A cutting method of a microtome and a microtome

Abstract

This application relates to the field of silicon rod processing technology, and in particular to a cutting method and a slicing machine for use in slicing machines. The slicing machine includes: main rollers, of which at least two are used; and diamond wire wound between the main rollers to form a wire mesh between the main rollers, wherein the silicon rod is located on the wire mesh and is cut. The cutting method includes: driving the diamond wire and cutting the silicon rod with the diamond wire; dividing the main rollers into several regions along the axial direction; acquiring the temperature change of the main rollers per unit time in each region; and determining whether there is a wear segment on the diamond wire based on the temperature change and a preset threshold.

Description

Technical Field

[0001] This application relates to the field of silicon rod processing technology, and in particular to a cutting method for a slicing machine and a slicing machine. Background Technology

[0002] In the photovoltaic and semiconductor industries, slicing machines are core equipment for cutting hard and brittle materials such as silicon rods into thin wafers, and their performance directly determines product precision and production efficiency. The cutting wire, as a key component of the slicing machine, has undergone technological iterations from slurry cutting to diamond wire cutting. Diamond wire cutting separates materials by bonding diamond abrasive grains to the surface of a metal wire substrate and utilizing the grinding action during high-speed motion. It features high cutting efficiency, low kerf loss, and superior silicon wafer surface quality, and has become the mainstream technology.

[0003] In existing technologies, diamond wire is the core component for slicing machines to achieve efficient cutting. Its surface abrasive distribution, wire diameter uniformity, and tensile strength directly determine the cutting accuracy, surface integrity, and production stability of silicon wafers. Therefore, its performance testing is of great significance. Generally, diamond wire testing is mostly carried out after the cutting operation is stopped, and the overall performance is evaluated through offline sampling and analysis. This method requires interrupting the production process and reducing equipment uptime.

[0004] Therefore, the technical problem with existing technologies is that diamond wire testing reduces equipment uptime. Summary of the Invention

[0005] This application provides a cutting method and a slicing machine, which avoids the problem of machine downtime due to diamond wire detection affecting equipment uptime.

[0006] This application provides a cutting method for a slicer, which adopts the following technical solution:

[0007] A cutting method for a slicer, applied to a slicer, the slicer comprising:

[0008] Main rollers, wherein at least two main rollers are present;

[0009] Diamond wire is wound between the main rollers to form a wire mesh between the main rollers, and the silicon rod is cut on the wire mesh.

[0010] The cutting method includes:

[0011] This enables the diamond wire to drive the silicon rod and allows it to be cut by the diamond wire.

[0012] The main roller is divided into several regions along the axial direction;

[0013] The temperature change of the main roller per unit time is obtained in each of the regions;

[0014] Based on the temperature change and a preset threshold, it is determined whether there is a wear segment in the diamond wire.

[0015] Preferably, the step of "determining whether there is a wear segment in the diamond wire based on the temperature change and a preset threshold" includes a first-level determination:

[0016] In any of the regions, if the temperature change exceeds a preset threshold;

[0017] The diamond wire was determined to be abnormal.

[0018] As a preferred option, a second-level determination is also included:

[0019] If the temperature change in each of the regions at the same time exceeds a preset threshold;

[0020] Determine if there is no wear on the diamond wire.

[0021] As a preferred option, a second-level determination is also included:

[0022] At any given moment, if the temperature change in any region exceeds a preset threshold, the temperature change in the remaining regions shall not exceed the preset threshold.

[0023] The diamond wire is determined to have at least one worn section.

[0024] As a preferred option, a third level of judgment is also included:

[0025] In terms of timing, the temperature changes along the main roller direction successively exceed the preset threshold.

[0026] The wear section is determined to be driven along the main roller direction by the diamond wire.

[0027] Preferably, the wire mesh portion corresponding to the transmission is defined as the wire mesh area; the area where the wear section is located is defined as the target area.

[0028] The slicer also includes tension components. The number of tension components is the same as the number of areas and they are set one-to-one. The tension components are connected to the wire mesh area corresponding to the area to adjust the tension of the wire mesh area.

[0029] In the next reciprocating cycle, when the wear section is determined to be in the target area, the tension component corresponding to the target area increases the tension of the corresponding wire mesh area to perform cutting tension compensation.

