Preparation method of structural component, structural component and electronic equipment

Abstract

The embodiment of the invention provides a preparation method of a structural member, which comprises the following steps: providing a fiber prepreg which is a fiber treated by thermoplastic resin; stacking a plurality of layers of fiber prepregs, placing the stacked fiber prepregs in a mold, and closing the mold and pressurizing the mold under a first condition to obtain the substrate; and thermoplastic resin is injected into the mold, the protruding structure is formed under the second condition, and the structural part is obtained after demolding. According to the preparation method, by adding the fibers, the structural strength of the structural part can be effectively improved, and space is provided for thinning design of the structural part. According to the preparation method, the structural part of the special-shaped structure can be formed in only one set of mold, and the manufacturing cost is lower. Meanwhile, the embodiment of the invention further provides a structural component and electronic equipment.

Description

Technical Field

[0001] The present application relates to the field of material processing technology, and in particular to a method for preparing a structural component, a structural component, and an electronic device. Background Art

[0002] With the rapid development of foldable electronic devices, their shortcomings of heavy weight and thick overall thickness have continued to emerge. Further thinning and weight reduction of structural parts while ensuring the reliability of the entire machine has become an inevitable trend in the development of the foldable mobile phone industry.

[0003] Foldable electronic devices are equipped with various internal structural components. Parameters such as weight, thickness, and structural strength of these components are crucial to the weight and structural strength of the electronic device. For example, the display screen components primarily protect the screen from damage from crushing and falling. In related technologies, these components are relatively thick to ensure structural strength, making it difficult to further reduce the thickness and weight of the entire electronic device. Summary of the Invention

[0004] The purpose of this application is to provide a method for preparing a structural component, a structural component, and an electronic device, so as to at least partially improve the above-mentioned technical problems.

[0005] In a first aspect, an embodiment of the present application provides a method for preparing a structural member, wherein the structural member includes a substrate and a protruding structure on a surface of the substrate, the method comprising: A fiber prepreg is provided, wherein the fiber prepreg is a fiber treated with a thermoplastic resin; multiple layers of the fiber prepreg are stacked and placed in a mold, and the mold is closed and pressurized under a first condition to obtain the substrate; a thermoplastic resin is injected into the mold, and the protruding structure is formed under a second condition, and the structural part is obtained after demolding.

[0006] In a second aspect, an embodiment of the present application provides a structural component, which is prepared according to the above-mentioned method for preparing a structural component.

[0007] In the third aspect, an embodiment of the present application provides an electronic device, including a shell assembly, a flexible display and a structural member, the shell assembly including a first shell, a second shell and a rotating connection member, the rotating connection member is connected between the first shell and the second shell, the first shell rotates relative to the second shell through the rotating connection member, during the rotation process, the first shell and the second shell are selectively folded or unfolded, the flexible display is continuously arranged on the first shell and the second shell, the structural member is arranged on the first shell and the second shell, the structural member is arranged on the edge of the flexible display, and the structural member is prepared according to the above-mentioned structural member preparation method.

[0008] The preparation method of the structural parts provided in the present application is to mold the fibers according to the required thickness to form a base by stacking fiber prepregs, and then injection mold various protruding structures on the base. This preparation method can effectively improve the structural strength of the structural parts by adding fibers, and provide space for the thinning design of the structural parts. At the same time, the stacking processing method can make the thickness of the entire base and the structural parts easier to control, and the structural parts finally formed can ensure the structural strength of the structural parts with a smaller thickness. The application of structural parts in electronic equipment can improve the structural strength and provide space for the thinning design of electronic equipment. The above preparation method can form structural parts with special-shaped structures in only one set of molds, and the manufacturing cost is lower.

[0009] These and other aspects of the present application will become more readily apparent from the description of the following embodiments. BRIEF DESCRIPTION OF THE DRAWINGS

[0010] In order to more clearly illustrate the technical solutions in the embodiments of the present application, the following briefly introduces the drawings required for use in the description of the embodiments. Obviously, the drawings described below are only some embodiments of the present application. For those skilled in the art, other drawings can be obtained based on these drawings without creative work.

