Display panel, display device and apparatus

Abstract

The application discloses a display panel, a display device and equipment. The display panel comprises a substrate, an isolation structure, a light-emitting device and a first encapsulation layer. The first electrode and the second electrode serve as electrodes of the light-emitting unit and drive the light-emitting unit to emit light. The first encapsulation layer comprises a first encapsulation sublayer and a second encapsulation sublayer. The first encapsulation sublayer comprises a plurality of first encapsulation subparts, and the plurality of first encapsulation subparts are arranged correspondingly to the light-emitting structure to form encapsulation of the light-emitting device. The second encapsulation sublayer can further improve the encapsulation effect of the first encapsulation layer. The density of the second encapsulation sublayer is greater than that of the first encapsulation sublayer. The second encapsulation sublayer is denser than the first encapsulation sublayer, further improves the overall encapsulation reliability of the first encapsulation layer, solves the problem that the single-layer first encapsulation sublayer cannot meet the encapsulation requirement of the display panel, and improves the display effect and use performance of the display panel.

Description

TECHNICAL FIELD

[0001] The present application relates to the display field, and in particular to a display panel, a display device and equipment. BACKGROUND

[0002] Organic light emitting diodes (OLED) and flat panel display devices based on light emitting diode (LED) technology have been widely used in mobile phones, televisions, notebook computers, desktop computers and other consumer electronic products due to their high image quality, power saving, thin body and wide application range, and have become the mainstream of display devices.

[0003] In the preparation process of a traditional display panel, a fine metal mask (FMM) is usually used to realize the patterning of a light emitting pixel. The FMM technology is mature and has rich mass production experience. However, the FMM technology also has the problems of limited precision, high development cost and long development cycle. The fine metal mask-free technology eliminates the limitations of the traditional OLED process on the size, resolution and other performance of the display screen, and has the advantages of high performance, full size and agile delivery. The patents CN118251982A, CN115666161A, CN116648095A, CN117062489A, CN118678742A, CN118785761A, CN115224220A, CN118678729A, CN118660529A and CN118660589A disclose the related content of the fine metal mask-free technology, which are referred to for reference.

[0004] However, the use performance of the current OLED display product needs to be improved. SUMMARY

[0005] Embodiments of the present application provide a display panel, a display device and equipment, which aims to improve the use performance of the OLED display product.

[0006] The first aspect of the present application provides a display panel, which comprises a substrate, an isolation structure located on one side of the substrate, the isolation structure enclosing a plurality of isolation openings, a light emitting device located on one side of the substrate and comprising a first electrode, a light emitting unit and a second electrode stacked, the light emitting device corresponding to the isolation opening, a first encapsulation layer located on the side of the second electrode away from the substrate, the first encapsulation layer comprising a first encapsulation sublayer and a second encapsulation sublayer, the second encapsulation sublayer located on the side of the first encapsulation sublayer away from the substrate, the first encapsulation sublayer comprising a plurality of first encapsulation subparts, wherein the compactness of the second encapsulation sublayer is greater than the compactness of the first encapsulation sublayer.

[0007] The second aspect embodiment of the present application provides a display panel, comprising: a substrate; an isolation structure located on one side of the substrate, the isolation structure enclosing a plurality of isolation openings; a light emitting device located on one side of the substrate and comprising a first electrode, a light emitting unit and a second electrode arranged in layers, the light emitting device corresponding to the isolation opening; a first encapsulation layer located on a side of the second electrode away from the substrate; a second encapsulation layer located on a side of the first encapsulation layer away from the substrate, the material of the second encapsulation layer comprising an organic material; a third encapsulation layer located on a side of the second encapsulation layer away from the substrate, the material of the third encapsulation layer comprising an inorganic material; and a protective cover plate located on a side of the third encapsulation layer away from the substrate, the protective cover plate and the substrate being oppositely arranged, and a sealing structure being arranged between the protective cover plate and the substrate.

[0008] The third aspect embodiment of the present application provides a display device comprising the display panel of any of the above embodiments.

[0009] The fourth aspect embodiment of the present application provides an apparatus comprising the display panel of any of the above embodiments.

[0010] According to the display panel of the present application, the display panel comprises a substrate, an isolation structure, a light emitting device and a first encapsulation layer. When the light emitting material is prepared, the light emitting material produces a large difference at the edge of the isolation structure, and the light emitting material is cut off at the edge of the isolation structure to form mutually disconnected light emitting units, thereby reducing the crosstalk of carriers between the light emitting units and improving the display effect of the display panel. Moreover, the preparation of the light emitting unit can not need to use a precision mask plate, which can reduce the development and use of the precision mask plate and reduce the preparation cost. The first electrode and the second electrode serve as the electrodes of the light emitting unit and drive the light emitting unit to emit light. The first encapsulation layer comprises a first encapsulation sublayer and a second encapsulation sublayer, the first encapsulation sublayer comprises a plurality of first encapsulation subparts, the plurality of first encapsulation subparts are arranged corresponding to the light emitting structure to form the encapsulation of the light emitting device. The arrangement of the second encapsulation sublayer can further improve the encapsulation effect of the first encapsulation layer. Moreover, the density of the second encapsulation sublayer is greater than the density of the first encapsulation sublayer, the second encapsulation sublayer is denser than the first encapsulation sublayer, which further improves the overall encapsulation reliability of the first encapsulation layer, improves the display effect and use performance of the display panel, and solves the problem that the single-layer first encapsulation sublayer cannot meet the encapsulation requirements of the display panel. BRIEF DESCRIPTION OF DRAWINGS

[0011] Other features, objects, and advantages of the present application will become more apparent from the following detailed description of non-limiting embodiments, read in conjunction with the accompanying drawings, wherein like reference numerals designate like features, and in which:

[0012] Figure 1 is a top view schematic diagram of a display panel provided by the present application;

[0013] Figure 2 is a partial top view of a display panel provided by an embodiment of the present application;

[0014] Figure 3 is Figure 2 is a sectional view of B-B in FIG. 1;

[0015] Figure 4 is a partial sectional view of a display panel in another embodiment;

[0016] Figure 5 is a partial sectional view of a display panel in yet another embodiment;

[0017] Figure 6 is a partial sectional view of a display panel in still another embodiment;

[0018] Figure 7 is a partial sectional view of a display panel in still another embodiment;

[0019] Figure 8 is a partial sectional view of a display panel in still another embodiment;

[0020] Figure 9 is a partial sectional view of a display panel in still another embodiment;

[0021] Figure 10 is a partial sectional view of a display panel in still another embodiment;

[0022] Figure 11 is a partial sectional view of a display panel in still another embodiment;

[0023] Figure 12 is a partial sectional view of a display panel in still another embodiment;

[0024] Figure 13 is a partial sectional view of a display panel in still another embodiment;

[0025] Figure 14 is a partial sectional view of a display panel in still another embodiment;

[0026] Figure 15 is a partial sectional view of a display panel in still another embodiment;

[0027] Figure 16 is a partial sectional view of a display panel in still another embodiment;

[0028] Figure 17 is a schematic diagram of a pixel circuit provided by an embodiment of the present application;

[0029] Figure 18 is a partial sectional view of a display panel in still another embodiment.

[0030] Reference numerals:

[0031] 10, display panel; AA, display area; NA, non-display area; NA1, side frame; NA2, lower frame;

[0032] 100, substrate;

[0033] 200, pixel definition layer; 201, first definition layer; 202, second definition layer; 210, pixel limiting part; 220, pixel opening; 230, light emitting unit;

[0034] 300, isolation structure; 301, first sub-layer; 302, second sub-layer; 303, third sub-layer; 310, isolation opening;

[0035] 400, first electrode layer; 410, first electrode;

[0036] 500, second electrode layer; 510, second electrode;

[0037] 610, first encapsulation layer; 610a, first encapsulation sub-layer; 610aa, first encapsulation sub-part; 610b, second encapsulation sub-layer; 610ba, second encapsulation sub-part; 610c, third encapsulation sub-layer; 610d, gap space; 620, second encapsulation layer; 630, third encapsulation layer; 640, first wear-resistant layer;

[0038] 700, dam;

[0039] 800, protective cover plate; 810, sealing structure; 820, closed space;

[0040] 900, polarizer; 910, recessed space; 920, water and oxygen resistant structure; 930, adhesive layer;

[0041] D1, first thickness; D2, second thickness;

[0042] X, first direction; Y, second direction. DETAILED DESCRIPTION

[0043] To make the objectives, technical solutions, and advantages of the embodiments of the present application clearer, the technical solutions in the embodiments of the present application will be described below in connection with the drawings in the embodiments of the present application. Obviously, the described embodiments are only some of the embodiments of the present application, rather than all the embodiments. The components of the embodiments of the present application described and shown in the drawings herein can be arranged and designed in various different configurations.

[0044] Therefore, the following detailed description of the embodiments of the application provided in the accompanying drawings is not intended to limit the scope of the application claimed, but merely represents selected embodiments of the application. Based on the embodiments in the application, all other embodiments obtained by those of ordinary skill in the art without creative labor are within the scope of protection of the application.

[0045] It should be noted that similar reference numbers and letters represent similar items in the following drawings, so once an item is defined in one drawing, it does not need to be further defined and explained in subsequent drawings. It should be noted that different features in the embodiments of the application can be combined with each other without conflict.

