Packaging structure and method of flip LED chip

Abstract

The invention belongs to the technical field of LED chip packaging, particularly relates to a flip LED chip packaging structure and method, and aims to solve the problems that adaptive clamping adjustment cannot be performed according to an LED chip and a clamp needs to be frequently replaced, the flip LED chip packaging structure comprises a packaging machine, the inner wall of the packaging machine is fixedly connected with a bottom plate, and the top end of the bottom plate is fixedly connected with a lifting seat; a connecting frame is arranged above the lifting seat, a turnover adaptive retention assembly is arranged in the connecting frame, an anti-falling assembly is arranged below the turnover adaptive retention assembly, a mounting plate is arranged above the connecting frame, a positioner is fixedly connected to the bottom end of the mounting plate, and symmetrical connecting rods are fixedly connected to the top end of the mounting plate. According to the flip LED chip packaging structure and method disclosed by the invention, self-adaptive adjustment can be carried out according to LED chips with different sizes and shapes, a clamp does not need to be frequently replaced, the universality of equipment to various chips is improved, and the production cost is reduced.

Description

Technical Field

[0001] The present invention relates to the technical field of LED chip packaging, and in particular to a packaging structure and method for a flip-chip LED chip. Background Art

[0002] The flip-chip LED chip packaging structure is an innovative design compared to the traditional upright LED chip packaging structure. Its characteristic is that the electrical side of the chip faces downward and is directly connected to the substrate, thereby optimizing thermal management and electrical performance.

[0003] In the existing technology, traditional clamping devices are difficult to adaptively adjust according to the size and shape of LED chips, and cannot clamp accurately and stably. When facing chips of different specifications, the clamps need to be changed frequently, which is time-consuming and labor-intensive, limiting the improvement of production efficiency and cost control. Summary of the Invention

[0004] The present invention discloses a packaging structure and method for flip-chip LED chips, aiming to solve the technical problems in the background art that the existing traditional clamping device is difficult to adapt to various shapes of LED chips, requires frequent clamp replacement, is time-consuming and labor-intensive, and limits production efficiency.

[0005] The present invention proposes a packaging structure for a flip-chip LED chip, comprising a packaging machine, wherein the inner wall of the packaging machine is fixedly connected to a base plate, the top of the base plate is fixedly connected to a lifting seat, a connecting frame is provided above the lifting seat, a flip-adaptive retaining component is provided inside the connecting frame, an anti-drop component is provided below the flip-adaptive retaining component, a mounting plate is provided above the connecting frame, the bottom end of the mounting plate is fixedly connected to a positioner, the top end of the mounting plate is fixedly connected to symmetrical connecting rods, the bottom ends of the connecting rods are fixedly connected to hydraulic rods, and the bottom ends of the hydraulic rods are fixedly connected to the top end of the connecting frame; The flip adaptive retaining assembly includes a flip frame, and two symmetrical adaptive retaining members are arranged inside the flip frame, and a flexible arc plate is arranged between the symmetrical adaptive retaining members; The anti-drop component includes an air head, the bottom end of the air head is fixedly connected to a connecting air pipe, and the end of the connecting air pipe away from the air head is fixedly connected to an air pump.

[0006] In a preferred embodiment, the flip-adaptive retention assembly also includes a servo motor, a power output shaft of the servo motor is connected to a rotating rod through a coupling, a circular hole is provided on the side of the connecting frame close to the servo motor, and the inside of the circular hole is movably connected to the outside of the rotating rod, the front end of the rotating rod is fixedly connected to one side of the flip frame, the flip frame is provided with a hole on the side away from the rotating rod, the inside of the hole is movably connected to a retaining rod, one end of the retaining rod is fixedly connected to one side of the connecting frame, two symmetrical telescopic electric rods are fixedly connected to both sides of the interior of the flip frame, and the front ends of the telescopic electric rods are fixedly connected to the connecting rods. The connecting piece, the front end of the connecting piece and the outer side of the adaptive retaining piece are fixedly connected, the adaptive retaining piece is provided with a through-hole, the inside of the through-hole is movably connected with a round rod, the two ends of the round rod are fixedly connected to the inner side of the front end of the connecting piece, a telescopic rod is provided between the symmetrical telescopic electric rods, the bottom end of the telescopic rod is fixedly connected to the inner sides of the flip frame, and the inner sides of the flip frame are fixedly connected with a compression spring, the compression springs are located on the outer side of the telescopic rod, the front ends of the telescopic rod and the compression spring are fixedly connected to the mounting piece, and the front end of the mounting piece is fixedly connected to the opposite side of the symmetrical flexible arc plate.

