A fully automatic glue dispensing mechanism

The design of the fully automated dispensing mechanism solves the problems of uneven heat-conducting materials and uneven thickness in the heat-conducting structure of large electronic products, realizing an efficient and stable dispensing and molding process, and improving processing efficiency and quality.

CN120607009BActive Publication Date: 2025-10-28GUANGDONG MAIKAN INTELLIGENT EQUIP CO LTD
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Patent Information

Application Number
CN202511122150.4
Authority / Receiving Office
CN · China
Patent Type
Patents(China)
Current Assignee / Owner
Filing Date
2025-08-12
Publication Date
2025-10-28
Estimated Expiration
2045-08-12

AI Technical Summary

Technical Problem

In large electronic products, it is difficult to ensure the uniformity of thermal conductive materials and molding thickness in the thermal conductive structure, especially after the adhesive is poured into the aluminum-plastic film, which makes it difficult to stabilize and leads to low processing efficiency.

Method used

A fully automatic dispensing mechanism was designed, including a worktable, a dispensing component, and a molding component. Through the cooperation of the mounting frame and guide rail, multiple dispensing devices are efficiently integrated. Combined with the lifting component, the film opening structure, and the film sealing structure, the uniformity of dispensing and the consistency of molding thickness are ensured. The sealing structure prevents air leakage, and the reference structure and the extrusion structure ensure the stable shaping of the heat-conducting structure.

Benefits of technology

It improves the processing efficiency and molding quality of large thermally conductive structures, solves the problems of uneven thermal conductive materials and thickness, and achieves an efficient and stable potting process.

✦ Generated by Eureka AI based on patent content.

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Abstract

This invention relates to a fully automatic dispensing mechanism, comprising a worktable, a dispensing assembly, and a molding assembly. The dispensing assembly is connected to a mounting frame and faces a guide rail. The mounting frame has a lifting assembly relative to the dispensing assembly. Each end of the dispensing assembly has an opening structure and a sealing structure, with the sealing structure located below the opening structure. A dispensing cavity is formed between the two opposing opening and sealing structures. The dispensing assembly has a dispensing device facing the dispensing cavity. The molding assembly is connected to the guide rail and faces the dispensing assembly. A sealing structure is provided between the molding assembly and the dispensing assembly. A reference structure passes through one side of the molding assembly, and an extrusion structure passes through the other side. The extrusion structure and the reference structure are parallel to each other and sandwiched to form a molding cavity, which is connected to the dispensing cavity. A clamping structure passes through the molding cavity on the reference structure. This invention aims to ensure uniform and stable dispensing and to make the overall thickness of the processed product uniform.
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Description

Technical Field

[0001] This invention relates to the field of glue dispensing technology, and in particular to a fully automatic glue dispensing mechanism. Background Technology

[0002] With the development of society, electronic products have become closely related to people's lives, and people's requirements for product quality are getting higher and higher. In order to improve product quality and enable it to work stably, every electronic product is equipped with at least one heat dissipation component. The core heat-conducting structure in the heat dissipation component is generally a heat-conducting material that is molded in an aluminum-plastic film and uniformly shaped by the aluminum-plastic film. The core of the quality of this heat-conducting structure is the uniformity of the internal heat-conducting material and the uniformity of the thickness of the entire heat-conducting structure.

[0003] However, unlike the small thermal conductive structures in small electronic products, the thermal conductive structures in large electronic products are much larger. It is difficult to ensure that the thermal conductive material is uniform within such a large thermal conductive structure, and it is also difficult to ensure that the thickness of the entire thermal conductive structure is uniform after the colloid is poured into the aluminum-plastic film and the colloid stabilizes. Summary of the Invention

[0004] The main objective of this invention is to provide a fully automatic glue dispensing mechanism that ensures uniform and stable glue dispensing and makes the overall thickness of the processed product uniform.

