Display device using light emitting element package

Abstract

The present invention is applicable to the technical field related to display devices, and relates to a light emitting element package and a display device using, for example, a light emitting diode (LED). The present invention as described above may be configured to include: a first layer in which a terminal portion is provided; a second layer positioned adjacent to the first layer and including light emitting elements and first filler particles, the light emitting elements constituting unit sub-pixels; a third layer positioned adjacent to the second layer, transmitting light emitted from the light emitting element, and including second filler particles; and a connection electrode positioned between the first layer and the second layer to selectively connect the light emitting element to the terminal portion.

Description

Technical Field

[0001] The present disclosure is applicable to a technical field related to a display apparatus, and relates to, for example, a light emitting device package and a display apparatus using a light emitting diode (LED). Background Art

[0002] In recent years, in the field of display technology, display devices with excellent characteristics such as ultra-thinness and flexibility have been developed. On the other hand, the main displays currently commercialized are represented by LCDs (Liquid Crystal Displays) and OLEDs (Organic Light Emitting Diodes).

[0003] On the other hand, light emitting diodes (LEDs) are well-known semiconductor light emitting elements that convert electric current into light, and began with the commercialization of red LEDs using GaAsP compound semiconductors in 1962. They are used as light sources for displaying images in electronic devices including information and communication devices, and GaP:N-based green LEDs.

[0004] Recently, these light emitting diodes (LEDs) have been gradually miniaturized and manufactured as micrometer-sized LEDs to be used as pixels of display devices.

[0005] Compared to other display devices / panels, this micro-LED technology exhibits low power consumption, high brightness, and high reliability, and is also suitable for flexible devices. Therefore, it has been actively studied by research institutions and companies in recent years.

[0006] Due to the characteristics of LEDs such as high brightness and high reliability, the market scope of LED displays is expanding. Among these applications, the most significant area leading the market is signage displays.

[0007] In such displays, LEDs can be manufactured in packages that can serve as unit pixels. When using mini-LEDs with millimeter-scale dimensions, these LED packages typically include a support layer containing a sapphire substrate. Typically, this support layer can be relatively thicker than the light-emitting layer containing the LED.

[0008] Figure 1 is a schematic diagram illustrating viewing angle distribution in an example of a display apparatus using a general-purpose light-emitting device. Figure 2 is a schematic diagram illustrating another example of a display device using a general-purpose light-emitting device.

[0009] refer to Figure 1 In a display device 1 using light sources 20, 30, and 40 employing light-emitting devices such as mini LEDs, the light sources 20, 30, and 40 may be disposed on a substrate 50, and an insulating layer 60 may be positioned to cover areas between the light sources 20, 30, and 40.

[0010] In the case where the refractive index between the substrate of the light sources 20, 30 and 40 (e.g., a sapphire substrate) and the insulating layer 60 surrounding the substrate is different, the optical path of the light sources 20, 30 and 40 may be laterally restricted, causing the brightness of each of the light sources 20, 30 and 40 to vary depending on the angle at which the user views the display device.

[0011] refer to Figure 1 , light sources 20, 30, and 40 emitting light of different colors may have different thicknesses. In an example, the thicknesses of the semiconductor layers 21, 31, and 41 of the light sources 20, 30, and 40 may be different, and the thicknesses of the substrates 22, 32, and 42 may also be different.

[0012] In this case, the difference in thickness of substrates 22, 32, and 42 and the size difference of semiconductor layers 21, 31, and 41 may cause a change in the orientation angle. In one example, the amount of light emitted to the side is proportional to the thickness of substrates 22, 32, and 42, which may cause large light loss.

[0013] In order to overcome this phenomenon, Figure 2 As shown, a lens-shaped scattering layer 61 may be provided on the substrates 22 , 32 , and 42 of the light sources 20 , 30 , and 40 .

[0014] The light sources 20 , 30 , and 40 using light emitting devices such as mini LEDs have Lambertian light characteristics in which the amount of light decreases smoothly with angle if light is emitted only from a flat surface of the light sources 20 , 30 , and 40 .

[0015] However, LEDs have various orientation angle shapes according to various shape structures, and RGB LEDs with different material compositions also have structural differences, such as different side shapes.

[0016] Even in a light source in the form of a light-emitting device package including micro-LEDs, the orientation angle of light emitted to the outside of the light source in the form of a light-emitting device package may differ between the light sources 20, 30, and 40 depending on the electrode pads of the micro-LEDs, the structure of the semiconductor layer, the structure surrounding the micro-LEDs, etc. As a result, there is a problem in that the color temperature of the display varies depending on the viewing angle of the viewer.

[0017] Therefore, a method that can solve this problem is needed. Summary of the Invention

[0018] Technical issues

[0019] An aspect of the present disclosure is to provide a light emitting device package capable of minimizing a change in color temperature due to a change in a viewing angle of a viewer viewing a display, and a display apparatus using the same.

[0020] Meanwhile, the present disclosure provides a light emitting device package capable of improving light emitting efficiency and a display apparatus using the same.

