Physical vapor deposition device for high-precision intelligent chip film

Abstract

The invention relates to the technical field of chip processing, and discloses a physical vapor deposition device for a high-precision intelligent chip film, through the arrangement of a cleaning mechanism and a drying assembly, when the chips are cleaned, a plurality of chips can be placed in a plurality of carrying frames respectively and enter a cleaning barrel under the driving of a lifting rod, and the plurality of chips are cleaned at the same time; and in the cleaning process, the push rod on the object carrying frame can drive the cleaning brush roller to roll back and forth on the surface of the chip to clean and brush the surface of the chip, so that the cleaning effect of the chip is further improved, the coating quality of the chip during vacuum evaporation is improved, and after the chip is cleaned, the coating quality of the chip is improved. And the cleaning mechanism places the cleaned chip into the drying assembly for drying treatment, so that the surface of the wet chip is prevented from being oxidized and water spots are prevented from being formed, and the processing efficiency of the chip is further improved.

Description

Technical Field

[0001] The present invention relates to the field of chip processing technology, in particular to a physical vapor deposition device for high-precision smart chip films. Background Art

[0002] Physical vapor deposition (PVD) is a technique that vaporizes a material source under vacuum conditions and deposits it onto a substrate to form a functional thin film. It is widely used in surface treatment of materials such as metals, alloys, compounds, and semiconductors. PVD equipment used in semiconductor chip production often employs vacuum evaporation, which requires cleaning of the semiconductor chip before vacuum evaporation. Chinese patent CN108735580B discloses a physical vapor deposition device for semiconductor chip production, including a support base, a connecting frame, a placement frame, a first washing chamber and an inner shell, wherein a support frame is provided at the upper end of the support base, the connecting frame is fixed to the lower end of the hydraulic cylinder, and a first motor is provided on the inner side of the connecting frame, and a baffle is installed at the lower end of the connecting frame, a rotating shaft is provided at the lower end of the first motor, a water-permeable hole is reserved on the outer side of the placement frame, the first washing chamber is installed at the inner bottom end of the support frame, the inner shell is installed at the inner end of the outer shell, a second motor is installed at the lower end of the rotating block, and a waterproof cover is provided on the outer side of the second motor, grooves are reserved on both sides of the top of the water collecting tank, which improves the cleaning speed and cleaning effect of the semiconductor chips. However, the existing technology can only clean a single chip when cleaning the chip, and cannot clean multiple chips at the same time, thereby reducing the processing efficiency of the chip. Summary of the Invention

[0003] In view of the shortcomings of the existing technology, the present invention provides a physical vapor deposition device for high-precision smart chip film to overcome the above-mentioned technical problems existing in the existing related technology.

[0004] In order to solve the above technical problems, the present invention provides the following technical solutions: a physical vapor deposition device for high-precision smart chip film, comprising a cabinet, an upper support plate and a lower support plate are respectively installed in the cabinet, the upper support plate and the lower support plate divide the interior of the cabinet into three layers of upper, middle and lower in sequence, a cleaning mechanism and a drying assembly are provided on the cabinet, the cleaning mechanism comprises a cleaning bucket, a moving assembly and a clamping assembly, the cleaning bucket is installed in the lower layer of the cabinet, the cleaning bucket is filled with a cleaning agent for cleaning chips, the moving assembly comprises a moving plate and a lifting rod, the moving plate is installed on the upper support plate, the lifting rod is installed on the moving plate, the lower end of the moving plate passes through the upper support plate and is connected to the connecting disk The lifting rod is used to drive the connecting plate to move between the cleaning bucket and the drying component, and the lifting rod is used to drive the connecting plate to move in the vertical direction. The connecting plate is evenly connected to a plurality of fixing rods in a circular shape. The clamping assembly includes a loading frame, a pressure plate and a push rod. The upper end of the loading frame is rotatably connected to the lower end of the fixing rod. The loading frame is used to load chips, and the pressure plate is closed on the loading frame to fix the chips. The push rod is installed at the upper end of the loading frame. The lower end of the push rod is connected to a cleaning brush roller, and the push rod drives the cleaning brush roller to move back and forth on the loading frame to clean the chips in the loading frame. The drying component is used to dry the cleaned chips.

[0005] Preferably, the upper support plate and the lower support plate are both fixedly connected to the inner side of the cabinet, a displacement groove is provided in the middle of the upper support plate, guide rails are provided on both sides of the displacement groove, the guide rails are fixedly connected to the upper support plate, and a bearing seat is also fixedly installed on the side of the upper support plate close to the drying component, the bearing seat is located on the outside of the guide rail, and a cleaning port for the connection plate to pass through is provided on one side of the lower support plate.

