Probe unit and contact probe

Abstract

A probe unit according to the present invention is provided with a plurality of probe groups each comprising two contact probes, and a probe holder for holding the contact probes, the probe holder having a plurality of holder holes for holding the plurality of contact probes, the contact probes each having: a tip portion, the tip end of which is in contact with one electrode of the object to be contacted, and a tip end portion, the tip end portion of which is in contact with the other electrode of the object to be contacted, and the tip end portion of which is in contact with the other electrode of the object to be contacted; and a flange portion extending from the base end side of the tip portion and having a maximum length greater than the maximum length of the tip portion in a direction orthogonal to the longitudinal axis of the contact probe. A part of the side surface of the flange part is provided with a plane part having a plane shape, and the seat hole has a stepped shape in which the flange part is engaged, and has a wall surface in low contact with the plane part. According to the probe unit and the contact type probe, rotation relative to the probe base can be restrained, and the strength of the contact type probe can be ensured.

Description

Technical Field

[0001] The present invention relates to a probe unit and a contact probe used for conducting state inspection or operation characteristic inspection of an inspection object such as a semiconductor integrated circuit or a liquid crystal panel. Background Art

[0002] Conventionally, when conducting a conduction state inspection or operating characteristic inspection on an inspection object such as a semiconductor integrated circuit or liquid crystal display device, a conductive contact probe is used to electrically connect the inspection object to a signal processing device having a circuit substrate for outputting inspection signals. One method for conducting a conduction state inspection or operating characteristic inspection is the four-terminal measurement method. As a probe unit utilizing this four-terminal measurement method, a technique has been disclosed in which a group of contact probes (probe group) held in a probe holder is brought into contact with the inspection object at the tip thereof to measure electrical characteristics (for example, see Patent Document 1).

[0003] Patent Document 1: Japanese Patent Application Laid-Open No. 2021-105550 Summary of the Invention

[0004] However, the technology disclosed in Patent Document 1 employs a flat tip portion that abuts the probe base to prevent the contact probe from rotating relative to the probe base. Consequently, the tip portion is smaller than the rest of the probe, leading to a decrease in durability due to repeated inspections.

[0005] The present invention has been made in view of the above-mentioned problems, and an object of the present invention is to provide a probe unit and a contact probe that can suppress rotation relative to a probe base while ensuring the strength of the contact probe.

[0006] In order to solve the above problems and achieve the above objectives, the probe unit of the present invention has a plurality of probe groups consisting of two contact probes that are respectively in contact with an electrode of a contact object on one end side in the longitudinal direction, and a probe seat for holding the contact probes, and each contact probe is respectively in contact with a different electrode of a substrate on the other end side. A plurality of seat holes for holding the plurality of contact probes are formed on the probe seat, and the contact probes have: a front end portion that contacts an electrode of the contact object with its front end; and a flange portion that extends from the base end side of the front end portion, and has a maximum length in a direction perpendicular to the longitudinal axis of the contact probe that is greater than the maximum length of the front end portion, and a planar portion is provided on a portion of the side surface of the flange portion, and the seat hole is in a stepped shape for the flange portion to be clamped, and has a wall surface that abuts the planar portion.

[0007] Furthermore, the probe unit of the present invention is the one described above, wherein the flange portion is provided with two planar portions provided on opposite sides to each other with respect to the longitudinal axis.

[0008] Furthermore, the probe unit of the present invention is characterized in that, in the above invention, one flat surface portion is provided on the flange portion.

[0009] The probe unit of the present invention is characterized in that, in the above invention, a second flat portion is provided on the flange portion at a position different from the flat portion, and the second flat portion faces another contact probe when the contact probe is installed on the probe holder.

[0010] In addition, the contact probe of the present invention is that in the above invention, the contact probe contacts one electrode of the contact object at one end side in the longitudinal direction, and the contact probe has: a front end portion, which contacts one electrode of the contact object with its front end; and a flange portion, which extends from the base end side of the front end portion and has a maximum length in a direction perpendicular to the longitudinal axis of the contact probe that is greater than the maximum length of the front end portion, and a flat surface portion is provided on a portion of the side surface of the flange portion.

[0011] According to the present invention, it is possible to achieve an effect of suppressing rotation relative to the probe base while ensuring the strength of the contact probe. BRIEF DESCRIPTION OF THE DRAWINGS

[0012] Figure 1 It is a perspective view showing the structure of a probe unit according to one embodiment of the present invention.