[0011] Figure 1 This is a flow chart of a method for preparing a structural member provided in an embodiment of the present application; Figure 2 This is a schematic diagram of the structure of an electronic device provided in an embodiment of the present application; Figure 3 This is a schematic diagram of the structure of a structural component in an electronic device provided in an embodiment of the present application. DETAILED DESCRIPTION

[0012] The following will be combined with the drawings in the embodiments of this application to clearly and completely describe the technical solutions in the embodiments of this application. Obviously, the embodiments described are only part of the embodiments of this application, not all of the embodiments. Based on the embodiments in this application, all other embodiments obtained by ordinary technicians in this field without making creative efforts are within the scope of protection of this application.

[0013] Foldable electronic devices are equipped with various internal structural components. Parameters such as weight, thickness, and structural strength of these components are crucial to the weight and structural strength of the electronic device. For example, the display screen components primarily protect the screen from damage from crushing and falling. In related technologies, these components are relatively thick to ensure structural strength, making it difficult to further reduce the thickness and weight of the entire electronic device.

[0014] Based on this, the inventors of this application have proposed a method for manufacturing a structural component, a structural component, and an electronic device, in order to at least partially improve the above technical problems.

[0015] See Figure 1 This embodiment provides a method for preparing a structural component, wherein the structural component includes a base and a protruding structure, wherein the protruding structure is provided on the base, wherein the protruding structure can be a structure used by the structural component to connect with other components, such as a screw hole or other structure; the protruding structure can also refer to other protruding parts of the structural component. It is understandable that the protruding structure can be one or more, and this embodiment does not limit this. The base is a generally planar structure, and the protruding structure can be various types of special-shaped structures, that is, the structural component prepared in this embodiment is a special-shaped structural component.

[0016] See Figure 1 , the above-mentioned preparation method comprises the following steps: Step S110: providing fiber prepreg.

[0017] Described fiber prepreg is the fiber after being processed by thermoplastic resin, and thermoplastic resin is attached to fiber, and preferably, fiber can select continuous fiber, i.e. long fiber, and its length can be 500-1000 millimeter or longer, and the structural strength of long fiber is stronger, and especially can significantly improve the structural strength of structural member after molded forming substrate.Wherein, fiber can be selected from at least one of glass fiber, carbon fiber, aramid fiber, poly (p-phenylene benzobisoxazole) fiber, and i.e. fiber can only comprise a kind of, also can be the multiple mixture in above-mentioned various types of fibers, and multiple refers to two or more.Above-mentioned fiber all has good structural strength, and the intensity of the structural member finally formed can be enhanced like this.

[0018] A thermoplastic resin refers to a resin that can be repeatedly heated to soften and cooled to harden within a specific temperature range. When heated, it softens and melts, becoming a flowable viscous liquid. In this state, it can be subjected to various molding processes, such as injection, extrusion, blow molding, etc.; after cooling, it hardens and takes shape again, and this process can be repeated. Its molecular structure basically does not undergo chemical changes during the heating and cooling process. In this embodiment, the thermoplastic resin can be selected from at least one of polycarbonate, polyacrylate, polyamide, and polyvinyl alcohol. These thermoplastic resins have a moderate density, the weight of the formed structural parts is not too large, and the wear resistance is good. It is understandable that in some other embodiments, other thermoplastic resins, such as polypropylene, polyethylene, etc., can also be used, and this embodiment does not limit this.

[0019] The fiber prepreg can be obtained in advance. It can also be prepared now. In a more specific embodiment, the fiber prepreg can be prepared in the following manner: the fiber is placed in a container containing thermoplastic resin, and the fiber is kept immersed for at least 30 minutes. When the fiber is placed in the container, the fiber can be kept in a single layer, that is, the fiber does not overlap when placed, so that the thickness of the fiber prepreg can be accurately controlled. For example, with a fiber weight of 50g / m 2 For example, the thickness of glass fiber when laid flat in a single layer is about 0.04 mm, and the fiber weight is 80 g / m 2 For example, the thickness of glass fiber when laid flat in a single layer is about 0.07 mm. It is understandable that the immersion time can be set longer to ensure the pre-impregnation effect, but too long a time will lead to reduced production efficiency. Preferably, the pre-impregnation time can be, for example, 30 minutes, 35 minutes, 40 minutes, etc.

