Processing device

Abstract

In order to suppress a change in the posture of a chuck table regardless of the rigidity of the chuck table, this machining device (1) is provided with: a chuck table (12) that rotatably supports a substantially disk-shaped workpiece (W); a chuck table support mechanism (80) that supports the chuck table (12); and grinding parts (40, 50) for rotatably holding grinding wheels (41, 51) for grinding the workpiece (W). The point of action of the support reaction force of the chuck table support mechanism (80) is eccentric with respect to the center of rotation (C2) of the chuck table (12), and the positional relationship between the grinding parts (40, 50) and the chuck table (12) is set such that the point of action of the support reaction force is included in the portions other than both ends of a machining region (AR) including an arc-shaped portion (AC) where the grinding wheels (41, 51) are in contact with the workpiece (W).

Description

Technical Field

[0001] The present disclosure relates to a processing device for grinding workpieces such as semiconductor wafers. Background Art

[0002] In the field of semiconductor manufacturing, in order to form semiconductor wafers such as silicon wafers (hereinafter referred to as "wafers") thinner, back grinding is performed on the back side of the wafer. For example, in Japanese Patent Application Publication No. 2016-201422, a transverse feed grinding device is disclosed, which grinds a wafer mounted on a rotatable chuck table using a grinding wheel rotatably arranged on a chuck table. In the transverse feed grinding device, the thickness and shape of the wafer are measured before grinding, and the inclination of the chuck table and the inclination of the grinding wheel are adjusted according to the result, and the arc-shaped portion of the edge of the grinding wheel is pressed against the wafer to perform grinding. Summary of the Invention

[0003] Technical problem to be solved by the invention

[0004] In the aforementioned machining apparatus, it is desirable to suppress the positional fluctuations of the chuck table during machining. Conventionally, a technique has been proposed to suppress positional fluctuations by increasing the rigidity of the chuck table. However, there is a limit to how much the rigidity of the chuck table can be increased, and this increase in rigidity also increases costs.

[0005] The present disclosure provides a machining device that suppresses the posture variation of a chuck table regardless of the rigidity of the chuck table, thereby achieving further high-precision machining and improvement in in-plane thickness variation (TTV).

[0006] Technical solutions to solve problems

[0007] The processing device of the first technical solution of the present disclosure includes: a chuck table, which supports a workpiece of a roughly circular plate shape so that it can rotate; a grinding part, which holds a grinding wheel for grinding the workpiece so that it can rotate; and a chuck table support mechanism, which is composed of a support body supporting the chuck table. The point of action of the support reaction force of the support body of the chuck table support mechanism is eccentric relative to the rotation center of the chuck table. Moreover, the positional relationship between the grinding part and the chuck table is set so that the point of action is included in the part excluding the two ends of the processing area including the arc-shaped part where the grinding wheel contacts the workpiece. In addition, in addition to the positional relationship, the distribution of each component at the chuck table support mechanism can also be appropriately set.

[0008] Here, the processing area can be defined as a rectangular area surrounding the arc-shaped portion. In addition, in addition to the above-mentioned features, the positional relationship between the grinding portion and the chuck table can be set so that the direction of the posture change of the chuck table when grinding the workpiece is roughly consistent with the short side direction of the processing area. In addition, the support body is composed of a plurality of support parts, and the point of action of the resultant force of the support reaction forces of the plurality of support parts is the center of gravity position of the polygon connecting the plurality of support parts. The positional relationship of the chuck table support mechanism relative to the grinding portion can also be set so that the center of gravity position is included in the portion excluding the two end portions of the processing area. In addition, in addition to the positional relationship, the distribution of the various components at the chuck table support mechanism can also be appropriately set.

[0009] The processing device of the second technical solution of the present disclosure includes: a chuck table, which supports a workpiece of a roughly circular plate shape so that it can rotate; a grinding part, which holds a grinding wheel for grinding the workpiece so that it can rotate; and a chuck table support mechanism, which is composed of a support body for supporting the chuck table. The point of action of the support reaction force of the support body of the chuck table support mechanism is eccentric with respect to the rotation center of the chuck table. Moreover, the positional relationship between the grinding part and the chuck table is set so that the direction of the posture change of the chuck table when grinding the workpiece is roughly consistent with the short side direction of the processing area including the arc-shaped part where the grinding wheel contacts the workpiece. In addition, in addition to the positional relationship, the distribution of each component at the chuck table support mechanism can also be appropriately set.