[0006] Preferably, the cleaning mechanism also includes a mounting seat, which is fixedly mounted on the bottom of the cabinet, a driving groove is provided on the mounting seat, the cleaning bucket is fixedly mounted above the mounting seat, the upper side of the cleaning bucket is connected to a water injection pipe, the lower side of the cleaning bucket is connected to a water pump, the water pump is fixedly mounted on the bottom of the cabinet, a driving shaft is rotatably connected in the cleaning bucket, the upper end of the driving shaft is fixedly connected to a impeller, the impeller is located at the bottom of the cleaning bucket, the lower end of the driving shaft passes through the bottom of the cleaning bucket and is rotatably connected to the driving groove, a pulley is coaxially fixedly connected to the end of the driving shaft located in the driving groove, the first motor is fixedly mounted on the side wall of the lower layer of the cabinet, and the output shaft of the first motor is connected to the pulley through a transmission belt.

[0007] The transmission mechanism is located in the rotation of the gear train track, and the transmission mechanism is located in the rotation of the gear train track, and the transmission mechanism is located in the rotation of the gear train track.

[0008] Preferably, a connecting shaft is fixedly connected to the middle part of the connecting disk, the upper end of the connecting shaft is rotatably connected to the lower end of the lifting rod, the lower end of the connecting shaft is coaxially fixedly connected to a second gear, the second gear is engaged with the first gear, the outer side of the connecting disk is rotatably connected to a gear ring, a motor frame is fixedly installed on the connecting disk, the motor frame is located on the inner side of the gear ring, a fourth motor is fixedly installed on the motor frame, a third gear is coaxially fixedly connected to the output shaft of the fourth motor, and the third gear is engaged on one side of the gear ring.

[0009] Preferably, the fixed rod is rotatably connected to the connecting disk, the upper end of the fixed rod is coaxially fixedly connected to the fourth gear, the fourth gear is engaged with the gear ring, the lower end of the fixed rod passes through the bottom of the connecting disk, the lower end of the fixed rod is fixedly connected to the motor base, the motor base is fixedly installed with the fifth motor, and the output shaft of the fifth motor is coaxially fixedly connected with the fifth gear.

[0010] Preferably, a placement slot for placing chips is provided on the loading frame, and a connecting seat is fixedly connected to the upper end of the loading frame. The loading frame is rotatably mounted on the lower end of the fixed rod through the connecting seat, and a sector gear is fixedly connected to one side of the connecting seat. The sector gear is engaged with the fifth gear, and a fixing plate is fixedly connected to the loading frame.

[0011] Preferably, the pressure plate is slidably installed between the fixed plate and the loading frame, the upper end of the pressure plate is fixedly connected to a driving rack, the fixed plate is fixedly installed with a sixth motor, the output shaft of the sixth motor is coaxially fixedly connected with a spur gear, the spur gear is located between the fixed plate and the loading frame, and the driving racks on the pressure plates on both sides of the loading frame are respectively engaged with the upper and lower sides of the spur gear.

[0012] Preferably, the upper end of the loading frame is fixedly connected to a cylinder seat, a driving cylinder is fixedly installed on the cylinder seat, the output shaft of the driving cylinder is fixedly connected to the upper end of the push rod, and the lower end of the push rod is rotatably installed with two cleaning brush rollers, and the two cleaning brush rollers are respectively located on both sides of the loading frame.

[0013] Preferably, the drying component includes an electric conveyor belt and a drying channel. The electric conveyor belt is fixedly mounted on the other side of the lower support plate. A drying channel is provided on the electric conveyor belt. Several heating tubes are fixedly mounted on the top of the drying channel. A collection frame is placed under the end of the electric conveyor belt away from the washing barrel. The collection frame is used to collect the dried chips.

[0014] Compared with the prior art, the present invention provides a physical vapor deposition device for high-precision smart chip films, which has the following beneficial effects: 1. The physical vapor deposition device of the high-precision smart chip film, through the setting of the cleaning mechanism and the drying component, can place multiple chips into several carrier frames respectively when cleaning the chips, and enter the cleaning bucket under the drive of the lifting rod, and clean multiple chips at the same time, thereby improving the processing efficiency of the chips. In the cleaning process, the push rod on the carrier frame can drive the cleaning brush roller to roll back and forth on the surface of the chip to clean the surface of the chip, thereby further improving the cleaning effect of the chip and improving the coating quality of the chip during vacuum evaporation. After the chip is cleaned, the cleaning mechanism places the cleaned chip into the drying component for drying, thereby avoiding oxidation of the wet chip surface and the formation of water stains, thereby further improving the processing efficiency of the chip.

