Chip packaging test equipment capable of realizing automatic blanking

Abstract

The invention relates to the technical field of chip packaging, and discloses chip packaging test equipment capable of realizing automatic blanking, which comprises a current detection module and a base, the current detection module is mounted on the outer wall of the base, a rotating table is rotatably mounted on the base, a driving unit is mounted in the base, and the driving unit is used for driving the rotating table to rotate intermittently. A fixing frame is fixedly connected to the inner wall of the base, a negative pressure suction mechanism is installed on the top of the fixing frame, and a lifting mechanism is arranged on the driving unit and used for driving the negative pressure suction mechanism to intermittently ascend and descend. When the rotating table is driven to rotate intermittently, the transverse rod is synchronously controlled to ascend and descend intermittently. The linkage control mechanism ensures accurate time sequence matching among the movable parts, effectively eliminates efficiency loss and error risks caused by asynchronous actions of traditional equipment, ensures coordination among the movable parts, and is beneficial to improving chip test efficiency and test result accuracy.

Description

Technical Field

[0001] The present invention relates to the technical field of chip packaging, and in particular to chip packaging and testing equipment capable of realizing automatic unloading. Background Art

[0002] Chip packaging testing, a core component of semiconductor manufacturing, aims to ensure chip compliance with design standards through comprehensive inspections throughout the entire process, effectively screening for defective products. During static power supply current testing of chips, current probes contacting the chip pins can accurately detect manufacturing defects such as transistor gate oxide breakdown and bridge short circuits during the chip manufacturing process.

[0003] Existing technologies are constantly driving the automation innovation of testing equipment. The chip packaging and testing equipment proposed in the patent with technical announcement number CN117169685A realizes automatic chip placement and testing through a pick-and-place mechanism, significantly reducing the high labor intensity, high risk and low efficiency problems caused by manual operation, and greatly improving the testing efficiency. However, the equipment still has time-consuming bottlenecks in the automation process. The chip placement and testing process takes a long time, resulting in limited overall efficiency. To overcome this limitation, the patent with technical announcement number CN117590201A introduces a continuous testing mechanism to realize the synchronous operation of chip placement, testing and removal, effectively reducing the waiting time for placement and picking, and optimizing the testing efficiency.

[0004] The existing technical solutions still have significant defects in mechanical motion control: the inherent return difference between the stepper motor and the gear transmission causes the test slot's stopping positioning accuracy to deteriorate as the speed increases after the rotating seat rotates at high speed. Specifically, when the rotating seat stops after rapid rotation, the inertial force will cause the test slot to deviate from the preset manipulator unloading position, making it difficult to accurately place the chip in the test slot, thereby affecting the accuracy of the test results; in addition, this positioning offset phenomenon also increases the difficulty and response time of the hydraulic cylinder's dynamic adjustment. However, if the speed is reduced to ensure positioning accuracy, the test efficiency is sacrificed. This contradiction deeply reveals that there is still urgent room for improvement in the high-speed, high-precision mechanical collaborative control of current chip packaging and testing equipment. Summary of the Invention

[0005] In view of the problem of insufficient motion synchronization of multiple moving parts during chip transfer, a chip packaging and testing equipment that can realize automatic unloading is proposed.

[0006] Its purpose is: when the driving unit drives the rotating table to stop, it drives the negative pressure suction mechanism to descend. The negative pressure suction mechanism simultaneously grabs and places the chip, so that the same driving unit can drive multiple moving parts in a distributed manner, ensuring coordination and thus improving test efficiency.

[0007] The technical solution of the present invention is a chip packaging and testing device capable of automatic unloading, comprising a current detection module and a base having a circular tubular structure, wherein the current detection module is mounted on the outer wall of the base, a rotating table is rotatably mounted on the base, a driving unit is mounted within the base, the driving unit is used to drive the rotating table to intermittently rotate, a fixing frame is fixedly connected to the inner wall of the base, a negative pressure suction mechanism is mounted on the top of the fixing frame, and a lifting mechanism is provided on the driving unit, the lifting mechanism is used to drive the negative pressure suction mechanism to intermittently rise and fall; The negative pressure suction mechanism includes a plurality of air tubes arranged in an annular shape with equal spacing, one end of the air tube is connected to an adsorption plate, the bottom of the adsorption plate is provided with an adsorption groove for placing the chip, the top surface of the adsorption plate is fixedly connected to a guide rod, and the guide rod is vertically slidably matched with the rotating table; The lifting mechanism includes a rotating shaft that is transmission-connected to the drive unit, and a cross bar that is slidingly connected to the fixed frame. The end of the cross bar is arranged in a driving groove opened on the corresponding guide rod. The rotating shaft drives the cross bar to rise and fall intermittently, and the cross bar drives the corresponding guide rod to rise and fall. A driving rod is fixedly connected to the cross bar, and when the driving rod descends, the air supply to the upper air pipe is cut off.

