Heating furnace, temperature measuring method and device thereof, electronic equipment and readable storage medium

Abstract

The invention provides a heating furnace and a temperature measurement method and device thereof, electronic equipment and a readable storage medium, and the heating furnace comprises a cookware radiation measurement unit which is used for receiving a first infrared ray in a first wavelength range and generating a first infrared signal; the panel radiation measurement unit is used for receiving a second infrared ray in a second wavelength range and generating a second infrared signal, and the temperature measurement method of the heating furnace comprises the following steps: acquiring the second infrared signal; determining a third infrared signal reflected by the inner panel surface of the panel according to the second infrared signal, wherein the wavelength of the third infrared signal is within the first wavelength range; determining a fourth infrared signal generated by the outer panel surface of the panel according to the second infrared signal, wherein the wavelength of the fourth infrared signal is within the first wavelength range; determining the emissivity and the reflectivity of the cookware; determining an equivalent infrared signal generated by the cookware according to the emissivity, the reflectivity, the fourth infrared signal, the third infrared signal and the first infrared signal; and calculating the temperature of the cookware according to the equivalent infrared signal.

Description

Technical Field

[0001] The present application relates to the field of kitchen appliances, and more specifically, to a heating stove and a temperature measurement method, device, electronic device, and readable storage medium thereof. Background Art

[0002] Induction cooktops and stoves utilize multiple infrared sensors beneath the cooktop to achieve non-contact pot temperature measurement. However, infrared temperature measurement on induction cooktops also emits infrared radiation, which is reflected by the pot surface and detected by the infrared sensors. Consequently, when the pot has high reflectivity and the cooktop temperature is high, the error in the pot temperature obtained through infrared temperature measurement is relatively large.

[0003] Therefore, how to measure the temperature of the cookware more accurately has become a problem that needs to be solved urgently. Summary of the Invention

[0004] This application aims to solve at least one of the technical problems existing in the prior art or related art.

[0005] To this end, a first aspect of the present application is to provide a temperature measurement method for a heating furnace.

[0006] An embodiment of the second aspect of the present application provides a temperature measuring device for a heating furnace.

[0007] An embodiment of the third aspect of the present application provides an electronic device.

[0008] An embodiment of the fourth aspect of the present application provides a readable storage medium.

[0009] An embodiment of the fifth aspect of the present application provides a heating stove.

[0010] The technical solution of the first aspect of the present application provides a temperature measurement method for a heating stove, which is used for the heating stove. The heating stove includes a bottom shell, a panel, a pot radiation measuring unit, and a panel radiation measuring unit. The panel is installed on the bottom shell and forms a accommodating cavity with the bottom shell. The panel is used to hold the pot. The pot radiation measuring unit is arranged in the accommodating cavity and is used to receive first infrared rays in a first wavelength range and generate a first infrared signal. The panel radiation measuring unit is arranged in the accommodating cavity and is used to receive second infrared rays in a second wavelength range and generate a second infrared signal. The second wavelength range is larger than the first wavelength range. The temperature measurement method of the heating stove includes: obtaining the second infrared signal; determining a third infrared signal reflected by an inner plate surface of the panel based on the second infrared signal, the wavelength of the third infrared signal being within the first wavelength range; determining a fourth infrared signal generated by an outer plate surface of the panel based on the second infrared signal, the wavelength of the fourth infrared signal being within the first wavelength range; determining the emissivity and reflectivity of the pot; determining an equivalent infrared signal generated by the pot based on the emissivity, reflectivity, the fourth infrared signal, the third infrared signal, and the first infrared signal; and calculating the temperature of the pot based on the equivalent infrared signal.

[0011] The temperature measurement method for a heating stove provided in this application is used for a heating stove. The heating stove includes a bottom shell, a panel, a pot radiation measurement unit, and a panel radiation measurement unit. The panel is used to support the pot. The panel and bottom shell form the outer shell structure of the heating stove. This outer shell structure houses components such as the pot radiation measurement unit, the panel radiation measurement unit, the heating coil, and a control device. The pot radiation measurement unit is primarily used to detect infrared radiation from the pot, but the detected infrared radiation may include some infrared radiation from the panel. The panel radiation measurement unit is used to detect second infrared radiation from the inner surface of the panel. Since the wavelength of the second infrared radiation falls within the second wavelength range, the infrared radiation detected by the panel radiation measurement unit all originates from the panel itself. This is because the wavelength of the infrared radiation generated by the pot radiation measurement unit is generally smaller than the second wavelength range. Since infrared radiation of different wavelengths generated by the same panel exhibits certain regularities, after detecting the second infrared signal from the panel, the signals corresponding to the third infrared radiation within the first wavelength range generated on the inner surface of the panel and the fourth infrared radiation generated on the outer surface of the panel can be determined based on these regularities. Then, the third and fourth infrared signals are removed from the first infrared signal to obtain the infrared signal radiated by the cookware. Finally, based on the obtained infrared signal radiated by the cookware and the emissivity of the cookware, the equivalent infrared signal E5 of the cookware is derived. The cookware temperature can then be determined based on the equivalent infrared signal E5. This method not only considers the influence of infrared radiation generated by the inner surface of the panel on the temperature measurement, but also the influence of infrared radiation reflected by the cookware from the outer surface of the panel on the cookware temperature measurement. In other words, when measuring the cookware temperature, the influence of infrared radiation from the inner and outer surfaces of the panel on the cookware is eliminated. As a result, the detected cookware temperature is more accurate and has a smaller error, thereby improving the accuracy of the product's temperature control.

[0012] When using infrared for non-contact temperature measurement, infrared radiation from the panel's outer surface also has a certain impact on the pot's temperature measurement. Specifically, the pot's infrared rays experience signal attenuation after passing through the panel. When the pot's temperature is high, the infrared signal from the pot received by the pot's radiation measurement unit is relatively strong, and the infrared radiation from the panel's outer surface has a relatively small impact on the pot's temperature measurement, resulting in more accurate pot temperature measurement. However, when the pot's temperature is below 120°C, the infrared signal intensity generated by the pot is low, and this infrared signal attenuates again after passing through the panel, making the infrared signal received by the pot's radiation measurement unit very weak. At this point, the infrared radiation from the panel's outer surface has a significant impact on the pot's temperature measurement. However, in related solutions for non-contact infrared temperature measurement, the impact of infrared radiation from the panel's outer surface on pot temperature measurement is not considered. This results in inaccurate pot temperature measurement. In particular, when the pot is operating in the low-temperature range, the temperature measurement error is very large, making infrared temperature measurement essentially unsuitable for low-temperature temperature measurement. However, in the present application, the influence of infrared radiation from the outer surface of the panel on the temperature measurement is taken into account during temperature measurement. Thus, the accuracy of temperature measurement will be improved regardless of whether the cookware is operating in a high temperature range or a low temperature range, thereby improving the accuracy of temperature measurement of the cookware as a whole.

[0013] Furthermore, considering that cookware of different colors and materials has different emissivity and reflectivity, the equivalent infrared signal of the cookware can be calculated by combining the detected infrared signal with the emissivity and reflectivity of the cookware. This can reduce the temperature measurement differences caused by the different emissivity and reflectivity of different cookware, making the detected temperature more accurate.

[0014] Different heating objects have different temperatures and generate different wavelengths of infrared light. When a cooker is operating, its temperature is generally higher, so the wavelength of the infrared light it generates is generally shorter. However, the temperature of a panel, etc., is lower, so the wavelength of the infrared light it generates is generally longer. Therefore, based on this principle, the present application provides two infrared sensors capable of receiving infrared light of different wavelengths. This allows the equivalent infrared signal of the cooker to be obtained, thereby accurately determining the cooker's temperature.

