonded to the plastic surface is greater than or equal to a preset width.

4. The electronic device according to claim 1, wherein: The second metal surface and the inner wall surface of the through hole are spaced apart by the plastic surface.

5. The electronic device according to claim 1, wherein The second radiator is provided with an air-avoiding groove, the air-avoiding groove is recessed from the second metal surface into the second radiator, and the air-avoiding groove extends to an end of the second radiator close to the first radiator; The air-avoiding groove is filled with the plastic part to form a part of the bonding surface.

6. The electronic device according to claim 5, characterized in that The wall surface of the air-avoiding groove is arranged in an arc shape along the circumference of the through hole.

7. The electronic device according to claim 1, wherein: The bonding surface also includes at least a portion of the second metal surface; The first metal surface, the second metal surface and the plastic surface corresponding to the bonding surface are arranged flush on the inner side of the frame.

8. The electronic device according to any one of claims 1 to 7, characterized in that: The first radiator includes: a first radiating portion, embedded in the plastic component; a first connecting portion provided on the first radiating portion, the first connecting portion being embedded in the plastic component and exposed from the plastic component on the inner side of the frame to form the first metal surface, the first radiating portion and the first connecting portion being disconnected from the second radiator at the break; Part of the through hole passes through the first radiation portion and the first connecting portion, so that the first metal surface is arranged in the circumference of the through hole, and another part of the through hole passes through the plastic component.

9. The electronic device according to any one of claims 1 to 7, characterized in that: The second radiator includes: a second radiating portion embedded in the plastic component; a second connecting portion, provided on the second radiating portion, the second connecting portion being embedded in the plastic component and exposed from the plastic component on the inner side of the frame to form the second metal surface; The second radiating portion and the second connecting portion are both disconnected from the first radiator at the break.

10. The electronic device according to any one of claims 1 to 7, characterized in that: The sensing element comprises: a cover body, the cover body being bonded to the bonding surface; The light guide column is provided on the cover body and is arranged opposite to the through hole. The light guide column and the cover body are sealed and connected.

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