[0008] Furthermore, the current detection module includes a support platform fixedly connected to the outer wall of the base, an electric push rod is installed at one end of the support platform, a detection probe is installed on the top of the electric push rod, and the detection probe is arranged under one of the adsorption plates.

[0009] Furthermore, the driving unit includes a motor fixedly installed in the base, the output end of the motor is fixedly connected to an incomplete gear, an inner ring gear is provided on the outside of the incomplete gear, a transmission gear is provided between the incomplete gear and the inner ring gear, the inner ring gear is fixedly connected to the bottom of the rotating table, and the transmission gear is rotatably installed on the inner wall of the base.

[0010] Furthermore, the top surfaces of the incomplete gear and the transmission gear are both fixedly connected to an annular plate, an arc-shaped notch is provided on the annular plate, and the arc side surface of the annular plate on the incomplete gear is in sliding contact with the arc-shaped notch on the other annular plate.

[0011] Furthermore, the negative pressure suction mechanism also includes a negative pressure cylinder, which is fixedly mounted on a fixed frame, a through hole in a superior arc-shaped structure is opened on the arc side of the negative pressure cylinder, a sealing ring is connected to the arc side wall of the negative pressure cylinder for sealing rotation, the upper part of the sealing ring is connected and fixed to the rotating table, and one end of the air pipe is connected to the sealing ring; A negative pressure tube is fixedly connected to the top of the negative pressure cylinder, and the other end of the negative pressure tube passes through the rotating table and is connected to external negative pressure equipment.

[0012] Furthermore, a fixing cylinder is movably sleeved on the outer wall of the guide rod, the fixing cylinder is connected and fixed to the bottom surface of the rotating table, and an elastic member 1 is commonly connected between the guide rod and the fixing cylinder.

[0013] Furthermore, the rotating shaft is connected and fixed to the top of the incomplete gear, a sleeve is movably sleeved on the outside of the rotating shaft, the sleeve is connected and fixed to the crossbar, and a driving rod is fixedly connected to the shaft wall of the rotating shaft, and a trapezoidal block is fixedly connected to the inner wall of the sleeve; A plurality of elastic members 2 are commonly connected between the cross bar and the fixing frame.

[0014] Furthermore, an air-blocking component is provided on the trachea, and the air-blocking component includes a U-shaped seat sleeved on the outside of the trachea, the U-shaped seat is fixedly connected to the rotating table, and an air-blocking plate is slidably connected inside the U-shaped seat, the lower end of the air-blocking plate extends to the outside of the U-shaped seat, and the driving rod is in friction contact with the corresponding air-blocking plate above.

[0015] Furthermore, a positioning assembly is installed on the adsorption plate, and the positioning assembly includes an annular airbag installed on the top of the adsorption plate, and a plurality of connecting tubes are connected to the annular airbag, and the other end of the connecting tube is connected to a telescopic airbag. The plurality of telescopic airbags are evenly distributed on the bottom surface of the adsorption plate and are fixedly connected to the adsorption plate. The side of the telescopic airbag facing the adsorption groove is fixedly connected to a positioning plate, and the positioning plate is slidably connected to the adsorption plate.

[0016] Compared with the prior art, the present invention has the following beneficial effects: 1. This system intermittently rotates the rotating table while simultaneously controlling the crossbar's intermittent raising and lowering. When the rotating table comes to a complete stop, the crossbar lowers the suction plate, automatically sucking in the chips using negative pressure. The driving lever on the crossbar precisely controls the opening and closing of the corresponding air pipe, allowing both the suction of new chips and the release of tested chips to be completed at the same station, eliminating the time-consuming steps of separate operations. This interlocking control mechanism ensures precise timing between the various moving parts, effectively eliminating the efficiency losses and risk of errors caused by asynchronous movements in traditional equipment, thereby improving chip testing efficiency and the accuracy of test results.