[0021] In one example, the present disclosure provides a light emitting device package capable of minimizing light loss due to side emission due to a smaller thickness than a mini LED when a light emitting device such as a micro LED is used, and a display apparatus using the same.

[0022] Furthermore, those skilled in the art will appreciate from the overall description and drawings that additional aspects not mentioned herein may exist according to other embodiments of the present disclosure.

[0023] Technical Solution

[0024] As a first aspect for achieving the above-mentioned purpose, the present disclosure provides a light-emitting device package, which includes: a first layer, the first layer having a terminal portion; a second layer, the second layer positioned adjacent to the first layer, the second layer including light-emitting devices each constituting a unit sub-pixel, the second layer including first filler particles; a third layer, the third layer positioned adjacent to the second layer, the third layer configured to allow light emitted from the light-emitting device to pass through the third layer, the third layer including second filler particles; and a connecting electrode, the connecting electrode being located between the first layer and the second layer, the connecting electrode configured to selectively connect the light-emitting device to the terminal portion.

[0025] As an exemplary embodiment, at least one of the first filler particles and the second filler particles may include particles having a nano-scale or micro-scale size.

[0026] As an exemplary embodiment, the refractive index of the first filler particles may be greater than the refractive index of the second filler particles.

[0027] As an exemplary embodiment, the third layer may include a transparent insulating layer including the second filler particles.

[0028] As an exemplary embodiment, the light emitting device package may further include a structure layer including a pattern defining a shape of the third layer.

[0029] As an exemplary embodiment, the pattern may be positioned to correspond to the position of the light emitting device.

[0030] As an exemplary embodiment, the pattern may include a plurality of patterns having a constant size.

[0031] As an exemplary embodiment, the pattern may have a lens shape.

[0032] As an exemplary embodiment, a size of the pattern may be smaller than a width of the light emitting device.

[0033] As an exemplary embodiment, the light emitting device package may further include a pillar structure located in the pattern.

[0034] As an exemplary embodiment, the light emitting device package may further include a high refractive index inorganic film having a higher refractive index than the second filler particles at a side surface of the pattern.

[0035] As an exemplary embodiment, the second layer may further include a light-adjusting portion configured to wrap around a side surface of the light-emitting device.

[0036] As an exemplary embodiment, the connection electrode may have a reflective cup shape configured to reflect light emitted from the light emitting device in a direction toward the third layer.

[0037] As a second aspect to achieve the above-mentioned object, the present disclosure provides a light-emitting device package, comprising: a support layer having a terminal portion; a light-emitting layer positioned adjacent to the support layer, the light-emitting layer comprising light-emitting devices each constituting a unit sub-pixel, the light-emitting layer comprising first filler particles; a scattering layer positioned adjacent to the light-emitting layer, the scattering layer configured to allow light emitted from the light-emitting devices to pass through the scattering layer, the scattering layer being located in a transparent insulating layer, the scattering layer comprising second filler particles having a refractive index smaller than that of the first filler particles; and a connecting electrode positioned between the support layer and the light-emitting layer, the connecting electrode configured to selectively connect the light-emitting devices to the terminal portion.

[0038] As an exemplary embodiment, the light emitting device package may further include a structure layer including a pattern defining a shape of the scattering layer.

[0039] As a third aspect for achieving the above-mentioned purpose, the present disclosure provides a display device, which includes a light-emitting device package that defines each pixel, wherein the light-emitting device package includes: a first layer, the first layer having a terminal portion; a second layer, the second layer positioned adjacent to the first layer, the second layer including light-emitting devices each constituting a unit sub-pixel, the second layer including first filler particles; a third layer, the third layer positioned adjacent to the second layer, the third layer configured to allow light emitted from the light-emitting device to pass through the third layer, the third layer including second filler particles; and a connecting electrode, the connecting electrode being located between the first layer and the second layer, the connecting electrode configured to selectively connect the light-emitting device to the terminal portion.

[0040] Beneficial effects

[0041] According to the embodiment of the present disclosure, there are the following effects.

[0042] First, according to the embodiments of the present disclosure, a change in color temperature due to a change in the viewing angle of a viewer viewing a display may be minimized.

[0043] At the same time, the light emitting efficiency of light emitting devices such as micro LEDs can be improved.

[0044] In an example, when a light emitting device such as a micro LED is used, light loss due to side emission due to a smaller thickness than the mini LED may be minimized.

[0045] In addition, according to other embodiments of the present disclosure, there are additional technical effects not mentioned herein, and those skilled in the art will understand these additional technical effects from the entire specification and drawings. BRIEF DESCRIPTION OF THE DRAWINGS

[0046] Figure 1 is a schematic diagram illustrating viewing angle distribution in an example of a display apparatus using a general-purpose light-emitting device.

[0047] Figure 2 is a schematic diagram illustrating another example of a display device using a general-purpose light-emitting device.

[0048] Figure 3 is a plan view showing a light emitting device package according to a first embodiment of the present disclosure.

[0049] Figure 4 It is along Figure 1 A cross-sectional view taken along line AA'.

