Temperature sensor

Abstract

A temperature sensor includes an element and a housing. The element includes a temperature sensing portion and a pair of wires connected to the temperature sensing portion. The housing accommodates the temperature sensing portion and the pair of wires. The housing includes a housing portion containing a resin. The housing portion includes a first face included by an outer surface of the housing. The housing portion includes a base region and a wall region. The base region includes a first surface and a second surface facing the first surface and on which a pair of conductive lines are disposed. The wall region is located between the pair of conductive lines and is continuous with the base region.

Description

Technical Field

[0001] The present disclosure relates to a temperature sensor. Background Art

[0002] A known element includes a temperature sensing portion and a pair of lead wires electrically connected to the temperature sensing portion (for example, see Japanese Patent Application Laid-Open No. 2021-106178). Summary of the Invention

[0003] For example, a temperature sensor includes the aforementioned element. In a structure where the temperature sensor includes the aforementioned element, external forces may act on the element. When external forces act on the element, a pair of wires may deform, causing the position of the pair of wires to shift. When the position of the pair of wires shifts, there is a risk that the pair of wires may contact each other. If the pair of wires contact each other, the pair of wires may short-circuit. When the pair of wires short-circuit, the accuracy of temperature detection is reduced.

[0004] An object of one embodiment of the present disclosure is to provide a temperature sensor that prevents a pair of wires from short-circuiting.

[0005] A temperature sensor according to one embodiment of the present disclosure includes an element and a housing. The element includes a temperature sensing portion and a pair of wires connected to the temperature sensing portion. The housing accommodates the temperature sensing portion and the pair of wires. The housing includes a housing portion containing resin. The housing portion includes a first surface included in the outer surface of the housing. The housing portion includes a base region and a wall region. The base region includes a first surface and a second surface opposite the first surface and having a pair of wires disposed thereon. The wall region is located between the pair of wires and is disposed continuously with the base region.

[0006] In the above embodiment, the temperature sensing unit and the pair of lead wires are housed in the housing. Therefore, even when an external force acts on the temperature sensor, the external force is unlikely to affect the element and the position of the pair of lead wires is unlikely to shift.

[0007] In one embodiment described above, the housing portion includes a wall region. The wall region is located between the pair of conductors and is disposed continuously with the base region. Therefore, even if the position of the pair of conductors within the housing is shifted due to external force acting on the temperature sensor, the pair of conductors are unlikely to contact each other.

[0008] As a result, the above-mentioned one aspect prevents a pair of conductive wires from being short-circuited.

[0009] The present invention can be more fully understood through the detailed description given below and the accompanying drawings, which are given for illustrative purposes only and therefore should not be considered as limiting the present invention.

[0010] The further scope of application of the present invention will become clear through the detailed description given below. However, it should be understood that although these detailed descriptions and specific examples show embodiments of the present invention, they are given by way of example only, and various changes and modifications based on these detailed descriptions within the spirit and scope of the present invention will be obvious to those skilled in the art. BRIEF DESCRIPTION OF THE DRAWINGS

[0011] Figure 1 It is a perspective view showing a temperature sensor according to one embodiment.

[0012] Figure 2 It is a diagram showing a cross-sectional structure of a temperature sensor according to this embodiment.

[0013] Figure 3 It is a diagram showing a cross-sectional structure of a temperature sensor according to this embodiment.

[0014] Figure 4 It is a diagram showing a cross-sectional structure of a temperature sensor according to this embodiment.

[0015] Figure 5 It is a diagram showing a cross-sectional structure of a temperature sensor according to this embodiment.

[0016] Figure 6 It is a plan view showing the structure of the housing and components.

[0017] Figure 7 It is a perspective view showing the structure of the housing and components. DETAILED DESCRIPTION

[0018] Hereinafter, embodiments of the present invention will be described in detail with reference to the accompanying drawings. In the following description, the same elements or elements having the same functions are denoted by the same reference numerals, and repeated descriptions are omitted.

[0019] Reference Figures 1 to 7 , the structure of the temperature sensor 1 involved in this embodiment is described. Figure 1 It is a perspective view showing the temperature sensor according to this embodiment. Figures 2 to 5 It is a diagram showing a cross-sectional structure of a temperature sensor according to this embodiment. Figure 6 It is a plan view showing the structure of the housing and components. Figure 7 It is a perspective view showing the structure of the housing and components.

[0020] like Figure 1 and Figure 2 As shown, the temperature sensor 1 includes an element 2 , a pair of leads 3 , 4 and a housing 5 .

