Microstructure preparation equipment and microstructure preparation method

Abstract

The invention discloses microstructure preparation equipment and a microstructure preparation method. The microstructure preparation method comprises the following steps: providing a container filled with a particle suspension and a base material with a hydrophilic interface; placing the provided substrate at least partially in the particle suspension in the container; and evaporating the particle suspension in the container to deposit suspended particles in the particle suspension on the hydrophilic interface of the substrate so as to form a target microstructure on the surface of the substrate. In one embodiment, at least a portion of a substrate having a hydrophilic interface is placed into a particle suspension in a container by preparing the particle suspension. Then, the particle suspension liquid in the container is evaporated, so that the needed target microstructure is generated on the hydrophilic interface of the base material, and the deposition time can be adjusted to control the height of the deposited microstructure. Therefore, by adopting the manufacturing method for the target microstructure, the production process of the target microstructure is relatively simple, and the cost is low.

Description

Technical Field

[0001] The present invention relates to the technical field of microstructure preparation, and in particular to a microstructure preparation device and a microstructure preparation method. Background Art

[0002] In modern science and technology, the demand for microstructures is increasing across a wide range of applications, from microelectronics manufacturing, advanced thermal management technologies, biomedical engineering, to microelectromechanical systems (MEMS). Precision fabrication of microstructures plays a key role in improving product performance and achieving specific functions. For example, in microelectronics, tiny and precise structures can increase chip integration and computing speed. In biomedicine, microstructures can be used to construct scaffolds that mimic cellular microenvironments, promoting cell growth and tissue repair.

[0003] In related technologies, the preparation of microstructures can usually be completed using large-scale equipment such as photolithography machines and 3D printers, and the main preparation methods include the pulling method, the spin method, and the electrostatic force method.

[0004] However, in the process of realizing the present invention, the inventors discovered that the prior art has at least the following problems: the production of the microstructure has defects such as complicated process, high cost, and large material loss. Summary of the Invention

[0005] The present invention aims to solve at least one of the technical problems existing in the prior art. To this end, the present invention provides a microstructure preparation method, which facilitates the production of microstructures on the surface of a substrate.

[0006] In a first aspect, an embodiment of the present application provides a method for preparing a microstructure, comprising:

[0007] A container containing a particle suspension and a substrate having a hydrophilic interface are prepared;

[0008] placing at least a portion of the prepared substrate in the container and contacting the substrate with a heating element placed in the container;

[0009] The heating element is controlled to heat the substrate so as to deposit the suspended particles in the particle suspension on the surface of the substrate to form a target microstructure on the surface of the substrate.

[0010] According to some embodiments of the present invention, before controlling the heating element to heat the substrate, the preparation method includes:

[0011] placing the container in a reaction chamber;

[0012] Adjusting the temperature of the heating element to adjust the evaporation effect on the particle suspension; or,

[0013] The wind speed at the suction port of the reaction chamber is adjusted to form a stable flow field inside the reaction chamber.

[0014] According to some embodiments of the present invention, if the wind speed at the suction port of the reaction chamber is adjusted, the wind speed at the suction port of the reaction chamber is between 0.3 and 0.8 m / s.

[0015] According to some embodiments of the present invention, the temperature of the heating element is set between 20°C and 100°C.

[0016] According to some embodiments of the present invention, during the evaporation of the container, the preparation method further comprises:

[0017] Obtaining the current liquid level in the container in real time;

[0018] Liquid is replenished or drawn into the container in real time according to the current liquid level, so that the liquid level in the container decreases at a set speed.

[0019] According to some embodiments of the present invention, the set speed is set between 5 μm / s and 500 μm / s.

[0020] In a second aspect, an embodiment of the present application provides a microstructure preparation device for use in the above-mentioned microstructure preparation method; wherein, the microstructure preparation device includes a reaction device, and the reaction device is provided with a reaction chamber for placing a container containing a particle suspension and a substrate.

[0021] According to some embodiments of the present invention, the reaction device is provided with a temperature detector and a temperature regulating device, wherein the temperature detector is used to detect the temperature of the heating element, and the temperature regulating device regulates the evaporation temperature of the heating element based on the temperature detected by the temperature detector; and / or,

[0022] The reaction device is provided with an air pressure sensor and a vacuum pump. The air pressure sensor is used to detect the vacuum degree of the reaction chamber. The vacuum pump controls the vacuum degree of the reaction chamber based on the pressure value detected by the pressure sensor.