[0005] To achieve the above objectives, the present invention proposes a fully automatic dispensing mechanism, comprising a worktable, a dispensing assembly, and a molding assembly;

[0006] The workbench is equipped with a mounting frame and guide rails passing through the mounting frame;

[0007] The dispensing assembly is connected to the mounting frame and is positioned towards the guide rail. The mounting frame is provided with a lifting component relative to the dispensing assembly. Each end of the dispensing assembly is provided with an opening structure and a sealing structure. The sealing structure is located below the opening structure. The two opening structures and sealing structures are sandwiched together to form a dispensing cavity. The dispensing assembly is provided with a dispensing device facing the dispensing cavity.

[0008] The molding component is connected to the guide rail and is positioned towards the dispensing component. A sealing structure is provided between the molding component and the dispensing component. A reference structure passes through one side of the molding component and an extrusion structure passes through the other side. The extrusion structure and the reference structure are parallel to each other and clamped together to form a molding cavity. The molding cavity is connected to the dispensing cavity. A clamping structure passing through the molding cavity is provided on the reference structure.

[0009] In one embodiment of this application, the extrusion structure includes an extrusion surface parallel to the reference structure and a pushing structure connected to the outer periphery of the molding component and connected to the extrusion surface. The pushing structure is provided in multiple ways, and the multiple pushing structures are arrayed and connected to the extrusion surface.

[0010] In one embodiment of this application, a plurality of first guide rods are arranged in an array within the molding assembly and are vertically connected to the reference structure. The extrusion surface is slidably connected to the plurality of first guide rods, and the plurality of first guide rods are connected to both sides of the molding cavity and are symmetrically arranged along the molding cavity.

[0011] In one embodiment of this application, the pressing structure includes a stabilizing frame connected to the outer periphery of the molding component and a pressing surface connected to the side of the extrusion surface away from the molding cavity. The stabilizing frame is provided with a first driving member, the first driving member is connected to a driving surface, and a second guide rod parallel to the first guide rod is provided between the pressing surface and the driving surface.

[0012] In one embodiment of this application, the stabilizer is provided with a plurality of third guide rods that are parallel to the second guide rods and connected to the drive surface, and the plurality of third guide rods are wrapped around the first drive member.

[0013] In one embodiment of this application, the sealing structure includes a second driving member connected to the outer periphery of the dispensing assembly and disposed towards the dispensing cavity, and a heat-sealing structure connected to the second driving member. The bottom edge of the heat-sealing structure is provided with a heat-sealing element facing the dispensing cavity, and the top edge of the heat-sealing structure is provided with a stabilizing element parallel to the heat-sealing element facing the dispensing cavity.

[0014] In one embodiment of this application, the film-opening structure includes a guide structure disposed adjacent to the dispensing device and a film-opening component connected to the guide structure. At least two film-opening components are symmetrically arranged along the guide structure, and suction heads are disposed opposite to each other on the two film-opening components. The film-opening component passes through the heat-sealing structure and is located between the heat-sealing component and the stabilizing component.

[0015] The two opening film components are connected by a drive mechanism.

[0016] In one embodiment of this application, the driving mechanism includes a third driving member disposed on the top of the dispensing assembly, and a driving structure connected to the third driving member and connected to the two film-opening members. The driving structure has guide portions at both ends, and the width of the guide portions gradually decreases along the vertically downward direction.

[0017] The guide section has a guide groove relative to the film-opening member, and the guide groove is arranged parallel to the side wall of the guide section.

[0018] In one embodiment of this application, the worktable is provided with a loading section and a unloading section at both ends relative to the guide rail, the mounting frame is located between the loading section and the unloading section, and the loading section is provided with a guide component surrounding the molding component;

[0019] The guiding assembly is symmetrically provided with two guide frames located above the molding assembly, and the two guide frames are provided with guide plates connected to the molding cavity.

[0020] In one embodiment of this application, the worktable is provided with at least two parallel guide rails, the glue-pouring assembly is provided with at least two sets opposite each other, and the molding assembly is provided with at least two sets.

[0021] Each of the glue-dispensing components is provided with at least two sets of glue-dispensing devices, and the molding component is provided with at least two sets of clamping structures relative to the glue-dispensing component, with each glue-dispensing device corresponding to a clamping structure.