[0007] In a preferred solution, the front end of the packaging machine is fixedly connected to an observation window, the front end of the packaging machine is fixedly connected to a cabinet door, and the cabinet door is located below the observation window, the inner wall of the packaging machine is fixedly connected to a slide member, the inner sides of the slide member are movably connected with rotating threaded rods, the end of the rotating threaded rod close to the servo motor is connected to the driving motor through a coupling, the outer side of the driving motor is fixedly connected to a motor frame, one side of the motor frame is fixedly connected to the inner wall of the packaging machine, the outer side of the rotating threaded rod is movably connected to a sliding seat, and the bottom end of the sliding seat is movably connected to the front end of the slide member, the front end of the sliding seat is fixedly connected to a robotic arm, the front end of the robotic arm is fixedly connected to a connecting frame, and the bottom end of the connecting frame is fixedly connected to the top of the mounting plate.

[0008] The transmission mechanism that this sliding part has a hole, and this hole is that this sliding part is in the air-conditioning system of present invention, and this sliding part has a bottom end and is fixed with this foot-operated gear.

[0009] A method for using a packaging structure for a flip-chip LED chip, using the packaging structure for a flip-chip LED chip as described above, comprises the following steps: Step 1: Place the LED chip face up on top of the lift. Activate the hydraulic lever, which is symmetrically connected to the top of the mounting plate, to push the mounting plate down, which in turn drives the connecting frame connected to it downward. The flip-adaptive retaining assembly inside the connecting frame begins to operate. The two symmetrical adaptive retaining members in the flip frame gradually approach and accurately clamp the outer side of the LED chip, ensuring that the chip is firmly positioned during subsequent operations. Step 2: After clamping is completed, the hydraulic rod reverses and begins to lift. At the same time, the anti-drop component located below the flip adaptation retention component comes into play. The air pump delivers gas to the air head through the connecting air pipe, so that the air head generates suction, firmly sucking the bottom of the LED chip to prevent the chip from falling during the flipping process, providing reliable protection for the next flipping step; Step 3: After the air head firmly adsorbs the bottom of the LED chip, flip the adaptive retaining component to start the flipping action, driving the clamped LED chip to flip 180 degrees, turning the original front-facing LED chip to the back-facing side, preparing for the final packaging process.

[0010] From the above, it can be seen that the packaging structure of a flip-chip LED chip provided by the present invention can be adaptively adjusted according to LED chips of different sizes and shapes, without the need for frequent replacement of fixtures, thereby improving the versatility of the equipment for multiple chips and reducing production costs. BRIEF DESCRIPTION OF THE DRAWINGS

[0011] Figure 1 This is a schematic diagram of the overall structure of a flip-chip LED chip packaging structure proposed by the present invention; Figure 2 This is a schematic diagram of the internal structure of a flip-chip LED chip packaging structure proposed by the present invention; Figure 3 This is a schematic diagram of the upper structure of the connection frame of a flip-chip LED chip packaging structure proposed by the present invention; Figure 4 A schematic diagram of a mechanical arm structure for a flip-chip LED chip packaging structure proposed by the present invention; Figure 5 A schematic diagram of the flip-adaptive retention component structure of a flip-chip LED chip packaging structure proposed by the present invention; Figure 6 A schematic diagram of the structure of a flip-adaptive retaining component of a flip-chip LED chip packaging structure proposed by the present invention; Figure 7 This is a schematic diagram of the anti-drop component structure of a flip-chip LED chip packaging structure proposed by the present invention; Figure 8 This is a schematic structural diagram of the anti-drop component portion of a flip-chip LED chip packaging structure proposed by the present invention.

[0012] Figure: 1, packaging machine; 2, observation window; 3, cabinet door; 4, slide member; 5, robot arm; 6, mounting plate; 7, anti-drop assembly; 701, connecting plate; 702, rotating motor; 703, rotating shaft; 704, pulling rope; 705, base; 706, air head; 707, connecting air pipe; 708, air pump; 709, retaining frame; 710, sliding plate; 711, sliding rod; 712, sliding frame; 8, connecting frame; 9, flip adaptor retaining assembly; 901, flip frame; 9 02. Rotating rod; 903. Servo motor; 904. Retaining rod; 905. Telescopic electric rod; 906. Connecting piece; 907. Round rod; 908. Telescopic rod; 909. Compression spring; 910. Mounting piece; 911. Flexible arc plate; 912. Adaptive retaining piece; 10. Lifting seat; 11. Base plate; 12. Connecting frame; 13. Hydraulic rod; 14. Positioner; 15. Connecting rod; 16. Sliding seat; 17. Drive motor; 18. Motor frame; 19. Rotating threaded rod. DETAILED DESCRIPTION

[0013] The technical solutions in the embodiments of the present invention will be clearly and completely described below in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, rather than all the embodiments.

