Composition for temporary fixing, adhesive for temporary fixing, and method for producing thin wafer

Abstract

The present invention addresses the problem of providing a temporary fixing composition capable of suppressing re-fixing. The problem can be solved by a composition for temporary fixation, which contains the following (A)-(C): (A) a polymerizable component that contains (A-1) a (meth) acrylate that contains an acryloyl group in a side chain or (A-2) a (meth) acrylate that has acryloyl groups at both terminal sites of a molecular chain; (B) a photoradical polymerization initiator; and (C) an ultraviolet absorber having a polymerizable functional group.

Description

Technical Field

[0001] The present invention relates to a temporary fixing composition, a temporary fixing adhesive, and a method for producing a thin wafer. Background Art

[0002] When manufacturing electronic devices, wafer-type substrates with a thickness of several hundred μm are often used. These are obtained by using an inorganic material represented by silicone as a substrate and performing processes such as insulating film formation, circuit formation, and thinning by grinding on the surface. However, most substrates are made of brittle materials and easily break, so measures are required to prevent damage, especially when thinning by grinding. Regarding this measure, a method has been used in the past to attach a temporary fixing protective tape that can be peeled off after the processing step is completed to the surface opposite to the grinding object (also called the back side). This tape uses an organic resin film as a base material, which is soft, but on the other hand, it lacks strength or heat resistance and is not suitable for use in high-temperature processes.

[0003] Therefore, a system has been proposed that achieves sufficient durability to withstand the conditions of back-side grinding and back-side electrode formation by bonding an electronic device substrate to a support such as silicone or glass via an adhesive. The adhesive layer used to bond the substrate to the support is crucial. This adhesive layer must be sufficiently durable to bond the substrate to the support without gaps, withstand subsequent steps, and ultimately allow for easy peeling of the thinned wafer from the support, i.e., to provide temporary fixation.

[0004] In the processing of such a chip, the main processes include spin coating, vacuum bonding and photocuring, thinning by grinding and polishing, high-temperature treatment, laser stripping, and removal of a temporary fixing agent (hereinafter sometimes also referred to as a temporary fixing composition or a temporary fixing adhesive).

[0005] In order to uniformly form a film of the temporary fixing agent on the wafer during the spin coating process, the temporary fixing agent is required to have an appropriate viscosity and be a Newtonian fluid (or have shear viscosity independent of shear rate).

[0006] In the vacuum bonding / UV curing process, the temporary bonding agent is required to be cured in a short time by irradiation with ultraviolet (UV) light or the like on a support such as glass, and to generate little outgassing (low outgassing properties).

[0007] To prevent damage caused by localized load from the grinder applied to the substrate during thinning processes using grinding and polishing, the temporary adhesive must have appropriate hardness to distribute the load in-plane and prevent localized sinking of the substrate, thereby maintaining planarity. Furthermore, it must have good adhesion to the support, an appropriately high elastic modulus to protect the edges, and chemical resistance.

[0008] In the high-temperature treatment step, the temporary bonding agent is required to have heat resistance that can withstand long-term high-temperature treatment in a vacuum (for example, treatment at 300° C. or higher for more than one hour).

[0009] In the laser lift-off process, the temporary bonding agent is required to be able to be lifted off at high speed by a laser such as a UV laser.

[0010] In the removal process, in addition to easy peelability for easily peeling the substrate from the support, cohesive properties for preventing adhesive residue from remaining on the substrate after peeling and easy cleaning properties are also required.

[0011] Against this backdrop, for example, Patent Document 1 discloses a temporary fixing composition comprising: (A-1) a monofunctional (meth)acrylate having an alkyl group having 18 or more carbon atoms in its side chain and a homopolymer having a Tg of -100°C to 60°C; (A-2) a polyfunctional (meth)acrylate; (B) a polyisobutylene homopolymer and / or a polyisobutylene copolymer; and (C) a photoradical polymerization initiator. This temporary fixing composition is said to exhibit excellent heat resistance, low outgassing properties, and releasability.

[0012] Prior art literature

[0013] Patent Literature

[0014] Patent Document 1: International Publication No. 2021 / 235406 Summary of the Invention

[0015] When peeling a cured temporary bonding agent (i.e., adhesive layer) on a wafer, a laser is scanned and irradiated through a transparent support such as glass, decomposing the temporary bonding agent in the irradiated area, thereby forming a hole (a recessed portion covered by the support). The gas vaporized in the hole expands due to the high temperature, pushing up the support and facilitating peeling.

[0016] However, during the period from laser irradiation to the separation of the glass support from the wafer, the glass support may come into contact with the wafer due to its own weight, and the glass support and wafer may become reattached due to the adhesive properties of low-molecular components degraded from the temporary bonding agent. If this reattachment occurs, the releasability deteriorates, thereby degrading workability.

[0017] The present invention has been made in view of the above-mentioned problems. In one embodiment, an object of the present invention is to provide a temporary fixing composition that can suppress reattachment. In another embodiment, an object of the present invention is to provide a temporary fixing adhesive containing such a temporary fixing composition, and a method for manufacturing a thin wafer using the temporary fixing adhesive.

[0018] The present inventors, through intensive research, have discovered that the aforementioned problems can be solved by including a (meth)acrylate containing an acryloyl group in a side chain and / or a (meth)acrylate having acryloyl groups at both ends of the molecular chain as a polymerizable component. The present invention, which was completed based on this finding, is exemplified below. [1]

[0020] A temporary fixing composition comprising the following (A) to (C).

[0021] (A) contains the following polymerizable component (A-1) or (A-2),

[0022] (A-1) (meth)acrylate containing an acryloyl group in a side chain,

[0023] (A-2) (meth)acrylate having acryloyl groups at both ends of the molecular chain;

[0024] (B) a photoradical polymerization initiator;

[0025] (C) A UV absorber having a polymerizable functional group. [2]

[0027] The temporary fixing composition according to [1], wherein the viscosity of the temporary fixing composition is 500 mPa·s to 15000 mPa·s. [3]

[0029] The temporary fixing composition according to [1] or [2], wherein the component (A-1) or (A-2) has a Tg of -80°C to 0°C. [4]

[0031] The temporary fixing composition according to any one of [1] to [3], wherein the weight average molecular weight of the component (A-1) or the component (A-2) is 5,000 to 200,000. [5]

[0033] The temporary fixing composition according to any one of [1] to [4], wherein the temporary fixing composition comprises the component (A-1), wherein the component (A-1) is one or more selected from polybutyl (meth)acrylate, polyethyl (meth)acrylate, polyisoamyl (meth)acrylate, poly2-ethylhexyl (meth)acrylate, and polyisobornyl (meth)acrylate each containing an acryloyl group in a side chain. [6]

