Ink layer offset measurement method and device, offset monitoring equipment and storage medium

Abstract

The invention provides an ink layer offset measurement method and device, offset monitoring equipment and a storage medium. The method comprises the following steps: acquiring a first PCB image of a target PCB; extracting first position data of the solder resist alignment target from the first PCB image; extracting second position data of a first ink offset target on the target PCB from the first PCB image; the first ink offset target is obtained by processing when a first ink layer is processed on a target PCB, and the first ink offset target is a part of the first ink layer; and calculating first offset data of the first ink layer and the copper layer according to the first position data and the second position data. Therefore, the processing of the first ink layer and the calculation of the offset data of the first ink layer can be realized only by arranging one solder resist alignment target on the copper layer of the target PCB, compared with the prior art, the number of the solder resist alignment targets is effectively reduced, and the utilization rate of the target PCB is improved.

Description

Technical Field

[0001] The present invention relates to the technical field of printed circuit board manufacturing, and in particular to an ink layer offset measurement method, device, offset monitoring equipment and storage medium. Background Art

[0002] Printed circuit boards (PCBs), also known as printed circuit boards, are core components of modern electronic devices. They typically consist of a core layer, a copper layer, and an ink layer. During the ink layer processing, independent alignment targets and offset coupons are required on the PCB. The alignment targets are used to align the exposure mask with the PCB, while the offset coupons assist in calculating the offset of the ink layer after processing.

[0003] Currently, ink layer processing includes a primary solder mask process and a secondary solder mask process. In both the primary and secondary solder mask processes, alignment targets and offset coupons need to be set on the PCB board. In addition, the alignment targets and offset coupons of the two solder mask processes need to be designed independently. This design method increases the number of alignment targets and offset coupons to be designed, which will occupy more PCB board area and result in low PCB board utilization. Summary of the Invention

[0004] The present invention provides an ink layer offset measurement method, device, offset monitoring equipment and storage medium to solve the problem of low PCB board utilization.

[0005] A method for measuring the offset of an ink layer, comprising: Acquire a first PCB image of a target PCB board, where the first PCB image is captured when a first ink layer is processed on the target PCB board based on a solder mask alignment target; the solder mask alignment target is obtained when processing a copper layer of the target PCB board, and the solder mask alignment target is a portion of the copper layer; Extracting first position data of the solder mask alignment target from the first PCB image; extracting second position data of a first ink offset target on the target PCB board from the first PCB image; the first ink offset target is obtained when processing the first ink layer on the target PCB board, and the first ink offset target is a portion of the first ink layer; First offset data of the first ink layer and the copper layer are calculated based on the first position data and the second position data.

[0006] In the above ink layer offset measurement method, optionally, the first ink offset target is obtained by processing as follows: Based on the solder resist comparison target, aligning the target PCB board coated with solder resist ink with a first exposure mask, wherein the first exposure mask includes a first mask pattern, and the first mask pattern includes a first target pattern; Curing the solder resist ink on the target PCB board through the first mask pattern using an exposure machine; The target PCB board after the curing treatment is developed to remove the uncured solder resist ink on the target PCB board to obtain the first ink layer, wherein the first ink layer includes the first ink offset target corresponding to the first target pattern.

[0007] The above ink layer offset measurement method may optionally include aligning the target PCB board coated with solder resist ink with the first exposure mask based on the solder resist comparison target, including: Preliminarily aligning the target PCB board with the first exposure mask; Acquire a second PCB image of the target PCB board; extracting third position data of the solder resist comparison target and fourth position data of the first target pattern from the second PCB image; Calculating second offset data between the first exposure mask and the target PCB board based on the third position data and the fourth position data; Determining whether the second offset data is greater than a preset first offset threshold; If the second offset data is less than or equal to the first offset threshold, it is determined that the target PCB board is aligned with the first exposure mask; If the second offset data is greater than the first offset threshold, the position of the first exposure mask or the target PCB board is adjusted according to the second offset data, and the process returns to the step of obtaining the third position data of the solder mask comparison target and the fourth position data of the first target pattern.