[0013] Figure 2 It is a partial cross-sectional view showing the structure of the main part of the probe unit according to one embodiment of the present invention.

[0014] Figure 3 It is a partial cross-sectional view showing the structure of the main part of the probe unit according to one embodiment of the present invention.

[0015] Figure 4 It means from Figure 3 FIG. 1 is a diagram showing the structure of the first plunger and the probe base as viewed in the direction of arrow A. FIG.

[0016] Figure 5 It is a diagram for explaining the structure of the first plunger according to Modification 1 of the present invention.

[0017] Figure 6 It is a diagram for explaining the structure of the first plunger according to Modification 2 of the present invention.

[0018] Figure 7 This is a perspective view (part 1) for explaining the structure of a probe according to a third modification of the present invention.

[0019] Figure 8 This is a perspective view (part 2) for explaining the structure of a probe according to Modification 3 of the present invention.

[0020] Explanation of symbols:

[0021] 1 probe unit

[0022] 2. 2A probe group

[0023] 2a, 2b contact probe (probe)

[0024] 3 Probe holder

[0025] 4 Base parts

[0026] 21, 21A, 21B, 21C first plunger

[0027] 21a, 21e front end

[0028] 21b, 21f flange parts

[0029] 21c plane portion (first plane portion)

[0030] 21d, 21i second plane portion

[0031] 21g flat part

[0032] 21h First flat surface

[0033] 22 Second plunger

[0034] 23 tube

[0035] 31 First Part

[0036] 32 Second part

[0037] 100 semiconductor packages

[0038] 101 pin

[0039] 200 circuit substrate. DETAILED DESCRIPTION

[0040] The following describes in detail embodiments for implementing the present invention with reference to the accompanying drawings. The present invention is not limited to the following embodiments. Furthermore, the figures referenced in the following description merely schematically illustrate shapes, sizes, and positional relationships to facilitate understanding of the present invention. In other words, the present invention is not limited solely to the shapes, sizes, and positional relationships illustrated in the figures.

[0041] Implementation Method

[0042] Figure 1 It is a perspective view showing the structure of a probe unit according to one embodiment of the present invention. Figure 1 The probe unit 1 shown is a device used when inspecting the electrical characteristics of a semiconductor integrated circuit as an inspection object, and is used to electrically connect the connection electrodes of a semiconductor package 100 enclosing the semiconductor integrated circuit to a circuit substrate 200 for outputting inspection signals to the semiconductor integrated circuit. Figure 1 The pin 101 is shown as being connected to a semiconductor integrated circuit.

[0043] The probe unit 1 has a plurality of probe groups 2 consisting of two contact probes 2a (hereinafter referred to as "probes 2a"), wherein the two probes 2a respectively contact a connection electrode (pin 101) of a semiconductor package 100 as a contacted body with one end side in the length direction, and contact different electrodes of a circuit substrate 200 with the other end side; and the probe unit 1 has: a probe seat 3, which is used to accommodate and hold the plurality of probe groups 2 according to a prescribed pattern; and a base component 4, which is arranged around the probe seat 3, and is used to suppress the position of the semiconductor package 100 that contacts the plurality of probe groups 2 from being offset during inspection.

[0044] Figure 2 It is a partial cross-sectional view showing the structure of the main part of the probe unit according to one embodiment of the present invention. Figure 3 It is a partial cross-sectional view showing the structure of the main part of the probe unit according to one embodiment of the present invention. Figure 4 It means from Figure 3 FIG. 1 is a diagram showing the structure of the first plunger and the probe base as viewed in the direction of arrow A. FIG. Figure 2 This is a partial cross-sectional view showing the detailed structure of the probe group 2 accommodated in the probe holder 3 , and is a cross-sectional view taken along a plane parallel to the arrangement direction of the probe group 2 . Figure 3 This is a partial cross-sectional view showing the detailed structure of the probe group 2 accommodated in the probe holder 3 , and is a cross-sectional view taken along a plane perpendicular to the arrangement direction of the probe group 2 . Figure 2 、 3 The probe group 2 shown is composed of two probes 2a formed of a conductive material and arranged side by side at the same height. In addition, each probe group 2 is arranged according to the arrangement of the connection electrodes (leads 101) of the semiconductor package 100.