[0022] By adopting the above technical solution, the present invention has the following advantages:

[0023] The purpose of this application is to address the potential issues of unstable heat-conducting materials and uneven thickness in the finished product when manufacturing large-volume integrated heat-conducting structures. The manufacturing process of heat-conducting structures presents problems primarily because the raw materials for heat-conducting materials generally consist of at least two solutions, which need to be injected into an aluminum-plastic film to allow the different solutions to react. Once the reaction stabilizes, a flexible gel-like heat-conducting material is obtained, and the aluminum-plastic film is then sealed to form the finished heat-conducting structure. During the reaction of different solutions, a large number of bubbles may appear, leading to unevenness in the finished heat-conducting material. Furthermore, in large-volume heat-conducting structures, the large area of ​​the aluminum-plastic film and the large amount of solution used result in difficulties in homogenization and molding.

[0024] To address the above issues, the dispensing mechanism is equipped with a worktable for mounting different structures. The worktable features mounting brackets and guide rails. Because the solution reaction takes time, multiple guide rails are typically arranged side-by-side on the worktable for full-power processing to ensure processing efficiency. A feeding structure can be installed on one side of the guide rails, allowing multiple dispensing devices to correspond to the power of the aluminum-plastic film cutting and preparation mechanism. However, when one side of multiple dispensing devices is occupied by a feeding structure, unloading the heat-conducting structure becomes difficult. Therefore, the dispensing devices can be guided to the other side via guide rails, and an unloading structure can be installed on that side. This combination of structures enables a high degree of integration of the fully automatic dispensing device. This structure effectively solves the efficiency mismatch problem caused by high aluminum-plastic film preparation efficiency and slow dispensing rate, thereby improving the overall production processing speed of the machine.

[0025] The glue-filling structure is mounted on a mounting frame. Through a lifting component on the mounting frame, the glue-filling structure can move relative to the molding component for mold closing or for material removal. The main functions of the glue-filling structure are: filling different solutions, vacuuming, removing gases generated during the reaction, opening the aluminum-plastic film to facilitate glue filling, and sealing the aluminum-plastic film after processing to form a complete heat-conducting structure. To achieve these functions, the glue-filling assembly has a film-opening structure and a film-sealing structure on both sides. The film-opening and film-sealing structures can move independently, and the two sides are clamped together to form a glue-filling cavity corresponding to the aluminum-plastic film. The top of the glue-filling assembly faces the glue-filling cavity and has a glue-filling device. The glue-filling device generally includes at least two glue-filling heads and a vacuum head, or other layout structures that can achieve the above functions. The glue-filling device ensures injection efficiency and stable solution ratio, while the vacuum head ensures that there is no other gas inside the glue-filling device, preventing reaction errors, and also removes the gases generated during the reaction, ensuring the homogeneity of the heat-conducting material.

[0026] The molding assembly is connected to the guide rail and is mainly used to hold the aluminum-plastic film. A sealing structure is provided between the molding assembly and the dispensing assembly to prevent air leakage in the inner cavity after mold closing. To ensure uniform thickness of the heat-conducting structure, a reference structure is provided on one side of the molding assembly, and an extrusion structure on the other side. A molding cavity for accommodating the heat-conducting structure to be processed is located between the two structures. The reference structure ensures the stability of the heat-conducting structure's shaping and serves as a reference surface to support it. Simultaneously, a clamping structure connected to the molding cavity is provided on the reference structure, which can clamp the top of the aluminum-plastic film, allowing the entire film to unfold for easy dispensing and shaping. The extrusion structure is parallel to the reference structure, ensuring a more uniform heat-conducting structure after the extrusion structure moves towards the reference structure. Through the cooperation of these structures, the entire dispensing mechanism is highly integrated, and the different structures can work together seamlessly, ensuring stable processing efficiency and quality. Attached Figure Description

[0027] To more clearly illustrate the technical solutions in the embodiments of the present invention or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on the structures shown in these drawings without creative effort.

