Low-dielectric epoxy resin for wave-transparent automatic fiber placement prepreg and preparation method of low-dielectric epoxy resin

Abstract

The invention discloses low-dielectric epoxy resin for a wave-transparent automatic fiber placement prepreg and a preparation method of the low-dielectric epoxy resin, and belongs to the technical field of composite material preparation. Aiming at the existing epoxy resin, the low-dielectric epoxy resin is obtained by blending the low-dielectric epoxy resin monomer component, the curing agent component, the low-dielectric copolymerization component and the viscosity adjusting component, and the low-dielectric epoxy resin is obtained through high crosslinking and low-polarizability network structure characteristics among the components. And the excellent performances of low dielectric constant, low dielectric loss, excellent fiber placement manufacturability and the like are achieved.

Description

Technical Field

[0001] The invention relates to a low-dielectric epoxy resin for wave-transmitting automatic fiber placement prepreg and a preparation method thereof, belonging to the technical field of composite material preparation. Background Art

[0002] With the increasing maturity of automated composite manufacturing technology abroad, automated fiber placement (AFP), known for its high efficiency, high quality, stability, and reliability, has gained widespread application in a variety of aerospace components. Due to the maturity of the material systems employed, the robust design and molding methodologies, and the ease of digitalization and automated manufacturing, AFP has become the primary molding method for large composite aircraft components in developed countries. With the demand for extreme aircraft weight reduction, certain large-scale aircraft components must meet not only high load-bearing capacity but also strong stealth functionality. This requires the use of prepregs with excellent wave transmission to ensure sufficient electromagnetic wave absorption by the absorber. Furthermore, to achieve high-precision and efficient molding, the use of AFP processes in component structures is crucial. Therefore, the development of wave-transmitting AFP prepregs is urgently needed.

[0003] Epoxy resin, due to its excellent processability and mechanical properties, has become one of the resin matrices used in structural composite materials. However, because epoxy resin contains a large number of polar structures, its wave-transmitting properties cannot meet the requirements of use. Therefore, low-dielectric modification is necessary based on the design of the epoxy resin formula. At the same time, the automated fiber placement molding process requires high adaptability of the prepreg placement process. Traditional manually placed wave-transmitting prepregs have low rigidity and high viscosity, making it impossible to obtain prepreg bundles suitable for automated fiber placement through slitting. Therefore, the epoxy resin formula needs to be designed to reduce the surface viscosity of the prepreg bundles to meet the placement requirements. As aircraft flight speeds increase, higher temperature resistance requirements are also placed on the composite materials used. Therefore, the epoxy resin formula needs to be designed to increase the glass transition temperature of the resin. Therefore, it is necessary to develop an epoxy resin that combines low dielectric functionality, high heat resistance, and excellent automated fiber placement processability. Summary of the Invention

[0004] The present invention aims to provide a low-dielectric epoxy resin for wave-transmitting automated fiber placement prepreg and a preparation method thereof. The present invention can produce a modified epoxy resin matrix with low dielectric constant, low dielectric loss and excellent fiber placement processability.

[0005] The purpose of the present invention is mainly achieved through the following technical solutions:

[0006] A low-dielectric epoxy resin for wave-transmitting automatic fiber placement prepreg comprises the following components in parts by mass:

[0007]

[0008]

[0009] Preferably, the low-dielectric epoxy resin monomer component is one or more of a fluorine-containing epoxy resin, a dicyclopentadiene epoxy resin, a biphenyl epoxy resin, a cage-type silsesquioxane-modified epoxy resin, an alicyclic epoxy resin, and a silicone-modified epoxy resin; and the epoxy equivalent of the low-dielectric epoxy resin monomer is 100-300 g / eq.

