Packaging structure of SIP system integration module

Abstract

The invention provides a packaging structure of an SIP (Session Initiation Protocol) system integration module, which comprises a tube shell (1) and a group of lead holes (2) arranged on the tube shell (1), and is characterized in that at least one substrate (3) is arranged in the tube shell (1), a group of steps (4) correspondingly matched with the substrate (3) are uniformly distributed on the tube shell (1), a lead (5) correspondingly matched with the substrate (3) is arranged in each lead hole (2) in a penetrating manner, and a bent section (5a) is arranged on each lead (5). The SIP module is simple in structure and convenient to use, an existing structure is directly improved, and the shell lead is changed from a linear type to a bent type, so that the stress of the lead to the welding position of the through hole of the substrate during temperature circulation is reduced, and the reliability of the SIP module is improved.

Description

Technical Field

[0001] The invention belongs to the field of SIP system integration, and in particular relates to a packaging structure of a SIP system integration module. Background Art

[0002] like Figure 1 As shown, a certain type of SIP system integration module adopts a hermetic enclosure. An upper and lower substrate 3 is assembled inside the enclosure 1. The lower substrate is bonded to the bottom of the enclosure, and the upper substrate is fixed to the steps 2 at the four corners of the enclosure. The two substrates are electrically connected through pins 4.

[0003] During later testing and use, it was discovered that the through-holes where the upper substrate connects to the housing pins were fractured. Analysis revealed stress in the substrate through-holes, as shown in the figure below: The upper substrate is fixed to the four corner steps of the housing, and the through-holes in the upper substrate are welded to the housing pins.

[0004] In this case, when the module undergoes a temperature cycling test, the different thermal expansion coefficients of the various materials inside the module cause stress to be generated at the solder joints between the shell pins and the upper substrate through-holes. If the through-hole soldering strength at this location is insufficient, the stress will tear the guide strips of the pin pads at the through-holes, causing a short circuit. Summary of the Invention

[0005] The present invention aims to overcome the deficiencies in the prior art and provides a packaging structure for a SIP system integration module.

[0006] This application provides the following technical solutions: A packaging structure for a SIP system integrated module includes a tube shell with a group of lead holes provided on the tube shell. The invention is characterized in that at least one substrate is provided in the tube shell, a group of steps corresponding to the substrate are evenly distributed on the tube shell, a lead corresponding to the substrate is passed through each lead hole, and the lead is provided with a bent section.

[0007] On the basis of the above technical solutions, the following further technical solutions can be provided: A substrate is provided on the bottom surface of the tube shell, and another substrate is provided on the step. Both substrates are connected with the leads to form electrical signal connections.

[0008] The bent section is located on the lead wire body in the tube shell, the lead wire on the upper side of the bent section is a vertically distributed upper straight section, and the lead wire on the lower side of the bent section is a vertically distributed lower straight section.

[0009] Advantages of the invention: The present invention has a simple structure and is easy to use. It directly improves the existing structure by improving the shell lead from a straight type to a curved type, thereby reducing the stress of the lead on the substrate through-hole welding during temperature cycling and improving the reliability of the SIP module. BRIEF DESCRIPTION OF THE DRAWINGS

[0010] Figure 1 It is a structural diagram in the prior art; Figure 2 is a top view of the tube shell of the present invention; Figure 3 It is a top view of the base plate placed on the steps; Figure 4 This is a schematic diagram of the structure of the present invention encapsulating two substrates; Figure 5 It is a structural schematic diagram of encapsulating a substrate in the present invention. DETAILED DESCRIPTION Example

[0011] like Figure 2-4 As shown, a SIP system integrated module packaging structure comprises a rectangular package 1 with two rows of lead holes 2 defined on its bottom surface. Glass insulators 2a are installed within the lead holes 2. Leads 5 are passed through the glass insulators 2a. Within the package 1, the leads 5 have a curved section 5a. Above the curved section 5a, the leads 5 extend vertically as an upper straight section 5b. Below the curved section 5a, the leads 5 extend vertically as a lower straight section 5c. The lower end of the lower straight section 5c extends beyond the package 1.

[0012] A step 4 is extended from each of the four corners of the inner wall of the tube shell 1 . The four steps 4 are on the same horizontal plane so that the four steps 4 can support a substrate 3 placed therein.

[0013] A substrate 3 is placed on the bottom surface of the housing 1 and on the step 4. The substrate 3 on the bottom surface of the housing 1 is inserted into the lower straight section 5c, while the other substrate 3 on the step 4 is inserted into the upper straight section 5b. The substrate 3 on the step 4 is soldered to the lead 5 to form an electrical signal connection. The substrate 3 on the bottom surface of the housing 1 is fixed to the housing 1 by adhesive bonding. Example

[0014] The difference between Example 2 and Example 1 is that Figure 5 As shown, only a substrate 3 is placed on four steps 4. The other identical structures are not described here. Working principle: Since a bent section 5a is provided on one side of the wire body where the lead is connected and fixed to the substrate, the stress of the lead on the through-hole soldering point of the substrate during temperature cycling is reduced, thereby improving the reliability of the SIP module.

Claims

1. A packaging structure of a SIP system integrated module, comprising a tube shell (1), a group of lead holes (2) being provided on the tube shell (1), characterized in that: At least one substrate (3) is provided in the tube shell (1), a group of steps (4) corresponding to the substrate (3) are evenly distributed on the tube shell (1), a lead (5) corresponding to the substrate (3) is passed through each lead hole (2), and a bent section (5a) is provided on the lead (5).

2. The packaging structure of a SIP system integration module according to claim 1, characterized in that: A substrate (3) is provided on the bottom surface of the tube shell (1), and another substrate (3) is provided on the step (4). Both substrates (3) form an electrical signal connection with the lead wire (5).

3. The packaging structure of a SIP system integration module according to claim 1, characterized in that: The bent section (5a) is located on the lead (5) in the tube shell (1); the lead (5) on the upper side of the bent section (5a) is a vertically distributed upper straight section (5b); and the lead (5) on the lower side of the bent section (5a) is a vertically distributed lower straight section (5c).

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