[0028] Figure 1 This is a schematic diagram of the fully automatic glue dispensing mechanism of the present invention;

[0029] Figure 2 This is a schematic diagram of the molding component of the fully automatic dispensing mechanism of the present invention;

[0030] Figure 3 This is a schematic diagram of the extrusion structure of the fully automatic glue dispensing mechanism of the present invention;

[0031] Figure 4 This is a schematic diagram of the worktable of the fully automatic glue dispensing mechanism of the present invention;

[0032] Figure 5 This is a schematic diagram of the dispensing assembly of the fully automatic dispensing mechanism of the present invention;

[0033] Figure 6 This is a schematic diagram of the sealing structure of the fully automatic glue dispensing mechanism of the present invention;

[0034] Figure 7 A schematic diagram of the film-opening structure of the fully automatic glue-dispensing mechanism of the present invention.

[0035] Explanation of icon numbers:

[0036] 1. Workbench; 11. Feeding section; 12. Guiding assembly; 13. Guide frame; 14. Mounting frame; 15. Guide rail; 2. Glue filling assembly; 21. Glue filling device; 3. Film opening structure; 31. Guiding structure; 32. Film opening component; 33. Drive mechanism; 34. Drive structure; 35. Guide section; 4. Film sealing structure; 41. Second drive component; 42. Heat sealing structure; 5. Molding assembly; 51. First guide rod; 6. Reference structure; 61. Clamping structure; 7. Extrusion structure; 71. Extrusion surface; 8. Pushing structure; 81. Stabilizing frame; 82. First drive component; 83. Third guide rod; 84. Pushing surface; 9. Molding cavity;

[0037] The realization of the objective, functional features and advantages of the present invention will be further explained in conjunction with the embodiments and with reference to the accompanying drawings. Detailed Implementation

[0038] To make the objectives, technical solutions, and advantages of this application clearer, the following detailed description is provided in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative and not intended to limit the scope of this application.

[0039] Reference Figures 1 to 7 To achieve the above objectives, the present invention proposes a fully automatic glue dispensing mechanism, comprising a worktable 1, a glue dispensing component 2, and a molding component 5;

[0040] The workbench 1 is provided with a mounting frame 14 and a guide rail 15 passing through the mounting frame 14;

[0041] The glue-filling assembly 2 is connected to the mounting frame 14 and is positioned towards the guide rail 15. The mounting frame 14 is provided with a lifting component relative to the glue-filling assembly 2. Both ends of the glue-filling assembly 2 are provided with an opening structure 3 and a sealing structure 4, respectively. The sealing structure 4 is located below the opening structure 3. The two opening structures 3 and sealing structures 4 are sandwiched together to form a glue-filling cavity. The glue-filling assembly 2 is provided with a glue-filling device 21 facing the glue-filling cavity.

[0042] The molding component 5 is connected to the guide rail 15 and is positioned towards the dispensing component 2. A sealing structure is provided between the molding component 5 and the dispensing component 2. A reference structure 6 is provided on one side of the molding component 5 and an extrusion structure 7 is provided on the other side. The extrusion structure 7 and the reference structure 6 are parallel to each other and clamped together to form a molding cavity 9. The molding cavity 9 is connected to the dispensing cavity. A clamping structure 61 is provided on the reference structure 6 that passes through the molding cavity 9.

[0043] The purpose of this application is to address the potential issues of unstable heat-conducting materials and uneven thickness in the finished product when manufacturing large-volume integrated heat-conducting structures. The manufacturing process of heat-conducting structures presents problems primarily because the raw materials for heat-conducting materials generally consist of at least two solutions, which need to be injected into an aluminum-plastic film to allow the different solutions to react. Once the reaction stabilizes, a flexible gel-like heat-conducting material is obtained, and the aluminum-plastic film is then sealed to form the finished heat-conducting structure. During the reaction of different solutions, a large number of bubbles may appear, leading to unevenness in the finished heat-conducting material. Furthermore, in large-volume heat-conducting structures, the large area of ​​the aluminum-plastic film and the large amount of solution used result in difficulties in homogenization and molding.