[0020] Step S120: stacking multiple layers of fiber prepreg, placing them in a mold, closing the mold and applying pressure under a first condition to obtain a substrate.

[0021] It should be noted that the term "multi-layer" herein refers to two or more layers, each of which is coated with a thermoplastic resin. After stacking, the layers are joined together by mold closing and pressurizing to form a substrate. The substrate is a generally planar structure with a generally uniform thickness throughout.

[0022] In step S120, the number of fiber prepreg layers can be predetermined, and then the multiple layers of fiber prepreg can be stacked together in sequence. Specifically, the number of fiber prepreg layers can be determined based on the thickness of the substrate and the thickness of the fiber prepreg. The desired number of fiber prepreg layers can be stacked, placed in a mold, and then closed and pressurized under the first condition to obtain the substrate. The thickness of the substrate is the design thickness, and the thickness of the fiber prepreg can be precisely determined based on the different fibers.

[0023] For example, to form a 0.16mm structural part, three layers of fiber with a gram weight of 50g / m 2 The fiber prepreg of glass fiber is stacked to form the base, or two layers of fiber with a gram weight of 80g / m 2 The fiber prepregs of glass fibers are stacked to form a substrate. In other embodiments, the number of layers of fiber prepregs may be other values ​​depending on the thickness of the substrate and the thickness of the fiber prepregs, which is not limited in this embodiment.

[0024] In one embodiment, step S120 can be performed as follows: stack multiple layers of the fiber prepreg, place them in a mold, and press them under a pressure of 5-15 kgf / cm2 The mold is closed and pressurized at a temperature of 120°C-160°C to obtain the substrate. Under this first condition, the multi-layer fiber prepreg can be completely fused and have a moderate density, and the structural strength of the substrate finally formed is good. The pressure can be, for example, 5-8 kgf / cm 2 、8-10kgf / cm 2 、10-12kgf / cm 2 、12-15kgf / cm 2 、8-12kgf / cm 2 And so on, the temperature can be, for example, 120°C-140°C, 140°C-160°C, 130°C-150°C, etc.

[0025] The substrate obtained in step S120 is a roughly planar structure formed by pressurizing and fusing multiple layers of fiber prepreg. At this point, the substrate is still in the mold. Because the structural member also includes raised structures disposed on the substrate, the mold is not yet fully filled, and step S130 can be continued.

[0026] Step S130: injecting thermoplastic resin into the mold to form a protruding structure under the second condition, and then demolding to obtain a structural part.

[0027] The mold described here is the same set of molds as the mold in step S120, and there is no need to transfer the substrate obtained in step S120, which reduces the preparation cost and improves production efficiency.

[0028] It should be noted that the thermoplastic resin here is the same thermoplastic resin as the thermoplastic resin used in the fiber prepreg in step S110. In this way, the connection strength of the structural parts formed by injection molding can be made higher, and it is not easy to form defects inside the structural parts, especially between the base and the protruding structure, which may lead to cracking during later use.

[0029] In some embodiments, an appropriate amount of fiber may be added to the thermoplastic resin in step S130. The added fiber may be short fiber, such as glass fiber with a length of 0.2-6 mm. The addition of fiber can improve the structural strength of the formed protrusion structure. For example, the amount of fiber added may comprise 10 wt% to 50 wt% of the entire injected thermoplastic resin and fiber mixture.

[0030] In one embodiment, step S130 can be performed as follows: injecting thermoplastic resin into the mold at a pressure of 5-15 kgf / cm 2The mold is closed and pressure maintained at 120-160°C for 2-6 minutes, and then cooled to room temperature at a rate of 50-150°C / min to form the protruding structure. After demolding, the structural part is obtained. The pressure can be, for example, 5-8 kgf / cm 2 、8-10kgf / cm 2 、10-12kgf / cm 2 、12-15kgf / cm 2 、8-12kgf / cm 2 And so on, the temperature can be, for example, 120°C-140°C, 140°C-160°C, 130°C-150°C, etc.