[0050] Figure 5 is a plan view showing a terminal portion side of the light emitting device package according to the first embodiment of the present disclosure.

[0051] Figure 6 and Figure 7 is a sectional view showing a modification of the light emitting device package according to the first embodiment of the present disclosure.

[0052] Figure 8 is a sectional view of a light emitting device package according to a second embodiment of the present disclosure.

[0053] Figure 9 and Figure 10 is a sectional view showing a modification of the light emitting device package according to the second embodiment of the present disclosure.

[0054] Figure 11 is a sectional view of a light emitting device package according to a third embodiment of the present disclosure.

[0055] Figures 12 to 20 is a sectional view showing a modification of the light emitting device package according to the third embodiment of the present disclosure.

[0056] Figure 21 is a graph showing orientation angle distribution of a light emitting device package according to an embodiment of the present disclosure.

[0057] Figure 22 is a graph showing color coordinate distribution of a light emitting device package according to an embodiment of the present disclosure.

[0058] Figure 23 is a schematic cross-sectional view illustrating a display apparatus using a light emitting device package according to a first embodiment of the present disclosure.

[0059] Figure 24 is a schematic cross-sectional view illustrating a display apparatus using a light emitting device package according to a second embodiment of the present disclosure. DETAILED DESCRIPTION

[0060] Reference will now be made in detail to the embodiments of the present disclosure, examples of which are shown in the accompanying drawings. Where possible, the same reference numerals will be used in all drawings to refer to the same or similar parts, and redundant descriptions thereof will be omitted. As used herein, the suffixes "module" and "unit" may be added or used interchangeably to facilitate the preparation of this specification and are not intended to imply unique meanings or functions. When describing the embodiments disclosed in this specification, in order not to obscure the subject matter of the embodiments disclosed in this specification, the relevant known technologies may not be described in detail. In addition, it should be noted that the drawings are only for the purpose of facilitating the understanding of the embodiments disclosed in this specification and should not be interpreted as limiting the technical spirit disclosed in this specification.

[0061] Furthermore, although the drawings are described individually for simplicity, embodiments implemented by combining at least two or more drawings are also within the scope of the present disclosure.

[0062] Further, when an element such as a layer, region, or module is referred to as being “on” another element, it should be understood that the element can be directly on the other element or intervening elements may be present therebetween.

[0063] In addition, the semiconductor light emitting device mentioned in this specification is a concept including LEDs, micro LEDs, etc., which can be used in a mixed manner.

[0064] Figure 3 is a plan view showing a light emitting device package according to a first embodiment of the present disclosure. Figure 4 It is along Figure 1 A cross-sectional view taken along line AA'. Figure 5 is a plan view showing a terminal portion side of the light emitting device package according to the first embodiment of the present disclosure.

[0065] Reference Figures 3 to 5 , shows a bottom emission type light emitting device package 200 in which light is emitted in a downward direction. Figure 3 A light emitting surface of a bottom emission type light emitting device package 200 is shown.

[0066] The light-emitting device package 200 according to the first embodiment may include: a first layer 210 (support layer) having terminal portions 211, 212, 213 and 214; a second layer 220 (light-emitting layer) positioned adjacent to the first layer 210 and including light-emitting devices 261, 262 and 263 (260) each constituting a unit sub-pixel; and a third layer 230 (scattering layer) positioned adjacent to the second layer 220 and configured to allow light emitted from the light-emitting device 260 to pass through the third layer 230 (scattering layer).

[0067] In an example, the light emitting device package 200 according to the first embodiment may include a scattering layer 230, a light emitting layer 220 located on the scattering layer 230 and including light emitting devices 261, 262 and 263 (260) each constituting a unit sub-pixel, and a support layer 210 having terminal portions 211, 212, 213 and 214.

[0068] At least one of the first to third layers 210 to 230 may include filler particles. If filler particles are included in at least two of the first to third layers 210 to 230, at least one of the material, particle size, and content may vary in each layer. The filler particles included in at least one of the first to third layers 210 to 230 may have a refractive index of 1.3 or greater.

[0069] In an example, the second layer 220 may include first filler particles 221. The first filler particles 221 may include a plurality of particles having a size in the nanometer (nm) level or the micrometer (μm) level.

[0070] In an example, the third layer 230 may include second filler particles 231. The second filler particles 231 may include a plurality of particles having a nano-scale or micro-scale size.

[0071] At least one of the first filler particles 221 and the second filler particles 231 may include at least one of metal oxides, resin particles, and inorganic oxides. In an example, at least one of the first filler particles 221 and the second filler particles 231 may include at least one of TiO2, ZnO2, ZrO2, MgF2, SnO2, ITO, SiNx, silicon dioxide, and PMMA.

[0072] The first filler particles 221 may be used in the second layer 220 for at least one of the purpose of improving a viewing angle according to a light emitting angle of the light emitting device 260 to prevent color temperature deviation and the purpose of increasing reflectivity.

