Package with carrier

Abstract

A package (100) comprising: an at least partially electrically conductive carrier (102) formed to define an accommodation space (104) therein; an electronic component (106) mounted on the carrier (102) and at least partially accommodated in the accommodation space (104); and a repelling structure (112) configured for repelling the electrically conductive connection medium (129) and arranged on a portion of the surface of the carrier (102) facing away from the accommodation space (104).

Description

Technical Field

[0001] Various embodiments generally relate to a package, an electronic device, and a method of manufacturing. Background Art

[0002] Conventional packages may include semiconductor components mounted on a carrier (eg, a leadframe structure), may be electrically connected via connecting wires extending from the semiconductor components to the carrier, and may be molded using a molding compound as an encapsulation material.

[0003] However, there are also non-encapsulated packages, e.g. A package body, wherein a semiconductor chip is accommodated in a receiving space of a carrier.

[0004] Achieving the right combination of electrical reliability and thermal performance may still be a challenge. Summary of the Invention

[0005] A package with high electrical reliability and high thermal performance may be required.

[0006] According to an exemplary embodiment, a package is provided, comprising: an at least partially conductive carrier formed to define a housing space therein; an electronic component mounted on the carrier and at least partially housed in the housing space; and a repulsive structure configured to repel a conductive connecting medium and arranged on a portion of a surface (in particular an outer surface) of the carrier facing away from the housing space.

[0007] According to another exemplary embodiment, an electronic device is provided, which includes the package body having the above features, and an assembly structure assembled with the package body.

[0008] According to another exemplary embodiment, a method for manufacturing a package is provided, wherein the method comprises: providing an at least partially conductive carrier, the carrier being formed to define a receiving space therein; mounting an electronic component on the carrier and at least partially receiving the electronic component in the receiving space; forming a repulsive structure, the repulsive structure being configured to repel a conductive connecting medium, and arranging the repulsive structure on a portion of a surface of the carrier facing away from the receiving space.

[0009] According to an exemplary embodiment, the package is provided with an at least partially electrically conductive carrier, which can be formed to define a preferably flat inner surface surrounded by walls to define a housing space in which the electronic component can be located and fixed. Advantageously, a repelling structure (e.g., solder resist) for repelling a conductive connection medium (e.g., solder) can be provided on an outer surface portion of the carrier opposite the inner housing space. This allows an assembly structure (e.g., a heat sink) to be connected to the outer surface portion opposite the housing space without the risk of the conductive connection medium used to connect the assembly structure to the carrier flowing from the outer surface of the carrier to the inner surface of the carrier and toward the electronic component, as the repelling structure reliably prevents this from happening. Preventing the conductive connection medium from flowing into undesirable areas of the package allows for adequate electrical reliability. It is possible to establish a highly thermally conductive link between the heat sink and a primary heat source in the form of the accommodated electronic component via the conductive connection medium and the back side of the at least partially electrically conductive carrier, which ensures high thermal performance. In short, the described configuration may enable soldering of a heat sink to the back side of a component receiving carrier without the risk of unwanted solder flowing along potentially wettable outer surfaces of the carrier towards the receiving space.

[0010] Description of Further Exemplary Embodiments

[0011] In the following, further exemplary embodiments of the package, the electronic device and the method will be explained.

[0012] In the context of the present application, the term "package" may particularly denote an arrangement of electronic components that may include one or more packages. A partially or fully conductive carrier may also form part of the package. The components of the package may be unencapsulated or may be at least partially encapsulated by an encapsulating material. Optionally, one or more conductive connecting elements (e.g. metal pillars, bumps, connecting wires and / or clips) may be implemented in the package, e.g. for electrically coupling and / or mechanically supporting the electronic components.

[0013] In the context of the present application, the term "carrier" may particularly denote a support structure (which may be at least partially electrically conductive) which serves as a mechanical support within the package and which may also facilitate electrical interconnection between one or more electronic components and the periphery of the package. In other words, the carrier may fulfil a mechanical support function and / or an electrical connection function. The carrier may comprise or consist of a single component, a plurality of components joined via an encapsulation or other package components, or a subassembly of the carrier. When the carrier forms part of a lead frame, the carrier may be or may comprise a die pad. For example, the carrier may be embodied as an electrically conductive plate, in particular made of a metal such as copper, aluminium or the like, which may be curved, for defining a housing space for the electronic components. A recessed section of the carrier may form the housing space, whereas an opposite recessed section of the carrier may define a heat dissipation surface for mounting a heat sink thereon.

[0014] In the context of the present application, the term "carrier formed to define a receiving space" may particularly denote a carrier that can be bent (e.g., three-dimensionally) so as to define a cavity, a hollow space, or any other type of free space in the carrier, thereby allowing electronic components to be mounted on the carrier and positioned in the receiving space. For example, such a carrier defining a receiving space may be formed by bending a metal sheet. For example, the bending may be of such a type that a pot-shaped carrier defining a receiving space is obtained.

[0015] In the context of the present application, the term "electronic component" may particularly encompass semiconductor chips (particularly power semiconductor chips), active electronic components (such as transistors), passive electronic components (such as capacitors or inductors or ohmic resistors), sensors (such as microphones, light sensors, temperature sensors or gas sensors), actuators (such as loudspeakers) and microelectromechanical systems (MEMS). However, in other embodiments, the electronic components may also be of different types, such as electromechanical components, in particular mechanical switches, etc. In particular, the electronic component may be a semiconductor chip having at least one integrated circuit element (such as a diode or transistor) on its surface portion. The electronic component may be a bare die or may be packaged or encapsulated. The semiconductor chip implemented according to the exemplary embodiment may be formed, for example, with silicon technology, gallium nitride technology, silicon carbide technology, etc.

[0016] In the context of the present application, the term "repulsive structure configured to repel a conductive connection medium" may particularly denote a physical structure made of a material, which is arranged at a position such that the flow of a conductive connection medium (e.g., solder, sinter or conductive glue) along the repulsive structure is strongly inhibited or even prevented. For example, the repulsive structure may be made of a material having repulsive or non-wetting properties for the conductive connection medium. For example, when the conductive connection medium is solder, the repulsive structure may be a solder resist. For example, the non-wetting properties of the repulsive structure may be at least more pronounced than the non-wetting properties of the surrounding material of the package. It may be desirable for the repulsive structure to be annularly closed so as to keep the conductive connection medium within the area defined by the fence-like annularly closed repulsive structure. However, in other embodiments, the repulsive structure may not be constructed as a ring, but rather as one or more separate physical structures that serve as a mechanical and chemical barrier to the conductive connection medium.