[0015] 2. The physical vapor deposition device of the high-precision smart chip film, through the setting of the moving component, can drive the connecting plate to move above the cleaning bucket when cleaning the chip, and with the cooperation of the lifting rod, the carrier frame and the chip in the carrier frame are placed in the cleaning bucket for cleaning. After cleaning, the chip is taken out of the cleaning bucket by the lifting rod and transported to the drying component for drying, thereby improving the working efficiency of the device. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] Figure 1 This is a schematic diagram of the internal planar structure of the cabinet of the present invention; Figure 2 for Figure 1 A local enlarged structural diagram of point A; Figure 3 It is a schematic diagram of the main structure of the present invention; Figure 4 This is a schematic side view of the mounting base of the present invention; Figure 5 This is a schematic diagram of the front structure of the drive slot of the present invention; Figure 6 for Figure 5 A schematic diagram of the partially enlarged structure at point B; Figure 7 This is a schematic diagram of the internal structure of the cleaning bucket of the present invention; Figure 8 for Figure 7 A schematic diagram of the partially enlarged structure at point C; Figure 9 This is a schematic diagram of the internal structure of the fixing plate and the drying component of the present invention; Figure 10 for Figure 9 A schematic diagram of the local enlarged structure at D; Figure 11 for Figure 9 Schematic diagram of the local enlarged structure at E; Figure 12 This is a schematic diagram showing the structure of the device when clamping a chip.

[0017] In the figure: 1. cabinet; 11. upper support plate; 111. displacement groove; 112. guide rail; 113. bearing seat; 12. lower support plate; 121. cleaning port; 2. cleaning mechanism; 21. mounting seat; 211. driving groove; 22. cleaning bucket; 221. water injection pipe; 222. water pump; 23. driving shaft; 24. impeller; 25. pulley; 26. first motor; 261. transmission belt; 3. moving assembly; 31. moving plate; 311. threaded sleeve; 32. second motor; 33. driving rod; 34. electric telescopic rod; 35. lifting rod; 36. fixing seat; 37. third motor; 371. first gear; 4. connecting plate; 41. Connecting shaft; 411, second gear; 42, gear ring; 43, motor frame; 44, fourth motor; 441, third gear; 45, fixing rod; 46, fourth gear; 47, motor seat; 48, fifth motor; 49, fifth gear; 5, clamping assembly; 51, loading frame; 511, placement slot; 512, connecting seat; 52, sector gear; 53, fixing plate; 54, pressing plate; 541, driving rack; 55, sixth motor; 551, spur gear; 56, cylinder seat; 57, driving cylinder; 571, push rod; 58, cleaning brush roller; 6, drying assembly; 61, electric conveyor belt; 62, drying channel; 63, heating pipe; 7, collecting frame. DETAILED DESCRIPTION

[0018] The following will clearly and completely describe the technical solutions in the embodiments of the present invention in conjunction with the accompanying drawings. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative efforts are within the scope of protection of the present invention.

[0019] See also Figures 1-12 A physical vapor deposition device for a high-precision smart chip film includes a cabinet 1, in which an upper support plate 11 and a lower support plate 12 are respectively installed. The upper support plate 11 and the lower support plate 12 divide the interior of the cabinet 1 into three layers, upper, middle and lower. A cleaning mechanism 2 and a drying component 6 are provided on the cabinet 1. The cleaning mechanism 2 includes a cleaning bucket 22, a moving component 3 and a clamping component 5. The cleaning bucket 22 is installed in the lower layer of the cabinet 1. The cleaning bucket 22 is filled with a cleaning agent for cleaning the chip. The moving component 3 includes a moving plate 31 and a lifting rod 35. The moving plate 31 is installed on the upper support plate 11, and the lifting rod 35 is installed on the moving plate 31. The lower end of the moving plate 31 passes through the upper support plate 11 and is connected to the connecting plate 4. The moving plate 31 is used The driving lifting rod 35 drives the connecting disk 4 to move between the cleaning barrel 22 and the drying assembly 6. The lifting rod 35 is used to drive the connecting disk 4 to move in the vertical direction. Several fixed rods 45 are evenly connected to the connecting disk 4 in a circular shape. The clamping assembly 5 includes a loading frame 51, a pressure plate 54 and a push rod 571. The upper end of the loading frame 51 is rotatably connected to the lower end of the fixed rod 45. The loading frame 51 is used to load chips. The pressure plate 54 is closed on the loading frame 51 to fix the chip. The push rod 571 is installed at the upper end of the loading frame 51. The lower end of the push rod 571 is connected to a cleaning brush roller 58. The push rod 571 drives the cleaning brush roller 58 to move back and forth on the loading frame 51 to clean the chips in the loading frame 51. The drying assembly 6 is used to dry the cleaned chips.

