Packaging method and corresponding packaging structure

Abstract

The invention relates to the technical field of semiconductor packaging, and provides a packaging method, which comprises the following steps that: a lead frame is provided, the lead frame comprises a base island, the surface of the base island is provided with a specified area for mounting a chip, and the outer side of the specified area on the surface of the base island is provided with a routing area; applying a first magnetic field to a wire bonding area on the surface of the base island; glue is provided, the glue flows to designated areas on the surfaces of the base islands to form glue points, the glue contains magnetic powder, and the glue and the first magnetic field repel each other; and mounting a chip on the surface of the glue layer formed by the glue points in the process of applying the first magnetic field. Through the repulsion effect of the first magnetic field and the glue, the glue is prevented from overflowing to the wire bonding area, the influence on the bonding wire is avoided, and the packaging reliability is improved.

Description

Technical Field

[0001] The invention relates to the technical field of semiconductor packaging, and discloses a packaging method and a corresponding packaging structure. Background Art

[0002] Using glue to dispense onto a leadframe is a common method for semiconductor package mounting. However, when the die is placed onto the glue surface, excessive glue overflow can occur if the die placement head is pressed down with a certain pressure, contaminating the leadframe's bonding area and affecting wire bonding and package reliability. Summary of the Invention

[0003] The purpose of the present invention is to solve the problem that the common way of semiconductor packaging is to use glue to dispense chips on the lead frame, which has the risk of contaminating the ground area of ​​the lead frame. A packaging method and a corresponding packaging structure are provided.

[0004] In order to achieve the above object, the present invention provides a packaging method, comprising: Providing a lead frame, the lead frame comprising a base island, the base island surface having a designated area for mounting a chip, and the outer side of the designated area on the base island surface having a bonding area; Applying a first magnetic field to the bonding area on the surface of the base island; Providing glue and allowing the glue to flow to a designated area on the surface of the base island to form glue spots, wherein the glue contains magnetic powder and the glue and the first magnetic field repel each other; During the process of applying the first magnetic field, the chip is mounted on the surface of the glue layer formed by the glue points.

[0005] As an implementation method, the first magnetic field is a vertical magnetic field, and the first magnetic field is located above the bonding area.

[0006] As an implementation method, the number of the first magnetic fields is the same as the number of the bonding areas.

[0007] As an implementation method, there are two bonding areas, which are respectively located at edge portions on two opposite sides of the base island surface.

[0008] As an implementable embodiment, the magnetic powder is evenly distributed in the glue.

[0009] As an implementation method, the magnetic powder is a conductive material or an insulating material.

[0010] As an implementation method, when the magnetic powder is a conductive material, the magnetic powder is ferromagnetic metal powder or ferrite magnetic powder, and the ferromagnetic metal powder is one of iron powder, cobalt powder and nickel powder; the ferrite magnetic powder is manganese zinc ferrite magnetic powder or nickel zinc ferrite magnetic powder; when the magnetic powder is an insulating material, the magnetic powder is one of graphite powder, silica powder and alumina powder.

[0011] As an implementation method, the proportion of the magnetic powder in the total filler in the glue is in the range of 20% to 30%.

[0012] As an implementation method, the diameter of the magnetic powder ranges from 5 μm to 10 μm.

[0013] As an implementation method, the area of ​​the glue layer is greater than or equal to the area of ​​the glue point.

[0014] As an implementable embodiment, the viscosity of the glue ranges from 500 mPa·s to 1000 mPa·s.

[0015] As an implementable embodiment, the glue is conductive glue or insulating glue.

[0016] As an implementable embodiment, when the glue is conductive glue, the glue also contains conductive powder.

[0017] As an implementable embodiment, the conductive powder is evenly distributed in the glue.

[0018] As an implementation method, the proportion of the conductive powder in the total filler in the glue is greater than or equal to 60%.

[0019] As an implementable embodiment, the glue further includes a toughening agent, and the toughening agent is used to improve the flexibility of the glue.

[0020] As an implementation method, the glue further includes a curing agent, and the curing agent is used to shorten the curing time of the glue during the process of baking the glue after chip mounting.

[0021] As an implementation method, the glue further includes a dispersant, and the dispersant is used to improve the dispersion uniformity of the magnetic powder in the glue.

[0022] As an implementation method, the glue further includes a diluent, and the diluent is used to increase the viscosity of the glue to improve the flow control capability of the magnetic field.