[0030] Preferably, the tension assembly includes several tension rollers; the position between the wire mesh area corresponding to the target area and the previous wire mesh area is defined as the first transition zone; the position between the wire mesh area corresponding to the target area and the next wire mesh area is defined as the second transition zone;

[0031] The phrase "when the worn section is determined to be located in the target area, the tension component corresponding to the target area increases the tension of the corresponding wire mesh area to perform cutting tension compensation" includes:

[0032] The tension value applied by the tension roller to the corresponding wire mesh area is linearly increased from the reference value to the compensation value along the direction from the first transition zone to the second transition zone, and then linearly decreased from the compensation value back to the reference value, so as to make the tension transition smooth.

[0033] Preferably, the tension compensation time range is:

[0034] It is initiated when the temperature change in the current target area exceeds a preset threshold; and

[0035] The process ends when the temperature change in the next target area exceeds a preset threshold.

[0036] This application provides a slicer, which adopts the following technical solution:

[0037] A slicer, comprising:

[0038] The main roller, having at least two, is divided into several regions along its axial direction;

[0039] Diamond wire is wound between the main rollers to form a wire mesh between the main rollers, and the silicon rod is cut on the wire mesh.

[0040] A non-contact temperature sensor, wherein there are multiple non-contact temperature sensors, each corresponding to a specific area, and the non-contact temperature sensor is used to acquire the temperature change of the corresponding area per unit time.

[0041] As a preferred option, it also includes:

[0042] Tension components are provided in a one-to-one correspondence with the number of zones. The tension components are connected to the wire mesh area corresponding to the zone to adjust the tension of the wire mesh area.

[0043] In summary, this application includes at least one of the following beneficial technical effects:

[0044] This application determines whether a section of diamond wire is severely worn based on the temperature change of the main roller. It can monitor the diamond wire status in real time during the silicon rod slicing process, ensuring accurate monitoring without missing any detections, and without requiring machine downtime, thus avoiding the problem of equipment uptime caused by diamond wire detection shutdowns. Attached Figure Description

[0045] Figure 1 This is a schematic diagram of the cutting method described in this application;

[0046] Figure 2 This is a schematic diagram of the main roller and zones in the slicer described in this application;

[0047] Figure 3 This is a schematic diagram showing the interaction between the area and the wire mesh area in the slicer described in this application;

[0048] Figure 4 This is a schematic diagram of the tension assembly in the slicer described in this application.

[0049] Explanation of reference numerals in the attached figures:

[0050] 100, Main roller; 110, Zone; 200, Diamond wire; 210, Wire mesh zone; 220, First transition zone; 230, Second transition zone; 300, Tension assembly; 310, Tension roller; 400, Non-contact temperature sensor; M, Silicon rod. Detailed Implementation

[0051] The serial numbers assigned to components in this document, such as "first" and "second," are used solely to distinguish the described objects and have no sequential or technical meaning. The terms "connection" and "linkage" used in this application, unless otherwise specified, include both direct and indirect connections (linkages). It should be understood that the terms "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," "clockwise," and "counterclockwise," indicating orientations or positional relationships, are based on the orientations or positional relationships shown in the accompanying drawings and are used solely for the convenience of describing this application and simplifying the description. They do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this application.

[0052] In this application, unless otherwise expressly specified and limited, "above" or "below" the second feature can mean that the first feature is in direct contact with the second feature, or that the first feature is in indirect contact with the second feature through an intermediate medium. Furthermore, "above," "on top of," and "over" the second feature can mean that the first feature is directly above or diagonally above the second feature, or simply that the first feature is at a higher horizontal level than the second feature. "Below," "below," and "under" the second feature can mean that the first feature is directly below or diagonally below the second feature, or simply that the first feature is at a lower horizontal level than the second feature.

[0053] This application provides a cutting method and a slicing machine, avoiding the problem of machine downtime due to diamond wire 200 detection affecting equipment uptime.

[0054] To better understand the above technical solutions, a detailed description of the technical solutions will be provided below in conjunction with the accompanying drawings and specific embodiments. It should be understood that the specific embodiments described herein are merely illustrative of this application and are not intended to limit the scope of this application.

[0055] In the process of cutting photovoltaic and semiconductor silicon rods M, diamond wire 200 serves as the core cutting tool. The diamond particles attached to its surface are used to peel off the silicon material through high-speed grinding. Due to potential local quality differences in the manufacturing process of diamond wire 200 (such as uneven distribution of diamond particles in a certain section or deviation in the thickness of the electroplated layer), or local abnormal stress during the cutting process (such as instantaneous impact wear caused by hard points in the silicon rod M, or increased friction caused by local defects in the groove of the main roller 100), abnormal wear may occur in certain sections of diamond wire 200. That is, the degree of diamond particle detachment and passivation in a certain section of diamond wire 200 is significantly higher than that in other sections, forming a wear section.