[0044] To address the above issues, the dispensing device 21 is equipped with a worktable 1 for mounting different structures. The worktable 1 has a mounting bracket 14 and guide rails 15. Because the solution reaction takes time, multiple guide rails 15 are generally arranged side by side on the worktable 1 for full-power processing to ensure processing efficiency. A feeding structure can be installed on one side of the guide rail 15 so that the power of multiple dispensing devices 21 can correspond to that of the aluminum-plastic film cutting and preparation mechanism. However, when one side of multiple dispensing devices 21 is a feeding structure, the unloading of the heat-conducting structure will be difficult. Therefore, the dispensing device 21 can be guided to the other side by the guide rail 15, and an unloading structure can be installed on the other side. Through the cooperation of these structures, the fully automatic dispensing device 21 can be highly integrated. This structure can effectively solve the efficiency mismatch problem caused by the high aluminum-plastic film preparation efficiency and the slow dispensing rate, thereby improving the overall production and processing speed of the machine.

[0045] The glue-filling structure is mounted on the mounting frame 14. Through the lifting components on the mounting frame 14, the glue-filling structure can move relative to the molding component 5 for mold closing or for material unloading. The main functions of the glue-filling structure are: glue-filling with different solutions, vacuuming, removing gases generated during the reaction, opening the aluminum-plastic film to facilitate glue-filling, and sealing the aluminum-plastic film after processing to form a complete heat-conducting structure. To achieve these functions, the glue-filling component 2 has an opening structure 3 and a sealing structure 4 on opposite sides. The opening structure 3 and the sealing structure 4 can operate independently of each other. The two sides of the opening film structure 3 and sealing film structure 4 are sandwiched to form a corresponding aluminum-plastic film-set potting cavity. The top of the potting assembly 2 faces the potting cavity and is provided with a potting device 21. The potting device 21 generally includes at least two potting heads and a vacuum head, or other layout structures that can achieve the above functions. The potting device 21 can ensure the injection efficiency and the stability of the solution ratio. The vacuum head can ensure that there is no other gas in the potting device 21, avoid reaction errors, and also remove the gas generated by the reaction to ensure the homogeneity of the heat-conducting material.

[0046] The molding component 5 is connected to the guide rail 15 and is mainly used to connect and place the aluminum-plastic film. A sealing structure is provided between the molding component 5 and the glue-filling component 2 to prevent air leakage in the inner cavity after mold closing. To ensure the overall thickness uniformity of the heat-conducting structure, a reference structure 6 is provided on one side of the molding component 5, and an extrusion structure 7 is provided on the other side. A molding cavity 9 is provided between the two structures to accommodate the heat-conducting structure to be processed. The reference structure 6 is used to ensure the stability of the heat-conducting structure shaping and serves as a reference surface to support the heat-conducting structure. At the same time, a clamping structure 61 connected to the molding cavity 9 is provided on the reference structure 6. The clamping structure 61 can clamp the top of the aluminum-plastic film, allowing the entire aluminum-plastic film to unfold, facilitating glue filling and shaping. The extrusion structure 7 is parallel to the reference structure 6, ensuring that the entire heat-conducting structure is more uniform after the extrusion structure 7 moves toward the reference structure 6. Through the cooperation of the above structures, the entire glue-filling mechanism can be highly integrated, and the different structures can cooperate closely, ensuring stable processing efficiency and processing quality.

[0047] See also Figures 2 to 3 The extrusion structure 7 includes an extrusion surface 71 parallel to the reference structure 6 and a pushing structure 8 connected to the outer periphery of the molding component 5 and connected to the extrusion surface 71. Multiple pushing structures 8 are provided, and multiple pushing structures 8 are arrayed and connected to the extrusion surface 71.

[0048] The extrusion surface 71 is parallel to the reference structure 6, which can ensure that the thickness of the entire heat-conducting structure is consistent when the extrusion surface 71 is working. Multiple pushing structures 8 jointly drive the extrusion surface 71 to ensure the high integration of the entire structure. At the same time, it ensures that the end of the extrusion surface 71 away from the forming cavity 9 is subjected to uniform force, which can prevent the aluminum-plastic film from being damaged and ensure that the thickness of the heat-conducting structure is consistent.