[0031] After the pressure is maintained, the temperature can be rapidly lowered to allow the thermoplastic resin to solidify quickly and prevent it from flowing out of the mold and causing deformation. The cooling rate can be, for example, 50-100°C / min, 100-150°C / min, 80-120°C / min, etc.

[0032] After cooling, the formed structural parts will shrink in volume due to solidification and separate from the mold, so they can be directly demolded and removed.

[0033] The resulting structural component, comprising fibers and an injected thermoplastic resin, exhibits excellent processability and can be further processed, such as by bending, shearing, or milling, to form the desired structure, depending on the intended use. For example, the structural component produced by the aforementioned preparation method can be used to manufacture components within electronic devices, such as components supporting display screens or components such as the ramp plate in a hinge assembly.

[0034] The following describes in detail the method for preparing the structural member provided by the present application in conjunction with specific embodiments.

[0035] Example 1 Select fiber weight of 50g / m 2 The glass fiber is placed in a container containing thermoplastic resin and immersed in the thermoplastic resin for 30 minutes before being taken out and used as fiber prepreg. The thermoplastic resin is PC resin (i.e., polycarbonate).

[0036] Three layers of fiber prepreg are stacked in sequence and then placed in the mold. The mold clamping pressure is set to 10kgf / cm 2 , the temperature is 140℃, the mold is closed and pressurized, and the base is obtained by holding for 5 minutes. Then the thermoplastic resin is injected into the mold and the pressure is 10kgf / cm 2 The mold was closed and pressure-maintained at 140°C for 6 minutes, and then cooled to room temperature at a rate of 100°C / min to form a convex structure. The structural part was obtained after demoulding.

[0037] Example 2 Select fiber weight of 50g / m 2 The glass fiber is placed in a container containing thermoplastic resin and immersed in the thermoplastic resin for 30 minutes before being taken out and used as fiber prepreg. The thermoplastic resin is PC resin (i.e., polycarbonate).

[0038] Stack three layers of fiber prepreg in sequence and place them in the mold. Set the mold pressure to 15kgf / cm 2 , the temperature is 120℃, the mold is closed and pressurized, and the base is obtained by holding for 4 minutes. Then the thermoplastic resin is injected into the mold and the pressure is 15kgf / cm 2 The mold was closed and pressure-maintained at 120°C for 6 minutes, and then cooled to room temperature at a rate of 150°C / min to form a convex structure. The structural part was obtained after demoulding.

[0039] Example 3 Select fiber weight of 80g / m 2 The glass fiber is placed in a container containing thermoplastic resin and immersed in the thermoplastic resin for 30 minutes before being taken out and used as fiber prepreg. The thermoplastic resin is PC resin (i.e., polycarbonate).

[0040] Stack two layers of fiber prepreg and place them in the mold. Set the mold pressure to 5kgf / cm 2 , the temperature is 160℃, the mold is closed and pressurized, and the base is obtained by holding for 4 minutes. Then the thermoplastic resin is injected into the mold and the pressure is 5kgf / cm 2 The mold was closed and pressure-maintained at 160°C for 6 minutes, and then cooled to room temperature at a rate of 50°C / min to form a convex structure. The structural part was obtained after demoulding.

[0041] Example 4 Select fiber weight of 80g / m 2 The glass fiber is placed in a container containing thermoplastic resin and immersed in the thermoplastic resin for 30 minutes before being taken out and used as fiber prepreg. The thermoplastic resin is PC resin (i.e., polycarbonate).

[0042] Stack two layers of fiber prepreg and place them in the mold. Set the mold pressure to 10kgf / cm 2 , the temperature is 140℃, the mold is closed and pressurized, and the base is obtained by holding for 4 minutes. Then the thermoplastic resin is injected into the mold and the pressure is 10kgf / cm 2 The mold was closed and pressure-maintained at 140°C for 6 minutes, and then cooled to room temperature at a rate of 100°C / min to form a convex structure. The structural part was obtained after demoulding.