[0056] Performance testing of diamond wire 200 (such as abrasive distribution, wire diameter uniformity, and localized wear) largely relies on offline sampling and analysis after the cutting operation has stopped. This method requires interrupting the production process, resulting in a significant decrease in equipment uptime (the percentage of actual equipment running time), severely impacting production efficiency and reducing equipment uptime. Furthermore, traditional testing methods have the following drawbacks:

[0057] Poor detection timeliness: Offline detection cannot reflect the changes in the state of the diamond wire 200 during the cutting process in real time. The worn section may continue to cut even when it is not detected, resulting in defects such as scratches and uneven thickness on the silicon wafer surface; unreasonable compensation method: If the cutting ability of the worn section is repaired by global tension compensation, the normal section will be subjected to excessive tension, increasing the risk of wire breakage and damage to the silicon wafer surface; difficult to eliminate interference factors: Single temperature monitoring is easily affected by silicon rod M deflection, coolant abnormalities, etc., making it difficult to distinguish between "local wear" and "normal system fluctuations";

[0058] Most importantly, the rate of missed detection for localized wear is high: offline sampling inspection is prone to missing worn sections (only some segments are inspected), and the reduced cutting ability of worn sections will directly cause fluctuations in silicon wafer quality; even when the machine is stopped for inspection, sampling inspection is usually used, that is, selecting a local section of diamond wire 200 for parameter analysis; however, during the high-speed cutting process of diamond wire 200, the degree of wear in different sections varies significantly, and the severely worn sections may not be covered by sampling inspection. In other words, localized wear is extremely difficult to detect. The length of diamond wire 200 is usually several kilometers. If "sampling inspection" is used in production (such as randomly cutting a 10cm segment for inspection), and a normal section happens to be selected, it will be mistakenly judged that the entire diamond wire 200 is in good condition, resulting in an inaccurate performance evaluation of the entire diamond wire 200. The worn section continues to participate in cutting, which in turn causes defects such as scratches, uneven thickness, and edge chipping on the silicon wafer surface. In severe cases, it may even lead to the scrapping of a batch of silicon wafers.

[0059] If local wear is found during the cutting process, the machine will be stopped for maintenance, which will interrupt the current cutting process of silicon rod M (the cutting cycle of a single silicon rod M is usually 1-2 hours), resulting in a decrease in equipment utilization and delays in production plans. Especially in large-scale mass production scenarios, a single unplanned shutdown may cause a loss of tens of thousands of yuan in production capacity.

[0060] Therefore, there is an urgent need to propose a cutting method for a slicing machine, which can detect local wear of the diamond wire 200 in real time without stopping the machine, avoiding efficiency loss caused by offline detection; how to accurately distinguish between local wear of the diamond wire 200 and system interference through multi-dimensional judgment logic, reducing the false judgment rate; and how to implement directional tension compensation for the worn section, avoiding the impact of global compensation on normal segments, and ensuring cutting quality.

[0061] In this application, it is important to understand that during the diamond wire 200 cutting process, it is necessary to distinguish between the "tolerable wear" and "fatal defects" of the diamond wire 200. Specifically, although the cutting capability of the worn section decreases, it can still maintain basic cutting accuracy in a short period of time (such as within 1-2 hours of completing the current silicon rod M cutting) (by controlling defects within the qualified threshold through auxiliary means such as dynamic tension compensation), without the need for immediate shutdown. After detecting local wear, the system records the location of the worn section and continues to execute the current cutting task. After the current batch of silicon rod M cutting is completed, the diamond wire 200 is repaired in a targeted manner (such as partially replacing the worn section or replacing the entire line). This avoids the disruption of the production rhythm caused by unplanned shutdowns and prevents the silicon wafer quality from going out of control due to the long-term operation of the worn section.

[0062] This invention aims to solve the problem of low equipment uptime caused by the need to stop the machine for diamond wire 200 inspection in the prior art. It also addresses the technical defects of insufficient accuracy in local wear detection and unreasonable compensation methods. The invention provides an online detection and dynamic compensation cutting method, which enables real-time monitoring of the diamond wire 200 status without stopping the machine for inspection; accurately identifies wear sections and eliminates system interference; provides directional compensation for the cutting capacity of wear sections to avoid overloading of normal wire sections; and improves silicon wafer cutting quality and equipment production efficiency.