[0010] Effects of the Invention

[0011] In the processing device using the first technical solution of the present disclosure, the points of action of the support reaction force of the support body of the chuck table support mechanism are located in the portion excluding the two ends of the processing area including the arc-shaped portion where the grinding wheel and the workpiece come into contact. Therefore, the positional change of the chuck table due to the external force from the grinding wheel is suppressed, and the change in the contact condition between the grinding wheel and the workpiece is also suppressed. Furthermore, in the processing device using the second technical solution of the present disclosure, the direction of the positional change of the chuck table is aligned with the short side direction of the processing area including the arc-shaped portion where the grinding wheel and the workpiece come into contact. Therefore, even if the position of the chuck table changes due to the external force from the grinding wheel causes the position of the chuck table to change, the change in the contact condition between the grinding wheel and the workpiece caused by this change can be suppressed. BRIEF DESCRIPTION OF THE DRAWINGS

[0012] Figure 1 It is a perspective view illustrating a schematic configuration of a wafer grinding apparatus 1 according to the first embodiment.

[0013] Figure 2 It is a plan view illustrating the structure of the turntable 11 and the chuck table 12 .

[0014] Figure 3 It is an explanation Figure 1 1 is a block diagram showing a structure of a control unit 100 of a processing device 1.

[0015] Figure 4 It is a schematic perspective view for explaining the positional relationship between the chuck table 12 and the rough grinding unit 40 or the fine grinding unit 50 .

[0016] Figure 5 It is a plan view illustrating the positional relationship between the chuck table 12 and the rough grinding unit 40 or the fine grinding unit 50 .

[0017] Figure 6 It is a perspective view showing an example of the positional relationship between the chuck table 12 and the rough grinding unit 40 or the fine grinding unit 50 in a conventional machining apparatus.

[0018] Figure 7 It is a plan view showing an example of the positional relationship between the chuck table 12 and the rough grinding unit 40 or the fine grinding unit 50 in a conventional machining apparatus.

[0019] Figure 8 It is a plan view illustrating the positional relationship between the chuck table 12 and the rough grinding unit 40 or the fine grinding unit 50 in the processing apparatus according to the second embodiment.

[0020] Figure 9 Various modifications of the embodiments are shown. DETAILED DESCRIPTION

[0021] Hereinafter, the present embodiment will be described with reference to the accompanying drawings. The accompanying drawings show embodiments in accordance with the principles of the present disclosure, but these embodiments are for understanding the present disclosure and are by no means for limiting the interpretation of the present disclosure. The descriptions in this specification are merely typical examples and do not limit the claims or application examples of the present disclosure in any sense. In this embodiment, the present disclosure is described in sufficient detail for those skilled in the art to implement the present disclosure, but it should be understood that other installations and forms can also be adopted, and changes in structure and construction, and replacement of various elements can be made without departing from the scope and spirit of the technical ideas of the present disclosure. Therefore, the subsequent description cannot be limited to this for interpretation.

[0022] In the following description, "up" and "down" are directions perpendicular to the surface of the base B of the processing device 1. The side farther from the surface of the base B is called "up", and the side closer to the surface of the base B is called "down".

[0023] In the following description, a processing apparatus will be described that processes a substantially disk-shaped semiconductor wafer as a workpiece W to be processed.

[0024] (First embodiment)

[0025] Reference Figure 1 as well as Figure 2 , a schematic structure of a wafer grinding processing apparatus 1 (hereinafter referred to as processing apparatus 1 ) according to a first embodiment will be described. Figure 1 1 is a perspective view illustrating the overall structure of the processing device 1. Figure 2 1 is a plan view illustrating the structure of the turntable 11 and the chuck table 12. The processing apparatus 1 is roughly configured to include a base B, a workpiece holding portion 10, and a main unit 20.

[0026] The workpiece holding portion 10 holds a workpiece W such as a wafer as a processing target object, and is placed on a base B. The workpiece holding portion 10 includes a turntable 11 and a plurality of (eg, three) chuck tables 12 .