[0020] Among them, in use, in the initial state, the movable plate 31 drives the connecting plate 4 to move to the top of the cleaning bucket 22, and the lifting rod 35 lifts the connecting plate 4 to the middle layer of the cabinet 1, so that the loading frame 51 under the fixing rod 45 is located above the lower support plate 12, and the loading frame 51 is in a vertical shape at this time, and the pressure plates 54 on both sides of the loading frame 51 are closed. When it is necessary to clean the chip before vacuum evaporation, all the closed pressure plates 54 on the loading frames 51 are opened to both sides, and then several chips are placed one by one in several loading frames 51. When the loading frame 51 is loaded with the core, the opened pressure plates 54 will be closed again, thereby fixing the chip in the loading frame 51, and at the same time the staff adds the chip into the cleaning bucket 22. Add cleaning agent. After all chips are clamped and cleaning agent is added to the cleaning barrel 22, the cabinet door is closed, and then the lifting rod 35 pushes the connecting plate 4 to move downward to the lower layer of the cabinet 1, so that the fixing rod 45 on the connecting plate 4 inserts the loading frame 51 into the cleaning agent in the cleaning barrel 22 for cleaning. During the cleaning process, the push rod 571 on the loading frame 51 will drive the cleaning brush roller 58 to reciprocate on the loading frame 51, so that the cleaning brush roller 58 rolls on the chip through friction, thereby cleaning the chip, thereby further improving the cleaning effect. After cleaning is completed, the lifting rod 35 lifts the connecting plate 4 to the middle layer of the cabinet 1, so that the vertical loading frame 51 is suspended above the lower support plate 12, and then The movable plate 31 drives the connecting plate 4 to move toward the drying assembly 6. During this process, the carrier frame 51 rotates upward on the fixed rod 45 until it is level with the lower support plate 12, so that the pressure plate 54 is located below the carrier frame 51. The push rod 571 pulls the cleaning brush to the upper end of the carrier frame 51 and separates it from the chip in the carrier frame 51. At the same time, the fixed rod 45 also drives the carrier frame 51 to rotate horizontally by 90 degrees, and the turntable rotates on the lifting rod 35, so that the lower end of the carrier frame 51 faces the drying assembly 6 and can pass over the drying assembly 6. When the first carrier frame 51 moves onto the drying assembly 6, the closed pressure plate 54 on the carrier frame 51 opens, allowing the first chip to fall into the drying assembly 6 for drying. After that, the connecting disk 4 continues to rotate, moving the second carrier frame 51 to the drying component 6, and the closed pressure plate 54 on the carrier opens, allowing the second chip to fall onto the drying component 6 for drying. The above steps are repeated until the chips in all the carrier frames 51 are placed in the drying component 6 for drying. After all the chips are placed in the carrier frames 51, the connecting disk 4 stops rotating, and the moving plate 31 drives the connecting disk 4 to move back to the top of the cleaning barrel 22. At the same time, the carrier frame 51 rotates downward and returns to a vertical state, and closes the pressure plate 54. The fixed rod 45 drives the carrier frame 51 to rotate ninety degrees in the opposite direction, thereby returning to the initial state. After drying the chips, the processed chips can be sent to the next process for coating.

[0021] Furthermore, the upper support plate 11 and the lower support plate 12 are fixedly connected to the inner side of the cabinet 1, a displacement groove 111 is provided in the middle of the upper support plate 11, and guide rails 112 are provided on both sides of the displacement groove 111. The guide rails 112 are fixedly connected to the upper support plate 11, and a bearing seat 113 is also fixedly installed on the side of the upper support plate 11 close to the drying component 6. The bearing seat 113 is located on the outside of the guide rail 112, and a cleaning port 121 for the connecting plate 4 to pass through is provided on one side of the lower support plate 12.

[0022] Among them, when the movable plate 31 drives the connecting plate 4 to move back and forth between the cleaning bucket 22 and the drying component 6, the lifting rod 35 follows the displacement plate to move in the displacement groove 111. When cleaning the chip, the connecting plate 4 enters the cleaning bucket 22 in the lower layer of the cabinet 1 through the cleaning port 121, and after completing the cleaning, returns to the middle layer of the cabinet 1 through the cleaning port 121, and places the chip on the drying component 6 for drying.