[0015] In a possible design, the cookware radiation measuring unit and the panel radiation measuring unit are both thermopile infrared sensors. Of course, the cookware radiation measuring unit and the panel radiation measuring unit can also be infrared photoelectric detectors.

[0016] In one possible design, the heating stove includes an infrared emitting tube and an infrared receiving tube, the infrared emitting tube is used to emit a fifth infrared ray in a third wavelength range, and the infrared receiving tube is used to receive a sixth infrared ray after the fifth infrared ray is reflected by the cookware and generate a sixth infrared signal. The steps of determining the emissivity and reflectivity of the cookware include: controlling the infrared emitting tube to emit the fifth infrared ray; determining the emissivity of the cookware based on the received sixth infrared signal and the fifth infrared ray; and calculating the reflectivity based on the relationship among the emissivity, reflectivity, and reflectivity.

[0017] In this technical solution, an infrared emitting tube and an infrared receiving tube form an infrared pair. This infrared pair can be used to detect the reflectivity of the cookware. Specifically, the infrared emitting tube can be controlled to emit a fifth infrared ray and then receive a sixth infrared ray, which is the result of the reflection of the fifth infrared ray. The reflectivity of the cookware can be determined based on the received sixth infrared ray. Subsequently, the emissivity of the cookware can be calculated based on the relationship between reflectivity and emissivity. This method allows for simple and rapid detection of the reflectivity and emissivity of the cookware while the heating stove is operating. This allows accurate detection of the reflectivity and emissivity of the current cookware when different cookware are placed on the heating stove.

[0018] In one possible design, an image acquisition device may be provided to capture an image of the cookware currently in use, and then determine the material and color of the cookware based on the image. The reflectivity and emissivity of the current cookware may then be determined by table lookup or other methods.

[0019] In one possible design, the emissivity and reflectivity satisfy the following relationship: ρ = 1-ε. That is, the sum of the emissivity and the reflectivity is equal to 1. ε represents the emissivity, and ρ represents the reflectivity.

[0020] In a possible design, the third wavelength range is 900 nanometers to 1000 nanometers. Further, the infrared wavelength that can be emitted by the infrared emitting tube and received by the infrared receiving tube is 940 nanometers.

[0021] In one possible design, the step of determining the third infrared signal generated by the inner surface of the panel based on the received second infrared signal includes: obtaining a first relationship between the second infrared signal and the third infrared signal; and determining the third infrared signal based on the second infrared signal and the first relationship.

[0022] In this technical solution, the first relationship between the second infrared signal and the third infrared signal can be stored in advance, so that after the second infrared signal is monitored, the third infrared signal can be determined according to the third relationship stored in advance.

[0023] In one possible design, the step of determining the fourth infrared signal generated by the outer surface of the panel based on the received second infrared signal includes: obtaining a second relationship between the second infrared signal and the fourth infrared signal; and determining the fourth infrared signal based on the second infrared signal and the second relationship.

[0024] In this technical solution, the second relationship between the second infrared signal and the fourth infrared signal can be stored in advance, so that after the second infrared signal is monitored, the fourth infrared signal can be determined according to the second relationship stored in advance.

[0025] In a possible design, the equivalent infrared signal E5, the third infrared signal E2, the fourth infrared signal E3, the first infrared signal E4, the emissivity ε and the reflectivity ρ satisfy the following relationship: E5 = (E4-E2-ρ×E3) / ε.

[0026] In this technical solution, E4-E2-ρ×E3 is the actual infrared signal of the cookware detected by the cookware radiation measurement unit, that is, the infrared signal emitted by the cookware and detected by the cookware radiation measurement unit. Given that different cookware has different emissivities, the equivalent infrared signal of the cookware can be calculated using E4-E2-ρ×E3 and ε.

[0027] In one possible design, the first wavelength range is 3μm-4.5μm. Different panels have different transmittances for different wavelengths of infrared. Experiments have shown that for microcrystalline panels, infrared rays with wavelengths below 4.5μm are more easily penetrating. Given that 3μm-4.5μm infrared sensors are relatively common, setting the first wavelength range to 3μm-4.5μm makes it easier to purchase cookware radiation measurement units.

[0028] In one possible design, the second wavelength range is 5 μm-15 μm.

[0029] Different panels have different transmittances for infrared light of different wavelengths. Experiments have shown that for microcrystalline panels, infrared light with wavelengths above 4.5μm cannot penetrate them. Therefore, setting the response wavelength of the panel's radiation measurement unit to above 4.5μm ensures that the infrared light detected by the panel's radiation measurement unit is generated by the panel's inner surface, thus ensuring the accuracy of the second infrared light generated by the panel's inner surface.

[0030] The technical solution of the second aspect of the present application provides a temperature measuring device for a heating stove, the heating stove comprising a bottom shell and a panel, a pot radiation measuring unit and a panel radiation measuring unit, the panel being mounted on the bottom shell and forming a receiving cavity with the bottom shell, the panel being used to hold the pot, the pot radiation measuring unit being disposed in the receiving cavity and being used to receive first infrared rays within a first wavelength range and generate a first infrared signal, the panel radiation measuring unit being disposed in the receiving cavity and being used to receive second infrared rays within a second wavelength range and generate a second infrared signal, the second wavelength range being greater than the first wavelength range, the temperature measuring device for the heating stove comprising: an acquiring unit for acquiring the second infrared signal; The first determination unit is used to determine a third infrared signal reflected by the inner surface of the panel based on the second infrared signal, and the wavelength of the third infrared signal is within the first wavelength range; the second determination unit is used to determine a fourth infrared signal generated by the outer surface of the panel based on the second infrared signal, and the wavelength of the fourth infrared signal is within the first wavelength range; the third determination unit is used to determine the emissivity and reflectivity of the cookware; the fourth determination unit is used to determine an equivalent infrared signal generated by the cookware based on the emissivity, reflectivity, the fourth infrared signal, the third infrared signal and the first infrared signal; and the calculation unit is used to calculate the temperature of the cookware based on the equivalent infrared signal.

[0031] The present application provides a temperature measurement device for a heating stove, which is used for heating stoves. The heating stove includes a bottom shell, a panel, a pot radiation measurement unit, and a panel radiation measurement unit. The panel is used to support the pot. The panel and bottom shell form the outer shell structure of the heating stove. This outer shell structure houses components such as the pot radiation measurement unit, the panel radiation measurement unit, the heating coil, and a control device. The pot radiation measurement unit is primarily used to detect infrared radiation from the pot, but the detected infrared radiation may include some infrared radiation from the panel. The panel radiation measurement unit is used to detect second infrared radiation from the inner surface of the panel. Since the wavelength of the second infrared radiation falls within the second wavelength range, the infrared radiation detected by the panel radiation measurement unit all originates from the panel itself. This is because the wavelength of the infrared radiation generated by the pot radiation measurement unit is generally smaller than the second wavelength range. Since infrared radiation of different wavelengths generated by the same panel exhibits certain regularities, after detecting the second infrared signal from the panel, the signals corresponding to the third infrared radiation within the first wavelength range generated on the inner surface of the panel and the fourth infrared radiation generated on the outer surface of the panel can be determined based on these regularities. Then, the third and fourth infrared signals are removed from the first infrared signal to obtain the infrared signal radiated by the cookware. Finally, based on the obtained infrared signal radiated by the cookware and the emissivity of the cookware, the equivalent infrared signal E5 of the cookware is derived. The cookware temperature can then be determined based on the equivalent infrared signal E5. This method not only considers the influence of infrared radiation generated by the inner surface of the panel on the temperature measurement, but also the influence of infrared radiation reflected by the cookware from the outer surface of the panel on the cookware temperature measurement. In other words, when measuring the cookware temperature, the influence of infrared radiation from the inner and outer surfaces of the panel on the cookware is eliminated. As a result, the detected cookware temperature is more accurate and has a smaller error, thereby improving the accuracy of the product's temperature control.