[0027] like Figure 2 As shown, the turntable 11 is connected to a motor (not shown) and is configured to be able to rotate around the rotation axis C1 using the driving force of the motor. The chuck tables 12 are placed on the turntable 11 at approximately equal intervals (for example, at intervals of 120°) in a circular shape, for holding the workpiece W, and can be rotated around the rotation axis C2 using the driving force of the motor. Partition plates 13 are radially provided on the turntable 11 to separate the spaces. Each chuck table 12 is arranged in a fan-shaped space separated by the partition plates 13, for example, at intervals of 120°. Three spaces are separated for the execution of the three stations: the alignment station S1, the rough grinding station S2, and the fine grinding station S3. The alignment station S1 is a station that uses a conveying device (not shown) to transport the workpiece W to the chuck table 12 and align the workpiece W. The rough grinding station S2 is a station that roughly grinds the workpiece W with a surface roughness lower than the desired surface roughness, and the fine grinding station S3 is a station that finely grinds the workpiece W with a desired surface roughness.

[0028] Partition plate 13 prevents machining fluid used on each stage from scattering onto adjacent stages. The machining apparatus 1 rotates turntable 11 about rotation axis C1 as the stage advances, enabling continuous grinding of stages S1 to S3 and workpieces W placed on multiple chuck stages 12. For example, the wafers used as workpieces W are silicon wafers, silicon carbide wafers, and the like, but the present invention is not limited thereto.

[0029] The chuck table 12 includes a chuck portion 12c that holds the workpiece W. Although not shown, the chuck portion 12c includes a suction body made of porous ceramic and a pipeline connected to a vacuum source below the suction body. The negative pressure from the pipeline holds the workpiece W against the chuck table 12.

[0030] Next, the main unit 20 will be described. Figure 1As shown, the main unit 20 is a portion for holding a grinding unit for grinding a workpiece W above the workpiece holding portion 10. Specifically, the main unit 20 includes an arch-shaped column 30 formed to span the workpiece holding portion 10, and further includes a rough grinding unit 40 and a fine grinding unit 50 mounted on the column 30. The rough grinding unit 40 corresponds to the rough grinding station S2, which performs rough grinding to a surface roughness lower than a desired surface roughness. The fine grinding unit 50 corresponds to the fine grinding station S3, which performs fine grinding to grind the surface of the workpiece W to a desired surface roughness.

[0031] The column 30 is composed of a base 31 having a generally E-shaped top view, and a support 32 extending vertically from a base B and connected to the end of the base 31. A rough grinding portion 40 and a fine grinding portion 50 are disposed in two recessed portions of the E-shaped base 31 when viewed from above. The rough grinding portion 40 and the fine grinding portion 50 are sometimes collectively referred to as the "grinding portion."

[0032] The rough grinding section 40 includes a rough grinding wheel 41, a grinding mechanism 42 with the rough grinding wheel 41 mounted at its lower end, and a spindle feed mechanism 43 for raising and lowering the grinding mechanism 42 in a vertical direction V. The fine grinding section 50 similarly includes a fine grinding wheel 51, a grinding mechanism 52 with the fine grinding wheel 51 mounted at its lower end, and a spindle feed mechanism 53 for raising and lowering the grinding mechanism 52 in a vertical direction V. The grinding mechanisms 42 and 52 are configured to be rotatable by a motor (not shown). The rough grinding wheel 41 and the fine grinding wheel 51 may sometimes be collectively referred to simply as "grinding wheels."

[0033] The column 30 is provided with a first guide 60 and a second guide 70 for controlling the raising and lowering of the rough grinding section 40 and the fine grinding section 50, respectively. The first guide 60 includes a guide portion 61 and a guide rail 62. The guide portions 61 are provided in one of two recesses in the base 31, which is E-shaped in plan view, and are used to raise and lower the rough grinding section 40. The guide rail 62 allows the guide portion 61 to slide in the vertical direction V. The second guide 70 includes a guide portion 71 and a guide rail 72. The guide portions 71 are provided in the other of the two recesses in the base 31, which is E-shaped in plan view, and are used to raise and lower the fine grinding section 50. The guide rail 72 allows the guide portion 71 to slide in the vertical direction V.