[0063] This application proposes a cutting method for a slicer, applicable to a slicer, such as... Figure 1 As shown, the slicing machine includes a main roller 100 and a diamond wire 200. The diamond wire 200 is wound around the main roller 100 and cuts the silicon rod M by being driven by the main roller 100. Specifically, there are at least two main rollers 100. The diamond wire 200 is wound between the main rollers 100 so that the diamond wire 200 forms a wire mesh between the main rollers 100, and the silicon rod M is located on the wire mesh and is cut.

[0064] Cutting methods include:

[0065] The diamond wire 200 is driven and the silicon rod M is cut by the diamond wire 200;

[0066] The main roller 100 is divided into several regions 110 along the axial direction;

[0067] The temperature change of the main roller 100 per unit time is obtained in each region 110;

[0068] Based on the temperature change and a preset threshold, it is determined whether there is a wear segment in the diamond wire 200.

[0069] First, the basic cutting process is executed, which involves starting the diamond wire 200 to cut the silicon rod M; driving the diamond wire 200 with the main roller 100, and the rotation of the main roller 100 drives the diamond wire 200 to move at a certain speed, forming a high-speed moving wire mesh; controlling the silicon rod M to feed towards the wire mesh, so that the diamond wire 200 contacts the silicon rod M, and the silicon rod M is cut by the grinding action of the diamond abrasive grains; at this time, the diamond wire 200 is in normal transmission state, the wire mesh tension remains stable, the silicon rod M is uniformly stressed, and the cutting process continues.

[0070] Furthermore, such as Figure 2 As shown, in the above basic cutting process, the main roller 100 is partitioned and temperature monitoring is deployed; the main roller 100 is uniformly divided into several continuous and non-overlapping regions 110 along the axial direction (e.g., divided into 4-20 regions 110), and the width of the region 110 is set according to the length of the main roller 100 and the detection accuracy requirements; a non-contact temperature sensor 400 is set at the corresponding position of each region 110. In one embodiment, the non-contact temperature sensor 400 can be an infrared temperature sensor, which is used to obtain the temperature change of the surface of the main roller 100 in real time per unit time (e.g., the temperature is collected once per second, and the temperature difference between two adjacent collections is calculated).

[0071] Understandably, taking a main roller of 100 as an example, such as Figure 2 As shown, the main roller 100 is divided into independent detection units, and the temperature change of each region 110 can be monitored individually, enabling precise location of temperature anomalies. Of course, for accurate detection and location, the method of this application can also be performed on each main roller 100. Furthermore, when the diamond wire 200 comes into contact with the main roller 100, the worn section generates more heat due to increased friction, which causes the temperature of the corresponding region 110 of the main roller 100 to rise. By monitoring the zones, the worn section can be located, avoiding the ambiguity of overall monitoring. The continuous main roller 100 is transformed into discrete detection regions 110, providing a spatial reference for local wear location. The temperature change can directly reflect the friction state between the worn section of the diamond wire 200 and the main roller 100.

[0072] By comparing the temperature change with a preset threshold, and combining time sequence and spatial location for a three-level judgment, local wear of diamond wire 200 can be accurately identified.

[0073] The first level of judgment includes: if the temperature change in any region 110 is greater than a preset threshold, the diamond wire 200 is judged to be abnormal.

[0074] The second-level determination includes: if the temperature change in each region 110 at the same time exceeds a preset threshold, the diamond wire 200 is determined to have no wear segment. Alternatively, if the temperature change in any region 110 at the same time exceeds a preset threshold, and the temperature change in the other regions 110 does not exceed the preset threshold, the diamond wire 200 is determined to have at least one wear segment.

[0075] Third-level judgment: In terms of timing, the temperature change in region 110 along the direction of the main roller 100 is greater than the preset threshold; the wear section is judged to be driven along the direction of the main roller 100 by the diamond wire 200.