[0010] Preferably, the curing agent component is one or more of dicyandiamide, ethylenetriamine, ethylenediamine, methylenebiscyclohexaneamine, diethylenetriamine, triethylenetetramine, tetraethylenepentamine, dipropylenetriamine, dimethylaminopropylamine, m-phenylenediamine, diaminodiphenyl sulfone, hexahydropyridine, bisbenzylamino ether, 2-methylimidazole, 2-ethylimidazole, 2-phenylimidazole, 1-cyanoethyl-2-ethyl-4-methylimidazole, 1-cyanoethyl-2-phenylimidazole, phthalic anhydride, tetrahydrophthalic anhydride, hexahydrophthalic anhydride, methyltetrahydrophthalic anhydride, trimellitic anhydride glyceride, polyazelaic anhydride, methylhexahydrophthalic anhydride, polysebacic anhydride, diphenyl ether tetracarboxylic dianhydride, cyclopentanetetracarboxylic dianhydride, and linear phenolic resin.

[0011] Preferably, the low dielectric copolymer component is one or more of cyanate ester, hydrocarbon resin, and benzocyclobutene resin.

[0012] Preferably, the cyanate ester is one or more of bisphenol A cyanate, bisphenol E cyanate, bisphenol M cyanate, bisphenol F cyanate, dicyclopentadiene bisphenol cyanate and novolac cyanate.

[0013] Preferably, the hydrocarbon resin comprises one or more of a cyclic or linear olefin copolymer, or a cyclic or linear olefin homopolymer; the side chain of the hydrocarbon resin has a reactive group capable of reacting with an epoxy resin, comprising one or more of a hydroxyl group, a vinyl group, an amine group, and an acid anhydride; and the molecular weight of the hydrocarbon resin is between 500 and 50,000.

[0014] Preferably, the benzocyclobutene resin is one or more of monobenzocyclobutene, dibenzocyclobutene or polybenzocyclobutene containing an imide structure, a fluorine structure, a trifluoromethyl structure, a siloxane structure, an aromatic ether structure, a saturated / unsaturated alkane structure, an amide structure and a carbonyl structure.

[0015] Preferably, the viscosity adjusting component is an organic viscosity adjusting component and / or an inorganic viscosity adjusting component.

[0016] Preferably, the organic viscosity regulating component comprises one or more of thermoplastic polyimide, polyphenylene ether, polyetheretherketone, polyaryletherketone, polyamide, polyarylethersulfone, polyethersulfone, and polyphenylene sulfide, and the average particle size of the organic component particles is 1-20 μm.

[0017] Preferably, the inorganic viscosity adjusting component includes one or more of silicon dioxide, aluminum oxide, titanium oxide, zinc oxide, magnesium oxide, aluminum hydroxide, magnesium hydroxide, ceramic powder, barium titanate, sodium titanate, boron nitride, and carbon nanotubes, and the average particle size of the inorganic component particles is 100-20 μm.

[0018] A method for preparing a low-dielectric epoxy resin for wave-transmitting automatic fiber placement prepreg comprises the following steps:

[0019] The low dielectric epoxy resin monomer component is heated until melted, the viscosity adjusting component is added, and the mixture is stirred until the viscosity adjusting component is dissolved or evenly dispersed; the low dielectric copolymer component is added, and the mixture is stirred evenly to obtain component A;

[0020] Adding the curing agent component to the low dielectric epoxy resin monomer component and grinding into a paste component B;

[0021] Mixing component A and component B and dispersing them evenly to obtain epoxy resin;

[0022] The obtained epoxy resin is heated, vacuumed and degassed, and then subjected to a curing reaction to obtain a low-dielectric epoxy resin cured product for wave-transmitting automatic fiber placement prepreg.

[0023] Preferably, the above method specifically comprises the following steps:

[0024] The low dielectric epoxy resin monomer component is heated to melt at a temperature range of 50 to 110° C., the viscosity adjusting component is added, and the mixture is stirred until the viscosity adjusting component is dissolved or evenly dispersed; the low dielectric copolymer component is added at a temperature range of 50 to 80° C., and the mixture is stirred evenly to obtain component A;

[0025] Adding the curing agent component to the low dielectric epoxy resin monomer component and grinding into a paste component B;

[0026] Mix component A and component B at 30-80°C and disperse them evenly to obtain epoxy resin;

[0027] The obtained epoxy resin is vacuum degassed at 80-110° C. for 0.5-2 hours, and cured at 70-200° C. for 5-20 hours to obtain a low-dielectric epoxy resin cured product for wave-transmitting automatic fiber placement prepreg.