[0014] The present invention discloses a flip-chip LED chip packaging structure that is mainly used in scenarios where existing traditional clamping devices are difficult to adapt to various shapes of LED chips, require frequent fixture replacement, are time-consuming and labor-intensive, and limit production efficiency.

[0015] Reference Figure 1-8 , including a packaging machine 1, the inner wall of the packaging machine 1 is fixedly connected to a bottom plate 11, the top of the bottom plate 11 is fixedly connected to a lifting seat 10, a connecting frame 8 is provided above the lifting seat 10, a flip-adaptive retaining component 9 is provided inside the connecting frame 8, an anti-drop component 7 is provided below the flip-adaptive retaining component 9, a mounting plate 6 is provided above the connecting frame 8, and the bottom end of the mounting plate 6 is fixedly connected to a positioner 14, the top of the mounting plate 6 is fixedly connected to symmetrical connecting rods 15, the bottom ends of the connecting rods 15 are fixedly connected to hydraulic rods 13, and the bottom ends of the hydraulic rods 13 are fixedly connected to the top of the connecting frame 8; The flip adaptive retaining assembly 9 includes a flip frame 901 , wherein two symmetrical adaptive retaining members 912 are provided inside the flip frame 901 , and a flexible arc plate 911 is provided between the symmetrical adaptive retaining members 912 ; The anti-drop component 7 includes an air head 706 , the bottom end of the air head 706 is fixedly connected to a connecting air pipe 707 , and the end of the connecting air pipe 707 away from the air head 706 is fixedly connected to an air pump 708 .

[0016] Reference Figure 2 、 Figure 3 、 Figure 5 and Figure 6 The flip adaptation retention component 9 also includes a servo motor 903. The power output shaft of the servo motor 903 is connected to the rotating rod 902 through a coupling. A circular hole is provided on the side of the connecting frame 8 close to the servo motor 903, and the inside of the circular hole is movably connected to the outside of the rotating rod 902. The front end of the rotating rod 902 is fixedly connected to one side of the flip frame 901. The flip frame 901 is provided with a hole on the side away from the rotating rod 902. The inside of the hole is movably connected to a retaining rod 904. One end of the retaining rod 904 is fixedly connected to one side of the connecting frame 8. Two symmetrical telescopic electric rods 905 are fixedly connected to both sides of the interior of the flip frame 901, and the front ends of the telescopic electric rods 905 are fixedly connected to connectors 906. The front end is fixedly connected to the outer side of the adaptive retaining member 912, and the adaptive retaining member 912 is provided with a through-hole, and the inside of the through-hole is movably connected to the round rod 907, and the two ends of the round rod 907 are fixedly connected to the inner side of the front end of the connecting member 906, and a telescopic rod 908 is provided between the symmetrical telescopic electric rods 905, and the bottom end of the telescopic rod 908 is fixedly connected to the inner sides of the flip frame 901, and the inner sides of the flip frame 901 are fixedly connected with compression springs 909, and the compression springs 909 are located on the outer side of the telescopic rod 908. The front ends of the telescopic rod 908 and the compression spring 909 are fixedly connected to the mounting member 910, and the front end of the mounting member 910 is fixedly connected to the opposite side of the symmetrical flexible arc plate 911.

[0017] Specifically, when the LED chip is flip-chip packaged, the flip frame 901 is in the initial position. When the LED chip is placed in the specified position, the telescopic electric rod 905 starts to extend, driving the front connecting piece 906 and the adaptive retaining piece 912 connected thereto to move toward the LED chip. As the telescopic electric rod 905 continues to extend, the two symmetrical adaptive retaining pieces 912 gradually approach the outside of the LED chip. If the LED chip is rectangular, the adaptive retaining pieces 912 tightly fit and clamp the outside of the LED chip. If the LED chip is circular, the flexible arc plate 911 can be fine-tuned according to the shape of the chip, and the adaptive retaining piece 912 rotates the angle to ensure that the clamping is firm and the chip is not damaged. , the servo motor 903 is started, driving the rotating rod 902 to rotate. Since the front end of the rotating rod 902 is fixedly connected to one side of the flip frame 901, the flip frame 901 begins to rotate around the axis of the rotating rod 902. The retaining rod 904 moves in the hole of the flip frame 901, playing the role of auxiliary support and stabilizing the flip trajectory, preventing the flip frame 901 from offsetting during rotation. As the flip frame 901 rotates, the clamped LED chip is flipped synchronously until it completes a 180° flip and achieves a flip-chip state, preparing for subsequent packaging processes. During the process, adaptive adjustments can be made according to LED chips of different sizes and shapes, without the need for frequent replacement of fixtures, thereby improving the versatility of the equipment for multiple chips and reducing production costs.