[0076] Specifically, the first-level judgment is used for preliminary anomaly detection of the diamond wire 200. The judgment logic is as follows: if the temperature change in any region 110 is greater than a preset threshold (such as 3℃, 4℃, 5℃), then the diamond wire 200 is judged to be abnormal. During normal cutting, the diamond wire 200 and the main roller 100 have stable friction and small temperature changes (such as ≤2℃). Local wear will increase the friction coefficient and significantly increase the temperature change. An abnormal temperature in a single region 110 indicates that the diamond wire 200 segment corresponding to region 110 may be worn or interfered with by other factors, and further verification is required. Temperature abnormality is a direct manifestation of abnormal state of the diamond wire 200. By setting a reasonable threshold, potential problem regions 110 can be quickly screened out, providing a basis for subsequent judgment. In this way, potentially problematic regions 110 can be quickly identified, avoiding the omission of potential wear segments and improving the efficiency of preliminary screening.

[0077] The second-level judgment is used to eliminate interference and confirm wear of the diamond wire 200. Based on the abnormal results of the first-level judgment, system interference is eliminated by comparing the 110°C temperature in multiple regions.

[0078] In the first case: the temperature change of each region 110 at the same time is greater than the preset threshold, and it is determined that the diamond wire 200 has no wear section. It should be noted that in this case, the deflection and cutting of the silicon rod M may cause the overall pressure of the wire mesh to increase, and the friction is generally enhanced.

[0079] In the second case: if the temperature change of any one region 110 is greater than the preset threshold at the same time, and the temperature change of the other regions 110 does not exceed the preset threshold, it is determined that the diamond wire 200 has at least one wear segment. It should be noted that in this case, the wear segment generates heat by friction with the main roller 100 when it passes through the region 110.

[0080] Synchronous anomalies in the 110 temperature across multiple regions indicate systemic factors (such as silicon rod M offset or deflection), while anomalies in a single region point to localized wear, enabling a preliminary distinction between interference and wear. Systemic interference, such as silicon rod M offset, affects the stress state of the entire network, causing a synchronous rise in the 110 temperature across all regions. Localized wear, on the other hand, only affects the corresponding region's 110 temperature, making the temperature anomalies localized. This can be effectively distinguished by comparing multiple regions' 110 temperatures. In this way, misjudgments caused by systemic interference are eliminated, improving the accuracy of wear assessment.

[0081] The third-level judgment is used to verify the motion state of the wear section. The judgment logic is as follows: In terms of timing, if the temperature change of the subsequent region 110 along the axial direction of the main roller 100 (i.e. the direction of movement of the diamond wire 200) is greater than the preset threshold, it is determined that the wear section is transmitted along the direction of the main roller 100 with the diamond wire 200. The timing correlation is based on the fact that the diamond wire 200 moves continuously along the main roller 100, and the wear section will pass through different regions 110 in sequence, causing the temperature of the corresponding region 110 to rise in time sequence, and the temperature rise interval matches the movement speed of the diamond wire 200.

[0082] The temperature abnormality area 110 migrates sequentially along the movement direction of the diamond wire 200, forming a continuous temperature abnormality trajectory, which is consistent with the movement path of the wear section. The wear section moves with the diamond wire 200, and its corresponding temperature abnormality area 110 will also move along the axial direction of the main roller 100 over time. Through time sequence analysis, the existence and movement status of the wear section can be confirmed, avoiding misjudgment as a equipment failure of the fixed area 110. In this way, the authenticity and movement characteristics of the wear section are further verified, interference factors such as local failures of the main roller 100 are eliminated, and the accuracy of the judgment is improved.

[0083] Furthermore, such as Figure 3 , 4 As shown, this application also includes tension compensation based on the area 110 where the wear segment is located. After confirming the existence of the wear segment and locating its movement trajectory, directional compensation is achieved by adjusting the tension in area 110. The wire mesh portion corresponding to area 110 is defined as wire mesh area 210; the area 110 where the wear segment is located is defined as target area 110; the slicing machine also includes tension components 300, the number of tension components 300 is the same as the number of areas 110 and they are set one-to-one, the tension components 300 are connected to the wire mesh area 210 corresponding to area 110 to adjust the tension of wire mesh area 210; in the next reciprocating cycle, when it is determined that the wear segment is located in target area 110, the diamond wire 200 causes the tension component 300 corresponding to target area 110 to increase the tension of the corresponding wire mesh area 210 to perform cutting tension compensation.