[0073] Meanwhile, in the third layer 230, the second filler particles 231 may be used to improve efficiency and viewing angle. In this case, the turbidity and reflectivity of the third layer 230 may be lower than those of the second layer 220. If the same particles are applied, the particle content of the third layer 230 may be less than that of the second layer 220.

[0074] Therefore, the refractive index of the first filler particles 221 may be greater than the refractive index of the second filler particles 231. In one example, the refractive index of the first filler particles 221 may be 2.0 to 2.7. In another example, the refractive index of the second filler particles 231 may be 1.4 to 1.5.

[0075] In another example, the second layer 220 including the first filler particles 221 may have a transmittance of 0 to 70%. In another example, the third layer 230 including the second filler particles 231 may have a transmittance of 50 to 100%.

[0076] At least one of the first to third layers 210 to 230 may include a transparent insulating layer. In one example, at least one of the first to third layers 210 to 230 may be made of at least one of acrylic, epoxy, silicone, Teflon, silicone-acrylic, and silicone-epoxy composite materials. In one example, the first to third layers 210 to 230 may be configured such that the first filler particles 221 and the second filler particles 231 are dispersed using a material such as an adhesive.

[0077] In one example, the refractive index of the transparent insulating layer constituting at least one of the first to third layers 210 to 230 may be 1.5 or less, and the refractive index of at least one of the first filler particles 221 and the second filler particles 231 may be 1.6 or greater. In one example, at least one of the first filler particles 221 and the second filler particles 231 may include at least one of TiO2, ZnO2, and ZrO2.

[0078] Connection electrodes 271 , 272 , 273 , and 274 selectively connecting the light emitting devices 261 , 262 , and 263 ( 260 ) to the terminal portions 211 , 212 , 213 , and 214 may be disposed between the first layer 210 and the second layer 220 .

[0079] The first electrode 264 (eg, P electrode) and the second electrode 265 (eg, N electrode) of each of the light emitting devices 261, 262, and 263 (260) may be electrically bonded to the first and second connection electrodes 272 and 274, respectively, by solder.

[0080] refer to Figure 4 Connection electrodes 271, 272, 273, and 274 selectively connecting the light emitting devices 261, 262, and 263 (260) to the terminal portions 211, 212, 213, and 214 may be located on the first boundary surface RDL1. The terminal portions 211, 212, 213, and 214 may be located on the upper surface RDL2 of the first layer 210.

[0081] At least one of the connection electrodes 271, 272, 273, and 274 may be manufactured using a redistribution layer (RDL) process used in a semiconductor packaging process. The light emitting device 260 may be connected to the connection electrodes 271, 272, 273, and 274 using the RDL process.

[0082] The light emitting device 260 may include a first light emitting device 261, a second light emitting device 262, and a third light emitting device 263 (see Figure 3 In one example, the first light emitting device 261 may be a red light emitting device R, the second light emitting device 262 may be a green light emitting device G, and the third light emitting device 263 may be a blue light emitting device B. In some cases, at least one of the first light emitting device 261, the second light emitting device 262, and the third light emitting device 263 may include two or more light emitting devices.

[0083] When the light emitting device package 200 is used in a display device, each of the first, second, and third light emitting devices 261, 262, and 263 may correspond to a respective sub-pixel and together constitute a unit pixel.

[0084] The light emitting device 260 may be a mini LED having a size of millimeter level or a micro LED having a size of micrometer level.

[0085] Although not shown, the light emitting device package 200 may further include a driving device configured to drive the light emitting devices 261, 262, and 263 (260). The driving device may be a micro driver integrated circuit (IC) chip that can selectively drive the light emitting device 260. In this case, the driving device may be connected to at least one of the light emitting devices 261, 262, and 263 and the connection electrodes 271, 272, 273, and 274. A detailed description thereof will be omitted.

[0086] Due to its reduced overall size, the light emitting device 260 (e.g., a micro-LED) has a non-negligible ratio of side-emitting light to front-emitting light. To change the light path from the side to the front of the light emitting device 260, the incident angle of light can be adjusted by changing the shape and side angle of the micro-LED chip.

[0087] In addition, if the scattering layer 230 including the second filler particles 231 as described above is applied, light emitted from the light emitting devices 261, 262 and 263 (260) can be scattered in the scattering layer 230 including the second filler particles 231, thereby minimizing color temperature changes due to changes in the viewing angle of the display.

[0088] Meanwhile, if the light emitting layer 220 including the first filler particles 221 is used, light emitted from the light emitting devices 261, 262, and 263 (260) may be reflected and scattered, thereby improving light emitting efficiency of the light emitting devices 260 (eg, micro LEDs).

[0089] In one example, if the light emitting device 260 such as a micro LED is used, light loss caused by side emission may be minimized due to a small thickness compared to a mini LED.

[0090] Figure 6 and Figure 7 is a sectional view showing a modification of the light emitting device package according to the first embodiment of the present disclosure.

[0091] Reference Figure 6, the light emitting devices 261, 262, and 263 (260) included in the light emitting layer 220 may be located on the scattering layer 230 in a state of being bonded by the adhesive layer 240. In an example, the adhesive layer 240 to which the lower surfaces of the light emitting devices 261, 262, and 263 (260) are bonded may be located between the scattering layers 230.