[0023] According to some embodiments of the present invention, the reaction device further includes a liquid level detection sensor and a liquid supply device, wherein the liquid level detection sensor is used to detect the current liquid level height of the particle suspension in the container in real time, and the liquid supply device replenishes or draws liquid into the container based on the current liquid level height so that the liquid level height in the container decreases at a set speed.

[0024] According to some embodiments of the present invention, the liquid level detection sensor is a pressure sensor located at the bottom of the container, which is used to detect the downward pressure of the container in real time to determine the change of the liquid level in the container.

[0025] It can be seen from the above technical solutions that the embodiments of the present application have the following advantages: the present application modulates a particle suspension and places at least a portion of a substrate having a hydrophilic interface into the particle suspension in a container. Then, the particle suspension in the container is evaporated to generate the required microstructure on the hydrophilic interface of the substrate. It can be seen that the microstructure adopts the above-mentioned production method, and the production process of the microstructure is relatively simple and low-cost. Moreover, during the evaporation process, the particle suspension can be fully and evenly coated on the hydrophilic interface of the substrate. Even if there are particles remaining in the container, they can be easily reused, avoiding the waste of particles and reducing the loss of materials.

[0026] In addition, the microstructure preparation method can form the required microstructure on various complex hydrophilic interfaces of substrates. For example, the required microstructure can be formed on the uneven hydrophilic interface of the substrate, which is difficult to accomplish with existing large and complex equipment such as photolithography machines and 3D printers. BRIEF DESCRIPTION OF THE DRAWINGS

[0027] Figure 1 Schematic diagram of the process structure of the microstructure preparation method according to an embodiment of the present invention;

[0028] Figure 2 Schematic diagram of the overall structure of the microstructure preparation equipment according to an embodiment of the present invention. DETAILED DESCRIPTION

[0029] The following describes embodiments of the present invention in detail. Examples of the embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals throughout represent the same or similar elements or elements having the same or similar functions. The embodiments described below with reference to the accompanying drawings are exemplary and are intended only to explain the present invention and are not to be construed as limiting the present invention.

[0030] In the description of the present invention, it should be understood that descriptions involving orientations, such as up, down, front, back, upper, lower, etc., indicating orientations or positional relationships, are based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the present invention.

[0031] In the description of the present invention, "several" means more than one, "plurality" means more than two, "greater than," "less than," and "exceed" are understood to exclude the number itself, while "above," "below," and "within" are understood to include the number itself. The use of "first" and "second" in the description is solely for the purpose of distinguishing technical features and should not be construed as indicating or implying relative importance, implicitly specifying the number of the indicated technical features, or implicitly specifying the order of the indicated technical features.

[0032] In the description of the present invention, unless otherwise clearly defined, terms such as setting, installing, and connecting should be understood in a broad sense, and technicians in the relevant technical field can reasonably determine the specific meanings of the above terms in the present invention based on the specific content of the technical solution.

[0033] In the description of the present invention, reference to terms such as "one embodiment," "some embodiments," "illustrative embodiments," "examples," "specific examples," or "some examples" means that the specific features, structures, materials, or characteristics described in conjunction with the embodiment or example are included in at least one embodiment or example of the present invention. In this specification, the exemplary expressions of the above terms do not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples.

[0034] The present invention will be further described in detail below with reference to the accompanying drawings.

[0035] See also Figures 1 to 2 , a microstructure preparation method provided by an embodiment of the present invention, wherein the microstructure is set between 10μm and 1000μm. The microstructure preparation method includes:

[0036] S100 provides a container containing a particle suspension 4 and a substrate 3 having a hydrophilic interface.

[0037] The particle suspension 4 is a liquid containing particles. The particle size is set between 50 nm and 500 nm, but is not limited to being set only between 50 nm and 500 nm. The particle size can be set according to actual needs. For example, the particle size can be set as silicon dioxide, particulate matter, or other particles, but is not limited to being set only as silicon dioxide, particulate matter, or other particles.

[0038] In addition, the hydrophilic interface of the substrate 3 is not limited to the characteristics of the substrate 3 itself. For example, the substrate 3 is made of materials such as aluminum oxide and silicon oxide, which have good hydrophilicity. Therefore, the substrate 3 has a hydrophilic interface for generating the target microstructure; of course, the substrate 3 can also be selected from materials with poor hydrophilicity, but the substrate 3 needs to be hydrophilically treated. Specifically, it can be prepared through a variety of processing methods, such as laser etching, dry and wet etching, gas / liquid chemical deposition, etc., so that the substrate 3 has a hydrophilic interface for generating the target microstructure.