[0023] Furthermore, the cleaning mechanism 2 also includes a mounting base 21, which is fixedly mounted on the bottom of the cabinet 1. A driving groove 211 is provided on the mounting base 21. The cleaning bucket 22 is fixedly mounted above the mounting base 21. The upper side of the cleaning bucket 22 is connected to a water injection pipe 221. The lower side of the cleaning bucket 22 is connected to a water pump 222. The water pump 222 is fixedly mounted on the bottom of the cabinet 1. A driving shaft 23 is rotatably connected in the cleaning bucket 22. The upper end of the driving shaft 23 is fixedly connected to a impeller 24. The impeller 24 is located at the bottom of the cleaning bucket 22. The lower end of the driving shaft 23 passes through the bottom of the cleaning bucket 22 and is rotatably connected in the driving groove 211. A pulley 25 is coaxially fixedly connected to the end of the driving shaft 23 located in the driving groove 211. The first motor 26 is fixedly mounted on the side wall of the lower layer of the cabinet 1. The output shaft of the first motor 26 is connected to the pulley 25 through a transmission belt 261.

[0024] Among them, when cleaning the chip, cleaning agent is added to the cleaning bucket 22 through the water injection pipe 221. When the fixing rod 45 pushes the carrier frame 51 containing the chip into the cleaning agent, the first motor 26 drives the impeller 24 to rotate through the transmission belt 261. The rotating impeller 24 causes the cleaning agent in the cleaning bucket 22 to rotate, and the chips in the carrier frame 51 are rinsed. After cleaning is completed, the water pump 222 discharges the used cleaning agent in the cleaning bucket 22.

[0025] Furthermore, the movable plate 31 is slidably mounted on the guide rail 112 through a slider, and the side of the movable plate 31 is fixedly connected to a threaded sleeve 311, and the second motor 32 is fixedly mounted on the upper support plate 11, and the output shaft of the second motor 32 is coaxially fixedly connected to one end of the driving rod 33, and the other end of the driving rod 33 is rotatably mounted on the bearing seat 113. The driving rod 33 is a threaded rod, and the threaded sleeve 311 is assembled on the threaded rod. An electric telescopic rod 34 is fixedly mounted on the movable plate 31, and a lifting rod 35 is fixedly connected to the output shaft of the electric telescopic rod 34. The lower end of the lifting rod 35 passes through the displacement slot 111 and is suspended above the cleaning bucket 22. The lower end of the lifting rod 35 is fixedly connected to a fixing seat 36, and a third motor 37 is fixedly mounted on the fixing seat 36. The output shaft of the third motor 37 is coaxially fixedly connected to the first gear 371.

[0026] Among them, during cleaning, the second motor 32 rotates the driving rod 33 in the opposite direction to move the movable plate 31 to above the cleaning bucket 22, and then the electric telescopic rod 34 extends the conveying shaft to push the lifting rod 35 downward, so that the carrier frame 51 containing the chips enters the cleaning bucket 22. After cleaning is completed, the electric telescopic rod 34 retracts its output shaft, so that the lifting rod 35 moves upward, and the carrier frame 51 is pulled out of the cleaning bucket 22. Then the second motor 32 drives the driving rod 33 to rotate forward to move the movable plate 31 toward the drying assembly 6. After all the carrier frames 51 place the chips on the drying assembly 6, the second motor 32 rotates the driving rod 33 in the opposite direction to move the movable plate 31 back to above the cleaning bucket 22. In the above process, when the connecting disk 4 needs to rotate, the third motor 37 drives the first gear 371 to rotate.

[0027] Furthermore, a connecting shaft 41 is fixedly connected to the middle of the connecting disk 4, the upper end of the connecting shaft 41 is rotatably connected to the lower end of the lifting rod 35, the lower end of the connecting shaft 41 is coaxially fixedly connected to the second gear 411, the second gear 411 is engaged with the first gear 371, the outer side of the connecting disk 4 is rotatably connected to the gear ring 42, a motor frame 43 is fixedly mounted on the connecting disk 4, the motor frame 43 is located on the inner side of the gear ring 42, a fourth motor 44 is fixedly mounted on the motor frame 43, the output shaft of the fourth motor 44 is coaxially fixedly connected to the third gear 441, and the third gear 441 is engaged on one side of the gear ring 42.

[0028] Among them, when the first gear 371 rotates, the rotating first gear 371 drives the second gear 411 to drive the connecting disk 4 to rotate, so that the loading frame 51 under the connecting disk 4 can pass through the drying component 6 in sequence and place the cleaned chips on the drying component 6. The fourth motor 44 drives the gear ring 42 to rotate forward and reverse through the third gear 441.