[0017] 2. After the adsorption plate rises, the annular airbag is pressed against the positioning plate, exerting a centripetal constraint force on the chip to achieve centering calibration, thereby realizing rapid alignment of the chip pins and the detection probe. This design does not require additional complex positioning devices. Through simple pneumatic transmission, it can quickly and accurately align the chip pins and the detection probe, reducing system complexity and hardware costs. At the same time, it can ensure that the chip does not fall when rotating in the adsorption tank, thereby improving safety.

[0018] 3. The dynamic allocation of negative pressure resources is achieved through the cooperation of the negative pressure cylinder and the sealing ring, which can effectively reduce the load power of the negative pressure equipment and the pressure fluctuation of the adsorption tank at the working position, thereby improving the success rate of chip adsorption at the working position and avoiding the risk of foreign matter being sucked into the adsorption plate in the air-off state. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] Figure 1 It is a three-dimensional schematic diagram of the overall structure of the present invention; Figure 2 This is a schematic structural diagram of the current detection module of the present invention; Figure 3 Schematic diagram of the internal structure of the rotating platform of the present invention; Figure 4 Schematic diagram of the drive unit structure of the present invention; Figure 5 Schematic diagram of the annular plate structure of the present invention; Figure 6 It is a vertical split schematic diagram of the negative pressure suction mechanism structure of the present invention; Figure 7 It is a schematic diagram of the guide rod and rotating platform structure of the present invention; Figure 8 It is a schematic structural diagram of the lifting mechanism of the present invention; Figure 9 This is a schematic diagram of the transverse splitting of the sleeve structure of the present invention; Figure 10 This is a schematic structural diagram of the driving rod and air blocking component of the present invention; Figure 11 It is a schematic diagram of the structure of the adsorption plate and positioning component of the present invention.

[0020] In the picture: 1. Base; 2. Rotating table; 3. Current detection module; 31. Support table; 32. Electric push rod; 33. Detection probe; 4. Drive unit; 41. Motor; 42. Incomplete gear; 43. Inner ring gear; 44. Transmission gear; 45. Ring plate; 46. Arc notch; 5. Fixed frame; 6. Negative pressure absorption mechanism; 61. Negative pressure cylinder; 62. Sealing ring; 63. Air pipe; 64. Adsorption plate; 65. Drive groove; 66. Guide rod; 7. Lifting mechanism; 71. Rotating shaft; 72. Drive rod; 73. Sleeve; 74. Cross bar; 75. Trapezoidal block; 76. Drive rod; 8. Air blocking component; 81. U-shaped seat; 82. Air blocking plate; 9. Positioning assembly; 91. Ring airbag; 92. Telescopic airbag; 93. Positioning plate. DETAILED DESCRIPTION

[0021] In order to make the above-mentioned objects, features and advantages of the present invention more obvious and easy to understand, the specific embodiments of the present invention are described in detail below with reference to the accompanying drawings.

[0022] Example 1, reference Figures 1-8 , which is the first embodiment of the present invention, provides a chip packaging and testing equipment capable of realizing automatic unloading, including a current detection module 3 and a base 1 having a circular tubular structure. The current detection module 3 is mounted on the outer wall of the base 1. A rotating table 2 is rotatably mounted on the base 1. A driving unit 4 is mounted inside the base 1. The driving unit 4 is used to drive the rotating table 2 to rotate intermittently. A fixing frame 5 is fixedly connected to the inner wall of the base 1. A negative pressure suction mechanism 6 is mounted on the top of the fixing frame 5. A lifting mechanism 7 is provided on the driving unit 4. The lifting mechanism 7 is used to drive the negative pressure suction mechanism 6 to intermittently rise and fall. The negative pressure suction mechanism 6 includes a plurality of air pumps arranged in a ring with equal spacing. Tube 63, one end of the air pipe 63 is connected to an adsorption plate 64, and an adsorption groove for placing chips is provided at the bottom of the adsorption plate 64. A guide rod 66 is fixedly connected to the top surface of the adsorption plate 64, and the guide rod 66 vertically slides with the rotating table 2; the lifting mechanism 7 includes a rotating shaft 71 that is transmission-connected to the drive unit 4, and a cross bar 74 that is slidingly connected to the fixed frame 5. The end of the cross bar 74 is arranged in a driving groove 65 provided on the corresponding guide rod 66. The rotating shaft 71 drives the cross bar 74 to rise and fall intermittently, and the cross bar 74 drives the corresponding guide rod 66 to rise and fall. A driving rod 76 is fixedly connected to the cross bar 74, and when the driving rod 76 descends, the air supply to the upper air pipe 63 is cut off.