[0035] The temporary fixing composition according to any one of [1] to [5], wherein the temporary fixing composition comprises the component (A-2), wherein the component (A-2) is one or more selected from polybutyl (meth)acrylate, polyethyl (meth)acrylate, polyisoamyl (meth)acrylate, poly-2-ethylhexyl (meth)acrylate, and polyisobornyl (meth)acrylate having acryloyl groups at both ends of the molecular chain. [7]

[0037] The temporary fixing composition according to any one of [1] to [6], wherein the component (B) is one or more selected from bis(2,4,6-trimethylbenzoyl)phenylphosphine oxide, 2,4,6-trimethylbenzoyldiphenylphosphine oxide, and 1-[9-ethyl-6-(2-methylbenzoyl)-9H-carbazol-3-yl]ethanone 1-(O-acetoxime). [8]

[0039] The temporary fixing composition according to any one of [1] to [7], wherein the component (C) has one or more selected from a benzophenone skeleton, a triazole skeleton, a hydroxyphenyltriazine skeleton, and a phenol skeleton, and has a polymerizable functional group. [9]

[0041] The temporary fixing composition according to any one of [1] to [8], comprising 0.01 to 10 parts by mass of the component (B) and 0.01 to 15 parts by mass of the component (C) per 100 parts by mass of the component (A).

[10]

[0043] A temporary fixing adhesive comprising the temporary fixing composition according to any one of [1] to [9].

[11]

[0045] A method for manufacturing a thin wafer using the temporary fixing adhesive described in

[10] .

[12]

[0047] A composition comprising the following (A) to (C).

[0048] (A) contains the following polymerizable component (A-1) or (A-2),

[0049] (A-1) (meth)acrylate containing a (meth)acryloyl group in a side chain,

[0050] (A-2) (meth)acrylate having (meth)acryloyl groups at both ends of the molecular chain;

[0051] (B) a polymerization initiator;

[0052] (C) A UV absorber having a polymerizable functional group.

[0053] According to one embodiment of the present invention, a temporary fixing composition that can suppress reattachment can be provided. In other embodiments, the present invention can provide a temporary fixing adhesive containing such a temporary fixing composition, and a method for manufacturing a thin wafer using the temporary fixing adhesive. DETAILED DESCRIPTION

[0054] The present invention is not limited to the following embodiments, and it should be understood that appropriate design changes and improvements can be made based on the common knowledge of those skilled in the art without departing from the scope of the present invention.

[0055] In this specification, unless otherwise specified, the numerical range includes its upper limit and lower limit. In this specification, (meth)acrylate refers to a compound having one or more (meth)acryloyl groups in one molecule. Monofunctional (meth)acrylate refers to a compound having one (meth)acryloyl group in one molecule. Polyfunctional (meth)acrylate refers to a compound having two or more (meth)acryloyl groups in one molecule. N-functional (meth)acrylate refers to a compound having n (meth)acryloyl groups in one molecule. As a polymerizable functional group in the polyfunctional (meth)acrylate, it may have only an acryloyl group, may have only a methacryloyl group, or may have both an acryloyl group and a methacryloyl group.

[0056] In one embodiment, the present invention provides a temporary fixing composition containing the following (A) to (C).

[0057] (A) Containing the following polymerizable component (A-1) or (A-2)

[0058] (A-1) (Meth)acrylate containing a (meth)acryloyl group in the side chain

[0059] (A-2) (meth)acrylate having (meth)acryloyl groups at both ends of the molecular chain

[0060] (B) Polymerization initiator

[0061] (C) UV absorbers having polymerizable functional groups

[0062] In a preferred embodiment, the present invention provides a temporary fixing composition containing the following (A) to (C).

[0063] (A) Containing the following polymerizable component (A-1) or (A-2)

[0064] (A-1) (Meth)acrylate containing an acryloyl group in the side chain

[0065] (A-2) (meth)acrylate having acryloyl groups at both ends of the molecular chain

[0066] (B) Photoradical polymerization initiator

[0067] (C) UV absorbers having polymerizable functional groups

[0068] (1. (A) ingredient)

[0069] The polymerizable component (A) contained in the temporary fixing composition of this embodiment functions to form a (meth)acrylic acid polymer backbone. The polymerizable component (A) includes the following components (A-1) and / or (A-2), and may further optionally include a polymerizable compound (e.g., a polymerizable polymer) other than components (A-1) and (A-2).

[0070] The temporary fixing composition of this embodiment may also contain a non-polymerizable component. The amount of the non-polymerizable component is preferably less than 15 parts by mass per 100 parts by mass of the total of the non-polymerizable component and component (A). It should be noted that, as used herein, "non-polymerizable component" refers to a component that does not have a polymerizable functional group such as a polymerizable double bond, and examples thereof include non-polymerizable polymers. Components (A) to (C) are not included in the non-polymerizable component.

[0071] In this embodiment, the (meth)acrylate containing an acryloyl group in the side chain (A-1) may also be referred to as a polymerizable polymer containing an acryloyl group in the side chain (A-1). Furthermore, the (meth)acrylate containing an acryloyl group at both ends of the molecular chain (A-2) may also be referred to as a polymerizable polymer containing an acryloyl group at both ends of the molecular chain (A-2).

[0072] The component (A-1) is a (meth)acrylate containing an acryloyl group in the side chain, and may be a (meth)acrylate having two or more acryloyl groups in the side chain. The component (A-1) may be a monofunctional (meth)acrylate, a difunctional (meth)acrylate, or a trifunctional or higher multifunctional (meth)acrylate, or a mixture thereof. In addition, the component (A-1) may preferably include a combination of a multifunctional (meth)acrylate and a monofunctional (meth)acrylate, a combination of a multifunctional (meth)acrylate and a difunctional (meth)acrylate, or a combination of a multifunctional (meth)acrylate, a monofunctional (meth)acrylate, and a difunctional (meth)acrylate.

[0073] Furthermore, component (A-1) being a (meth)acrylate containing an acryloyl group in a side chain means that an acryloyl group is present in the side chain of the molecular chain. Without an acryloyl group, it functions as an adhesive, making it easy to reattach to the wafer due to its own weight. However, if it contains an acryloyl group, the acryloyl group polymerizes during curing, losing its adhesive function. It is speculated that even if the glass support contacts the wafer due to its own weight, reattachment can be suppressed. However, the present invention is not limited by theory.