[0017] In the context of the present application, the term "conductive connecting medium" may particularly denote a material that is able to conduct electric current, preferably also able to conduct heat, and that additionally has the property of connecting a carrier to an electronic component and / or to an assembly structure, for example a heat sink and / or a mounting board (such as a printed circuit board, PCB). Examples of conductive connecting media are solders, sintering pastes and / or conductive glues (for example glues comprising metal particles therein). A connecting medium may be a material that can be configured for connecting different components to one another, preferably mechanically and electrically. Such a connecting medium may be flowable during processing and may be rendered (in particular permanently) solid by hardening, curing or the like. Examples of connecting media are solders, glues or assembly adhesives, or even sinterable or semi-sinterable materials.

[0018] In the context of this application, the term "electronic device" may particularly refer to a device having an electronic function, and the device having an electronic function may include a package having one or more electronic components and a carrier, and one or more exposed conductive structures (such as pads, terminals, leads, etc.). The electronic device may have a mounting base that supports the package and / or may have a heat sink mounted on the package, that is, at least one assembly structure.

[0019] In the context of the present application, the term "assembly structure" may particularly denote a structure that is electrically and / or mechanically coupled and / or thermally coupled to a package. For example, such an assembly structure may include a mounting base (which may be, for example, a printed circuit board (PCB)). The package may be surface-mounted on the mounting base. Additionally or alternatively, the assembly structure may include a heat sink attached to the package for removing heat generated by the package during operation, for example heat primarily generated by at least one electronic component of the package.

[0020] In the context of the present application, the term "main surface" of a body may particularly denote one of the largest body surfaces. For example, a body (such as a carrier or an electronic component) may have two opposite main surfaces that are separated in the thickness direction by body material and connected to each other by a circumferential edge.

[0021] In one embodiment, the package body includes a wettable coating (in particular a solderable coating) which is configured to be wetted by the conductive connecting medium and is arranged at least on a portion of the heat dissipation surface (in particular an external heat dissipation surface, which may be flat) of the carrier facing away from the accommodation space. In other words, the wettable coating may be formed at least on a surface portion of the carrier which is opposite to the concave side of the carrier having the accommodation space. More specifically, the wettable coating may be formed on the heat dissipation surface which may be an external flat surface of the top side of the carrier. Advantageously, this may allow a solder connection to be established between the heat dissipation surface and the radiator, since the solder may appropriately wet the wettable coating. Advantageously, the repelling structure may prevent the flowable conductive connecting medium from flowing away from the heat dissipation surface, for example, towards the underside of the carrier.

[0022] In the context of the present application, the term "wettable coating" (e.g., wettable layer) may particularly refer to a film or sheet having surface properties that promote wetting of a conductive connecting medium (e.g., solder or adhesive) thereon (e.g., flowable during processing). In particular, wetting may refer to the ability of the conductive connecting medium to maintain contact with the solid surface of the wettable coating, particularly due to intermolecular interactions when the two are combined. The degree of wetting may be expressed as wettability and may be determined by the balance of forces between adhesive and cohesive forces.

[0023] In one embodiment, the wettable coating also coats at least a portion of the surface of the carrier that faces away from the heat dissipation surface and defines the receiving space. Thus, the wettable coating may also be present on the concave surface of the carrier. Advantageously, this allows for a solder connection to be established between the surface of the wettable coating on the carrier within the receiving space and an electronic component to be mounted on the wettable carrier within the receiving space.

[0024] In one embodiment, the wettable coating coats the entire exterior surface of the carrier. This allows the wettable coating to be formed over the entire surface of the carrier using a single, universal manufacturing process (e.g., plating) without the need for selective plating or patterning of the wettable coating. Due to the repelling structure on the wettable coating, the full surface coverage of the wettable coating will only allow solder to flow in permitted areas, as the repelling structure can act as a mechanical and / or chemical barrier to such solder flow.

[0025] In one embodiment, the wettable coating is configured to wet a solder-type conductive connection medium. Alternatively, the wettable coating may be configured to wet a conductive glue or a sintering material.

[0026] In one embodiment, the wettable coating is a plated layer. The plated layer can be a layer formed at least in part by plating, for example by depositing a metal on a surface (e.g., by chemical plating or sputtering). Plating can be performed directly on a carrier (e.g., a lead frame or clip).

[0027] In one embodiment, the wettable coating comprises or consists of silver. Silver may have excellent wetting properties, allowing solder to be evenly distributed on the silver surface. Advantageously, silver plating may provide better wetting than other materials (e.g., copper).

[0028] In one embodiment, the wettable coating comprises silver and / or nickel. In particular, the coating can be a double-layer structure comprising a bottom nickel layer on a carrier and a top silver layer on the nickel layer. Nickel is solderable, hard, and retains its color. Silver is also solderable, can reduce the risk of copper migration, can prevent nickel oxidation, and has significant wetting properties. In short, a wettable coating comprising silver and nickel can form an excellent solderable film.

[0029] In another embodiment, the wettable coating includes or consists of one of the group consisting of palladium, gold, titanium, nickel, and NiP.

[0030] Although the materials of the wettable coating mentioned in the previous paragraph may be preferred choices, the wettable coating may be made of any material having an affinity for the electrically conductive connection medium to be achieved, in particular solder.

[0031] In one embodiment, the repelling structure is formed at least partially on each of the two opposing guide rails of the carrier. When at least partially formed on the guide rails, the flowable conductive connecting medium can be reliably prevented from undesirably seeping, creeping or flowing from the top side of the carrier to the bottom side via the guide rails.

[0032] In one embodiment, the repelling structure comprises a closed annular structure. According to such a preferred embodiment, the repelling structure can form a circumferentially closed ring, preventing the flowable conductive connecting medium from unintentionally seeping, creeping, or flowing outside the space defined by the annular structure or ring. This ensures comprehensive perimeter protection against unintended spread of the flowable conductive connecting medium.

[0033] In one embodiment, the repelling structure includes a solder resist. The solder resist or solder mask can be a strip, mesh or layer of ink, polymer, paste, laminate or paint, or any other dielectric material, which is applied to the surface to prevent solder from seeping out or forming solder bridges. The solder resist can also play a role in preventing oxidation. For example, the solder resist can be formed based on epoxy resin. For example, the repelling structure can be implemented as an epoxy resin mask.

[0034] In one embodiment, the repelling structure is arranged on the wettable coating. When the repelling structure is formed directly on the wettable coating, the flowable conductive connecting medium (such as molten solder) flowing along the path of the wettable coating can be directly blocked by the chemical and mechanical barrier in the form of the repelling structure.

[0035] In one embodiment, the repelling structure is arranged on the outer surface of a transition portion between the carrier's preferably flat outer heat dissipation surface and the carrier's inner surface defining the receiving space. Due to this preferred configuration, the entire area of ​​the (preferably flat) outer heat dissipation surface adjacent to the transition portion (preferably an inclined, stepped, or vertical edge portion of the carrier) remains available for heat dissipation, for example, for soldering a heat sink thereto. Furthermore, when the repelling structure is arranged on the transition portion, it can be spatially retracted, thereby effectively preventing damage.