[0028] Compared with the prior art, the present invention has the following beneficial effects:

[0029] (1) The low-dielectric epoxy resin for the wave-transmitting automatic fiber placement prepreg of the present invention is prepared by blending four components, wherein the low-dielectric epoxy resin monomer component and the low-dielectric copolymer component form a network structure with a high degree of cross-linking and a low polarizability, giving the epoxy resin excellent dielectric properties and heat resistance; the viscosity regulating component is divided into an organic component and an inorganic component, exerting an organic-inorganic synergistic effect, and giving the epoxy resin excellent fiber placement processability.

[0030] (2) The present invention introduces a low-dielectric copolymer component that can form a copolymer structure with a low-dielectric epoxy resin, such as a cyanate ester, a hydrocarbon resin, a benzocyclobutene resin, etc. Compared with a single low-dielectric epoxy resin monomer component, the introduction of the above copolymer component can effectively increase the crosslinking density of the resin cured structure, giving the epoxy resin a higher glass transition temperature, thermal oxidation stability, and good dimensional stability; and the crosslinked network formed by the reaction of the above copolymer group with the epoxy resin has a low degree of polarization and a high degree of conjugation, which can effectively reduce the dielectric constant and dielectric loss of the epoxy resin. The present invention can optimize the dielectric properties and heat resistance of the epoxy resin, reduce the dielectric constant of the epoxy resin to below 3.10, reduce the dielectric loss to below 0.013, and increase the glass transition temperature to 200°C.

[0031] (3) The present invention is based on an organic-inorganic hybridization method, and simultaneously introduces a thermoplastic organic viscosity regulating component and a nano / micron-sized inorganic viscosity regulating component, which are dissolved or uniformly dispersed in the epoxy resin, giving full play to the synergistic effect of the organic and inorganic components, thereby effectively reducing the viscosity of the resin during use; and the introduction of the above-mentioned particles can limit the orientation movement of the polar groups of the resin, thereby effectively reducing the dielectric constant and dielectric loss of the epoxy resin, and can optimize the processability of the epoxy resin fiber laying.

[0032] (4) In the prior art, when preparing epoxy resin, a curing agent is directly added to the molten resin matrix, stirred evenly, and then discharged. This process is carried out in a high-temperature environment, and the resin monomer and curing agent are highly reactive, resulting in a cross-linking reaction, which significantly reduces the shelf life of the epoxy resin. To overcome this shortcoming, the present invention adopts a grinding method to grind the resin monomer and curing agent evenly at room temperature, thereby significantly reducing the reactive activity of the resin monomer and curing agent and extending the shelf life of the epoxy resin.

[0033] (5) The present invention provides an epoxy resin with both low dielectric functionality and excellent fiber placement processability, which provides a resin raw material basis for the development of large-scale automatic fiber placement wave-transparent composite materials. It can be used as a resin matrix for large-scale structure / wave-transparent and structure / stealth integrated composite materials, and has great application prospects in aerospace, rail transportation, 5G communication equipment and other fields. DETAILED DESCRIPTION

[0034] In order to make the various technical features and advantages or technical effects of the above technical solutions of the present invention more obvious and easy to understand, they are described in detail below through embodiments.