[0039] In S200 , the provided substrate 3 is at least partially placed in the particle suspension 4 in the container 2 .

[0040] The substrate 3 and the heating element 5 can be, but are not limited to, placed vertically within the container 2. The hydrophilic interface of the substrate 3 where the target microstructure is to be generated at least partially extends into the particle suspension 4 within the container 2. In other words, the particle suspension 4 should cover the area of ​​the substrate 3 where the target microstructure is to be generated. After the substrate 3 is placed, the container 2 is placed within the reaction chamber 1.

[0041] S300 evaporates the particle suspension 4 in the container 2 to deposit the suspended particles in the particle suspension 4 on the hydrophilic interface of the substrate 3 to form a target microstructure on the surface of the substrate 3 .

[0042] Wherein, evaporating the particle suspension 4 in the container 2 includes: heating the particle suspension 4 and / or the substrate 3 using a heating element 5 to evaporate the particle suspension 4 in the container 2 .

[0043] Specifically, after the substrate 3 is placed in the container 2, the particle suspension 4 in the container 2 is evaporated. At this point, the suspended particles are highly concentrated and deposited at the gas-liquid-solid three-phase contact line. As the liquid level of the particle suspension 4 in the container 2 gradually decreases, the particles in the particle suspension 4 gradually deposit on the hydrophilic interface of the substrate 3, thereby gradually forming the desired microstructure on the hydrophilic interface of the substrate 3. It is understood that during the evaporation process of the particle suspension 4, the particles can be well aggregated and arranged at the hydrophilic interface. Under the action of convection, the particles will form a tightly packed single-layer or multi-layer structure on the hydrophilic interface of the substrate 3, i.e., the desired microstructure to be generated on the substrate 3.

[0044] In summary, in steps S100 to S200, the present application modulates a particle suspension 4 and places at least a portion of the substrate 3 having a hydrophilic interface into the particle suspension 4 in the container 2. Then, the particle suspension 4 in the container 2 is evaporated to generate the desired microstructure on the hydrophilic interface of the substrate 3. It can be seen that the microstructure adopts the above-mentioned production method, and the production process of the microstructure is relatively simple and low-cost. Moreover, during the evaporation process, the particle suspension 4 can be fully and evenly coated on the hydrophilic interface of the substrate 3. Even if there are residual particles in the container 2, they can be easily reused, avoiding the waste of particles and reducing the loss of materials.

[0045] In addition, the microstructure preparation method can form the required microstructure on various more complex hydrophilic interfaces of the substrate 3. For example, the required microstructure can be formed on the uneven hydrophilic interface of the substrate 3, which is difficult to accomplish with existing large and complex equipment such as photolithography machines and 3D printers.

[0046] In some embodiments, evaporating the particle suspension 4 in the container 2 includes heating the particle suspension 4 and / or the substrate 3 using a heating element 5 to evaporate the particle suspension 4 in the container 2 .

[0047] In one possible embodiment, the heating element 5 is attached to the substrate 3. After the substrate 3 and the heating element 5 are placed in the container 2, the staff places the container 2 in the reaction chamber 1, and the reaction chamber 1 is adjusted to the required suction wind speed. The temperature of the heating element 5 is adjusted to the required temperature. The heating element 5 increases the temperature of the substrate 3, and the substrate 3 evaporates the particle suspension. At this time, the suspended particles are highly concentrated and deposited at the gas-liquid-solid three-phase contact line. As the liquid level of the particle suspension 4 in the container 2 gradually decreases, the particles in the particle suspension 4 gradually deposit on the hydrophilic interface of the substrate 3, thereby gradually forming the required target microstructure on the hydrophilic interface of the substrate 3. It can be understood that during the evaporation process of the particle suspension 4, the particles can be better aggregated and arranged at the hydrophilic interface. The particles will form a tightly arranged single-layer or multi-layer structure on the hydrophilic interface of the substrate 3 under the action of convection, that is, the target microstructure to be generated on the substrate 3.