[0023] Specifically, the drive unit 4 can synchronously drive the rotating shaft 71 to rotate and intermittently drive the rotating table 2 to rotate. When the rotating table 2 stops rotating, the rotating shaft 71 drives the crossbar 74 to descend, and the two ends of the crossbar 74 drive the corresponding guide rods 66 and adsorption plates 64 to descend synchronously through the driving grooves 65. At this time, one of the adsorption plates 64 completes the absorption of the chip to be detected through the adsorption groove; at the same time, the driving rod 76 descends with the crossbar 74, blocking the air supply channel of a certain air pipe 63 above, causing the corresponding adsorption plate 64 to stop adsorption and release the chip. The absorbed chip rotates with the rotating table 2 to the next workstation. When the rotating table 2 stops rotating again, the current detection module 3 performs current detection on the chip above.

[0024] Through the linkage control of the drive unit 4, the intermittent rotation of the turntable 2 and the intermittent lifting and lowering of the negative pressure suction mechanism 6 are precisely coordinated to ensure the timing synchronization of the chip in each link of suction, transfer and detection. The blocking design of the driving rod 76 on the air pipe 63 can simultaneously complete the actions of "absorbing new chips" and "releasing detected chips" at the same workstation, avoiding the time loss of traditional equipment that requires step-by-step operation and significantly improving the unloading efficiency.

[0025] In actual work, conveying platforms are symmetrically arranged on both sides below the rotating table 2. The two conveying platforms are respectively arranged on both sides of the length direction of the cross bar 74. One of the conveying platforms arranges the chips to be tested at equal intervals and maintains a constant conveying speed toward the side of the rotating table 2. The other conveying platform conveys the chips after testing to the side away from the rotating table 2.

[0026] Reference Figure 2 The current detection module 3 includes a support platform 31 fixedly connected to the outer wall of the base 1, an electric push rod 32 is installed at one end of the support platform 31, and a detection probe 33 is installed on the top of the electric push rod 32. The detection probe 33 is located below one of the adsorption plates 64.

[0027] Specifically, when the rotating table 2 stops rotating, the control system synchronously triggers the electric push rod 32 to start, driving the detection probe 33 to move linearly upward. At this point, the adsorption plate 64 has accurately positioned the chip directly above the detection probe 33, and the chip pins and the detection probe 33 maintain vertical alignment. As the detection probe 33 continues to rise, its top forms stable physical contact with the chip pins, and power is supplied through the preset detection circuit. The control system collects current data and analyzes and processes it to complete the current detection of the chip. After the test is completed, the electric push rod 32 drives the detection probe 33 to descend and reset, waiting for the next cycle of detection instructions.

[0028] Reference Figure 4 The driving unit 4 includes a motor 41 fixedly installed in the base 1, and an incomplete gear 42 is fixedly connected to the output end of the motor 41. An inner ring gear 43 is sleeved on the outer side of the incomplete gear 42. A transmission gear 44 is provided between the incomplete gear 42 and the inner ring gear 43. The inner ring gear 43 is fixedly connected to the bottom of the rotating table 2, and the transmission gear 44 is rotatably installed on the inner wall of the base 1.

[0029] Specifically, the motor 41 keeps rotating clockwise after starting ( Figure 4 The incomplete gear 42 (from a top-down perspective) rotates at a uniform speed, driving the incomplete gear 42 to rotate synchronously. When the teeth of the incomplete gear 42 engage with the transmission gear 44, the power is transmitted to the turntable 2 through the transmission gear 44 and the inner ring gear 43 in sequence, driving the turntable 2 to rotate counterclockwise. Since the incomplete gear 42 is only partially provided with teeth, when the toothless portion rotates to the position corresponding to the transmission gear 44, the engagement is interrupted and the turntable 2 stops rotating. As the incomplete gear 42 continues to rotate, its teeth will periodically engage with the transmission gear 44, thereby achieving intermittent counterclockwise rotation of the turntable 2. By precisely designing the number of teeth and tooth width of the incomplete gear 42 and the transmission ratio of the transmission gear 44, it can be ensured that the turntable 2 rotates at the same angle each time, thereby achieving precise station switching of the chip packaging and testing equipment.