[0021] Element 2 includes an electronic component whose resistance value changes according to the increase of temperature. Element 2 includes, for example, a thermistor element. Figure 2 As shown, element 2 includes a temperature sensing portion 21, a sealing portion 22, and a pair of lead wires 23 and 24. Temperature sensing portion 21 includes, for example, an NTC (Negative Temperature Coefficient) thermistor or a PTC (Positive Temperature Coefficient) thermistor. Temperature sensing portion 21 includes a detection portion whose resistance value changes in response to temperature changes. Sealing portion 22 seals temperature sensing portion 21. Sealing portion 22 covers temperature sensing portion 21. For example, sealing portion 22 covers the entire temperature sensing portion 21. For example, sealing portion 22 includes glass. For example, sealing portion 22 is formed of glass.

[0022] A pair of wires 23 and 24 are connected to the temperature sensing portion 21. For example, the temperature sensing portion 21 includes a pair of electrodes. For example, each of the pair of wires 23 and 24 is electrically and physically connected to a corresponding electrode in the pair of electrodes included in the temperature sensing portion 21. Each of the pair of wires 23 and 24 is connected to the corresponding electrode, for example, by welding. The pair of wires 23 and 24 include portions 23a and 24a sealed together with the temperature sensing portion 21 by the sealing portion 22, and portions 23b and 24b exposed from the sealing portion 22.

[0023] Each of the pair of leads 3 and 4 is connected to a corresponding wire in the pair of conductive wires 23 and 24. Leads 3 and 4 comprise, for example, insulated wires. Lead 3 includes a portion 3a exposed from the insulating coating and a portion 3b containing the insulating coating. For example, lead 3 is physically and electrically connected to conductive wire 23 in portion 3a. For example, portion 3a of lead 3 is connected to conductive wire 23 via solder 6. Lead 4 includes a portion 4a exposed from the insulating coating and a portion 4b containing the insulating coating. For example, lead 4 is physically and electrically connected to conductive wire 24 in portion 4a. For example, portion 4a of lead 4 is connected to conductive wire 24 via solder 6.

[0024] The housing 5 houses the temperature sensing portion 21, the sealing portion 22, and a pair of lead wires 23 and 24. The housing 5 houses the element 2. For example, the housing 5 houses the entire portion 3a of the lead 3, the entire portion 4a of the lead 4, and a portion of each of the portions 3b and 4b. When the temperature sensor 1 detects the temperature of an object, the housing 5 faces the object. When the temperature sensor 1 detects the temperature of an object, the housing 5 may also abut against the object. The housing 5 is in the shape of a rectangular parallelepiped. The rectangular parallelepiped shape includes, for example, a rectangular parallelepiped shape with chamfered corners and edges, or a rectangular parallelepiped shape with rounded corners and edges.

[0025] The housing 5 includes a pair of facing surfaces 5a, 5b, a pair of side surfaces 5c, 5d, and a pair of end surfaces 5e, 5f. The facing surfaces 5a, 5b oppose each other in a first direction D1. The side surfaces 5c, 5d oppose each other in a second direction D2. The end surfaces 5e, 5f oppose each other in a third direction D3. The first direction D1, the second direction D2, and the third direction D3 intersect with each other, for example. For example, the first direction D1, the second direction D2, and the third direction D3 are orthogonal to each other. For example, the outer surface of the housing 5 includes a pair of facing surfaces 5a, 5b, a pair of side surfaces 5c, 5d, and a pair of end surfaces 5e, 5f.

[0026] One of the pair of faces 5a, 5b and the pair of side faces 5c, 5d faces the object. For example, face 5b faces the object. An opening is formed on end face 5e or end face 5f. A pair of leads 3, 4 are inserted through these openings. For example, the opening is formed on end face 5f.

[0027] The housing 5 includes a housing portion 51 and a housing portion 52. For example, the housing portion 51 and the housing portion 52 are integrally formed. For example, the element 2 is disposed in the housing portion 51. For example, the housing portion 52 is disposed so as to cover the element 2 and the housing portion 51.

[0028] The housing portion 51 is made of resin. For example, the housing portion 51 is made of resin. The resin included in the housing portion 51 includes, for example, PPS (polyphenylene sulfide) resin, PEEK (polyetheretherketone) resin, or PA (polyamide) resin. For example, the housing portion 51 is made of PPS resin. For example, the sealing portion 22 is made of glass. For example, the sealing portion 22 is made of a material different from that of the housing portion 51. The housing portion 51 includes a base region R1, a wall region R2, a wall region R3, and a region R4.

