Recyclable damping tray for semiconductor equipment

Abstract

The invention discloses a semiconductor equipment damping tray capable of being recycled, and aims to solve the damping and fixing problems of semiconductor equipment in the transportation and installation process. The shock absorption tray takes a tray main body as a bearing foundation, the upper end face of the shock absorption tray is provided with guide rails with adjustable mounting positions and quantity, and two ends of the guide rails are provided with through limiting hole channels and are mounted through connecting bolts; the sliding blocks with adjustable positions are in sliding fit with the guide rails and are connected with the damping blocks through bolts, so that vibration energy can be effectively absorbed and buffered; a top plate connected with the tray main body through connecting bolts is placed on the damping blocks, the top plate is provided with a right-angle limiting structure, and semiconductor equipment is bundled and fixed by a packing belt after being placed on the top plate; during dismantling, the connecting bolts of the top plate and the tray body are firstly dismantled, then the connecting bolts of the tray body and the guide rails are dismantled, and finally the guide rails, the sliding blocks and the damping blocks are integrally packaged and recycled. The device is simple in structure, convenient to adjust, good in damping effect, easy and convenient to disassemble, convenient to recycle and suitable for semiconductor devices of different sizes and weights.

Description

Technical Field

[0001] The present invention relates to the technical field of semiconductor equipment transportation and installation, and in particular to a recyclable shock-absorbing tray for semiconductor equipment. Background Art

[0002] In the semiconductor manufacturing industry, the precision and stability of semiconductor equipment are crucial to the success of the production process. These devices are often expensive and contain numerous sophisticated electronic components and mechanical structures, making them extremely sensitive to vibration. During transportation, handling, and installation, these devices are inevitably subject to various vibrations and shocks, such as vehicle jolting, shaking during handling, and collisions during installation. If these vibrations and shocks are directly transmitted to the semiconductor equipment, they can damage internal components, loosen connections, and reduce precision, severely impacting the equipment's performance and reliability, and may even render the equipment obsolete, resulting in significant financial losses for the company.

[0003] Currently, there are several shock-absorbing pallets on the market for transporting and installing semiconductor equipment, but these pallets have numerous shortcomings. Some have a fixed structure and cannot be flexibly adjusted to suit the size of different semiconductor equipment. For example, when handling large equipment, the pallet's load-bearing area is insufficient, resulting in unstable placement of the equipment. Meanwhile, for smaller equipment, they cannot provide precise securing and shock-absorbing protection. Furthermore, some shock-absorbing pallets have limited shock absorption and cannot effectively absorb and buffer vibration energy of varying intensities and frequencies, failing to meet the stringent shock absorption requirements of semiconductor equipment.

[0004] Some shock-absorbing pallets are complex to install and remove, requiring significant time and manpower. Dismantling often requires disassembling individual components, which is not only inefficient but also prone to component loss and damage, hindering pallet recycling and reuse. This not only increases operating costs for businesses but also violates environmental and resource conservation principles.

[0005] Therefore, it is of great practical significance to develop a shock-absorbing tray for semiconductor equipment that has a simple structure, is easy to adjust, has a good shock-absorbing effect, is easy to dismantle, and is easy to recycle. Summary of the Invention

[0006] The purpose of the present invention is to provide a recyclable shock-absorbing tray for semiconductor equipment. The shock-absorbing tray has a simple structure, is easy to adjust, can be flexibly adjusted according to the size and weight of the semiconductor equipment, and has a simple disassembly process and is easy to recycle.

[0007] To achieve the above objectives, the present invention provides the following technical solutions:

[0008] A recyclable shock-absorbing tray for semiconductor equipment includes a tray body serving as a supporting base for the entire shock-absorbing tray;

[0009] The upper end surface of the tray body is provided with at least two mutually parallel guide rails, and two ends of the guide rails are respectively provided with through-limiting holes perpendicular to the guide rails, and the guide rails are adjustably mounted on the through-limiting holes of the tray body by connecting bolts;

[0010] A plurality of sliders are slidably fitted on each guide rail, and the positions of the sliders on the guide rails are adjustable;

[0011] Each of the sliders is tightly connected to a shock-absorbing block by bolts, which is used to absorb and buffer the vibration energy generated by the semiconductor equipment during transportation and installation;

[0012] A top plate is placed on the shock-absorbing block, and the top plate is firmly connected to the tray body through connecting bolts. The semiconductor device is placed on the top plate, and the device and the top plate are fixed by strapping with a packing tape.

[0013] Furthermore, the length of the guide rail and the installation position on the tray body are adjusted according to the size of the semiconductor device, and the number of the guide rail, the shock-absorbing blocks, and the sliding blocks are increased or decreased according to the weight of the semiconductor device.

[0014] Furthermore, the shock-absorbing block is adhered to an iron plate, and the iron plate is connected to the slider via bolts.

[0015] Furthermore, the connecting bolts between the top plate and the tray body are vertically movable positioning connecting bolts.