[0008] The above-mentioned method for measuring the offset of the ink layer may optionally include, after calculating and obtaining the first offset data of the first ink layer based on the first position data and the second position data: Acquire a third PCB image of the target PCB board; the third PCB image is captured when the second ink layer processing is completed on the target PCB board based on the solder mask alignment target; extracting fifth position data of a second ink offset target on the target PCB board from the third PCB image; the second ink offset target is obtained when processing the second ink layer on the target PCB board, and the second ink offset target is a portion of the second ink layer; Third offset data between the second ink layer and the first ink layer is calculated based on the fifth position data and the second position data.

[0009] In the above ink layer offset measurement method, optionally, the second ink offset target is obtained by processing as follows: Based on the solder resist comparison target, aligning the target PCB board re-coated with solder resist ink with a second exposure mask, wherein the second exposure mask includes a second mask pattern, and the second mask pattern includes a second target pattern; Curing the solder resist ink on the target PCB board through the second mask pattern using an exposure machine; The target PCB board after the curing treatment is developed to remove the uncured solder resist ink on the target PCB board to obtain the second ink layer, wherein the second ink layer includes the second ink offset target corresponding to the second target pattern.

[0010] In the above ink layer offset measurement method, optionally, the first ink offset target and the solder resist offset target are nested with each other.

[0011] In the above-mentioned ink layer offset measurement method, optionally, the solder resist offset target includes an inner target and an outer target, and the inner target is embedded in the outer target.

[0012] An ink layer deflection measuring device, comprising: a first image acquisition module, configured to acquire a first PCB image of a target PCB board, wherein the first PCB image is obtained when a first ink layer is processed on the target PCB board based on a solder mask alignment target; the solder mask alignment target is obtained when a copper layer of the target PCB board is processed, and the solder mask alignment target is a portion of the copper layer; A first position extraction module, configured to extract first position data of the solder mask alignment target from the first PCB image; a second position extraction module, configured to extract second position data of a first ink offset target on the target PCB board from the first PCB image; the first ink offset target is obtained when processing the first ink layer on the target PCB board, and the first ink offset target is a portion of the first ink layer; The first data calculation module is configured to calculate first offset data of the first ink layer and the copper layer according to the first position data and the second position data.

[0013] A deviation monitoring device comprises a memory, a processor and a computer program stored in the memory and executable on the processor, wherein the processor implements any one of the above-mentioned methods for measuring the deviation of the ink layer when executing the computer program.

[0014] A computer-readable storage medium stores a computer program, wherein the computer program, when executed by a processor, implements any of the above-mentioned methods for measuring the offset of an ink layer.

[0015] The present invention provides an ink layer offset measurement method, device, offset monitoring device, and storage medium. The method comprises: obtaining a first PCB image of a target PCB board, the first PCB image being obtained by photographing the first ink layer on the target PCB board based on a solder mask alignment target; the solder mask alignment target being obtained when processing the copper layer of the target PCB board, and the solder mask alignment target being a portion of the copper layer; extracting first position data of the solder mask alignment target from the first PCB image; extracting second position data of a first ink offset target on the target PCB board from the first PCB image; the first ink offset target being obtained when processing the first ink layer on the target PCB board, and the first ink offset target being a portion of the first ink layer; and calculating first offset data of the first ink layer and the copper layer based on the first position data and the second position data. It can be seen that the present invention only requires setting a solder mask alignment target on the copper layer of the target PCB board to achieve the processing of the first ink layer and the calculation of the offset data of the first ink layer. Compared with the prior art, the method effectively reduces the number of solder mask alignment targets and improves the utilization rate of the target PCB board. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the following briefly introduces the drawings required for use in the description of the embodiments of the present invention. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying any creative labor.

[0017] Figure 1 is a flow chart of an implementation method of measuring the offset of an ink layer in one embodiment of the present invention; Figure 2 is a flowchart of a partial implementation of a method for measuring the offset of an ink layer according to an embodiment of the present invention; Figure 3 1 is a schematic structural diagram of a first ink shift target and a second ink shift target in one embodiment of the present invention; Figure 4 is another implementation flow chart of the method for measuring the offset of an ink layer according to one embodiment of the present invention; Figure 5is a flowchart of a partial implementation of a method for measuring the offset of an ink layer according to an embodiment of the present invention; Figure 6 is a flowchart of a partial implementation of a method for measuring the offset of an ink layer according to an embodiment of the present invention; Figure 7 2 is a schematic structural diagram of an ink layer offset measurement device according to an embodiment of the present invention; Figure 8 2 is a schematic structural diagram of an offset monitoring device according to an embodiment of the present invention. DETAILED DESCRIPTION

[0018] In order to make the technical problems, technical solutions and beneficial effects solved by the present invention more clearly understood, the present invention is further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain the present invention and are not intended to limit the present invention.