[0036] In one embodiment, the transition portion of the carrier is curved and / or stepped. For example, the transition portion may include multiple steps and / or multiple curved sections, and may also include one or more horizontal platforms. This curved and / or stepped configuration of the transition portion laterally defines a receiving space, while the exterior portion serves as a support surface for the repelling structure.

[0037] In one embodiment, the repelling structure is arranged on a platform (which may be a horizontal platform) that is retracted downward relative to the heat dissipation surface of the transition portion, in particular, on an upper platform (preferably on the uppermost platform) (see, for example Figure 2 According to such a preferred embodiment, the entire heat dissipation surface can still be used for heat dissipation purposes, while the repelling structure can be formed very close to the upper main surface of the carrier, thereby reliably preventing or limiting the flow of the flowable conductive connecting medium out of this area. In other words, the solder flow can be spatially confined to the heat dissipation surface, and the repelling structure can also prevent the molten solder from flowing to the bottom portion of the transition area.

[0038] In one embodiment, the repelling structure extends from the upper (or uppermost) platform to and includes (particularly part or all of) the transition portion of the lower (or lowermost) platform (see, for example Figure 4Due to this spatially extended configuration of the repelling structure and the correspondingly complex shape of the repelling structure extending between the different terraces and, therefore, between the different height levels of the transition section, complex and elongated flow paths are formed, which makes it almost impossible for the flowable electrically conductive connecting medium to pass through this complex mechanical and chemical barrier. Furthermore, the barrier can also be sufficiently complex to prevent or at least suppress the undesirable creep of moisture, etc., along the transition section.

[0039] In one embodiment, the repelling structure is arranged on a flat area of ​​the heat dissipation surface (see e.g. Figure 6 For example, the repelling structure can be formed as a ring extending along the upper outer surface of the carrier. This configuration allows for particularly simple production of the repelling structure on easily accessible flat surface areas. In order to keep the heat dissipation surface of the carrier as large as possible, the repelling structure can be formed along the outer periphery of the flat heat dissipation surface.

[0040] In one embodiment, the electronic component comprises at least one terminal for connecting the carrier, said at least one terminal for connecting the carrier being located on one main surface on which the electronic component is mounted on the carrier. A plurality of terminals for connecting the carrier may also be provided.

[0041] In one embodiment, the electronic component comprises at least one exposed terminal facing away from the carrier, for example a plurality of exposed terminals. For example, the exposed terminals may be arranged side by side.

[0042] The electronic component may also include terminals on its two opposing main surfaces.For example, the electronic component may be a semiconductor die that experiences a vertical current flow between the terminals on its two opposing main surfaces during operation.

[0043] In one embodiment, the carrier is pot-shaped and / or has two opposing rails (see e.g. Figure 8 and Figure 9 ). Based on such a carrier, it is possible to produce Type of package.

[0044] In one embodiment, the carrier comprises a lead frame structure, a clip and / or a bent metal sheet.

[0045] In the context of the present application, the term "lead frame structure" may in particular denote a sheet metal structure which can be bent, stamped and / or patterned so as to form a lead frame structure as a mounting section for mounting a chip. In one embodiment, the lead frame may be a metal plate (in particular made of copper or a copper-containing alloy) which can be bent and / or patterned. Forming the carrier as a lead frame structure is cost-effective and a mechanically and electrically highly advantageous configuration in which a low-ohmic connection of the chip can be combined with the robust supporting capabilities of the lead frame structure. In addition, the lead frame structure may contribute to the thermal conductivity of the package and may remove heat generated during operation of the chip due to the high thermal conductivity of the metal (in particular copper) material of the lead frame structure. In the context of the present application, the term "clip" may in particular denote a three-dimensionally bent connecting element which comprises an electrically conductive material such as copper and is a one-piece body having sections to be connected to chip terminals and / or mounting bases.

[0046] In one embodiment, the package is configured as a discrete package. In particular, the package may include a single electronic component. However, in another embodiment, the package may include multiple electronic components mounted on the same carrier. Thus, the package may also include multiple semiconductor components mounted in the receiving space. Thus, the package may include one or more semiconductor components (e.g., at least one passive component, such as a capacitor, and at least one active component).

[0047] In one embodiment, the package is configured as a non-encapsulated package. Thus, the package may not contain an encapsulation material. Alternatively, the package may include an encapsulation material such as a molding compound.

[0048] In one embodiment, the package is configured as a power package. For example, the package is configured as a semiconductor power package. For example, one exemplary embodiment of the package may be an intelligent power module (IPM). Another exemplary embodiment of the package is a dual in-line package (DIP). For example, such a DIP may include a plurality of leads on a can-shaped carrier. For example, the can may be placed over and insulated from the leads of the DIP.

[0049] In one embodiment, the electronic component is a power semiconductor chip. Thus, the semiconductor component (such as a semiconductor chip) can be used for power applications (e.g., in the automotive field) and can, for example, have at least one integrated insulated gate bipolar transistor (IGBT) and / or at least one other type of transistor (such as MOSFET, JFET, etc.) and / or at least one integrated diode. Such integrated circuit elements can, for example, be manufactured in silicon technology or based on wide bandgap semiconductors (e.g., silicon carbide or gallium nitride). The semiconductor power chip may include one or more field effect transistors, diodes, inverter circuits, half-bridges, full-bridges, drivers, logic circuits, other devices, and the like.

[0050] In one embodiment, the electronic component comprises a monolithically integrated transistor, in particular a field effect transistor. Other transistors are also possible, such as a bipolar transistor.

[0051] In one embodiment, the electronic device includes a conductive connection medium for electrically connecting the package body to the assembly structure, for example, the conductive connection medium includes solder, sintering material and / or conductive glue.

[0052] In one embodiment, the conductive connection medium includes solder. In the context of this application, the term "solder" can be a solderable material that can withstand soldering to establish a conductive solder connection between different components. For example, such a solder structure can be a solder film or solder layer or can be a solder bump. For example, a solder paste having a lead-based or bismuth-based solder material can be used. Solder structures including tin can also be used.

[0053] In one embodiment, the conductive connection medium includes an assembly adhesive, such as a conductive glue. It is also possible that this assembly adhesive can be a die attach paste. The assembly adhesive can also be any resin-based assembly adhesive, including semi-sintered materials and pressure-based sintered materials. With regard to mixed and semi-sintered materials, the corresponding paste can be a partially bonded and partially sintered paste, such as a silver-filled adhesive. Therefore, the assembly adhesive can be resin-based, while pure sintered products can be solvent-based. They can be manipulated with the same or similar processes as other die attach adhesives. Therefore, all resin-based die attach or assembly materials can be used as connection media. For example, the assembly adhesive can be epoxy-based, or based on acrylic, silicone, bismaleimide (BMI) and / or a mixed material.