[0034] The three chuck tables 12 are respectively provided with a first inclination angle adjusting portion 80 for adjusting the inclination angle of the chuck table 12 relative to the turntable 11. The first inclination angle adjusting portion 80 is as follows: Figure 2As shown, it includes, for example, two movable support parts 14 and one fixed support part 15. That is, the chuck table 12 is supported on the surface of the turntable 11 by a plurality of support parts (for example, three points) provided by the movable support part 14 and the fixed support part 15. The first inclination angle adjustment part 80 constitutes a chuck table support mechanism that supports the chuck table 12 so as to adjust the inclination angle of the chuck table 12. In addition, the movable support part 14 and the fixed support part 15 are sometimes collectively referred to as "support parts 14, 15". The movable support part 14 and the fixed support part 15 are an example of a support body.

[0035] The movable support portion 14 raises and lowers the tilting table (not shown) in the chuck table 12, and the fixed support portion 15 fixes the tilting table along the vertical direction V. Therefore, the chuck table 12 can be tilted relative to the turntable 11 according to the respective extension and contraction amounts of the two movable support portions 14. The movable support portion 14 can be configured as a structure using a differential screw mechanism and bolts, for example, but the present invention is not limited thereto. In addition, the number of support portions 14 and 15 supporting one chuck table 12 is three in the example shown in the figure, but the present invention is not limited thereto, and may be four (four-point support), five, or more than five. In addition, the number of movable support portions 14 supporting one chuck table 12 is two in the above-mentioned example, but the present invention is not limited thereto.

[0036] In addition, the rough grinding part 40 and the fine grinding part 50 are respectively provided with a second inclination angle adjustment part 90 (at the Figure 1 For simplicity of illustration, only the second inclination angle adjustment portion 90 of the rough grinding portion 40 is shown. As an example, the second inclination angle adjustment portion 90 may be configured to include two movable support portions 91 and one fixed support portion 92. The movable support portion 91 may be, for example, a differential screw mechanism including a slider, a fixed block, and an adjustment screw. The movable support portion 91 and the fixed support portion 92 may sometimes be collectively referred to as "support portions 91, 92."

[0037] The turntable 11 rotates in 120-degree increments in conjunction with stages S1-S3, sequentially moving the workpiece W to the alignment stage S1, rough grinding stage S2, and fine grinding stage S3. The rotation of the turntable 11 exposes the chuck table 12 of the alignment stage S1 to the side opposite the two recesses in the base 31. Meanwhile, the rotation of the turntable 11 moves the chuck tables 12 of the rough grinding stage S2 and fine grinding stage S3 to the lower portion of the two recesses in the base 31.

[0038] After the workpiece W has been aligned with the chuck table 12 on the alignment table S1, the turntable 11 rotates 120°, causing it to move downward from the rough grinding section 40 and be transferred to the rough grinding table S2. When the rough grinding on the rough grinding table S2 is completed, the turntable 11 rotates another 120°, causing the workpiece W to move downward from the fine grinding section 50 and be transferred to the fine grinding table S3. When the fine grinding on the fine grinding table S3 is completed, the turntable 11 rotates further, causing the workpiece W to be transferred back to the alignment table S1. It is then moved from the chuck table 12 to a rack, etc., not shown, by a conveyor device, etc. (not shown). Alternatively, the turntable 11 can be divided into four sections at 90° intervals, allowing additional grinding stations to be provided for grinding the workpiece W after fine grinding.

[0039] Reference Figure 3 illustrate Figure 1 The structure of the control unit 100 of the processing device 1 is shown. As described above, the processing device 1 causes the turntable 11, the chuck table 12, the rough grinding unit 40, and the fine grinding unit 50 to rotate, adjust the tilt angle, and move in parallel, thereby processing the workpiece W. The control unit 100 controls the various operations of the turntable 11, the chuck table 12, the rough grinding unit 40, and the fine grinding unit 50.

[0040] The control unit 100 includes, for example, a CPU 101, a memory 102, and a storage 103, and is connected to a first sensor 104 and a second sensor 105 located externally. The CPU 101 operates according to a control program stored in the memory 102 and stores various calculation results in the memory 103. A data map representing the analysis results of the acquired data may also be stored in the memory 103.

[0041] The first sensor 104 and the second sensor 105 are arranged near the workpiece W and output measurement signals indicating the surface shape of the workpiece W to the control unit 100. The control unit 100 outputs the measurement signals to the turntable control unit 106, the chuck table control unit 107, the grinding wheel rotation drive control unit 108, and the tilt control unit 109.