[0046] For some elements, the terms "upper" or "above" are sometimes used when describing the position, and "lower" or "below" are used when describing the position of elements opposite to them. In addition, when the terms "upper", "above", "lower", "below", "relative" and the like are used to define the positional relationship between two elements, they not only include the state where the above two elements are directly connected, but also include the state where the above two elements are separated by a gap, other elements. In addition, the terms "first", "second", "third" and the like are only used for distinction and cannot be understood as indicating or implying relative importance.

[0047] When applying the fine metal mask technology to large-size display products, the inventor found that there were small black spots, which gradually increased to become large black spots. After gradual analysis, it was found that the poor thickness uniformity of the packaging material on the large-size display product led to black spot defects and the like.

[0048] In order to solve the problem of black spot defects caused by low packaging reliability in large-size display products, the embodiments of the application provide a display panel, a display device and equipment, which will be described below in conjunction with the drawings.

[0049] The embodiments of the application provide a display panel, which can be an organic light emitting diode (OLED) display panel.

[0050] The display panel 10 can be an organic light emitting diode display panel (OLED) or a quantum dot light emitting diode display panel (QLED).

[0051] Please refer to Figure 1 , Figure 1is a top view of a display panel provided by an embodiment of the present application.

[0052] As shown in Figure 1 , the display panel 10 includes a display region AA having a display function and a non-display region NA.

[0053] The display region AA of the display panel 10 can be rectangular, or square, circular, or other shapes such as elliptical.

[0054] The display region AA includes a plurality of pixels arranged in a first direction X and a second direction Y. The pixels include a plurality of sub-pixels displaying different colors. In some embodiments, the pixels include a first sub-pixel, a second sub-pixel, and a third sub-pixel, for example, the first sub-pixel is a blue sub-pixel, the second sub-pixel is a green sub-pixel, and the third sub-pixel is a red sub-pixel. In some embodiments, the pixels include a sub-pixel emitting white or other color light in addition to the first sub-pixel, the second sub-pixel, and the third sub-pixel.

[0055] The sub-pixels include a pixel circuit and a light emitting device driven by the pixel circuit to emit light of a corresponding color. The first sub-pixel includes a first light emitting device, the second sub-pixel includes a second light emitting device, and the third sub-pixel includes a third light emitting device. One pixel circuit drives at least one light emitting device to emit light. For example, the display region AA includes a normal display region and a light-transmitting display region, the light-transmitting display region is a display region AA corresponding to a sensor and having light-transmitting performance, and the normal display region is a display region AA not corresponding to a sensor, in the normal display region one pixel circuit drives one light emitting device to emit light, and in the light-transmitting display region one pixel circuit drives one or more light emitting devices to emit light. In some embodiments, the normal display region is also provided with a sensor.

[0056] Please refer to Figures 1 to 3 , Figure 2 is a partial top view of a display panel provided by an embodiment of the present application. Figure 3 is Figure 2 a sectional view of B-B in

[0057] As shown in Figures 1 to 3As shown, the first aspect of the present application provides a display panel 10, which comprises: a substrate 100; an isolation structure 300 located on one side of the substrate 100, the isolation structure 300 enclosing a plurality of isolated openings 310; a light emitting device located on one side of the substrate 100 and comprising a first electrode 410, a light emitting unit 230 and a second electrode 510 arranged in layers, the light emitting device corresponding to the isolated openings 310; and a first encapsulation layer 610 located on the side of the second electrode 510 away from the substrate 100, the first encapsulation layer 610 comprising a first encapsulation sub-layer 610a and a second encapsulation sub-layer 610b, the second encapsulation sub-layer 610b being located on the side of the first encapsulation sub-layer 610a away from the substrate 100, and the first encapsulation sub-layer 610a comprising a plurality of first encapsulation sub-sections 610aa; wherein the density of the second encapsulation sub-layer 610b is greater than the density of the first encapsulation sub-layer 610a.

[0058] Density is a physical quantity describing the closeness of the arrangement of atoms or molecules inside a material, reflecting the number of atoms or molecules per unit volume. The greater the density, the better the material's barrier ability to water and oxygen.

[0059] According to the display panel 10 of the present application, the display panel 10 comprises a substrate 100, an isolation structure 300, a light emitting device and a first encapsulation layer 610. When preparing the light emitting material, the light emitting material produces a large difference at the edge of the isolation structure 300, and the light emitting material is cut off at the edge of the isolation structure 300 to form mutually disconnected light emitting units 230, thereby reducing the crosstalk between the light emitting units 230 and improving the display effect of the display panel 10. Moreover, the preparation of the light emitting unit 230 can be performed without using a precision mask plate, which can reduce the development and use of the precision mask plate and lower the preparation cost. The first electrode 410 and the second electrode 510 serve as the electrodes of the light emitting unit 230 to drive the light emitting of the light emitting unit 230. The first encapsulation layer 610 comprises a first encapsulation sub-layer 610a and a second encapsulation sub-layer 610b, the first encapsulation sub-layer 610a comprises a plurality of first encapsulation sub-sections 610aa, the plurality of first encapsulation sub-sections 610aa are arranged corresponding to the light emitting structure to form encapsulation of the light emitting device, and each first encapsulation sub-section 610aa independently encapsulates each light emitting device. The arrangement of the second encapsulation sub-layer 610b can further improve the encapsulation effect of the first encapsulation layer 610. Moreover, the density of the second encapsulation sub-layer 610b is greater than the density of the first encapsulation sub-layer 610a, the second encapsulation sub-layer 610b is more dense than the first encapsulation sub-layer 610a, which further improves the overall encapsulation reliability of the first encapsulation layer 610, solves the problem that the single-layer first encapsulation sub-layer 610a cannot meet the encapsulation requirements of the display panel 10, and improves the display effect and use performance of the display panel 10. In particular, it can improve the problem of poor thickness uniformity of the first encapsulation sub-layer 610a on a large-size display panel 10, and improve the black spots and other defects of the large-size display panel caused by low encapsulation reliability.

[0060] It should be noted that the scheme of the present application is not only applicable to large-size display panels, but also to display panels of other sizes, to improve the packaging performance of the display panels.

[0061] In some embodiments of the present application, the second packaging sub-layer 610b is arranged on the side of the first packaging sub-layer 610a of the light-emitting device of each color away from the substrate 100. In this way, the second packaging sub-layer 610b can be formed after the preparation of the light-emitting device of each color, so as to avoid affecting the normal preparation process of the light-emitting device due to the preparation of the second packaging sub-layer 610b. The reason is as follows: if the second packaging sub-layer 610b is prepared after the preparation of the light-emitting unit 230, the second electrode layer 500 and the first packaging sub-layer 610a of the light-emitting device of a certain color, and before the etching removal of the light-emitting unit 230, the second electrode layer 500 and the first packaging sub-layer 610a of the first light-emitting device at the positions of the plurality of second isolation openings and the plurality of third isolation openings, the film layer at the positions of the plurality of second isolation openings and the plurality of third isolation openings also needs to be removed additionally when etching. However, due to the high density of the second packaging sub-layer 610b, it is more difficult to remove the second packaging sub-layer 610b. Therefore, the second packaging sub-layer 610b can be prepared after the preparation of the light-emitting device of each color, so as to avoid affecting the preparation process of the light-emitting device due to the preparation of the second packaging sub-layer 610b. The first electrode 410 can be an anode, and the second electrode 510 can be a cathode. The first electrode 410 of each light-emitting device can be connected to the pixel circuit through a via hole, so that the pixel circuit drives the light-emitting device to emit light. Alternatively, the plurality of first packaging sub-layers 610aa are arranged at intervals, or at least part of the first packaging sub-layers 610aa are connected to each other, or at least part of the first packaging sub-layers 610aa overlap in the orthographic projection of the substrate 100 and overlap on the side of the isolation structure 300 away from the substrate 100.

[0062] Alternatively, the second packaging sub-layer 610b is prepared by an atomic layer deposition (ALD) process to form a denser film structure. Alternatively, the first packaging sub-layer 610a is prepared by a chemical vapor deposition (CVD) process.

[0063] Optionally, the light-emitting unit 230 includes a first light-emitting unit, a second light-emitting unit, and a third light-emitting unit, the light-emitting colors of the first light-emitting unit, the second light-emitting unit, and the third light-emitting unit are different, for example, the light-emitting color of the first light-emitting unit is red, the light-emitting color of the second light-emitting unit is green, and the light-emitting color of the third light-emitting unit is blue.

[0064] Optionally, the refractive index of the first encapsulation sub-layer 610a is greater than the refractive index of the second encapsulation sub-layer 610b.

[0065] In these optional embodiments, the refractive index of the first encapsulation sub-layer 610a and the second encapsulation sub-layer 610b decreases, forming a progressive light coupling layer, reducing interface reflection loss, and improving light extraction efficiency. The high refractive index first encapsulation sub-layer 610a is close to the light-emitting unit 230, shortening the optical path difference and weakening the color deviation caused by wavelength interference. The low refractive index second encapsulation sub-layer 610b serves as an out-light interface buffer to scatter ambient light reflection.

[0066] Please refer to Figure 4 , Figure 4 FIG. 6 is a partial cross-sectional view of a display panel according to another embodiment.

[0067] As Figure 4 shown, in some optional embodiments, the display panel 10 further includes: a second encapsulation layer 620 located on the side of the first encapsulation layer 610 away from the substrate 100, the material of the second encapsulation layer 620 including an organic material; and a third encapsulation layer 630 located on the side of the second encapsulation layer 620 away from the substrate 100, the material of the third encapsulation layer 630 including an inorganic material.