[0054] In one embodiment, the assembly structure includes a radiator mounted on the heat dissipation surface of the carrier. In the context of the present application, the term "radiator" can particularly denote a high thermal conductor that can be thermally coupled to the exposed carrier of the package for removing the heat generated by the electronic components during operation of the package. For example, the radiator can be made of a material with a thermal conductivity of at least 10W / mK, in particular at least 50W / mK, or even up to 400W / mK or even higher. For example, the radiator can be made of a conductive material such as copper, an alloy of copper and / or aluminum, but can also include ceramic materials. The radiator can be thermally coupled to the carrier directly or indirectly, for example, via solder. For example, the radiator can include a thermal conductor (e.g., a metal plate) having a plurality of cooling fins extending from the thermal conductor. Additionally or alternatively, liquid and / or gas cooling can also be achieved by the radiator. The thermal coupling of the package and the radiator can ensure efficient cooling.

[0055] In one embodiment, the assembly structure includes a mounting base, such as a laminate, on which the carrier and / or electronic components are mounted. For example, the mounting base can be a printed circuit board (PCB), an insulated metal substrate (IMS), a direct copper bonding (DCB) substrate, or an active metal brazing (AMB) substrate. As an alternative to a printed circuit board, another laminated carrier can also be used as the mounting base.

[0056] For example, the package body can be sandwiched between the mounting base and the heat sink. For example, the guide rails of the carrier can be soldered to the mounting base. It is also possible that the exposed main surface of the electronic component mounted in the receiving space of the carrier is soldered to the mounting base. Thus, the mounting base can form the bottom side of the electronic device. The heat sink can be soldered to the top of the upper main surface of the carrier facing away from the receiving space, and thus can form the top side of the electronic device.

[0057] In one embodiment, the method comprises forming the repelling structure by printing (e.g., inkjet printing or 3D printing), optionally followed by curing. In this way, the repelling structure can be manufactured simply and precisely. Furthermore, by using inkjet printing, the thickness of the coating can be increased by applying multiple layers on top of each other.

[0058] As the substrate or wafer forming the basis of the semiconductor component, a semiconductor substrate, in particular a silicon substrate, can be used. Alternatively, a silicon oxide or another insulator substrate can be provided. Germanium substrates or III-V semiconductor materials can also be implemented. For example, exemplary embodiments can be implemented using GaN or SiC technology.

[0059] The above and other objects, features and advantages will become apparent from the following description and appended claims taken in conjunction with the accompanying drawings in which like parts or elements are designated by like reference numerals. BRIEF DESCRIPTION OF THE DRAWINGS

[0060] The accompanying drawings, which are included to provide a further understanding of exemplary embodiments and constitute a part of this specification, illustrate exemplary embodiments.

[0061] In the attached figure:

[0062] Figure 1 A cross-sectional view of an electronic device having a package according to an exemplary embodiment is shown.

[0063] Figure 2 Shown according to Figure 1 A cross-sectional view of a package of an electronic device.

[0064] Figure 3 Shown according to Figure 2 A top view of the package.

[0065] Figure 4 A cross-sectional view of a package according to another exemplary embodiment is shown.

[0066] Figure 5 Shown according to Figure 4 A top view of the package body.

[0067] Figure 6 A cross-sectional view of a package according to another exemplary embodiment is shown.

[0068] Figure 7 Shown according to Figure 6 A top view of the package body.

[0069] Figure 8 A top-side three-dimensional view of a carrier with a recessed receiving space of a package according to another exemplary embodiment is shown.

[0070] Figure 9 Shown according to Figure 8 3D view of the bottom side of the carrier of the package with the recessed receiving space.

[0071] Figure 10 A flow chart of a method of manufacturing a package according to an exemplary embodiment is shown. DETAILED DESCRIPTION

[0072] The illustrations in the figures are schematic and not to scale.

[0073] Before describing exemplary embodiments in more detail with reference to the accompanying drawings, some general considerations based on which exemplary embodiments have been developed will be outlined.

[0074] The package can include a can-shaped metal carrier with at least one surface-mounted electronic component, such as one or more power MOSFET devices. Solderable contacts on the surface of the silicon die can be provided for connecting the gate and source to a printed circuit board (PCB). A copper clip attached to the backside of the die can provide a drain connection.

[0075] Traditional The package can be coated with silver only on its underside or interior to facilitate silver epoxy bonding. For example, a Ni / Ag coating can be applied to the inner surface of the carrier. This can facilitate proper mounting of the electronic components on the carrier. However, to prevent tarnishing and the possibility of excessive silver migration, the silver should be kept away from the top side of the carrier.

[0076] According to an exemplary embodiment, a package (which may be of non-encapsulated type) may include a (e.g. metal) carrier having a housing space for accommodating electronic components (e.g. semiconductor chips) on its front side or bottom side. Advantageously, a (e.g. annular) repulsive structure may be provided as a barrier for repelling a conductive connection medium and may be formed on an outer surface portion of the back side of the carrier, the back side of the carrier facing away from the housing space. Preferably, the repulsive structure for repelling the conductive connection medium may be a solder resist for repelling solder. Thus, it is possible to reliably prevent a conductive connection medium (e.g. solder) that may be applied to connect a radiator or another assembly structure to the back side of the carrier from wetting the front side surface portion of the carrier, in which the electronic components may be mounted. Thus, good electrical reliability may be achieved because the repulsive structure may help to keep the conductive connection medium only in the target area. At the same time, proper heat dissipation may be ensured by soldering the radiator on the back side of at least part of the metal carrier. This may achieve excellent performance of the package. For example, the described package may advantageously allow soldering of a heat sink to the back side of a carrier while reliably preventing solder from unintentionally flowing to the front side when the electronic component is mounted in the receiving space.

[0077] According to an exemplary embodiment, a repelling structure configured as a solder mask can be applied to a wettable coating to form a package with a silver back that prevents solder from seeping out. For example, such a solder mask can enable solder connection of a heat sink that can be connected to the back side of a carrier facing away from the side on which the electronic components are mounted. Advantageously, a silver back with a repelling structure can be provided. In a can-shaped package, the repelling structure acts as a solder exclusion zone, thereby enabling soldering of, for example, a heat sink to the back side of the can-shaped carrier.

[0078] To promote heat flow The top of the package is transferred and a heat sink can be added. Using a non-conductive TIM (thermal interface material) to achieve this is a conventional option, although thermal coupling may be limited by the low thermal conductivity of the TIM. However, soldering the heat sink to the top of the can-shaped carrier can achieve significantly better heat conduction and may therefore be highly preferred. However, in conventional methods, this may lead to unintended surface portions of the carrier (e.g., surface portions facing the mounted electronic components) being undesirably wetted by the solder, which may result in undefined or non-reproducible configurations involving electrical reliability issues. According to an exemplary embodiment, a repelling structure (e.g., a solder mask) can be formed, for example, on the outer edge of the carrier, preferably directly on the wettable coating. This can allow solder (or more generally, a conductive connecting medium) to be reliably prevented from wetting the carrier surface in unwanted locations. Furthermore, this can prevent the conductive connecting medium, such as solder, from entering under the can-shaped carrier and flowing to undesired locations. Thus, the electrical reliability of the package can be improved by providing the described repelling structure.

