Micro-electro-mechanical microphone structure and electronic equipment

Abstract

The invention relates to the technical field of micro-electro-mechanical systems, in particular to a micro-electro-mechanical system microphone structure and electronic equipment, the micro-electro-mechanical system microphone structure comprises a substrate, the substrate comprises a first surface and a second surface opposite to the first surface, the first surface is provided with a first accommodating cavity, the second surface is provided with a second accommodating cavity, and the first accommodating cavity and the second accommodating cavity are communicated with each other. And a bonding pad is also arranged on the second surface and is positioned outside the second accommodating cavity. The space layout is optimized, the containing cavities are formed in the two sides of the substrate respectively, the structure thickness is reduced, and the diversified requirements of the electronic equipment can be met.

Description

Technical Field

[0001] The present invention relates to the field of micro-electromechanical technology, and in particular to a micro-electromechanical microphone structure and electronic equipment. Background Art

[0002] Microelectromechanical system (MEMS) microphones have become the mainstream acoustic sensor in consumer electronics due to their miniaturization, high integration, and low cost. As performance requirements for MEMS microphones continue to increase, the need to integrate more acoustic sensors has made it difficult for the overall size of MEMS microphones to meet the demands of increasingly compact electronic devices. Summary of the Invention

[0003] In view of the above problems, an object of the present invention is to provide a micro-electromechanical microphone structure.

[0004] Another object of the present invention is to provide an electronic device.

[0005] A micro-electromechanical microphone structure is characterized in that it includes a substrate, the substrate including a first surface and a second surface opposite to the first surface, a first accommodating cavity is provided on the first surface, a second accommodating cavity is provided on the second surface, and a solder pad is also provided on the second surface, which is located outside the second accommodating cavity.

[0006] In the micro-electromechanical microphone structure of the present invention, a first acoustic sensor and a first application-specific integrated circuit are provided in the first accommodating cavity, and the first acoustic sensor is signal-connected to the first application-specific integrated circuit.

[0007] In the micro-electromechanical microphone structure of the present invention, a second acoustic sensor and a second ASIC are provided in the second accommodating cavity, and the second acoustic sensor is signal-connected to the second ASIC.

[0008] In the micro-electromechanical microphone structure described in the present invention, the first accommodating cavity is composed of the first surface and a first metal cover provided on the first surface. The first metal cover is provided with a first acoustic through hole, and the height of the first metal cover is 0.3mm to 0.8mm.

[0009] In the micro-electromechanical microphone structure described in the present invention, the second accommodating cavity is composed of the second surface and a second metal cover provided on the second surface. The second metal cover is provided with a second acoustic through hole, and the height of the second metal cover is 0.3mm to 0.8mm.

[0010] In the micro-electromechanical microphone structure of the present invention, a signal processing chip is provided in the first accommodating cavity or the second accommodating cavity, and the signal processing chip is signal-connected to the first ASIC and the second ASIC.

[0011] In the micro-electromechanical microphone structure of the present invention, the thickness of the substrate is 0.3 mm to 0.5 mm.

[0012] The micro-electromechanical microphone structure of the present invention further includes a second pad, wherein the second pad and the first pad are located on the same side or both sides of the second metal cover on the second surface.

[0013] In the micro-electromechanical microphone structure of the present invention, the length of the second metal cover is smaller than the length of the first metal cover.

[0014] An electronic device includes the micro-electromechanical microphone structure described above, and includes a circuit board, a through-hole is provided on the circuit board, the second accommodating cavity passes through the through-hole and is at least partially located in the through-hole, and the solder pad is connected to the circuit board signal.

