Photovoltaic cell module, manufacturing method of photovoltaic cell module and preparation device of photovoltaic cell module

Abstract

The invention belongs to the technical field of cells, and provides a photovoltaic cell assembly and a manufacturing method and preparation device thereof, and the photovoltaic cell assembly comprises the following functional layers which are sequentially stacked: an FTO conductive glass substrate, an N iOx hole transport layer, an organic hole transport layer, a perovskite light absorption layer, a surface passivation layer, an electron transport layer, a hole barrier layer and a metal electrode layer. According to the invention, the functional layers are tightly laminated and matched with each other to jointly form a complete photovoltaic cell module. All links including light absorption, carrier generation and separation, carrier transmission and collection, suppression of carrier recombination by surface passivation and management of light by an anti-reflection layer are tightly connected and are indispensable. Through respective unique material characteristics and functions, the solar energy and the electric energy can be efficiently converted into the electric energy through cooperative work.

Description

Technical Field

[0001] The present invention belongs to the technical field of batteries, and in particular relates to a photovoltaic battery assembly, a manufacturing method for the photovoltaic battery assembly, and a manufacturing device. Background Art

[0002] With the continuous growth of global energy demand and the increasing emphasis on environmental protection, the development of clean and sustainable energy has become a top priority. Among the many renewable energy sources, solar energy, with its inexhaustible and widespread distribution, has become one of the energy sources with the greatest development potential. Photovoltaic technology, as a key technology for directly converting sunlight energy into electrical energy, has developed rapidly in recent years. Currently, silicon-based photovoltaic cells represented by monocrystalline silicon and polycrystalline silicon occupy a mainstream position in the market. However, these traditional photovoltaic cells have some limitations, such as complex manufacturing processes, high energy consumption, high costs, and heavy batteries that are difficult to use flexibly. This has, to a certain extent, restricted their large-scale application and promotion in some special scenarios.

[0003] Photovoltaic technology, a key technology for converting sunlight directly into electricity, has achieved remarkable and rapid development in recent years. Researchers have continuously invested significant energy in research and innovation, significantly improving the efficiency and stability of photovoltaic technology.

[0004] Currently, silicon-based photovoltaic cells, represented by monocrystalline and polycrystalline silicon, dominate the market. With their relatively mature technology and high photoelectric conversion efficiency, they provide clean electricity to numerous regions around the world and play a significant role in driving energy transition.

[0005] However, these traditional photovoltaic cells are not perfect and have several limitations that should not be overlooked. The production process for silicon-based photovoltaic cells is extremely complex, requiring multiple precision steps, from silicon material purification, crystal pulling, and slicing to cell preparation and packaging. Each step requires extremely high technical and equipment requirements. This not only increases production difficulty and cost, but can also lead to quality issues during the production process. The manufacturing process is energy-intensive, and the production of monocrystalline and polycrystalline silicon requires a significant amount of electricity, which to some extent offsets the environmental benefits of solar power generation. Furthermore,

[0006] To this end, those skilled in the art have proposed a photovoltaic cell assembly, a method for manufacturing a photovoltaic cell assembly, and a manufacturing device to solve the problems raised in the background art. Summary of the Invention

[0007] In order to solve the above technical problems, the present invention provides a photovoltaic cell assembly, a method for manufacturing a photovoltaic cell assembly, and a manufacturing device to solve the problems in the background technology.

[0008] A photovoltaic cell assembly comprises the following functional layers stacked in sequence: an FTO conductive glass substrate, a NiOx hole transport layer, an organic hole transport layer, a perovskite light absorption layer, a surface passivation layer, an electron transport layer, a hole blocking layer and a metal electrode layer, wherein the NiOx hole transport layer, the organic hole transport layer, the perovskite light absorption layer, the surface passivation layer, the electron transport layer, the hole blocking layer and the metal electrode layer are stacked on the front side of the FTO conductive glass substrate.

[0009] Preferably, a MgF anti-reflection layer is provided on the back side of the FTO conductive glass substrate.

[0010] A method for manufacturing a photovoltaic cell assembly further comprising the following steps:

[0011] S1. Scribing of FTO conductive glass substrate: First, laser scribing P1 line of FTO conductive glass substrate was performed with the following scribing parameters: scribing power 12W, pulse width 100ns, repetition frequency 100kHz, forming a scribe width of 30μm.

[0012] S2. Cleaning of the FTO conductive glass substrate: The laser-scribed FTO conductive glass substrate (1) was then ultrasonically treated with tetramethylammonium hydroxide solution, isopropyl alcohol, ethanol, and pure water at 50° C. for 20 min each, and then dried with hot air;

[0013] S3, Preparation of NiOx hole transport layer: The cleaned FTO conductive glass substrate was then treated with Ar plasma for 1 min, followed by sputtering and depositing 20 nm NiO x layer, wherein the sputtering parameters include: RF power 1000W, working pressure 0.3Pa, oxygen doping concentration 1%, and storage in a nitrogen environment after completion;

[0014] S4. Preparation of an organic hole transport layer: First, a methanol solution containing 0.3 mmol·L-1 Me-4PACz was prepared. Then, an FTO conductive glass substrate with a NiOx hole transport layer stored in a nitrogen environment was taken out and immersed in the prepared methanol solution for 10 minutes. After the immersion, the substrate was taken out and annealed in a 100°C environment for 5 minutes. Then, the FTO conductive glass substrate with the NiOx hole transport layer was rinsed with methanol and dried with N2, and an organic hole transport layer was laminated on the NiOx hole transport layer.