[0084] Specifically, for ease of understanding, such as Figure 3As shown, the wire mesh area 210 is defined as: the portion of the wire mesh corresponding to area 110 of each main roller 100 is the wire mesh area 210, that is, the wire mesh portion composed of diamond wire 200 segments within area 110; the target area 110 is defined as: the main roller 100 area 110 where the current wear segment is located; as shown Figure 4 As shown, the slicing machine also includes a tension assembly 300, which is used to perform tension compensation on the target area 110. The number of tension assemblies 300 is the same as the number of areas 110 and they are set one-to-one. The tension assemblies 300 are connected to the corresponding wire mesh area 210 and can adjust the tension of the wire mesh area 210. That is, the tension assemblies 300 correspond one-to-one with the wire mesh area 210 and can independently control the wire mesh tension of each area 110, providing a structural basis for directional compensation. It should be noted that since the silicon rod M is rigid and cannot be locally pressurized, by adjusting the tension of the wire mesh area 210 where the wear section is located, this application specifically improves the cutting force of this area 110 and makes up for the insufficient cutting capacity of the wear section.

[0085] like Figure 4 As shown, the tension assembly 300 includes a plurality of tension rollers 310; the position between the wire mesh area 210 corresponding to the target area 110 and the previous wire mesh area 210 is defined as the first transition zone 220; the position between the wire mesh area 210 corresponding to the target area 110 and the next wire mesh area 210 is defined as the second transition zone 230.

[0086] "Previous Line Net Area 210" refers to the net portion corresponding to the adjacent area 110 before the current target area 110 in the direction of movement of the diamond wire 200, corresponding to the net portion of the previous target area 110 (i.e., the area 110 that the wear segment passes through before entering the current target area 110); "Next Line Net Area 210" refers to the net portion corresponding to the adjacent area 110 after the current target area 110 in the direction of movement of the diamond wire 200, corresponding to the net portion of the next target area 110 (i.e., the area 110 that the wear segment will enter after leaving the current target area 110).

[0087] "When the wear section is determined to be located in the target area 110, the tension component 300 corresponding to the target area 110 increases the tension of the corresponding wire mesh area 210 to perform cutting tension compensation" includes: making the tension value of the tension roller 310 acting on the corresponding wire mesh area 210 linearly increase from the reference value to the compensation value along the direction from the first transition area 220 to the second transition area 230, and then linearly decrease from the compensation value to the reference value, so as to make the tension transition smoothly.

[0088] More specifically, in the next reciprocating cycle, when the wear section is determined to be located in the target area 110, the corresponding tension component 300 is activated; the tension component 300 corresponding to the target area 110 is controlled to increase the tension of the wire mesh area 210 (e.g., from the reference value of 10N to 12N) to enhance the cutting force; this application performs tension smoothing processing near the transition area, defining the transition between the target area 110 and the previous wire mesh area 210 as the first transition area 220, and the transition with the next wire mesh area 210 as the second transition area 230. The tension roller 310 makes the tension value linearly increase from the reference value to the compensation value along the direction from the first transition area 220 to the second transition area 230, and then linearly decrease to the reference value. The tension changes smoothly in the transition zone, avoiding sudden changes that could cause wire mesh vibration and ensuring a stable cutting process. Sudden tension changes can cause wire mesh to deflect and lead to edge chipping of the silicon wafer. A linear transition can ensure that the wire mesh is subjected to uniform force, thus guaranteeing the quality of the silicon wafer edge. The cutting force in the compensation area 110 is increased by 20%-30%, the cutting ability of the worn section is restored, and the tension in the transition zone is stable, reducing the edge chipping rate of the silicon wafer by 60%.

[0089] It should be noted that a complete "reciprocating cycle" refers to the unidirectional movement of the diamond wire 200 from "released from the pay-off shaft → passing through the wire mesh cutting area of ​​the main roller 100 → winding back to the take-up shaft," and the reverse movement from "released from the take-up shaft in the opposite direction → passing through the wire mesh cutting area again → winding back to the pay-off shaft," forming a "forward → reverse" cycle. After detecting a wear section in the current cycle, the diamond wire 200 completes this cycle (e.g., from pay-off to take-up) and enters the next cycle stage of passing through the wire mesh area 210. "In the next reciprocating cycle" refers to the diamond wire 200 completing one movement from pay-off to take-up. The reverse motion cycle allows us to utilize the wear segment location information detected in the previous cycle to prepare for compensation in advance when the target area 110 is passed again in the next cycle. This ensures the accuracy of compensation because detecting the wear segment takes time, and the wear segment location detected in the current cycle will repeatedly pass through the same area 110 in the next cycle. This periodicity allows compensation to be started in advance, avoiding untimely compensation due to detection delays in the current cycle. At the same time, combined with previous detection results, the location and movement trajectory of the wear segment can be accurately determined, allowing for targeted compensation in the next cycle, improving efficiency and accuracy, and avoiding erroneous compensation.