[0068] In these optional embodiments, the first encapsulation layer 610, the second encapsulation layer 620 and the third encapsulation layer 630 form a three-layer thin film evaporator (TFE), improving the encapsulation performance of the display panel 10. Optionally, the material of the first encapsulation layer 610 includes an inorganic material. The second encapsulation layer 620 is formed on the side of the first encapsulation layer 610 away from the substrate 100 by printing or the like, for planarization and stress relief. The TFE encapsulation combined with the design of the second encapsulation sub-layer 610b can improve the black spot and other defects of the large-size display panel 10 caused by the low encapsulation reliability of the three-layer conventional TFE encapsulation structure of the first encapsulation sub-layer 610a, the second encapsulation layer 620 and the third encapsulation layer 630 in the large-size display panel 10. Optionally, the first encapsulation sub-layer 610a and the second encapsulation sub-layer 610b are of the same material or different materials. The materials of the first encapsulation layer 610 and the third encapsulation layer 630 include at least one of silicon nitride (SiN), silicon oxide (SiO) and silicon oxynitride (SiON). The second encapsulation layer 620 is an organic insulating material, such as a resin material of epoxy resin, acrylic resin or the like. The second encapsulation layer 620 and the third encapsulation layer 630 are continuously arranged at least on the display area AA as a whole, and a part thereof is also arranged in the non-display area NA.

[0069] In some optional embodiments, the projection of the boundary of the second encapsulation layer 620 on the substrate 100 is located within the projection of the second encapsulation sub-layer 610b on the substrate 100. That is, the boundary of the second encapsulation layer 620 is inwardly recessed from the second encapsulation sub-layer 610b.

[0070] Please refer to Figure 4 and Figure 5 , Figure 5 is a partial sectional view of the display panel in yet another embodiment.

[0071] As shown in Figure 4 and Figure 5 , optionally, the second encapsulation sub-layer 610b and the third encapsulation layer 630 are arranged in contact on the side of the second encapsulation layer 620.

[0072] In these optional embodiments, the boundary of the second encapsulation layer 620 is inwardly recessed from the boundary of the second encapsulation sub-layer 610b. After the third encapsulation layer 630 is deposited on the second encapsulation layer 620, the third encapsulation layer 630 can be arranged in contact with the second encapsulation sub-layer 610b on at least part of the side of the second encapsulation layer 620, improving the edge encapsulation reliability.

[0073] In some optional embodiments, the projection of the second encapsulation sub-layer 610b on the substrate 100 is located within the projection of the third encapsulation layer 630 on the substrate 100.

[0074] In these optional embodiments, the third encapsulation layer 630 fully covers the second encapsulation sub-layer 610b, and strengthens the encapsulation of the edges of the second encapsulation sub-layer 610b, further improving the encapsulation reliability of the display panel 10.

[0075] Referring to Figure 6 , Figure 6 is a partial cross-sectional view of a display panel in another embodiment.

[0076] As Figure 6 shown, in some optional embodiments, the display panel 10 further comprises a first wear-resistant layer 640 disposed on the outer surface of the third encapsulation layer 630 away from the second encapsulation layer 620, and the wear rate of the first wear-resistant layer 640 is less than that of the third encapsulation layer 630.

[0077] The wear rate is a quantitative parameter representing the volume loss rate of a material under mechanical action, which is defined as "the volume worn per unit load per unit length".

[0078] In these optional embodiments, the wear rate of the first wear-resistant layer 640 is less than that of the third encapsulation layer 630, that is, the wear resistance of the first wear-resistant layer 640 is better than that of the third encapsulation layer 630. When the first wear-resistant layer 640 is disposed on the third encapsulation layer 630, the first wear-resistant layer 640 has better wear resistance and provides protection to the third encapsulation layer 630, improving the encapsulation reliability of the display panel 10. Optionally, the material of the first wear-resistant layer 640 includes diamond carbon or SiO2 nanoparticle coating and other wear-resistant materials.

[0079] In some optional embodiments, the orthographic projection of the third encapsulation layer 630 on the substrate 100 is within the orthographic projection of the first wear-resistant layer 640 on the substrate 100.

[0080] In these optional embodiments, the first wear-resistant layer 640 fully covers the outer surface of the third encapsulation layer 630, improves the coverage range of the first wear-resistant layer 640, so that the third encapsulation layer 630 is protected by the first wear-resistant layer 640, further improving the encapsulation reliability of the display panel 10.

[0081] In some optional embodiments, the orthographic projection of the first encapsulation sub-layer 610aa on the substrate 100 is within the orthographic projection of the second encapsulation sub-layer 610b on the substrate 100.

[0082] In these optional embodiments, the first encapsulation sub-layer 610a is covered by the second encapsulation sub-layer 610b, further improving the encapsulation reliability of the display panel 10.

[0083] In some optional embodiments, the second encapsulation sub-layer 610b is integrally arranged, and the plurality of first encapsulation sub-regions 610aa are located within the projection of the second encapsulation sub-layer 610b on the substrate 100.

[0084] In these optional embodiments, the second encapsulation sub-layer 610b is integrally and continuously arranged, and the second encapsulation sub-layer 610b not only covers and protects the area where the plurality of first encapsulation sub-regions 610aa are located, but also covers the gap area between the first encapsulation sub-regions 610aa, thereby improving the encapsulation reliability. In addition, the second encapsulation sub-region 610ba is integrally arranged, thereby reducing the process difficulty.

[0085] Referring to Figure 7 , Figure 7 FIG. 8 is a partial cross-sectional view of a display panel according to another embodiment.

[0086] As shown in Figure 7 , optionally, the second encapsulation sub-layer 610b includes a plurality of second encapsulation sub-regions 610ba, and the second encapsulation sub-regions 610ba are located on the side of the first encapsulation sub-regions 610aa away from the substrate 100, and the projection of the first encapsulation sub-regions 610aa on the substrate 100 is located within the projection of the second encapsulation sub-regions 610ba on the substrate 100.

[0087] In these optional embodiments, the second encapsulation sub-layer 610b includes a plurality of second encapsulation sub-regions 610ba, and the first encapsulation sub-layer 610a includes a plurality of first encapsulation sub-regions 610aa, and the second encapsulation sub-regions 610ba and the first encapsulation sub-regions 610aa are arranged correspondingly. In this way, the encapsulation performance of the display panel 10 is improved, and the first encapsulation sub-regions 610aa and the second encapsulation sub-regions 610ba can be formed by using the same mask plate for etching, thereby simplifying the preparation process.

[0088] Optionally, the first encapsulation sub-regions 610aa are located on the side of the second electrode 510 away from the substrate 100, and extend to the side of the isolation structure 300 away from the substrate 100 through the side wall of the isolation structure 300.

[0089] Referring to Figure 8 , Figure 8 FIG. 8 is a partial cross-sectional view of a display panel according to another embodiment.

[0090] As shown in Figure 8 , for example, the first encapsulation sub-region 610aa includes a first segment and a second segment connected to each other, the first segment is located within the isolation opening 310 and arranged on the side of the light-emitting unit 230 away from the substrate 100, and the second segment is located on the side of the isolation structure 300 facing the isolation opening 310. The side surface of the first segment away from the substrate 100 and the side surface of the second segment away from the isolation structure 300 are at least partially connected to each other to enclose a gap space 610d.

[0091] For example, the first segment is not connected to the side surface of the substrate 100, and the second segment is not connected to the side surface of the isolation structure 300.

[0092] For example, the first encapsulation sub-layer 610a further includes a third segment connected to the second segment, and the third segment is located on the side of the isolation structure 300 away from the substrate 100. Optionally, the third segments of at least two adjacent first encapsulation sub-layers 610a are spaced to form a spacing region. Optionally, the second encapsulation sub-layer 610b is continuously arranged in the spacing region, or the second encapsulation sub-layer 610b is discontinuously arranged in the spacing region.

[0093] For example, the third segment and the isolation structure 300 form a spacing space, and the second encapsulation layer 620 fills at least part of the spacing space to improve the adhesion between the film layers.

[0094] Referring to Figure 9 , Figure 9 is a partial cross-sectional view of a display panel in another embodiment.

[0095] As shown in Figure 9 , in some optional embodiments, the display panel 10 has a display area AA, the second encapsulation layer 620 has a first thickness D1 in the display area AA, and the second encapsulation layer 620 has a second thickness D2 away from the edge of the display area AA, and the ratio of the second thickness D2 to the first thickness D1 is less than or equal to 0.4. For example, the ratio of the second thickness D2 to the first thickness D1 is 0.1, 0.2, 0.3, 0.4.

[0096] In these optional embodiments, the second encapsulation layer 620 extends from the display area AA to a non-display area NA, and the part of the second encapsulation layer 620 located in the non-display area NA has an edge away from the display area AA, and the second encapsulation layer 620 has a second thickness D2 at the edge, and the second encapsulation layer 620 has a first thickness D1 in the display area AA, and the second thickness D2 is less than the first thickness D1. The ratio of the second thickness D2 to the first thickness D1 is less than or equal to 0.4, which is suitable for large-size display panels 10. In large-size display panels 10, the non-display area NA has a larger width, and the overflow path of the second encapsulation layer 620 is longer. In the flow leveling process of the second encapsulation layer 620, the edge thickness is farther away from the display area AA, and has a lower thickness, without the need to strictly control the overflow path length of the second encapsulation layer 620 as in small-size display panels 10.