[0048] Thus, the present application modulates the particle suspension 4 so that at least a portion of the substrate 3 having a hydrophilic interface is placed in the particle suspension 4 in the container 2. Then, the heating element 5 evaporates the particle suspension 4 in the container 2 through the substrate 3, and the particles in the particle suspension 4 are deposited on the hydrophilic interface of the substrate, thereby generating the required target microstructure on the hydrophilic interface of the substrate 3. It can be seen that the target microstructure adopts the above-mentioned preparation method, and the production process of the target microstructure is simpler and has low cost. Moreover, the particle suspension 4 can be fully and evenly coated on the hydrophilic interface of the substrate 3 during the evaporation process, and even if the particulate matter remains in the container 2, it can be easily reused, thereby avoiding the waste of particulate matter and reducing the loss of material. In addition, the heating element 5 also evaporates the particle suspension 4 while heating the substrate 3, thereby better controlling the liquid level in the particle suspension 4, and then forming the required target microstructure at the required position of the hydrophilic interface of the substrate 3.

[0049] In other possible embodiments, an evaporation device may be used to evaporate the particle suspension 4; or, the heating element 5 may be used to evaporate only the suspended particle liquid 4; or, the heating element 5 may be used to heat only the substrate 3.

[0050] In a specific embodiment, before or during evaporation of the container 2, the preparation method includes:

[0051] The container is placed in the reaction chamber 1 .

[0052] The heating temperature of the heating element 5 is adjusted to adjust the evaporation effect on the particle suspension 4 .

[0053] Specifically, when the heating element 5 is less effective at evaporating the particle suspension 4, the operator adjusts the evaporation temperature of the heating element 5. According to the theory of molecular motion, as the temperature increases, the average kinetic energy of the liquid molecules increases, allowing more water molecules to have sufficient energy to overcome the binding force of the liquid's oxygen-philic interface and escape from the liquid surface into the vapor phase, thereby accelerating the evaporation rate. As a result, the particles in the particle suspension 4 are rapidly deposited on the hydrophilic interface of the substrate 3. Of course, if the particle suspension 4 in the container 2 evaporates too quickly, the operator can reduce the evaporation temperature of the heating element 5, thereby reducing the evaporation rate of the particle suspension 4 and ensuring that the particles are evenly deposited on the hydrophilic interface of the substrate 3.

[0054] In a specific embodiment, before or during evaporation of the container 2, the preparation method includes:

[0055] The container is placed in the reaction chamber.

[0056] The wind speed at the suction port of the reaction chamber is adjusted to form a stable flow field inside the reaction chamber.

[0057] Specifically, the reaction chamber 1 is capable of simultaneously adjusting the air velocity at the inlet and having a relatively stable internal flow field, providing the surrounding flow field required for the experimental area. With this arrangement, during the deposition of the particles, the temperature and surrounding flow field have little effect on the deposition of the particles, thereby ensuring that the particles can be uniformly deposited on the hydrophilic interface of the substrate 3, thereby avoiding uneven thickness of the target microstructure generated on the hydrophilic interface. Furthermore, during the deposition of the particles, a suitable surrounding flow field has little effect on the deposition structure and performance of the particles, thereby ensuring the structural and compact nature of the particles deposited on the hydrophilic interface, and thus ensuring the application performance of the generated target microstructure.

[0058] In addition, on the first aspect, the airflow design of the reaction chamber 1 helps to optimize the evaporation process of the particle suspension 4. Under the suction of the reaction chamber 1, the solvent in the particle suspension 4 can be volatilized more evenly, and the particles are deposited on the surface of the substrate 3 at a relatively stable rate. By adjusting the wind speed and evaporation time of the reaction chamber 1, the deposition rate of the particles and the thickness of the microstructure can be precisely controlled to meet the needs of high-precision applications. On the second aspect, the stable airflow provided by the reaction chamber 1 can optimize the deposition uniformity of the particles. Under the suction of the reaction chamber 1, the particles in the particle suspension 4 can move in a straight line to the surface of the substrate 3, reducing the aggregation or scattering of particles caused by air turbulence, thereby forming a target microstructure with uniform thickness and dense structure, and improving the consistency of the optical, electrical and mechanical properties of the microstructure.