[0029] Component 2 is configured in the base region R1. Figure 3 and Figure 4 As shown, base region R1 includes a pair of surface faces R1a and R1b, a pair of side faces R1c and R1d, and a pair of end faces R1e and R1f. The pair of surface faces R1a and R1b oppose each other in a first direction D1. The pair of side faces R1c and R1d oppose each other in a second direction D2. The pair of side faces R1c and R1d connects the pair of surface faces R1a and R1b. The pair of end faces R1e and R1f oppose each other in a third direction D3. Surface R1a connects the pair of end faces R1e and R1f. For example, if end face R1f includes the first end face, end face R1e includes the second end face.

[0030] The outer surface of housing 5 includes surface R1b, a pair of side surfaces R1c and R1d, and a pair of end surfaces R1e and R1f. For example, surface 5b includes surface R1b, side surface 5c includes a portion of side surface R1c, side surface 5d includes a portion of side surface R1d, end surface 5e includes end surface R1e, and end surface 5f includes end surface R1f. Housing portion 51 includes surface 5b and a pair of side surfaces R1c and R1d.

[0031] Each of the pair of side surfaces R1c and R1d includes a surface portion S1 and a surface portion S2. Figure 6 As shown, for example, each of a pair of side surfaces R1c and R1d includes one surface portion S1 and two surface portions S2. For example, one surface portion S1 is continuous with two surface portions S2, while each of a pair of side surfaces R1c and R1d includes only one surface portion S1 and two surface portions S2. The two surface portions S2 are connected to the corresponding end surfaces of the pair of end surfaces R1e and R1f. Surface portion S1 is located between the two surface portions S2 in the third direction D3. The one surface portion S1 and the two surface portions S2 are arranged in the order of surface portion S2, surface portion S1, and surface portion S2 in the third direction D3. For example, if surface portion S1 includes the first surface portion, surface portion S2 includes the second surface portion.

[0032] In the second direction D2, the interval d1 between the surface portions S1 and the interval d2 between the surface portions S2 are different from each other. Figure 6 As shown, for example, interval d1 is smaller than interval d2. For example, interval d1 may also vary depending on the position in third direction D3. Each surface segment S1 may include, for example, one surface region S1a and two surface regions S1b. Each of the two surface regions S1b is connected to the corresponding surface region S2 of the two surface segments S2. Surface region S1a is located between the two surface regions S1b in third direction D3. The one surface region S1a and the two surface regions S1b are arranged in the order of surface region S1b, surface region S1a, and surface region S1b in third direction D3.

[0033] For example, the spacing d1 between surface regions S1b decreases as they move away from surface portion S2 in third direction D3, while the spacing d1 between surface regions S1a remains constant. For example, spacing d1 is greatest at the boundary between surface portion S1 and surface portion S2 and smallest between surface regions S1a. For example, when viewed from first direction D1, base region R1 has a shape that tapers midway in third direction D3. Surface portion S1 may not include two surface regions S1b.

[0034] Base region R1 includes region R11 and region R12. Region R11 includes surface portion S1 included in side surface R1c and surface portion S1 included in side surface R1d. Region R12 includes surface portion S2 included in side surface R1c and surface portion S2 included in side surface R1d. For example, if each of a pair of side surfaces R1c and R1d includes one surface portion S1 and two surface portions S2, base region R1 includes one region R11 and two regions R12. For example, if one region R11 is continuous with two regions R12, base region R1 includes only one region R11 and two regions R12. Region R11 is located between the two regions R12 in the third direction D3. One region R11 and two regions R12 are arranged in the order of region R12, region R11, and region R12 in the third direction D3. For example, when the region portion R11 includes the first region portion, the region portion R12 includes the second region portion.

[0035] Surface segment S1 corresponds to a surface segment consisting of one surface region S1a and two surface regions S1b. Region segment R11 consists of one portion R11a and two portions R11b. Portion R11a is located between two portions R11b in third direction D3. Portion R11a and two portions R11b are arranged in the order of portion R11a, portion R11b, and portion R11a in third direction D3.

[0036] like Figure 3 and Figure 4 As shown in FIG. 1 , a bottomed recess H is formed in the base region R1. The recess H opens at the surface R1a. Figure 6 As shown, for example, recess H is formed in region R12 located near end surface R1e and in region R11b adjacent to region R12. When viewed from surface R1a toward surface R1b in first direction D1, recess H is, for example, circular. Examples of circular shapes include true circles, oblongs, or ellipses. When viewed from surface R1a toward surface R1b, recess H is, for example, elliptical. Alternatively, recess H may be polygonal when viewed from surface R1a toward surface R1b.