[0016] Furthermore, a plurality of right-angle limiting structures are provided on the top plate for performing preliminary positioning of the semiconductor device placed on the top plate to prevent displacement of the device during transportation.

[0017] Furthermore, the steps for removing the shock-absorbing tray of the semiconductor device are as follows:

[0018] First, remove the connecting bolts between the top plate and the pallet body;

[0019] Next, remove the connecting bolts between the pallet body and the guide rails;

[0020] Finally, the guide rails, sliders and shock absorbers are packaged and recycled as a whole without having to be disassembled.

[0021] The semiconductor equipment shock-absorbing tray of the present invention has the following beneficial effects:

[0022] Simple structure and easy adjustment: By adjusting the length, installation position and number of the guide rails, it can adapt to semiconductor equipment of different sizes and weights, improving the versatility of the shock-absorbing tray.

[0023] Good shock absorption effect: The shock-absorbing blocks can effectively absorb and buffer the vibration energy generated by semiconductor equipment during transportation and installation, protecting the equipment from damage.

[0024] Easy to dismantle and recycle: The dismantling process is simple. You only need to remove the connecting bolts and pack the guide rails, sliders and shock absorbers as a whole for recycling without disassembly, which improves recycling efficiency. BRIEF DESCRIPTION OF THE DRAWINGS

[0025] Figure 1 This is a schematic diagram of the overall structure of a recyclable shock-absorbing tray for semiconductor equipment according to the present invention;

[0026] Figure 2 Schematic diagram of the installation of guide rails and sliders for the shock-absorbing tray of semiconductor equipment;

[0027] Figure 3 Schematic diagram of the installation of shock-absorbing blocks for the shock-absorbing tray of semiconductor equipment;

[0028] Figure 4 This is a reference diagram of the use of a shock-absorbing tray for semiconductor equipment. DETAILED DESCRIPTION

[0029] To make the objectives, technical solutions, and advantages of the embodiments of the present invention more clear, the technical solutions of the embodiments of the present invention will be clearly and completely described below in conjunction with the accompanying drawings of the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Generally, the components of the embodiments of the present invention described and shown in the drawings herein can be arranged and designed in various different configurations.

[0030] In the description of the embodiments of the present invention, "a plurality of" means at least two.

[0031] In the description of the embodiments of the present invention, it should be noted that, unless otherwise expressly specified or limited, the terms "disposed," "installed," "connected," and "connected" should be understood in a broad sense. For example, they can refer to fixed connections, detachable connections, or integral connections; they can refer to mechanical connections or electrical connections; they can refer to direct connections or indirect connections through an intermediate medium; and they can refer to internal connections between two components. Those skilled in the art will understand the specific meanings of the above terms in the present invention based on specific circumstances.

[0032] The present invention provides a recyclable shock-absorbing tray for semiconductor equipment, which is characterized by:

[0033] The invention comprises a pallet body 1 which serves as a bearing base for the entire shock-absorbing pallet;

[0034] The upper end surface of the tray body 1 is provided with at least two mutually parallel guide rails 2. The length of the guide rails 2 and their installation position on the tray body 1 can be adjusted according to the size of the semiconductor device 300. For example, if the semiconductor device is long, a longer guide rail can be selected and installed in a suitable position on the tray body to ensure stable placement of the device. At the same time, the number of guide rails can also be increased or decreased based on the weight of the semiconductor device. If the device is heavy, the number of guide rails can be increased to enhance the load-bearing capacity and stability.

[0035] The corresponding two ends of the guide rail 2 are respectively provided with a through-limiting hole 3 perpendicular to the guide rail 2. The guide rail 2 is adjustably installed on the through-limiting hole 3 of the tray body 1 through the connecting bolt 100. During installation, the mounting holes at both ends of the guide rail 2 are placed correspondingly on the through-limiting hole, and then the guide rail is firmly connected to the tray body using the connecting bolts. By adjusting the position of the connecting bolts in the through-limiting hole, the installation position of the guide rail can be adjusted to meet the installation requirements of equipment of different sizes.

[0036] There are multiple sliders 4 slidingly fitted on each guide rail 2. The position of the slider 4 on the guide rail 2 is adjustable. According to the specific shape and center of gravity distribution of the semiconductor device 300, the position of the slider 4 on the guide rail 2 can be adjusted so that the shock-absorbing block 5 can accurately support the key parts of the device.

[0037] Each slider 4 is tightly bolted to a damping block 5. Specifically, the damping block 5 is first glued to a metal plate, which is then bolted to the slider 4. Made of a material with excellent shock-absorbing properties, such as rubber or other composite damping materials, the damping block 5 effectively absorbs and buffers the vibration energy generated during the transportation and installation of semiconductor equipment. For example, if the road surface is bumpy during transportation, the damping block can convert the vibration energy into other forms of energy, such as heat, through its own elastic deformation, thereby reducing the vibration transmitted to the semiconductor equipment.

[0038] A top plate 6 is placed on the shock-absorbing block 5 , and the top plate 6 is firmly connected to the tray body 1 through connecting bolts 200 . The top plate 6 provides a stable placement platform for the semiconductor device 300 .