[0015] S5. Preparation of perovskite light-absorbing layer: First, prepare a perovskite solution with a concentration of 1.3M, then connect the prepared perovskite solution to a slit coater, and then use the slit coater to coat the perovskite solution on the organic hole transport layer to form a completed liquid film, then move it to a vacuum flash evaporator, and then evacuate the vacuum flash evaporator to below 10Pa. After the flash evaporation, the perovskite thin liquid film changes from light color to brown, and then it is taken out and placed on a hot stage for annealing at 150°C for 15 minutes. After annealing, it is placed in a nitrogen cabinet for use;

[0016] S6. Preparation of surface passivation layer: First, prepare a PEAI (0.5 mg / ml) solution, then connect the PEAI solution to a slit coater, then take out the FTO conductive glass substrate prepared with a NiOx hole transport layer, an organic hole transport layer, and a perovskite light absorbing layer, and use the slit coater to coat the PEAI solution on the perovskite light absorbing layer to form a complete liquid film. After coating, anneal the surface passivation layer in an environment at 120°C for 10 minutes;

[0017] S7. Preparation of electron transport layer: First, place the FTO conductive glass substrate with NiOx hole transport layer, organic hole transport layer, perovskite light absorption layer and surface passivation layer into a vacuum evaporation device, and then evaporate C60 with a thickness of 30nm using the vacuum evaporation device, wherein the vacuum degree of the vacuum evaporation device is less than -4 * 10 5 Pa, then heat the organic source to 360 ° C, and then C60 will be evaporated. After the evaporation rate stabilizes at 0.2-0.3A / s, the baffle of the vacuum evaporation equipment is opened to start depositing C60 on the FTO conductive glass substrate to form an electron transport layer;

[0018] S8. Preparation of hole blocking layer: First, place the FTO conductive glass substrate having the NiOx hole transport layer, the organic hole transport layer, the perovskite light absorption layer, the surface passivation layer, and the electron transport layer in an atomic force deposition apparatus. Then, prepare a Sn aqueous solution and use the atomic force deposition apparatus to deposit a 25 nm thick SnO2 layer to form a hole blocking layer;

[0019] S9, scribing P2 line: forming a perovskite module component with an FTO conductive glass substrate having a NiOx hole transport layer, an organic hole transport layer, a perovskite light absorbing layer, a surface passivation layer, an electron transport layer, and a hole blocking layer. The entire perovskite module component is then divided into several sub-cells and connected in series. The P2 line is then scribed with a laser, wherein the scribing parameters are: power 6W, pulse width 100ns, repetition frequency 70kHz, and scribing width 100μm;

[0020] S10, metal electrode layer: then placing the plurality of sub-cells connected in series into a vacuum evaporation device, and then evaporating Ag to a thickness of 100 nm using the vacuum evaporation device, wherein the vacuum evaporation device has a vacuum degree of less than -5*105 Pa and an evaporation rate of 0.5 A / s, to form a metal electrode layer on the plurality of sub-cells connected in series;

[0021] S11, scribing P3 line: using a laser to scribe P2 line of several sub-cells with metal electrode layers, wherein the scribing parameters are: power 6W, pulse width 100ns, repetition frequency 70kHz and scribing width 100μm;

[0022] S12, Preparation of MgF2 anti-reflection layer: After that, several sub-cells after being scribed are placed in a vacuum evaporation device, and then a 100nm thick MgF2 is evaporated on the back of the FTO conductive glass substrate using the vacuum evaporation device, wherein the vacuum degree of the vacuum evaporation device is less than -5 * 10 5 Pa, the evaporation rate is 1A / s.

[0023] Preferably, the composition of the perovskite solution in S5 is FA 0.85 Cs 0.15 For 1 ml of perovskite solution, 190.025 mg of FAI, 50.663 mg of CsI, and 629.28 mg of PbI2 need to be weighed respectively, and 13.504 mg of MACl is additionally added as an additive to assist perovskite crystallization, dissolved in DMF:DMSO = 9:1 (v / v), and placed in a magnetic stirrer at 30 ° C for 3-5 hours. After complete dissolution, the perovskite solution is filtered using a 0.22 μm organic filter head to obtain a perovskite solution. The parameters of the slit coater coating in the S5 are: a speed of 20 mm / s, and a distance between the upper layer of the FTO conductive glass substrate and the blade head of 0.1 mm.

[0024] Preferably, the operating parameters of the atomic force deposition equipment in S8 are: vacuum degree less than -4 * 10 5 Pa, a total of 200 cycles.

[0025] A device for preparing photovoltaic cell components

[0026] A support plate, wherein a placement plate is provided on the upper end of the support plate, sliding grooves are provided on both sides of the placement plate, and a movable frame is slidably installed inside the two sliding grooves;

[0027] A chute is installed between the two sliding grooves, a hanger is slidably installed inside the chute, a coating module is slidably installed inside the hanger, the coating module is connected to a conduit, and the conduit passes through the hanger;

[0028] A driving assembly is provided between the two movable frames and is used to lift and lower the coating module and to shield the liquid outlet of the coating module;

[0029] Preferably, the driving assembly includes two driving disks, which are rotatably connected to the two movable frames respectively, and the two driving disks are connected through driving members. The front ends of the two driving disks are each equipped with an eccentric wheel, and the two eccentric wheels are connected by a connecting rod. The front ends of the two eccentric wheels are each equipped with a linkage rod, and the front ends of the linkage rods are equipped with a rotating rod. The outer surface of the rotating rod is provided with a lifting groove, and a retaining groove is slidably installed inside the lifting groove.