[0037] For example, the temperature sensing portion 21, the sealing portion 22, the pair of wires 23, 24, and the pair of leads 3, 4 are arranged in the base region R1. The temperature sensing portion 21 and the sealing portion 22 are, for example, located in the recess H. Figure 3 and Figure 4As shown, for example, the entire temperature sensing portion 21 and a portion of the sealing portion 22 are located within the recess H. For example, the sealing portion 22 includes a portion located within the recess H and a portion located outside the recess H. The entire sealing portion 22 may also be located within the recess H. The entire temperature sensing portion 21 may not be located within the recess H. For example, only a portion of the temperature sensing portion 21 may be located within the recess H. For example, the sealing portion 22 is separated from the inner surface Ha of the recess H, and the temperature sensing portion 21 is separated from the inner surface Ha of the recess H. The sealing portion 22 and the inner surface Ha of the recess H may be in contact with each other.

[0038] like Figure 6 and Figure 7 As shown, a pair of conductive wires 23 and 24 are arranged on plane R1a. The pair of conductive wires 23 and 24 are arranged along plane R1a. The pair of conductive wires 23 and 24 are adjacent to each other and separated from each other. For example, the pair of conductive wires 23 and 24 are adjacent to each other and separated from each other in the second direction D2. For example, portions 23b and 24b of the pair of conductive wires 23 and 24 are adjacent to each other and separated from each other in the second direction D2. Portions 23b and 24b extend along the third direction D3 in portions R11b and R11a located near end surface R1e.

[0039] A pair of leads 3 and 4 are arranged on plane R1a. For example, the entire portions 3a and 4a of the pair of leads 3 and 4, as well as portions of portions 3b and 4b, are arranged on plane R1a. The entire portions 3a and 4a, as well as the portions of portions 3b and 4b, are arranged along plane R1a. The entire portions 3a and 4a, as well as the portions of portions 3b and 4b, are adjacent to each other and separated from each other. For example, the entire portions 3a and 4a, as well as the portions of portions 3b and 4b, are adjacent to each other and separated from each other in second direction D2. Portions 3a and 4a extend along a third direction D3 over portion R11a and portion R11b located near end surface R1f. Portions 3b and 4b extend along a third direction D3 over portion R11b located near end surface R1f and over region R12.

[0040] Wall region R2 is disposed continuously with base region R1. In this specification, "two elements disposed continuously" means that the two elements are integrally formed. Wall region R2 and base region R1 may also be integrally formed. For example, wall region R2 may be disposed continuously with region portion R11 of base region R1. Wall region R2 extends in the first direction D1 from surface R1b toward surface R1a.

[0041] Wall region R2 also extends in the third direction D3 over portion R11a and portion R11b located near end surface R1f. For example, a recess H is formed in region portion R12 located near end surface R1e and in portion R11b adjacent to region portion R12. For example, temperature sensing portion 21 is located within recess H. Therefore, for example, when viewed from the first direction D1, wall region R2 is located between temperature sensing portion 21 and end surface R1f. For example, temperature sensing portion 21, wall region R2, and end surface R1f are arranged in the order of temperature sensing portion 21, wall region R2, and end surface R1f in the third direction D3.

[0042] Wall region R2 is located between the pair of conductive wires 23 and 24. Wall region R2 separates the pair of conductive wires 23 and 24 in the second direction D2. For example, wall region R2 is located between portion 23b of conductive wire 23 and portion 24b of conductive wire 24. For example, wall region R2 is located entirely between portion 23b and portion 24b. For example, wall region R2 separates portion 23b of conductive wire 23 and portion 24b of conductive wire 24 in the second direction D2.

[0043] Wall region R2 may also be located between the pair of leads 3 and 4. Wall region R2 may also separate the pair of leads 3 and 4 in the second direction D2. For example, wall region R2 is located between portion 3a of lead 3 and portion 4a of lead 4. For example, wall region R2 separates portion 3a of lead 3 from portion 4a of lead 4 in the second direction D2.

[0044] The wall region R2 may also have a first height greater than the thickness of each of the pair of wires 23 and 24. The wall region R2 may also have a second height greater than the thickness of each of the pair of leads 3 and 4. The wall region R2 may also include a plurality of portions having different heights. The above-mentioned first height and the above-mentioned second height are different from each other, and the wall region R2 may also include a portion located between the pair of wires 23 and 24 and having the above-mentioned first height, and a portion located between the pair of leads 3 and 4 and having the above-mentioned second height. The height of the wall region R2 may also be different corresponding to the position of the wall region R2 on the third direction D3. The height of the wall region R2 may also change corresponding to the position of the wall region R2 on the third direction D3. The third direction D3 is the direction in which the pair of wires 23 and 24 and the pair of leads 3 and 4 extend. As Figure 7 As shown, the second height may be greater than the first height. The second height may be the same as the first height.