[0092] refer to Figure 7 , may further include a transparent separation layer 241 configured to separate the adhesive layer 240 and the scattering layer 230 from each other. The transparent separation layer 241 may separate the optical structures of the light emitting layer 220 and the scattering layer 230.

[0093] Figure 8 is a sectional view of a light emitting device package according to a second embodiment of the present disclosure.

[0094] Reference Figure 8 , the light emitting device package 200 according to the second embodiment may be a top emission package emitting light in an upward direction.

[0095] In one example, the light-emitting device package 200 according to the second embodiment may include: a first layer 215 (support layer) having terminal portions 211, 212, 213 and 214; a second layer 222 (light-emitting layer) located on the first layer 215 and including light-emitting devices 261, 262 and 263 (260) each constituting a unit sub-pixel; and a third layer 232 (scattering layer) positioned adjacent to the second layer 222 and configured to allow light emitted from the light-emitting device 260 to pass through the third layer 232 (scattering layer).

[0096] At least one of the first to third layers 215, 232 may include filler particles. If filler particles are included in at least two of the first to third layers 215, 232, at least one of the material, particle size, and content may vary in each layer. The filler particles included in at least one of the first to third layers 215, 232 may have a refractive index of 1.3 or greater.

[0097] In one example, the second layer 222 may include first filler particles 221. The first filler particles 221 may include a plurality of particles having a size in the nanometer (nm) level or the micrometer (μm) level.

[0098] In one example, the third layer 232 may include second filler particles 231. The second filler particles 231 may include a plurality of particles having a nano-scale or micro-scale size.

[0099] The first filler particles 221 may be used in the second layer 222 for at least one of the purpose of improving a viewing angle according to a light emitting angle of the light emitting device 260 to prevent color temperature deviation and the purpose of increasing reflectivity.

[0100] Meanwhile, in the third layer 232, the second filler particles 231 may be used to improve efficiency and viewing angle. In this case, the turbidity and reflectivity of the third layer 232 may be lower than those of the second layer 222. If the same particles are applied, the particle content of the third layer 232 may be lower than that of the second layer 222.

[0101] In one example, the second layer 222 including the first filler particles 221 may have a transmittance of 0 to 70%. In another example, the third layer 232 including the second filler particles 231 may have a transmittance of 50 to 100%.

[0102] The description of the first filler particles 221 and the second filler particles 231 may be the same as that in the above-described first embodiment, and therefore, redundant description will be omitted.

[0103] At least one of the first layer 215, the second layer 222, and the third layer 232 may include a transparent insulating layer. In an example, at least one of the first layer 215, the second layer 222, and the third layer 232 may be made of at least one of acrylic, epoxy, silicone, Teflon, a silicone-acrylic, and silicone-epoxy composite materials. In one example, the first layer 215, the second layer 222, and the third layer 232 may be configured such that the first filler particles 221 and the second filler particles 231 are dispersed using such a material as a binder.

[0104] In one example, the refractive index of the transparent insulating layer constituting at least one of the first layer 215 , the second layer 222 , and the third layer 232 may be 1.5 or less, and the refractive index of at least one of the first filler particles 221 and the second filler particles 231 may be 1.6 or greater.

[0105] Connection electrodes 271 , 272 , 273 , and 274 selectively connecting the light emitting devices 261 , 262 , and 263 ( 260 ) to the terminal portions 211 , 212 , 213 , and 214 may be provided between the first layer 215 and the second layer 222 .

[0106] The first electrode 264 (eg, P electrode) and the second electrode 265 (eg, N electrode) of each of the light emitting devices 261, 262, and 263 (260) may be electrically bonded to the first and second connection electrodes 272 and 274, respectively, by solder.

[0107] The description of the first embodiment given above can be equally applied to parts not described.

[0108] Figure 9 and Figure 10is a sectional view showing a modification of the light emitting device package according to the second embodiment of the present disclosure.

[0109] refer to Figure 9 The third layer (scattering layer) 233 through which light emitted from the light emitting device 260 passes may have a lens shape. The lens-shaped scattering layer 233 may include second filler particles 231 .

[0110] The lens-shaped scattering layer 233 may be manufactured using lens pattern formation by photolithography and a shape flow effect by thermal curing.

[0111] refer to Figure 10 , a third layer 234 (scattering layer) having a rough surface constituting the light extraction structure 235 may be provided. The third layer 234 (scattering layer) including the light extraction structure 235 may include second filler particles 231 .

[0112] The description of the first embodiment and the second embodiment given above can be equally applied to parts that are not described.

[0113] Figure 11 is a sectional view of a light emitting device package according to a third embodiment of the present disclosure.

[0114] Reference Figure 11 , shows a bottom emission type light emitting device package 200 in which light is emitted in a downward direction, as in the light emitting device package 200 according to the above-described first embodiment.