[0079] At the same time, this can provide an opportunity to solder the heat sink to the back side of the carrier, as the repelling structure can prevent solder from flowing into undesirable areas. This, in turn, can significantly improve the thermal performance of the package by establishing an efficient heat flow path from the electronic components via the carrier and heat sink to the environment of the electronic device. By transferring heat more efficiently, the package can operate at a lower temperature, thereby improving efficiency and reducing the energy required for cooling. This can also help reduce carbon dioxide emissions. By improving cooling, operating current can also be increased because the improved cooling allowed by exemplary embodiments can more effectively remove Joule heat from the device.

[0080] In a preferred embodiment, the entire can-shaped carrier can be coated with nickel (Ni) and silver (Ag), which can be applied, for example, by plating. Although silver, in particular a silver-nickel combination, may be preferred, other materials, such as gold, may also be used. This can make it possible to solder the heat sink to the back side of the can-shaped carrier itself to improve the overall thermal capacity while allowing electronic components to be mounted on the front side of the carrier by soldering. In order to prevent solder from wetting the underside of the edge of the can-shaped carrier and the bottom of the can-shaped carrier, a repelling structure such as a solder mask can be provided, which, in a preferred embodiment, can be neatly located in the first lower portion of the can. For example, the repelling structure can advantageously be implemented as a solder mask that can be dispensed or printed. Therefore, the gist of an exemplary embodiment can be to coat the entire can with silver so that the heat sink can be sintered, silver epoxy glued or soldered to the top of the can.

[0081] Therefore, in order to prevent unwanted parts of the carrier from being wetted by the conductive connection medium, in particular solder, it may be very beneficial to provide a repelling structure (e.g. a solder mask), preferably at the outer edge of the can-shaped carrier. The solder mask can prevent the solder from wetting above and below the carrier. The positioning of the solder mask mentioned can ensure that it does not interfere with the appearance of the package or the positioning of the optional laser scribing. For example, the solder mask repelling structure can be applied in the form of a lead frame using a dispensing or inkjet process. This may help to achieve an efficient manufacturing process with high output on an industrial scale. Thus, a heat sink can be soldered to the top of the can-shaped carrier. To support this, it may be advantageous to add silver on the back side of the package having the solder mask on it.

[0082] Therefore, one exemplary embodiment provides a package (such as a discrete package, for example, a field effect transistor (FET) package) having a carrier constructed using a metal can. A silver coating (preferably a NiAg coating, which can be implemented as a double-layer structure consisting of a bottom-side nickel layer and a top-side silver layer) on the back side of the package (which can correspond to the top side of the can-shaped carrier) can be advantageously combined with a solder exclusion zone in the form of a solder resist-type exclusion structure. Advantageously, a conductive connection medium such as a silver-filled epoxy, sinter, or solder can be used to attach a heat sink to the back side of the package.

[0083] In a preferred embodiment, the exclusion structure forming the solder exclusion zone can be made by adding a solder mask to prevent solder material from overflowing to the underside of the electronic component (especially the die), thereby preventing tarnish and excessive silver migration.

[0084] Advantageously, a solder mask repelling structure can be added in the form of a ring that surrounds the first, lower portion of the can-shaped carrier, maintaining the flatness of the structure. Advantageously, reducing (particularly minimizing) the solder mask area can increase (particularly maximizing) the cooling capacity of the package. This package configuration also enables dual-sided cooling.

[0085] Advantageously, the solder mask may be sprayed to form a repelling structure to cover the drain edge while preventing solder from migrating to the drain rail. In one embodiment, the solder mask repelling structure may also be sprayed to cover only the back side of the carrier.

[0086] In short, the solder mask repelling structure can inhibit the conductive connection medium, such as solder, from seeping from the top side of the carrier through the sidewalls of the carrier downward and toward the electronic components. In other words, the repelling structure can prevent the solder (or another conductive connection medium) from parasitic creeping into undesirable areas by providing a barrier (particularly a solder barrier) on the back side of the carrier, which can be implemented, for example, as a lead frame structure or clip. At the same time, the repelling structure can make it possible to establish a solder connection to the heat sink on the back side of the carrier, thereby improving thermal reliability.

[0087] Figure 1 A cross-sectional view of an electronic device 124 having a package 100 is shown according to an exemplary embodiment.

[0088] The illustrated electronic device 124 includes the package 100 and an assembly structure 126 composed of two separate components assembled on the top and bottom sides of the package 100 , respectively.

[0089] More specifically, the top-side component of the assembly structure 126 is embodied herein as a heat sink 130 mounted on the heat dissipation surface 110 of the package body 100. The heat sink 130 is configured to efficiently dissipate heat from the top side of the package body 100. In the embodiment shown, the heat sink 130 includes a highly thermally conductive plate 150 to be thermally coupled to the top side of the package body 100. A plurality of cooling fins 152 extend parallel to each other from the highly thermally conductive plate 150 and are integrally formed with the highly thermally conductive plate 150. The heat sink 130 can be made of a highly thermally conductive material such as copper, aluminum, or ceramic. Other embodiments of the heat sink 130 are possible, such as a water-cooled heat sink, a fan-type heat sink, a heat sink including a heat pipe, and the like.

[0090] On the bottom side of the electronic device 124, another component of the assembly structure 126 is provided, which is implemented as a mounting base 132, for example, a laminate such as a printed circuit board (PCB) or an interposer. The carrier 102 and the electronic components 106 of the package 100 (to be described in more detail below) are mechanically and electrically mounted on the mounting base 132.

[0091] As shown, a conductive connecting medium 128 electrically and mechanically connects the carrier 102 and the electronic component 106 of the package 100 to each other. In addition, another conductive connecting medium 127 electrically and mechanically connects the mounting base 132 of the assembly structure 126 to the carrier 102 and the electronic component 106. More specifically, the conductive connecting medium 127 connects the exposed pads 154 (such as copper pads) of the PCB-type mounting base 132 to the exposed terminals 122, 123 on the bottom major surface of the electronic component 106 of the package 100, and connects the additional exposed pads 154 to the carrier 102. Correspondingly, another conductive connecting medium 129 electrically and mechanically connects the carrier 102 of the package 100 to the heat sink 130 of the assembly structure 126. In the illustrated embodiment, the conductive connecting medium 128 includes, for example, a silver-filled epoxy or mixed sintering paste, or a diffusion solder joint. For example, the conductive connection medium 129 can be a solder such as a SAC (Sn / Ag / Cu) alloy. For example, the conductive connection medium 127 can be another or the same solder. More generally, the conductive connection media 127, 128, 129 can be different or can be the same. For example, the conductive connection media 127 and / or 128 and / or 129 can be solder, a sintering material (e.g., a sintering paste) and / or a conductive glue (e.g., an epoxy-based glue with metal particles therein). The above-mentioned connection established by the conductive connection media 127, 128, 129 ensures the mechanical integrity of the electronic device 124 as a whole. The bottom side connection established by the conductive connection medium 127 can allow the transmission of electrical signals between the mounting base 132 and the components of the package body 100 (particularly the electronic component 106 and the carrier 102). The top-side connection established by the conductive connecting medium 129 can create an efficient thermal path from the electronic component 106 (which can be a primary source of heat during operation of the electronic device 124) through the carrier 102, through the heat sink 130, and from the heat sink to the environment of the electronic device 124. An intermediate conductive connecting medium 128 can connect the electronic component 106 and the carrier 102, for example, to enable die attach.