[0074] Examples of (meth)acrylates containing an acryloyl group in a side chain include polybutyl (meth)acrylate, polyethyl (meth)acrylate, polymethyl (meth)acrylate, polyisoamyl (meth)acrylate, poly2-ethylhexyl (meth)acrylate, and polyisobornyl (meth)acrylate, which contain an acryloyl group in a side chain. Among these, polybutyl (meth)acrylate, polyethyl (meth)acrylate, polymethyl (meth)acrylate, and poly2-ethylhexyl (meth)acrylate are preferred. More preferred is polybutyl (meth)acrylate. Commercially available (meth)acrylates containing an acryloyl group in a side chain can also be used. For example, preferred are "HX7975" and "HX7975D" manufactured by Showa Denko Materials Co., Ltd.; "EBECRYL305," "KRM8912," and "KRM8981" manufactured by Daicel-Allnex; and "RA-341," "RA-331P," "OAP-2531," "MAP-2801," "RA-4101," "MAP-7000," "MAP-4050," "RA-3631," and "OAP-5000" manufactured by Negami Industries Co., Ltd. Commercially available products diluted with a solvent are preferably used after the solvent has been removed. "APB-001" manufactured by Negami Industries Co., Ltd. is also preferred.

[0075] In addition, the polybutyl (meth)acrylate containing an acryloyl group in the side chain and the like exemplified above refer to polymers having a polybutyl (meth)acrylate skeleton and a part of the side chain modified with an acryloyl group.

[0076] The Tg of the component (A-1) is preferably between -80°C and 0°C. In this application, by setting the Tg of the component (A-1) that can obtain a resin with appropriate hardness to be -80°C or higher, a resin with hardness can be obtained. From this viewpoint, the Tg of the component (A-1) is more preferably -70°C or higher, further more preferably -65°C or higher, further more preferably -60°C or higher. By setting the Tg of the component (A-1) to be below 0°C, a resin that can be peeled off without breaking even if the temporary fixing agent is bent during peeling can be obtained. From this viewpoint, the Tg of the component (A-1) is more preferably -5°C or lower, further more preferably -10°C or lower, further more preferably -20°C or lower, and particularly preferably -40°C or lower.

[0077] The weight average molecular weight of component (A-1) is preferably 5000 to 200000. By making the weight average molecular weight of component (A-1) 5000 or more, when combined with other polymerizable components, appropriate viscosity can be obtained. By making the weight average molecular weight of component (A-1) 10000 or more, an appropriate thickening effect can be obtained. From this viewpoint, the weight average molecular weight of component (A-1) is more preferably 6000 or more, and further more preferably 7000 or more. By making the weight average molecular weight of component (A-1) 200000 or less, good spin coating properties with low shear rate dependence can be obtained. From this viewpoint, the weight average molecular weight of component (A-1) is more preferably 190000 or less, further more preferably 180000 or less, further more preferably 150000 or less, and particularly preferably 100000 or less.

[0078] The functional group equivalent of the component (A-1) is preferably 500 to 20,000, more preferably 700 to 10,000, and most preferably 1,000 to 7,000.

[0079] It should be noted that the weight average molecular weight in this specification is a value converted to standard polystyrene measured by gel permeation chromatography (GPC). Specifically, the weight average molecular weight is determined by using tetrahydrofuran as a solvent and a GPC system (SC-8010 manufactured by TOSOH Corporation) under the following conditions, using a calibration curve made from commercially available standard polystyrene.

[0080] Flow rate: 1.0ml / min

[0081] Set temperature: 40℃

[0082] Column configuration: TSK-GEL MultiporeHXL-Mφ7.8×300mm (manufactured by TOSOH Corporation), exclusion limit 20,000,002

[0083] Sample injection volume: 100 μl (sample solution concentration 0.1% (wt / vol))

[0084] Liquid delivery pressure: 3.8MPa

[0085] Detector: RI detector (differential refractive index detector)

[0086] It should be noted that the glass transition temperature (Tg) in this specification is measured using a differential scanning calorimeter (DSC). The intersection of a straight line obtained by extending the baseline on the low temperature side of the DSC curve obtained during heating from this measurement toward the high temperature side and a tangent line drawn at the point where the gradient of the step-like change portion of the glass transition is the largest is defined as the glass transition temperature. Specific apparatus conditions are as follows. The glass transition temperature (Tg) in this specification is determined using the DSC value of heating (3).

[0087] Device: EXSTAR6000 (manufactured by Hitachi High-Tech Corporation)

[0088] Heating and cooling speed: 5℃ / min

[0089] Temperature conditions: increase from room temperature to 40°C and maintain for 5 minutes (temperature increase (1)), decrease from 40°C to -80°C and maintain for 5 minutes (temperature decrease (1)), increase from -80°C to 50°C (temperature increase (2)), decrease from 50°C to -80°C and maintain for 5 minutes (temperature decrease (1)), increase from -80°C to 50°C (temperature increase (3)).

[0090] Component (A-2) is a (meth)acrylate having acryloyl groups at both ends of the molecular chain. Component (A-2) may be a difunctional (meth)acrylate, a trifunctional or higher-functional (meth)acrylate, or a mixture thereof. Component (A-2) may preferably comprise a combination of a multifunctional (meth)acrylate and a difunctional (meth)acrylate.

[0091] What's crucial here is that component (A-2) is a (meth)acrylate with acryloyl groups at both ends of the molecular chain. Without acryloyl groups, it functions as an adhesive, making it easier to reattach to the wafer due to its own weight. However, if it contains acryloyl groups, the acryloyl groups polymerize during curing, losing their adhesive properties. This suggests that even when the glass support contacts the wafer due to its own weight, reattachment can be suppressed. However, the present invention is not limited by theory.

[0092] Examples of (meth)acrylates having acryloyl groups at both ends of the molecular chain include polybutyl (meth)acrylate, polyethyl (meth)acrylate, polyisoamyl (meth)acrylate, poly2-ethylhexyl (meth)acrylate, and polyisobornyl (meth)acrylate. Among these, polybutyl (meth)acrylate having acryloyl groups at both ends of the molecular chain is preferred. Furthermore, (meth)acrylates having acryloyl groups at both ends of the molecular chain can be obtained by various polymerization methods, which are not particularly limited. From the perspective of the versatility of the monomer and the ease of reaction control, free radical polymerization is preferred. Among free radical polymerizations, controlled radical polymerization is preferred, living radical polymerization is more preferred, and atom transfer radical polymerization is particularly preferred. In addition, methods for introducing (meth)acrylic groups into polymers of (meth)acrylic monomers as the main skeleton include: (1) a method of introducing by reacting a vinyl polymer having a hydroxyl group at the terminal with a (meth)acrylic acid ester compound containing chlorine, bromine, or a hydroxyl group; (2) a method of introducing by reacting a vinyl polymer having a halogen group at the terminal with a (meth)acrylic acid ester compound containing an alkali metal ion or a quaternary ammonium ion; (3) a method of reacting a vinyl polymer having a hydroxyl group at the terminal with a diisocyanate compound, and reacting the residual isocyanate group with a hydroxyl group-containing (meth)acrylic acid ester; etc. These methods are already known and are described in Japanese Patent Application Laid-Open No. 61-133201, Japanese Patent Application Laid-Open No. 11-80250, Japanese Patent Application Laid-Open No. 2000-38404, Japanese Patent Application Laid-Open No. 2001-271055, Japanese Patent Application Laid-Open No. 2002-69121, etc.