[0032] When using infrared for non-contact temperature measurement, infrared radiation from the panel's outer surface also has a certain impact on the pot's temperature measurement. Specifically, the pot's infrared rays experience signal attenuation after passing through the panel. When the pot's temperature is high, the infrared signal from the pot received by the pot's radiation measurement unit is relatively strong, and the infrared radiation from the panel's outer surface has a relatively small impact on the pot's temperature measurement, resulting in more accurate pot temperature measurement. However, when the pot's temperature is below 120°C, the infrared signal intensity generated by the pot is low, and this infrared signal attenuates again after passing through the panel, making the infrared signal received by the pot's radiation measurement unit very weak. At this point, the infrared radiation from the panel's outer surface has a significant impact on the pot's temperature measurement. However, in related solutions for non-contact infrared temperature measurement, the impact of infrared radiation from the panel's outer surface on pot temperature measurement is not considered. This results in inaccurate pot temperature measurement. In particular, when the pot is operating in the low-temperature range, the temperature measurement error is very large, making infrared temperature measurement essentially unsuitable for low-temperature temperature measurement. However, in the present application, the influence of infrared radiation from the outer surface of the panel on the temperature measurement is taken into account during temperature measurement. Thus, the accuracy of temperature measurement will be improved regardless of whether the cookware is operating in a high temperature range or a low temperature range, thereby improving the accuracy of temperature measurement of the cookware as a whole.

[0033] Furthermore, considering that cookware of different colors and materials has different emissivity and reflectivity, the equivalent infrared signal of the cookware can be calculated by combining the detected infrared signal with the emissivity and reflectivity of the cookware. This can reduce the temperature measurement differences caused by the different emissivity and reflectivity of different cookware, making the detected temperature more accurate.

[0034] Different heating objects have different temperatures and generate different wavelengths of infrared light. When a cooker is operating, its temperature is generally higher, so the wavelength of the infrared light it generates is generally shorter. However, the temperature of a panel, etc., is lower, so the wavelength of the infrared light it generates is generally longer. Therefore, based on this principle, the present application provides two infrared sensors capable of receiving infrared light of different wavelengths. This allows the equivalent infrared signal of the cooker to be obtained, thereby accurately determining the cooker's temperature.

[0035] In a possible design, the temperature measuring device of the heating furnace can also implement the steps of the temperature measuring method of the heating furnace in any of the above technical solutions.

[0036] In a possible design, the panel is a light-transmitting panel, such as a black crystal glass panel. The light transmittance of the panel can be set to be fully transparent or partially transparent as needed.

[0037] In one possible design, the panel is provided with a through-hole, and a light-transmitting member is installed in the through-hole. This arrangement, by locally providing the light-transmitting member on the panel, can improve the panel's attenuation of infrared radiation, thereby increasing the intensity of the infrared signal detected by the cookware radiation measurement unit and the panel radiation measurement unit, thereby improving temperature measurement accuracy.

[0038] In a possible design, the heating stove further includes: a pot detection unit, which can cooperate with the pot to generate detection parameters.

[0039] Existing heating stoves with infrared non-contact temperature measurement cannot determine whether a pot is present. Once the stove starts heating, it will continue heating regardless of whether a pot is on the panel. However, heating without a pot on the panel not only wastes energy but is also dangerous. A pot detection unit can detect the presence of a pot. This allows the stove to heat only when a pot is detected. If no pot is on the panel, the stove will not heat, or continue heating based on whether the user is away. This not only improves energy efficiency but also reduces safety hazards caused by the pot not being heated.

[0040] In one possible design, the infrared emitting tube is further configured to emit a seventh infrared ray, and the infrared receiving tube is further configured to receive an eighth infrared ray, which is the result of reflection of the seventh infrared ray. The temperature measurement method further includes determining the color of the cookware and / or the presence of the cookware based on the eighth infrared ray. This configuration allows the heating stove to detect the presence of a cookware. This is because the infrared light reflected by the cookware produces different signal intensities when the cookware is present and when the cookware is absent. Based on this signal intensity, the presence of the cookware on the panel can be determined. Alternatively, the infrared pair sensor can detect the color of the cookware. This is because different cookware colors reflect infrared light differently. Therefore, the infrared light reflected by the fifth infrared ray produces different signal intensities when the cookware is different colors. Based on this signal intensity, the cookware color can be determined. Given that different colors of cookware generate different infrared rays when heated, once the cookware color is determined, the cookware temperature can be corrected based on the color of the cookware.

[0041] In one possible design, the heating stove also includes a heating device, such as a heating coil. This heating device is located within the accommodating cavity and is used to heat the cookware. The heating device can be an electromagnetic heating coil. The specific principle is that the heating coil generates an alternating electromagnetic field. Electromagnetic induction generates eddy currents within the cookware within this alternating electromagnetic field, generating active heating. This achieves electromagnetic heating of the cookware.

[0042] In one possible design, the heating oven further includes a light guide channel, one end of which is sealed to the panel. The cookware radiation measurement unit and the panel radiation measurement unit are located within the light guide channel. This reduces the impact of infrared radiation from the panel and other sources on the detection results of the cookware radiation measurement unit and the panel radiation measurement unit.

[0043] In a possible design, the panel is generally a light-transmitting panel, such as a glass panel.

[0044] Among them, heating stoves include induction cookers, electric ceramic cookers, etc.

[0045] In a third aspect, an embodiment of the present application proposes an electronic device, comprising: a memory, the memory storing a program or instruction, and a processor, which, when executing the program or instruction, implements the steps of the temperature measurement method of the heating furnace provided by any one of the solutions in the first aspect.

[0046] The electronic device according to the present application can implement the steps of the method for measuring the temperature of a heating furnace provided by any solution of the first aspect. Therefore, the electronic device has all the beneficial effects of the method for measuring the temperature of a heating furnace provided by any solution of the first aspect.

[0047] In a fourth aspect, an embodiment of the present application proposes a readable storage medium on which a program or instruction is stored. When the program or instruction is executed, the steps of the temperature measurement method of the heating furnace provided by any solution of the first aspect are implemented.

[0048] Since the readable storage medium can implement the steps of the temperature measurement method for a heating furnace provided by any solution of the first aspect, the readable storage medium has all the beneficial effects of the temperature measurement method for a heating furnace provided by any solution of the first aspect.

[0049] In a fifth aspect, an embodiment of the present application proposes a heating furnace, comprising: the temperature measuring device of the heating furnace provided in the second aspect, and / or the electronic device provided in any one of the schemes of the third aspect; and / or the readable storage medium provided in any one of the schemes of the fourth aspect.

[0050] Since the heating furnace of the embodiment of the present application includes one of the temperature measuring device, electronic device, and readable storage medium of the heating furnace of any of the above technical solutions, it also has all the beneficial effects of the temperature measuring device, electronic device, or readable storage medium of the heating furnace.

[0051] Additional aspects and advantages of the present application will become apparent in the following description or may be learned through practice of the present application. BRIEF DESCRIPTION OF THE DRAWINGS

[0052] The above and / or additional aspects and advantages of the present application will become apparent and easily understood from the description of the embodiments in conjunction with the following drawings, in which:

[0053] Figure 1 A schematic diagram showing a flow chart of a method for measuring temperature of a heating furnace according to an embodiment of the present application is provided;

[0054] Figure 2 A schematic structural diagram of a heating furnace according to an embodiment of the present application is shown;

[0055] Figure 3 Another structural schematic diagram of a heating furnace according to an embodiment of the present application is shown;

[0056] Figure 4 The transmittance of the heating stove panel to infrared rays of different wavelengths is shown;

[0057] Figure 5 A second flow chart of a method for measuring temperature of a heating furnace according to an embodiment of the present application is shown;

[0058] Figure 6 A block diagram of a temperature measuring device for a heating furnace according to an embodiment of the present application is shown.