[0043] Example 5 Select fiber weight of 100g / m 2 The carbon fiber is placed in a container containing a thermoplastic resin, immersed in the thermoplastic resin for 30 minutes, and then taken out to be used as a fiber prepreg. The thermoplastic resin is polyacrylate.

[0044] Stack two layers of fiber prepreg and place them in the mold. Set the mold pressure to 10kgf / cm 2 , the temperature is 140℃, the mold is closed and pressurized, and the base is obtained by holding for 4 minutes. Then the thermoplastic resin is injected into the mold and the pressure is 10kgf / cm 2 The mold was closed and pressure-maintained at 140°C for 6 minutes, and then cooled to room temperature at a rate of 100°C / min to form a convex structure. The structural part was obtained after demoulding.

[0045] The structural parts obtained in the above embodiments can be used to prepare structural parts with special-shaped structures such as protruding structures. Through the above preparation method, the overall thickness can be reduced while ensuring the structural strength of the structural parts, which is beneficial for application in products with high requirements on thickness and structural strength.

[0046] Comparative Example 1 Polycarbonate and glass fiber are mixed to form a prepreg, wherein the glass fiber is short fiber with a fiber length of 0.2-6mm, the weight ratio of polycarbonate to the prepreg is 80%, and the weight ratio of glass fiber to the prepreg is 20%. After mixing, it is injected into the mold through an injection molding machine at a pressure of 10kgf / cm 2 The mold is closed and pressure-maintained at 140°C for 6 minutes, and then cooled to room temperature at a rate of 100°C / min to form a structural part.

[0047] Comparative Example 2 Polycarbonate and glass fiber are mixed to form a prepreg, wherein the glass fiber is short fiber with a fiber length of 0.2-6mm, the weight ratio of polycarbonate to the prepreg is 90%, and the weight ratio of glass fiber to the prepreg is 10%. After mixing, it is injected into the mold through an injection molding machine at a pressure of 10kgf / cm 2 The mold is closed and pressure-maintained at 140°C for 6 minutes, and then cooled to room temperature at a rate of 100°C / min to form a structural part.

[0048] Comparative Example 3 Polycarbonate and glass fiber are mixed to form a prepreg, wherein the glass fiber is short fiber with a fiber length of 0.2-6mm, the weight ratio of polycarbonate to the prepreg is 50%, and the weight ratio of glass fiber to the prepreg is 50%. After mixing, it is injected into the mold through an injection molding machine at a pressure of 10kgf / cm2 The mold is closed and pressure-maintained at 140°C for 6 minutes, and then cooled to room temperature at a rate of 100°C / min to form a structural part.

[0049] It should be noted that the structural members obtained in Examples 1-5 and Comparative Examples 1-3 are structural members of the same structure, and the molds used therein are molds of the same structure.

[0050] Experimental Example 1 The tensile test was performed on the structural members obtained in Examples 1-4 and Comparative Examples 1-3. The test method is as follows: The two ends of the structural members obtained in Examples 1-4 and Comparative Examples 1-3 were connected with clamps, and the structural members were placed in a tensile testing machine. The parameters of the tensile testing machine were set to be consistent, and the tensile modulus of the structural members was measured. The measured data are shown in Table 1: Table 1 Tensile modulus test results Example 1 Example 2 Example 3 Example 4 Comparative Example 1 Comparative Example 2 Comparative Example 3 Tensile modulus (GPa) 26.4 26.5 28.3 28.2 6.3 5.0 12.0 It can be seen from the data in Table 1 that, for the same structural parts with the same thickness, the tensile modulus of the structural parts prepared in the embodiments of the present application is significantly improved, which provides a large space for thinning the structural parts during application. For example, when applied to electronic devices, under the same structural strength requirements, the structural parts can be thinned, which is conducive to the lightweight and thinning of electronic devices.

[0051] Example 6 See also Figure 2 This embodiment provides an electronic device 10, including a shell assembly 20, a flexible display screen 30 and a structural member 50, wherein the flexible display screen 30 and the structural member 50 are installed in the shell assembly 20, and the structural member 50 is arranged at the edge of the flexible display screen and is used to support and protect the edge of the flexible display screen.