[0093] Examples of commercially available products include RC200C, RC110C, and RC100 manufactured by Kaneka Corporation, but the invention is not limited thereto.

[0094] The Tg of the component (A-2) is preferably between -80°C and 0°C. In this application, by setting the Tg of the component (A-2) that can obtain a resin with appropriate hardness to be -80°C or higher, a resin with hardness can be obtained. From this viewpoint, the Tg of the component (A-2) is more preferably -70°C or higher, further more preferably -65°C or higher, further more preferably -60°C or higher. By setting the Tg of the component (A-2) to 0°C or lower, a resin that can be peeled off without breaking even if the temporary fixing agent is bent during peeling can be obtained. From this viewpoint, the Tg of the component (A-2) is more preferably -5°C or lower, further more preferably -10°C or lower, further more preferably -20°C or lower, and particularly preferably -40°C or lower.

[0095] The weight average molecular weight of component (A-2) is preferably 5000 to 200000. By making the weight average molecular weight of component (A-2) 5000 or more, appropriate viscosity can be obtained when combined with other polymerizable components. By making the weight average molecular weight of component (A-2) 10000 or more, an appropriate viscosity-increasing effect can be obtained. From this viewpoint, the weight average molecular weight of component (A-2) is more preferably 6000 or more, and further more preferably 7000 or more. By making the weight average molecular weight of component (A-2) 200000 or less, good spin coating properties with low shear rate dependence can be obtained. From this viewpoint, the weight average molecular weight of component (A-2) is more preferably 190000 or less, further more preferably 180000 or less, further more preferably 150000 or less, further more preferably 100000 or less, further more preferably 50000 or less, and particularly preferably 30000 or less.

[0096] The functional group equivalent of the component (A-2) is preferably 500 to 20,000, more preferably 700 to 10,000, and most preferably 1,000 to 7,000.

[0097] In this specification, the term "polymerizable compound" refers to a polymerizable component having a (meth)acryloyl group other than the above-mentioned components (A-1) and (A-2). Preferred polymerizable compounds include monofunctional (meth)acrylates, difunctional (meth)acrylates, or trifunctional or higher-functional (meth)acrylates, or polymerizable polymers. Examples of polymerizable polymers include urethane acrylates and epoxy acrylates.

[0098] In a preferred embodiment, the total amount of the component (A-1) and the component (A-2) in the component (A) may be in the range of 10 to 100% by mass relative to the mass of the entire component (A). Specifically, the total amount of the component (A-1) and the component (A-2) relative to the mass of the entire component (A) may preferably be 10% by mass or more, 15% by mass or more, 20% by mass or more, 25% by mass or more, or 30% by mass or more. The total amount of the component (A-1) and the component (A-2) relative to the mass of the entire component (A) may preferably be 100% by mass or less, 90% by mass or less, 80% by mass or less, 70% by mass or less, 60% by mass or less, 50% by mass or less, or 40% by mass or less.

[0099] In a preferred embodiment, the mass ratio of the total of components (A-1) and (A-2) in component (A) to the polymerizable compound can be in the range of 1 to 50:100. In other embodiments, component (A) can contain both components (A-1) and (A-2), and the mass ratio of components (A-1) to (A-2) to the polymerizable polymer can be in the range of 5 to 20:5 to 30:100. When compounds belonging to both components (A-1) and (A-2) are included, they are not counted.

[0100] The content of component (A-1) is preferably 0 to 100% by mass relative to the total amount of component (A), 100% by mass. Specifically, the content of component (A-1) is preferably 0% by mass or more, 25% by mass or more, 40% by mass or more, 55% by mass or more, or 80% by mass or more relative to the total amount of component (A), 100% by mass. The content of component (A-1) is preferably 100% by mass or less, 85% by mass or less, 60% by mass or less, or 40% by mass or less relative to the total amount of component (A), 100% by mass or less.

[0101] The content of component (A-2) is preferably 0 to 100% by mass relative to the total amount of component (A), 100% by mass. Specifically, the content of component (A-1) is preferably 0% by mass or more, 10% by mass or more, 25% by mass or more, 40% by mass or more, or 55% by mass or more relative to the total amount of component (A), 100% by mass. The content of component (A-1) is preferably 100% by mass or less, 85% by mass or less, 60% by mass or less, or 40% by mass or less, relative to the total amount of component (A), 100% by mass.

[0102] The content of the other polymerizable compounds (A-3) other than components (A-1) and (A-2) is preferably 50 to 99% by mass relative to the total amount of component (A). Specifically, the content of component (A-1) is preferably 50% by mass or more, 55% by mass or more, 60% by mass or more, or 65% by mass or more relative to the total amount (100% by mass) of component (A). The content of component (A-1) is preferably 99% by mass or less, 95% by mass or less, 90% by mass or less, or 85% by mass or less relative to the total amount (100% by mass) of component (A).

[0103] In a preferred embodiment, the temporary fixing composition of the present embodiment may contain non-polymerizable components in an amount of 0% by mass or more and less than 10% by mass, or 0% by mass or more and less than 5% by mass. More preferably, the composition contains no non-polymerizable components.

[0104] Examples of the polymerizable compound (A-3) other than the polymerizable polymers (A-1) and (A-2) include aromatic difunctional (meth)acrylates, alicyclic difunctional (meth)acrylates, and acyclic difunctional (meth)acrylates.

[0105] Examples of aromatic difunctional (meth)acrylates preferably include 9,9-bis[4-(2-hydroxyethoxy)phenyl]fluorene di(meth)acrylate, ethoxylated bisphenol A di(meth)acrylate, benzyl di(meth)acrylate, 1,3-bis(2-(meth)acryloyloxy) C1-C 20 Compounds such as 2,2-bis(4-(meth)acryloyloxydiethoxyphenyl)propane and 2,2-bis(4-(meth)acryloyloxydiethoxyphenyl)propane are preferably included. Di(meth)acrylates having a fused ring skeleton, for example, a skeleton of fluorene, indene, indenene, anthracene, azulene, or terphenylene may be included.

[0106] Examples of alicyclic difunctional (meth)acrylates include EO (ethylene oxide)-modified hydrogenated bisphenol A di(meth)acrylate, 1,3-di(meth)acryloyloxyadamantane, tricyclic C 10 ~C 20 Alkanedimethanol di(meth)acrylate, bicyclic C5~C 20 Di(meth)acrylate, etc.

[0107] Examples of the acyclic difunctional (meth)acrylate include 1,3-butanediol di(meth)acrylate, 1,4-butanediol di(meth)acrylate, 1,6-hexanediol di(meth)acrylate, 1,9-nonanediol di(meth)acrylate, 1,10-decanediol di(meth)acrylate, neopentyl glycol di(meth)acrylate, caprolactone-modified hydroxypivalate neopentyl glycol di(meth)acrylate, and trimethylolpropane di(meth)acrylate.