[0059] Figure 7 A block diagram of an electronic device according to an embodiment of the present application is shown. DETAILED DESCRIPTION

[0060] In order to more clearly understand the above-mentioned objects, features and advantages of the present application, the present application is further described in detail below in conjunction with the accompanying drawings and specific embodiments. It should be noted that the embodiments of the present application and the features therein can be combined with each other in the absence of conflict.

[0061] In the following description, many specific details are set forth to facilitate a full understanding of the present application. However, the present application may also be implemented in other ways different from those described herein. Therefore, the scope of protection of the present application is not limited to the specific embodiments disclosed below.

[0062] Refer to the following Figures 1 to 7 The following describes a heating stove provided according to some embodiments of the present application.

[0063] like Figure 1 As shown, the technical solution of the first aspect of the present application provides a temperature measurement method for a heating furnace, which is used as follows Figure 2 and Figure 3The heating stove shown. The heating stove includes a bottom shell 13, a panel 14, a pot radiation measuring unit 8, and a panel radiation measuring unit 9. The panel 14 is mounted on the bottom shell 13 and forms a receiving cavity 15 with the bottom shell 13. The panel 14 is used to hold the pot. The pot radiation measuring unit 8 is disposed in the receiving cavity 15 and is used to receive a first infrared ray within a first wavelength range and generate a first infrared signal. The panel radiation measuring unit 9 is disposed in the receiving cavity 15 and is used to receive a second infrared ray within a second wavelength range and generate a second infrared signal. The second wavelength range is greater than the first wavelength range. The temperature measurement method of the heating stove includes:

[0064] S102, acquiring a second infrared signal;

[0065] S104, determining a third infrared signal reflected by the inner surface of the panel based on the second infrared signal, where the wavelength of the third infrared signal is within the first wavelength range;

[0066] S106, determining a fourth infrared signal generated by the outer surface of the panel based on the second infrared signal, where the wavelength of the fourth infrared signal is within the first wavelength range;

[0067] S108, determining the emissivity and reflectivity of the cookware;

[0068] S110, determining an equivalent infrared signal generated by the cookware based on the emissivity, reflectivity, the fourth infrared signal, the third infrared signal, and the first infrared signal;

[0069] S112: Calculate the temperature of the cookware according to the equivalent infrared signal.

[0070] The temperature measurement method for a heating stove provided in this application is used for a heating stove. The heating stove includes a bottom shell, a panel, a pot radiation measurement unit, and a panel radiation measurement unit. The panel is used to support the pot. The panel and bottom shell form the outer shell structure of the heating stove. This outer shell structure houses components such as the pot radiation measurement unit, the panel radiation measurement unit, the heating coil, and a control device. The pot radiation measurement unit is primarily used to detect infrared radiation from the pot, but the detected infrared radiation may include some infrared radiation from the panel. The panel radiation measurement unit is used to detect second infrared radiation from the inner surface of the panel. Since the wavelength of the second infrared radiation falls within the second wavelength range, the infrared radiation detected by the panel radiation measurement unit all originates from the panel itself. This is because the wavelength of the infrared radiation generated by the pot radiation measurement unit is generally smaller than the second wavelength range. Since infrared radiation of different wavelengths generated by the same panel exhibits certain regularities, after detecting the second infrared signal from the panel, the signals corresponding to the third infrared radiation within the first wavelength range generated on the inner surface of the panel and the fourth infrared radiation generated on the outer surface of the panel can be determined based on these regularities. Then, the third and fourth infrared signals are removed from the first infrared signal to obtain the infrared signal radiated by the cookware. Finally, based on the obtained infrared signal radiated by the cookware and the emissivity of the cookware, the equivalent infrared signal E5 of the cookware is derived. The cookware temperature can then be determined based on the equivalent infrared signal E5. This method not only considers the influence of infrared radiation generated by the inner surface of the panel on the temperature measurement, but also the influence of infrared radiation reflected by the cookware from the outer surface of the panel on the cookware temperature measurement. In other words, when measuring the cookware temperature, the influence of infrared radiation from the inner and outer surfaces of the panel on the cookware is eliminated. As a result, the detected cookware temperature is more accurate and has a smaller error, thereby improving the accuracy of the product's temperature control.

[0071] When using infrared for non-contact temperature measurement, infrared radiation from the panel's outer surface also has a certain impact on the pot's temperature measurement. Specifically, the pot's infrared rays experience signal attenuation after passing through the panel. When the pot's temperature is high, the infrared signal from the pot received by the pot's radiation measurement unit is relatively strong, and the infrared radiation from the panel's outer surface has a relatively small impact on the pot's temperature measurement, resulting in more accurate pot temperature measurement. However, when the pot's temperature is below 120°C, the infrared signal intensity generated by the pot is low, and this infrared signal attenuates again after passing through the panel, making the infrared signal received by the pot's radiation measurement unit very weak. At this point, the infrared radiation from the panel's outer surface has a significant impact on the pot's temperature measurement. However, in related solutions for non-contact infrared temperature measurement, the impact of infrared radiation from the panel's outer surface on pot temperature measurement is not considered. This results in inaccurate pot temperature measurement. In particular, when the pot is operating in the low-temperature range, the temperature measurement error is very large, making infrared temperature measurement essentially unsuitable for low-temperature temperature measurement. However, in the present application, the influence of infrared radiation from the outer surface of the panel on the temperature measurement is taken into account during temperature measurement. Thus, the accuracy of temperature measurement will be improved regardless of whether the cookware is operating in a high temperature range or a low temperature range, thereby improving the accuracy of temperature measurement of the cookware as a whole.

[0072] Furthermore, considering that cookware of different colors and materials has different emissivity and reflectivity, the equivalent infrared signal of the cookware can be calculated by combining the detected infrared signal with the emissivity and reflectivity of the cookware. This can reduce the temperature measurement differences caused by the different emissivity and reflectivity of different cookware, making the detected temperature more accurate.

[0073] Different heating objects have different temperatures and generate different wavelengths of infrared light. When a cooker is operating, its temperature is generally higher, so the wavelength of the infrared light it generates is generally shorter. However, the temperature of a panel, etc., is lower, so the wavelength of the infrared light it generates is generally longer. Therefore, based on this principle, the present application provides two infrared sensors capable of receiving infrared light of different wavelengths. This allows the equivalent infrared signal of the cooker to be obtained, thereby accurately determining the cooker's temperature.

[0074] In a possible design, the cookware radiation measuring unit and the panel radiation measuring unit are both thermopile infrared sensors. Of course, the cookware radiation measuring unit and the panel radiation measuring unit can also be infrared photoelectric detectors.

[0075] In one possible design, Figure 2As shown, the heating stove includes an infrared emitting tube and an infrared receiving tube, the infrared emitting tube is used to emit a fifth infrared ray in a third wavelength range, and the infrared receiving tube is used to receive a sixth infrared ray after the fifth infrared ray is reflected by the cookware and generate a sixth infrared signal. The steps of determining the emissivity and reflectivity of the cookware include: controlling the infrared emitting tube to emit the fifth infrared ray; determining the emissivity of the cookware based on the received sixth infrared signal and the fifth infrared ray; and calculating the reflectivity based on the relationship among the emissivity, reflectivity and reflectivity.