[0030] Preferably, the rotating rod passes through the lifting slot, and a bevel gear 1 is provided on the outer surface of the rotating rod. A bevel gear 2 is rotatably connected inside the lifting slot, and the bevel gear 1 is meshed with the bevel gear 2. One end of the bevel gear 2 is connected to a rotating shaft, and the rotating shaft is rotatably connected to the lifting slot. A gear 1 is provided at one end of the rotating shaft, and a tooth plate 1 is slidably installed inside the lifting slot, and the gear 1 is meshed with the tooth plate 1. One side of the tooth plate is connected to the retaining slot.

[0031] Preferably, a connecting groove is slidably installed inside the movable frame, a driving tooth plate is slidably installed inside the connecting groove, the driving tooth plate is connected to the lifting groove, gear two is rotatably installed on one side of the connecting groove, the gear two is engaged with the driving tooth plate, tooth plate three is slidably installed inside the connecting groove, the gear two is engaged with tooth plate three, a connecting plate is provided on one side of the tooth plate three, and the connecting plate is connected to the coating module.

[0032] Preferably, a threaded rod is rotatably installed inside the sliding groove, a threaded ring is provided inside the movable frame, the threaded ring is threadedly connected to the threaded rod, a rotating member is provided inside the sliding groove, and an output end of the rotating member is connected to the threaded rod.

[0033] Compared with the prior art, the present invention has the following beneficial effects:

[0034] 1. The present invention forms a complete photovoltaic cell module through the close stacking and mutual cooperation of various functional layers. From light absorption, carrier generation and separation, to carrier transmission and collection, to surface passivation to suppress carrier recombination and anti-reflection layer to manage light, each link is closely connected and indispensable. Through their unique material properties and functions, they work together to achieve the goal of efficiently converting solar energy into electrical energy, providing guarantees for the normal operation and high-efficiency performance of photovoltaic cell modules. Compared with traditional monocrystalline silicon photovoltaic panels, new perovskite photovoltaic panels have lower costs, lower losses, and higher light conversion efficiency. At the same time, their lightweight body also makes their application scenarios more flexible.

[0035] 2. In the present invention, after the coating module completes the coating operation, the motor in the drive part is started, and the drive disc and the eccentric wheel are driven to rotate through the belt transmission. This series of actions eventually causes the retaining groove to extend to the bottom of the coating module. This design can effectively prevent the residual liquid in the coating module from dripping onto the coated substrate, causing the quality of the substrate coating liquid film to decline, and at the same time prevent the liquid from dripping onto other equipment components. In the preparation process of photovoltaic cell modules, the coating liquid usually has a certain degree of corrosiveness or viscosity. If it drips onto the equipment, it may cause damage or pollution to the equipment, affecting the subsequent production process. This device reduces the steps of manual intervention through an automated linkage mechanism. After the coating is completed, the equipment can automatically complete the actions of raising the coating module, lowering the lifting groove, and extending the retaining groove, without the need for additional operators to perform manual adjustments. This not only improves production efficiency, but also reduces the labor intensity and operating difficulty of the operator, making the equipment easier to use and manage. BRIEF DESCRIPTION OF THE DRAWINGS

[0036] Figure 1 This is a schematic structural diagram of a photovoltaic cell assembly according to the present invention;

[0037] Figure 2 A flow chart of a method for manufacturing a photovoltaic cell assembly of the present invention;

[0038] Figure 3 This is a schematic structural diagram of a photovoltaic cell assembly manufacturing apparatus according to the present invention from a first perspective;

[0039] Figure 4 This is a schematic structural diagram of a second viewing angle of a device for preparing a photovoltaic cell assembly of the present invention;

[0040] Figure 5 This is a schematic structural diagram of a photovoltaic cell assembly manufacturing apparatus according to the present invention from a third perspective;

[0041] Figure 6 This is a schematic structural diagram of a photovoltaic cell assembly manufacturing apparatus according to the present invention from a fourth viewing angle;

[0042] Figure 7 It is a partial structural diagram of the present invention.

[0043] In the picture:

[0044] 1. FTO conductive glass substrate; 2. NiOx hole transport layer; 3. Organic hole transport layer; 4. Perovskite light absorption layer; 5. Surface passivation layer; 6. Electron transport layer; 7. Hole blocking layer; 8. Metal electrode layer; 9. MgF2 antireflection layer; 10. Support plate; 11. Placement plate; 12. Slide groove; 13. Threaded rod; 14. Rotating part; 15. Moving frame; 16. Slide groove; 17. Hanger; 1 8. Coating module; 19. Conduit; 20. Driving part; 21. Driving disk; 22. Eccentric wheel; 23. Connecting rod; 24. Linking rod; 25. Rotating rod; 26. Lifting slot; 27. Stop slot; 28. Bevel gear 1; 29. ​​Bevel gear 2; 30. Rotating shaft; 31. Gear 1; 32. Tooth plate 1; 33. Connecting slot; 34. Driving tooth plate; 35. Gear 2; 36. Tooth plate 3; 37. Connecting plate. DETAILED DESCRIPTION

[0045] The following embodiments of the present invention are described in further detail with reference to the accompanying drawings and examples. The following examples are used to illustrate the present invention but are not intended to limit the scope of the present invention.