[0115] The light emitting device package 200 according to the third embodiment may further include a scattering layer 236 and a structure layer 242 including a pattern 244 defining a shape of the scattering layer 236 , in addition to the structures of the light emitting layer 220 and the support layer 210 .

[0116] In one example, the light-emitting device package 200 according to the third embodiment may include: a structure layer 242 including patterns 244; a scattering layer 236 located between the patterns 244; a light-emitting layer 220 located on the scattering layer 236 and including light-emitting devices 261, 262, and 263 (260) each constituting a unit sub-pixel; and a support layer 210 having terminal portions 211, 212, 213, and 214. The scattering layer 236 may include second filler particles 231.

[0117] In this case, the patterns 244 of the structural layer 242 can be positioned to correspond to the positions of the light-emitting devices 261, 262, and 263. The structural layer 242 can be made of a transparent material. Light emitted in a downward direction from the light-emitting devices 261, 262, and 263 can be directly emitted through the structural layer 242 made of a transparent material. At the same time, light emitted in an oblique direction from the light-emitting devices 261, 262, and 263 can be scattered and refracted by the scattering layer 236 located between the patterns 244 and emitted.

[0118] As such, the structure layer 242 may include embossed patterns 244 formed at positions corresponding to the positions of the light emitting devices 261, 262, and 263, and the scattering layer 236 may be located in an intaglio shape positioned between the embossed patterns 244. The scattering layer 236 may fill the intaglio shape to flatten the structure layer 242.

[0119] Meanwhile, in the light emitting device package 200 , the black matrix 255 may be located on the outside of each of the light emitting devices 261 , 262 , and 263 . In one example, the black matrix 255 may be located on each of both ends of the structure layer 242 .

[0120] The description of the first embodiment given above can be equally applied to parts not described.

[0121] Figures 12 to 20 is a sectional view showing a modification of the light emitting device package according to the third embodiment of the present disclosure.

[0122] refer to Figure 12 In addition to the structures of the light emitting layer 220 and the support layer 210 , the light emitting device package 200 may further include a scattering layer 237 and a structure layer 245 including a pattern 246 defining a shape of the scattering layer 237 .

[0123] In an exemplary embodiment, the pattern 246 may include a plurality of patterns 246 having a constant size. In one example, the size of the pattern 246 may be smaller than the width of each of the unit light-emitting devices 261, 262, and 263. In addition, in one example, the patterns 246 may be spaced apart from each other in the structural layer 245. In one example, the patterns 246 may have the same size.

[0124] Thus, the structure layer 245 may include irregularly shaped patterns 246, and the scattering layer 237 may be located in a concave shape positioned between the irregularly shaped patterns 246. The scattering layer 237 may fill the concave shape to flatten the structure layer 245. The scattering layer 237 may include second filler particles 231.

[0125] In one example, the process of manufacturing the structure layer 245 and the scattering layer 237 may be completed by first forming a pattern of the scattering layer 237 and then forming the structure layer 245 to cover the pattern of the scattering layer 237 .

[0126] In this case, the structure layer 245 may be made of a transparent material. Some of the light emitted in the downward direction from the light emitting devices 261, 262, and 263 may be directly emitted through the structure layer 245 made of a transparent material. At the same time, some of the light emitted from the light emitting devices 261, 262, and 263 may be emitted while being scattered and refracted by the scattering layer 237 located between the patterns 246.

[0127] The scattering layer 237 may serve to diffract light emitted from the light emitting devices 261 , 262 , and 263 so that orientation angle distributions of the light emitted from the light emitting devices 261 , 262 , and 263 are similar.

[0128] The application of scattering layer 237 may reduce transmittance due to light diffraction, which may lead to reduced luminous efficiency. To address this issue, pattern 246 of structured layer 245 can form a uniform orientation angle distribution while increasing luminous efficiency. In this way, scattering layer 237 can be formed in a pattern on a portion of the light-emitting surface to improve visibility, contrast, and luminous efficiency.

[0129] If a fine pattern of the scattering layer 237 including the second filler particles 231 is difficult, the structure layer 245 having the pattern 246 may be formed, and then the scattering layer 237 may be formed on the pattern 246 .

[0130] refer to Figure 13 In addition to the structures of the light emitting layer 220 and the support layer 210 , the light emitting device package 200 may further include a scattering layer 238 and a structure layer 247 including a pattern 248 defining a shape of the scattering layer 238 .

[0131] As an exemplary embodiment, the pattern 248 may include a plurality of patterns 248 having a constant size. In one example, the pattern 248 may have a concave lens shape.

[0132] In one example, the size of the pattern 248 may be smaller than the width of each of the unit light emitting devices 261, 262, and 263. In addition, in one example, the patterns 248 may be disposed spaced apart from each other in the structure layer 247. In one example, the patterns 248 may have the same size.

[0133] Therefore, the structure layer 247 may include the concave lens shape pattern 248, and the scattering layer 238 may be located in the concave lens shape pattern 248. The scattering layer 238 may fill the concave lens shape to flatten the structure layer 247. The scattering layer 238 may include second filler particles 231.