[0018] Reference Figure 1 、 Figure 2 、 Figure 3 and Figure 4 In a preferred embodiment, the front end of the packaging machine 1 is fixedly connected to an observation window 2, and the front end of the packaging machine 1 is fixedly connected to a cabinet door 3, and the cabinet door 3 is located below the observation window 2. The inner wall of the packaging machine 1 is fixedly connected to a slide member 4, and the inner sides of the slide member 4 are movably connected with a rotating threaded rod 19. The end of the rotating threaded rod 19 close to the servo motor 903 is connected to the drive motor 17 through a coupling, and the outer side of the drive motor 17 is fixedly connected to a motor frame 18, and one side of the motor frame 18 is fixedly connected to the inner wall of the packaging machine 1, and the outer side of the rotating threaded rod 19 is movably connected to a sliding seat 16, and the bottom end of the sliding seat 16 is movably connected to the front end of the slide member 4, and the front end of the sliding seat 16 is fixedly connected to a robotic arm 5, and the front end of the robotic arm 5 is fixedly connected to a connecting frame 12, and the bottom end of the connecting frame 12 is fixedly connected to the top of the mounting plate 6.

[0019] Reference Figure 2 、 Figure 3 、 Figure 7 and Figure 8, the anti-fall component 7 also includes a connecting plate 701, one end of the connecting plate 701 is fixedly connected to the inner side of the flip frame 901, the bottom end of the connecting plate 701 is fixedly connected to the rotating motor 702, and the power output shaft of the rotating motor 702 is connected to the rotating shaft 703 through a coupling, the inner side of the rotating shaft 703 is movably connected to a pulling rope 704, and the end of the pulling rope 704 away from the rotating shaft 703 is fixedly connected to a base 705, and the inner side of the base 705 is fixedly connected to the outer side of the connecting air pipe 707, and the bottom The top of the seat 705 is fixedly connected to the bottom of the air head 706, and a sliding plate 710 is fixedly connected to one side of the base 705. A sliding rod 711 is movably connected between the inner side of the end of the sliding plate 710 away from the base 705. Both ends of the sliding rod 711 are fixedly connected to a sliding frame 712, and the top of the sliding frame 712 is fixedly connected to the bottom of the flip frame 901. The outer side of the air pump 708 is fixedly connected to a retaining frame 709, and the top of the retaining frame 709 is fixedly connected to the bottom of the flip frame 901.

[0020] Specifically, before flipping the LED chip, after the flip adaptation retaining assembly 9 firmly clamps the LED chip, the rotating motor 702 is started to drive the rotating shaft 703 to rotate. When the rotating shaft 703 rotates, the pulling rope 704 wrapped around its inner side begins to retract and release, and the pulling rope 704 pulls the base 705, and the base 705 drives the air head 706 and the connecting air pipe 707 to move. The sliding plate 710 on one side of the base 705 slides on the sliding rod 711, and the sliding frame 712 is fixed to the bottom end of the flip frame 901 to play a guiding and stabilizing role, ensuring that the air head 706 can move smoothly and accurately to the bottom of the LED chip. After reaching the appropriate position directly below the LED chip, the air pump 708 is started. The air pump 708 delivers gas to the air head 706 through the connecting air pipe 707, so that the air head 706 generates suction. The air head 706 relies on the suction to tightly absorb the bottom of the LED chip, providing protection to prevent the chip from falling during the subsequent flipping process. Cooperating with the flip-adaptive retention component 9, the stability of the LED chip in the entire flip-chip packaging operation is ensured. During the process, the air head 706 can be accurately controlled to move to the appropriate position below the chip to ensure stable and reliable adsorption, ensure the accuracy of the entire flip-chip packaging process, greatly reduce the risk of the chip falling during flipping and other operations, and avoid chip damage and packaging failure.