[0076] In this technical solution, an infrared emitting tube and an infrared receiving tube form an infrared pair. This infrared pair can be used to detect the reflectivity of the cookware. Specifically, the infrared emitting tube can be controlled to emit a fifth infrared ray and then receive a sixth infrared ray, which is the result of the reflection of the fifth infrared ray. The reflectivity of the cookware can be determined based on the received sixth infrared ray. Subsequently, the emissivity of the cookware can be calculated based on the relationship between reflectivity and emissivity. This method allows for simple and rapid detection of the reflectivity and emissivity of the cookware while the heating stove is operating. This allows accurate detection of the reflectivity and emissivity of the current cookware when different cookware are placed on the heating stove.

[0077] In one possible design, an image acquisition device may be provided to capture an image of the cookware currently in use, and then determine the material and color of the cookware based on the image. The reflectivity and emissivity of the current cookware may then be determined by table lookup or other methods.

[0078] In one possible design, the emissivity and reflectivity satisfy the following relationship: ρ = 1-ε. That is, the sum of the emissivity and the reflectivity is equal to 1. ε represents the emissivity, and ρ represents the reflectivity.

[0079] In a possible design, the third wavelength range is 900 nanometers to 1000 nanometers. Further, the infrared wavelength that can be emitted by the infrared emitting tube and received by the infrared receiving tube is 940 nanometers.

[0080] In one possible design, the step of determining the third infrared signal generated by the inner surface of the panel based on the received second infrared signal includes: obtaining a first relationship between the second infrared signal and the third infrared signal; and determining the third infrared signal based on the second infrared signal and the first relationship.

[0081] In this technical solution, the first relationship between the second infrared signal and the third infrared signal can be stored in advance, so that after the second infrared signal is monitored, the third infrared signal can be determined according to the third relationship stored in advance.

[0082] In one possible design, the step of determining the fourth infrared signal generated by the outer surface of the panel based on the received second infrared signal includes: obtaining a second relationship between the second infrared signal and the fourth infrared signal; and determining the fourth infrared signal based on the second infrared signal and the second relationship.

[0083] In this technical solution, the second relationship between the second infrared signal and the fourth infrared signal can be stored in advance, so that after the second infrared signal is monitored, the fourth infrared signal can be determined according to the second relationship stored in advance.

[0084] In a possible design, the equivalent infrared signal E5, the third infrared signal E2, the fourth infrared signal E3, the first infrared signal E4, the emissivity ε and the reflectivity ρ satisfy the following relationship: E5 = (E4-E2-ρ×E3) / ε.

[0085] In this technical solution, E4-E2-ρ×E3 is the actual infrared signal of the cookware detected by the cookware radiation measurement unit, that is, the infrared signal emitted by the cookware and detected by the cookware radiation measurement unit. Given that different cookware has different emissivities, the equivalent infrared signal of the cookware can be calculated using E4-E2-ρ×E3 and ε.

[0086] In one possible design, the first wavelength range is 3μm-4.5μm. Different panels have different transmittances for different wavelengths of infrared. Experiments have shown that for microcrystalline panels, infrared rays with wavelengths below 4.5μm are more easily penetrating. Given that 3μm-4.5μm infrared sensors are relatively common, setting the first wavelength range to 3μm-4.5μm makes it easier to purchase cookware radiation measurement units.

[0087] In one possible design, the second wavelength range is 5 μm-15 μm.

[0088] Different panels have different transmittances for infrared light of different wavelengths. Experiments have shown that for microcrystalline panels, infrared light with wavelengths above 4.5μm cannot penetrate them. Therefore, setting the response wavelength of the panel's radiation measurement unit to above 4.5μm ensures that the infrared light detected by the panel's radiation measurement unit is generated by the panel's inner surface, thus ensuring the accuracy of the second infrared light generated by the panel's inner surface.

[0089] The temperature measurement method provided by this application is further introduced below using an induction cooker as an example.

[0090] Due to the need for heat resistance, induction cookers generally use high-temperature resistant micro-ceramic glass as the cooktop. However, conventional infrared (wavelength > 5um) cannot penetrate micro-ceramic panels, so conventional infrared methods cannot be used for temperature measurement.

[0091] Existing infrared temperature measurement devices for induction cookers measure temperature using infrared sensors that receive infrared radiation in a specific wavelength band that can penetrate microcrystalline panels. These thermopile infrared sensors measure the intensity of the thermal radiation emitted by the object being measured. In practical applications, especially during long-term, high-power heating, when the temperature of surrounding components is high, the sensor is susceptible to interference from ambient infrared radiation.

[0092] At the same time, since the cooktop also emits infrared radiation, the infrared radiation interference reflected by the cookware surface will also be collected by the sensor. Therefore, when the cookware has a high reflectivity and the cooktop temperature is high, the measured temperature error is relatively large.

[0093] in, Figure 4 The infrared transmittance of the stove panel (microcrystalline panel) at different wavelengths is shown. Figure 4 Indicates the ability to penetrate certain specific wavelengths of infrared light. Figure 4 In the figure, 201 represents the first spectral band, 202 represents the second spectral band, and 203 represents the third spectral band.

[0094] Among them, Figure 4 As can be seen, infrared can penetrate the spectral bands 203 and 202, with the 202 band having weaker penetration than the 203 band. The spectral range encompassed by the 201 and 202 bands allows the use of a mid-infrared sensor to measure the infrared radiation intensity of the cookware under test. The 203 band can be used to measure the long infrared radiation intensity at the bottom of the cooktop using a long infrared sensor. Furthermore, a short infrared pair module (wavelength 940nm) is provided to measure the emissivity of the cookware.

[0095] Figure 3 Cookware emissivity measurement unit

[0096] The block diagram of the induction cooker of this embodiment shows the structure of the induction cooker. The induction cooker includes a processing unit 12, a pot emissivity measurement unit 7, a pot radiation measurement unit 8, and a panel radiation measurement unit 9. The pot radiation measurement unit's measurement results are compensated using the pot's emissivity and reflection characteristics as well as the panel's infrared radiation, improving the accuracy of the pot's infrared temperature measurement.

[0097] Figure 5This is the measurement flow chart of this embodiment. The emissivity of the pot is measured by the pot emissivity measurement unit, and the corresponding reflectivity of the measured object is obtained based on the relationship. Since the mid-infrared radiation intensity E2 from the bottom of the panel measured by the pot radiation unit can be obtained by mapping the long infrared radiation intensity E1 measured by the panel radiation measurement unit. The surface mid-infrared radiation intensity E3 of the glass panel can also be obtained by mapping the long infrared radiation intensity E1 measured by the panel radiation measurement unit. Finally, the emissivity and reflectivity of the pot surface measured by the pot emissivity measurement unit are combined to obtain the equivalent mid-infrared radiation intensity E5 of the pot black body after compensation, and the accurate pot temperature is obtained. Figure 5 As shown, the specific process includes the following steps:

[0098] S502: The cookware emissivity measurement unit measures the emissivity ε and reflectivity ρ of the cookware.

[0099] S504: The panel radiation measuring unit measures and obtains the long infrared radiation intensity E1 of the bottom of the stove panel.

[0100] S506: Obtain the mid-infrared radiation intensity E2 emitted from the bottom of the stove panel through infrared radiation mapping at the bottom of the stove panel.

[0101] S508 , obtaining the mid-infrared radiation intensity E3 of the stove panel surface through long infrared radiation mapping at the bottom of the stove panel.

[0102] S510: The cookware radiation measurement unit measures and obtains a mid-infrared radiation intensity E4.

[0103] S512, compensating to obtain the equivalent blackbody infrared radiation intensity E5 = (E4 - E2 - ρ × E3) / ε emitted by the cookware.

[0104] S514: Calculate the temperature of the cookware.

[0105] The following combination Figure 2 and Figure 3 The structure of the present embodiment is further described in detail.