[0019] The present invention provides an ink layer offset measurement method, device, offset monitoring device, and storage medium. The method comprises obtaining first position data of a solder mask alignment target on a target PCB board; the solder mask alignment target is obtained when processing the copper layer of the target PCB board, and the solder mask alignment target is a part of the copper layer; obtaining second position data of a first ink offset target on the target PCB board; the first ink offset target is obtained when processing the first ink layer of the target PCB board based on a solder mask comparison target, and the first ink offset target is a part of the first ink layer; and calculating first offset data of the first ink layer based on the first position data and the second position data. It can be seen that the present invention only requires setting a solder mask alignment target on the copper layer of the target PCB board to realize the processing of the first ink layer and the calculation of the offset data of the first ink layer. Compared with the prior art, the number of solder mask alignment targets is effectively reduced, and the utilization rate of the target PCB board is improved. This will be described below through specific embodiments.

[0020] In one embodiment, Figure 1 FIG. 1 is a flowchart illustrating an implementation method for measuring the offset of an ink layer disclosed in an embodiment of the present invention. The method is applicable to alignment and offset calculation in a primary solder mask process and / or a secondary solder mask process during PCB manufacturing, and specifically includes the following steps: S101: Acquire a first PCB image of a target PCB board.

[0021] Among them, the first PCB image is taken when the first ink layer processing is completed on the target PCB board based on the solder mask alignment target; the solder mask alignment target is obtained when processing the copper layer of the target PCB board, and the solder mask alignment target is part of the copper layer.

[0022] In a specific implementation, in this embodiment, an image acquisition device can capture an image of the target PCB after the first ink layer is processed on the target PCB to obtain a first PCB image of the target PCB. The shape of the solder mask alignment target includes, but is not limited to, a circle, a square, or a composite shape composed of multiple circles or squares. The specific shape of the solder mask alignment target is not limited in this embodiment.

[0023] S102: Extracting first position data of a solder mask alignment target from a first PCB image.

[0024] The first position data in this embodiment refers to the position of the solder resist alignment target on the target PCB board, such as the coordinates of the solder resist alignment target in the target PCB board coordinate system.

[0025] It should be understood that after the first ink layer is applied to the target PCB, the solder mask alignment target beneath the ink layer remains clearly visible due to the high light transmittance of the solder mask ink. Therefore, the target detection algorithm can be used to identify the solder mask alignment target in the first PCB image and obtain the first position data of the solder mask alignment target. For example, if the solder mask alignment target is circular, the first position data is the coordinates of the center of the solder mask alignment target.

[0026] S103: Extracting second position data of a first ink offset target on the target PCB board from the first PCB image; the first ink offset target is obtained when processing the first ink layer on the target PCB board, and the first ink offset target is a part of the first ink layer.

[0027] As will be understood, in this embodiment, the first ink layer is obtained after curing and developing. The development process removes uncured solder resist ink, resulting in the first ink layer. The first ink offset target is the portion of the first ink layer that remains after the development process. Using a target detection algorithm, the first ink offset target is identified in the first PCB image to obtain second position data for the first ink offset target. The shape of the first ink offset target includes, but is not limited to, a circle, a square, or a composite shape composed of multiple circles or squares. The specific shape of the first ink offset target is not limited in this embodiment. For example, if the first ink offset target is circular, the second position data is the coordinates of the center of the first ink offset target.

[0028] S104: Calculate and obtain first offset data of the first ink layer and the copper layer according to the first position data and the second position data.

[0029] It can be understood that the smaller the value of the first offset data, the smaller the offset between the first ink layer and the copper layer, and the higher the accuracy of the target PCB board. The larger the value of the first offset data, the greater the offset between the first ink layer and the copper layer, and the lower the accuracy of the target PCB board.