[0090] In one embodiment, the tension value can be adjusted by visually changing the height of the tension roller 310. When the height of the tension roller 310 is increased, the diamond wire 200 is lifted upwards, the wire mesh tension increases, and the tension value increases; when the height is decreased, the tension decreases. In this embodiment, the linear change in tension corresponds to the linear adjustment of the height of the tension roller 310. Along the first transition zone 220 to the second transition zone 230, the height of the tension roller 310 gradually rises from the reference position to the compensation position, and then gradually falls back to the reference position. The continuous change in height achieves a smooth transition of tension from the reference value to the compensation value, avoiding tension fluctuations caused by sudden changes in height. At the same time, multiple groups of tension rollers 310 can be provided, and each group of tension rollers 310 can drive one or more diamond wires 200, ensuring coordinated tension adjustment of all diamond wires 200 within the region 110 and improving the consistency of compensation.

[0091] It should be noted that the tension roller 310 can be lifted by linearly driving the tension roller 310 or deflecting the tension roller 310 through a bracket, so that the tension roller 310 can be raised and lowered. The bracket can be set inside the space enclosed by the diamond wire 200, and the bracket can be connected to a liquid receiving tank or an external frame or other structures that can be fixedly installed.

[0092] Furthermore, it also includes compensation time range control. The tension compensation time range is: it starts when the temperature change in the current target area 110 exceeds a preset threshold; and it ends when the temperature change in the next target area 110 exceeds a preset threshold.

[0093] Start-up time: The temperature change in the current target area 110 exceeds the preset threshold. When the wear segment enters the current target area 110, the friction between the diamond wire 200 and the main roller 100 intensifies due to the increased friction coefficient caused by wear. The surface temperature of the main roller 100 rises significantly in a short time (usually 0.5-1 second). When the temperature change exceeds the preset threshold (e.g., 3℃, 4℃, 5℃), it can be determined that the wear segment has completely entered the area 110. At this time, starting tension compensation can accurately match the cutting time of the wear segment. At this time, the wear segment is in complete contact with the wire mesh in the current area 110, and the problem of insufficient cutting force is most prominent. Increasing the tension can immediately enhance the grinding effect and avoid insufficient local cutting of silicon wafers (e.g., excessive thickness, surface scratches) due to compensation lag.

[0094] End time: The temperature change in the next target area 110 exceeds the preset threshold. The diamond wire 200 moves along the main roller 100 at a constant speed, and the wear section will pass through the adjacent area 110 in sequence with the diamond wire 200; when the wear section of the current target area 110 leaves and enters the next area 110, the temperature of the main roller 100 in the next area 110 will exceed the preset threshold due to increased friction. At this time, the wear section of the previous area 110 has completely detached, and tension compensation can be stopped to ensure that the compensation time is completely matched with the actual elapsed time of the wear section; "next target area 110" specifically refers to "the adjacent area 110 in the direction of movement of the diamond wire 200 along the axial direction of the main roller 100 when the diamond wire 200 is driven along the axial direction of the main roller 100", that is, the next target area is the adjacent area along the direction of movement of the diamond wire.

[0095] This application also provides a slicer, such as Figure 1 As shown, the slicing machine includes a main roller 100, diamond wire 200, a non-contact temperature sensor 400, and a tension assembly 300. The main roller 100 has at least two sections, divided axially into several regions 110 for supporting and driving the diamond wire 200. The diamond wire 200 is wound between the main rollers 100 to form a wire mesh, and the silicon rod M is located on the wire mesh and cut. The non-contact temperature sensor 400 is positioned above, to the side, or near the main roller 100, with the number of sensors corresponding to each region 110, used to acquire the temperature change of the main roller 100 in the corresponding region 110. The tension assembly 300 has the same number as and corresponds to each region 110, and is connected to the wire mesh region 210 corresponding to each region 110 for adjusting the tension of the wire mesh region 210.

[0096] Although preferred embodiments of this application have been described, those skilled in the art, upon learning the basic inventive concept, can make other changes and modifications to these embodiments. Therefore, the appended claims are intended to be interpreted as including the preferred embodiments as well as all changes and modifications falling within the scope of this application.