[0092] Thus, the conductive connection media 127, 128, 129 may include a die-to-mounting base material (reference numeral 127), a die attach material (reference numeral 128), and a heat sink attach material (reference numeral 129). Specifically, the die attach may employ a silver-filled epoxy or a mixed sintered material or a sintered material, the die-to-board attach material may be solder, and the heat sink attach material may be solder, for example, a different or similar alloy. The heat sink attach material may also be a sintering paste, etc.

[0093] More specifically, the wettable coating 108 coats the entire exterior surface of the carrier 102. By coating the entire exterior surface of the carrier 102 with the wettable coating 108, the wettable coating 108 facilitates a reliable solder connection in the receiving space 104 through the conductive connection medium 128 between the electronic component 106 and the carrier 102, as well as a reliable solder connection to the mounting base 132 at the bottom side of the carrier 102. On the top side of the carrier 102, the wettable coating 108 facilitates a reliable solder connection relative to the heat sink 130 through the conductive connection medium 129. The coating 108 provides a surface that enables reliable solder interconnection between the heat sink 130 and the carrier 102, while also providing a surface that enables reliable die attach interconnection between the electronic component 106 and the carrier 102. The coating 108 can also enable reliable solder interconnection to be formed between the carrier 102 and the mounting base 132 (e.g., a substrate).

[0094] Advantageously, the wettable coating 108 is configured to wet (e.g., solder-type) conductive connecting media 127, 128, 129. In particular, the coating 108 provides a wettable surface for soldering and a reliable surface for die attach material adhesion. As shown in detail 160, the wettable coating 108 can be implemented as a double-layer structure including a first metal layer 156 and a second metal layer 158 located on the first metal layer 156. For example, the first metal layer 156 can be a nickel layer. For example, the second metal layer 158 can be a silver layer. The outer surface of the wettable coating 108 can be configured to promote wetting of the conductive connecting media 127, 128, 129, particularly when implemented as solder (e.g., including tin). Therefore, the wettable coating 108 ensures proper coating of the conductive connecting media 127, 128, 129 and, therefore, ensures a very reliable connection between the various components of the electronic device 124 implemented by the conductive connecting media 127, 128, 129.

[0095] The structure of the package 100 will be described in more detail below:

[0096] exist Figure 1 In an embodiment of the present invention, the package 100 includes a conductive carrier 102, which is formed to define a receiving space 104 or a cavity therein. For example, the carrier 102 can be a metal plate (e.g., made of copper, an alloy including copper, aluminum, an alloy including aluminum, or an alloy of aluminum and copper), which is three-dimensionally bent to define a receiving space 104 or a cavity for receiving the electronic component 106. The carrier 102 can be can-shaped, having a central flat section surrounded by at least two opposite side walls, preferably four side walls arranged along all four circumferential sides of the receiving space 104. Figure 1, the carrier 102 is pot-shaped and has two laterally and downwardly extending opposing rails 134, 136 (which may be designated as drain rails) defining a transition portion 114. The transition portion 114 may provide a support for the carrier 102, for example, for keeping the bottom side of the electronic component 106 slightly spaced relative to the mounting base 132 before establishing a solder connection between the electronic component 106 and the mounting base 132. For example, the carrier 102 may have a thickness D in the range of 100 μm to 500 μm, for example 250 μm. For example, the carrier 102 may be implemented as a leadframe structure (e.g., singulated into pot sections from a leadframe) or as a clip.

[0097] As already mentioned, the electronic component 106 is mounted on the carrier 102 and accommodated in the accommodation space 104. In the illustrated embodiment, the package 100 includes only one single electronic component 106 and is a discrete package. Although not shown, the package 100 may also include a plurality of electronic components 106 accommodated in the accommodation space 104. Therefore, the package 100 may also be a multi-chip package. Figure 1 , the electronic component 106 may be a semiconductor chip manufactured, for example, in silicon technology or silicon carbide technology. The electronic component 106 may be a power semiconductor chip. For example, the electronic component 106 may be a metal oxide semiconductor field effect transistor (MOSFET) chip. Alternatively, the electronic component 106 may be an insulated gate bipolar transistor (IGBT) chip. As shown, the electronic component 106 has a plurality of exposed conductive terminals 122, 123 on its bottom side and one terminal 120 on its top side for connecting to the carrier. For example, the terminal 122 may be a gate terminal of the field effect transistor type electronic component 106, the terminal 123 may be a source terminal of the field effect transistor type electronic component 106, and the terminal 120 may be a drain terminal of the field effect transistor type electronic component 106. In other embodiments, any other greater or fewer number of terminals on the top side and / or bottom side of the electronic component 106 is possible. Figure 1 In the embodiment of the present invention, the bottom side terminals 122, 123 are solder connected to the mounting base 132, while the top side terminal 120 can be connected to the carrier 102. For example, the die attach can be made with silver filled epoxy, mixed sinter paste, sinter paste or diffusion solder. In application, die attach may employ silver-filled epoxy. However, since carrier 102 is also solder-connected to mounting base 132 , top-side terminals 120 are also electrically connected to mounting base 132 via carrier 102 .

[0098] As already mentioned, a wettable coating 108 covering the entire outer surface of carrier 102 is highly advantageous for ensuring efficient coating of the surface of carrier 102 with the conductive connecting medium 127, 128, 129 (preferably solder). In particular, the wettable coating 108 on the top side of carrier 102, facing heat sink 130, can be of greatest advantage, as it allows heat sink 130 to be connected to carrier 102 via a highly thermally conductive and mechanically reliable solder connection. Consequently, the result is a package 100 with excellent thermal performance. However, the excellent wettability of wettable coating 108 can also result in a significant tendency for the flowable conductive connecting medium 129 to flow into undesirable areas of the outer surface of carrier 102. Without any further measures, it is particularly likely that the flowable conductive connecting medium 129 (e.g., molten solder) could flow from the top side of carrier 102 to the underside. This can involve the risk of forming undesirable conductive paths and can inadvertently render the appearance of package 100 unreproducible.