[0023] As an implementation method, allowing the glue to flow to a designated area on the surface of the base island to form a glue point includes: During the application of the first magnetic field, a glue tube is used to allow glue to flow to a designated area on the surface of the base island to form glue spots.

[0024] As an implementation method, the step of applying a first magnetic field to the bonding area on the surface of the base island includes: The base island surface is positioned according to the bonding area on the base island surface, and a first magnetic field is applied to the bonding area on the base island surface according to the positioning.

[0025] As an implementation method, the first magnetic field at least covers the bonding area outside the designated area on the surface of the base island.

[0026] As an implementable embodiment, it also includes: Applying a plurality of first magnetic fields to other areas outside the designated area on the surface of the base island; By applying a first magnetic field outside a designated area on the surface of the base island and the repulsive effect of the glue, the glue dots form a glue layer with a regular shape in the designated area; During the process of applying the first magnetic field, the chip is mounted on the surface of the glue layer formed by the glue points.

[0027] As an implementation method, the area of ​​the glue layer is greater than or equal to the area of ​​the corresponding chip.

[0028] As an implementable embodiment, the regular shape is one of a square, a rectangle, a hexagon, an octagon and a circle.

[0029] As an implementation method, after the step of mounting the chip on the surface of the glue layer under the action of the first magnetic field, the method further includes: The chip surface and the bonding area on the island surface are connected by wires.

[0030] Accordingly, the present invention further provides a packaging structure prepared by any of the above packaging methods, comprising: A base island, wherein a surface of the base island has a designated area for mounting a chip; A glue layer located in a designated area on the surface of the base island; wherein the glue layer contains magnetic powder; A chip is located on the surface of the glue layer.

[0031] As an implementation method, it further includes a lead connecting the bonding area and the chip surface.

[0032] The present invention provides a packaging method and a corresponding packaging structure, which prevents the glue from overflowing into the bonding area through the repulsive effect of a first magnetic field and glue, thereby avoiding affecting the bonding wires and improving packaging reliability.

[0033] The present invention proposes a packaging method and a corresponding packaging structure, in which the glue is formed into a regular shape through the repulsive effect of a first magnetic field and glue, making the shape of the glue controllable and preventing it from overflowing into the bonding area. The adhesion of the chip can be increased by increasing the amount of glue. BRIEF DESCRIPTION OF THE DRAWINGS

[0034] Figure 1 A schematic diagram of a packaging process provided for explaining technical problems in some embodiments of the present invention; Figure 2 A flowchart of the packaging method steps provided for some embodiments of the present invention; Figure 3 A schematic diagram of a packaging process for applying a first magnetic field to a bonding area according to some embodiments of the present invention; Figure 4 A schematic diagram of applying a first magnetic field to a bonding area according to some embodiments of the present invention; Figure 5 A schematic diagram of a packaging process for applying a first magnetic field to a bonding area and other areas outside a designated area provided in some embodiments of the present invention. DETAILED DESCRIPTION

[0035] The following will clearly and completely describe the technical solutions in the embodiments of the present invention in conjunction with the accompanying drawings. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative efforts are within the scope of protection of the present invention.

[0036] It should be understood that as used herein, terms such as "first" and "second" describe various elements, components, regions, layers and / or sections, and these elements, components, regions, layers and / or sections should not be limited by these terms. These terms may be used only to distinguish one element, component, region, layer or section from another element, component, region, layer or section. For example, terms such as "first" and "second" do not imply a sequence or order when used herein unless the context clearly indicates. For ease of description, spatially relative terms such as "upper" and "lower" may be used herein to describe the relationship of one element or feature to other elements or features as shown in the accompanying drawings. It should be understood that spatially relative terms are intended to include different orientations of the device in use or operation in addition to the orientations shown in the accompanying drawings.

[0037] In this application, unless otherwise specified or limited, the terms "connected" and "connection" should be understood in a broad sense. For example, they can refer to fixed connection, detachable connection, or integration; mechanical connection, electrical connection; direct connection, or indirect connection through an intermediate medium; internal communication between two elements, or interaction between two elements, unless otherwise specified. Those skilled in the art will understand the specific meanings of the above terms in this application based on specific circumstances.