[0097] Obviously, those skilled in the art can make various modifications and variations to this application without departing from the spirit and scope of this application. Therefore, if such modifications and variations fall within the scope of the claims of this application and their equivalents, this application also intends to include such modifications and variations.

Claims

1. A cutting method for a slicer, characterized in that, Applied to a slicer, the slicer comprising: Main roller (100), said main roller (100) having at least two; Diamond wire (200) is wound between the main rollers (100) to form a wire mesh between the main rollers (100), and a silicon rod (M) is cut on the wire mesh; the cutting method includes: The diamond wire (200) is driven and the silicon rod (M) is cut by the diamond wire (200); The main roller (100) is divided into several regions (110) along the axial direction. The temperature change of the main roller (100) per unit time is obtained in each of the regions (110); Based on the temperature change and a preset threshold, determine whether there is a wear segment in the diamond wire (200); Also includes: The first level of judgment includes: if the temperature change in any region (110) is greater than the preset threshold, the diamond wire (200) is judged to be abnormal; The second level of judgment includes: if the temperature change in each region (110) is greater than the preset threshold at the same time, the diamond wire (200) is determined to have no wear segment; or, if the temperature change in any region (110) is greater than the preset threshold at the same time, and the temperature change in the other regions (110) does not exceed the preset threshold, the diamond wire (200) is determined to have at least one wear segment. Third-level judgment: In terms of timing, the temperature change in region (110) along the direction of the main roller (100) is greater than the preset threshold; the wear section is judged to be driven along the direction of the main roller (100) by the diamond wire (200); Define the wire mesh portion of the transmission corresponding to the area (110) as the wire mesh area (210); define the area (110) where the wear section is located as the target area (110). The slicer also includes tension components (300), the number of which is the same as the number of regions (110) and they are set one-to-one. The tension components (300) are connected to the wire mesh area (210) corresponding to the region (110) to adjust the tension of the wire mesh area (210). In the next reciprocating cycle, when the wear section is determined to be located in the target area (110), the tension component (300) corresponding to the target area (110) increases the tension of the corresponding wire mesh area (210) to perform cutting tension compensation.

2. The cutting method of a slicer according to claim 1, characterized in that, The tension assembly (300) includes several tension rollers (310); the position between the wire mesh area (210) corresponding to the target area (110) and the previous wire mesh area (210) is defined as the first transition zone (220); the position between the wire mesh area (210) corresponding to the target area (110) and the next wire mesh area (210) is defined as the second transition zone (230). The phrase "when the wear segment is determined to be located in the target area (110), the tension component (300) corresponding to the target area (110) increases the tension of the corresponding wire mesh area (210) to perform cutting tension compensation" includes: The tension value of the tension roller (310) acting on the corresponding wire mesh area (210) is linearly increased from the reference value to the compensation value along the direction from the first transition area (220) to the second transition area (230), and then linearly decreased from the compensation value back to the reference value, so as to make the tension transition smoothly.

3. The cutting method of a slicer according to claim 1, characterized in that, The tension compensation time range is: It is initiated when the temperature change in the current target area (110) exceeds a preset threshold; and The process ends when the temperature change in the next target area (110) exceeds a preset threshold.

4. A slicer, characterized in that, The slicer, applicable to the method of claim 1, comprises: The main roller (100) has at least two main rollers, and the main rollers (100) are divided into several regions (110) along the axial direction. Diamond wire (200) is wound between the main rollers (100) to form a wire mesh between the main rollers (100), and the silicon rod (M) is cut on the wire mesh; A non-contact temperature sensor (400) is provided, and there are multiple non-contact temperature sensors (400). Each non-contact temperature sensor (400) corresponds to one region (110). The non-contact temperature sensor (400) is used to obtain the temperature change of the corresponding region (110) within a unit time. The diamond wire (200) is driven and the silicon rod (M) is cut by the diamond wire (200); The main roller (100) is divided into several regions (110) along the axial direction. The temperature change of the main roller (100) per unit time is obtained in each of the regions (110); Based on the temperature change and a preset threshold, it is determined whether there is a wear segment on the diamond wire (200).

5. A slicer according to claim 4, characterized in that, Also includes: Tension assembly (300) The number of tension assembly (300) is the same as the number of regions (110) and they are set one-to-one. The tension assembly (300) is connected to the wire mesh area (210) corresponding to the region (110) to adjust the tension of the wire mesh area (210).

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