[0108] Among these, it is more preferred to contain at least 9,9-bis[4-(2-hydroxyethoxy)phenyl]fluorene di(meth)acrylate, and further preferably to contain at least 9,9-bis[4-(2-hydroxyethoxy)phenyl]fluorene di(meth)acrylate and ethoxylated bisphenol A di(meth)acrylate.

[0109] Among these, it is more preferred to contain at least 9,9-bis[4-(2-hydroxyethoxy)phenyl]fluorene diacrylate, and further preferably to contain at least 9,9-bis[4-(2-hydroxyethoxy)phenyl]fluorene diacrylate and ethoxylated bisphenol A diacrylate.

[0110] (2. (B) Component)

[0111] The polymerization initiator as component (B) included in the temporary fixing composition of this embodiment is preferably a photoradical polymerization initiator, which is a substance capable of initiating polymerization of component (A) upon exposure to light. For example, a photoradical polymerization initiator is a compound whose molecules are cleaved and split into two or more radicals upon exposure to ultraviolet light or visible light (e.g., a wavelength of 350 to 700 nm, preferably 365 to 500 nm, and more preferably 385 to 450 nm). Examples of the photoradical polymerization initiator include bis(2,4,6-trimethylbenzoyl)phenylphosphine oxide, 2,4,6-trimethylbenzoyldiphenylphosphine oxide, bis(η5-2,4-cyclopentadien-1-yl)-bis(2,6-difluoro-3-(1H-pyrrol-1-yl)-phenyl)titanium, 2-benzyl-2-dimethylamino-1-(4-morpholinophenyl)-butan-1-one, 2-dimethylamino-2-(4-methylbenzyl)-1-(4-morpholin-4-ylphenyl)-butan-1-one, 1-[4-(phenylthio)phenyl]-1,2-octanedione 2-O-benzoyl oxime, and 1-[9-ethyl-6-(2-methylbenzoyl)-9H-carbazol-3-yl]ethanone 1-(O-acetyl oxime). The component (B) may contain one or more of these or a combination of two or more of these.

[0112] In a preferred embodiment of the present invention, the (B) component contained in the temporary fixing composition may contain an acylphosphine oxide compound. As preferred acylphosphine oxide compounds, bis(2,4,6-trimethylbenzoyl)phenylphosphine oxide and 2,4,6-trimethylbenzoyldiphenylphosphine oxide can be mentioned. As a photoradical polymerization initiator, from the perspective of high sensitivity and light fading, it is preferred that the deep curing property is excellent, and the absorption wavelength region for generating free radicals is expanded to a longer wavelength region. The absorption wavelength region of the above-mentioned preferred compound reaches a wavelength range of about 440nm, which is significantly different from the absorption wavelength region of the UV absorber used in the UV laser stripping process described later. In other words, the UV absorber inhibits UV curing to a lesser extent, and light with a longer wavelength can be used to initiate free radical polymerization. Therefore, even in the coexistence of a UV absorber, the effect of efficiently initiating free radical polymerization at a faster speed and thus curing can be obtained.

[0113] In a preferred embodiment, the photoradical polymerization initiator can be selected based on absorbance. Specifically, the photoradical polymerization initiator can be selected from one or more compounds that meet any one or more of the following conditions: when dissolved at a concentration of 0.1% by mass in a solvent that does not have a maximum absorption in the wavelength range of 300 to 500 nm (such as acetonitrile, toluene, etc.), the absorbance at a wavelength of 365 nm is 0.5 or more, the absorbance at a wavelength of 385 nm is 0.5 or more, and the absorbance at a wavelength of 405 nm is 0.5 or more. Examples of compounds satisfying such conditions include 1-[9-ethyl-6-(2-methylbenzoyl)-9H-carbazol-3-yl]ethanone 1-(O-acetoxime), which has an absorbance of 0.5 or greater at a wavelength of 365 nm when dissolved in acetonitrile as a solvent at a concentration of 0.1% by mass; 1-[4-(phenylthio)phenyl]-1,2-octanedione 2-O-benzoyloxime, which has an absorbance of 0.5 or greater at wavelengths of 365 nm and 385 nm; and bis(2,4,6-trimethylbenzoyl)phenylphosphine oxide and 2,4,6-trimethylbenzoyldiphenylphosphine oxide, which have absorbances of 0.5 or greater at wavelengths of 365 nm, 385 nm, and 405 nm.

[0114] In addition, from the perspective of achieving both the curing properties brought by the photoradical polymerization initiator and UV laser stripping, bis(η5-2,4-cyclopentadien-1-yl)-bis(2,6-difluoro-3-(1H-pyrrol-1-yl)-phenyl)titanium having an absorption wavelength region in the range of 400 to 500 nm can also be used as a photoradical polymerization initiator.

[0115] The photoradical polymerization initiator (B) is preferably selected from one or more of an acylphosphine oxide compound, a titanocene compound, or an α-aminoalkylphenyl ketone compound from the perspectives of reaction speed, heat resistance after curing, low outgassing, and absorption characteristics in a region different from both the wavelength of the UV laser used in UV laser stripping described below and the absorption wavelength region of the UV absorber used in the same UV laser stripping. Furthermore, in the temporary fixing composition having the following structure, an oxime ester compound may be selected as a photoradical polymerization initiator for a resin composition used for temporary fixing to prevent damage from the bonding to a supporting substrate (or support) of the substrate to be processed until the heating step, rather than for use in the layer corresponding to the UV laser stripping step.

[0116] Examples of the acylphosphine oxide-based compounds include bis(2,4,6-trimethylbenzoyl)phenylphosphine oxide and 2,4,6-trimethylbenzoyldiphenylphosphine oxide. Among these, bis(2,4,6-trimethylbenzoyl)phenylphosphine oxide is particularly preferred.

[0117] Examples of the titanocene-based compound include bis(η5-2,4-cyclopentadien-1-yl)-bis(2,6-difluoro-3-(1H-pyrrol-1-yl)-phenyl)titanium.

[0118] Examples of the α-aminoalkylphenone compounds include 2-benzyl-2-dimethylamino-1-(4-morpholinophenyl)-butan-1-one and 2-dimethylamino-2-(4-methylbenzyl)-1-(4-morpholin-4-ylphenyl)-butan-1-one.

[0119] Examples of oxime ester compounds include 1-[4-(phenylthio)phenyl]-1,2-octanedione 2-O-benzoyloxime and 1-[9-ethyl-6-(2-methylbenzoyl)-9H-carbazol-3-yl]ethanone 1-(O-acetoxime). Among these, 1-[9-ethyl-6-(2-methylbenzoyl)-9H-carbazol-3-yl]ethanone 1-(O-acetoxime) is preferred.