[0097] Referring to Figure 1 and Figure 10 , Figure 10 is a partial cross-sectional view of a display panel in another embodiment.

[0098] As shown inFigure 1 and Figure 10 As shown, in some optional embodiments, the display panel 10 has a display area AA and a non-display area NA, the non-display area NA surrounding at least a portion of the display area AA, or the non-display area NA surrounding a light-transmitting hole. The light-transmitting hole is a hole corresponding to a sensor and extends through the display panel 10. For example, the non-display area NA includes a border area surrounding the display area AA and an area surrounding the light-transmitting hole. The display panel 10 also includes a dam 700 located in the non-display area NA, and a second encapsulation layer 620 located on the side of the dam 700 facing the display area AA; wherein the dam 700 is disposed around the isolation structure 300, or the boundary of the isolation structure 300 is at least partially located on the dam 700, or the boundary of the isolation structure 300 is located outside the area enclosed by the dam 700.

[0099] In these optional embodiments, a dam 700 is positioned in the non-display area NA to block the second encapsulation layer 620, causing it to stop at the dam 700 position, or preventing the second encapsulation layer 620 from overflowing to the side of the dam 700 away from the display area AA, thus ensuring the encapsulation reliability of the display panel 10. The second encapsulation sub-layer 610b or the third encapsulation layer 630 extends to the side of the dam 700 away from the display area AA to increase the water and oxygen intrusion path. When the width of the non-display area of ​​a large-size display product is sufficiently large, the dam 700 may not be necessary.

[0100] Optionally, the dam 700 is arranged around at least a portion of the display area AA. Optionally, there are multiple dams 700. Optionally, the multiple dams 700 are spaced apart in the direction from the display area AA to the non-display area NA.

[0101] In some alternative embodiments, the second encapsulation layer 620 and the dam 700 are spaced apart. Specifically, the second encapsulation layer 620 and the dam 700 closest to the display area AA are spaced apart.

[0102] Alternatively, the boundary of the second encapsulation layer 620 is located on the sidewall of the dam 700 facing the display area AA.

[0103] In these alternative embodiments, the second encapsulation layer 620 and the dam 700 are spaced apart. For example, in a large-size display panel 10, the non-display area NA has a large width, and the distance between the dam 700 and the display area AA is large. This makes it difficult for the second encapsulation layer 620 to flow to the dam 700, reducing the risk of overflow. The boundary of the second encapsulation layer 620 is located on the sidewall of the dam 700 facing the display area AA. The second encapsulation layer 620 flows to the dam 700 and is stopped by the dam 700, preventing the second encapsulation layer 620 from continuing to overflow in a direction away from the display area AA.

[0104] In some optional embodiments, the second encapsulation sub-layer 610b covers the sidewall of the isolation structure 300 facing the dam 700.

[0105] In these optional embodiments, the first encapsulation sub-layer 610aa independently encapsulates the opening 310, and the sidewall of the isolation structure 300 facing the dam 700 is covered by the second encapsulation sub-layer 610b, which physically isolates the sidewall of the isolation structure 300 and increases the water-oxygen intrusion path, thereby improving the problem of water-oxygen intrusion into the light-emitting unit 230 through the sidewall of the isolation structure 300, resulting in display defects.

[0106] Optionally, the dam 700 comprises a single layer or multiple layers of metal material, or the dam 700 comprises metal material and inorganic material, or the dam 700 comprises a single layer or multiple layers of organic material.

[0107] The substrate 100 can be arranged in various ways. Optionally, the substrate 100 further comprises a substrate and a pixel driving circuit. For example, the substrate 100 comprises a substrate, a driving circuit layer and a planarization layer arranged on the substrate. The pixel driving circuit comprises a transistor and a capacitor, and the capacitor comprises a first electrode plate and a second electrode plate. The transistor comprises a source electrode, a drain electrode, a gate electrode and a semiconductor layer. The driving circuit layer further comprises a plurality of signal lines, such as a data signal line, a scan signal line, a driving power voltage signal line, etc. The driving circuit layer comprises a plurality of conductive layers, including a first conductive layer, a second conductive layer and a third conductive layer. The gate electrode and the first electrode plate can be located in the first conductive layer, the second electrode plate can be located in the second conductive layer, and the source electrode and the drain electrode can be located in the third conductive layer. Optionally, the plurality of conductive layers further comprises a fourth conductive layer located on the side of the third conductive layer away from the substrate.

[0108] Optionally, at least part of the dam 700 is in the same layer as at least one of the first conductive layer, the second conductive layer, the third conductive layer and the fourth conductive layer. For example, at least part of the dam 700 is in the same layer as the fourth conductive layer, or at least part of the dam 700 is in the same layer as the first conductive layer, the second conductive layer and the fourth conductive layer.

[0109] Optionally, in the same cross section extending along the thickness direction of the display panel 10, the thickness of the first encapsulation sub-layer 610a is greater than the thickness of the second encapsulation sub-layer 610b.

[0110] In these optional embodiments, the second encapsulation sub-layer 610b has the smallest thickness but the highest density, which improves the overall encapsulation reliability of the first encapsulation layer 610, reduces the material usage of the second encapsulation sub-layer 610b, and reduces the overall film thickness of the display panel 10.

[0111] Please refer to Figure 11 , Figure 11 is a partial cross-sectional view of a display panel in still another embodiment.

[0112] As shown in FIG. 6, in some optional embodiments, the first encapsulation layer 610 further comprises a third encapsulation sub-layer 610c, the third encapsulation sub-layer 610c is located on the side of the second encapsulation sub-layer 610b away from the substrate 100, and the density of the second encapsulation sub-layer 610b is greater than the density of the third encapsulation sub-layer 610c. Figure 11 In these optional embodiments, the third encapsulation sub-layer 610c is arranged to further improve the encapsulation effect of the first encapsulation layer 610. In addition, the density of the second encapsulation sub-layer 610b is greater than the density of the first encapsulation sub-layer 610a and the third encapsulation sub-layer 610c, and the second encapsulation sub-layer 610b is denser than the first encapsulation sub-layer 610a, which further improves the overall encapsulation reliability of the first encapsulation layer 610, improves the problem that the single-layer first encapsulation layer 610 is difficult to meet the encapsulation requirements of the display panel 10, and improves the display effect and use performance of the display panel 10. In particular, it can improve the problem that the single-layer first encapsulation layer 610 is difficult to meet the encapsulation requirements of the large-size display panel 10.

[0113] In some optional embodiments, in the same cross section extending along the thickness direction of the display panel 10, the thickness of the first encapsulation sub-layer 610a is greater than the thickness of the second encapsulation sub-layer 610b, and the thickness of the third encapsulation sub-layer 610c is greater than the thickness of the second encapsulation sub-layer 610b.

[0114] In these optional embodiments, the second encapsulation sub-layer 610b has the smallest thickness but the highest density, which reduces the material usage of the second encapsulation sub-layer 610b while improving the overall encapsulation reliability of the first encapsulation layer 610, and reduces the overall film thickness of the display panel 10.

[0115] In some optional embodiments, the refractive index of the first encapsulation sub-layer 610a is greater than the refractive index of the second encapsulation sub-layer 610b, and the refractive index of the second encapsulation sub-layer 610b is greater than the refractive index of the third encapsulation sub-layer 610c.

[0116] In these optional embodiments, the refractive index of the first encapsulation sub-layer 610a, the second encapsulation sub-layer 610b and the third encapsulation sub-layer 610c decreases gradually, forming a progressive light coupling layer, reducing interface reflection loss, and improving light extraction efficiency. The high-refractive first encapsulation sub-layer 610a is close to the light-emitting unit 230, which shortens the optical path difference and weakens the color deviation caused by wavelength interference. The low-refractive third encapsulation sub-layer 610c serves as a light-out interface buffer to scatter ambient light reflection.

[0117]

[0118] ​Optionally, when the first encapsulation layer 610 includes the first encapsulation sub-layer 610a, the second encapsulation sub-layer 610b and the third encapsulation sub-layer 610c, the thickness of the first encapsulation sub-layer 610a and the third encapsulation sub-layer 610c are both less than the thickness of the first encapsulation sub-layer 610a when the first encapsulation layer 610 includes only the first encapsulation sub-layer 610a and the second encapsulation sub-layer 610b. Optionally, when the first encapsulation layer 610 includes the first encapsulation sub-layer 610a, the second encapsulation sub-layer 610b and the third encapsulation sub-layer 610c, the sum of the thickness of the first encapsulation sub-layer 610a and the third encapsulation sub-layer 610c is equal to the thickness of the first encapsulation sub-layer 610a when the first encapsulation layer 610 includes only the first encapsulation sub-layer 610a and the second encapsulation sub-layer 610b.

[0119] Referring to Figure 12 , Figure 12 is a partial cross-sectional view of a display panel in yet another embodiment.

[0120] As Figure 12 shown, in some optional embodiments, the display panel 10 further includes a protective cover plate 800 located on the side of the first encapsulation layer 610 facing away from the substrate 100, the protective cover plate 800 and the substrate 100 are oppositely arranged, and a sealing structure 810 is arranged between the protective cover plate 800 and the substrate 100.