[0035] Example 1

[0036] 30 parts of bisphenol AF epoxy resin monomer were melted at 80°C, and 10 parts of thermoplastic polyimide particles and 5 parts of micron-sized silica particles were added. The mixture was stirred until the thermoplastic particles dissolved and the inorganic particles were evenly dispersed. The temperature was then lowered to 60°C, and 30 parts of bisphenol A cyanate ester were added and stirred until uniformly distributed. Then, 10 parts of diaminodiphenyl sulfone were added to 10 parts of bisphenol AF epoxy resin monomer and ground into a paste using a three-roll mill. The components from the two steps were then mixed at 40°C and evenly dispersed to produce a low-dielectric, high-heat-resistant epoxy resin for wave-transmitting automated fiber placement prepregs. The resulting resin was tested for viscosity, and the data are detailed in Table 1. The resin exhibited suitable viscosity, making it suitable for automated fiber placement processes.

[0037] The resulting epoxy resin was degassed in a vacuum oven at 100°C for 0.5 hours, then placed in a forced air drying oven and cured according to the following schedule: 100°C / 3 hours, 150°C / 2 hours, and 180°C / 5 hours. This yielded a low-dielectric, high-heat-resistant epoxy resin cured product for wave-transmitting automated fiber placement prepreg. Heat resistance and dielectric properties of the cured resin were tested, as shown in Table 1. The cured resin exhibited a dielectric constant less than 3.10, a dielectric loss less than 0.013, and a glass transition temperature greater than 200°C, demonstrating excellent heat resistance and dielectric properties.

[0038] Example 2

[0039] 35 parts of dicyclopentadiene epoxy resin monomer were melted at 110°C, and 12 parts of polyphenylene ether particles and 3 parts of micron-sized alumina particles were added. The mixture was stirred until the thermoplastic particles dissolved and the inorganic particles were evenly dispersed. The temperature was then lowered to 50°C, and 30 parts of siloxane-containing dibenzocyclobutene were added and stirred until uniformly distributed. Then, 10 parts of phthalic anhydride were added to 15 parts of dicyclopentadiene epoxy resin monomer and ground into a paste using a three-roll mill. The components from the two previous steps were then mixed at 35°C and evenly dispersed to produce a low-dielectric, high-heat-resistant epoxy resin for wave-transmitting automated fiber placement prepregs. The resulting resin was tested for viscosity, and the data are detailed in Table 1. The resin exhibited suitable viscosity, making it suitable for automated fiber placement processes.

[0040] The resulting epoxy resin was degassed in a vacuum oven at 90°C for 0.5 hours, then placed in a forced air drying oven and cured according to the following schedule: 100°C for 3 hours, 130°C for 2 hours, and finally 170°C for 5 hours. This yielded a low-dielectric, high-heat-resistant epoxy resin cured product for wave-transmitting automated fiber placement prepreg. Heat resistance and dielectric properties of the cured resin were tested, as shown in Table 1. The cured resin exhibited a dielectric constant less than 3.10, a dielectric loss less than 0.013, and a glass transition temperature greater than 200°C, demonstrating excellent heat resistance and dielectric properties.

[0041] Example 3

[0042] 25 parts of silicone-modified epoxy resin monomer were melted at 50°C, and 15 parts of polyetheretherketone particles and 5 parts of micron-sized boron nitride particles were added. The mixture was stirred until the thermoplastic particles dissolved and the inorganic particles were evenly dispersed. The mixture was then cooled to 60°C, and 50 parts of a linear vinyl copolymer with a molecular weight of 2000 was added and stirred until uniformly mixed. 25 parts of dicyandiamide were then added to 25 parts of the silicone-modified epoxy resin monomer and ground into a paste using a three-roll mill. The components from the two steps were then mixed at 40°C and evenly dispersed to obtain a low-dielectric, high-heat-resistant epoxy resin for wave-transmitting automated fiber placement prepregs. The resulting resin was tested for viscosity, and the data are detailed in Table 1. The resin exhibited suitable viscosity, making it suitable for automated fiber placement processes.