[0042] The turntable control unit 106 controls the rotation of the turntable 11 according to instructions from the control program. Furthermore, the chuck table control unit 107 controls the suction operation and rotation of the chuck table 12 according to instructions from the control program. Furthermore, the grinding wheel rotation control unit 108 controls the rotation of the grinding wheels 41 and 51 of the rough grinding unit 40 and the fine grinding unit 50. The tilt control unit 109 controls the movable support unit 14 and the movable support unit 91 according to measurement signals from the first sensor 104 and the second sensor 105, thereby controlling the tilt angles of the chuck table 12, the rough grinding unit 40, and the fine grinding unit 50.

[0043] Next, refer to Figure 4 as well as Figure 5The positional relationship between the chuck table 12 and the rough grinding section 40 or the fine grinding section 50 in the machining apparatus 1 according to the first embodiment will be described. In order to suppress the positional fluctuation of the chuck table 12 due to the external force from the grinding wheels 41 and 51, the chuck table 12, the rough grinding section 40, and the fine grinding section 50 are arranged so as to have the positional relationship described below.

[0044] The chuck portion 12c of the chuck table 12 is arranged on the turntable 11 so as to be rotated about the rotation axis C2 by the motor 12d. The chuck table 12 is supported on the turntable 11 at three points by three support portions formed by the movable support portion 14 and the fixed support portion 15 that constitute the first inclination angle adjustment portion 80. When the point of application of the resultant support reaction force from these three support portions is SC, the rotation axis C2 (rotation center) of the chuck table 12 (chuck portion 12c) is set to a position eccentric with respect to the point of application SC.

[0045] When the support rigidity of the three support parts 14 and 15 is the same, the action point SC coincides with the center of gravity of the triangle connecting the three points. When the support rigidity of the three support parts 14 and 15 is different, the action point SC may be located at a position different from the center of gravity. In addition, the arrangement of the three support parts 14 and 15 may be set to Figure 5 The support structure 14 and 15 may be configured as an equilateral triangle, but may also be configured as a configuration other than an equilateral triangle (e.g., an isosceles triangle with a shorter side) depending on the difference in support rigidity of the support parts 14 and 15 and other factors. In the case of four-point support, the configuration may be a square, but may also be configured as a shape other than a square (rectangle, parallelogram, trapezoid, etc.) depending on the difference in support rigidity and other judgment factors. In addition, when the support rigidity of each support part is the same, the point of action SC coincides with the center of gravity of the polygon connecting the support parts.

[0046] The rotation axis C3 of the grinding wheels 41 and 51 of the rough grinding unit 40 and the fine grinding unit 50 is adjusted to have a small inclination angle relative to the rotation axis C2 of the workpiece W (chuck table 12) during machining, and is controlled to be in the same direction as the workpiece W during machining. Figure 5 The arc-shaped portion AC (arc-shaped curved area) shown in the figure makes the grinding wheels 41, 51 contact the workpiece W. The arc-shaped portion AC is adjusted to pass through the rotation axis C2, and the positions of the rough grinding part 40 and the fine grinding part 50 are adjusted so that the above-mentioned point of action SC is included in the middle of the rectangular processing area AR that at least surrounds the arc-shaped portion AC (in other words, the part of the processing area AR excluding the two ends). Figure 5In the figure, the point of action SC coincides with the midpoint ACC of the arc-shaped portion AC, but this is only an example, and it is sufficient if the point of action SC is included near the middle of the processing area AR. Although it is sufficient if the point of action SC is included near the middle of the processing area AR, it is preferable that it exists near the midpoint ACC of the arc-shaped portion AC. Here, the "processing area AR" can be defined as a rectangular area connected to both ends and the vertex of the arc-shaped portion AC, or it can be set to an area larger than this area. In addition, "near the middle of the processing area AR" means the extent of the processing area AR excluding the two ends in the longitudinal direction, and does not only refer to the vicinity of the midpoint ACC. For example, an area occupying approximately 50% of the arc-shaped portion AC with the midpoint ACC as the center can be defined as near the middle of the processing area. More preferably, an area occupying approximately 20% of the arc-shaped portion AC with the midpoint ACC as the center can be defined as near the middle of the processing area.

[0047] In this manner, the positional relationship between the rough grinding unit 40 and the fine grinding unit 50 relative to the chuck table 12 is set so that the machining area AR includes the point of action SC. This achieves a state in which the support reaction force and the external force from the rough grinding unit 40 or the fine grinding unit 50 are easily offset. Even when large external forces from the rough grinding unit 40 or the fine grinding unit 50 are applied to the workpiece W, fluctuations in the inclination angle of the chuck table 12 can be suppressed.