[0045] The height of the wall region R2 is determined, for example, by the length of the wall region R2 in the first direction D1. The thickness of the pair of wires 23 and 24 is determined, for example, by the length of the pair of wires 23 and 24 in the first direction D1. The thickness of the pair of leads 3 and 4 is determined, for example, by the length of the pair of leads 3 and 4 in the first direction D1.

[0046] Wall region R3 is disposed continuously with base region R1. For example, wall region R3 and base region R1 are integrally formed. For example, wall region R3 is disposed continuously with region portion R12 of base region R1. For example, wall region R3 includes a wall region different from wall region R2.

[0047] For example, when viewed from the first direction D1, wall region R3 is located closer to end surface R1e than the edge of recess H where temperature-sensing portion 21 is located. For example, when viewed from the first direction D1, wall region R3 is located between end surface R1e and temperature-sensing portion 21. As described above, when viewed from the first direction D1, wall region R2 is located between temperature-sensing portion 21 and end surface R1f. Therefore, for example, in the third direction D3, end surface R1e, wall region R3, temperature-sensing portion 21, wall region R2, and end surface R1f are arranged in the order of end surface R1e, wall region R3, temperature-sensing portion 21, wall region R2, and end surface R1f.

[0048] The wall region R3 extends from the surface R1b to the surface R1a in the first direction D1. For example, when viewed from the first direction D1, the wall region R3 is curved. Figure 6 As shown, for example, when viewed from the first direction D1, the wall region R3 is curved so as to convexly face the end surface R1e. When viewed from the first direction D1, the wall region R3 may not be curved. When viewed from the first direction D1, the wall region R3 may be rectangular or polygonal.

[0049] The region R4 is arranged continuously with the base region R1. The region R4 and the base region R1 are formed integrally. The region R4 is also arranged continuously with the wall region R2. The region R4 and the wall region R2 are formed integrally.

[0050] Region R4 covers a pair of conductors 23 and 24. Figures 5 to 7 As shown, region R4 covers, for example, portions 23b and 24b of a pair of conductors 23 and 24. Region R4 may not only cover the pair of conductors 23 and 24 but may also cover, for example, wall region R2. For example, region R4 covers the portion of wall region R2 between the pair of conductors 23 and 24.

[0051] Housing portion 52 covers component 2, the pair of leads 3 and 4, and housing portion 51. For example, housing portion 52 covers temperature sensing portion 21, sealing portion 22, and the pair of wires 23 and 24. Housing portion 52 comprises resin. For example, housing portion 52 is made of resin. The resin included in housing portion 52 may include, for example, PPS resin, PEEK resin, or PA resin. For example, housing portion 52 is made of PPS resin. As described above, housing portion 51 is also made of, for example, PPS resin. Housing portion 51 and housing portion 52 may also be made of the same resin. Housing portion 52 includes a housing portion different from housing portion 51.

[0052] The housing portion 52 includes a surface 52a, a pair of side surfaces 52b and 52c, and a pair of end surfaces 52d and 52e. Surface 52a opposes surface R1b of base region R1. For example, surface 52a and surface R1b oppose each other in a first direction D1. The pair of side surfaces 52b and 52c oppose each other in a second direction D2. The pair of end surfaces 52d and 52e oppose each other in a third direction D3. Surface 52a connects the pair of end surfaces 52d and 52e.

[0053] Each of the pair of side surfaces 52b and 52c is continuous with the corresponding side surface of the pair of side surfaces R1c and R1d. For example, side surface 52b is continuous with side surface R1c, and side surface 52c is continuous with side surface R1d. Each of the pair of end surfaces 52d and 52e is continuous with the corresponding side surface of the pair of end surfaces R1e and R1f. For example, end surface 52d is continuous with end surface R1e, and end surface 52e is continuous with end surface R1f. For example, if surface R1b includes the first surface, surface R1a includes the second surface, and surface 52a includes the third surface.

[0054] The outer surface of housing 5 includes surface 52a, a pair of side surfaces 52b and 52c, and a pair of end surfaces 52d and 52e. For example, surface 5a includes surface 52a, side surface 5c includes side surface 52b, side surface 5d includes side surface 52c, end surface 5e includes end surface 52d, and end surface 5f includes end surface 52e. For example, side surface 5c includes side surface R1c and side surface 52b, side surface 5d includes side surface R1d and side surface 52c. For example, end surface 5e includes end surface R1e and end surface 52d, and end surface 5f includes end surface R1f and end surface 52e.