[0045] Probe 2a comprises a first plunger 21 for contacting pins 101 of semiconductor package 100 during semiconductor integrated circuit inspection; a second plunger 22 for contacting electrodes on circuit board 200, which includes an inspection circuit; and a barrel 23, one end of which receives first plunger 21 and the other end of which second plunger 22 is retractably connected. The first and second plungers 21, 22, and barrel 23 that comprise probe 2a share a common axis (here, axis N). Axis N corresponds to the longitudinal axis of probe 2a.

[0046] The first plunger 21 has a cylindrical tip 21a and a flange 21b, which are arranged approximately coaxially. The tip 21a has a flat surface inclined relative to the axis. The flange 21b extends from the base of the tip 21a and has at least a portion thereof extending perpendicularly to the axis. The junction between the tip 21a and the flange 21b forms a stepped shape. The first plunger 21 is attached to the tube 23 by means of fitting or welding.

[0047] In addition, “the same axis” or “on the same axis” includes manufacturing errors and the like.

[0048] The front end portion 21 a has an inclined surface formed by being cut obliquely with respect to the axis N direction, and the front end of the front end portion 21 a contacts the lead 101 of the semiconductor package 100 .

[0049] The front end portion 21a is cylindrical except for the front end portion. In other words, the front end portion 21a is cylindrical except for the portion in contact with the pin 101, thereby ensuring the volume of the front end portion 21a.

[0050] The distal end portion 21 a may have any shape as long as it can come into contact with the pin 101 , and may have, for example, a crown shape or a cylindrical shape.

[0051] The flange portion 21b has two flat portions 21c formed by cutting a portion of the side surface into a flat shape. The two flat portions 21c are located on opposite sides of the axis of the flange portion 21b. The axis of the flange portion 21b extends parallel to the axis of the first plunger 21 and passes through the center of gravity. Here, it coincides with the axis of the first plunger 21.

[0052] In this embodiment, the flat surface portion 21 c is provided on the side of the inclined surface of the front end portion 21 a.

[0053] Furthermore, the planar portion 21c may be formed into a concave-convex shape to a degree that allows it to contact the wall surface of the probe base 3 at multiple locations in the circumferential direction. That is, in this embodiment, the "flat surface" of the planar portion 21c also includes a surface having a surface roughness that allows it to contact the wall surface of the probe base 3 at multiple locations.

[0054] The second plunger 22 is in the shape of a column with a tapered tip and is prevented from coming out of the tube 23 by contacting with a coil spring in the tube 23 or by providing a flange.

[0055] A coil spring is disposed within the barrel 23, which applies force to the second plunger 22. After the probe 2a contacts the semiconductor package 100, the second plunger 22 moves axially relative to the barrel 23, thereby mitigating the impact on the connection electrodes of the semiconductor package 100. The force exerted by the coil spring within the barrel 23 also applies a load to the semiconductor package 100 and the circuit board 200.

[0056] The probe base 3 is made of insulating materials such as resin, machinable ceramics, silicone, etc. Figure 2 The first component 31 on the upper surface and the second component 32 on the lower surface are stacked. The first component 31 and the second component 32 are formed with a seat hole consisting of a first hole portion 33 and a second hole portion 34 for accommodating multiple probes 2a. The position of the seat hole is determined by the wiring pattern of the semiconductor package 100. In this case, the probe group 2 is arranged such that the front ends of the tip portions 21a of the probes 2a are close to each other.

[0057] The first hole portion 33 and the second hole portion 34 are both stepped holes with different diameters along the through-hole direction. Specifically, the first hole portion 33 is composed of a large-diameter portion 33b and two small-diameter portions 33a. The two small-diameter portions 33a have openings on the upper end surface of the probe holder 3, through which the front end portions 21a of the probes 2a pass, respectively. The diameter of the large-diameter portion 33b is larger than the diameter of the small-diameter portion 33a, through which the two probes 2a pass. The diameter of the small-diameter portion 33a is slightly larger than the diameter of the front end portion 21a and smaller than the maximum length of the flange portion 21b. Furthermore, the large-diameter portion 33b is in the shape of an elongated hole capable of accommodating the two probes 2a, and its shortest length is equal to or slightly larger than the distance between the planar portions 21c of the flange portion 21b.