[0030] The arc length of the teeth of the incomplete gear 42 matches the number of suction plates 64 in the following relationship: when n suction plates 64 are evenly distributed on the turntable 2, the central angle θ corresponding to the arc length of the teeth of the incomplete gear 42 satisfies the formula θ = 360° / n. With this design, for every clockwise rotation of the incomplete gear 42 driven by the motor 41, its teeth, via the transmission gear 44, drive the inner ring gear 43 to rotate counterclockwise by an angle of exactly 360° / n, ensuring that each suction plate 64 on the turntable 2 precisely moves to the initial position of the adjacent suction plate 64.

[0031] Reference Figure 5 The top surfaces of the incomplete gear 42 and the transmission gear 44 are fixedly connected to an annular plate 45 , and an arc-shaped recess 46 is provided on the annular plate 45 . The arc side surface of the annular plate 45 on the incomplete gear 42 is in sliding contact with the arc-shaped recess 46 on the other annular plate 45 .

[0032] Specifically, when the teeth of the incomplete gear 42 disengage from the transmission gear 44, the transmission gear 44 may have a slight tendency to rotate due to inertia. At this time, the arcuate side surface of the annular plate 45 on the incomplete gear 42 slides into the arcuate recess 46 of the annular plate 45 on the transmission gear 44, forming a high-precision mechanical limit structure. The contour of the arcuate recess 46 perfectly matches the arcuate side surface of the annular plate 45. Through this mechanical interlocking, the freedom of the transmission gear 44 is effectively limited, thereby preventing the rotating table 2 from being displaced due to external force disturbance or inertia. When the incomplete gear 42 enters the meshing state again, the arcuate side surface of the annular plate 45 and the arcuate recess 46 are smoothly separated, ensuring that the transmission process is not interfered with.

[0033] Reference Figure 6 The negative pressure suction mechanism 6 also includes a negative pressure cylinder 61, which is fixedly installed on the fixed frame 5. A through hole with an arc-shaped structure is opened on the arc side of the negative pressure cylinder 61. The arc side wall of the negative pressure cylinder 61 is sealed and rotatably connected with a sealing ring 62. The upper part of the sealing ring 62 is fixedly connected to the rotating table 2, and one end of the air pipe 63 is connected to the sealing ring 62; the top of the negative pressure cylinder 61 is fixedly connected to a negative pressure pipe, and the other end of the negative pressure pipe passes through the rotating table 2 and is connected to the external negative pressure equipment.

[0034] Specifically, when the turntable 2 stops rotating and the adsorption plate 64 descends to the top of the conveying platform, the negative pressure device continuously supplies air to the negative pressure cylinder 61 through the negative pressure pipe, forming a stable negative pressure environment. At this time, the air pipe 63 connected to the through-hole area of ​​the negative pressure cylinder 61 transmits the negative pressure to the corresponding adsorption groove of the adsorption plate 64, forming a pressure difference on the surface of the chip to ensure that the chip is reliably adsorbed. When the adsorption plate 64 rotates to the next station with the turntable 2, the relative rotation of the sealing ring 62 and the negative pressure cylinder 61 causes the air pipe 63 to gradually separate from the through-hole area, and the negative pressure in the adsorption groove gradually dissipates, realizing the precise release of the chip.

[0035] It should be noted that through the precise rotational coordination of the sealing ring 62 and the negative pressure cylinder 61, the system realizes dynamic control of negative pressure adsorption: when and only when the port of the trachea 63 is completely aligned with the superior arc-shaped through hole of the negative pressure cylinder 61, the corresponding adsorption groove of the adsorption plate 64 is connected to the negative pressure source to form an effective negative pressure environment.

[0036] During the rotation of the turntable 2, the air pipes 63 that are not aligned with the through-holes are in a closed state, and the corresponding adsorption plates 64 do not generate suction. This design offers three technical advantages: When the adsorption plates 64 are not in operation, they are deactivated, reducing the effective load of the negative pressure equipment; by dynamically allocating negative pressure resources, the pressure fluctuations in the adsorption tanks at the working position are kept within a narrow range, significantly better than the fluctuation range of traditional static negative pressure systems; and when the adsorption plates 64 are deactivated, the risk of foreign matter adsorption is eliminated, while also reducing leaks within the system, thereby improving the success rate of chip adsorption at the working position.