[0055] like Figure 3 、 Figure 4 as well as Figure 5As shown, housing portion 52 includes regions R5 and R6. Region R5 includes surface 52a, a pair of side surfaces 52b and 52c, and a pair of end surfaces 52d and 52e. For example, region R5 covers base region R1, wall regions R2 and R3, region R4, component 2, and a pair of leads 3 and 4. Region R5 covers surface R1a and surface portions S1 of each of the pair of side surfaces R1c and R1d. For example, surface portions S2 of each of the pair of side surfaces R1c and R1d are exposed from region R5. For example, side surface 52b is continuous with the two surface portions S2 included in side surface 5c, and side surface 52c is continuous with the two surface portions S2 included in side surface 5d. For example, side surface 5c includes surface portions S2 of side surface 52b and side surface R1c, and side surface 5d includes surface portions S2 of side surface 52c and side surface R1d.

[0056] like Figure 3 and Figure 4 As shown, region R6 is located between the temperature sensing portion 21 and the inner surface Ha of the recess H. The housing portion 52 exists between the temperature sensing portion 21 and the inner surface Ha. Within the recess H, region R6 covers the temperature sensing portion 21. For example, the sealing portion 22 is separated from the inner surface Ha. Region R6 is located between the sealing portion 22 and the inner surface Ha. Within the recess H, region R6 indirectly covers the temperature sensing portion 21 via the sealing portion 22.

[0057] The process of forming the casing portion 52 including the regions R5 and R6 includes, for example, the following process.

[0058] For example, component 2 and a pair of leads 3 and 4 are placed in housing portion 51. With component 2 and a pair of leads 3 and 4 placed in housing portion 51, housing portion 51, component 2, and a pair of leads 3 and 4 are placed in a mold. Resin is injected into the mold containing housing portion 51, component 2, and a pair of leads 3 and 4. The resin injected into the mold solidifies. Through these processes, housing portion 52 made of resin is formed. This formed housing portion 52 covers component 2, a pair of leads 3 and 4, and housing portion 51.

[0059] As described above, in temperature sensor 1, temperature sensing portion 21 and pair of lead wires 23, 24 are housed in housing 5. Therefore, even if external force acts on temperature sensor 1, the external force is unlikely to affect element 2, and the position of pair of lead wires 23, 24 is unlikely to shift.

[0060] In the temperature sensor 1, the housing portion 51 includes a wall region R2. Wall region R2 is located between the pair of wires 23 and 24 and is arranged continuously with the base region R1. The base region R1 includes a surface R1a on which the pair of wires 23 and 24 are arranged. Therefore, even if the position of the pair of wires 23 and 24 within the housing 5 is shifted due to external forces acting on the temperature sensor 1, for example, the pair of wires 23 and 24 are unlikely to come into contact with each other.

[0061] As a result, the temperature sensor 1 prevents the pair of lead wires 23 and 24 from being short-circuited.

[0062] A temperature sensor with a component housed in a housing can be obtained, for example, by the following process: preparing a component separate from the housing; placing the component in the component; and housing the component and the component in the housing. In this case, the housing houses the component and the component in their entirety.

[0063] In a temperature sensor obtained through the above process, there is a risk of misalignment of the other components within the housing where the element is located. In a temperature sensor with misaligned other components, the element is more likely to shift position. This misalignment of the element can reduce the accuracy of temperature detection.

[0064] In temperature sensor 1, element 2 is disposed in housing portion 51. Housing portion 51 includes surface R1b included in the outer surface of housing 5. Therefore, temperature sensor 1 is a separate component from housing 5 and does not include a component in which element 2 is disposed. In temperature sensor 1, positional displacement of element 2 caused by a separate component from housing 5 is less likely to occur.

[0065] As a result, the temperature sensor 1 prevents a decrease in the accuracy of temperature detection.

[0066] In the temperature sensor 1, the portions 3b and 4b are housed in the housing 5. Therefore, external forces acting on the temperature sensor 1 are unlikely to affect the pair of leads 3 and 4, and the positions of the portions 3a and 4a are unlikely to shift.

[0067] In temperature sensor 1, wall region R2 is also located between portion 3a and portion 4a. Therefore, even if portions 3a and 4a are displaced within housing 5 due to external force acting on temperature sensor 1, portions 3a and 4a are unlikely to contact each other.

[0068] As a result, the temperature sensor 1 prevents the portion 3a from being short-circuited with the portion 4a. The temperature sensor 1 also prevents the solders 6 from being short-circuited with each other.