[0038] In the description of this specification, the description with reference to the terms "one embodiment", "some embodiments", "example", "specific example", or "some examples" means that the specific features, structures, materials or characteristics described in conjunction with the embodiment or example are included in at least one embodiment or example of the present invention. In this specification, the schematic representations of the above terms do not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials or characteristics described can be combined in a suitable manner in any one or more embodiments or examples. In addition, those skilled in the art can combine and combine the different embodiments or examples described in this specification and the features of different embodiments or examples, unless they are contradictory. It should be noted that the terms "including" and "having" and their variations involved in this application are intended to cover non-exclusive inclusions.

[0039] In the existing film mounting process, see Figure 1 The surface of the lead frame's base island 10 has a designated area for chip mounting, and the outer side of the designated area has a bonding area 20. Glue 31 is applied to the designated area, and then the chip 40 is mounted on the surface of the glue 31. Since the surface area of ​​contact between the glue 31 and the chip 40 is small, when the chip 40 sucked by the nozzle is mounted on the surface of the glue 31, the negative pressure of the nozzle is not released in time, and the surface tension of the glue 31 is insufficient to hold the chip, there is a risk of the chip being sucked back. In the above situation, if the downward pressure parameter of the chip mounting welding head is increased, the chip 40 will not be sucked back, but the glue 31 may overflow to the surrounding area and contaminate the bonding area 20, thereby affecting the bonding wire and packaging reliability.

[0040] Some embodiments of the present invention provide a packaging method, see Figure 2 ,include: Step S100: providing a lead frame, wherein the lead frame comprises a base island, and a surface of the base island has a designated area for mounting a chip.

[0041] In some embodiments, the material of the lead frame is metal, and the metal may be one or more of aluminum, tin, tungsten, platinum, copper, titanium, chromium, tantalum, gold, and silver.

[0042] In some embodiments, the lead frame includes a base island and pins located outside the base island. Figure 3 The surface of the base island 100 has a designated area for mounting the chip 400, and the outer side of the designated area on the surface of the base island 100 has a bonding area 200. In some embodiments, the designated area is located in the middle portion of the surface of the base island 100, and the bonding area 200 is located at the edge portion of the surface of the base island 100; in some embodiments, the designated area is located on one side of the base island, and the bonding area is located on the other side of the base island; in some embodiments, there are multiple designated areas, the bonding area is located in the middle portion of the surface of the base island 100, and multiple designated areas are arranged around the bonding area.

[0043] In step S200 , a first magnetic field is applied to the bonding area 200 on the surface of the base island 100 .

[0044] In some embodiments, see Figure 4 The first magnetic field is a vertical magnetic field, and the first magnetic field is located above the bonding area 200. In some embodiments, the first magnetic field may also be an oblique magnetic field or other magnetic field that can replace the vertical magnetic field.

[0045] Step S300: providing glue and allowing the glue to flow to a designated area on the surface of the base island to form glue spots; wherein the glue contains magnetic powder, and the glue and the first magnetic field repel each other.

[0046] In some embodiments, the glue is a conductive glue or an insulating glue. In some embodiments, when the glue is a conductive glue, the glue further comprises a conductive powder. The conductive powder is a metal, and the metal is one or more of aluminum, nickel, tin, tungsten, platinum, copper, titanium, chromium, tantalum, gold, silver, etc. In some embodiments, the conductive powder is evenly distributed in the glue.

[0047] In some embodiments, when the glue is an insulating glue, the glue dots are controlled to form a glue layer of a certain thickness and area to prevent leakage. In some embodiments, the conductive powder accounts for 60% or more of the total filler in the glue to ensure the continuity of the conductive network. In some embodiments, the conductive powder is evenly distributed in the glue.

[0048] In some embodiments, the magnetic powder is a conductive material or an insulating material. In some embodiments, when the magnetic powder is a conductive material, the magnetic powder is ferromagnetic metal powder or ferrite powder, and the ferromagnetic metal powder is one of iron powder, cobalt powder, and nickel powder; the ferrite powder is manganese-zinc ferrite powder or nickel-zinc ferrite powder; when the magnetic powder is an insulating material, the magnetic powder is one of graphite powder, silica powder, and alumina powder.

[0049] In some embodiments, the magnetic powder is evenly distributed in the glue. In some embodiments, the magnetic powder accounts for 20% to 30% of the total filler in the glue to avoid excessive amounts that could block the conductive path. In some embodiments, the magnetic powder has a diameter in the range of 5 μm to 10 μm to avoid small particles that tend to agglomerate and large particles that reduce magnetic field sensitivity.