[0049] See also Figure 2 The molding component 5 is provided with a plurality of first guide rods 51 that are vertically connected to the reference structure 6. The extrusion surface 71 is slidably connected to the plurality of first guide rods 51. The plurality of first guide rods 51 are connected to both sides of the molding cavity 9 and are symmetrically arranged along the molding cavity 9.

[0050] Multiple first guide rods 51 are inserted inside the molding component 5. The reference structure 6 and the extrusion surface 71 are both connected to the first guide rods 51. The guide rods can restrict the movement path of the extrusion surface 71, ensuring the uniformity of the force on the entire heat-conducting structure, so that the extrusion surface 71 can move parallel to the reference structure 6. The multiple first guide rods 51 can limit the molding cavity 9, ensuring the structural stability of the molding cavity 9.

[0051] See also Figure 3 The pressing structure 8 includes a stabilizing member connected to the outer periphery of the molding component 5 and a pressing surface 84 connected to the side of the extrusion surface 71 facing away from the molding cavity 9. The stabilizing member is provided with a first driving member 82, which is connected to a driving surface. A second guide rod parallel to the first guide rod 51 is provided between the pressing surface 84 and the driving surface.

[0052] A set of pressing structures 8 includes a stabilizing component for ensuring stable installation of the pressing structure 8 and a pressing surface 84 connected to the extrusion surface 71. The pressing surface 84 drives the extrusion surface 71, which can increase the contact area between the two and ensure uniform force. The stabilizing component is provided with a first driving component 82 (generally a cylinder, but it can also be a motor). The first driving component 82 drives and connects to the driving surface. Multiple second guide rods are provided between the driving surface and the pressing surface 84, which can shorten the connecting rod length between the driving component and the pressing surface 84 and ensure the stability of the movement of the pressing surface 84.

[0053] See also Figure 3 The stabilizer is provided with multiple third guide rods 83 that are parallel to the second guide rod and connected to the drive surface. The multiple third guide rods 83 are wrapped around the first drive member 82. The drive surface can be limited by the third guide rods 83 to ensure the stability of the drive surface movement path.

[0054] See also Figures 5 to 6 The sealing structure 4 includes a second driving member 41 connected to the outer periphery of the dispensing assembly 2 and disposed towards the dispensing cavity, and a heat sealing structure 42 connected to the second driving member 41. The bottom edge of the heat sealing structure 42 is provided with a heat sealing member facing the dispensing cavity, and the top edge of the heat sealing structure 42 is provided with a stabilizing member parallel to the heat sealing member facing the dispensing cavity.

[0055] The sealing structure 4 is driven by the second driving member 41. The end of the second driving member 41 is provided with a heat sealing structure 42. The bottom of the heat sealing structure 42 is connected to the end of the second driving member 41. The bottom end of the heat sealing structure 42 is provided with a heat sealing element and the top end is provided with a stabilizing element. The stabilizing element and the heat sealing element can form a stable cavity. When adjacent sealing structures 4 are molded by the second driving member 41, the two heat sealing elements are molded and heat-sealed. The two stabilizing elements can ensure the stability of the connection of the heat sealing elements and prevent damage caused by uneven force when the heat sealing elements are molded.

[0056] See also Figures 5 to 7 The film-opening structure 3 includes a guide structure 31 located near the glue-dispensing device 21 and a film-opening component 32 connected to the guide structure 31. At least two film-opening components 32 are symmetrically arranged along the guide structure 31. The two film-opening components 32 are provided with suction heads opposite each other. The film-opening component 32 passes through the heat-sealing structure 42 and is located between the heat-sealing component and the stabilizing component.

[0057] The two film-opening parts 32 are connected to the drive mechanism 33.