[0039] A plurality of right-angle limiting structures 7 are provided on the top plate 6 for preliminary positioning of the semiconductor device 300 placed on the top plate 6 to prevent displacement of the device during transportation. When the semiconductor device is placed on the top plate, the right-angle limiting structure can clamp the edge of the device to keep the device in a fixed position.

[0040] After the semiconductor device 300 is placed on the top plate 6 , the device is strapped and fixed to the top plate 6 using a strapping tape 400 to ensure that the device does not shake or shift during transportation and installation.

[0041] Practical application examples:

[0042] Suppose a large and heavy semiconductor device needs to be transported and installed.

[0043] First, select a guide rail of appropriate length based on the size of the equipment and install it on the through-limiting hole of the pallet body. After adjusting the position of the guide rail, secure it with connecting bolts. Due to the heavy equipment, increase the number of guide rails to three to improve the load-bearing capacity.

[0044] Next, install the slider on the guide rail and adjust the position of the slider according to the center of gravity distribution of the equipment so that the shock absorber on the slider can accurately support the key bottom part of the equipment. Connect the shock absorber to the slider tightly with bolts.

[0045] Then, place the top plate on the shock-absorbing block and firmly connect the top plate to the pallet body with connecting bolts (this bolt is a special bolt with an integrated upper and lower movable shaft, that is, an upper and lower movable positioning connecting bolt). Place the semiconductor device on the top plate, use the right-angle limit structure on the top plate to preliminarily position the device, and finally use strapping tape to tie the device to the top plate.

[0046] During transportation, the shock-absorbing blocks effectively absorb the vibrations generated by the vehicle while the right-angle limit structure and packing tape ensure the stability of the equipment, allowing it to arrive safely at the installation site.

[0047] Pallet removal

[0048] After the semiconductor equipment is installed, the pallet needs to be removed.

[0049] First, remove the connecting bolts between the top plate and the pallet body, and remove the top plate.

[0050] Next, remove the connecting bolts between the pallet body and the guide rail to separate the guide rail from the pallet body;

[0051] Finally, the guide rails, sliders and shock absorbers are packaged and recycled as a whole without having to be disassembled, making it convenient for subsequent reuse or maintenance.

[0052] Through the above specific embodiments, the semiconductor equipment shock-absorbing tray of the present invention can provide reliable protection for semiconductor equipment, and has the advantages of easy adjustment and easy disassembly, and has broad application prospects.

[0053] The present invention and its embodiments are described above. This description is not restrictive. The drawings show only one embodiment of the present invention, and the actual structure is not limited thereto. In short, if a person skilled in the art is inspired by this and, without departing from the purpose of the present invention, designs structures and embodiments similar to this technical solution without inventiveness, they shall fall within the scope of protection of the present invention.

Claims

1. A recyclable shock-absorbing tray for semiconductor equipment, characterized by: It includes a pallet body that serves as the bearing base of the entire shock-absorbing pallet; The upper end surface of the tray body is provided with at least two mutually parallel guide rails, and two ends of the guide rails are respectively provided with through-limiting holes perpendicular to the guide rails, and the guide rails are adjustably mounted on the through-limiting holes of the tray body by connecting bolts; A plurality of sliders are slidably fitted on each guide rail, and the positions of the sliders on the guide rails are adjustable; Each of the sliders is tightly connected to a shock-absorbing block by bolts, which is used to absorb and buffer the vibration energy generated by the semiconductor equipment during transportation and installation; A top plate is placed on the shock-absorbing block, and the top plate is firmly connected to the tray body through connecting bolts. The semiconductor device is placed on the top plate, and the device and the top plate are fixed by strapping with a packing tape.

2. The recyclable shock-absorbing tray for semiconductor equipment according to claim 1, characterized in that: The length of the guide rail and the installation position on the tray body are adjusted according to the size of the semiconductor device, and the number of the guide rail, the shock-absorbing block and the sliding block is increased or decreased according to the weight of the semiconductor device.

3. The recyclable shock-absorbing tray for semiconductor equipment according to claim 1, characterized in that: The shock-absorbing block is adhered to an iron plate, and the iron plate is connected to the sliding block through bolts.

4. The recyclable shock-absorbing tray for semiconductor equipment according to claim 1, characterized in that: The connecting bolts between the top plate and the tray body are vertically movable positioning connecting bolts.

5. The recyclable shock-absorbing tray for semiconductor equipment according to claim 1, characterized in that: The top plate is provided with a plurality of right-angle limiting structures for performing preliminary positioning of the semiconductor device placed on the top plate to prevent displacement of the device during transportation.

6. The recyclable shock-absorbing tray for semiconductor equipment according to claim 1, characterized in that: The steps for removing the semiconductor equipment shock-absorbing tray are as follows: First, remove the connecting bolts between the top plate and the pallet body; Next, remove the connecting bolts between the pallet body and the guide rails; Finally, the guide rails, sliders and shock absorbers are packaged and recycled as a whole without having to be disassembled.

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