[0037] Reference Figure 3 、 Figure 7 The outer wall of the guide rod 66 is movably sleeved with a fixed cylinder, the fixed cylinder is connected and fixed to the bottom surface of the rotating table 2, and an elastic member 1 is commonly connected between the guide rod 66 and the fixed cylinder.

[0038] Specifically, the fixed cylinder and the guide rod 66 form a sliding substructure to ensure the vertical movement accuracy of the guide rod 66. In the initial state, the elastic member 1 lifts the guide rod 66 to the highest position, so that the bottom surface of the adsorption plate 64 maintains a certain safety distance from the top of the conveyor platform. When the end of the crossbar 74 enters the driving groove 65 and descends, the groove wall applies a downward driving force to the guide rod 66, overcoming the pre-tightening force of the elastic member 1, so that the guide rod 66 descends smoothly. During this process, the movement trajectory of the adsorption plate 64 maintains strict parallelism with the surface of the conveyor platform, ensuring the flatness of the chip adsorption.

[0039] Reference Figure 3 、 Figure 8 and Figure 9 The rotating shaft 71 is connected and fixed to the top of the incomplete gear 42, and a sleeve 73 is movably sleeved on the outside of the rotating shaft 71. The sleeve 73 is connected and fixed to the cross bar 74, and a driving rod 72 is fixedly connected to the shaft wall of the rotating shaft 71, and a trapezoidal block 75 is fixedly connected to the inner wall of the sleeve 73; a plurality of elastic members 2 are commonly connected between the cross bar 74 and the fixed frame 5.

[0040] Specifically, when the teeth of the incomplete gear 42 disengage from the transmission gear 44, the drive rod 72 rotates synchronously with the rotating shaft 71 until it contacts the trapezoidal block 75. At this point, the arcuate end surface of the drive rod 72 performs a rolling friction motion along the inclined surface of the trapezoidal block 75, converting the circular motion into linear motion, allowing the sleeve 73 to descend smoothly. As the crossbar 74 descends synchronously with the sleeve 73, it applies a vertical downward driving force to the guide rod 66, ensuring that the guide rod 66 overcomes the resistance of the elastic member 1 and descends precisely. When the drive rod 72 loses contact with the trapezoidal block 75, the elastic member 2 drives the sleeve 73 and crossbar 74 upward and back to their original position.

[0041] Example 2, reference Figure 3 、 Figure 10 , which is the second embodiment of the present invention. This embodiment is different from the first embodiment in that: an air blocking component 8 is provided on the air pipe 63, and the air blocking component 8 includes a U-shaped seat 81 sleeved on the outside of the air pipe 63, the U-shaped seat 81 is fixedly connected to the rotating table 2, and an air blocking plate 82 is slidably connected inside the U-shaped seat 81. The lower end of the air blocking plate 82 extends to the outside of the U-shaped seat 81, and the driving rod 76 is in friction contact with the corresponding air blocking plate 82 above.

[0042] Specifically, the driving rod 76 and the air blocking plate 82 are both L-shaped structures. When the cross bar 74 descends, the upper protruding section of the driving rod 76 contacts the lower protruding section of the air blocking plate 82, causing the air blocking plate 82 to slide downward. The upper end of the air blocking plate 82 cooperates with the lower part of the U-shaped seat 81 to press the air pipe 63, and the inner cavity of the air pipe 63 is reduced, so that the air flow in the air pipe 63 is effectively reduced, ensuring the reliable release of the chip.

[0043] The air pipe 63 is made of a rubber material that is flexible and deformable, and the air pipe 63 can automatically return to its original position when the driving rod 76 stops driving the air blocking plate 82 downward. The remaining structure is the same as that of the first embodiment.