[0059] In some embodiments, the air velocity at the inlet of the reaction chamber 1 is set between 0.3 and 0.8 m / s, and the air velocity at the inlet of the reaction chamber 1 is set at 0.3 m / s, 0.4 m / s, 0.5 m / s, 0.6 m / s, 0.7 m / s, and 0.8 m / s. It is understood that with the above-mentioned inlet air velocity, the particle suspension has a suitable surrounding flow field, thereby ensuring that the particle suspension 4 has a relatively suitable particle deposition on the substrate 3 during the evaporation process, thereby ensuring the formation of the target microstructure.

[0060] In some embodiments, the temperature of the heating element 5 is set between 20°C and 100°C, for example, the temperature of the heating element 5 is set at 20°C, 30°C, 40°C, 50°C, 60°C, 70°C, 80°C, or 100°C. In this manner, the temperature of the heating element 5 is appropriately set. It will be appreciated that the aforementioned evaporation temperature, particularly between 60°C and 80°C, ensures that the particles are deposited on the hydrophilic surface of the substrate 3 while also avoiding excessively high temperatures that could affect the deposition of the particles on the hydrophilic surface of the substrate 3, thereby ensuring a relatively uniform thickness of the target microstructure.

[0061] In some embodiments, during the evaporation of the container 2 in the above steps, the preparation method further includes steps A1-A2.

[0062] A1 obtains the current liquid level in the container 2 in real time.

[0063] In order to obtain the current liquid level in the container 2, a variety of methods can be used to obtain the information. For example, when the container 2 is placed in the reaction chamber 1, a pressure sensor, such as a PZT sensor, is placed at the bottom of the container 2. The pressure sensor can detect the gravity of the container 2 to determine the change in the gravity of the container 2, and further determine the change in the particle suspension 4 in the container 2. The control system can determine the change in the particle suspension 4 in the container 2 based on the change in the gravity of the particle suspension 4. Of course, an infrared sensor can also be used to monitor the current liquid level in the container 2.

[0064] A2 replenishes or extracts liquid from the container 2 in real time according to the current liquid level, so that the liquid level in the container 2 decreases at a set speed.

[0065] Specifically, as the heating element 5 evaporates the particle suspension 4 in the container 2, the particle suspension 4 in the container 2 gradually decreases. At this time, the detection system obtains in real time the change in the liquid level of the particle suspension 4 in the container 2, or more specifically, the rate at which the particle suspension 4 in the container 2 decreases. If the particle suspension 4 in the container 2 decreases at a rapid rate, the syringe pump 10 of the liquid supply device 9 can be used to promptly replenish liquid in the container 2, thereby ensuring that the particle suspension 4 in the container 2 decreases at a set rate. If the particle suspension 4 in the container 2 decreases at a slow rate, the syringe pump 10 of the liquid supply device 9 can be used to promptly remove the particle suspension 4 from the container 2, thereby ensuring that the particle suspension 4 in the container 2 decreases at a set rate.

[0066] It can be understood that during steps A1 to A2, when the heating element 5 evaporates the particle suspension 4 in the container 2, the injection pump 10 of the liquid supply device 9 performs real-time filling and replenishing of liquid according to the liquid level of the particle suspension 4 in the container 2, so that the particle suspension 4 in the container 2 descends at a set speed, and the particles in the particle suspension 4 can be evenly deposited on the hydrophilic interface of the substrate 3.

[0067] Furthermore, the liquid level descending speed of the particle suspension 4 is set between 5μm / s and 500μm / s. For example, the set speed is set at 5μm / s, 50μm / s, 100μm / s, 150μm / s, 200μm / s, 250μm / s, 300μm / s, 350μm / s, 400μm / s, 450μm / s, and 500μm / s. It is understandable that when the heating element 5 evaporates the particle suspension 4 in the container 2, the particle suspension in the container 2 descends at the above-mentioned set speed, and the descending speed of the particle suspension is appropriate, so that the particles in the particle suspension will not be deposited too much or too little at a certain position of the substrate 3, thereby ensuring that the particles deposited at each position of the hydrophilic interface are more appropriate, thereby ensuring that a uniform target microstructure can be formed subsequently.

[0068] See also Figures 1 to 2 The present application discloses a microstructure preparation device for use in the above-mentioned microstructure preparation method; wherein, the microstructure preparation device includes a reaction device, which is provided with a heating element 5 for patch heating and evaporation, and is used to place a container 2 containing a particle suspension 4 and a substrate 3.