[0058] The guide structure 31 of the film-opening structure 3 is connected to the inner wall of the top of the dispensing assembly 2. Two film-opening components 32 can be slidably connected through the guide structure 31 (which is a guide rail). The film-opening component 32 includes a suction head (with an air pump, which picks up the two sides of the aluminum-plastic film by two opposing suction heads respectively to open the film) and a connecting frame for installing and extending the suction head into the stabilizing cavity. The two film-opening components 32 can be opened synchronously by the drive mechanism 33 to ensure the accuracy and stability of the injected solution.

[0059] See also Figure 7 The drive mechanism 33 includes a third drive member disposed on the top of the glue-pouring assembly 2, and a drive structure 34 connected to the third drive member and connected to the two film-opening members 32. The drive structure 34 has guide portions 35 at both ends, and the width of the guide portions 35 gradually decreases along the vertically downward direction.

[0060] The guide section 35 is provided with a guide groove relative to the film opening member 32, and the guide groove is arranged parallel to the side wall of the guide section 35.

[0061] The third driving component is installed on the top of the dispensing assembly 2, which can avoid the second driving component 41, making the whole machine highly integrated in terms of structure. It is set relative to the guide structure 31 to ensure the stability of the driving force. The driving structure 34 can be regarded as an isosceles trapezoid with a slot on the top. The guide part 35 is located on both sides of the trapezoid, and the guide groove is opened parallel to the side of the trapezoid. Through the above structure, when the third driving component moves up and down, the two film opening parts 32 can open or avoid each other with the help of the guide grooves on both sides that gradually increase in distance along the vertical upward direction, so that the suction head can stably connect and open the aluminum-plastic film.

[0062] See also Figures 1 to 4 The workbench 1 is provided with a loading section 11 and a unloading section at its two ends relative to the guide rail 15. The mounting frame 14 is located between the loading section 11 and the unloading section. The loading section 11 is provided with a guide component 12 surrounding the forming component 5.

[0063] The guide assembly 12 is symmetrically provided with two guide frames 13 located above the molding assembly 5. Both guide frames 13 are provided with guide plates connected to the molding cavity 9 along the central axis between the two guide frames 13.

[0064] The two ends of the guide rail 15 are the loading section 11 and the unloading section, respectively. A guide component 12 is provided at the loading section 11. Because the aluminum-plastic film to be processed has a large area and is relatively light, it is easy for the aluminum-plastic film to float around during loading. The two guide frames 13 at the guide component 12 drive the guide plates to close together to form a limiting channel, which is used to guide the aluminum-plastic film to be captured by the clamping structure 61, effectively ensuring processing efficiency and processing quality.

[0065] See also Figures 1 to 7 The worktable 1 is provided with at least two parallel guide rails 15, the glue dispensing assembly 2 is provided with at least two sets opposite each other, and the molding assembly 5 is provided with at least two sets.

[0066] Each dispensing assembly 2 is provided with at least two sets of dispensing devices 21, and the molding assembly 5 is provided with at least two sets of clamping structures 61 relative to the dispensing assembly 2. Each dispensing device 21 corresponds to a clamping structure 61.

[0067] The above structure enables multiple glue-dispensing mechanisms to work in tandem, which solves the problem of mismatched overall machine efficiency caused by high aluminum-plastic film feeding efficiency and low glue-dispensing efficiency, and ensures processing quality.

[0068] In the accompanying drawings of this embodiment, the same or similar reference numerals correspond to the same or similar components. In the description of this application, it should be understood that if terms such as "upper," "lower," "left," and "right" indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, they are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, the terms used to describe positional relationships in the accompanying drawings are only for illustrative purposes and should not be construed as limiting this patent. For those skilled in the art, the specific meaning of the above terms can be understood according to the specific circumstances.

[0069] The above are merely preferred embodiments of this application and are not intended to limit this application. Any modifications, equivalent substitutions, and improvements made within the spirit and principles of this application should be included within the protection scope of this application.