[0106] in, Figure 2 and Figure 3 The correspondence between the reference numerals and component names is as follows:

[0107] 1 short infrared reflection signal (i.e., the signal emitted by the infrared emitting tube), 2 mid-infrared radiation of the cookware, 3 mid-infrared radiation of the stove panel surface, 4 mid-infrared radiation of the stove panel bottom, 5 long infrared radiation of the stove panel bottom, 6 signal measured by the cookware radiation measurement unit, 7 cookware emissivity measurement unit, 72 infrared emitting tube, 74 infrared receiving tube, 8 cookware radiation measurement unit, 9 stove panel radiation measurement unit, 10 stove panel surface, 11 stove panel bottom, 12 processing unit, 13 bottom shell, 14 panel, 15 accommodating cavity.

[0108] like Figure 2 As shown, the infrared temperature measurement module in the present invention includes a pot emissivity measurement unit 7, a pot radiation measurement unit 8, a stove panel radiation measurement unit 9 and a processing unit 12. For easy installation, the above four modules are integrated on a circuit board and built into the induction cooker, placed directly below the induction cooker panel.

[0109] The cookware emissivity measurement unit 7 uses a short infrared (wavelength 940nm) pair of tubes (one infrared emitting tube and one infrared receiving tube) to measure the short infrared signal reflection intensity E6 of the measured object, inputs it into the processing unit, and calculates the emissivity and reflectivity ρ of the measured object.

[0110] The cooktop panel radiation measuring unit 9 measures a long infrared radiation signal containing a wavelength of the third spectrum band 203 . The third spectrum band 203 ensures that the infrared radiation measured by the cooktop panel radiation measuring unit 9 comes from the cooktop panel.

[0111] The cookware radiation measuring unit 8 measures the mid-infrared radiation signal containing the wavelength of the second spectral band 202, such as Figure 3 As shown, the mid-infrared radiation signal E4 measured by the cookware radiation measurement unit 8 includes the mid-infrared thermal radiation signal E5 from the measured object itself, the mid-infrared radiation signal E3 emitted from the bottom 11 of the cooktop, and the mid-infrared radiation signal E2 emitted from the cooktop surface 10 and reflected from the bottom of the cookware. Except for the mid-infrared radiation signal emitted by the measured object itself, all other infrared radiation signals are mid-infrared radiation signals to be removed.

[0112] The processing unit 12 is an independent processing unit, which is used to drive the cookware emissivity measurement unit 7, collect signals from the cookware radiation measurement unit 8 and the stove panel radiation measurement unit 9, perform calculations to obtain parameter information of the measured object such as the emissivity of the measured object, and output the temperature information of the measured object to the main controller in the induction cooker.

[0113] Among them, the effectiveness and principle of this solution:

[0114] 1. In an infrared temperature measurement system, the material of the object being measured and the color of the measured point will affect the infrared emissivity and reflectivity. Therefore, in this embodiment, the infrared temperature measurement system determines the temperature of the object being measured by measuring the infrared radiation intensity of the object being measured.

[0115] 2. When the object being measured (cookware) is in contact with the stove panel (microcrystalline panel), the surface radiation of the stove panel will be reflected by the surface of the object being measured and enter the infrared temperature measurement system, causing radiation noise and affecting the temperature measurement accuracy.

[0116] 3. Obtain the infrared emissivity and reflectivity of the object under test by using an infrared (wavelength 940nm) pair of tubes (one infrared emitting tube and one infrared receiving tube).

[0117] 4. Measure the infrared radiation intensity of the bottom surface of the stove panel using the third spectral band infrared sensor to obtain the infrared radiation intensity of the stove panel surface.

[0118] 5. Through the infrared radiation intensity of the contact surface between the stove panel and the measured object and the reflectivity of the measured object surface, infrared radiation compensation is called to improve the accuracy of infrared temperature measurement.

[0119] 6. Perform infrared radiation compensation based on the emissivity of the object to obtain the measured temperature result of the object.

[0120] The flow chart of the infrared temperature measurement system of the present invention for measuring the temperature of the object to be measured is as follows: Figure 4 As shown, the specific steps include:

[0121] S1, obtain the corresponding relationship between the short infrared signal reflection intensity stored in the processing unit 12 and the emissivity of the object under test = f1(E6); obtain the stored corresponding relationship E2=f2(E1) between the long infrared signal emitted by the bottom 11 of the stove panel and the medium infrared signal emitted by the bottom 11 of the stove panel; obtain the corresponding relationship E3=f3(E1) between the long infrared signal emitted by the bottom 11 of the stove panel and the medium infrared signal emitted by the surface 10 of the stove panel; obtain the corresponding relationship T=f4(E5) between the medium infrared signal intensity of the black body object under test through the stove panel and the temperature of the black body object under test.

[0122] S2, the processing unit 12 drives the infrared pair tube of the cookware emissivity measuring unit 7 to obtain the short infrared signal reflection intensity E6 of the measured object, and obtains the emissivity and reflectivity of the measured object through the corresponding relationship f1.

[0123] S3, the processing unit 12 collects the long infrared radiation signal emitted by the bottom 11 of the stove panel by the panel radiation measurement unit 9, and obtains the mid-infrared radiation intensity E2 emitted by the bottom 11 of the stove panel and the mid-infrared radiation intensity E3 of the surface of the stove panel through the corresponding relationship f2 and f3.

[0124] S4, the processing unit 12 collects the mid-infrared radiation signal E4 measured by the cookware radiation measuring unit 8, and obtains the equivalent blackbody mid-infrared radiation intensity E5 of the measured object by deducting the direct radiation from the bottom of the stove panel, the reflected radiation from the surface of the stove panel through the surface of the measured object, and the influence of the emissivity, where ε represents the emissivity of the stove panel and ρ represents the reflectivity of the stove panel.

[0125] S5, obtaining the equivalent blackbody infrared radiation intensity E5 of the object under test, obtaining the temperature of the object under test through the corresponding relationship f4, and outputting the temperature information of the object under test to the main controller in the electromagnetic cooker.

[0126] like Figure 6 As shown, the technical solution of the second aspect of the present application provides a temperature measuring device 600 for a heating furnace, which is used as follows Figure 2 and Figure 3 The heating stove shown. The heating stove includes a bottom shell 13 and a panel 14, a pot radiation measuring unit 8 and a panel radiation measuring unit 9. The panel 14 is mounted on the bottom shell 13 and forms a receiving cavity 15 with the bottom shell 13. The panel 14 is used to carry the pot. The pot radiation measuring unit 8 is arranged in the receiving cavity 15 and is used to receive a first infrared ray in a first wavelength range and generate a first infrared signal. The panel radiation measuring unit 9 is arranged in the receiving cavity 15 and is used to receive a second infrared ray in a second wavelength range and generate a second infrared signal. The second wavelength range is larger than the first wavelength range. The structure of the temperature measuring device 600 of the heating stove is as shown in FIG. Figure 6 The temperature measuring device 600 includes: an acquisition unit 610 for acquiring a second infrared signal; a first determination unit 620 for determining a third infrared signal reflected by the inner surface of the panel based on the second infrared signal, wherein the wavelength of the third infrared signal is within the first wavelength range; a second determination unit 630 for determining a fourth infrared signal generated by the outer surface of the panel based on the second infrared signal, wherein the wavelength of the fourth infrared signal is within the first wavelength range; a third determination unit 640 for determining the emissivity and reflectivity of the cookware; a fourth determination unit 650 for determining an equivalent infrared signal generated by the cookware based on the emissivity, reflectivity, the fourth infrared signal, the third infrared signal, and the first infrared signal; and a calculation unit 660 for calculating the temperature of the cookware based on the equivalent infrared signal.