[0134] In one example, during the process of manufacturing the structural layer 247 and the scattering layer 238, the pattern of the scattering layer 238 may be formed as follows: Figure 12 The shape shown in FIG. 24 is a scattering layer 238, and the pattern of the scattering layer 238 can be bent by gravity and surface tension. Subsequently, a structure layer 247 can be formed to cover the pattern of the scattering layer 238.

[0135] In this case, the structure layer 247 may be made of a transparent material. Some of the light emitted in the downward direction from the light emitting devices 261, 262, and 263 may be directly emitted through the structure layer 247 made of a transparent material. At the same time, some of the light emitted from the light emitting devices 261, 262, and 263 may be emitted while being scattered and refracted by the scattering layer 238 located between the patterns 248.

[0136] refer to Figure 14 , the scattering layer 238 may be located in a concave lens shape pattern 248, similar to Figure 13 , but the pillar structure 250 may be located in each lens shape.

[0137] refer to Figure 15 , this implementation is similar to the reference Figure 12 The embodiment described above, however, an inorganic film 251 may be further provided on the side surface of the pattern 246. In this case, the inorganic film 251 may be a high-refractive-index inorganic film 251 having a greater refractive index than the second filler particles 231.

[0138] Reference Figure 16 , showing that in Figure 15 The second layer 220 is also provided with an example of a light adjustment portion 223 that wraps around the side surfaces of the light emitting devices 261 , 262 and 263 .

[0139] The light adjustment portion 223 may control a light path of light emitted through side surfaces of the light emitting devices 261 , 262 , and 263 .

[0140] refer to Figure 17 , these light-adjusting parts 224 may further include third filler particles 225 .

[0141] refer to Figure 18 , the connection electrodes 271 a and 272 a may each have a reflective cup shape, which reflects light emitted from the light emitting devices 261 , 262 , and 263 toward the scattering layer 238 .

[0142] In one example, a light emitting layer 226 may be formed between the reflective cup-shaped connection electrodes 271a and 272a and the light adjustment portion 223. The light emitting layer 226 may include first filler particles 221.

[0143] In this case, the support layer 210 may be formed to be wound around the outer side of each of the reflective cup-shaped connection electrodes 271 a and 272 a .

[0144] refer to Figure 19 , the connection electrodes 271a and 272a may contact the light-adjusting portion 224. In this case, the light-emitting layer 226 may be omitted.

[0145] refer to Figure 20 , the support layer 216 may include fourth filler particles 217. The fourth filler particles 217 may be used for at least one of scattering and reflection.

[0146] Since the size of each of the light emitting devices 261, 262, and 263 is reduced to micrometers, each light emitting device has a non-negligible ratio of the amount of side light emission to the amount of front light emission.

[0147] In order to change the side emission amount of the light emitting devices 261 , 262 , and 263 to the front emission amount, the incident angle of light may be adjusted by changing the shape and side angle of the light emitting devices 261 , 262 , and 263 .

[0148] In addition, the tilt angles of the light emitting devices 261 , 262 , and 263 may also be formed by forming patterns for adjusting the light incident angle of the high refractive material or the high reflective material using the light adjustment parts 223 and 224 .

[0149] Therefore, the efficiency of the light emitting device package 200 may be increased by improving the orientation angle characteristics of the light emitting devices 261 , 262 , and 263 due to side light emission.

[0150] In addition, third filler particles 225 may be applied to the light adjustment portion 224 to alleviate differences in orientation angle characteristics among the light emitting devices 261 , 262 , and 263 .

[0151] Figure 21 is a graph showing orientation angle distribution of a light emitting device package according to an embodiment of the present disclosure.

[0152] refer to Figure 21 , shows the orientation angle distribution of an embodiment of the present disclosure when the scattering layers 230 to 238 including the second filler particles 231 are applied (dashed lines) and when no scattering layer is applied (solid lines).

[0153] As shown in the figure, it can be seen that when the scattering layers 230 to 238 (dashed lines) including the second filler particles 231 are applied, the orientation angle pattern is flat.

[0154] Figure 22 is a graph showing color coordinate distribution of a light emitting device package according to an embodiment of the present disclosure.

[0155] Reference Figure 22 , shows color coordinate distributions of an embodiment of the present disclosure when the scattering layers 230 to 238 including the second filler particles 231 are applied (squares) and when no scattering layer is applied (circles).

[0156] As shown in the figure, it can be seen that when the scattering layers 230 to 238 including the second filler particles 231 are applied, the color temperature difference of the RGB light emitting devices 261 , 262 and 263 is improved to a level of du'v' 0.005.

[0157] Figure 23 is a schematic cross-sectional view illustrating a display apparatus using a light emitting device package according to a first embodiment of the present disclosure.

[0158] Figure 23 Shown according to reference Figures 3 to 5 The light emitting device package 200 of the first embodiment is described as an example of the display device 10 used as a unit pixel.

[0159] refer to Figure 23 The display device 10 is configured such that the light emitting device package 200 is provided on a wiring substrate 100 including a substrate 110 on which a wiring electrode 120 is connected to a substrate 110. Figure 4 The opposite states are formed at regular intervals.