[0058] On the other hand, the second hole portion 34 is composed of a small-diameter portion 34a and a large-diameter portion 34b. The small-diameter portion 34a has an opening at the lower end surface of the probe holder 3, and the large-diameter portion 34b has a larger diameter than the small-diameter portion 34a. The diameter of the small-diameter portion 34a is slightly larger than the diameter of the second plunger 22. Furthermore, the diameter of the large-diameter portion 34b is slightly larger than the diameter of the tube 23. The second hole portion 34 is used to accommodate the probes 2a. Therefore, in the probe group 2, the probes 2a are respectively accommodated in the through-hole connecting the large-diameter portion 33b and the two second hole portions 34 in the first hole portion 33 having the large-diameter portion 33b and the two small-diameter portions 33a. The shapes of the first and second hole portions 33 and 34 are determined according to the structure of the probes 2a to be accommodated. Alternatively, the large-diameter portion 34b through which the grouped probes 2a are inserted can be formed as a common hole portion without a wall surface.

[0059] The flange portion 21b of the first plunger 21 has a function of preventing the probe 2a from being separated from the probe holder 3 by abutting against the boundary wall between the small diameter portion 33a and the large diameter portion 33b of the first hole 33 (see FIG. Figure 2 At this time, the flat surface portion 21c contacts the wall surface of the large diameter portion 33b (here, the flat surface portion of the long hole shape), or faces each other with a small gap therebetween (see Figure 4 Therefore, when a force is applied to the probe 2a to rotate about the axis N, the rotation about the axis N is suppressed because the flat portion 21c abuts against the wall surface of the large diameter portion 33b.

[0060] During semiconductor integrated circuit inspection, the inspection signal supplied from circuit substrate 200 to the semiconductor integrated circuit travels from the electrodes of circuit substrate 200 through probe 2a to lead 101 of semiconductor package 100. Specifically, in probe 2a, the inspection signal travels through second plunger 22, barrel 23, and first plunger 21 to lead 101 of semiconductor package 100. Furthermore, regarding the two electrodes on circuit substrate 200, for example, one electrode is used for measurement (Sense), and the other electrode is used for power supply (Force).

[0061] Furthermore, since the tip of the tip portion 21 a is tapered, even if an oxide film is formed on the surface of the lead 101 , the oxide film can be pierced and the tip of the tip portion 21 a can be brought into direct contact with the lead 101 .

[0062] According to the above embodiment, two planar flat portions 21c are formed on the flange portion 21b of the columnar first plunger 21, and the flat portions 21c abut the wall surface of the hole of the probe base 3 (here, the wall surface of the large-diameter portion 33b). Therefore, by ensuring the volume of the front end portion 21a and controlling the rotation of the probe 2a around the axis, it is possible to suppress the rotation relative to the probe base while ensuring the strength of the contact probe.

[0063] Furthermore, according to this embodiment, the small diameter portion 33a is in the shape of a circular hole and regulates the position of the tip portion 21a. This suppresses the distance variation between the tip portions 21a of the paired probes 2a, thereby improving the positioning performance of the probes 2a.

[0064] Modification 1

[0065] Next, refer to Figure 5 Modification 1 of this embodiment will be described. Figure 5 1 is a diagram for explaining the structure of the first plunger of the modification example 1 of the present invention. Figure 2 The same components as those described above are denoted by the same reference numerals. In the above embodiment, the flange portion 21b is described as having two flat surface portions 21c, but in this first modification, only one flat surface portion 21c is formed.

[0066] The first plunger 21A of the present modification 1 has a flat surface portion 21 c provided on the flange portion 21 b , and can control the rotation of the probe 2 a around the axis by causing the flat surface portion 21 c to abut against the wall surface of the hole of the probe holder 3 .

[0067] According to the above-mentioned modification example 1, as in the above-mentioned embodiment, a flat surface portion 21c is formed on the flange portion 21b of the columnar first plunger 21, and the flat surface portion 21c abuts against the wall surface of the hole of the probe holder 3. Therefore, by ensuring the volume of the front end portion 21a and controlling the rotation of the probe 2a around the axis, it is possible to suppress the rotation relative to the probe holder while ensuring the strength of the contact probe.

[0068] Modification 2

[0069] Next, refer to Figure 6 Modification 2 of this embodiment will be described. Figure 6 1 is a diagram for explaining the structure of the first plunger of the second modification of the present invention. Figure 2 The same components as those described above are denoted by the same reference numerals. In the second modification, the flange portion 21b is further provided with a second flat surface portion 21d.