[0121] In these optional embodiments, a sealed chamber is formed between the protective cover plate 800 and the substrate 100 provided with the light emitting device through the sealing structure 810, which blocks the environmental water and oxygen. The protective cover plate 800 and the first encapsulation layer 610 form a double encapsulation, and the hard encapsulation and the flexible encapsulation are cooperatively arranged, which further improves the encapsulation reliability of the display panel 10.

[0122] Optionally, the sealing structure 810 includes glass glue, and the glass glue is sintered between the protective cover plate 800 and the substrate 100 to form a seal. Optionally, the sealing structure 810 is fixedly connected to an inorganic material of the display panel 10, for example, the sealing structure 810 is fixed to the third encapsulation layer 630, or the sealing structure 810 is fixed to the second encapsulation sub-layer 610b, or the sealing structure 810 is fixed to other inorganic insulating layers. Optionally, the sealing structure 810 includes a sealant (Seal) or other opaque sealing material.

[0123] Optionally, the display panel 10 further includes a second wear-resistant layer arranged on the outer surface of the protective cover plate 800 facing away from the first encapsulation layer 610, and the wear rate of the second wear-resistant layer is less than the wear rate of the protective cover plate 800.

[0124] In these optional embodiments, the wear rate of the second wear-resistant layer is less than the wear rate of the protective cover plate 800, i.e., the wear-resistant performance of the second wear-resistant layer is superior to the wear-resistant performance of the protective cover plate 800. When the second wear-resistant layer is arranged on the protective cover plate 800, the second wear-resistant layer has better wear-resistant performance and provides protection to the protective cover plate 800, improving the packaging reliability of the display panel 10. Optionally, the second wear-resistant layer material includes diamond carbon or a SiO2 nanoparticle coating or the like wear-resistant material.

[0125] In some optional embodiments, the protective cover plate 800, the substrate 100, and the sealing structure 810 enclose a closed space 820, and the light-emitting device and the isolation structure 300 are both located in the closed space 820, and the closed space 820 is filled with an inert gas. The inert gas is, for example, nitrogen, argon, or the like.

[0126] In these optional embodiments, the inert gas completely isolates oxygen and water vapor, reducing the oxidation risk of the light-emitting device from the source. The closed space 820 forms a gas pressure buffer layer, improving the impact resistance of the display panel 10.

[0127] Please refer to Figure 13 , Figure 13 is another partial cross-sectional view of a display panel in an embodiment.

[0128] As shown in Figure 13 , in some optional embodiments, the display panel 10 further includes: a second packaging layer 620 located on the side of the first packaging layer 610 away from the substrate 100, the material of the second packaging layer 620 including an organic material; a third packaging layer 630 located on the side of the second packaging layer 620 away from the substrate 100, the material of the third packaging layer 630 including an inorganic material; and the protective cover plate 800 located on the side of the third packaging layer 630 away from the substrate 100.

[0129] In these optional embodiments, the protective cover plate 800 forms a gas-tight cavity through the sealing structure 810, blocking environmental water and oxygen. The first packaging layer 610, the second packaging layer 620, and the third packaging layer 630 form a three-layer thin film encapsulation. The protective cover plate 800 and the TFE form a hard packaging and a flexible packaging double encapsulation, further improving the packaging reliability of the display panel 10.

[0130] As shown in Figure 1 and Figure 12As shown, the display panel 10 has a display area AA and a non-display area NA surrounding at least part of the display area AA, the non-display area NA includes a side frame NA1 located on both sides of the display area AA in the first direction X and a bottom frame NA2 located on one side of the display area AA in the second direction Y; in the side frame NA1, the sealing structure 810 is located on the side of the second encapsulation sub-layer 610b or the third encapsulation layer 630 away from the display area AA; the display panel 10 further includes a driving power voltage signal line at least partially located in the bottom frame NA2, and in the bottom frame NA2, the sealing structure 810 at least partially overlaps the driving power voltage signal line in the orthographic projection of the substrate 100. The sealing structure 810 is arranged around the display area AA in the side frame NA1 and the bottom frame NA2 to form a sealed protection for the display area AA. Optionally, the driving power voltage signal line includes a high-level power line ELVDD and a low-level power line ELVSS.

[0131] In some optional embodiments, the orthographic projection of the second encapsulation layer 620 on the substrate 100 is located within the orthographic projection of the protective cover plate 800 on the substrate 100.

[0132] In these optional embodiments, the second encapsulation layer 620 is recessed in the protective cover plate 800, and the protective cover plate 800 realizes physical shielding protection for the second encapsulation layer 620 against edge delamination caused by assembly stress.

[0133] In some optional embodiments, the orthographic projection of the third encapsulation layer 630 on the substrate 100 is located within the orthographic projection of the protective cover plate 800 on the substrate 100.

[0134] In these optional embodiments, the edge of the third encapsulation layer 630 is covered by the protective cover plate 800, which can improve water and oxygen permeation caused by cutting cracks.

[0135] In some optional embodiments, the distance L0 between the boundary of the isolation structure 300 and the sealing structure 810 is greater than or equal to 50 μm. For example, the distance between the boundary of the isolation structure 300 and the sealing structure 810 is 50 μm, 60 μm, 70 μm, 80 μm.

[0136] In these optional embodiments, the distance between the boundary of the isolation structure 300 and the sealing structure 810 is greater than or equal to 50 μm to adapt to large-size display panels 10.

[0137] Please refer to Figure 14 , Figure 14 is a partial cross-sectional view of a display panel in still another embodiment.

[0138] As Figure 14As shown, in some optional embodiments, the display panel 10 further comprises a polarizer 900 between the display panel 10 and the protective cover plate 800, the sidewall of the polarizer 900 is recessed relative to the substrate 100 and the protective cover plate 800 to form a recessed space 910, and the recessed space 910 is filled with a water-oxygen resistant structure 920.

[0139] In these optional embodiments, the edges of the substrate 100, the polarizer 900 and the protective cover plate 800 of the display panel 10 are not flush, for example, the sidewall of the polarizer 900 is recessed relative to the substrate 100 and the protective cover plate 800 to form a recessed space 910, water and oxygen are easy to gather in the recessed space 910 and invade the inside of the screen body, therefore, the recessed space 910 is filled with the water-oxygen resistant structure 920, which can isolate water and oxygen, cut off the invasion path of water and oxygen, and improve the packaging reliability of the display panel 10.

[0140] Optionally, the water-oxygen resistant structure 920 comprises glass glue.

[0141] Optionally, a glue layer 930 is arranged between the polarizer 900 and the protective cover plate 800, and the glue layer 930 is used for bonding the polarizer 900 and the protective cover plate 800. Optionally, the glue layer 930 comprises OCA (Optical Clear Adhesive) and the like.

[0142] In some optional embodiments, on the same cross section extending along the thickness direction of the display panel 10, the thickness of the second packaging sub-layer 610b is less than the thickness of the first packaging sub-layer 610a, and the ratio of the thickness of the second packaging sub-layer 610b to the thickness of the first packaging sub-layer 610a is less than or equal to 0.1. For example, the ratio of the thickness of the second packaging sub-layer 610b to the thickness of the first packaging sub-layer 610a is 0.02, 0.05, 0.08, 0.1 or the like.

[0143] In these optional embodiments, the ratio of the thickness of the second packaging sub-layer 610b to the thickness of the first packaging sub-layer 610a is less than or equal to 0.1, which can improve the problems that the ratio of the thickness of the second packaging sub-layer 610b to the thickness of the first packaging sub-layer 610a is too large, the thickness of the second packaging sub-layer 610b is too large, the material cost of the second packaging sub-layer 610b is too large, the overall film thickness of the display panel 10 is too large, or the thickness of the first packaging sub-layer 610a is too small, the packaging effect of the first packaging sub-layer 610a is poor, and the structural strength is low.

[0144] In some optional embodiments, the thickness of the second packaging sub-layer 610b ranges from 100A to 1000A. For example, the thickness of the second packaging sub-layer 610b is 100A, 600A, 800A, 1000A or the like.

[0145] In these optional embodiments, the thickness of the second encapsulation sub-layer 610b is greater than or equal to 100 A, which can improve the problems of high preparation accuracy, high preparation difficulty, poor encapsulation performance, and low structural strength of the second encapsulation sub-layer 610b, and cracks of the second encapsulation sub-layer 610b due to the too small thickness of the second encapsulation sub-layer 610b. The thickness of the second encapsulation sub-layer 610b is less than or equal to 1000 A, which can improve the problems of too large material cost of the second encapsulation sub-layer 610b and too large overall film thickness of the display panel 10 due to the too large thickness of the second encapsulation sub-layer 610b.

[0146] Optionally, the display panel 10 further includes a pixel definition layer 200 disposed on one side of the substrate 100, the pixel definition layer 200 including a pixel limiting portion 210 and a pixel opening 220 enclosed by the pixel limiting portion 210, the pixel opening 220 being configured to accommodate the light emitting unit 230. The pixel definition layer 200 includes the pixel limiting portion 210 and the pixel opening 220, the light emitting unit 230 is located in the pixel opening 220, and the pixel limiting portion 210 can improve the problem of light emitting crosstalk of adjacent light emitting units 230. The isolation structure 300 encloses an isolation opening 310, and the isolation opening 310 and the pixel opening 220 are correspondingly arranged, and the isolation structure 300 can further improve the problem of light emitting crosstalk of the light emitting unit 230.