[0046] Example 1

[0047] refer to Figure 1 The present invention provides a photovoltaic cell assembly, comprising the following functional layers stacked in sequence: an FTO conductive glass substrate 1, a NiOx hole transport layer 2, an organic hole transport layer 3, a perovskite light absorption layer 4, a surface passivation layer 5, an electron transport layer 6, a hole blocking layer 7, and a metal electrode layer 8. The NiOx hole transport layer 2, the organic hole transport layer 3, the perovskite light absorption layer 4, the surface passivation layer 5, the electron transport layer 6, the hole blocking layer 7, and the metal electrode layer 8 are stacked on the front side of the FTO conductive glass substrate 1.

[0048] A MgF2 antireflection layer 9 is provided on the back side of the FTO conductive glass substrate 1 .

[0049] As can be seen from the above, sunlight is incident from the front of the FTO conductive glass substrate, passes through the FTO conductive glass substrate 1, and enters the perovskite light-absorbing layer 4. Perovskite materials have excellent light absorption characteristics. In their band structure, when the photon energy is greater than the band gap of the perovskite material, the photon is absorbed and generates electron-hole pairs, i.e., excitons. Due to their own structure and energy level characteristics, these excitons will separate under a certain driving force inside the perovskite light-absorbing layer 4, forming free electrons and holes. This is the key starting step for converting light energy into electrical energy. The separated holes will move toward the NiOx hole transport layer 2 and the organic hole transport layer 3. As a common hole transport material, the NiOx hole transport layer 2 can effectively transport holes and has a good energy level match with the perovskite light-absorbing layer 4, which is conducive to the injection and transport of holes. The organic hole transport layer 3 further assists the transport of holes, reduces the loss and recombination during the transport process, and enables the holes to be efficiently collected on the side of the FTO conductive glass substrate 1, and finally transported to the external circuit through the FTO conductive glass substrate 1. The separated electrons will migrate to the electron transport layer 6. The electron transport layer is usually composed of a material with high electron affinity and good electron transport performance. It provides a channel for rapid transmission of electrons, so that electrons can be effectively collected on the side of the electron transport layer 6. Subsequently, the electrons will pass through the subsequent hole blocking layer 7 and the metal electrode layer 8, flow to the external circuit, and merge with the holes in the external circuit to form a current, thereby realizing the output of electrical energy.

[0050] The surface passivation layer 5 interacts with the defect sites on the perovskite surface through chemical bonding or physical adsorption, filling or passivating these defect states, reducing the non-radiative recombination of carriers, thereby increasing the concentration and mobility of carriers, and enhancing the photocurrent and photoelectric conversion efficiency.

[0051] The MgF2 anti-reflection layer 9, applied to the back of the FTO conductive glass substrate 1, effectively increases light transmittance on the back of the substrate. Through its unique optical properties, the MgF2 anti-reflection layer 9 reduces light reflection from the surface of the FTO conductive glass substrate 1, allowing more incident light to enter the perovskite light-absorbing layer 4. This improves the overall solar light utilization efficiency of the photovoltaic cell assembly, increases the number of photogenerated carriers, and ultimately enhances the photovoltaic cell assembly's photoelectric conversion efficiency.

[0052] Through the tight stacking and interplay of various functional layers, a complete photovoltaic cell module is formed. From light absorption and carrier generation and separation to carrier transport and collection, surface passivation to suppress carrier recombination, and the anti-reflection layer to manage light, each link is closely linked and indispensable. Through their unique material properties and functions, they work together to achieve the goal of efficiently converting solar energy into electrical energy, ensuring the normal operation and high-performance of photovoltaic cell modules. Compared with traditional monocrystalline silicon photovoltaic panels, new perovskite photovoltaic panels have lower costs, lower losses, and higher light conversion efficiency. Their slim design also makes them more flexible in application scenarios.

[0053] Example 2

[0054] refer to Figure 2 The present invention provides a method for manufacturing a photovoltaic cell assembly, comprising the following steps:

[0055] S1. Scribing the FTO conductive glass substrate 1: First, laser scribing the P1 line of the FTO conductive glass substrate 1, with the scribing parameters being: scribing power 12 W, pulse width 100 ns, repetition frequency 100 kHz, to form a scribe width of 30 μm;

[0056] S2. Cleaning the FTO conductive glass substrate 1: The laser-scribed FTO conductive glass substrate 1 is then ultrasonically treated with tetramethylammonium hydroxide solution, isopropyl alcohol, ethanol, and pure water at 50° C. for 20 minutes each, and then dried with hot air.

[0057] S3, Preparation of NiOx hole transport layer 2: The cleaned FTO conductive glass substrate 1 was then treated with Ar plasma for 1 min, and then 20 nm NiO was sputtered and deposited. x The sputtering parameters include: RF power 1000W, working pressure 0.3Pa, oxygen doping concentration 1%, and storage in a nitrogen environment after completion;

[0058] S4. Preparation of the organic hole transport layer 3: First, a methanol solution containing 0.3 mmol·L-1 Me-4PACz was prepared. Then, the FTO conductive glass substrate 1 with the NiOx hole transport layer 2, which had been stored in a nitrogen environment, was taken out and immersed in the prepared methanol solution for 10 minutes. After the immersion, the substrate was taken out and annealed in a 100°C environment for 5 minutes. Then, the FTO conductive glass substrate 1 with the NiOx hole transport layer 2 was rinsed with methanol and dried with N2, and the organic hole transport layer 3 was laminated on the NiOx hole transport layer 2.

[0059] S5. Preparation of the perovskite light-absorbing layer 4: First, a perovskite solution with a concentration of 1.3M is prepared, and then the prepared perovskite solution is connected to a slit coater. The perovskite solution is then coated on the organic hole transport layer 3 using the slit coater to form a completed liquid film, which is then moved to a vacuum flash evaporator. The vacuum flash evaporator is then evacuated to below 10 Pa. After the flash evaporation, the perovskite thin liquid film changes from light color to brown. The film is then taken out and placed on a hot stage for annealing at 150°C for 15 minutes. After annealing, it is placed in a nitrogen cabinet for standby use.