[0021] A method for using a packaging structure for a flip-chip LED chip, using the packaging structure for a flip-chip LED chip as described above, comprises the following steps: Step 1: Place the LED chip with the front side facing up on top of the lifting seat 10. At this time, activate the hydraulic rod 13, which is symmetrically connected to the top of the mounting plate 6, pushing the mounting plate 6 down, thereby driving the connecting frame 8 connected to it to move down synchronously. The flip adaptive retaining assembly 9 inside the connecting frame 8 begins to operate. The two symmetrical adaptive retaining members 912 in the flip frame 901 gradually approach and accurately clamp the outer side of the LED chip, ensuring that the chip is firmly positioned during subsequent operations; Step 2: After the clamping is completed, the hydraulic rod 13 reverses and starts to rise. At the same time, the anti-drop component 7 located below the flip-adaptive retention component 9 comes into play. The air pump 708 delivers gas to the air head 706 through the connecting air pipe 707, so that the air head 706 generates suction, firmly sucking the bottom of the LED chip to prevent the chip from falling during the flipping process, providing reliable protection for the next flipping step; Step 3: After the air head 706 firmly adsorbs the bottom of the LED chip, the flip-adaptive retaining component 9 starts to perform the flipping action, driving the clamped LED chip to flip 180 degrees, turning the original front-facing LED chip to the back-facing side, preparing for the final packaging process.

[0022] The above description is only a preferred specific embodiment of the present invention, but the scope of protection of the present invention is not limited thereto. Any technician familiar with the technical field, within the technical scope disclosed by the present invention, who makes equivalent replacements or changes based on the technical solution and inventive concept of the present invention, should be covered by the scope of protection of the present invention.

Claims

1. A packaging structure for a flip-chip LED chip, comprising a packaging machine (1), characterized in that: The inner wall of the packaging machine (1) is fixedly connected to a base plate (11), the top of the base plate (11) is fixedly connected to a lifting seat (10), a connecting frame (8) is provided above the lifting seat (10), a flip-adaptive retaining assembly (9) is provided inside the connecting frame (8), an anti-drop assembly (7) is provided below the flip-adaptive retaining assembly (9), a mounting plate (6) is provided above the connecting frame (8), and the bottom end of the mounting plate (6) is fixedly connected to a positioner (14), the top end of the mounting plate (6) is fixedly connected to symmetrical connecting rods (15), the bottom ends of the connecting rods (15) are fixedly connected to hydraulic rods (13), and the bottom ends of the hydraulic rods (13) are fixedly connected to the top end of the connecting frame (8); The flip adaptive retaining assembly (9) comprises a flip frame (901), two symmetrical adaptive retaining members (912) are arranged inside the flip frame (901), and a flexible arc plate (911) is arranged between the symmetrical adaptive retaining members (912); The anti-drop assembly (7) comprises an air head (706), the bottom end of the air head (706) is fixedly connected to a connecting air pipe (707), and the end of the connecting air pipe (707) away from the air head (706) is fixedly connected to an air pump (708).

2. The packaging structure of a flip-chip LED chip according to claim 1, characterized in that: The flip-adaptive retaining assembly (9) further comprises a servo motor (903), a power output shaft of the servo motor (903) being connected to a rotating rod (902) via a coupling, a circular hole being provided on a side of the connecting frame (8) close to the servo motor (903), and a movably connected interior of the circular hole and an exterior of the rotating rod (902), and a fixed connection between a front end of the rotating rod (902) and a side of the flip frame (901).

3. The packaging structure of a flip-chip LED chip according to claim 2, characterized in that: The flip frame (901) is provided with a hole on a side away from the rotating rod (902), and a retaining rod (904) is movably connected inside the hole. One end of the retaining rod (904) is fixedly connected to one side of the connecting frame (8). Two symmetrical telescopic electric rods (905) are fixedly connected to both sides of the interior of the flip frame (901), and the front ends of the telescopic electric rods (905) are fixedly connected to connecting pieces (906). The front ends of the connecting pieces (906) are fixedly connected to the outer sides of the adaptive retaining pieces (912).