[0070] In the first plunger 21B of this second variation, the flange portion 21b has, in addition to the planar portion 21c (in this variation, the first planar portion 21c), a second planar portion 21d positioned differently from the first planar portion 21c. The second planar portion 21d is circumferentially disposed between the planar portions 21c and has a planar shape. Furthermore, when the second planar portion 21d is mounted on the probe holder 3, it is positioned opposite the other probe 2a in the set.

[0071] When the probes 2a are placed on the probe holder 3, the second flat surfaces 21d of the probes 2a face each other. At this time, the probes 2a are restricted from rotating by the first flat surfaces 21c, so the second flat surfaces 21d can approach each other to a degree that they do not touch each other.

[0072] According to the above-mentioned variation example 2, similarly to the above-mentioned embodiment, two planar flat portions 21c are formed on the flange portion 21b of the columnar first plunger 21, and the flat portions 21c abut against the wall surface of the hole of the probe holder 3. Therefore, by ensuring the volume of the front end portion 21a and controlling the rotation of the probe 2a around the axis, it is possible to suppress the rotation relative to the probe holder while ensuring the strength of the contact probe.

[0073] Furthermore, according to Modification 2, the second flat surface portions 21 d of the probes 2 a are arranged to face each other, and therefore the interval between the probes 2 a can be shortened compared to the configuration of the embodiment.

[0074] Furthermore, in Modification 2, the structure of Modification 1 may be adopted, and a structure having only one first flat surface portion 21 c may be formed.

[0075] Modification 3

[0076] Next, refer to Figure 7 and Figure 8 Modification 3 of this embodiment will be described. Figure 7 and Figure 8 It is a perspective view for explaining the structure of a probe according to Modification 3 of the present invention. Figure 7 and Figure 8 The following are three-dimensional images of the probe when viewed from different directions. Figure 2 The same components as those in the above are marked with the same reference numerals. In the modification 3, a probe group 2A is provided instead of the probe group 2 of the embodiment. Figure 7 and Figure 8 Only a portion of the probe is shown in the figure.

[0077] The probe group 2A is composed of two probes 2b formed of a conductive material and arranged side by side at the same height. In addition, each probe group 2A is arranged according to the arrangement of the connection electrodes (leads 101) of the semiconductor package 100.

[0078] The probe 2b comprises: a first plunger 21C for contacting the pin 101 of the semiconductor package 100 when inspecting the semiconductor integrated circuit; a second plunger 22 for contacting the electrode of the circuit substrate 200 having the inspection circuit (see FIG. Figure 2and a tube 23, one end of which is mounted on the first plunger 21C and the other end of which is flexibly connected to the second plunger 22. The first plunger 21C and the second plunger 22 constituting the probe 2b, and the tube 23 have the same axis (here, axis N).

[0079] The first plunger 21C has a cylindrical tip 21e and a flange 21f, which are approximately coaxial. The tip 21e is formed with a flat surface inclined relative to the axis. The flange 21f extends from the base of the tip 21e and has at least a portion thereof extending perpendicularly to the axis. The connection between the tip 21e and the flange 21f in the first plunger 21C is stepped. Furthermore, the first plunger 21C is attached to the tube 23 by means of fitting or welding.

[0080] The front end portion 21 e has an inclined surface formed by cutting obliquely with respect to the axis N at its front end, and the front end portion 21 e contacts the lead 101 of the semiconductor package 100 at its front end.

[0081] The front end portion 21e has two flat surfaces 21g that are parallel to the axis N. The two flat surfaces 21g are provided on the sides of the inclined surface of the front end and on opposite sides of the axis N.

[0082] The flange portion 21f has two first planar portions 21h formed by cutting a portion of the side surface into a planar shape, and a second planar portion 21i located at a different position from the first planar portions 21h. The two first planar portions 21h are located on opposite sides of the axis of the flange portion 21b. The second planar portion 21i is circumferentially located between the first planar portions 21h.

[0083] In the third modification, the first flat surface portion 21h is provided on the side of the inclined surface of the distal end portion 21a.

[0084] Furthermore, similar to the flat surface portion 21 c , the first flat surface portion 21 h and the second flat surface portion 21 i may be formed in a concave-convex shape to such an extent that they can contact the wall surface of the probe holder 3 at multiple locations in the circumferential direction.