[0060] S6. Preparation of surface passivation layer 5: First, prepare a PEAI 0.5 mg / ml solution, then connect the PEAI solution to a slit coater, then take out the FTO conductive glass substrate 1 prepared with the NiOx hole transport layer 2, the organic hole transport layer 3 and the perovskite light absorption layer 4, and use the slit coater to coat the PEAI solution on the perovskite light absorption layer 4 to form a complete liquid film. After coating, anneal the surface passivation layer 5 in an environment of 120°C for 10 minutes;

[0061] S7, preparation of electron transport layer 6: first, the FTO conductive glass substrate 1 with NiOx hole transport layer 2, organic hole transport layer 3, perovskite light absorption layer 4 and surface passivation layer 5 is placed in a vacuum evaporation device, and then C60 with a thickness of 30nm is evaporated by the vacuum evaporation device, wherein the vacuum degree of the vacuum evaporation device is less than -4 * 10 5 Pa, then heat the organic source to 360°C, and then C60 will be evaporated. After the evaporation rate stabilizes at 0.2-0.3A / s, the baffle of the vacuum evaporation equipment is opened to start depositing C60 on the FTO conductive glass substrate 1 to form the electron transport layer 6;

[0062] S8. Preparation of hole blocking layer 7: First, the FTO conductive glass substrate 1 having the NiOx hole transport layer 2, the organic hole transport layer 3, the perovskite light absorption layer 4, the surface passivation layer 5, and the electron transport layer 6 is placed in an atomic force deposition device. Then, a Sn aqueous solution is prepared and a SnO2 layer with a thickness of 25 nm is deposited using the atomic force deposition device to form the hole blocking layer 7;

[0063] S9, scribing P2 line: forming a perovskite module component with an FTO conductive glass substrate 1 having a NiOx hole transport layer 2, an organic hole transport layer 3, a perovskite light absorbing layer 4, a surface passivation layer 5, an electron transport layer 6, and a hole blocking layer 7, and then using the entire perovskite module component to divide into several sub-cells, which are connected in series, and then using a laser to scribe the P2 line, wherein the scribing parameters are: power 6W, pulse width 100ns, repetition frequency 70kHz, and scribing width 100μm;

[0064] S10, metal electrode layer 8: The plurality of sub-cells connected in series are then placed in a vacuum evaporation device, and a 100 nm thick layer of Ag is evaporated by the vacuum evaporation device. The vacuum evaporation device has a vacuum degree of less than -5*105 Pa and an evaporation rate of 0.5 A / s, thereby forming a metal electrode layer 8 on the plurality of sub-cells connected in series;

[0065] S11, scribing P3 line: using a laser to scribe P2 line of several sub-cells with metal electrode layer 8, wherein the scribing parameters are: power 6W, pulse width 100ns, repetition frequency 70kHz and scribing width 100μm;

[0066] S12, preparation of MgF2 anti-reflection layer 9: Afterwards, several sub-cells after being scribed are placed in a vacuum evaporation device, and then a 100nm thick MgF2 is evaporated on the back of the FTO conductive glass substrate 1 using the vacuum evaporation device, wherein the vacuum degree of the vacuum evaporation device is less than -5 * 10 5 Pa, the evaporation rate is 1A / s.

[0067] The composition of the perovskite solution in S5 is FA 0.85 Cs 0.15 For 1 ml of perovskite solution, 190.025 mg of FAI, 50.663 mg of CsI, and 629.28 mg of PbI2 need to be weighed respectively, and 13.504 mg of MACl is additionally added as an additive to assist perovskite crystallization, dissolved in DMF:DMSO = 9:1 (v / v), and placed in a magnetic stirrer at 30 ° C for 3-5 hours. After complete dissolution, the perovskite solution is filtered using a 0.22 μm organic filter head to obtain a perovskite solution. The parameters of the slit coater coating in S5 are: the speed is 20 mm / s, and the distance between the upper layer of the FTO conductive glass substrate 1 and the blade is 0.1 mm.

[0068] The operating parameters of the atomic force deposition equipment in S8 are: vacuum degree less than -4 * 10 5 Pa, a total of 200 cycles.

[0069] From the above, it can be seen that the photovoltaic cell module manufacturing method precisely controls the process parameters of each step, deposits different functional layers in sequence, and uses laser scribing to achieve the division and series connection of the cell modules, and finally prepares a photovoltaic cell module with high-efficiency photoelectric conversion performance.

[0070] Example 3:

[0071] refer to Figures 3 to 7 The present invention provides a device for preparing a photovoltaic cell assembly, comprising:

[0072] A support plate 10 is provided with a placement plate 11 on the upper end of the support plate 10. Sliding grooves 12 are provided on both sides of the placement plate 11. Moving frames 15 are slidably installed inside the two sliding grooves 12.

[0073] A chute 16 is installed between the two sliding grooves 12. A hanger 17 is slidably installed inside the chute 16. A coating module 18 is slidably installed inside the hanger 17. The coating module 18 is connected to a conduit 19, which passes through the hanger 17.