[0120] In a preferred embodiment of the present invention, component (B) in the temporary fixing composition is one or more selected from bis(2,4,6-trimethylbenzoyl)phenylphosphine oxide, 2,4,6-trimethylbenzoyldiphenylphosphine oxide, and 1-[9-ethyl-6-(2-methylbenzoyl)-9H-carbazol-3-yl]ethanone 1-(O-acetoxime).

[0121] From the perspectives of reaction speed, heat resistance after curing, and low outgassing properties, the amount of the photoradical polymerization initiator (B) used is preferably 0.01 to 10 parts by mass, more preferably 0.01 to 5 parts by mass, even more preferably 0.1 to 2 parts by mass, and even more preferably 0.1 to 1 part by mass, relative to 100 parts by mass of the total of component (A). If the amount of component (B) is 0.01 parts by mass or more, sufficient curing properties are achieved, while if it is 10 parts by mass or less, the effects of low outgassing properties and heat resistance are not significantly impaired.

[0122] (3.(C) Component)

[0123] The ultraviolet absorber (UV absorber) having a polymerizable functional group as component (C) contained in the temporary fixing composition of this embodiment refers to a compound whose molecules are cut by irradiation with ultraviolet rays or visible light lasers, decomposing and gasifying. Since this decomposition and gasification occur at the interface between the supporting substrate (or support) and the temporary fixing agent, the adhesion between the temporary fixing agent and the supporting substrate (or support) is lost until the UV laser stripping process is performed. Component (C) is a compound having one or more selected from a benzophenone skeleton, a triazole skeleton, a hydroxyphenyltriazine skeleton, and a phenol skeleton (preferably a hindered phenol skeleton). These skeletons are present in order to obtain the degree of overlap between the UV absorption wavelength region and the UV laser wavelength, the UV absorption characteristics at this wavelength, low degassing, and heat resistance. The polymerizable functional group possessed by component (C) is preferably a (meth)acryloyl group.

[0124] Examples of the component (C) include, from the viewpoints of compatibility with the resin component, UV absorption properties, low outgassing properties, and heat resistance, particularly preferably one or more selected from the group consisting of 2-[2-hydroxy-5-[2-((meth)acryloyloxy)ethyl]phenyl]-2H-benzotriazole, 2-[1-(2-hydroxy-3,5-di-tert-pentylphenyl)ethyl]-4,6-di-tert-pentylphenyl (meth)acrylate, 2-(2-(meth)acryloyloxy, 5-methyl)phenyl-2H-benzotriazole, 1,1-bis-[2-(meth)acryloyloxy, 3-(2H-benzotriazol-2-yl), 5-tert-octyl]methane, and 2,2'-dihydroxy-4,4'-di(meth)acryloyloxybenzophenone.

[0125] The amount of component (C) is preferably 0.01 to 15 parts by mass, more preferably 0.1 to 10 parts by mass, even more preferably 0.5 to 9.5 parts by mass, and even more preferably 0.5 to 7 parts by mass relative to 100 parts by mass of the total components of (A). If the amount is 0.01 parts by mass or more, a sufficient UV laser stripping rate can be achieved, while if it is 15 parts by mass or less, the effects of low outgassing properties and heat resistance can be achieved without compromising.

[0126] (4. Adhesive for temporary fixation)

[0127] The temporary fixing composition of the present invention can be used as a temporary fixing adhesive, particularly as a temporary fixing adhesive for manufacturing electronic devices such as thin wafers. The temporary fixing adhesive is preferably composed solely of the temporary fixing composition of the present invention.

[0128] (5. Method for Manufacturing Thin Wafer)

[0129] In another embodiment, the present invention also provides a method for manufacturing a thin wafer using the temporary fixing adhesive of the present invention. The method comprises: applying the temporary fixing adhesive to a supporting substrate (or support); adhering a substrate to be processed to the supporting substrate (or support) on the surface of the supporting substrate (or support) coated with the temporary fixing adhesive; thinning the substrate to be processed; and peeling the supporting substrate (or support) and the substrate to be processed by irradiating the substrate with a UV laser.

[0130] As a coating method for the temporary fixing adhesive, known coating methods such as spin coating, screen printing, and various coating machines can be used. From the perspective of coating properties or workability, the viscosity of the temporary fixing composition of this embodiment is preferably 500 mPa·s or more at 23°C (atmospheric pressure), and more preferably 1000 mPa·s or more. From the perspective of coating properties or workability, the viscosity of the temporary fixing composition of this embodiment is preferably 15000 mPa·s or less at 23°C (atmospheric pressure), more preferably 10000 mPa·s or less, and even more preferably 5000 mPa·s or less. If it is 500 mPa·s or more, the coating properties, especially the coating properties by spin coating, are excellent. If it is 15000 mPa·s or less, the workability is excellent. The viscosity can be measured using a known viscometer.

[0131] Spin coating is a method for coating a composition on a support substrate (or support) by dripping a liquid composition onto the support substrate (or support) and rotating the support substrate (or support) at a predetermined speed. Spin coating can efficiently produce high-quality coating films.

[0132] When bonding the substrate to be processed to the supporting substrate (or support), it is preferable to use an energy amount of 1 to 20,000 mJ / cm 2 Visible light or ultraviolet light (wavelength or center wavelength 365-405nm) is irradiated in the form of 2 If the above is 20000mJ / cm, sufficient adhesion can be obtained. 2 From the perspectives of productivity, adhesion, low outgassing, and easy peeling, the preferred range is 1000 to 10000 mJ / cm. 2 .

[0133] The substrate to be processed and the supporting substrate (or support) are not particularly limited, but preferably at least one substrate is a light-transmitting transparent substrate. Examples of transparent substrates include inorganic substrates such as crystal, glass, quartz, calcium fluoride, and magnesium fluoride; and organic substrates such as plastics. Among these, inorganic substrates are preferred due to their versatility and the ability to achieve good results. Among inorganic substrates, at least one selected from glass and quartz is preferred.

[0134] After the substrate to be processed has been thinned by grinding and polishing and subjected to high-temperature treatment, it can be irradiated with UV laser light from the optically transparent substrate side of the adhesive, scanning the entire surface to achieve peeling. As described above, the use of the temporary fixing composition of the present invention can suppress reattachment between the support and the thin wafer, thus preventing a decrease in workability even when a certain amount of time is allowed between UV laser irradiation and peeling.

[0135] Example

[0136] The present invention will be described in more detail below based on Examples and Comparative Examples, but the present invention is not limited thereto.

[0137] Unless otherwise specified, the experiment was conducted at 23°C and 50% humidity. Temporary fixing compositions (hereinafter sometimes referred to as liquid compositions) having the compositions shown in the following table (units are parts by mass) were prepared and evaluated. The following compounds were selected as the components.