[0043] The resulting epoxy resin was degassed in a vacuum oven at 80°C for 2 hours, then placed in a forced air drying oven and cured according to the following schedule: 100°C for 2 hours, 130°C for 1 hour, and finally 180°C for 3 hours. This yielded a low-dielectric, high-heat-resistant epoxy resin cured product for wave-transmitting automated fiber placement prepreg. Heat resistance and dielectric properties of the cured resin were tested, as shown in Table 1. The cured resin exhibited a dielectric constant less than 3.10, a dielectric loss less than 0.013, and a glass transition temperature greater than 200°C, demonstrating excellent heat resistance and dielectric properties.

[0044] Example 4

[0045] 15 parts of cycloaliphatic epoxy resin monomer were melted at 65°C, and 20 parts of thermoplastic poly(arylethersulfone) particles and 10 parts of micron-sized silica particles were added. The mixture was stirred until the thermoplastic particles dissolved and the inorganic particles were evenly dispersed. The temperature was then lowered to 80°C, and 35 parts of dicyclopentadiene bisphenol cyanate were added and stirred until uniformly distributed. Then, 15 parts of diaminodiphenylsulfone were added to 15 parts of the cycloaliphatic epoxy resin monomer and ground into a paste using a three-roll mill. The components from the two previous steps were then mixed at 80°C and evenly dispersed to produce a low-dielectric, high-heat-resistant epoxy resin for wave-transmitting automated fiber placement prepregs. The resulting resin was tested for viscosity, and the data are detailed in Table 1. The resin exhibited suitable viscosity, making it suitable for automated fiber placement processes.

[0046] The resulting epoxy resin was degassed in a vacuum oven at 110°C for 1 hour, then placed in a forced air drying oven and cured according to the following schedule: 80°C for 5 hours, 130°C for 4 hours, and finally 160°C for 11 hours. This yielded a low-dielectric, high-heat-resistant epoxy resin cured product for wave-transmitting automated fiber placement prepreg. The cured resin was tested for heat resistance and dielectric properties, as shown in Table 1. The cured resin exhibited a dielectric constant less than 3.10, a dielectric loss less than 0.013, and a glass transition temperature greater than 200°C, demonstrating excellent heat resistance and dielectric properties.

[0047] Comparative Example 1

[0048] 30 parts of bisphenol AF epoxy resin monomer were melted at 80°C, and 10 parts of thermoplastic polyimide particles and 5 parts of micron-sized silica particles were added. The mixture was stirred until the thermoplastic particles dissolved and the inorganic particles were evenly dispersed. Then, 10 parts of diaminodiphenyl sulfone were added to 10 parts of bisphenol AF epoxy resin monomer and ground into a paste using a three-roll mill. The components from the two steps were then mixed at 40°C and evenly dispersed to produce a low-dielectric, high-heat-resistant epoxy resin for wave-transmitting automated fiber placement prepreg. The resulting resin was tested for viscosity, and the data are detailed in Table 1. The resin exhibited suitable viscosity, making it suitable for automated fiber placement processes.

[0049] The epoxy resin prepared by the present invention is vacuum degassed in a vacuum oven at 100°C for 0.5h, placed in a blast drying oven, and cured according to the following procedure: 100°C / 3h-150°C / 2h-180°C / 5h to obtain a low-dielectric and high-heat-resistant epoxy resin cured product for wave-transmitting automatic filament placement prepreg. The heat resistance and dielectric properties of the resin cured product are tested, see Table 1. Compared with Example 1, the low-dielectric copolymer component is not introduced in Comparative Example 1. The dielectric constant of the resin cured product is greater than 3.10, the dielectric loss is greater than 0.013, the glass transition temperature is lower than 200°C, and the heat resistance and dielectric properties are poor. It can be seen that the low-dielectric copolymer component can effectively increase the cross-linking density of the resin cured product and reduce the polarization degree of the cross-linking network, which plays a significant role in improving the dielectric properties and heat resistance of the resin.