[0069] As described above, the process for forming the housing portion 52 includes, for example, placing the housing portion 51, the component 2, and a pair of leads 3 and 4 within a mold; and injecting resin into the mold. The mold includes a surface defining the end face 52d, and a resin injection port is formed, for example, on the surface defining the end face 52d. When a mold is used in which the resin injection port is formed on the surface defining the end face 52d, a force may be applied to the temperature sensing portion 21 (seal portion 22) from the resin injected into the mold. Specifically, when the resin is injected into the mold from the injection port, the injected resin may contact the temperature sensing portion 21 (seal portion 22), and a force may be applied to the temperature sensing portion 21 (seal portion 22). This force acting on the temperature sensing portion 21 (seal portion 22) may cause the temperature sensing portion 21 to shift relative to the housing portion 51. If the housing portion 52 is formed with the temperature sensing portion 21 shifted relative to the housing portion 51, there is a risk that the temperature sensing portion 21 within the housing portion 5 may shift. There is a risk that the positional deviation of the temperature sensing portion 21 in the housing 5 may reduce the accuracy of temperature detection.

[0070] In temperature sensor 1, at least a portion of temperature sensing portion 21 is located within recess H. Therefore, even when a mold formed on the surface defining end surface 52d is used as the resin injection port, the aforementioned force caused by the injected resin is less likely to act on temperature sensing portion 21 (seal portion 22). Consequently, the position of temperature sensing portion 21 relative to housing portion 51 is less likely to shift. Consequently, temperature sensor 1 minimizes degradation in temperature detection accuracy.

[0071] In temperature sensor 1 , housing portion 52 covers temperature sensing portion 21 and pair of lead wires 23 and 24 . Therefore, housing portion 52 protects not only temperature sensing portion 21 but also lead wires 23 and 24 . As a result, temperature sensor 1 reliably protects temperature sensing portion 21 and pair of lead wires 23 and 24 .

[0072] In the temperature sensor 1 , the housing portion 52 includes a region R6 . The region R6 is located between the temperature sensing portion 21 and the inner surface Ha of the recess H. Therefore, both the base region R1 and the region R6 protect the temperature sensing portion 21 . As a result, the temperature sensor 1 reliably protects the temperature sensing portion 21 .

[0073] In the temperature sensor 1, the case portion 52 is made of the same resin as the case portion 51. As a result, in the temperature sensor 1, the case 5 including the case portion 51 and the case portion 52 can be easily realized.

[0074] In temperature sensor 1, distance d1 is smaller than distance d2, and housing portion 52 includes region R5. Region R5 covers surface portion S1 included in each of a pair of side surfaces R1c and R1d. Temperature sensor 1 can increase the contact area between housing portion 51 and housing portion 52. As a result, temperature sensor 1 can improve the connection strength between housing portion 51 and housing portion 52.

[0075] In temperature sensor 1, wall region R2 is arranged continuously with region R11. Region R11 includes surface portions S1 included in each of a pair of side surfaces R1c and R1d. When viewed from first direction D1, wall region R2 is arranged between surface portions S1 included in side surface R1c and surface portions S1 included in side surface R1d. As described above, interval d1 is smaller than interval d2. Therefore, temperature sensor 1 can further increase the contact area between housing portion 51 and housing portion 52. As a result, temperature sensor 1 can further improve the connection strength between housing portion 51 and housing portion 52.

[0076] In the temperature sensor 1 , the housing portion 51 includes a wall region R3 . When viewed from the first direction D1 , the wall region R3 is located between the end surface R1 e and the temperature sensing portion 21 and is continuous with the base region R1 .

[0077] When the above-described mold is used to form the housing portion 52, the wall region R3 can be used to position the housing portion 51 within the mold. In this case, the positioning of the housing portion 51 within the mold can be easily achieved.

[0078] Even when using the aforementioned mold, wall region R3 can hinder the flow of resin from the resin injection port to temperature sensing portion 21 (seal portion 22). Therefore, the aforementioned force caused by the injected resin is less likely to act on temperature sensing portion 21 (seal portion 22). The position of temperature sensing portion 21 relative to housing portion 51 is less likely to shift. As a result, temperature sensor 1 minimizes degradation in temperature detection accuracy.

[0079] In temperature sensor 1, wall region R3 curves convexly toward end surface R1e when viewed from first direction D1. Consequently, the aforementioned forces caused by the injected resin are less likely to act on temperature sensing portion 21 (seal portion 22). The position of temperature sensing portion 21 relative to housing portion 51 is less likely to shift. As a result, temperature sensor 1 further minimizes degradation in temperature detection accuracy.