[0029] Furthermore, the fixed rod 45 is rotatably connected to the connecting disk 4, and the upper end of the fixed rod 45 is coaxially fixedly connected to the fourth gear 46, which is engaged with the gear ring 42. The lower end of the fixed rod 45 passes through the bottom of the connecting disk 4, and the lower end of the fixed rod 45 is fixedly connected to the motor base 47, and the fifth motor 48 is fixedly installed on the motor base 47. The fifth gear 49 is coaxially fixedly connected to the output shaft of the fifth motor 48.

[0030] Among them, initially, the fixed rod 45 makes the chips in the loading frame 51 at the lower end face the rotation direction of the detergent, so that the detergent can rinse the surface of the chips during rotation. When the lifting rod 35 lifts the loading frame 51 out of the cleaning bucket 22, the loading frame 51 at this time is facing the drying component 6. When the gear ring 42 drives the fixed rod 45 to rotate forward ninety degrees through the fourth gear 46, the loading frame 51 at this time is facing the drying component 6. After the loading frame 51 is lifted upward, the loading frame 51 can be aligned with the drying component 6, and the chips can be accurately placed on the drying component 6. After the loading frame 51 completes unloading and returns to a vertical state, the gear ring 42 drives the fixed rod 45 to rotate in the opposite direction ninety degrees through the fourth gear 46, so that when the chips are cleaned next time, the chips in the loading frame 51 can face the rotation direction of the detergent, and the fifth motor 48 can drive the fifth gear 49 to rotate forward or reverse.

[0031] Furthermore, a placement slot 511 for placing chips is provided on the loading frame 51, and a connecting seat 512 is fixedly connected to the upper end of the loading frame 51. The loading frame 51 is rotatably mounted on the lower end of the fixed rod 45 through the connecting seat 512. A fan-shaped gear 52 is fixedly connected to one side of the connecting seat 512, and the fan-shaped gear 52 is engaged with the fifth gear 49. A fixing plate 53 is fixedly connected to the loading frame 51.

[0032] When clamping the chip, the closed pressure plate 54 is first opened so that the chip can be placed in the placement groove 511. After the chip is placed in the placement groove 511, the opened pressure plate 54 is closed so that the two pressure plates 54 are pressed on both sides of the placement groove 511, thereby fixing the chip in the placement groove 511. When the carrier frame 51 passes through the drying component 6, the closed pressure plate 54 is opened, and the chip loses the restraint of the pressure plate 54 and falls out of the placement groove 511 and falls on the drying component 6. When the vertical carrier frame 51 needs to be converted into When it remains horizontal with the lower support plate 12, the fifth gear 49 drives the sector gear 52 to rotate in the opposite direction, and the rotating sector gear 52 drives the loading frame 51 to rotate upward ninety degrees on the fixed rod 45 through the connecting seat 512, so as to remain horizontal with the lower support plate 12. When it is necessary to transform the loading frame 51 maintained horizontal with the lower support plate 12 into a vertical state, the fifth gear 49 drives the sector gear 52 to rotate forward, and the rotating sector gear 52 drives the loading frame 51 to rotate downward ninety degrees on the fixed rod 45 through the connecting seat 512, so as to return to the vertical state.

[0033] Furthermore, the pressure plate 54 is slidably installed between the fixed plate 53 and the loading frame 51, and the upper end of the pressure plate 54 is fixedly connected to the driving rack 541. The sixth motor 55 is fixedly installed on the fixed plate 53, and the output shaft of the sixth motor 55 is coaxially fixedly connected to the spur gear 551. The spur gear 551 is located between the fixed plate 53 and the loading frame 51, and the driving racks 541 on the pressure plates 54 on both sides of the loading frame 51 are respectively engaged with the upper and lower sides of the spur gear 551.

[0034] Among them, when the pressure plate 54 needs to be opened, the sixth motor 55 drives the spur gear 551 to rotate forward, and the rotating spur gear 551 simultaneously drives the driving racks 541 on the upper and lower sides to push the two pressure plates 54 to move toward the two sides of the loading frame 51, thereby opening the closed pressure plate 54. When the pressure plate 54 needs to be closed, the sixth motor 55 drives the spur gear 551 to rotate reversely, and the rotating spur gear 551 simultaneously drives the driving racks 541 on the upper and lower sides to pull the two pressure plates 54 toward the placement slot 511, thereby closing the opened pressure plate 54.