[0052] See Figure 1 The housing assembly 20 includes a first housing 100, a second housing 200, and a rotating connector 300. The rotating connector 300 is connected between the first housing 100 and the second housing 200. The first housing 100 is folded or unfolded relative to the second housing 200 via the rotating connector 300. Folding refers to stacking the first housing 100 and the second housing 200 in an overlapping manner. During the relative folding of the first housing 100 and the second housing 200, the rotating connector 300 may bend. In some embodiments, the first housing 100 and the second housing 200 are axially symmetrical along the rotating connector 300, that is, when the first housing 100 and the second housing 200 are in the folded state, the first housing 100 and the second housing 200 may completely overlap. In other embodiments, the first housing 100 and the second housing 200 may not completely overlap when in the folded state, which is not limited here.

[0053] The first housing 100 has a first side 101 and a second side 102 opposite to the first side 101, wherein the first side 101 and the second side 102 are stacked along the thickness direction of the first housing 100. In some embodiments, the first housing 100 may include a middle frame and a back cover, and the back cover is mounted on the middle frame. The back cover can be assembled with the middle frame by bonding or snapping. In some embodiments, the back cover can be made of glass, ceramic, plastic, metal, etc.

[0054] The second housing 200 has a third side 201 and a fourth side 202 opposite to the third side 201, wherein the third side 201 and the fourth side 202 are stacked along the thickness direction of the second housing 200. In some embodiments, the second housing 200 can also be composed of a middle frame and a back cover, and the back cover is mounted on the middle frame. The back cover can be assembled with the middle frame by bonding or snapping. In some embodiments, the back cover can be made of materials such as glass, ceramic, plastic, and metal.

[0055] When the first shell 100 and the second shell 200 are in the unfolded state, the first side 101 may be flush with the third side 201 , and the second side 102 may be flush with the fourth side 202 .

[0056] Please continue reading Figure 1 The flexible display screen 30 is continuously arranged on the housing assembly 20, that is, continuously laid on the first housing 100, the rotating connector 300 and the second housing 200. The flexible display screen 30 is located on the first side 101 and the third side 201. In this embodiment, when the first housing 100 and the second housing 200 are folded relative to each other, the flexible display screen 30 is located on the inner side, that is, the electronic device 10 is an inward-folding electronic device. In some other embodiments, when the first housing 100 and the second housing 200 are folded relative to each other, the flexible display screen 30 can serve as at least part of the appearance surface of the electronic device 10, that is, the electronic device 10 can also be an outward-folding structure.

[0057] The structural member 50 can be prepared using the aforementioned method for preparing the structural member 50 . For example, any one of Examples 1 to 4 can be used as the material for the structural member in this embodiment and processed into the required structure according to design requirements.

[0058] Figure 3The structure of a structural member 50 is shown. There are two structural members 50, which are respectively arranged in the first shell 100 and the second shell 200. The structural member 50 is configured in a roughly U-shape, with the U-shaped opening of the structural member 50 facing the direction of the rotating connector. The two structural members 50 are arranged symmetrically. In this embodiment, the raised structure 52 on the structural member 50 can be used to connect with the first shell 100 or the second shell 200, or to form a seal between the flexible display 30 and the first shell 100 and the second shell 200. The base 51 can be located between the first shell 100 and the second shell 200 and the flexible display 30 and can be exposed as a part of the exterior surface. When the electronic device 10 is dropped, the structural member 50 is arranged outside the flexible display 30 and provides support for the flexible display 30. The structural member 50 can act as a buffer, preventing damage or scratches on the flexible display 30 and improving the protection of the flexible display 30.

[0059] Since the structural member 50 used in this embodiment is prepared using the aforementioned preparation method, its structural strength is greater, so the thickness of the structural member 50 can be thinned. In this embodiment, the thickness of the structural member 50 can be less than or equal to 0.16 mm. Compared with the structural member 50 of the same structural strength in the related art, the thickness is about 0.0195 mm, and the overall thickness can be reduced by 0.035 mm, which is about 18% thinner.