[0147] Optionally, the substrate 100 is provided with a first electrode layer 400, the first electrode layer 400 including a plurality of first electrodes 410 arranged in an array, each first electrode 410 corresponding to each pixel opening 220, and the first electrode 410 being configured to drive the light emitting unit 230 to emit light. Part of the first electrode 410 is exposed by the pixel opening 220, and another part of the first electrode 410 is located between the pixel limiting portion 210 and the substrate 100.

[0148] The first electrode 410 can include a multilayer structure, such as a reflective layer and a pair of conductive oxide layers covering the upper surface and the lower surface of the reflective layer, respectively. The reflective layer can be formed of a metal material having excellent light reflectivity, such as silver. Each conductive oxide layer can be formed of a transparent conductive oxide such as ITO (Indium Tin Oxide), IZO (Indium Zinc Oxide), or IGZO (Indium Gallium Zinc Oxide). The second electrode 510 is formed of a metal material such as an alloy of magnesium and silver (MgAg).

[0149] The material of the pixel definition layer 200 can be set in various ways. For example, the material of the pixel definition layer 200 is an inorganic material, such as an inorganic insulating material formed by at least one of silicon nitride (SiNx), silicon oxide (SiOx), and silicon oxynitride (SiON).

[0150] Referring to Figure 15 , Figure 15 is a partial cross-sectional view of a display panel in another embodiment.

[0151] As shown in Figure 15 , in an embodiment, the pixel definition layer 200 includes a plurality of sub-layers, and the pixel definition layer 200 includes a first definition layer 201 and a second definition layer 202 stacked in sequence away from the substrate 100, that is, the pixel definition layer 200 can adopt a double-layer design.

[0152] For example, the film-forming property of the first definition layer 201 is better than that of the second definition layer 202. That is, under the condition of the same thickness, the first definition layer 201 can better cover the step structure formed by the first electrode 410 than the second definition layer 202, and will not produce cracks. Conversely, to obtain the same step coverage effect, the thickness of the first definition layer 201 is required to be thinner than that of the second definition layer 202, that is, the thickness of the first definition layer 201 is relatively low, which is beneficial to the thinness of the product, and in addition, good film-forming property means good coverage of the formed film, which is more compact and more conducive to water vapor isolation. That is, the material density of the first definition layer 201 is greater than that of the second definition layer 202.

[0153] For example, the etching resistance of the second definition layer 202 is better than that of the first definition layer 201. Since the side of the pixel definition layer 200 away from the substrate 100 will be etched during the preparation of the display panel 10, by selecting a material with better etching resistance as the second definition layer 202, the etching resistance of the pixel definition layer 200 can be improved, and the reliability of the display panel 10 can be further improved.

[0154] For example, the materials of the first definition layer 201 and the second definition layer 202 are different. For example, the material of the first definition layer 201 includes silicon nitride, and the material of the second definition layer 202 includes silicon oxide.

[0155] For example, the thickness of the first definition layer 201 is greater than or equal to 1000 microns and less than or equal to 5000 microns. For example, the thickness of the first definition layer 201 is 1000 microns, 2000 microns, 3000 microns, 4000 microns, 5000 microns, etc.

[0156] For example, the second defining layer 202 has a thickness of 500 microns, 1000 microns, 2000 microns, 3000 microns, or the like.

[0157] In some alternative embodiments, the isolation structure 300 includes a first sub-layer 301 and a second sub-layer 302 stacked in a direction away from the substrate 100, and the second sub-layer 302 is protrudingly arranged towards the isolation opening 310 relative to the first sub-layer 301.

[0158] In these alternative embodiments, the isolation structure 300 includes the first sub-layer 301 and the second sub-layer 302, and the second sub-layer 302 is protrudingly arranged towards the isolation opening 310 relative to the first sub-layer 301, so that an inner recess can be formed under the second sub-layer 302. In the preparation process of the light emitting unit 230, the light emitting material can be broken into independent light emitting units 230 at the edge of the second sub-layer 302.

[0159] Referring to Figure 16 , Figure 16 is a partial cross-sectional view of a display panel in yet another embodiment.

[0160] As Figure 16 shown, alternatively, the isolation structure 300 further includes a third sub-layer 303, which is located on a side of the first sub-layer 301 facing the substrate 100, and the third sub-layer 303 is protrudingly arranged towards the isolation opening 310 relative to the first sub-layer 301. In the preparation process of the isolation structure 300, the third sub-layer 303 can provide protection to the film layer on the side of the substrate 100 when side etching is performed on the first sub-layer 301.

[0161] Alternatively, the first sub-layer 301 and the second sub-layer 302 are made of different materials, and the etching rate of the first sub-layer 301 is lower than that of the second sub-layer 302. The material of the first sub-layer 301 includes a conductive material, which specifically includes at least one of aluminum (Al) and an aluminum alloy, and the aluminum alloy can include at least one of an aluminum-neodymium alloy (AlNd), an aluminum-yttrium alloy (AlY), or an aluminum-silicon alloy (AlSi). The second sub-layer 302 can be a single-layer structure or a multi-layer structure. When the second sub-layer 302 is a single-layer structure, the material of the second sub-layer 302 includes at least one of titanium, titanium nitride, molybdenum, tungsten, a molybdenum-tungsten alloy, or a molybdenum-niobium alloy. When the second sub-layer 302 is a multi-layer structure, one layer of the second sub-layer 302 includes at least one of titanium, titanium nitride, molybdenum, tungsten, a molybdenum-tungsten alloy, or a molybdenum-niobium alloy, and another layer of the second sub-layer 302 includes a conductive oxide or an inorganic insulating material, such as indium tin oxide (ITO) or indium zinc oxide (IZO).

[0162] Optionally, the material of the third sub-layer 303 comprises a conductive material, for example, the material of the third sub-layer 303 can comprise at least one of molybdenum (Mo), titanium (Ti), titanium nitride (TiN), molybdenum tungsten alloy (MoW), or molybdenum niobium alloy (MoNb).

[0163] Optionally, the display panel 10 further comprises a second electrode layer 500, the second electrode layer 500 comprises a second electrode 510 located on the side of each light emitting unit 230 away from the substrate 100. Optionally, the light emitting device is composed of the first electrode 410, the light emitting unit 230, and the second electrode 510. Optionally, the second electrode 510 is located in each isolation opening 310. Optionally, the second electrode 510 is electrically connected with the isolation structure 300. For example, the material of the first sub-layer 301 comprises a conductive material, and the second electrode 510 is electrically connected with the first sub-layer 301. Alternatively, the materials of the first sub-layer 301 and the third sub-layer 303 both comprise conductive materials, and the second electrode 510 is electrically connected with the third sub-layer 303 and the first sub-layer 301. Optionally, the second electrode 510 comprises a main body part and a contact part surrounding the main body part in a closed ring shape, and the contact part and the third sub-layer 303 are in contact with each other.

[0164] Optionally, at least one light emitting unit 230 comprises a hole injection layer HIL, a hole transport layer HTL, an electron blocking layer EBL, a light emitting material layer EML, a hole blocking layer HBL, an electron transport layer ETL, and an electron injection layer EIL stacked in the direction away from the substrate 100 (the thickness direction). The light emitting unit 230 can comprise one light emitting material layer EML, or a stacked light emitting structure comprising a plurality of light emitting material layers EML.

[0165] In the light emitting process of the light emitting unit 230, the first electrode 410 is used to generate holes, and the second electrode 510 is used to generate electrons, and the holes and the electrons combine in the light emitting unit 230 to make the light emitting unit 230 emit light. The first electrode 410 is in contact with the light emitting unit 230, and part of the light emitting unit 230 can be overlapped with the isolation structure 300, which can cause the holes to be crosstalked between adjacent light emitting units 230 through the light emitting unit 230 and the isolation structure 300. In the embodiment of the present application, the pixel defining part 210 is provided with a recess, which causes at least part of the light emitting unit 230 to be broken at the recess, thereby reducing the transmission area of the holes and improving the problem of lateral crosstalk.

[0166] In order to enable the light emitting unit 230 to emit light, the pixel voltage is provided to the first electrode 410 and the common voltage is provided to the second electrode 510, a potential difference is formed between the first electrode 410 and the second electrode 510, so that the light emitting structure arranged between the first electrode 410 and the second electrode 510 emits light. In one embodiment, if a potential difference is formed between the first electrode 410 and the second electrode 510 of the light emitting unit 230, the light emitting material layer EML of the light emitting unit 230 emits light.

[0167] The pixel voltage of the first electrode 410 is provided by the pixel driving circuit, and the common voltage of the second electrode 510 is provided by the isolation structure 300. Specifically, the second electrode 510 is electrically connected with the isolation structure 300, and the common voltage is supplied to the second electrode 510 by providing the common voltage to the isolation structure 300. That is, the isolation structure 300 has the function of supplying the common voltage to the second electrode 510.

[0168] The display panel 10 can further include at least one film layer such as a touch layer and a color film substrate 100. The film layer can also be bonded in the display panel 10 via an adhesive layer such as an optical clear adhesive (OCA). Optionally, the width of the signal line located in the non-display area NA is greater than the width of the signal area of the display area AA. Optionally, the substrate 100 further includes a gate drive circuit located in the non-display area NA, and the channel region size of the transistor of the gate drive circuit is greater than the channel region size of the transistor of the pixel driving circuit located in the display area, so as to ensure the transistor life of the gate drive circuit and improve the driving capability of the gate drive circuit.