[0127] The present application provides a temperature measurement device 600 for a heating stove, which is used for a heating stove. The heating stove includes a bottom shell, a panel, a pot radiation measurement unit, and a panel radiation measurement unit. The panel is used to support the pot. The panel and bottom shell form the outer shell of the heating stove. This outer shell houses components such as the pot radiation measurement unit, the panel radiation measurement unit, the heating coil, and a control device. The pot radiation measurement unit primarily detects infrared radiation from the pot, but the detected infrared radiation may include some infrared radiation from the panel. The panel radiation measurement unit detects second infrared radiation from the inner surface of the panel. Since the wavelength of the second infrared radiation falls within the second wavelength range, the infrared radiation detected by the panel radiation measurement unit originates from the panel itself. This is because the wavelength of the infrared radiation generated by the pot radiation measurement unit is generally smaller than the second wavelength range. Since infrared radiation of different wavelengths generated by the same panel exhibits certain patterns, after detecting the second infrared signal from the panel, the signals corresponding to the third infrared radiation within the first wavelength range generated on the inner surface of the panel and the fourth infrared radiation generated on the outer surface of the panel can be determined based on these patterns. Then, the third and fourth infrared signals are removed from the first infrared signal to obtain the infrared signal radiated by the cookware. Finally, based on the obtained infrared signal radiated by the cookware and the emissivity of the cookware, the equivalent infrared signal E5 of the cookware is derived. The cookware temperature can then be determined based on the equivalent infrared signal E5. This method not only considers the influence of infrared radiation generated by the inner surface of the panel on the temperature measurement, but also the influence of infrared radiation reflected by the cookware from the outer surface of the panel on the cookware temperature measurement. In other words, when measuring the cookware temperature, the influence of infrared radiation from the inner and outer surfaces of the panel on the cookware is eliminated. As a result, the detected cookware temperature is more accurate and has a smaller error, thereby improving the accuracy of the product's temperature control.

[0128] When using infrared for non-contact temperature measurement, infrared radiation from the panel's outer surface also has a certain impact on the pot's temperature measurement. Specifically, the pot's infrared rays experience signal attenuation after passing through the panel. When the pot's temperature is high, the infrared signal from the pot received by the pot's radiation measurement unit is relatively strong, and the infrared radiation from the panel's outer surface has a relatively small impact on the pot's temperature measurement, resulting in more accurate pot temperature measurement. However, when the pot's temperature is below 120°C, the infrared signal intensity generated by the pot is low, and this infrared signal attenuates again after passing through the panel, making the infrared signal received by the pot's radiation measurement unit very weak. At this point, the infrared radiation from the panel's outer surface has a significant impact on the pot's temperature measurement. However, in related solutions for non-contact infrared temperature measurement, the impact of infrared radiation from the panel's outer surface on pot temperature measurement is not considered. This results in inaccurate pot temperature measurement. In particular, when the pot is operating in the low-temperature range, the temperature measurement error is very large, making infrared temperature measurement essentially unsuitable for low-temperature temperature measurement. However, in the present application, the influence of infrared radiation from the outer surface of the panel on the temperature measurement is taken into account during temperature measurement. Thus, the accuracy of temperature measurement will be improved regardless of whether the cookware is operating in a high temperature range or a low temperature range, thereby improving the accuracy of temperature measurement of the cookware as a whole.

[0129] Furthermore, considering that cookware of different colors and materials has different emissivity and reflectivity, the equivalent infrared signal of the cookware can be calculated by combining the detected infrared signal with the emissivity and reflectivity of the cookware. This can reduce the temperature measurement differences caused by the different emissivity and reflectivity of different cookware, making the detected temperature more accurate.

[0130] Different heating objects have different temperatures and generate different wavelengths of infrared light. When a cooker is operating, its temperature is generally higher, so the wavelength of the infrared light it generates is generally shorter. However, the temperature of a panel, etc., is lower, so the wavelength of the infrared light it generates is generally longer. Therefore, based on this principle, the present application provides two infrared sensors capable of receiving infrared light of different wavelengths. This allows the equivalent infrared signal of the cooker to be obtained, thereby accurately determining the cooker's temperature.

[0131] In a possible design, the temperature measuring device of the heating furnace can also implement the steps of the temperature measuring method of the heating furnace in any of the above embodiments.

[0132] In a possible design, the panel is a light-transmitting panel, such as a black crystal glass panel. The light transmittance of the panel can be set to be fully transparent or partially transparent as needed.

[0133] In one possible design, the panel is provided with a through-hole, and a light-transmitting member is installed in the through-hole. This arrangement, by locally providing the light-transmitting member on the panel, can improve the panel's attenuation of infrared radiation, thereby increasing the intensity of the infrared signal detected by the cookware radiation measurement unit and the panel radiation measurement unit, thereby improving temperature measurement accuracy.

[0134] In a possible design, the heating stove further includes: a pot detection unit, which can cooperate with the pot to generate detection parameters.

[0135] Existing heating stoves with infrared non-contact temperature measurement cannot determine whether a pot is present. Once the stove starts heating, it will continue heating regardless of whether a pot is on the panel. However, heating without a pot on the panel not only wastes energy but is also dangerous. A pot detection unit can detect the presence of a pot. This allows the stove to heat only when a pot is detected. If no pot is on the panel, the stove will not heat, or continue heating based on whether the user is away. This not only improves energy efficiency but also reduces safety hazards caused by the pot not being heated.

[0136] In one possible design, the infrared emitting tube is further configured to emit a seventh infrared ray, and the infrared receiving tube is further configured to receive an eighth infrared ray, which is the result of reflection of the seventh infrared ray. The temperature measurement method further includes determining the color of the cookware and / or the presence of the cookware based on the eighth infrared ray. This configuration allows the heating stove to detect the presence of a cookware. This is because the infrared light reflected by the cookware produces different signal intensities when the cookware is present and when the cookware is absent. Based on this signal intensity, the presence of the cookware on the panel can be determined. Alternatively, the infrared pair sensor can detect the color of the cookware. This is because different cookware colors reflect infrared light differently. Therefore, the infrared light reflected by the fifth infrared ray produces different signal intensities when the cookware is different colors. Based on this signal intensity, the cookware color can be determined. Given that different colors of cookware generate different infrared rays when heated, once the cookware color is determined, the cookware temperature can be corrected based on the color of the cookware.

[0137] In one possible design, the heating stove also includes a heating device, such as a heating coil. This heating device is located within the accommodating cavity and is used to heat the cookware. The heating device can be an electromagnetic heating coil. The specific principle is that the heating coil generates an alternating electromagnetic field. Electromagnetic induction generates eddy currents within the cookware within this alternating electromagnetic field, generating active heating. This achieves electromagnetic heating of the cookware.

[0138] In one possible design, the heating oven further includes a light guide channel, one end of which is sealed to the panel. The cookware radiation measurement unit and the panel radiation measurement unit are located within the light guide channel. This reduces the impact of infrared radiation from the panel and other sources on the detection results of the cookware radiation measurement unit and the panel radiation measurement unit.

[0139] In a possible design, the panel is generally a light-transmitting panel, such as a glass panel.

[0140] Among them, heating stoves include induction cookers, electric ceramic cookers, etc.

[0141] Thirdly, as Figure 7 As shown, an embodiment of the present application proposes an electronic device 700, including: a memory 710, the memory 710 stores a program or instruction, and a processor 720. When the processor 720 executes the program or instruction, it implements the steps of the temperature measurement method of the heating furnace provided by any one of the solutions of the first aspect.

[0142] The electronic device according to the present application can implement the steps of the method for measuring the temperature of a heating furnace provided by any solution of the first aspect. Therefore, the electronic device has all the beneficial effects of the method for measuring the temperature of a heating furnace provided by any solution of the first aspect.