[0015] Beneficial effects: The present invention can meet the diverse requirements of electronic equipment by optimizing spatial layout and reducing structural thickness. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] Figure 1 is a schematic diagram of a micro-electromechanical microphone structure according to a specific embodiment of the present invention;

[0017] Figure 2 is a schematic diagram of a micro-electromechanical microphone structure according to another specific embodiment of the present invention;

[0018] Figure 3 Schematic diagram of the cooperation between the micro-electromechanical microphone structure of the present invention and the circuit board of an electronic device. DETAILED DESCRIPTION

[0019] The following will clearly and completely describe the technical solutions in the embodiments of the present invention in conjunction with the accompanying drawings. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making any creative efforts shall fall within the scope of protection of the present invention.

[0020] It should be noted that, in the absence of conflict, the embodiments of the present invention and the features therein may be combined with each other.

[0021] The present invention will be further described below with reference to the accompanying drawings and specific embodiments, but they are not intended to limit the present invention.

[0022] Reference Figures 1 to 2The micro-electromechanical microphone structure includes a substrate 1, which includes a first surface and a second surface opposite to the first surface. A first accommodating cavity 26 is provided on the first surface, a second accommodating cavity 36 is provided on the second surface, and a solder pad 11 is also provided on the second surface, which is located outside the second accommodating cavity 36.

[0023] The present invention optimizes the spatial layout, provides accommodating cavities on both sides of the substrate, reduces the thickness of the structure, can meet the diverse requirements of electronic devices, improve the consistency of the structure and achieve overall thinning.

[0024] In a preferred embodiment of the present invention, a first acoustic sensor 21 and a first ASIC 22 are disposed in the first accommodating cavity 26 , and the first acoustic sensor 21 is signal-connected to the first ASIC 22 .

[0025] In a preferred embodiment of the present invention, a second acoustic sensor 31 and a second ASIC 32 are provided in the second accommodating cavity 36 , and the second acoustic sensor 31 is signal-connected to the second ASIC 32 .

[0026] In a preferred embodiment of the present invention, a signal processing chip 23 is disposed within the first accommodating cavity 26 or the second accommodating cavity 36. The signal processing chip 23 is signal-connected to the first ASIC 22 and the second ASIC 32. The signal processing chip 23 processes the signals from the first ASIC 22 and the second ASIC 32 to generate a directional output signal. The signal processing chip 23 may include a phase delayer that delays the output signal of the second ASIC by a predetermined phase, and an adder-subtractor that performs addition and subtraction operations on the output signal of the first ASIC 22 and the output signal of the phase delayer to output a directional output signal, such as an omnidirectional output signal, a figure-of-eight output signal, or a cardioid output signal. The signal processing chip 23 may generate one of the above-mentioned directional output signals in response to a switching control signal.

[0027] In a preferred embodiment of the present invention, the first accommodating cavity 26 is composed of a first surface and a first metal cover 24 arranged on the first surface. The first metal cover 24 is provided with a first acoustic through hole 25. The height of the first metal cover is 0.3mm to 0.8mm, preferably 0.7mm, and the width of the first metal cover is preferably 4mm.

[0028] In a preferred embodiment of the present invention, the second accommodating cavity 36 is composed of a second surface and a second metal cover 33 arranged on the second surface. The second metal cover 33 is provided with a second acoustic through hole 34. The height of the second metal cover 34 is 0.3mm to 0.8mm, preferably 0.7mm, and the length of the second metal cover 34 is less than the length of the first metal cover.

[0029] After the first acoustic through hole 25 guides the sound into the first acoustic sensor 21, the first dedicated integrated circuit 22 performs signal processing; after the second acoustic through hole 34 guides the sound into the second acoustic sensor 31, the second dedicated integrated circuit 32 performs signal processing, and the signal processing chip 23 receives the signals from the first dedicated integrated circuit 22 and the second dedicated integrated circuit chip 32 for calculation processing.

[0030] In a preferred embodiment of the present invention, the substrate 1 is a PCB circuit board with a thickness of 0.3 mm to 0.5 mm, preferably 0.4 mm, and the interior of the substrate 1 can be hollow.

[0031] In a preferred embodiment of the present invention, a second solder pad 12 is further included. The second solder pad 12 and the first solder pad 11 are located on the same side or both sides of the second metal cover 33 on the second surface.