[0048] Figure 6 as well as Figure 7 It is a diagram (stereoscopic view and schematic top view) showing an example of the positional relationship between the chuck table 12 and the rough grinding section 40 or the fine grinding section 50 in a conventional processing device. In this conventional processing device, at the chuck table 12, the rotation axis C2 of the chuck portion 12c is roughly consistent with the point of action SC of the support portions 14 and 15. As described above, when the support rigidity of the support portions 14 and 15 is roughly the same, the point of action SC is the center of gravity position of the triangle, and the rotation axis C2 is roughly consistent with the center of gravity position. Therefore, the point of action SC is not located near the middle of the processing area AR surrounding the arc-shaped portion AC, but is located near the end. Since the position of the point of action SC is different from the position near the middle of the processing area AR containing the arc-shaped portion AR, the force (arrow A) that tilts the chuck table 12 is exerted when processing the workpiece W, and the possibility of the inclination angle of the chuck table 12 changing increases. In addition, by Figure 7 In the structure of the machining apparatus shown, a configuration in which the support rigidity, length, and other shapes of the support portions 14 and 15 are set or adjusted so that the points of action SC of the support portions 14 and 15 are included in the machining area AR is also within the scope of the present application. With this configuration, the effects of the present embodiment can be achieved without changing the arrangement of the support portions 14 and 15 or the shape of the chuck table 12.

[0049] (Second embodiment)

[0050] Next, refer to Figure 8 A processing device 1 according to a second embodiment of the present invention will be described. The overall structure of the processing device 1 is similar to that of the first embodiment ( Figure 1 and Figure 2 ) is the same, so repeated descriptions are omitted. In this second embodiment, the positional relationship between the chuck table 12 and the rough grinding part 40 or the fine grinding part 50 is different from that in the first embodiment. In the first embodiment, the point of action of the support reaction force of the support body, that is, the positional relationship is set so that the point of action SC of the resultant force of the support reaction force of the movable support part 14 and the fixed support part 15 exists near the middle of the processing area AR. In contrast, in the second embodiment, the positional relationship is set so that the direction of the posture change of the chuck table 12 is consistent with the short side direction of the processing area AR. Here, the "direction of the posture change of the chuck table 12" refers to the change in position and the change in inclination of the chuck table 12 that occurs when the grinding wheel 41 or the grinding wheel 51 rotating relative to the workpiece W is pressed during processing.

[0051] Reference Figure 8 In the processing apparatus 1 of the second embodiment, the rotation axis C2 of the chuck portion 12c is eccentric from the point of action SC (or the center of gravity of the support portions 14 and 15), which is the same as the first embodiment. However, it should be noted that in the second embodiment, the processing area AR does not include the point of action SC, which is different from the first embodiment. Instead, in the second embodiment, the direction D1 of the posture change of the chuck table 12 (using Figure 8 The reference numerals I1 and I2 in the figure indicate the direction in which the chuck table 12 is flipped over) are roughly consistent with the short side direction D2 of the processing area AR. The direction D1 in which the posture of the chuck table 12 changes varies depending on, for example, the configuration of the support parts 14 and 15 and / or the support rigidity, the configuration of the chuck part 12c, and the position of the processing area AR. By making this direction D1 consistent with the short side direction D2 of the processing area AR, even if the external force of the grinding wheels 41 and 51 causes the posture of the chuck table 12 to change, the change in the contact condition between the grinding wheels 41 and 51 and the workpiece W caused by the change can be suppressed. As a result, further high-precision processing and improved in-plane thickness variation (TTV) can be achieved.

[0052] The present invention is not limited to the above-mentioned embodiments and includes various modified examples. For example, the above-mentioned embodiments are described in detail to explain the present invention in an easy-to-understand manner, but the present invention is not limited to having all the structures described. In addition, a part of the structure of one embodiment can be replaced with the structure of another embodiment, and the structure of another embodiment can be added to the structure of one embodiment. In addition, other structures can be added, deleted, or replaced with a part of the structure of each embodiment. Regarding the positional relationship between the chuck table 12 and the rough grinding section 40 or the fine grinding section 50, the features of the first embodiment and the second embodiment can also be adopted in one processing device 1.