[0138] (Synthesis of Compound: α-1)

[0139] Ethyl acetate and azobisisobutyronitrile (AIBN) were placed in a 2L four-necked round-bottom flask. While refluxing, n-butyl acrylate (BA) and 2-hydroxyethyl acrylate (2HEA) were added dropwise over a period of 2 hours. Then, ethyl acetate and AIBN were added appropriately and the mixture was reacted for 7.5 hours to obtain a hydroxyl-containing acrylic resin (α-0) solution (the monomer components of the hydroxyl-containing acrylic resin (α-0) are BA:2HEA=90:10 (molar ratio), and the solid content is 40 wt%).

[0140] A hydroxyl-containing acrylic resin (α-0), 99 mol% of 2-isocyanate ethyl acrylate (AOI) relative to 100 mol% of 2HEA in the hydroxyl-containing acrylic resin (α-0), and dibutyltin dilaurate as a urethanization catalyst are appropriately added, and the mixture is reacted at 50°C for 18 hours while stirring. The ethyl acetate is removed to obtain an acrylic resin (α-1) containing multiple acryloyl groups in the side chain.

[0141] (Identification of Compounds)

[0142] The obtained α-1 was dissolved in deuterated chloroform (reagent grade manufactured by Tokyo Chemical Industry Co., Ltd.) to adjust to a 3% by mass solution, and then subjected to 1H nuclear magnetic resonance (1H-NMR) measurement. The obtained data are as follows.

[0143] δ=6.45~6.40, 6.16~6.09, 5.85~5.83, 4.25~4.23, 4.03~4.02, 3.52~3.48, 2.27, 1.90, 1.59, 1.38~1.34, 0.95~0.15

[0144] This result supports the structure of α-1.

[0145] (Synthesis of Compound: α-2)

[0146] Cuprous bromide (0.625 g, 15.6 mmol), acetonitrile (5.0 mL), and pentamethyldiethylenetriamine (0.91 mL) were placed in a 100 mL three-necked round-bottom flask equipped with a reflux tube, and the atmosphere was purged with nitrogen. n-Butyl acrylate (50 mL, 44.7 g, 0.39 mol) and diethyl 2,5-dibromoadipate (1.57 g, 4.36 mmol) were added, and the mixture was heated and stirred at 70°C for 7 hours. The mixture was diluted with ethyl acetate and treated with activated alumina. Volatiles were distilled off under reduced pressure to obtain polybutyl acrylate with halogen groups at both ends. Next, the obtained polybutyl acrylate with halogen groups at both ends (35.0 g), potassium salt of 4-pentenoic acid (2.23 g, 16.1 mmol), and dimethylacetamide (35 mL) were placed in a 200 mL three-necked round-bottom flask equipped with a reflux tube, and the mixture was reacted at 70°C for 4 hours under a nitrogen atmosphere. The mixture was diluted with ethyl acetate and washed with 2% hydrochloric acid and brine. The organic layer was dried over Na2SO4, and the volatiles were distilled off under reduced pressure to isolate the polymer. An amount of aluminum silicate (KYOWAAD 700PEL, manufactured by Kyowa Chemical) equal to the polymer was added and stirred at 100°C for 4 hours to obtain polybutyl acrylate (α-2) having acryloyl groups at both terminals.

[0147] (composition)

[0148] As the component (A-1), the following were used.

[0149] APB-001 (multifunctional acrylate polymer, manufactured by Negami Industries, Ltd., “APB-001”, weight average molecular weight 72,000, functional group equivalent weight 1,400, Tg: -45°C)

[0150] Synthesized polymer α-1 (multifunctional acrylate polymer, weight average molecular weight 78,000, Tg: -50°C)

[0151] As the component (A-2), the following were used.

[0152] RC110C (a polymer with acrylate esters at both ends, manufactured by Kaneka Corporation, “RC110C”, weight average molecular weight 12,000, functional group equivalent weight 6,000, Tg: -50°C)

[0153] Synthesized polymer α-2 (acrylic acid ester polymer at both ends, weight average molecular weight 12000, Tg: -54°C)

[0154] As other polymerizable polymers, the following were used.

[0155] A-BPEF-2: 9,9-bis[4-(2-hydroxyethoxy)phenyl]fluorene diacrylate ("NK ESTER A-BPEF-2" manufactured by Shin-Nakamura Chemical Industry Co., Ltd.)

[0156] A-BPE-2: Ethoxylated bisphenol A diacrylate ("NK ESTER A-BPE-2" manufactured by Shin-Nakamura Chemical Industry Co., Ltd., wherein R = -CH2CH2O-, m = n = 1)

[0157]

[0158] HBPE-4: EO-modified hydrogenated bisphenol A diacrylate ("HBPE-4" manufactured by Daiichi Kogyo Seiyaku Co., Ltd., m+n≈4)

[0159] A-DOD-N: 1,10-decanediol diacrylate ("A-DOD-N" manufactured by Shin-Nakamura Chemical Co., Ltd.)

[0160] HX-620: Caprolactone-modified hydroxypivalate neopentyl glycol diacrylate ("KAYARAD HX-620" manufactured by Nippon Kayaku Co., Ltd., m+n≈4)

[0161] HX-220: Caprolactone-modified hydroxypivalate neopentyl glycol diacrylate ("KAYARAD HX-220" manufactured by Nippon Kayaku Co., Ltd., m+n≈2)

[0162] A-TMPT: trimethylolpropane triacrylate ("A-TMPT" manufactured by Shin-Nakamura Chemical Industry Co., Ltd.)

[0163] M-113: Nonylphenol EO-modified acrylate (Toagosei Co., Ltd., "Aronix M-113," n≈4)

[0164] ISTA: Isostearyl acrylate ("ISTA" manufactured by Osaka Organic Chemical Industry Co., Ltd.)

[0165] As the component (B), bis(2,4,6-trimethylbenzoyl)phenylphosphine oxide ("Omnirad 819" manufactured by IGM RESINS) was used.

[0166] As the component (C), the following were used.

[0167] RUVA-93: 2-[2-hydroxy-5-[2-(methacryloyloxy)ethyl]phenyl]-2H-benzotriazole ("RUVA-93" manufactured by Otsuka Chemical Co., Ltd.)

[0168] P-66: 2,2'-dihydroxy-4,4'-diacryloyloxybenzophenone ("DAINSORB P-66" manufactured by Yamato Chemical Industry Co., Ltd.)

[0169] The weight average molecular weight of each component was determined by using tetrahydrofuran as a solvent under the following conditions using a GPC system (SC-8010 manufactured by TOSOH Corporation) and preparing a calibration curve using commercially available standard polystyrene.