[0169] Please refer to Figure 17 , Figure 17 is a schematic diagram of a pixel circuit provided by an embodiment of the present application.

[0170] Optionally, referring to Figure 17 , the pixel driving circuit includes a driving transistor T1 and a data transistor T2, the source of the data transistor T2 is connected with a data line providing a data signal Data, the gate of the data transistor T2 is connected with a scan line providing a scan signal Scan, the drain of the data transistor T2 is connected with the gate of the driving transistor T1, the two ends of a storage capacitor C1 are respectively connected to the gate and the source of the driving transistor T1, and the drain of the driving transistor T1 is connected to a light emitting device. Figure 16 is an embodiment of a pixel driving circuit, and the pixel driving circuit of the present application is not limited to Figure 16 the 2T1C pixel driving circuit shown in , but can also be other pixel driving circuits such as a 4T1C pixel driving circuit.

[0171] Figure 18 Please refer to Figure 18 ,is a partial cross-sectional view of a display panel in another embodiment.

[0172] As shown in Figure 18 The second aspect of the present application provides a display panel 10, which comprises: a substrate 100; an isolation structure 300 located on one side of the substrate 100, the isolation structure 300 enclosing a plurality of isolated openings 310; a light emitting device located on one side of the substrate 100 and comprising a first electrode 410, a light emitting unit 230 and a second electrode 510 arranged in layers, the light emitting device corresponding to the isolated openings 310; a first encapsulation layer 610 located on the side of the second electrode 510 away from the substrate 100; a second encapsulation layer 620 located on the side of the first encapsulation layer 610 away from the substrate 100, the material of the second encapsulation layer 620 comprising organic material; a third encapsulation layer 630 located on the side of the second encapsulation layer 620 away from the substrate 100, the material of the third encapsulation layer 630 comprising inorganic material; and a protective cover plate 800 located on the side of the third encapsulation layer 630 away from the substrate 100, the protective cover plate 800 and the substrate 100 being oppositely arranged, and a sealing structure 810 being arranged between the protective cover plate 800 and the substrate 100.

[0173] According to the display panel 10 of the present application, the display panel 10 comprises the substrate 100, the isolation structure 300, the light emitting device, the first encapsulation layer 610, the second encapsulation layer 620, the third encapsulation layer 630 and the protective cover plate 800. When the light emitting material is prepared, the light emitting material produces a large difference at the edge of the isolation structure 300, and the light emitting material is blocked at the edge of the isolation structure 300 to form mutually disconnected light emitting units 230, thereby reducing the crosstalk between the light emitting units 230 and improving the display effect of the display panel 10. Moreover, the light emitting units 230 can be prepared without using a precision mask plate, which can reduce the development and use of the precision mask plate and reduce the preparation cost. The first electrode 410 and the second electrode 510 serve as electrodes of the light emitting unit 230 to drive the light emitting of the light emitting unit 230. The first encapsulation layer 610, the second encapsulation layer 620 and the third encapsulation layer 630 form a three-layer thin film encapsulation (TFE) to improve the encapsulation performance of the display panel 10. Optionally, the material of the first encapsulation layer 610 comprises inorganic material. The second encapsulation layer 620 is formed on the side of the first encapsulation layer 610 away from the substrate 100 by printing or the like, which is used for planarization and stress relief. The protective cover plate 800 forms an airtight cavity through the sealing structure 810 to block the environmental water and oxygen. The first encapsulation layer 610, the second encapsulation layer 620 and the third encapsulation layer 630 form a three-layer thin film encapsulation. The protective cover plate 800 and the TFE form a hard encapsulation and a flexible encapsulation double encapsulation to further improve the encapsulation reliability of the display panel 10.

[0174] The manufacturing method of the display panel 10 of the present application will be described below.

[0175] Reference Figures 1 to 18 The preparation method of the display panel 10 comprises the following steps:

[0176] Step S11, providing a substrate 100.

[0177] Step S12, forming an isolation structure 300 on one side of the substrate 100, the isolation structure 300 encloses a plurality of isolation openings 310, the plurality of isolation openings 310 comprises a plurality of first isolation openings 310, a plurality of second isolation openings 310 and a plurality of third isolation openings 310.

[0178] Step S14, preparing a film layer of the first light emitting device, the film layer of the first light emitting device comprises a light emitting unit 230 layer and a second electrode layer 500 of the first light emitting device.

[0179] Step S15, preparing a first encapsulation sub-layer 610a of the first light emitting device. Since the film layer of the first light emitting device and the first encapsulation sub-layer 610a are both prepared as a whole layer, the positions of the plurality of first isolation openings 310, the plurality of second isolation openings 310 and the plurality of third isolation openings 310 are all provided with the film layer of the first light emitting device and the first encapsulation sub-layer 610a.

[0180] Step S16, etching and removing the film layer of the first light emitting device and the first encapsulation sub-layer 610a at the positions of the plurality of second isolation openings 310 and the plurality of third isolation openings 310, so as to form the light emitting unit 230 and the second electrode 510 of the first light emitting device and the first encapsulation sub-layer 610aa of the first light emitting device at the positions of the plurality of first isolation openings 310.

[0181] Based on the above steps S14 to S16, the light emitting unit 230 and the second electrode 510 of the second light emitting device and the first encapsulation sub-layer 610aa of the second light emitting device are respectively arranged at the positions of the plurality of second isolation openings 310, and the light emitting unit 230 and the second electrode 510 of the third light emitting device and the first encapsulation sub-layer 610aa of the third light emitting device are arranged at the positions of the plurality of third isolation openings 310.

[0182] Optionally, after the step of arranging the light emitting unit 230 and the second electrode 510 of the third light emitting device and the first encapsulation sub-layer 610aa of the third light emitting device at the positions of the plurality of third isolation openings 310, the preparation method comprises the following steps:

[0183] Step S17, preparing a second encapsulation sub-layer 610b on the side of the first encapsulation sub-layer 610a away from the substrate 100.

[0184] The second encapsulation sub-layer 610b is prepared by an atomic layer deposition (ALD) process, so that the density of the second encapsulation sub-layer 610b is greater than the density of the first encapsulation sub-layer 610a.

[0185] In some embodiments, step S17 is performed after the preparation of the light emitting devices of various colors. If step S17 is performed during the preparation of the light emitting devices, for example, between step S15 and step S16, in step S16, not only the film layer and the first encapsulation sub-layer 610a of the first light emitting device at the positions of the second isolation openings 310 and the third isolation openings 310 are etched and removed, but also the second encapsulation sub-layer 610b at the positions of the second isolation openings 310 and the third isolation openings 310 is removed. However, since the second encapsulation sub-layer 610b has a high density, it is more difficult to remove the second encapsulation sub-layer 610b. Therefore, the second encapsulation sub-layer 610b is prepared after the preparation of the light emitting devices of various colors, so that the preparation of the second encapsulation sub-layer 610b does not affect the preparation process of the light emitting devices.

[0186] Optionally, step S15 includes:

[0187] The first encapsulation sub-layer 610a and the second encapsulation sub-layer 610b of the first light emitting device are prepared. Since the film layer, the first encapsulation sub-layer 610a and the second encapsulation sub-layer 610b of the first light emitting device are all prepared as a whole, the film layer, the first encapsulation sub-layer 610a and the second encapsulation sub-layer 610b of the first light emitting device are present at the positions of the first isolation openings 310, the second isolation openings 310 and the third isolation openings 310.

[0188] Step S16 includes:

[0189] The film layer, the first encapsulation sub-layer 610a and the second encapsulation sub-layer 610b of the first light emitting device at the positions of the second isolation openings 310 and the third isolation openings 310 are etched and removed, so that the light emitting unit 230 and the second electrode 510 of the first light emitting device, the first encapsulation sub-layer 610aa of the first light emitting device, and the second encapsulation sub-layer 610ba of the first light emitting device are formed only at the positions of the first isolation openings 310.

[0190] Based on the steps S14 to S16, the light emitting unit 230 and the second electrode 510 of the second light emitting device, the first encapsulation sub-portion 610aa of the second light emitting device, and the second encapsulation sub-portion 610ba of the second light emitting device are respectively arranged at positions of the plurality of second isolation openings 310, and the light emitting unit 230 and the second electrode 510 of the third light emitting device, the first encapsulation sub-portion 610aa of the third light emitting device, and the second encapsulation sub-portion 610ba of the third light emitting device are respectively arranged at positions of the plurality of third isolation openings 310.

[0191] In some possible implementation manners, the present application further provides a display device, and the display device comprises the display panel 10 in the present application. The display device can comprise a device with image processing capability, for example, a mobile phone, a desktop computer, a notebook computer, a tablet computer, a vehicle-mounted display, a wearable device, etc. Since the display device comprises the display panel 10 in the present application, the reliability of the display device is higher.

[0192] In some possible implementation manners, the present application further provides a device, and the device comprises the display panel 10 in the present application. The device can comprise a device with image processing capability, for example, a television, a large-size display, etc. Since the device comprises the display panel 10 in the present application, the reliability of the device is higher.