[0050] In certain embodiments, the glue further comprises a toughening agent, which is used to improve the flexibility of the glue. The main purpose of improving the flexibility of the glue is to enhance its durability and reliability in practical applications. Specifically, the glue with good flexibility can still maintain its bonding performance when facing physical stress, vibration or temperature changes, thereby avoiding the bonding failure caused by glue embrittlement. In certain embodiments, the toughening agent can be polysulfide rubber (JLY-121).

[0051] In some embodiments, the glue further includes a curing agent, which is used to shorten the curing time of the glue during the baking process after chip mounting. In some embodiments, the curing agent can be T31 curing agent.

[0052] In some embodiments, the glue further includes a dispersant, which is used to improve the uniformity of the dispersion of the magnetic powder in the glue. In some embodiments, the dispersant may be BYK-111 dispersant.

[0053] In some embodiments, the glue further includes a diluent to increase the glue's viscosity, thereby enhancing the magnetic field's flow control capabilities. In some embodiments, the diluent can be acetone. In some embodiments, the glue's viscosity ranges from 500 mPa·s to 1000 mPa·s, balancing the requirements of magnetic field traction and the glue dispensing process.

[0054] As a specific embodiment, the steps of forming glue are as follows: Step 1: Mix epoxy resin and acetone and stir until completely dissolved; Step 2: Add polysulfide rubber and BYK-111 dispersant in sequence and stir at low speed for 5 minutes; Step 3: Add silver powder and nickel powder in batches and disperse at high speed for 30 minutes to avoid introducing bubbles; Step 4: Finally, add T31 curing agent, stir evenly and degas in vacuum for 10 minutes.

[0055] In some embodiments, allowing the glue to flow to a designated area on the surface of the base island to form glue spots includes: during the process of applying the first magnetic field, using a glue tube to allow the glue to flow to a designated area on the surface of the base island to form glue spots; thereby, in the process of allowing the glue to flow to the designated area on the surface of the base island to form glue spots, the distribution position of the glue is controlled.

[0056] In some embodiments, a first magnetic field that repels the glue, specifically the magnetic powder in the glue, is applied to the bonding area 200 , thereby preventing the glue layer 302 from overflowing into the bonding area 200 . In some embodiments, the principle of repulsion between the magnetic field and the magnetic powder involves the effect of the magnetic field on the magnetic powder. When the magnetic field approaches the magnetic powder, the magnetic powder is magnetized to form small magnets that align along the direction of the magnetic field. According to the principle that like poles repel, these small magnets, if they share the same polarity as the magnetic field, will repel each other.

[0057] In some embodiments, the number of the first magnetic fields is the same as the number of the bonding areas. Figure 4 When the bonding area 200 is located at the edge of the base island 100, there are two bonding areas 200, one located on opposite sides of the base island 100. The first magnetic field also has two corresponding areas. This allows the first magnetic field to be applied to the bonding area along the dotted line in the figure. Based on the principle that like poles repel, the magnetic field polarity is controlled to repel the magnetic powder in the glue. In some embodiments, the power of the first magnetic field can be controlled to maintain a reasonable distance between the repelling magnetic fields, thus preventing deviation in the glue dispensing position.

[0058] In some embodiments, the number of the first magnetic fields is greater than the number of the bonding areas. This means that the first magnetic fields can be set in areas other than the bonding areas and the designated areas on the surface of the base island. By setting the first magnetic fields in areas other than the designated areas on the surface of the base island to repel the glue, the glue dots form a regularly shaped glue layer in the designated areas.

[0059] In some embodiments, the step of applying a first magnetic field to the bonding area of ​​the base island surface includes: positioning the base island surface according to the bonding area of ​​the base island surface, and applying the first magnetic field to the bonding area of ​​the base island surface according to the positioning.

[0060] In some embodiments, the first magnetic field at least covers the bonding area outside the designated area on the base island surface. This means that the first magnetic field applied to the bonding area on the base island surface can extend beyond the bonding area. For example, it can also cover other areas outside the designated area on the base island surface.

[0061] In some embodiments, the method further includes: applying multiple first magnetic fields to other areas outside the designated area on the surface of the base island; through the repulsive effect of the first magnetic fields applied outside the designated area on the surface of the base island and the glue, the glue dots form a glue layer with a regular shape in the designated area; and attaching the chip to the surface of the glue layer formed by the glue dots during the application of the first magnetic fields. Figure 5(a) in which glue is provided and allowed to flow to a designated area on the surface of the base island to form glue dots 301; wherein the glue contains magnetic powder, and the glue and the first magnetic field repel each other; see Figure 5 (b) in which the glue dots form a glue layer 302 having a regular shape in the designated area on the surface of the base island under the action of the first magnetic field outside the designated area; see Figure 5 In (c), the chip 400 is mounted on the surface of the glue layer 302 .