[0030] In a specific implementation, in this embodiment, the Euclidean distance between the first position data and the second position data can be used as the first offset data to determine whether the value of the first offset data is greater than a preset offset threshold. If the value of the first offset data is greater than the offset threshold, it indicates that the target PCB board is a defective product and needs to be reprocessed or treated as waste. If the value of the first offset data is less than or equal to the offset threshold, it indicates that the target PCB board is a good product.

[0031] In summary, the present invention provides a method for measuring the offset of an ink layer. The method comprises: obtaining a first PCB image of a target PCB board, the first PCB image being obtained by photographing the first ink layer on the target PCB board based on a solder mask alignment target; the solder mask alignment target being obtained when processing the copper layer of the target PCB board, and the solder mask alignment target being a part of the copper layer; extracting first position data of the solder mask alignment target from the first PCB image; extracting second position data of a first ink offset target on the target PCB board from the first PCB image; the first ink offset target being obtained when processing the first ink layer on the target PCB board, and the first ink offset target being a part of the first ink layer; and calculating first offset data of the first ink layer and the copper layer based on the first position data and the second position data. It can be seen that the present invention only requires setting a solder mask alignment target on the copper layer of the target PCB board to realize the processing of the first ink layer and the calculation of the offset data of the first ink layer. Compared with the prior art, the method effectively reduces the number of solder mask alignment targets and improves the utilization rate of the target PCB board.

[0032] In one embodiment, Figure 2 As shown, the first ink offset target in this embodiment is obtained by processing as follows: S201: Based on the solder resist comparison target, aligning a target PCB board coated with solder resist ink with a first exposure mask, where the first exposure mask includes a first mask pattern, and the first mask pattern includes a first target pattern.

[0033] S202: Curing the solder resist ink on the target PCB board through the first mask pattern using an exposure machine.

[0034] S203: performing a developing process on the target PCB board after the curing process to remove the uncured solder resist ink on the target PCB board to obtain a first ink layer, wherein the first ink layer includes a first ink offset target corresponding to the first target pattern.

[0035] like Figure 3 As shown, Figures (a) to (f) are the side view and top view of the solder mask alignment target when the target PCB board is not coated with solder mask ink; Figures (b) to (g) are the side view and top view of the solder mask alignment target when the target PCB board is coated with solder mask ink; Figures (c) to (h) are the side view and top view of the first ink offset target and the solder mask alignment target after the target PCB board is coated with solder mask ink and cured and developed.

[0036] It can be seen that the first ink offset target and the solder mask alignment target are nested with each other, which further reduces the occupation of the first ink offset target on the target PCB board and improves the utilization rate of the target PCB board.

[0037] In one embodiment, step S201 can be implemented by the following steps: Figure 4 As shown: S401: Preliminary alignment of the target PCB board and the first exposure mask.

[0038] It is understandable that after the target PCB board and the first exposure mask are initially aligned, it is necessary to calculate the second offset data between the target PCB board and the first exposure mask to correct the relative position of the target PCB board and the first exposure mask, so as to improve the alignment accuracy of the target PCB board and the first exposure mask, thereby improving the processing quality of the target PCB board.

[0039] S402: Acquire a second PCB image of the target PCB board In a specific implementation, in this embodiment, an image acquisition device can be used to capture an image of the target PCB when the target PCB is preliminarily aligned with the first exposure mask to obtain a second PCB image of the target PCB.

[0040] S403: Extracting third position data of the solder resist comparison target and fourth position data of the first target pattern from the second PCB image.

[0041] In a specific implementation, in this embodiment, the solder mask alignment target in the second PCB image can be identified through a target detection algorithm to obtain the third position data of the solder mask alignment target and the fourth position data of the first target pattern.

[0042] S404: Calculate and obtain second offset data between the first exposure mask and the target PCB board according to the third position data and the fourth position data.

[0043] It can be understood that the smaller the value of the first offset data, the better the alignment effect between the target PCB and the first exposure mask, and the larger the value of the first offset data, the worse the alignment effect between the target PCB and the first exposure mask.

[0044] In a specific implementation, in this embodiment, the Euclidean distance between the third position data and the fourth position data can be used as the second offset data.