[0060] By thinning the structural member 50, the space within the housing assembly 20 for arranging the flexible display 30 and the structural member 50 can be reduced, and the thickness of the entire electronic device 10 can also be reduced by approximately 0.035mm, making the electronic device 10 thinner and lighter than other electronic devices in the related art. Because the electronic device 10 is a foldable structure, when the electronic device 10 is folded, the first housing 100 and the second housing 200 are both thinned by 0.035mm, and the entire electronic device can be thinner by approximately 0.07mm in the folded state, making the foldable electronic device 10 more portable for users.

[0061] It should be noted that the various technical features of the above-mentioned embodiments can be combined arbitrarily. In order to make the description concise, not all possible combinations of the various technical features in the above-mentioned embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0062] The above description is merely a preferred embodiment of the present application and is not intended to limit the present application. Various modifications and variations are possible for those skilled in the art. Any modifications, equivalent substitutions, or improvements made within the spirit and principles of the present application shall be included within the scope of protection of the present application.

Claims

1. A method for preparing a structural part, characterized in that: The structural member includes a base and a protruding structure disposed on the base, and the method includes: Providing a fiber prepreg, wherein the fiber prepreg is a fiber treated with a thermoplastic resin; stacking multiple layers of the fiber prepreg, placing the layers in a mold, and closing the mold and applying pressure under a first condition to obtain the substrate; A thermoplastic resin is injected into the mold to form the protruding structure under a second condition, and the structural component is obtained after demoulding.

2. The method for preparing a structural member according to claim 1, wherein: The method of stacking multiple layers of the fiber prepreg, placing the layers in a mold, and closing the mold and applying pressure under a first condition to obtain the substrate comprises: The number of layers of the fiber prepreg to be stacked is determined based on the thickness of the substrate and the thickness of the fiber prepreg. The required number of layers of the fiber prepreg are stacked and placed in a mold. The mold is closed and pressurized under a first condition to obtain the substrate.

3. The method for preparing a structural member according to claim 1 or 2, characterized in that: The method of stacking multiple layers of the fiber prepreg, placing the layers in a mold, and closing the mold and applying pressure under a first condition to obtain the substrate comprises: The fiber prepreg is stacked in layers and placed in a mold under a pressure of 5-15 kgf / cm 2 , the mold is closed and pressurized at a temperature of 120° C.-160° C. to obtain the substrate.

4. The method for preparing a structural member according to claim 1 or 2, characterized in that: The step of injecting a thermoplastic resin into the mold to form the protruding structure under the second condition and demolding the structure to obtain the structural part comprises: Thermoplastic resin is injected into the mold at a pressure of 5-15 kgf / cm 2 The mold is closed and pressure-maintained for 2-6 minutes at a temperature of 120-160°C, and then cooled to room temperature at a rate of 50-150°C / min to form the protruding structure, and the structural part is obtained after demolding.

5. The method for preparing a structural member according to claim 1 or 2, characterized in that: The fiber is selected from at least one of glass fiber, carbon fiber, aramid fiber, and poly(p-phenylene benzobisoxazole) fiber.

6. The method for preparing a structural member according to claim 1 or 2, characterized in that: The thermoplastic resin is selected from at least one of polycarbonate, polyacrylate, polyamide and polyvinyl alcohol.

7. The method for preparing a structural member according to claim 1 or 2, characterized in that: The fiber prepreg is prepared in the following manner: The fibers are placed in a container containing a thermoplastic resin and the fibers are kept submerged for at least 30 minutes.

8. A structural member, characterized in that: The structural component is prepared according to the method for preparing a structural component according to any one of claims 1 to 7.

9. An electronic device, characterized in that: include: A housing assembly comprising a first housing, a second housing, and a rotating connector, wherein the rotating connector is connected between the first housing and the second housing, and the first housing rotates relative to the second housing via the rotating connector. During the rotation, the first housing and the second housing selectively fold or unfold; a flexible display screen, the flexible display screen being continuously provided on the first shell and the second shell; A structural member, wherein the structural member is arranged in the first shell and the second shell, the structural member is arranged at the edge of the flexible display screen, and the structural member is prepared according to the method according to any one of claims 1 to 7.

10. The electronic device according to claim 9, characterized in that The thickness of the structural member is less than or equal to 0.16 mm.

Images