[0062] In some embodiments, since the shape of the glue layer 302 is controllable and will not overflow into the bonding area, the adhesion of the chip can be increased by increasing the amount of glue.

[0063] In some embodiments, the area of ​​the glue layer 302 is greater than or equal to the area of ​​the chip 400. In some embodiments, the regular shape can be one or more of a triangle, a square, a rectangle, a hexagon, an octagon, and a circle.

[0064] Step S400 , mounting the chip on the surface of the glue layer formed by the glue dots during the application of the first magnetic field.

[0065] In some embodiments, see Figure 4 The area of ​​the glue layer 302 is greater than or equal to the area of ​​the glue point 301. By mounting the chip 400 on the glue point 301, the chip 400 will press down the glue point 301 to form the glue layer 302. Under the action of the first magnetic field, the glue can be controlled not to overflow into the bonding area 200.

[0066] In some embodiments, see Figure 5 In (c), the chip 400 can be mounted on the surface of the glue layer 302 during the application of the first magnetic field, so that the chip 400 is mounted while the glue layer 302 maintains a regular shape, thereby improving packaging reliability.

[0067] In some embodiments, the chip 400 may include a power chip, a logic chip, or a memory chip. In some embodiments, the logic chip may include a gate array, a cell substrate array, an embedded array, a structured application-specific integrated circuit (ASIC), a field-programmable gate array (FPGA), a complex programmable logic device (CPLD), a central processing unit (CPU), a microprocessing unit (MPU), a microcontroller unit (MCU), a logic integrated circuit (IC), an application processor (AP), a display driver IC (DDI), a radio frequency (RF) chip, a power chip, or a complementary metal oxide semiconductor (CMOS) image sensor. In some embodiments, the memory chip may include a volatile memory chip (such as a dynamic random access memory (DRAM) or a static RAM (SRAM) or a non-volatile memory chip (such as a flash memory (Flash), a phase change RAM (PRAM), a magnetoresistive RAM (MRAM), a ferroelectric RAM (FeRAM), or a resistive RAM (ReRAM)). In a specific embodiment, the memory chip may include a high-bandwidth memory (HBM) including a DRAM chip.

[0068] In some embodiments, after the step of attaching the chip to the surface of the glue layer under the action of the first magnetic field, the method further includes: connecting the chip surface to the bonding area on the base island surface using wires. In some embodiments, the method further includes plastic encapsulation and some cutting of the lead frame.

[0069] Accordingly, see Figure 3 (c) and Figure 5 In (c), the present invention further provides a packaging structure prepared according to the above-mentioned packaging method, comprising: a base island 100, wherein the surface of the base island 100 has a designated area for chip mounting, and the outer side of the designated area has a bonding area 200; a glue layer 302 located on the surface of the base island 100; wherein the glue layer 302 contains magnetic powder; and a chip 400 located on the surface of the glue layer 302. In some embodiments, it also includes a lead, wherein the lead connects the bonding area and the chip surface. In some embodiments, it also includes a molding compound, which can be an epoxy resin, a polyimide resin, a benzocyclobutene resin, or a polybenzoxazole resin, and the molding process can be an injection molding process or a transfer molding process.

[0070] Although the present invention has been disclosed above in terms of preferred embodiments, this is not intended to limit the present invention. Any person skilled in the art may make possible changes and modifications to the technical solutions of the present invention by utilizing the methods and technical contents disclosed above without departing from the spirit and scope of the present invention. Therefore, any simple modifications, equivalent changes, and modifications made to the above embodiments based on the technical essence of the present invention without departing from the content of the technical solutions of the present invention shall fall within the scope of protection of the technical solutions of the present invention.

Claims

1. A packaging method, characterized in that: include: Providing a lead frame, the lead frame comprising a base island, the base island surface having a designated area for mounting a chip, and the outer side of the designated area on the base island surface having a bonding area; Applying a first magnetic field to the bonding area on the surface of the base island; Providing glue and allowing the glue to flow to a designated area on the surface of the base island to form glue spots, wherein the glue contains magnetic powder and the glue and the first magnetic field repel each other; During the process of applying the first magnetic field, the chip is mounted on the surface of the glue layer formed by the glue points.