[0193] In accordance with the embodiments of the present application as described above, the embodiments do not describe all the details, nor limit the present application to only the specific embodiments described. Obviously, many modifications and variations are possible in light of the above descriptions. The present application selects and specifically describes these embodiments in order to better explain the principles and practical applications of the present application, so that those skilled in the art can well utilize the present application and make modifications and uses on the basis of the present application. The present application is limited only by the claims and their full scope and equivalents.

Claims

1. A display panel, characterized in that, The display panel has a display area and a non-display area, wherein the non-display area surrounds at least a portion of the display area, or the non-display area is disposed around a light-transmitting hole, and the display panel includes: substrate; An isolation structure is located on one side of the substrate, and the isolation structure encloses and forms a plurality of isolation openings; A light-emitting device is located on one side of the substrate and includes a first electrode, a light-emitting unit, and a second electrode stacked together, wherein the light-emitting device is disposed corresponding to the isolation opening; A first encapsulation layer is located on the side of the second electrode away from the substrate. The first encapsulation layer includes a first encapsulation sublayer and a second encapsulation sublayer. The second encapsulation sublayer is located on the side of the first encapsulation sublayer away from the substrate. The first encapsulation sublayer includes a plurality of first encapsulation sub-parts. Wherein, the density of the second encapsulation sublayer is greater than that of the first encapsulation sublayer; The second encapsulation sublayer is continuously arranged, and the orthographic projection of multiple first encapsulation sub-parts on the substrate is located within the orthographic projection of the same second encapsulation sublayer on the substrate. The second encapsulation sublayer covers multiple first encapsulation sub-parts corresponding to the light-emitting units of different colors and the gap area between two adjacent first encapsulation sub-parts. The display panel also includes: The second encapsulation layer is located on the side of the first encapsulation layer away from the substrate, and the material of the second encapsulation layer includes organic materials; The third encapsulation layer is located on the side of the second encapsulation layer that is away from the substrate; The boundary of the second encapsulation layer is located within the orthographic projection of the second encapsulation sublayer onto the substrate. The boundary of the first encapsulation sublayer is located on the side of the isolation structure away from the substrate. The second encapsulation sublayer sequentially covers the boundary of the first encapsulation sublayer, the side of the isolation structure away from the substrate, and the sidewall of the isolation structure away from the display area. The second encapsulation sublayer extends from the display area to the non-display area. In the non-display area, the second encapsulation sublayer and the third encapsulation layer are contacted on the periphery of the second encapsulation layer. Both the second encapsulation sublayer and the third encapsulation layer include inorganic materials.

2. The display panel according to claim 1, characterized in that, The second encapsulation sublayer is projected onto the substrate in the same direction as the third encapsulation layer in the same direction as the substrate.

3. The display panel according to claim 1, characterized in that, The display panel also includes: A first wear-resistant layer is disposed on the outer surface of the third encapsulation layer opposite to the second encapsulation layer, and the wear rate of the first wear-resistant layer is less than the wear rate of the third encapsulation layer.

4. The display panel according to claim 3, characterized in that, The projection of the third encapsulation layer onto the substrate is located within the projection of the first wear-resistant layer onto the substrate.

5. The display panel according to claim 1, characterized in that, The display panel has a display area, the second encapsulation layer has a first thickness in the display area, the second encapsulation layer has a second thickness at the edge away from the display area, and the ratio of the second thickness to the first thickness is less than or equal to 0.

4.

6. The display panel according to claim 1, characterized in that, The display panel also includes: A dam is located in the non-display area, and the second encapsulation layer is located on the side of the dam facing the display area; The embankment is arranged around the isolation structure, or the boundary of the isolation structure is at least partially located on the embankment, or the boundary of the isolation structure is located outside the area enclosed by the embankment.

7. The display panel according to claim 6, characterized in that, The second encapsulation layer and the dam are spaced apart; or, the boundary of the second encapsulation layer is located on the sidewall of the dam facing the display area.

8. The display panel according to claim 6, characterized in that, The second encapsulation sublayer covers the sidewall of the isolation structure facing the dam.

9. The display panel according to claim 6, characterized in that, The dam may comprise a single layer or multiple layers of metallic material, or the dam may comprise metallic material and inorganic material, or the dam may comprise a single layer or multiple layers of organic material.

10. The display panel according to claim 1, characterized in that, The first encapsulation layer further includes a third encapsulation sublayer, which is located on the side of the second encapsulation sublayer away from the substrate, and the density of the second encapsulation sublayer is greater than that of the third encapsulation sublayer.

11. The display panel according to claim 10, characterized in that, On the same cross section extending along the thickness direction of the display panel, the thickness of the first encapsulation sub-layer is greater than the thickness of the second encapsulation sub-layer, and the thickness of the third encapsulation sub-layer is greater than the thickness of the second encapsulation sub-layer.

12. The display panel according to claim 10, characterized in that, The refractive index of the first encapsulation sublayer is greater than that of the second encapsulation sublayer, and the refractive index of the second encapsulation sublayer is greater than that of the third encapsulation sublayer.

13. The display panel according to claim 1, characterized in that, The display panel also includes: A protective cover is located on the side of the first encapsulation layer opposite to the substrate. The protective cover and the substrate are disposed opposite to each other, and a sealing structure is provided between the protective cover and the substrate.

14. The display panel according to claim 13, characterized in that, The protective cover, the substrate, and the sealing structure enclose a sealed space, and the light-emitting device and the isolation structure are both located within the sealed space, which is filled with inert gas.

15. The display panel according to claim 14, characterized in that, The display panel has a display area and a non-display area surrounding at least a portion of the display area, the non-display area including side borders located on both sides of the display area in a first direction and a bottom border located on one side of the display area in a second direction; Within the side bezel, the sealing structure is located on the side of the second encapsulation sublayer or the third encapsulation layer away from the display area; The display panel also includes a power signal line located at least partially within the lower bezel, wherein the sealing structure and the power signal line at least partially overlap in the orthographic projection of the substrate within the lower bezel.

16. The display panel according to claim 13, characterized in that, The second encapsulation layer is projected onto the substrate in a direction that is within the projection of the protective cover onto the substrate.

17. The display panel according to claim 13, characterized in that, The third encapsulation layer is projected onto the substrate in a direction within which the protective cover is projected onto the substrate.

18. The display panel according to claim 13, characterized in that, The distance between the boundary of the isolation structure and the sealing structure is greater than or equal to 50 μm.

19. The display panel according to claim 13, characterized in that, The display panel also includes a polarizer located between the display panel and the protective cover plate. The sidewall of the polarizer is recessed relative to the substrate and the protective cover plate to form a recessed space, and the recessed space is filled with a water- and oxygen-resistant structure.

20. The display panel according to claim 1, characterized in that, On the same cross section extending along the thickness direction of the display panel, the thickness of the second encapsulation sub-layer is less than the thickness of the first encapsulation sub-layer, and the ratio of the thickness of the second encapsulation sub-layer to the thickness of the first encapsulation sub-layer is less than or equal to 0.

1.

21. The display panel according to claim 1, characterized in that, The thickness of the second encapsulation sublayer ranges from 100A to 1000A.

22. A display panel, characterized in that, The display panel has a display area and a non-display area, wherein the non-display area surrounds at least a portion of the display area, or the non-display area is disposed around a light-transmitting hole, and the display panel includes: substrate; An isolation structure is located on one side of the substrate, and the isolation structure encloses and forms a plurality of isolation openings; A light-emitting device is located on one side of the substrate and includes a first electrode, a light-emitting unit, and a second electrode stacked together, wherein the light-emitting device is disposed corresponding to the isolation opening; A first encapsulation layer is located on the side of the second electrode away from the substrate. The first encapsulation layer includes a first encapsulation sublayer and a second encapsulation sublayer. The second encapsulation sublayer is located on the side of the first encapsulation sublayer away from the substrate. The first encapsulation sublayer includes a plurality of first encapsulation sub-parts. The second encapsulation sublayer is disposed as a whole. The orthographic projection of the first encapsulation sub-parts corresponding to the light-emitting units of different colors on the substrate is located within the orthographic projection of the same second encapsulation sublayer on the substrate. The second encapsulation layer is located on the side of the first encapsulation layer away from the substrate, and the material of the second encapsulation layer includes organic materials; The third encapsulation layer is located on the side of the second encapsulation layer away from the substrate, and the material of the third encapsulation layer includes inorganic materials; A protective cover is located on the side of the third encapsulation layer opposite to the substrate. The protective cover and the substrate are disposed opposite to each other, and a sealing structure is provided between the protective cover and the substrate. The display panel also includes: The second encapsulation layer is located on the side of the first encapsulation layer away from the substrate, and the material of the second encapsulation layer includes organic materials; The third encapsulation layer is located on the side of the second encapsulation layer that is away from the substrate; The boundary of the second encapsulation layer is located within the orthographic projection of the second encapsulation sublayer onto the substrate. The boundary of the first encapsulation sublayer is located on the side of the isolation structure away from the substrate. The second encapsulation sublayer sequentially covers the boundary of the first encapsulation sublayer, the side of the isolation structure away from the substrate, and the sidewall of the isolation structure away from the display area. The second encapsulation sublayer extends from the display area to the non-display area. In the non-display area, the second encapsulation sublayer and the third encapsulation layer are contacted on the periphery of the second encapsulation layer. Both the second encapsulation sublayer and the third encapsulation layer include inorganic materials.

23. A display device, characterized in that, Includes the display panel as described in any one of claims 1-22.

24. A display device, characterized in that, The display panel includes any one of claims 1-22.

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