[0160] Figure 24 is a schematic cross-sectional view illustrating a display apparatus using a light emitting device package according to a second embodiment of the present disclosure.

[0161] Figure 24 Another example of the display device 12 is shown, wherein according to the reference Figure 8 The light emitting device package 200 of the second embodiment is described as being used as a unit pixel.

[0162] refer to Figure 24 The display device 12 is configured such that the light emitting device package 200 is provided on a wiring substrate 100 including a substrate 110 on which wiring electrodes 121 and 122 are arranged in a manner similar to that of FIG. Figure 8 The states shown in are formed at regular intervals.

[0163] In one example, the wiring electrodes 121 and 122 and the terminal portions 211 to 214 of the light emitting device package 202 may be electrically connected to each other via the first and second wires 123 and 124 .

[0164] The above description is provided by way of example only to illustrate the present invention, and those skilled in the art will appreciate that various modifications and changes may be made without departing from the essential characteristics of the present invention.

[0165] Therefore, the embodiments disclosed herein are intended to illustrate but not limit the scope of the present invention, and the scope of the present invention should not be interpreted as being limited by these embodiments.

[0166] The protection scope of the present invention should be defined by the following claims, and all modifications or equivalents within the scope of the claims should be construed as being included in the scope of the present invention.

[0167] Industrial Applicability

[0168] According to the present disclosure, a light emitting device package using a light emitting device and a display apparatus using the light emitting device package may be provided.

Claims

1. A light-emitting device package, comprising: a first layer having a terminal portion; a second layer positioned adjacent to the first layer, the second layer including a light-emitting device constituting a unit sub-pixel and first filler particles; a third layer positioned adjacent to the second layer, the third layer configured to allow light emitted from the light emitting device to pass through the third layer, the third layer comprising second filler particles; as well as A connection electrode is located between the first layer and the second layer, the connection electrode being configured to selectively connect the light emitting device to the terminal portion.

2. The light emitting device package according to claim 1, wherein At least one of the first filler particles and the second filler particles includes particles having nanoscale or microscale dimensions.

3. The light emitting device package according to claim 1, wherein The refractive index of the first filler particles is greater than the refractive index of the second filler particles. The light emitting device package according to claim 1 , wherein: The third layer includes a transparent insulating layer, and the transparent insulating layer includes the second filler particles. The light emitting device package according to claim 1 , further comprising a structure layer including a pattern defining a shape of the third layer. The light emitting device package according to claim 5 , wherein: The patterns are positioned to correspond to positions of the light emitting devices.

7. The light emitting device package according to claim 5, wherein The pattern includes a plurality of patterns having a constant size. The light emitting device package according to claim 5 , wherein: The pattern has a lens shape.

9. The light emitting device package according to claim 5, wherein The size of the pattern is smaller than the width of the light emitting device. 10 . The light emitting device package according to claim 5 , further comprising a pillar structure located in the pattern. The light emitting device package according to claim 5 , further comprising a high refractive index inorganic film having a higher refractive index than the second filler particles at a side surface of the pattern.

12. The light emitting device package according to claim 1, wherein The second layer further includes a light-adjusting portion configured to wrap around a side surface of the light-emitting device.

13. The light emitting device package according to claim 1, wherein The connection electrode has a reflective cup shape configured to reflect light emitted from the light emitting device in a direction toward the third layer.

14. A light emitting device package, comprising: a supporting layer having a terminal portion; a light-emitting layer, the light-emitting layer being positioned adjacent to the support layer, the light-emitting layer including a light-emitting device constituting a unit sub-pixel and first filler particles; a scattering layer positioned adjacent to the light emitting layer, the scattering layer configured to allow light emitted from the light emitting device to pass through the scattering layer, the scattering layer being located in a transparent insulating layer, the scattering layer comprising second filler particles having a refractive index less than that of the first filler particles; as well as A connection electrode is located between the support layer and the light emitting layer, the connection electrode being configured to selectively connect the light emitting device to the terminal portion. The light emitting device package according to claim 14 , wherein: At least one of the first filler particles and the second filler particles includes particles having nanoscale or microscale dimensions. The light emitting device package according to claim 14 , further comprising a structure layer including a pattern defining a shape of the scattering layer. The light emitting device package according to claim 16 , wherein: The patterns are positioned to correspond to positions of the light emitting devices. The light emitting device package according to claim 16 , wherein: The pattern includes a plurality of patterns having a constant size. The light emitting device package according to claim 16 , wherein: The pattern has a lens shape.

20. A display device comprising a light emitting device package defining each pixel, wherein: The light emitting device package includes: a first layer having a terminal portion; a second layer positioned adjacent to the first layer, the second layer including a light-emitting device constituting a unit sub-pixel and first filler particles; a third layer positioned adjacent to the second layer, the third layer configured to allow light emitted from the light emitting device to pass through the third layer, the third layer comprising second filler particles; and A connection electrode is located between the first layer and the second layer, the connection electrode being configured to selectively connect the light emitting device to the terminal portion.

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