[0099] In order to suppress or even eliminate this undesirable phenomenon, it has proven to be very beneficial to provide a repelling structure 112 on selected portions of the outer surface of the wettable coating 108 on the carrier 102. The repelling structure 112 is configured, in particular made of such a material, and is located in such a region of the wettable coating 108 that it effectively repels the conductive connecting medium 129. In particular, the repelling structure 112 can prevent the flowable conductive connecting medium 129 from flowing along the wettable coating 108 and passing through the repelling structure 112, thus acting as a mechanical and chemical barrier for the flowable conductive connecting medium 129. For this purpose, the repelling structure 112 is arranged on a surface portion of the carrier 102 facing away from the receiving space 104. The repelling structure 112 can be a circumferentially closed ring surrounding the entire conductive connecting medium 129 formed on the top-side heat dissipation surface 110 and carrying the heat sink 130. Since the receiving space 104 is formed on the bottom side of the carrier 102, the repelling structure 112 is arranged on the top side of the carrier 102 opposite to the bottom side. Preferably, the repelling structure 112 comprises a solder resist. Figure 1 As shown, the repellent structure 112 can be directly disposed on the wettable coating 108. For example, the repellent structure 112 can be formed as an annular closed structure or an annular structure. In one embodiment, the repellent structure 112 can be formed by printing (eg, 3D printing or inkjet).

[0100] Advantageously, Figure 1 The repelling structure 112 is arranged on the outer surface of the transition portion 114 between the top side heat dissipation surface 110 of the carrier 102 (on which the carrier 102 is connected to the heat sink 130) and the bottom side surface of the carrier 102 that defines the receiving space 104. Figure 1 As shown, the transition portion 114 of the carrier 102 can be formed by curved and stepped sections. Advantageously, the repelling structure 112 is arranged on an upper platform 116 of the transition portion 114 that is recessed downward relative to the heat dissipation surface 110. This has the following advantages: First, arranging the repelling structure 112 on the transition portion 114 does not reduce the area of ​​the heat dissipation surface 110 available for heat dissipation, in particular, the area on which the heat sink 130 is assembled. This ensures excellent thermal performance of the package 100. Second, arranging the repelling structure 112 on the transition portion 114 prevents solder from seeping downward from the heat dissipation surface 110 along the transition portion 114 and reaching the underside of the carrier 102, in particular, the receiving space 104. Therefore, due to the described arrangement of the repelling structure 112, the bottom side of the carrier 102 is reliably kept free of creeping solder. Therefore, configuring the repelling structure 112 as an under-set ring on the transition portion 114 may maximize the top side cooling area of ​​the carrier 102 and may prevent solder from creeping from the top side of the carrier 102 to the bottom side of the carrier 102 .

[0101] exist Figure 1 In the embodiment of the present invention, a NiAg double layer structure is also applied as a wettable coating 108 to the top side of the can-shaped carrier 102 to enable attachment of a heat sink 130 via a conductive connection medium 129, which may include solder, silver-filled epoxy, or sinter. In addition to the wettable coating 108 made of NiAg, it may also be very advantageous to add a solder mask repellent structure 112 to prevent solder material from escaping from the underside of the electronic component 108 into the underside of the carrier 102.

[0102] Therefore, in Figure 1 In an embodiment of the present invention, there may be a Ni / Ag coating on the outside of the can-shaped carrier 102 as well as on the inside of the can-shaped carrier 102. An additional solder mask forming a repelling structure 112 may prevent solder wetting towards the inside of the can.

[0103] Figure 2 Shown according to Figure 1 1 is a cross-sectional view of the package 100 of the electronic device 124. Figure 3 Shown according to Figure 2 FIG. 1 is a top view of the package body 100 .

[0104] like Figure 3 As shown, the repelling structure 112 comprises a closed ring structure. By providing the repelling structure 112 as a circumferentially closed ring, the conductive connection medium 129 (e.g., molten solder) can be reliably prevented from seeping along the entire periphery of the carrier 102. This is particularly advantageous when the entire surface of the carrier 102 is coated with the wettable coating 108, as this can promote the flow of solder in any direction.

[0105] More precisely, according to Figure 2 and Figure 3 The repelling structure 112, in particular embodied as a solder mask, is provided as a ring around the first underlying portion of the transition section 114 of the pot-shaped carrier 102. This combines reliable protection against solder seepage with a large heat dissipation surface 110 that is not restricted by the repelling structure 112.

[0106] The solder mask repellent structure 112 can be formed by inkjet printing and cured on the wettable coating 108. The can carrier 102 can be in the form of a lead frame. Keeping the solder mask area small enough and away from the heat dissipation surface 110 can enhance the cooling capacity of the package 100.

[0107] Positioning the solder mask exclusion structure 112 at the underlying region of the transition portion 114 also maintains the planarity of the heat dissipation surface 110 , leaving it fully available for heat dissipation purposes, such as for attaching a heat sink 130 thereto by soldering.

[0108] from Figure 2 As can be seen, the terminals on the bottom main surface of the electronic component 106 can be covered by solder balls or bumps, thereby forming an electrically conductive connection medium 127 on the bottom side of the electronic component 106. Between adjacent structures of the electrically conductive connection medium 127, the bottom side of the electronic component 106 can be provided with a patterned electrically insulating passivation layer 162. For example, the passivation layer 162 can represent a chip-level solder mask.

[0109] Figure 4 A cross-sectional view of a package 100 according to another exemplary embodiment is shown. Figure 5 Shown according to Figure 4 FIG. 1 is a top view of the package body 100 .

[0110] according to Figure 4 and Figure 5 Examples and Figure 2 and Figure 3 The embodiments of Figure 4 and Figure 5 , the repelling structure 112 extends from the upper platform 116 of the transition portion 114 to and includes the lower platform 118 of the transition portion 114. Figure 5 As shown, the repelling structure 112 may be formed on the entire top surface of the two opposing guide rails 134 , 136 of the carrier 102 .

[0111] like Figure 4 and Figure 5 As shown, the solder mask mold repellent structure 112 may be sprayed to cover the drain edge and prevent solder from migrating to the drain rails 134 , 136 . Figure 4 and Figure 5 The embodiment provides highly reliable protection against solder seepage without compromising the area of ​​the heat dissipation surface 110. Figure 4 and Figure 5 The embodiment will not reduce the cooling area capability nor reduce the flatness of the package 100. In addition, Figure 4 and Figure 5 The embodiment can make the moisture path increased and more complicated, so that the repelling structure 112 can also protect the package 100 from moisture creeping.

[0112] Figure 6 A cross-sectional view of a package 100 according to another exemplary embodiment is shown. Figure 7 Shown according to Figure 6 FIG. 1 is a top view of the package body 100 .

[0113] according to Figure 6 and Figure 7 Examples and Figure 2 and Figure 3 The embodiments of Figure 6 and Figure 7 , the repelling structure 112 is arranged on the top side outer flat area of ​​the heat dissipation surface 110 of the carrier 102. In other words, Figure 6 and Figure 7 The repelling structure 112 may be formed on the same vertical level as the heat dissipation surface 110 .

[0114] Thus, the solder mask repelling structure 112 can be sprayed to cover only the back side of the carrier 102 and the wettable coating 108 thereon. This allows for a very simple application process for forming the repelling structure 112.