[0045] S405: Determine whether the second offset data is greater than a preset first offset threshold.

[0046] S406: If the second offset data is less than or equal to the first offset threshold, it is determined that the target PCB is aligned with the first exposure mask.

[0047] S407: If the second offset data is greater than the first offset threshold, adjust the position of the first exposure mask or the target PCB board according to the second offset data, and return to the step of obtaining the third position data of the solder mask comparison target and the fourth position data of the first target pattern.

[0048] If the second offset data is greater than the preset first offset threshold, it indicates that the alignment between the target PCB and the first exposure mask is poor. Adjustment of the first exposure mask or the target PCB is required based on the second offset data, and the process returns to the step of acquiring the third position data of the solder resist contrast target and the fourth position data of the first target pattern. If the second offset data is less than or equal to the first offset threshold, alignment between the target PCB and the first exposure mask is determined to be complete.

[0049] In one embodiment, after step S104, the following steps may be further included: Figure 5 As shown: S105: Acquire a third PCB image of the target PCB board.

[0050] Among them, the third PCB image is taken when the second ink layer processing is completed on the target PCB board based on the solder mask alignment target.

[0051] In a specific implementation, in this embodiment, an image acquisition device can be used to capture an image of the target PCB when the second ink layer processing is completed on the target PCB board to obtain a third PCB image of the target PCB board.

[0052] S106: Extracting fifth position data of the second ink offset target on the target PCB board from the third PCB image.

[0053] The second ink offset target is obtained when processing the second ink layer on the target PCB board, and the second ink offset target is a part of the second ink layer.

[0054] In a specific implementation, this embodiment can use a target detection algorithm to identify the second ink offset target in the third PCB image and obtain fifth position data of the second ink offset target. The shape of the second ink offset target includes, but is not limited to, a circle, a square, or a composite shape composed of multiple circles or squares. The specific shape of the second ink offset target is not limited in this embodiment.

[0055] S107: Calculate and obtain third offset data between the second ink layer and the first ink layer according to the fifth position data and the second position data.

[0056] It can be understood that the smaller the value of the third offset data, the smaller the offset between the second ink layer and the first ink layer, and the higher the accuracy of the target PCB board. The larger the value of the third offset data, the greater the offset between the first ink layer and the copper layer, and the lower the accuracy of the target PCB board.

[0057] In a specific implementation, in this embodiment, the Euclidean distance between the fifth position data and the second position data can be used as the third offset data to determine whether the value of the third offset data is greater than a preset offset threshold. If the value of the third offset data is greater than the offset threshold, it indicates that the target PCB board is a defective product and needs to be reprocessed or treated as waste. If the value of the third offset data is less than or equal to the offset threshold, it indicates that the target PCB board is a good product.

[0058] In summary, in this embodiment, only one solder mask alignment target needs to be set on the copper layer of the target PCB board to realize the processing of the first ink layer and the second ink layer and the calculation of the offset data of the first ink layer and the second ink layer. Compared with the existing technology, the number of solder mask alignment targets is effectively reduced, and the utilization rate of the target PCB board is improved.

[0059] In one embodiment, Figure 6 As shown, the second ink offset target in this embodiment is obtained by processing as follows: S601: Based on the solder resist comparison target, aligning the target PCB board re-coated with solder resist ink with a second exposure mask, where the second exposure mask includes a second mask pattern, and the second mask pattern includes a second target pattern.

[0060] S602: The solder resist ink on the target PCB is cured by an exposure machine through the second mask pattern.

[0061] S603: performing a developing process on the target PCB board after the curing process to remove the uncured solder resist ink on the target PCB board to obtain a second ink layer, wherein the second ink layer includes a second ink offset target corresponding to the second target pattern.

[0062] refer to Figure 3As shown, Figure (d) to Figure (i) are the side view and top view of the solder mask alignment target when the target PCB board is coated with solder mask ink for the second time; Figure (e) to Figure (j) are the side view and top view of the first ink offset target, the second ink offset target and the solder mask alignment target after the target PCB board is coated with solder mask ink and cured and developed.