[0032] The micro-electromechanical microphone structure of the present invention supports SMT (Surface Mounted Technology) packaging.

[0033] Reference Figure 3 An electronic device includes the above-mentioned micro-electromechanical microphone structure, and also includes a circuit board 5, a through-hole is provided on the circuit board 5, the second accommodating cavity 36 passes through the through-hole and is at least partially located in the through-hole, and the micro-electromechanical microphone structure is connected to the circuit board 5 through the solder pad 11 or through the solder pad 11 and the second solder pad 12.

[0034] In specific implementations, the second metal cover 36 extends through the through-hole, with at least a portion positioned within it. Its height partially overlaps the thickness of the circuit board 5, allowing it to utilize a portion of the circuit board 5 to reduce the internal space occupied by the electronic device and improve assembly compactness. A first acoustic rubber can be positioned on the exterior of the first metal cover 26, while a second acoustic rubber can be positioned on the exterior of the second metal cover 36. These first and second acoustic rubbers allow for mating and mounting with other components within the electronic device.

[0035] Through the description and drawings, typical embodiments of the specific structure of the specific implementation are given. Based on the spirit of the present invention, other transformations can be made. Although the above invention has proposed the existing preferred embodiments, however, these contents are not intended to be limiting.

[0036] Various changes and modifications will undoubtedly become apparent to those skilled in the art upon reading the foregoing description. Therefore, the appended claims should be construed to encompass all changes and modifications within the true intent and scope of the present invention. Any and all equivalents within the scope of the claims should be considered to be within the intent and scope of the present invention.

Claims

1. A micro-electromechanical microphone structure, characterized in that: The substrate includes a first surface and a second surface opposite to the first surface. The first surface is provided with a first accommodating cavity, the second surface is provided with a second accommodating cavity, and the second surface is further provided with a solder pad located outside the second accommodating cavity.

2. The micro-electromechanical microphone structure according to claim 1, characterized in that: A first acoustic sensor and a first dedicated integrated circuit are provided in the first accommodating cavity, and the first acoustic sensor is signal-connected to the first dedicated integrated circuit.

3. The micro-electromechanical microphone structure according to claim 2, characterized in that: A second acoustic sensor and a second dedicated integrated circuit are provided in the second accommodating cavity, and the second acoustic sensor is signal-connected to the second dedicated integrated circuit.

4. The micro-electromechanical microphone structure according to claim 1, characterized in that: The first accommodating cavity is formed by the first surface and a first metal cover provided on the first surface. The first metal cover is provided with a first acoustic through hole. The height of the first metal cover is 0.3 mm to 0.8 mm.

5. The micro-electromechanical microphone structure according to claim 4, characterized in that: The second accommodating cavity is formed by the second surface and a second metal cover provided on the second surface. The second metal cover is provided with a second acoustic through hole. The height of the second metal cover is 0.3 mm to 0.8 mm.

6. The micro-electromechanical microphone structure according to claim 3, characterized in that: A signal processing chip is provided in the first accommodating cavity or the second accommodating cavity, and the signal processing chip is signal-connected to the first ASIC and the second ASIC.

7. The micro-electromechanical microphone structure according to claim 1, characterized in that: The thickness of the substrate is 0.3 mm to 0.5 mm.

8. The micro-electromechanical microphone structure according to claim 5, characterized in that: The second pad is located on the same side or both sides of the second metal cover on the second surface as the first pad.

9. The micro-electromechanical microphone structure according to claim 5, characterized in that: The length of the second metal cover is smaller than that of the first metal cover.

10. An electronic device, characterized in that: The micro-electromechanical microphone structure according to any one of claims 1 to 9 comprises a circuit board, a through-hole is provided on the circuit board, the second accommodating cavity passes through the through-hole and is at least partially located in the through-hole, and the solder pad is connected to the circuit board signal.

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