[0170] Flow rate: 1.0ml / min

[0171] Set temperature: 40℃

[0172] Column configuration: TSK-GEL MultiporeHXL-Mφ7.8×300mm (manufactured by TOSOH Corporation), exclusion limit 20,000,002

[0173] Sample injection volume: 100 μl (sample solution concentration 0.1% (wt / vol))

[0174] Liquid delivery pressure: 3.8MPa

[0175] Detector: RI detector (differential refractive index detector)

[0176] The glass transition temperature (Tg) of each component was measured using a differential scanning calorimeter (DSC). The intersection of a straight line extending the baseline on the low temperature side of the DSC curve obtained during heating from this measurement toward the high temperature side and a tangent line drawn at the point where the gradient of the step-like change in the glass transition is the largest was determined as the glass transition temperature. Specific apparatus conditions are as follows. The glass transition temperature (Tg) was determined using the DSC value of the heating (3).

[0177] Device: EXSTAR6000 (manufactured by Hitachi High-Tech Corporation)

[0178] Heating and cooling speed: 5℃ / min

[0179] Temperature conditions: increase from room temperature to 40°C and maintain for 5 minutes (temperature increase (1)), decrease from 40°C to -80°C and maintain for 5 minutes (temperature decrease (1)), increase from -80°C to 50°C (temperature increase (2)), decrease from 50°C to -80°C and maintain for 5 minutes (temperature decrease (1)), increase from -80°C to 50°C (temperature increase (3)).

[0180] (Liquid sample preparation)

[0181] As shown in Table 1, for each comparative example and example, the materials were heated and mixed at 60°C to form a uniform liquid composition to obtain a temporary fixing composition. The viscosity of each composition was measured by the following method according to JIS Z 8803:2011. The results are shown in Table 1.

[0182] (Evaluation of viscosity)

[0183] Measuring device: E-type viscometer DV3T-HB (manufactured by Eikon Seiki Co., Ltd.)

[0184] Measuring fixture: Cone-plate CPA-40Z (manufactured by Eikon Seiki Co., Ltd.)

[0185] Measurement temperature: 23°C

[0186] Speed: 10 rpm (500 mPa·s to 2500 mPa·s); 2 rpm (2501 mPa·s to 10000 mPa·s)

[0187] (Joint sample production)

[0188] The prepared liquid composition was used to bond a 4-inch silicon wafer (10 cm in diameter x 0.47 mm in thickness) to a 4-inch glass support (10 cm in diameter x 0.7 mm in thickness). During bonding, the thickness of the liquid composition was adjusted to 50 μm. After bonding, the LED with a wavelength of 405 nm was used to generate a cumulative light intensity of 5000 mJ / cm 2 The liquid composition was applied to the entire surface of the bonding surface.

[0189] (Another evaluation)

[0190] The obtained test piece was irradiated with UV laser light from the glass support side. A UV laser QLA-355 manufactured by Quark Technology was used with an output of 8.5 W, a frequency of 40 kHz, a scanning pitch of 200 μm, and a beam diameter of 200 μm. After a predetermined time had passed, the peeling force was measured according to the following method.

[0191] A blade was placed against the perimeter of the laser-irradiated test piece to remove any protruding portions. With the silicon wafer facing downward, the test piece was placed and secured on a multi-hole suction cup-type suction table. Three suction cups with a diameter of 30 mm were attached from above to the glass surface of the test piece. A load measurement module was attached to each suction cup, and the load applied to the glass, which was pulled vertically upward, was measured. Multiple test pieces were prepared for each comparative example and example, and the time until the peeling force reached 15 N or greater was defined as the time until reattachment.

[0192] [Table 1]

[0193]

[0194] The unit of the amount used is part by mass.

[0195] The results in Table 1 show that the temporary fixing composition of the present invention has a long time until reattachment and is excellent in workability.

[0196] On the other hand, in the comparative example containing neither the component (A-1) nor the component (A-2), the time until re-adhesion was short, and workability was found to be poor depending on the working conditions.

Claims

1. A temporary fixing composition comprising the following (A) to (C): (A) contains the following polymerizable component (A-1) or (A-2), (A-1) (meth)acrylate containing an acryloyl group in a side chain, (A-2) (meth)acrylate having acryloyl groups at both ends of the molecular chain; (B) a photoradical polymerization initiator; (C) A UV absorber having a polymerizable functional group.

2. The temporary fixing composition according to claim 1, wherein The temporary fixing composition has a viscosity of 500 mPa·s to 15000 mPa·s.

3. The temporary fixing composition according to claim 1 or 2, wherein The Tg of the component (A-1) or (A-2) is -80 to 0°C.

4. The temporary fixing composition according to claim 1 or 2, wherein The weight average molecular weight of the component (A-1) or the component (A-2) is 5,000 to 200,000.

5. The temporary fixing composition according to claim 1 or 2, wherein The temporary fixing composition includes the component (A-1), which is one or more selected from polybutyl (meth)acrylate, polyethyl (meth)acrylate, polyisoamyl (meth)acrylate, poly2-ethylhexyl (meth)acrylate, and polyisobornyl (meth)acrylate containing an acryloyl group in a side chain.

6. The temporary fixing composition according to claim 1 or 2, wherein The temporary fixing composition contains the component (A-2), which is one or more selected from polybutyl (meth)acrylate, polyethyl (meth)acrylate, polyisoamyl (meth)acrylate, poly2-ethylhexyl (meth)acrylate, and polyisobornyl (meth)acrylate having acryloyl groups at both ends of the molecular chain.

7. The temporary fixing composition according to claim 1 or 2, wherein The component (B) is one or more selected from bis(2,4,6-trimethylbenzoyl)phenylphosphine oxide, 2,4,6-trimethylbenzoyldiphenylphosphine oxide, and 1-[9-ethyl-6-(2-methylbenzoyl)-9H-carbazol-3-yl]ethanone 1-(O-acetoxime).

8. The temporary fixing composition according to claim 1 or 2, wherein The component (C) has one or more selected from the group consisting of a benzophenone skeleton, a triazole skeleton, a hydroxyphenyltriazine skeleton, and a phenol skeleton, and has a polymerizable functional group.

9. The temporary fixing composition according to claim 1 or 2, wherein The component (B) is contained in an amount of 0.01 to 10 parts by mass, and the component (C) is contained in an amount of 0.01 to 15 parts by mass, relative to 100 parts by mass of the total of the component (A). 10 . A temporary fixing adhesive comprising the temporary fixing composition according to claim 1 .

11. A method for manufacturing a thin wafer, comprising using the temporary fixing adhesive according to claim 10.

12. A composition comprising the following (A) to (C): (A) contains the following polymerizable component (A-1) or (A-2), (A-1) (meth)acrylate containing a (meth)acryloyl group in a side chain, (A-2) (meth)acrylate having (meth)acryloyl groups at both ends of the molecular chain; (B) a polymerization initiator; (C) A UV absorber having a polymerizable functional group.

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