[0069] It can be understood that the illustrated microstructure is prepared in the manner described above, that is, the present application modulates the particle suspension 4 and places at least a portion of the substrate 3 having a hydrophilic interface into the particle suspension 4 in the container 2. Then, the heating element 5 is used to evaporate the particle suspension 4 in the container 2, thereby generating the desired target microstructure on the hydrophilic interface of the substrate 3. It can be seen that the target microstructure adopts the above-mentioned production method, and the production process of the target microstructure is relatively simple and low-cost. It can be seen that the present application does not require more complex microstructure preparation equipment, such as only the reaction device heating element 5, etc., which further illustrates that the target microstructure adopts the above-mentioned production method, and the production process of the target microstructure is relatively simple and low-cost.

[0070] In a possible embodiment, the heating element 5 is provided with a temperature detector 7 and a temperature regulating device 8. The temperature detector 7 is used to detect the temperature of the heating element 5. The temperature regulating device 8 regulates the evaporation temperature of the heating element 5 based on the temperature detected by the temperature detector.

[0071] Specifically, while the heating element 5 is evaporating the particle suspension 4, the temperature detector 7 monitors the temperature of the heating element 5 in real time and transmits the information to the temperature control device 8. If the temperature of the heating element 5 increases, the temperature control device 8 lowers the temperature of the heating element 5, thereby maintaining the particle suspension 4 at a constant temperature. Similarly, if the temperature of the heating element 5 decreases, the temperature control device 8 increases the temperature of the heating element 5, thereby maintaining the particle suspension 4 at a constant temperature. It can be understood that the particle suspension 4 is maintained at a constant temperature during operation, thereby ensuring that the heating element 5 effectively evaporates the particle suspension 4 and, in turn, that the particle suspension 4 is uniformly deposited on the hydrophilic interface of the substrate 3.

[0072] In another possible embodiment, the reaction chamber 1 is provided with a wind speed sensor, which is used to detect the flow field velocity of the reaction chamber 1 . The reaction chamber 1 controls the surrounding flow field of the reaction chamber 1 based on the result detected by the wind speed sensor.

[0073] It is understood that, through the provision of the wind speed sensor, the reaction chamber 1 is able to adjust the wind speed at the inlet and have a relatively stable internal flow field, providing the surrounding flow field required for the experimental area. With this arrangement, during the deposition process of the particles, the surrounding flow field has little effect on the deposition of the particles, thereby ensuring that the particles can be evenly deposited on the hydrophilic interface of the substrate 3, thereby avoiding uneven thickness of the target microstructure generated on the hydrophilic interface. Furthermore, during the deposition process of the particles, the appropriate surrounding flow field has little effect on the deposition structure and performance of the particles, thereby ensuring the structural and compact nature of the particles deposited on the hydrophilic interface, thereby ensuring the application performance of the target microstructure generated.

[0074] In some embodiments, the reaction device also includes a liquid level detection sensor 6 and an injection pump 10 of a liquid supply device 9, wherein the liquid level detection sensor 6 is used to detect the current liquid level height of the particle suspension 4 in the container 2 in real time, and the injection pump 10 of the liquid supply device 9 replenishes or draws liquid into the container 2 based on the current liquid level height so that the liquid level height in the container 2 decreases at a set speed.

[0075] The liquid level detection sensor 6 is a pressure sensor disposed at the bottom of the container 2. The pressure sensor may be a PZT sensor for real-time detection of the weight of the container 2. The pressure sensor determines the current liquid level of the particle suspension 4 in the container 2 based on the gravity of the container 2. Specifically, the pressure sensor can detect the gravity of the container 2 to determine changes in the gravity of the container 2, and thus determine changes in the particle suspension 4 in the container 2. The control system can determine changes in the particle suspension 4 in the container 2 based on changes in the gravity of the particle suspension 4. Of course, an infrared sensor can also be used to monitor the current liquid level in the container 2.

[0076] Specifically, as the heating element 5 evaporates the particle suspension 4 in the container 2, the particle suspension 4 in the container 2 gradually decreases. At this time, the detection system obtains in real time the change in the liquid level of the particle suspension 4 in the container 2, or more specifically, the rate at which the particle suspension 4 in the container 2 decreases. If the particle suspension 4 in the container 2 decreases at a rapid rate, the syringe pump 10 of the liquid supply device 9 can be used to promptly replenish liquid in the container 2, thereby ensuring that the particle suspension 4 in the container 2 decreases at a set rate. If the particle suspension 4 in the container 2 decreases at a slow rate, the syringe pump 10 of the liquid supply device 9 can be used to promptly remove the particle suspension 4 from the container 2, thereby ensuring that the particle suspension 4 in the container 2 decreases at a set rate.