[0063] It can be seen that the first ink offset target, the second ink offset target and the solder mask alignment target are nested with each other, which further reduces the occupation of the first ink offset target on the target PCB board and improves the utilization rate of the target PCB board.

[0064] In one embodiment, the first ink shift target and the solder mask shift target are nested with each other. Figure 3 Figures (c) to (h) in the middle are exemplary illustrations of the mutual nesting of the first ink offset target and the solder resist offset target in this embodiment.

[0065] It should be understood that the first ink offset target may be nested in the solder resist offset target, and the solder resist offset target may also be nested in the first ink offset target, which is not limited in this embodiment.

[0066] In one embodiment, the solder mask offset target includes an inner target and an outer target, wherein the inner target is embedded in the outer target. Figure 3 The middle figure (f) is an exemplary illustration of the nesting of inner targets and outer targets in this embodiment.

[0067] It should be understood that the size of the serial numbers of the steps in the above embodiments does not mean the order of execution. The execution order of each process should be determined by its function and internal logic, and should not constitute any limitation on the implementation process of the embodiments of the present invention.

[0068] In one embodiment, a device for measuring the offset of an ink layer is provided, and the device for measuring the offset of an ink layer corresponds to the method for measuring the offset of an ink layer in the above embodiment. Figure 7 As shown, the ink layer offset measurement device includes a first image acquisition module, a first position extraction module, a second position extraction module and a first data calculation module. The functional modules are described in detail as follows: A first image acquisition module 701 is configured to acquire a first PCB image of a target PCB board. The first PCB image is obtained when a first ink layer is processed on the target PCB board based on a solder mask alignment target. The solder mask alignment target is obtained when processing a copper layer of the target PCB board. The solder mask alignment target is a portion of the copper layer. A first position extraction module 702 is used to extract first position data of the solder mask alignment target from the first PCB image; A second position extraction module 703 is configured to extract second position data of a first ink offset target on a target PCB from the first PCB image; the first ink offset target is obtained when processing a first ink layer on the target PCB, and the first ink offset target is a portion of the first ink layer; The first data calculation module 704 is configured to calculate first offset data of the first ink layer and the copper layer according to the first position data and the second position data.

[0069] In summary, the present invention provides an ink layer offset measurement device, which obtains a first PCB image of a target PCB board, the first PCB image being obtained by photographing when the first ink layer is processed on the target PCB board based on a solder mask alignment target; the solder mask alignment target being obtained when processing the copper layer of the target PCB board, and the solder mask alignment target being a part of the copper layer; extracting first position data of the solder mask alignment target from the first PCB image; extracting second position data of the first ink offset target on the target PCB board from the first PCB image; the first ink offset target being obtained when processing the first ink layer on the target PCB board, and the first ink offset target being a part of the first ink layer; and calculating first offset data of the first ink layer and the copper layer based on the first position data and the second position data. It can be seen that the present invention only requires setting a solder mask alignment target on the copper layer of the target PCB board to realize the processing of the first ink layer and the calculation of the offset data of the first ink layer. Compared with the prior art, the number of solder mask alignment targets is effectively reduced, and the utilization rate of the target PCB board is improved.

[0070] In one embodiment, the first ink offset target is processed as follows: Based on the solder resist comparison target, aligning a target PCB board coated with solder resist ink with a first exposure mask, where the first exposure mask includes a first mask pattern, and the first mask pattern includes a first target pattern; The solder resist ink on the target PCB is cured by an exposure machine through the first mask pattern; The target PCB board after the curing treatment is developed to remove the uncured solder resist ink on the target PCB board to obtain a first ink layer, wherein the first ink layer includes a first ink offset target corresponding to the first target pattern.

[0071] In one embodiment, the target PCB is aligned with the first exposure mask in the following manner: Performing preliminary alignment of the target PCB board and the first exposure mask; Acquire a second PCB image of the target PCB board; extracting third position data of the solder resist contrast target and fourth position data of the first target pattern from the second PCB image; Calculating second offset data between the first exposure mask and the target PCB board based on the third position data and the fourth position data; Determining whether the second offset data is greater than a preset first offset threshold; If the second offset data is less than or equal to the first offset threshold, it is determined that the target PCB board is aligned with the first exposure mask; If the second offset data is greater than the first offset threshold, the position of the first exposure mask or the target PCB board is adjusted according to the second offset data, and the process returns to the step of obtaining the third position data of the solder resist contrast target and the fourth position data of the first target pattern.