[0035] Furthermore, the upper end of the loading frame 51 is fixedly connected to a cylinder seat 56, and a driving cylinder 57 is fixedly installed on the cylinder seat 56. The output shaft of the driving cylinder 57 is fixedly connected to the upper end of the push rod 571, and two cleaning brush rollers 58 are rotatably installed at the lower end of the push rod 571. The two cleaning brush rollers 58 are respectively located on both sides of the loading frame 51.

[0036] Among them, when cleaning the chip, the driving cylinder 57 extends and retracts its output shaft, thereby driving the push rod 571 to drive the cleaning brush roller 58 to reciprocate in the carrier frame 51, so that the two cleaning brush rollers 58 roll back and forth on both sides of the chip to clean the chip. After cleaning is completed, the driving cylinder 57 retracts the output shaft, so that the push rod 571 drives the cleaning brush roller 58 to move to the upper end of the carrier frame 51, separates from the chip in the carrier frame 51, and makes room for the chip, so that when the carrier frame 51 passes through the drying component 6 and opens the closed pressure plate 54, the chip in the placement slot 511 can fall, and it is convenient to clamp the next batch of chips.

[0037] Furthermore, the drying component 6 includes an electric conveyor belt 61 and a drying channel 62. The electric conveyor belt 61 is fixedly installed on the other side of the lower support plate 12. A drying channel 62 is provided on the electric conveyor belt 61. Several heating tubes 63 are fixedly installed on the top of the drying channel 62. A collection frame 7 is placed under the end of the electric conveyor belt 61 away from the washing barrel 22. The collection frame 7 is used to collect the dried chips.

[0038] Among them, the electric conveyor belt 61 rotates toward the collection frame 7. After the loading frame 51 places the chip on the electric conveyor belt 61, the electric conveyor belt 61 transports the chip to the drying channel 62. The heating tube 63 in the drying channel 62 heats up and dries the chip. The dried chip is sent out of the drying channel 62 by the electric conveyor belt 61 and finally falls into the collection frame 7.

[0039] While embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that various changes, modifications, substitutions, and variations may be made to these embodiments without departing from the principles and spirit of the invention, and that the scope of the invention is defined by the appended claims and their equivalents.

Claims

1. A physical vapor deposition device for high-precision smart chip films, comprising a cabinet, wherein an upper support plate and a lower support plate are respectively installed in the cabinet, wherein the upper support plate and the lower support plate sequentially divide the interior of the cabinet into three layers: upper, middle, and lower. The device is characterized in that: The cabinet is provided with a cleaning mechanism and a drying assembly, the cleaning mechanism includes a cleaning bucket, a moving assembly and a clamping assembly, the cleaning bucket is installed in the lower layer of the cabinet, the cleaning bucket is filled with cleaning agent for cleaning chips, the moving assembly includes a moving plate and a lifting rod, the moving plate is installed on the upper support plate, the lifting rod is installed on the moving plate, the lower end of the moving plate passes through the upper support plate and is connected to the connecting plate, the moving plate is used to drive the lifting rod to drive the connecting plate to move between the cleaning bucket and the drying assembly, and the lifting rod is used to bring The connecting disk is moved in the vertical direction, and a number of fixed rods are evenly connected to the connecting disk in a circular shape. The clamping assembly includes a carrier frame, a pressure plate and a push rod. The upper end of the carrier frame is rotatably connected to the lower end of the fixed rod. The carrier frame is used to load chips, and the pressure plate is closed to fix the chip on the carrier frame. The push rod is installed at the upper end of the carrier frame, and a cleaning brush roller is connected to the lower end of the push rod. The push rod drives the cleaning brush roller to move back and forth on the carrier frame to clean the chips in the carrier frame. The drying assembly is used to dry the cleaned chips.

2. The physical vapor deposition device for high-precision smart chip film according to claim 1, characterized in that: The upper support plate and the lower support plate are both fixedly connected to the inner side of the cabinet, a displacement groove is provided in the middle of the upper support plate, guide rails are provided on both sides of the displacement groove, the guide rails are fixedly connected to the upper support plate, and a bearing seat is also fixedly installed on the side of the upper support plate close to the drying component, the bearing seat is located on the outside of the guide rail, and a cleaning port for the connection plate to pass through is provided on one side of the lower support plate.