[0115] Figure 8 A top-side three-dimensional view of a carrier 102 having a receiving space 104 of a package 100 according to another exemplary embodiment is shown. Figure 9 Shown according to Figure 8 3D bottom side view of the carrier 102 of the package 100 with the recessed receiving space 104 . Figure 8 and Figure 9 No electronic components are shown, only the carrier 102 is shown.

[0116] therefore, Figure 8 and Figure 9 The metal carrier 102 shown includes a central tank area 164 having a cavity-type receiving space 104 surrounded by four stepped, inclined or vertical side walls 166. From two opposite sides of the side walls 166, strip-shaped guide rails 134, 136 extend laterally outward.

[0117] Figure 10A flow chart 200 is shown of a method of manufacturing the package 100 according to an exemplary embodiment. Figure 1 and Figure 9 Example of .

[0118] Referring to block 202 , the method includes providing an at least partially electrically conductive carrier 102 formed to define a receiving space 104 therein.

[0119] Referring to block 204 , the method includes mounting the electronic component 106 on the carrier 102 and at least partially receiving it in the receiving space 104 .

[0120] Referring to block 206 , the method includes forming a repelling structure 112 configured to repel the conductive connecting medium 127 , 128 , 129 .

[0121] Referring to block 208 , the method includes disposing a repelling structure 112 on a portion of a surface of the carrier 102 facing away from the receiving space 104 .

[0122] With inkjet, the forming and placement processes may be the same process (e.g., the material can be dispensed where the jetting occurs). However, when the material is dipped or sprayed, additional processes such as drying, exposure / development / baking may be performed to pattern the solder mask. With this in mind, for inkjet, stages 206 and 208 can be combined into one.

[0123] It should be noted that the term "comprising" does not exclude other elements or features, and "a" or "an" does not exclude a plurality. Elements described in association with different embodiments may also be combined. It should also be noted that the reference numerals should not be interpreted as limiting the scope of the claims. Furthermore, the scope of the present application is not intended to be limited to the particular embodiments of the processes, machines, manufactures, compositions of matter, means, methods, and steps described in the specification. Accordingly, the appended claims are intended to include within their scope such processes, machines, manufactures, compositions of matter, means, methods, or steps.

Claims

1. A package (100), comprising: an at least partially electrically conductive carrier (102) formed to define a receiving space (104) therein; An electronic component (106) mounted on the carrier (102) and at least partially housing in the receiving space (104); and A repelling structure (112) which is configured to repel the electrically conductive connecting medium (129) and is arranged on a portion of the surface of the carrier (102) facing away from the receiving space (104).

2. The package (100) according to claim 1, wherein The package (100) comprises a wettable coating (108) which is configured to be wettable by an electrically conductive connecting medium (127, 128, 129) and is arranged at least on a portion of a heat dissipation surface (110) of the carrier (102) facing away from the receiving space (104).

3. The package (100) according to claim 2, wherein: The wettable coating (108) also coats at least a portion of the surface of the carrier (102) facing away from the heat dissipation surface (110) and delimiting the receiving space (104).

4. The package (100) according to claim 2 or 3, wherein: The wettable coating (108) coats the entire exterior surface of the carrier (102).

5. The package (100) according to any one of claims 2 to 4, wherein: The wettable coating (108) is configured to wet a solder-type conductive connecting medium (127, 128, 129).

6. The package (100) according to any one of claims 2 to 5, wherein: The wettable coating (108) includes silver and / or nickel.

7. The package (100) according to any one of claims 1 to 6, wherein: The repelling structure (112) is formed on at least a portion of each of two opposing rails (134, 136) of the carrier (102).

8. The package (100) according to any one of claims 1 to 7, wherein: The repelling structure (112) comprises a closed ring structure.

9. The package (100) according to any one of claims 1 to 8, wherein: The repelling structure (112) includes solder resist.

10. The package (100) according to any one of claims 2 to 9, wherein: The repellent structure (112) is disposed on the wettable coating (108).

11. The package (100) according to any one of claims 1 to 10, wherein: The repelling structure (112) is arranged on the outer surface of a transition portion (114) between a preferably flat outer heat dissipating surface (110) of the carrier (102) and an inner surface of the carrier (102) that defines a receiving space (104).

12. The package (100) according to claim 11, wherein The transition portion (114) of the carrier (102) is curved and / or stepped.

13. The package (100) according to claim 11 or 12, wherein: The repelling structure (112) is arranged on a platform of the transition portion (114) that is retracted downward relative to the heat dissipation surface (110), in particular, on an upper platform (116).

14. The package (100) according to claim 13, wherein: The repelling structure (112) extends from an upper platform (116) to and includes a lower platform (118) of a transition portion (114).

15. The package (100) according to any one of claims 1 to 14, wherein: The repelling structure (112) is arranged on a flat area of ​​the heat dissipation surface (110).

16. The package (100) according to any one of claims 1 to 15, wherein: The package (100) includes at least one of the following features: The electronic component (106) comprises at least one terminal (120) for connecting to a carrier, wherein the at least one terminal (120) for connecting to the carrier is located on a main surface, and the electronic component (106) is mounted on the carrier (102) on the main surface; The electronic component (106) includes at least one exposed terminal (122, 123), for example a plurality of exposed terminals (122, 123), facing away from the carrier (102); The carrier (102) is can-shaped; The carrier (102) has two opposing guide rails (134, 136); The carrier (102) comprises a lead frame structure, a clip and / or a bent metal plate; The package (100) is configured as a discrete package; The package (100) is configured as a non-encapsulated package; The package (100) is configured as a power package; The electronic component (106) is a power semiconductor chip; The electronic components (106) include monolithically integrated transistors, in particular field effect transistors.

17. An electronic device (124), comprising: The package (100) according to any one of claims 1 to 16; and An assembly structure (126) assembled with the packaging body (100).

18. The electronic device (124) according to claim 17, wherein The electronic device (124) includes at least one of the following features: The electronic device (124) includes a conductive connection medium (127, 129) for electrically connecting the package (100) and the assembly structure (126), wherein the conductive connection medium (127, 129) includes, for example, solder, sintering material and / or conductive glue; The assembly structure (126) includes a heat sink (130) mounted on the heat dissipation surface (110) of the carrier (102); The assembly structure (126) includes a mounting base (132), such as a laminate, on which the carrier (102) and / or the electronic component (106) are mounted.

19. A method of manufacturing a package (100), wherein: The method comprises: providing an at least partially electrically conductive carrier (102) formed to define a receiving space (104) therein; The electronic component (106) is mounted on the carrier (102) and is at least partially housed in in the accommodation space (104); forming a repelling structure (112) configured to repel the conductive connecting medium (129); and The repelling structure (112) is arranged on a portion of the surface of the carrier (102) facing away from the receiving space (104).

20. The method according to claim 19, wherein The method comprises forming the repelling structure (112) by printing, such as inkjet printing or three-dimensional printing, optionally followed by curing.

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