Claims

1. A fully automatic glue dispensing mechanism, characterized in that, include: A workbench, wherein the workbench is provided with a mounting frame and a guide rail passing through the mounting frame; A dispensing assembly is connected to a mounting frame and is positioned towards a guide rail. The mounting frame is provided with a lifting component relative to the dispensing assembly. Each end of the dispensing assembly is provided with an opening film structure and a sealing film structure. The sealing film structure is located below the opening film structure. A dispensing cavity is formed between the two oppositely positioned opening film structures and sealing film structures. The dispensing assembly is provided with a dispensing device facing the dispensing cavity. A molding component is connected to a guide rail and is positioned toward a dispensing component. A sealing structure is provided between the molding component and the dispensing component. A reference structure passes through one side of the molding component, and an extrusion structure passes through the other side. The extrusion structure and the reference structure are parallel to each other and clamped together to form a molding cavity. The molding cavity is connected to the dispensing cavity. A clamping structure passing through the molding cavity is provided on the reference structure. The sealing structure includes a second driving member connected to the outer periphery of the dispensing assembly and disposed towards the dispensing cavity, and a heat sealing structure connected to the second driving member. The bottom edge of the heat sealing structure is provided with a heat sealing element facing the dispensing cavity, and the top edge of the heat sealing structure is provided with a stabilizing element parallel to the heat sealing element facing the dispensing cavity. The film-opening structure includes a guide structure adjacent to the glue-dispensing device and a film-opening component connected to the guide structure. At least two film-opening components are symmetrically arranged along the guide structure. Two film-opening components are provided with suction heads opposite each other. The film-opening components pass through the heat-sealing structure and are located between the heat-sealing component and the stabilizing component. The two film-opening components are connected to a driving mechanism. The driving mechanism includes a third driving member disposed on the top of the glue-dispensing assembly, and a driving structure connected to the third driving member and connected to the two film-opening members. The driving structure has guide portions at both ends, and the width of the guide portions gradually decreases along the vertical downward direction. The guide portions have guide grooves disposed in the guide portions relative to the film-opening members, and the guide grooves are parallel to the sidewalls of the guide portions. The worktable is provided with a loading section and a unloading section at its two ends relative to the guide rail. The mounting frame is located between the loading section and the unloading section. The loading section is provided with a guide component surrounding the molding component. The guide component is symmetrically provided with two guide frames above the molding component. The two guide frames are provided with guide plates connected to the molding cavity.

2. The fully automatic glue dispensing mechanism according to claim 1, characterized in that, The extrusion structure includes an extrusion surface parallel to the reference structure and a pushing structure connected to the outer periphery of the molding component and connected to the extrusion surface. Multiple pushing structures are provided, and an array of multiple pushing structures is connected to the extrusion surface.

3. The fully automatic glue dispensing mechanism according to claim 2, characterized in that, The molding assembly has multiple first guide rods arranged in an array, which are vertically connected to the reference structure. The extrusion surface is slidably connected to the multiple first guide rods. The multiple first guide rods are connected to both sides of the molding cavity and are symmetrically arranged along the molding cavity.

4. The fully automatic glue-dispensing mechanism according to claim 3, characterized in that, The pressing structure includes a stabilizing frame connected to the outer periphery of the molding component and a pressing surface connected to the side of the extrusion surface away from the molding cavity. The stabilizing frame is provided with a first driving member, which is connected to a driving surface. A second guide rod parallel to the first guide rod is provided between the pressing surface and the driving surface.

5. The fully automatic glue-dispensing mechanism according to claim 4, characterized in that, The stabilizer is provided with a plurality of third guide rods that are parallel to the second guide rods and connected to the drive surface, and the plurality of third guide rods are wrapped around the first drive member.

6. The fully automatic glue dispensing mechanism according to claim 1, characterized in that, The worktable is provided with at least two parallel guide rails, the glue-pouring assembly is provided with at least two sets opposite each other, and the molding assembly is provided with at least two sets. Each of the glue-dispensing components is provided with at least two sets of glue-dispensing devices, and the molding component is provided with at least two sets of clamping structures relative to the glue-dispensing component, with each glue-dispensing device corresponding to a clamping structure.

Citation Information

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