3. The physical vapor deposition device for high-precision smart chip film according to claim 1, characterized in that: The cleaning mechanism also includes a mounting seat, which is fixedly mounted on the bottom of the cabinet, a driving groove is provided on the mounting seat, the cleaning bucket is fixedly mounted above the mounting seat, the upper side of the cleaning bucket is connected to a water injection pipe, the lower side of the cleaning bucket is connected to a water pump, the water pump is fixedly mounted on the bottom of the cabinet, a driving shaft is rotatably connected in the cleaning bucket, the upper end of the driving shaft is fixedly connected to a impeller, the impeller is located at the bottom of the cleaning bucket, the lower end of the driving shaft passes through the bottom of the cleaning bucket and is rotatably connected to the driving groove, a pulley is coaxially fixedly connected to the end of the driving shaft located in the driving groove, and a first motor is fixedly mounted on the side wall of the lower layer of the cabinet, and the output shaft of the first motor is connected to the pulley through a transmission belt.

4. The physical vapor deposition device for high-precision smart chip film according to claim 2, characterized in that: The movable plate is slidably mounted on the guide rail by a slider, and the side of the movable plate is fixedly connected to a threaded sleeve, and the second motor is fixedly mounted on the upper support plate, and the output shaft of the second motor is coaxially fixedly connected to one end of the driving rod, and the other end of the driving rod is rotatably mounted on the bearing seat, and the driving rod is a threaded rod, and the threaded sleeve is assembled on the threaded rod. The electric telescopic rod is fixedly mounted on the movable plate, and the output shaft of the electric telescopic rod is fixedly connected to the lifting rod, and the lower end of the lifting rod passes through the displacement slot and is suspended above the cleaning bucket. The lower end of the lifting rod is fixedly connected to a fixing seat, and the fixing seat is fixedly mounted on the third motor, and the output shaft of the third motor is coaxially fixedly connected to the first gear.

5. The physical vapor deposition device for high-precision smart chip film according to claim 4, characterized in that: A connecting shaft is fixedly connected to the middle of the connecting disk, the upper end of the connecting shaft is rotatably connected to the lower end of the lifting rod, the lower end of the connecting shaft is coaxially fixedly connected to a second gear, the second gear is meshed with the first gear, the outer side of the connecting disk is rotatably connected to a gear ring, a motor frame is fixedly installed on the connecting disk, the motor frame is located on the inner side of the gear ring, a fourth motor is fixedly installed on the motor frame, a third gear is coaxially fixedly connected to the output shaft of the fourth motor, and the third gear is meshed on one side of the gear ring.

6. The physical vapor deposition device for high-precision smart chip film according to claim 5, characterized in that: The fixing rod is rotatably connected to the connecting disk, the upper end of the fixing rod is coaxially fixedly connected to the fourth gear, the fourth gear is engaged with the gear ring, the lower end of the fixing rod passes through the bottom of the connecting disk, the lower end of the fixing rod is fixedly connected to the motor base, the motor base is fixedly mounted with a fifth motor, and the output shaft of the fifth motor is coaxially fixedly connected with the fifth gear.

7. The physical vapor deposition device for high-precision smart chip film according to claim 6, characterized in that: The carrier frame is provided with a placement slot for placing chips, the upper end of the carrier frame is fixedly connected to a connecting seat, the carrier frame is rotatably mounted on the lower end of the fixed rod through the connecting seat, one side of the connecting seat is fixedly connected to a sector gear, the sector gear is engaged with the fifth gear, and a fixing plate is fixedly connected to the carrier frame.

8. The physical vapor deposition device for high-precision smart chip film according to claim 7, characterized in that: The pressure plate is slidably installed between the fixed plate and the loading frame, the upper end of the pressure plate is fixedly connected to a driving rack, the fixed plate is fixedly installed with a sixth motor, the output shaft of the sixth motor is coaxially fixedly connected with a spur gear, the spur gear is located between the fixed plate and the loading frame, and the driving racks on the pressure plates on both sides of the loading frame are respectively engaged with the upper and lower sides of the spur gear.

9. The physical vapor deposition device for high-precision smart chip film according to claim 7, characterized in that: The upper end of the loading frame is fixedly connected to a cylinder seat, a driving cylinder is fixedly installed on the cylinder seat, the output shaft of the driving cylinder is fixedly connected to the upper end of the push rod, and the lower end of the push rod is rotatably installed with two cleaning brush rollers, which are respectively located on both sides of the loading frame.

10. The physical vapor deposition device for high-precision smart chip film according to claim 1, characterized in that: The drying component includes an electric conveyor belt and a drying channel. The electric conveyor belt is fixedly installed on the other side of the lower support plate. The electric conveyor belt is provided with a drying channel. Several heating tubes are fixedly installed on the top of the drying channel. A collection frame is placed under the end of the electric conveyor belt away from the cleaning barrel. The collection frame is used to collect the dried chips.

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