[0050] Comparative Example 2

[0051] Melt 30 parts of bisphenol AF type epoxy resin monomer at 80°C; cool to 60°C, add 30 parts of bisphenol A type cyanate, and stir evenly; then add 10 parts of diaminodiphenyl sulfone to 10 parts of bisphenol AF type epoxy resin, and grind into a paste with a three-roll grinder; then mix the components in the above two steps at 40°C and disperse evenly to obtain a low-dielectric and high-heat-resistant epoxy resin for wave-transmitting automatic fiber placement prepreg. The obtained resin was subjected to a viscosity test, and the obtained data are shown in Table 1. Compared with Example 1, the viscosity regulating component was not introduced in Comparative Example 1, which makes the resin more viscous, which will cause problems such as wire blocking and glue blocking during the automatic fiber placement process, and is not suitable for the automatic fiber placement process. It can be seen that organic thermoplastic particles and inorganic powders are crucial for adjusting the viscosity of the resin and improving the processability of the resin fiber placement.

[0052] The epoxy resin prepared by the present invention is vacuum-degassed in a vacuum oven at 100°C for 0.5h, placed in a blast drying oven, and cured according to the following procedure: 100°C / 3h-150°C / 2h-180°C / 5h to obtain a low-dielectric and high-heat-resistant epoxy resin cured product for wave-transmitting automatic filament placement prepreg. The heat resistance and dielectric properties of the cured resin are tested, as shown in Table 1. Compared with Example 1, the viscosity regulating component is not introduced in Comparative Example 1, and the dielectric constant of the cured resin is greater than 3.10, the dielectric loss is greater than 0.013, and the dielectric properties are poor. It can be seen that the introduction of organic thermoplastic particles and inorganic powders can limit the orientation movement of the polar groups of the resin, thereby effectively reducing the dielectric constant and dielectric loss of the epoxy resin.

[0053] Table 1 Comprehensive properties of low dielectric and high heat resistant epoxy resin for wave-transmitting automatic fiber placement prepreg

[0054]

[0055] Although the present invention has been disclosed as above by way of embodiments, they are not intended to limit the present invention. Any appropriate modification or equivalent substitution of the technical solution of the present invention by a person skilled in the art should be included in the protection scope of the present invention. The protection scope of the present invention shall be based on that defined in the claims.

Claims

1. A low-dielectric epoxy resin for wave-transmitting automated fiber placement prepreg, comprising the following components in parts by weight:

2. The low dielectric epoxy resin for wave-transmitting automatic fiber placement prepreg according to claim 1, characterized in that: The low-dielectric epoxy resin monomer component is one or more of a fluorine-containing epoxy resin, a dicyclopentadiene epoxy resin, a biphenyl epoxy resin, a cage-type silsesquioxane-modified epoxy resin, an alicyclic epoxy resin, and a silicone-modified epoxy resin; and the epoxy equivalent of the low-dielectric epoxy resin monomer is 100-300 g / eq.

3. The low dielectric epoxy resin for wave-transmitting automatic fiber placement prepreg according to claim 1, characterized in that: The curing agent component is one or more of dicyandiamide, ethylenetriamine, ethylenediamine, methylenebiscyclohexaneamine, diethylenetriamine, triethylenetetramine, tetraethylenepentamine, dipropylenetriamine, dimethylaminopropylamine, m-phenylenediamine, diaminodiphenyl sulfone, hexahydropyridine, bisbenzylamino ether, 2-methylimidazole, 2-ethylimidazole, 2-phenylimidazole, 1-cyanoethyl-2-ethyl-4-methylimidazole, 1-cyanoethyl-2-phenylimidazole, phthalic anhydride, tetrahydrophthalic anhydride, hexahydrophthalic anhydride, methyltetrahydrophthalic anhydride, trimellitic anhydride glyceride, polyazelaic anhydride, methylhexahydrophthalic anhydride, polysebacic anhydride, diphenyl ether tetracarboxylic dianhydride, cyclopentanetetracarboxylic dianhydride, and linear phenolic resin.