[0072] In one embodiment, it further includes: The second image acquisition module is used to acquire a third PCB image of the target PCB board; the third PCB image is obtained when the second ink layer processing is completed on the target PCB board based on the solder mask alignment target; a third data acquisition module for extracting fifth position data of a second ink offset target on the target PCB from the third PCB image; the second ink offset target is obtained when processing the second ink layer on the target PCB, and the second ink offset target is a portion of the second ink layer; The second data calculation module is used to calculate third offset data between the second ink layer and the first ink layer according to the fifth position data and the second position data.

[0073] In one embodiment, the second ink offset target is processed as follows: Based on the solder resist comparison target, aligning the target PCB board re-coated with solder resist ink with a second exposure mask, where the second exposure mask includes a second mask pattern, and the second mask pattern includes a second target pattern; The solder resist ink on the target PCB is cured by an exposure machine through the second mask pattern; The target PCB board after the curing treatment is developed to remove the uncured solder resist ink on the target PCB board to obtain a second ink layer, which includes a second ink offset target corresponding to the second target pattern.

[0074] In one embodiment, the first ink shift target and the solder resist shift target are nested within each other.

[0075] In one embodiment, the solder resist offset target includes an inner target and an outer target, wherein the inner target is embedded in the outer target.

[0076] The specific definitions of the ink layer deflection measurement device can be found in the definitions of the ink layer deflection measurement method described above and will not be further elaborated here. Each module in the aforementioned ink layer deflection measurement device can be implemented in whole or in part via software, hardware, or a combination thereof. Each of these modules can be embedded in or independent of the processor in the deflection monitoring device in hardware form, or stored in memory in the deflection monitoring device in software form, allowing the processor to call and execute the corresponding operations of each module.

[0077] In one embodiment, if Figure 8 As shown, a deviation monitoring device is provided, including a memory, a processor, and a computer program stored in the memory and executable on the processor. When the processor executes the computer program, the deviation measurement method of the ink layer in the above embodiment is implemented, for example Figure 1 Deflection measurement method for the ink layer shown, or Figures 2 to 6 Alternatively, when the processor executes the computer program, the functions of the modules / units in the embodiment of the ink layer offset measuring device are realized, such as Figure 7 The functions shown in the figure that improve the utilization rate of the target PCB board are not described here in detail to avoid repetition.

[0078] In one embodiment, a computer-readable storage medium is provided, on which a computer program is stored. When the computer program is executed by a processor, the method for measuring the offset of the ink layer in the above embodiment is implemented, for example Figure 1 Deflection measurement method for the ink layer shown, or Figures 2 to 6 Alternatively, when the processor executes the computer program, the functions of the modules / units in the embodiment of the ink layer offset measuring device are realized, such as Figure 7 The functions shown in the figure that improve the utilization rate of the target PCB board are not described here in detail to avoid repetition.

[0079] The embodiments described above are only used to illustrate the technical solutions of the present invention, rather than to limit the same. Although the present invention has been described in detail with reference to the aforementioned embodiments, those skilled in the art should understand that they can still modify the technical solutions described in the aforementioned embodiments, or make equivalent replacements for some of the technical features therein. These modifications or replacements do not deviate the essence of the corresponding technical solutions from the spirit and scope of the technical solutions of the various embodiments of the present invention, and should all be included in the scope of protection of the present invention.

Claims

1. A method for measuring the offset of an ink layer, characterized in that: include: Acquire a first PCB image of a target PCB board, where the first PCB image is captured when a first ink layer is processed on the target PCB board based on a solder mask alignment target; The solder resist alignment target is obtained when processing the copper layer of the target PCB board, and the solder resist alignment target is a part of the copper layer; Extracting first position data of the solder mask alignment target from the first PCB image; extracting second position data of a first ink offset target on the target PCB board from the first PCB image; the first ink offset target is obtained when processing the first ink layer on the target PCB board, and the first ink offset target is a portion of the first ink layer; First offset data of the first ink layer and the copper layer are calculated based on the first position data and the second position data.