[0074] A driving assembly is provided between the two movable frames 15 and is used to lift and lower the coating module 18 and to shield the liquid outlet of the coating module 18;

[0075] The driving assembly includes two driving disks 21, which are respectively rotatably connected to the two movable frames 15. The two driving disks 21 are connected through a driving member 20. The front ends of the two driving disks 21 are each installed with an eccentric wheel 22. The two eccentric wheels 22 are connected by a connecting rod 23. The front ends of the two eccentric wheels 22 are each installed with a linkage rod 24. The front ends of the linkage rod 24 are installed with a rotating rod 25. The outer surface of the rotating rod 25 is provided with a lifting groove 26, and a retaining groove 27 is slidably installed inside the lifting groove 26.

[0076] The rotating rod 25 passes through the lifting groove 26. The outer surface of the rotating rod 25 is provided with a bevel gear 1 29. The lifting groove 26 is internally connected to the bevel gear 2 29 for rotation. The bevel gear 1 29 is engaged with the bevel gear 2 29. One end of the bevel gear 2 29 is connected to a rotating shaft 30. The rotating shaft 30 is rotatably connected to the lifting groove 26. A gear 1 31 is provided at one end of the rotating shaft 30. A tooth plate 1 32 is slidably installed inside the lifting groove 26. The gear 1 31 is engaged with the tooth plate 1 32. One side of the tooth plate 1 32 is connected to the side of the retaining groove 27.

[0077] A connecting groove 33 is slidably installed inside the movable frame 15, and a driving gear plate 34 is slidably installed inside the connecting groove 33. The driving gear plate 34 is connected to the lifting groove 26. A gear 2 35 is rotatably installed on one side of the connecting groove 33. The gear 2 35 is engaged with the driving gear plate 34. A gear plate 36 is slidably installed inside the connecting groove 33. The gear 2 35 is engaged with the gear plate 36. A connecting plate 37 is provided on one side of the gear plate 36. The connecting plate 37 is connected to the coating module 18.

[0078] A threaded rod 13 is rotatably installed inside the sliding groove 12 , a threaded ring is provided inside the movable frame 15 , the threaded ring is threadedly connected to the threaded rod 13 , a rotating member 14 is provided inside the sliding groove 12 , and an output end of the driving member 14 is connected to the threaded rod 13 .

[0079] As can be seen from the above, a slit coater is currently used in the preparation of photovoltaic cell modules. A liquid film is coated on a substrate through the slit coater. However, after the coating is completed, liquid that has not yet dripped will remain at the liquid outlet of the slit coater. In the process of restoring the slit coater to its original position, the residual liquid shakes under gravity or in the process of returning to its original position, causing the liquid to drip and drip onto the already coated substrate, causing the quality of the substrate to deteriorate or drip onto the slit coater equipment, causing the equipment to be corroded.

[0080] When coating a substrate, conduit 19 is connected to the solution to be coated, and coating module 18 draws the solution, which is then discharged from its lower end. Rotating member 14 is then activated, and its output drives threaded rod 13 to rotate. As threaded rod 13 rotates, the threaded ring inside movable frame 15 is threadedly connected to threaded rod 13, causing movable frame 15 to move axially within sliding groove 12. The movement of movable frame 15 drives hanger 17 to slide within sliding groove 16, thereby moving coating module 18 above the substrate, completing the coating operation.

[0081] When the coating module 18 completes the coating operation, the motor in the driving member 20 is started and driven by a belt drive to drive the two driving discs 21 to rotate synchronously. Since an eccentric wheel 22 is installed at the front end of the driving disc 21 and the two eccentric wheels 22 are connected by a connecting rod 23, the eccentric wheel 22 will produce eccentric motion as the driving disc 21 rotates, and the linkage rod 24 at the front end of the eccentric wheel 22 will swing with the eccentric motion of the eccentric wheel 22, thereby driving the lifting groove 26 to move downward. When the lifting groove 26 moves downward, it drives the driving gear plate 34 to move downward inside the connecting groove 33, so that the driving gear plate 34 drives the gear 2 35 to rotate. The rotation of the gear 2 35 can drive the gear plate 3 36 to move upward inside the connecting groove 26, thereby driving the coating module 18 to move upward inside the hanger 17 through the connecting plate 37.

[0082] At the same time, the rotation of the eccentric wheel 22 drives the rotating rod 25 to rotate about its axis. The bevel gear 1 29 on the outer surface of the rotating rod 25 meshes with the bevel gear 2 29 in the lifting groove 26. When the rotating rod 25 rotates, the bevel gear 1 29 drives the bevel gear 2 29 to rotate, thereby enabling the bevel gear 2 29 to drive the rotating shaft 30 to rotate, further driving the gear 1 31 to rotate. The gear 1 31 meshes with the tooth plate 1 31, so that the tooth plate 1 31 slides inside the lifting groove 26, driving the retaining groove 27 to slide outward inside the lifting groove 26. This allows the smearing module 18 to rise while the lifting groove 26 is lowered, and the retaining plate 27 extends below the smearing module 18, effectively preventing residual liquid from dripping.

[0083] When the coating module 18 completes the coating operation, the motor in the drive member 20 starts, and the drive disc 21 and the eccentric wheel 22 are driven to rotate through the belt drive. This series of actions eventually causes the retaining groove 27 to extend to the bottom of the coating module 18. This design can effectively prevent the residual liquid in the coating module 18 from dripping onto the coated substrate, causing the quality of the substrate coating liquid film to deteriorate, and at the same time prevent the liquid from dripping onto other equipment components. In the preparation process of photovoltaic cell modules, the coating liquid is usually corrosive or viscous. If it drips onto the equipment, it may cause damage or contamination to the equipment, affecting the subsequent production process. This device reduces the steps of manual intervention through an automated linkage mechanism. After the coating is completed, the equipment can automatically complete the actions of rising the coating module 18, lowering the lifting groove 26, and extending the retaining groove 27, without the need for additional operators to perform manual adjustments. This not only improves production efficiency, but also reduces the labor intensity and operating difficulty of the operator, making the equipment easier to use and manage.