4. The low dielectric epoxy resin for wave-transmitting automatic fiber placement prepreg according to claim 1, characterized in that: The low dielectric copolymer component is one or more of cyanate ester, hydrocarbon resin, and benzocyclobutene resin.

5. The low dielectric epoxy resin for wave-transmitting automatic fiber placement prepreg according to claim 4, characterized in that: The cyanate ester is one or more of bisphenol A cyanate ester, bisphenol E cyanate ester, bisphenol M cyanate ester, bisphenol F cyanate ester, dicyclopentadiene bisphenol cyanate ester and novolac cyanate ester.

6. The low dielectric epoxy resin for wave-transmitting automatic fiber placement prepreg according to claim 4, characterized in that: The hydrocarbon resin includes one or more of a cyclic or linear olefin copolymer and a cyclic or linear olefin homopolymer; the side chain of the hydrocarbon resin has a reactive group capable of reacting with an epoxy resin, including one or more of a hydroxyl group, a vinyl group, an amine group and an acid anhydride; and the molecular weight of the hydrocarbon resin is 500-50,000.

7. The low dielectric epoxy resin for wave-transmitting automatic fiber placement prepreg according to claim 4, characterized in that: The benzocyclobutene resin is one or more of monobenzocyclobutene, dibenzocyclobutene or polybenzocyclobutene containing an imide structure, a fluorine structure, a trifluoromethyl structure, a siloxane structure, an aromatic ether structure, a saturated / unsaturated alkane structure, an amide structure and a carbonyl structure.

8. The low dielectric epoxy resin for wave-transmitting automatic fiber placement prepreg according to claim 1, characterized in that: The viscosity adjusting component is an organic viscosity adjusting component and / or an inorganic viscosity adjusting component; the organic viscosity adjusting component includes one or more of thermoplastic polyimide, polyphenylene ether, polyetheretherketone, polyaryletherketone, polyamide, polyarylethersulfone, polyethersulfone, and polyphenylene sulfide, and the average particle size of the organic component particles is 1-20 μm; the inorganic viscosity adjusting component includes one or more of silicon dioxide, aluminum oxide, titanium oxide, zinc oxide, magnesium oxide, aluminum hydroxide, magnesium hydroxide, ceramic powder, barium titanate, sodium titanate, boron nitride, and carbon nanotubes, and the average particle size of the inorganic component particles is 100-20 μm.

9. A method for preparing a low-dielectric epoxy resin for wave-transmitting automatic fiber placement prepreg according to any one of claims 1 to 8, characterized in that: The steps include: The low dielectric epoxy resin monomer component is heated until melted, the viscosity adjusting component is added, and the mixture is stirred until the viscosity adjusting component is dissolved or evenly dispersed; the low dielectric copolymer component is added, and the mixture is stirred evenly to obtain component A; Adding the curing agent component to the low dielectric epoxy resin monomer component and grinding into a paste component B; Mixing component A and component B and dispersing them evenly to obtain epoxy resin; The obtained epoxy resin is heated, vacuumed and degassed, and then subjected to a curing reaction to obtain a low-dielectric epoxy resin cured product for wave-transmitting automatic fiber placement prepreg.

10. The preparation method according to claim 9, wherein The specific steps include: The low dielectric epoxy resin monomer component is heated to melt at a temperature range of 50 to 110° C., a viscosity adjusting component is added, and the mixture is stirred until the viscosity adjusting component is dissolved or evenly dispersed; the temperature is lowered to 50 to 80° C., a low dielectric copolymer component is added, and the mixture is stirred evenly to obtain component A; Adding the curing agent component to the low dielectric epoxy resin monomer component and grinding into a paste component B; Mix component A and component B at 30-80°C and disperse them evenly to obtain epoxy resin; The obtained epoxy resin is vacuum degassed at 80-110° C. for 0.5-2 hours, and cured at 70-200° C. for 5-20 hours to obtain a low-dielectric epoxy resin cured product for wave-transmitting automatic fiber placement prepreg.

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