[0080] When using the above-described mold, resin injected from the resin injection port can also be guided along the curved surface of wall region R3. Therefore, wall region R3 is less likely to impede the flow of resin within the mold. The resin flows smoothly into recess H. As a result, in temperature sensor 1, region R6 is easily and reliably positioned between temperature sensing portion 21 and inner surface Ha of recess H.

[0081] In temperature sensor 1, housing portion 51 includes region R4. Region R4 covers the pair of lead wires 23 and 24 and is arranged continuously with wall region R2. As a result, even if external force acts on temperature sensor 1, the external force is less likely to affect element 2, and the position of the pair of lead wires 23 and 24 is less likely to shift.

[0082] In temperature sensor 1, seal portion 22 is made of a material different from that of case portion 51. In temperature sensor 1, both seal portion 22 and case portion 51, which are made of different materials, protect temperature sensing portion 21. As a result, temperature sensor 1 reliably protects temperature sensing portion 21.

[0083] It should be understood that all aspects, advantages and features described herein may not necessarily be achieved by any one specific example, and may not necessarily be included in any one specific example. In fact, after various examples have been described and illustrated herein, it is apparent that the configuration and details of other examples may be modified.

[0084] The recess H may not be formed in the base region R1. In a structure where the recess H is not formed in the base region R1, the temperature sensing portion 21, for example, the temperature sensing portion 21 and the sealing portion 22 may be arranged on the surface R1a of the base region R1 so that the surface of the sealing portion 22 contacts the surface R1a of the base region R1.

Claims

1. A temperature sensor, wherein: have: An element comprising a temperature sensing portion and a pair of wires connected to the temperature sensing portion; and a housing accommodating the temperature sensing portion and the pair of wires, The housing includes a housing portion including a first face included in an outer surface of the housing and including a resin, The housing portion comprises: a base region including the first surface and a second surface opposite to the first surface and provided with the pair of conductive wires; and The wall region is located between the pair of conductive wires and is continuously arranged with respect to the base region.

2. The temperature sensor according to claim 1, wherein A bottomed depression opening at the second surface is formed in the base region. At least a portion of the temperature sensing portion is located in the recess.

3. The temperature sensor according to claim 1 or 2, wherein: The housing further includes another housing portion, wherein the other housing portion includes a third surface included in the outer surface and opposite to the first surface. The other housing portion covers the temperature sensing portion and the pair of lead wires.

4. The temperature sensor according to claim 2, wherein: The housing further includes another housing portion, wherein the other housing portion includes a third surface included in the outer surface and opposite to the first surface. The temperature sensing portion and the inner surface of the recess are separated from each other. The other housing portion includes a region between the temperature sensing portion and the inner surface of the recess.

5. The temperature sensor according to claim 3 or 4, wherein: The other housing portion is made of the same resin as that of the housing portion.

6. The temperature sensor according to any one of claims 3 to 5, wherein: The housing portion includes a pair of side surfaces facing each other and connecting the first surface and the second surface. Each of the pair of side surfaces includes a first surface portion and a second surface portion different from the first surface portion, In the direction in which the pair of side surfaces are opposed to each other, the interval between the first surface portions is smaller than the interval between the second surface portions. The other housing portion includes a region covering the first surface portion included in each of the pair of side surfaces.

7. The temperature sensor according to claim 6, wherein: The base region includes: a first region portion including the first surface portion included in each of the pair of side surfaces; and a second region portion including the second surface portion included in each of the pair of side surfaces. The wall region is arranged partially continuously with the first region.

8. The temperature sensor according to any one of claims 1 to 7, wherein: The outer surface of the housing includes a first end surface and a second end surface, the first end surface and the second end surface are opposite to each other and connected to each other through the first surface, When viewed from a direction in which the first surface and the second surface are opposite to each other, the wall region is located between the temperature sensing portion and the first end surface. When viewed from the direction in which the first surface and the second surface are opposed to each other, the housing portion includes another wall region that is located between the second end surface and the temperature sensing portion and is arranged continuously with the base region.

9. The temperature sensor according to claim 8, wherein The other wall region is curved so as to be convex toward the second end surface when viewed from the direction in which the first surface and the second surface are opposed to each other.

10. The temperature sensor according to any one of claims 1 to 9, wherein: The housing portion includes a region covering the pair of wires and arranged continuously with the wall region.

11. The temperature sensor according to any one of claims 1 to 10, wherein: The element further includes a sealing portion that seals the temperature sensing portion and is formed of a material different from that of the housing portion.

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