4. The packaging structure of a flip-chip LED chip according to claim 3, characterized in that: The adaptive retaining member (912) is provided with a perforation, and a round rod (907) is movably connected inside the perforation. The two ends of the round rod (907) are fixedly connected to the inner side of the front end of the connecting member (906). A telescopic rod (908) is provided between the symmetrical telescopic electric rods (905). The bottom end of the telescopic rod (908) is fixedly connected to the inner sides of the flip frame (901), and the inner sides of the flip frame (901) are fixedly connected to compression springs (909). The compression springs (909) are located on the outside of the telescopic rod (908). The front ends of the telescopic rod (908) and the compression spring (909) are fixedly connected to the mounting member (910). The front end of the mounting member (910) is fixedly connected to the opposite side of the symmetrical flexible arc plate (911).

5. The packaging structure of a flip-chip LED chip according to claim 4, characterized in that: The front end of the packaging machine (1) is fixedly connected to an observation window (2), the front end of the packaging machine (1) is fixedly connected to a cabinet door (3), and the cabinet door (3) is located below the observation window (2), the inner wall of the packaging machine (1) is fixedly connected to a slide member (4), the inner sides of the slide member (4) are movably connected to a rotating threaded rod (19), and the end of the rotating threaded rod (19) close to the servo motor (903) is connected to the drive motor (17) through a coupling.

6. The packaging structure of a flip-chip LED chip according to claim 5, characterized in that: The outer side of the driving motor (17) is fixedly connected to a motor frame (18), one side of the motor frame (18) is fixedly connected to the inner wall of the packaging machine (1), the outer side of the rotating threaded rod (19) is movably connected to a sliding seat (16), and the bottom end of the sliding seat (16) is movably connected to the front end of the slide member (4), the front end of the sliding seat (16) is fixedly connected to a mechanical arm (5), the front end of the mechanical arm (5) is fixedly connected to a connecting frame (12), and the bottom end of the connecting frame (12) is fixedly connected to the top end of the mounting plate (6).

7. The packaging structure of a flip-chip LED chip according to claim 6, characterized in that: The anti-drop assembly (7) further comprises a connecting plate (701), one end of the connecting plate (701) being fixedly connected to the inner side of the flip frame (901), a rotating motor (702) being fixedly connected to the bottom end of the connecting plate (701), and a power output shaft of the rotating motor (702) being connected to a rotating shaft (703) via a coupling.

8. The packaging structure of a flip-chip LED chip according to claim 7, characterized in that: The inner side of the rotating shaft (703) is movably connected to a pulling rope (704), and one end of the pulling rope (704) away from the rotating shaft (703) is fixedly connected to a base (705), and the inner side of the base (705) is fixedly connected to the outer side of the connecting air pipe (707), and the top end of the base (705) is fixedly connected to the bottom end of the air head (706), and one side of the base (705) is fixedly connected to a sliding plate (710).

9. The packaging structure of a flip-chip LED chip according to claim 8, characterized in that: A sliding rod (711) is movably connected to the inner side of one end of the sliding plate (710) away from the base (705), and both ends of the sliding rod (711) are fixedly connected to the sliding frame (712), and the top end of the sliding frame (712) is fixedly connected to the bottom end of the flip frame (901), and the outer side of the air pump (708) is fixedly connected to the retaining frame (709), and the top end of the retaining frame (709) is fixedly connected to the bottom end of the flip frame (901).

10. A method for using a flip-chip LED chip packaging structure, using the flip-chip LED chip packaging structure according to claim 9, characterized in that: The steps include: Step 1: Place the LED chip with the front side facing upward on the top of the lifting seat (10). At this time, start the hydraulic rod (13). The hydraulic rod (13) is symmetrically connected to the top of the mounting plate (6), pushing the mounting plate (6) down, thereby driving the connecting frame (8) connected thereto to move down synchronously. The flip-adaptive retaining assembly (9) inside the connecting frame (8) starts to operate, and the two symmetrical adaptive retaining members (912) in the flip frame (901) gradually approach and accurately clamp the outer side of the LED chip to ensure that the chip is firmly positioned during subsequent operations. Step 2: After the clamping is completed, the hydraulic rod (13) reverses and starts to rise. At the same time, the anti-drop component (7) located below the flip-adaptive retention component (9) comes into play, and the air pump (708) delivers gas to the air head (706) through the connecting air pipe (707), so that the air head (706) generates suction, firmly sucking the bottom of the LED chip to prevent the chip from falling during the flipping process, providing reliable protection for the next flipping step; Step 3: After the air head (706) firmly adsorbs the bottom of the LED chip, the flip-adaptive retaining component (9) starts to perform the flipping action, driving the clamped LED chip to flip 180 degrees, turning the LED chip that was originally facing up to face up, and preparing for the final packaging process.

Images