2. The method for measuring the offset of the ink layer according to claim 1, wherein: The first ink offset target is obtained by processing as follows: Based on the solder resist comparison target, aligning the target PCB board coated with solder resist ink with a first exposure mask, wherein the first exposure mask includes a first mask pattern, and the first mask pattern includes a first target pattern; Curing the solder resist ink on the target PCB board through the first mask pattern using an exposure machine; The target PCB board after the curing treatment is developed to remove the uncured solder resist ink on the target PCB board to obtain the first ink layer, wherein the first ink layer includes the first ink offset target corresponding to the first target pattern.

3. The method for measuring the offset of the ink layer according to claim 2, wherein: The method of aligning the target PCB board coated with solder resist ink with a first exposure mask based on the solder resist comparison target includes: Preliminarily aligning the target PCB board with the first exposure mask; Acquire a second PCB image of the target PCB board; extracting third position data of the solder resist comparison target and fourth position data of the first target pattern from the second PCB image; Calculating second offset data between the first exposure mask and the target PCB board based on the third position data and the fourth position data; Determining whether the second offset data is greater than a preset first offset threshold; If the second offset data is less than or equal to the first offset threshold, it is determined that the target PCB board is aligned with the first exposure mask; If the second offset data is greater than the first offset threshold, the position of the first exposure mask or the target PCB board is adjusted according to the second offset data, and the process returns to the step of obtaining the third position data of the solder mask comparison target and the fourth position data of the first target pattern.

4. The method for measuring the offset of the ink layer according to claim 1, wherein: After calculating and obtaining the first offset data of the first ink layer according to the first position data and the second position data, the method further includes: Acquire a third PCB image of the target PCB board; the third PCB image is captured when the second ink layer processing is completed on the target PCB board based on the solder mask alignment target; extracting fifth position data of a second ink offset target on the target PCB board from the third PCB image; the second ink offset target is obtained when processing the second ink layer on the target PCB board, and the second ink offset target is a portion of the second ink layer; Third offset data between the second ink layer and the first ink layer is calculated based on the fifth position data and the second position data.

5. The method for measuring the offset of the ink layer according to claim 4, wherein: The second ink offset target is obtained by processing as follows: Based on the solder resist comparison target, aligning the target PCB board re-coated with solder resist ink with a second exposure mask, wherein the second exposure mask includes a second mask pattern, and the second mask pattern includes a second target pattern; Curing the solder resist ink on the target PCB board through the second mask pattern using an exposure machine; The target PCB board after the curing treatment is developed to remove the uncured solder resist ink on the target PCB board to obtain the second ink layer, wherein the second ink layer includes the second ink offset target corresponding to the second target pattern.

6. The method for measuring the offset of an ink layer according to any one of claims 1 to 5, characterized in that: The first ink shift target and the solder resist shift target are nested with each other.

7. The method for measuring the offset of the ink layer according to claim 6, wherein: The solder resist offset target includes an inner target and an outer target, and the inner target is embedded in the outer target.

8. An ink layer deviation measuring device, characterized in that: include: a first image acquisition module, configured to acquire a first PCB image of a target PCB board, wherein the first PCB image is obtained when a first ink layer is processed on the target PCB board based on a solder mask alignment target; the solder mask alignment target is obtained when a copper layer of the target PCB board is processed, and the solder mask alignment target is a portion of the copper layer; A first position extraction module, configured to extract first position data of the solder mask alignment target from the first PCB image; a second position extraction module, configured to extract second position data of a first ink offset target on the target PCB board from the first PCB image; the first ink offset target is obtained when processing the first ink layer on the target PCB board, and the first ink offset target is a portion of the first ink layer; The first data calculation module is configured to calculate first offset data of the first ink layer and the copper layer according to the first position data and the second position data.

9. An excursion monitoring device comprising a memory, a processor, and a computer program stored in the memory and executable on the processor, wherein: When the processor executes the computer program, the method for measuring the offset of the ink layer according to any one of claims 1 to 7 is implemented.

10. A computer-readable storage medium storing a computer program, characterized in that: When the computer program is executed by a processor, the method for measuring the offset of the ink layer according to any one of claims 1 to 7 is implemented.

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