[0053] In addition, in the above embodiment, as the first tilt angle adjustment mechanism 80, a multi-point support structure of the movable support portion 14 and the fixed support portion 15 is described, but the present invention is not limited to this. Figure 9 As shown, the chuck table 12 can also be supported by a first inclination angle adjustment mechanism 80A (chuck table support mechanism). The first inclination angle adjustment mechanism 80A includes a support body having an inclined surface on its upper surface and being rotatable relative to the chuck table 12. By appropriately rotating the first inclination angle adjustment mechanism 80A relative to the chuck table 12, the inclination angle of the chuck table 12 can be appropriately adjusted, and the point of application of the resultant force of the support reaction force can also be arbitrarily adjusted.

[0054] In addition, in the above example, the case where the first inclination angle adjustment mechanism 80, 80A is constructed so as to be able to adjust the inclination angle of the chuck table 12 is described, but the inclination angle adjustment function formed by the first inclination angle adjustment mechanism (chuck table support mechanism) 80, 80A can also be omitted, and the second inclination angle adjustment part 90 can be used to only adjust the inclination angle of the grinding part 40, 50.

[0055] Description of Reference Numerals

[0056] 1. Wafer grinding apparatus; 10. Workpiece holding unit; 11. Turntable; 12. Chuck table; 12c. Chuck unit; 12d. Motor; 13. Partition plate; 14. Movable support unit; 15. Fixed support unit; 20. Main unit; 30. Column; 31. Base; 32. Support column; 40. Rough grinding unit; 41. Rough grinding wheel; 42, 52. Grinding mechanism; 43, 53. Spindle feed mechanism; 50. Finishing grinding unit; 51. Finishing grinding wheel; 60. First guide member; 61, 71. Guide unit; 62, 72. Guide rail; 7 0. Second guide; 80. First inclination angle adjustment part; 90. Second inclination angle adjustment part; 91. Movable support part; 92. Fixed support part; 100. Control part; 102, 103. Memory; 104, 105. Sensor; 106. Turntable control part; 107. Chuck table control part; 108. Grinding wheel rotation drive control part; 109. Inclination control part; AC, arc-shaped part; ACC, midpoint; AR, processing area; B, base; C1~C3, rotation axis; SC, point of action; V, vertical direction; W, workpiece.

Claims

1. A processing device comprising: a chuck table that rotatably supports a substantially disk-shaped workpiece; a grinding portion that rotatably holds a grinding wheel for grinding the workpiece; as well as A chuck table support mechanism includes a support body that supports the chuck table, wherein a point of application of a support reaction force of the support body is eccentric with respect to a rotation center of the chuck table, and a positional relationship of the chuck table support mechanism with respect to the grinding section is set so that the point of application is included in a portion of a processing area excluding both end portions, and the processing area includes an arc-shaped portion where the grinding wheel contacts the workpiece.

2. The processing device according to claim 1, wherein The processing area is a rectangular area surrounding the arc-shaped portion.

3. The processing device according to claim 1 or 2, wherein: The positional relationship between the grinding unit and the chuck table is set so that a direction in which the posture of the chuck table changes when grinding the workpiece substantially coincides with a short-side direction of the processing region.

4. The processing device according to claim 1, wherein The support body is constructed to include a plurality of support parts. The point of action of the resultant force of the support reaction forces of the plurality of support parts is the center of gravity of the polygon connecting the plurality of support parts. The positional relationship of the chuck table support mechanism with respect to the grinding unit is set so that the center of gravity position is included in a portion of the processing area excluding both end portions.

5. A processing device, wherein: include: a chuck table that rotatably supports a substantially disk-shaped workpiece; a grinding portion that rotatably holds a grinding wheel for grinding the workpiece; as well as A chuck table support mechanism includes a support body that supports the chuck table, wherein the point of application of the support reaction force of the support body is eccentric with respect to the rotation center of the chuck table, and the positional relationship of the chuck table support mechanism relative to the grinding section is set so that the direction of the posture change of the chuck table when grinding the workpiece is roughly consistent with the short side direction of the processing area, which includes the arc-shaped portion where the grinding wheel contacts the workpiece.

6. The processing device according to claim 5, wherein: The processing area is a rectangular area surrounding the arc-shaped portion.

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