[0044] Example 3, reference Figure 7 、 Figure 11 , which is the third embodiment of the present invention. This embodiment is different from the second embodiment in that: a positioning component 9 is installed on the adsorption plate 64, and the positioning component 9 includes an annular airbag 91 installed on the top of the adsorption plate 64. A plurality of connecting tubes are connected to the annular airbag 91, and the other end of the connecting tube is connected to a telescopic airbag 92. The plurality of telescopic airbags 92 are evenly distributed on the bottom surface of the adsorption plate 64 and are fixedly connected to the adsorption plate 64. A positioning plate 93 is fixedly connected to the side of the telescopic airbag 92 facing the adsorption groove, and the positioning plate 93 is slidably connected to the adsorption plate 64.

[0045] Specifically, when the suction plate 64 completes chip absorption and moves upward, the annular airbag 91 contacts and compresses the bottom surface of the fixed tube. The pressurized gas flows through the connecting tube to the telescopic airbag 92, causing it to expand laterally. The four evenly spaced telescopic airbags 92 simultaneously push the positioning plate 93 to slide. The multiple positioning plates 93 cooperate to exert a centripetal restraining force on the chip. This force quickly centers the chip, ensuring that the alignment error between the chip pins and the detection probe 33 is within the allowable error range.

[0046] When the adsorption plate 64 descends, the annular airbag 91 automatically recovers and extracts the air in the telescopic airbag 92, and the positioning plate 93 moves in the opposite direction to cancel the contact with the chip. The rest of the structure of the positioning plate 93 is the same as that of the second embodiment.

[0047] In summary, the working principle of the present invention is as follows: This chip packaging and testing equipment achieves automated chip testing based on the coordinated operation of multiple mechanisms. Motor 41 drives the incomplete gear 42 to rotate clockwise at a constant speed. Through the meshing of the transmission gear 44 and the inner ring gear 43, it intermittently drives the turntable 2 to rotate counterclockwise. When the turntable 2 stops rotating, the lifting shaft 71 drives the crossbar 74 downward. The crossbar 74, through the driving groove 65, lowers the guide rod 66 and the adsorption plate 64. At this time, the air pipe 63 connected to the through hole of the negative pressure cylinder 61 transmits negative pressure to the adsorption groove of the adsorption plate 64, attracting the chip to be tested. Simultaneously, the driving rod 76 descends, blocking the airflow of the air pipe 63 above via the air blocking component 8, causing the corresponding adsorption plate 64 to release the tested chip. The attracted chip rotates with the turntable 2 to the testing station. The electric push rod 32 of the current detection module 3 drives the detection probe 33 upward, contacting the chip pins and energizing to complete the current detection.

[0048] It should be noted that the above embodiments are only used to illustrate the technical solutions of the present invention and are not intended to limit the present invention. Although the present invention has been described in detail with reference to the preferred embodiments, those skilled in the art should understand that the technical solutions of the present invention may be modified or replaced by equivalents without departing from the spirit and scope of the technical solutions of the present invention, which should all be included in the scope of the claims of the present invention.

Claims

1. A chip packaging and testing device capable of realizing automatic unloading, comprising a current detection module (3), characterized in that: It also includes a base (1) with a circular tubular structure, the current detection module (3) is installed on the outer wall of the base (1), a rotating table (2) is rotatably installed on the base (1), a driving unit (4) is installed in the base (1), and the driving unit (4) is used to drive the rotating table (2) to rotate intermittently, a fixing frame (5) is fixedly connected to the inner wall of the base (1), a negative pressure suction mechanism (6) is installed on the top of the fixing frame (5), and a lifting mechanism (7) is provided on the driving unit (4), and the lifting mechanism (7) is used to drive the negative pressure suction mechanism (6) to intermittently rise and fall; The negative pressure suction mechanism (6) includes a plurality of air tubes (63) arranged in an annular shape and at equal intervals, one end of the air tube (63) is connected to an adsorption plate (64), the bottom of the adsorption plate (64) is provided with an adsorption groove for placing a chip, the top surface of the adsorption plate (64) is fixedly connected to a guide rod (66), and the guide rod (66) is vertically slidably matched with the rotating table (2); The lifting mechanism (7) includes a rotating shaft (71) connected to the driving unit (4) in a transmission manner, and a cross bar (74) connected to the fixed frame (5) in a sliding manner. The end of the cross bar (74) is arranged in a driving groove (65) provided on the corresponding guide rod (66). The rotating shaft (71) drives the cross bar (74) to be raised and lowered intermittently. The cross bar (74) drives the corresponding guide rod (66) to be raised and lowered. A driving rod (76) is fixedly connected to the cross bar (74). When the driving rod (76) descends, the air supply to the upper air pipe (63) is cut off.