[0084] The embodiments of the present invention are provided for the purpose of illustration and description. Although the embodiments of the present invention have been shown and described above, it can be understood that the above embodiments are exemplary and cannot be understood as limitations of the present invention. Ordinary technicians in this field can change, modify, replace and modify the above embodiments within the scope of the present invention.

Claims

1. A photovoltaic cell assembly, characterized in that: The invention comprises the following functional layers stacked in sequence: an FTO conductive glass substrate (1), a NiOx hole transport layer (2), an organic hole transport layer (3), a perovskite light absorbing layer (4), a surface passivation layer (5), an electron transport layer (6), a hole blocking layer (7), and a metal electrode layer (8), wherein the NiOx hole transport layer (2), the organic hole transport layer (3), the perovskite light absorbing layer (4), the surface passivation layer (5), the electron transport layer (6), the hole blocking layer (7), and the metal electrode layer (8) are stacked on the front side of the FTO conductive glass substrate (1).

2. A photovoltaic cell assembly according to claim 1, characterized in that: A MgF2 anti-reflection layer (9) is provided on the back side of the FTO conductive glass substrate (1).

3. A method for manufacturing a photovoltaic cell assembly, characterized in that: The photovoltaic cell assembly according to any one of claims 1 to 2 further comprises the following steps: S1. Scribing the FTO conductive glass substrate (1): First, laser scribing the P1 line of the FTO conductive glass substrate (1) with the following scribing parameters: scribing power 12W, pulse width 100ns, repetition frequency 100kHz, forming a scribing width of 30μm; S2. Cleaning of the FTO conductive glass substrate (1): The laser-scribed FTO conductive glass substrate (1) is then ultrasonically treated with tetramethylammonium hydroxide solution, isopropyl alcohol, ethanol, and pure water at 50° C. for 20 minutes each, and then dried with hot air; S3. Preparation of NiOx hole transport layer (2): The cleaned FTO conductive glass substrate (1) was then treated with Ar plasma for 1 min, and then 20 nm NiO was sputtered and deposited. x layer, wherein the sputtering parameters include: RF power 1000W, working pressure 0.3Pa, oxygen doping concentration 1%, and storage in a nitrogen environment after completion; S4. Preparation of the organic hole transport layer (3): first, a methanol solution containing 0.3 mmol·L-1 Me-4PACz is prepared, then the FTO conductive glass substrate (1) with the NiOx hole transport layer (2) stored in a nitrogen environment is taken out, and then it is placed in the prepared methanol solution and soaked for 10 minutes. After the soaking is completed, it is taken out and annealed in a 100°C environment for 5 minutes. Then, the FTO conductive glass substrate (1) with the NiOx hole transport layer (2) is rinsed with methanol and dried with N2, and the organic hole transport layer (3) is stacked on the NiOx hole transport layer (2); S5. Preparation of the perovskite light-absorbing layer (4): first, prepare a perovskite solution with a concentration of 1.3M, then connect the prepared perovskite solution to a slit coater, and then use the slit coater to coat the perovskite solution on the organic hole transport layer (3) to form a completed liquid film, then move it to a vacuum flash evaporator, and then evacuate the vacuum flash evaporator to below 10Pa. After the flash evaporation, the perovskite thin liquid film changes from light color to brown, and then take it out and place it on a hot stage for annealing at 150°C for 15 minutes. After annealing, place it in a nitrogen cabinet for use; S6. Preparation of the surface passivation layer (5): first prepare a PEAI (0.5 mg / ml) solution, then connect the PEAI solution to a slit coater, then take out the FTO conductive glass substrate (1) prepared with the NiOx hole transport layer (2), the organic hole transport layer (3) and the perovskite light absorption layer (4), and use the slit coater to coat the PEAI solution on the perovskite light absorption layer (4) to form a complete liquid film. After coating, anneal the surface passivation layer (5) in an environment of 120°C for 10 minutes; S7. Preparation of electron transport layer (6): First, the FTO conductive glass substrate (1) having a NiOx hole transport layer (2), an organic hole transport layer (3), a perovskite light absorption layer (4) and a surface passivation layer (5) is placed in a vacuum evaporation device, and then C60 with a thickness of 30 nm is evaporated by the vacuum evaporation device, wherein the vacuum degree of the vacuum evaporation device is less than -4 * 10 5 Pa, then heating the organic source to 360° C., and then evaporating C60. After the evaporation rate stabilizes at 0.2-0.3 A / s, opening the baffle of the vacuum evaporation equipment, and starting to deposit C60 on the FTO conductive glass substrate (1) to form an electron transport layer (6); S8. Preparation of the hole blocking layer (7): first, placing the FTO conductive glass substrate (1) having the NiOx hole transport layer (2), the organic hole transport layer (3), the perovskite light absorption layer (4), the surface passivation layer (5) and the electron transport layer (6) into an atomic force deposition device, then preparing a Sn aqueous solution, and using the atomic force deposition device to deposit a SnO2 layer with a thickness of 25 nm, thereby forming the hole blocking layer (7); S9, scribing the P2 line: forming a perovskite module component from an FTO conductive glass substrate (1) having a NiOx hole transport layer (2), an organic hole transport layer (3), a perovskite light absorbing layer (4), a surface passivation layer (5), an electron transport layer (6) and a hole blocking layer (7), and then dividing the entire perovskite module component into a plurality of sub-cells, which are connected in series, and then scribing the P2 line using a laser, wherein the scribing parameters are: power 6W, pulse width 100ns, repetition frequency 70kHz and scribing width 100μm; S10, metal electrode layer (8): then placing the plurality of sub-batteries connected in series into a vacuum evaporation device, and then using the vacuum evaporation device to evaporate Ag with a thickness of 100 nm, wherein the vacuum evaporation device has a vacuum degree of less than -5*105 Pa and an evaporation rate of 0.5 A / s, to form a metal electrode layer (8) on the plurality of sub-batteries connected in series; S11, scribing P3 line: using a laser to scribble P2 line on a plurality of sub-cells having a metal electrode layer (8), wherein the scribing parameters are: power 6W, pulse width 100ns, repetition frequency 70kHz and scribing width 100μm; S12, preparation of MgF2 anti-reflection layer (9): Afterwards, several sub-cells after being scribed are placed in a vacuum evaporation device, and then a 100 nm thick MgF2 is evaporated on the back of the FTO conductive glass substrate (1) using the vacuum evaporation device, wherein the vacuum degree of the vacuum evaporation device is less than -5 * 10 5 Pa, the evaporation rate is 1A / s.