2. The packaging method according to claim 1, wherein: The first magnetic field is a vertical magnetic field, and the first magnetic field is located above the bonding area.

3. The packaging method according to claim 1, wherein: The number of the first magnetic fields is the same as the number of the bonding areas.

4. The packaging method according to claim 1, wherein: The number of the first magnetic fields is greater than the number of the bonding areas.

5. The packaging method according to claim 1, wherein: The magnetic powder is evenly distributed in the glue.

6. The packaging method according to claim 1, wherein: The magnetic powder is a conductive material or an insulating material.

7. The packaging method according to claim 6, wherein: When the magnetic powder is a conductive material, the magnetic powder is ferromagnetic metal powder or ferrite powder, and the ferromagnetic metal powder is one of iron powder, cobalt powder and nickel powder; the ferrite powder is manganese-zinc ferrite powder or nickel-zinc ferrite powder; when the magnetic powder is an insulating material, the magnetic powder is one of graphite powder, silica powder and alumina powder.

8. The packaging method according to claim 1, wherein: The proportion of the magnetic powder in the total filler in the glue is in the range of 20% to 30%.

9. The packaging method according to claim 1, wherein: The diameter of the magnetic powder ranges from 5 μm to 10 μm.

10. The packaging method according to claim 1, wherein: The area of ​​the glue layer is greater than or equal to the area of ​​the glue point.

11. The packaging method according to claim 1, wherein: The viscosity of the glue ranges from 500 mPa·s to 1000 mPa·s.

12. The packaging method according to claim 1, wherein: The glue is conductive glue or insulating glue.

13. The packaging method according to claim 12, wherein: When the glue is conductive glue, the glue also contains conductive powder.

14. The packaging method according to claim 13, wherein: The conductive powder is evenly distributed in the glue.

15. The packaging method according to claim 13, wherein: The proportion of the conductive powder in the total filler in the glue is greater than or equal to 60%.

16. The packaging method according to claim 1, wherein: The glue also includes a toughening agent, which is used to improve the flexibility of the glue.

17. The packaging method according to claim 1, wherein: The glue also includes a curing agent, which is used to shorten the glue curing time during the glue baking process after chip mounting.

18. The packaging method according to claim 1, wherein: The glue further comprises a dispersant, and the dispersant is used to improve the dispersion uniformity of the magnetic powder in the glue.

19. The packaging method according to claim 1, wherein: The glue also includes a diluent, and the diluent is used to increase the viscosity of the glue to improve the magnetic field flow control capability.

20. The packaging method according to claim 1, wherein: Allowing the glue to flow to a designated area on the surface of the base island to form a glue point includes: During the application of the first magnetic field, a glue tube is used to allow glue to flow to a designated area on the surface of the base island to form glue spots.

21. The packaging method according to claim 1, wherein: The step of applying a first magnetic field to the bonding area on the surface of the base island includes: The base island surface is positioned according to the bonding area on the base island surface, and a first magnetic field is applied to the bonding area on the base island surface according to the positioning.

22. The packaging method according to claim 1, wherein: The first magnetic field at least covers the bonding area outside the designated area on the surface of the base island.

23. The packaging method according to claim 22, characterized in that: Also includes: Applying a plurality of first magnetic fields to other areas outside the designated area on the surface of the base island; By applying a first magnetic field outside a designated area on the surface of the base island and the repulsive effect of the glue, the glue dots form a glue layer with a regular shape in the designated area; During the process of applying the first magnetic field, the chip is mounted on the surface of the glue layer formed by the glue points.

24. The packaging method according to claim 23, wherein: The area of ​​the glue layer is greater than or equal to the area of ​​the corresponding chip.

25. The packaging method according to claim 23, wherein: The regular shape is one or more of a triangle, a square, a rectangle, a hexagon, an octagon and a circle.

26. The packaging method according to claim 1, wherein: After the step of mounting the chip on the surface of the glue layer under the action of the first magnetic field, the method further includes: The chip surface and the bonding area on the island surface are connected by wires.

27. A packaging structure prepared by the packaging method according to any one of claims 1 to 26, characterized in that: include: A base island, wherein a surface of the base island has a designated area for mounting a chip; A glue layer located in a designated area on the surface of the base island; wherein the glue layer contains magnetic powder; A chip is located on the surface of the glue layer.

28. The packaging structure according to claim 27, wherein: It also includes leads connecting the bonding area and the chip surface.

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