2. The chip packaging and testing equipment capable of automatic unloading according to claim 1, characterized in that: The current detection module (3) comprises a support platform (31) fixedly connected to the outer wall of the base (1), an electric push rod (32) is mounted on one end of the support platform (31), a detection probe (33) is mounted on the top of the electric push rod (32), and the detection probe (33) is arranged below one of the adsorption plates (64).

3. The chip packaging and testing equipment capable of automatic unloading according to claim 1, characterized in that: The driving unit (4) includes a motor (41) fixedly mounted in the base (1), an output end of the motor (41) is fixedly connected to an incomplete gear (42), an inner ring gear (43) is sleeved on the outer side of the incomplete gear (42), a transmission gear (44) is provided between the incomplete gear (42) and the inner ring gear (43), the inner ring gear (43) is fixedly connected to the bottom of the rotating platform (2), and the transmission gear (44) is rotatably mounted on the inner wall of the base (1).

4. The chip packaging and testing equipment capable of automatic unloading according to claim 3, characterized in that: The top surfaces of the incomplete gear (42) and the transmission gear (44) are both fixedly connected to an annular plate (45), and an arc-shaped notch (46) is provided on the annular plate (45). The arc side surface of the annular plate (45) located on the incomplete gear (42) is in sliding contact with the arc-shaped notch (46) on the other annular plate (45).

5. The chip packaging and testing equipment capable of automatic unloading according to claim 1, characterized in that: The negative pressure suction mechanism (6) further comprises a negative pressure cylinder (61), the negative pressure cylinder (61) being fixedly mounted on the fixing frame (5), a through hole in an arc-shaped structure being provided on the arc side of the negative pressure cylinder (61), a sealing ring (62) being rotatably connected to the arc side wall of the negative pressure cylinder (61), the upper portion of the sealing ring (62) being fixedly connected to the rotating table (2), and one end of the air pipe (63) being in communication with the sealing ring (62); A negative pressure tube is fixedly connected to the top of the negative pressure cylinder (61), and the other end of the negative pressure tube passes through the rotating table (2) and is connected to external negative pressure equipment.

6. The chip packaging and testing equipment capable of automatic unloading according to claim 3, characterized in that: The outer wall of the guide rod (66) is movably sleeved with a fixed cylinder, the fixed cylinder is connected and fixed to the bottom surface of the rotating platform (2), and an elastic member 1 is commonly connected between the guide rod (66) and the fixed cylinder.

7. The chip packaging and testing equipment capable of automatic unloading according to claim 1, characterized in that: The rotating shaft (71) is fixedly connected to the top of the incomplete gear (42); a sleeve (73) is movably sleeved on the outside of the rotating shaft (71); the sleeve (73) is fixedly connected to the crossbar (74); a driving rod (72) is fixedly connected to the shaft wall of the rotating shaft (71); and a trapezoidal block (75) is fixedly connected to the inner wall of the sleeve (73); A plurality of elastic members 2 are commonly connected between the crossbar (74) and the fixing frame (5).

8. The chip packaging and testing equipment capable of automatic unloading according to claim 1, characterized in that: An air blocking component (8) is provided on the air pipe (63), and the air blocking component (8) includes a U-shaped seat (81) sleeved on the outside of the air pipe (63), the U-shaped seat (81) is fixedly connected to the rotating table (2), and an air blocking plate (82) is slidably connected inside the U-shaped seat (81), the lower end of the air blocking plate (82) extends to the outside of the U-shaped seat (81), and the driving rod (76) is in friction contact with the corresponding air blocking plate (82) above.

9. The chip packaging and testing equipment capable of automatic unloading according to claim 1, characterized in that: A positioning assembly (9) is installed on the adsorption plate (64), and the positioning assembly (9) includes an annular airbag (91) installed on the top of the adsorption plate (64). The annular airbag (91) is connected to a plurality of connecting tubes, and the other end of the connecting tube is connected to a telescopic airbag (92). The plurality of telescopic airbags (92) are evenly distributed on the bottom surface of the adsorption plate (64) and are fixedly connected to the adsorption plate (64). The telescopic airbag (92) is fixedly connected to a positioning plate (93) on the side facing the adsorption groove, and the positioning plate (93) is slidably connected to the adsorption plate (64).

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