[0077] Furthermore, the microstructure preparation equipment also includes a synchronization signal generator 11, which synchronously controls the injection pump 10 of the liquid supply device 9 to replenish or extract liquid from the container 2 based on the current liquid level detected by the liquid level detection sensor 6.

[0078] Specifically, the synchronous control method of the synchronization signal generator 11 is: the PZT sensor monitors the liquid level of the particle suspension 4 in the container 2 in real time, and outputs a voltage signal when the liquid level changes. At this time, the synchronization signal generator 11 receives the voltage signal generated by the PZT sensor, sends a signal to the liquid level control device, and adjusts the liquid level rise and fall, so that the particle suspension 4 descends at a set speed to ensure the hydrophilicity of the particles at the hydrophilic interface of the substrate 3.

[0079] The technical means disclosed in the solutions of the present invention are not limited to those disclosed in the above-mentioned embodiments, but also include technical solutions composed of any combination of the above-mentioned technical features. It should be noted that those skilled in the art may make various improvements and modifications without departing from the principles of the present invention, and such improvements and modifications are also considered to be within the scope of protection of the present invention.

Claims

1. A method for preparing a microstructure, characterized in that: include: providing a container containing a particle suspension and a substrate having a hydrophilic interface; placing the provided substrate at least partially in the particle suspension in the container; The particle suspension in the container is evaporated to deposit the suspended particles in the particle suspension on the hydrophilic interface of the substrate to form a target microstructure on the surface of the substrate.

2. A microstructure preparation method according to claim 1, characterized in that: The evaporating the particle suspension in the container comprises: A heating element is used to heat the particle suspension and / or the substrate to evaporate the particle suspension in the container.

3. A microstructure preparation method according to claim 1, characterized in that: Before controlling the heating element to heat the substrate, the preparation method includes: placing the container in a reaction chamber; Adjusting the vacuum level of the reaction chamber to adjust the boiling point of the particle suspension; or Adjusting the heating temperature of the heating element to adjust the evaporation effect on the particle suspension; or, The wind speed at the suction port of the reaction chamber is adjusted to form a stable flow field inside the reaction chamber.

4. A microstructure preparation method according to claim 3, characterized in that: If the wind speed at the suction port of the reaction chamber is adjusted, the wind speed at the suction port of the reaction chamber is between 0.3 and 0.8 m / s; and / or the temperature of the heating element is set between 20° C. and 100° C.

5. The method for preparing a microstructure according to claim 1, wherein: During the evaporation process of the container, the preparation method further comprises: Obtaining the current liquid level in the container in real time; Liquid is replenished or drawn into the container in real time according to the current liquid level, so that the liquid level in the container decreases at a set speed.

6. A microstructure preparation method according to claim 6, characterized in that: The set speed is set between 5 μm / s and 500 μm / s.

7. A microstructure preparation device, characterized in that: Used for application in the microstructure preparation method according to any one of claims 1 to 6; wherein the microstructure preparation equipment includes a reaction device, and the reaction device is provided with a reaction chamber for placing a container containing a particle suspension and a substrate.

8. The microstructure preparation device according to claim 7, characterized in that: The reaction device is provided with a temperature detector and a temperature regulating device, wherein the temperature detector is used to detect the temperature of the heating element, and the temperature regulating device regulates the evaporation temperature of the heating element based on the temperature detected by the temperature detector; and / or, The reaction device is provided with an air pressure sensor and a vacuum pump. The air pressure sensor is used to detect the vacuum degree of the reaction chamber. The vacuum pump controls the vacuum degree of the reaction chamber based on the pressure value detected by the pressure sensor.

9. The microstructure preparation device according to claim 7, characterized in that: The reaction device also includes a liquid level detection sensor and a liquid supply device, wherein the liquid level detection sensor is used to detect the current liquid level height of the particle suspension in the container in real time, and the liquid supply device replenishes or draws liquid into the container based on the current liquid level height so that the liquid level height in the container decreases at a set speed.

10. The microstructure preparation device according to claim 9, characterized in that: The liquid level detection sensor is a pressure sensor located at the bottom of the container, and is used to detect the downward pressure of the container in real time to determine the change of the liquid level in the container.

Images