4. A method for manufacturing a photovoltaic cell assembly according to claim 3, characterized in that: The composition of the perovskite solution in S5 is FA 0.85 Cs 0.15 For 1 ml of perovskite solution, 190.025 mg of FAI, 50.663 mg of CsI, and 629.28 mg of PbI2 need to be weighed respectively, and 13.504 mg of MACl is added as an additive to assist perovskite crystallization, dissolved in DMF:DMSO = 9:1 (v / v), and placed in a magnetic stirrer at 30°C for 3-5 hours. After complete dissolution, the perovskite solution is filtered using a 0.22 μm organic filter to obtain a perovskite solution. The parameters of the slit coater coating in S5 are: a speed of 20 mm / s, and a spacing of 0.1 mm between the upper layer of the FTO conductive glass substrate (1) and the blade.

5. The method for manufacturing a photovoltaic cell assembly according to claim 3, wherein: The operating parameters of the atomic force deposition equipment in S8 are: vacuum degree less than -4 * 10 5 Pa, a total of 200 cycles.

6. A device for preparing a photovoltaic cell assembly, characterized in that: A photovoltaic cell assembly applicable to any one of claims 1-2, comprising: A support plate (10), wherein a placement plate (11) is provided at the upper end of the support plate (10), sliding grooves (12) are provided on both sides of the placement plate (11), and a movable frame (15) is slidably installed inside the two sliding grooves (12); A chute (16) is installed between the two sliding grooves (12); a hanger (17) is slidably installed inside the chute (16); a coating module (18) is slidably installed inside the hanger (17); the coating module (18) is connected to a conduit (19), and the conduit (19) passes through the hanger (17); A driving assembly is arranged between the two movable frames (15) and is used for lifting and lowering the coating module (18) and shielding the liquid outlet of the coating module (18).

7. The device for preparing a photovoltaic cell assembly according to claim 1, wherein: The driving assembly comprises two driving discs (21), the two driving discs (21) are respectively connected to the two moving frames (15) in rotation, the two driving discs (21) are connected in transmission via a driving member (20), the front ends of the two driving discs (21) are both provided with eccentric wheels (22), the two eccentric wheels (22) are connected via a connecting rod (23), the front ends of the two eccentric wheels (22) are both provided with a linkage rod (24), the front ends of the linkage rod (24) are provided with a rotating rod (25), the outer surface of the rotating rod (25) is provided with a lifting groove (26), and the lifting groove (26) is internally provided with a retaining groove (27) for sliding.

8. The device for preparing a photovoltaic cell assembly according to claim 1, wherein: The rotating rod (25) penetrates into the lifting groove (26), and the outer surface of the rotating rod (25) is provided with a bevel gear 1 (29). The lifting groove (26) is internally rotatably connected with a bevel gear 2 (29). The bevel gear 1 (29) is meshed with the bevel gear 2 (29). One end of the bevel gear 2 (29) is connected with a rotating shaft (30). The rotating shaft (30) is rotatably connected with the lifting groove (26). One end of the rotating shaft (30) is provided with a gear 1 (31). The lifting groove (26) is internally slidably installed with a tooth plate 1 (32). The gear 1 (31) is meshed with the tooth plate 1 (32). One side of the tooth plate 1 (32) is connected to one side of the retaining groove (27).

9. The device for preparing a photovoltaic cell assembly according to claim 1, wherein: A connecting groove (33) is slidably installed inside the movable frame (15), a driving tooth plate (34) is slidably installed inside the connecting groove (33), the driving tooth plate (34) is connected to the lifting groove (26), a gear 2 (35) is rotatably installed on one side of the connecting groove (33), the gear 2 (35) is engaged with the driving tooth plate (34), a tooth plate 3 (36) is slidably installed inside the connecting groove (33), the gear 2 (35) is engaged with the tooth plate 3 (36), a connecting plate (37) is provided on one side of the tooth plate 3 (36), and the connecting plate (37) is connected to the coating module (18).

10. The device for preparing a photovoltaic cell assembly according to claim 1, wherein: A threaded rod (13) is rotatably mounted inside the sliding groove (12), a threaded ring is provided inside the movable frame (15), the threaded ring is threadedly connected to the threaded rod (13), a rotating member (14) is provided inside the sliding groove (12), and an output end of the rotating member (14) is connected to the threaded rod (13).

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