[0085] In the third modification, the one-side flat surface portion 21g and the one-side first flat surface portion 21h form a flat surface portion on the same plane, and the other-side flat surface portion 21g and the other-side first flat surface portion 21h form a flat surface portion on the same plane.

[0086] When the probes 2b are placed on the probe holder 3, the second flat surfaces 21i of the probes 2b face each other. At this time, the probes 2b are restricted from rotating by the flat surfaces 21g and the first flat surfaces 21h, so the second flat surfaces 21i can approach each other without contacting each other.

[0087] In this variant example 3, by providing a planar portion 21g that forms the same plane as the first planar portion 21h and ensuring the arrangement area in a direction orthogonal to the direction opposite to the planar portion 21g, it is possible to ensure the function of limiting the rotation of the probe by the first planar portion 21h of the flange portion 21f and to ensure the volume of the front end portion 21e.

[0088] According to the above-mentioned variation example 3, similarly to the above-mentioned embodiment, two planar first plane portions 21h are formed on the flange portion 21f of the columnar first plunger 21C, and the first plane portions 21h abut against the wall surface of the hole of the probe holder 3. Therefore, by ensuring the volume of the front end portion 21e and controlling the rotation of the probe 2b around the axis, it is possible to suppress the rotation relative to the probe holder while ensuring the strength of the contact probe.

[0089] Furthermore, according to Modification 3, the flat portion 21g connected to the first flat portion 21h is formed at the distal end 21e of each probe 2b, thereby expanding the range of the function of restricting the rotation of the probe 2b around the axis and more reliably restricting the rotation of the probe 2b around the axis.

[0090] Furthermore, according to Modification 3, the second flat surface portions 21i of the probes 2a are arranged to face each other, and therefore the interval between the probes 2b can be shortened compared to the configuration of the embodiment.

[0091] While the embodiments for implementing the present invention have been described above, the present invention is not limited to the aforementioned embodiments. The (first) and second planar portions are not limited to those shown in the aforementioned embodiments or variations. The range of the planar portion within the flange portion can be appropriately modified. Furthermore, the planar portion only needs to be formed outside the location where the flange portion connects to the front end. Specifically, the planar portion should be formed such that a stepped shape protrudes from the front end toward the flange portion.

[0092] Furthermore, the probe 2a used in the probe group 2 only needs to have a flange portion and is not limited to the aforementioned probe consisting of a plunger and a barrel. It can also be a probe consisting of a plunger with a front end portion and a coil spring, or a pogo pin. In addition, the connection electrode can be a hemispherical electrode in addition to a flat electrode such as the pin 101.

[0093] In summary, the probe unit and the contact probe of the present invention are advantageous in suppressing rotation relative to the probe base and ensuring the strength of the contact probe.

Claims

1. A probe unit comprising a plurality of contact probes each comprising two contact probes each contacting an electrode of a contact object at one end in a longitudinal direction thereof, and a probe holder for holding the contact probes, wherein each contact probe contacts a different electrode of a substrate at the other end thereof, wherein the probe unit is characterized in that: A plurality of seat holes for holding a plurality of the contact probes are formed on the probe seat. The contact probe has: a front end portion, the front end of which contacts one electrode of the contact object; and a flange portion extending from the base end side of the front end portion and having a maximum length in a direction perpendicular to the longitudinal axis of the contact probe greater than a maximum length of the front end portion, A flat surface portion is provided on a portion of the side surface of the flange portion. The seat hole has a stepped shape in which the flange portion is engaged, and has a wall surface that abuts against the flat surface portion.

2. The probe unit according to claim 1, characterized in that The flange portion is provided with two planar portions that are provided on opposite sides to each other with respect to the longitudinal axis.

3. The probe unit according to claim 1, wherein The flange portion is provided with a flat surface portion.

4. The probe unit according to any one of claims 1 to 3, characterized in that A second flat portion is provided at a position of the flange portion different from the flat portion. The second flat portion faces another contact probe when the contact probe is installed on the probe holder.

5. A contact probe, wherein each of one end portions in a longitudinal direction contacts one electrode of a contact object, wherein the contact probe has: a front end portion, the front end of which contacts one electrode of the contact object; and a flange portion extending from the base end side of the front end portion and having a maximum length in a direction perpendicular to the longitudinal axis of the contact probe greater than a maximum length of the front end portion, A planar portion is provided on a portion of a side surface of the flange portion.

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