[0143] The electronic device in the embodiments of the present application may be a device, or a component, integrated circuit, or chip in a product.

[0144] In a fourth aspect, an embodiment of the present application proposes a readable storage medium on which a program or instruction is stored. When the program or instruction is executed, the steps of the temperature measurement method of the heating furnace provided by any solution of the first aspect are implemented.

[0145] Since the readable storage medium can implement the steps of the temperature measurement method for a heating furnace provided by any solution of the first aspect, the readable storage medium has all the beneficial effects of the temperature measurement method for a heating furnace provided by any solution of the first aspect.

[0146] The processor is the processor in the electronic device in the above embodiment. The readable storage medium includes a computer-readable storage medium, such as a computer read-only memory (ROM), a random access memory (RAM), a magnetic disk, or an optical disk.

[0147] In a fifth aspect, an embodiment of the present application proposes a heating furnace, comprising: the temperature measuring device of the heating furnace provided in the second aspect, and / or the electronic device provided in any one of the schemes of the third aspect; and / or the readable storage medium provided in any one of the schemes of the fourth aspect.

[0148] Since the heating furnace of the embodiment of the present application includes the temperature measuring device, electronic device, and readable storage medium of the heating furnace of any of the above technical solutions, it also has all the beneficial effects of the temperature measuring device, electronic device, or readable storage medium of the heating furnace.

[0149] An embodiment of the present application further provides a chip, which includes a processor and a communication interface, the communication interface and the processor are coupled, and the processor is used to run programs or instructions to implement the various processes of the above-mentioned abnormality detection method embodiment, and can achieve the same technical effect. To avoid repetition, it will not be repeated here.

[0150] It should be understood that the chip mentioned in the embodiments of the present application can also be called a system-level chip, a system chip, a chip system or a system-on-chip chip, etc.

[0151] Throughout this specification, reference to terms such as "one embodiment," "some embodiments," "illustrative embodiments," "examples," "specific examples," or "some examples" means that the specific features, structures, materials, or characteristics described in conjunction with the embodiment or example are included in at least one embodiment or example of the present application. In this specification, the illustrative expressions of the above terms do not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples.

[0152] Although the embodiments of the present application have been shown and described, those skilled in the art will appreciate that various changes, modifications, substitutions, and variations may be made to the embodiments without departing from the principles and intent of the present application, and that the scope of the present application is defined by the claims and their equivalents.

Claims

1. A method for measuring the temperature of a heating furnace, characterized in that: The heating stove includes a bottom shell, a panel, a pot radiation measuring unit, and a panel radiation measuring unit. The panel is mounted on the bottom shell and forms a receiving cavity with the bottom shell. The panel is used to hold the pot. The pot radiation measuring unit is disposed in the receiving cavity and is used to receive first infrared rays in a first wavelength range and generate a first infrared signal. The panel radiation measuring unit is disposed in the receiving cavity and is used to receive second infrared rays in a second wavelength range and generate a second infrared signal. The second wavelength range is greater than the first wavelength range. The temperature measurement method of the heating stove includes: acquiring the second infrared signal; determining a third infrared signal reflected by the inner surface of the panel according to the second infrared signal, wherein the wavelength of the third infrared signal is within the first wavelength range; determining a fourth infrared signal generated by the outer surface of the panel according to the second infrared signal, wherein the wavelength of the fourth infrared signal is within the first wavelength range; determining the emissivity and reflectivity of the cookware; determining an equivalent infrared signal generated by the cookware according to the emissivity, the reflectivity, the fourth infrared signal, the third infrared signal, and the first infrared signal; The temperature of the pot is calculated according to the equivalent infrared signal.

2. The temperature measurement method of a heating furnace according to claim 1, characterized in that: The heating stove includes an infrared emitting tube and an infrared receiving tube, the infrared emitting tube is used to emit fifth infrared rays in a third wavelength range, and the infrared receiving tube is used to receive sixth infrared rays after the fifth infrared rays are reflected by the cookware and generate a sixth infrared signal. The step of determining the emissivity and reflectivity of the cookware includes: controlling the infrared emitting tube to emit the fifth infrared ray; determining the emissivity of the cookware according to the received sixth infrared signal and the fifth infrared ray; The reflectivity is calculated according to the relationship between the emissivity, the reflectivity and the reflectivity.

3. The temperature measurement method of a heating furnace according to claim 2, characterized in that: The emissivity and the reflectivity satisfy the following relationship: ρ=1-ε; and / or The third wavelength range is 900 nanometers to 1000 nanometers; Wherein, ε represents the emissivity, and ρ represents the reflectivity.

4. The temperature measurement method of a heating furnace according to claim 1, characterized in that: The step of determining a third infrared signal reflected by the inner surface of the panel according to the second infrared signal comprises: obtaining a first relationship between the second infrared signal and the third infrared signal; The third infrared signal is determined according to the second infrared signal and the first relationship expression.

5. The temperature measurement method of a heating furnace according to claim 1, characterized in that: The step of determining a fourth infrared signal generated by the outer surface of the panel according to the second infrared signal comprises: obtaining a second relationship between the second infrared signal and the fourth infrared signal; The fourth infrared signal is determined according to the second infrared signal and the second relationship expression.

6. The temperature measurement method of a heating furnace according to claim 1, characterized in that: The equivalent infrared signal E5, the third infrared signal E2, the fourth infrared signal E3, the first infrared signal E4, the emissivity ε and the reflectivity ρ satisfy the following relationship: E5=(E4-E2-ρ×E3) / ε.

7. The temperature measurement method of a heating furnace according to any one of claims 1 to 6, characterized in that: The first wavelength range is 3 μm-4.5 μm; and / or The second wavelength range is 5 μm-15 μm.

8. A temperature measuring device for a heating furnace, characterized in that: The heating stove includes a bottom shell, a panel, a pot radiation measuring unit, and a panel radiation measuring unit. The panel is mounted on the bottom shell and forms a receiving cavity with the bottom shell. The panel is used to hold the pot. The pot radiation measuring unit is disposed in the receiving cavity and is used to receive first infrared rays in a first wavelength range and generate a first infrared signal. The panel radiation measuring unit is disposed in the receiving cavity and is used to receive second infrared rays in a second wavelength range and generate a second infrared signal. The second wavelength range is greater than the first wavelength range. The temperature measuring device of the heating stove includes: an acquiring unit, configured to acquire the second infrared signal; a first determining unit, configured to determine a third infrared signal reflected by the inner surface of the panel based on the second infrared signal, wherein the wavelength of the third infrared signal is within the first wavelength range; a second determining unit, configured to determine a fourth infrared signal generated by the outer surface of the panel according to the second infrared signal, wherein the wavelength of the fourth infrared signal is within the first wavelength range; a third determining unit, configured to determine the emissivity and reflectivity of the cookware; a fourth determining unit, configured to determine an equivalent infrared signal generated by the cookware according to the emissivity, the reflectivity, the fourth infrared signal, the third infrared signal, and the first infrared signal; A calculation unit is used to calculate the temperature of the cookware according to the equivalent infrared signal.

9. An electronic device, characterized in that: include: a memory storing programs or instructions; A processor, wherein when executing the program or the instruction, the processor implements the steps of the temperature measurement method of the heating furnace according to any one of claims 1 to 7.

10. A readable storage medium, characterized in that: A program or instruction is stored thereon, and when the program or instruction is executed, the steps of the temperature measurement method of the heating furnace according to any one of claims 1 to 7 are implemented.

11. A heating furnace, characterized in that: include: The temperature measuring device for a heating furnace as claimed in claim 8; and / or The electronic device according to claim 9; and / or The readable storage medium according to claim 10.

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