Horizontal transmission wafer clamping and rotating cleaning device

Abstract

The invention relates to the technical field of wafer processing and cleaning, in particular to a horizontal transmission wafer clamping and rotating cleaning device which comprises an equipment box supported and fixed through a base. A megasonic bin, a first roller brush bin, a second roller brush bin and a drying bin are sequentially arranged in the equipment box in a separated mode, the driving wheel and the three driven wheels are arranged in a transmission gap of the conveying assembly in a square array mode, and a megasonic assembly and a drying assembly are arranged in the megasonic bin and the drying bin correspondingly. The first roller brush bin and the second roller brush bin are each internally provided with a roller brush assembly, a wafer can be conveyed in the sound bin, the first roller brush bin, the second roller brush bin and the drying bin in sequence under conveying of the conveying assembly, the two sliding frames move inwards at the same time to conduct centering clamping on the wafer, the two roller brush assemblies conduct double brushing on the surface of the wafer, and therefore the wafer can be conveniently cleaned. And the brushed wafers enter the drying bin to be dried, continuous machining is carried out along with continuous feeding of the wafers, and the cleaning efficiency is improved.

Description

Technical Field

[0001] The invention relates to the technical field of wafer processing and cleaning, in particular to a horizontal transmission wafer clamping and rotating cleaning device. Background Art

[0002] Wafers are products processed in the semiconductor field and are the substrate for manufacturing chips. The production process of wafers is complex and requires multiple etching processes. After multiple processing steps, process residues and dust particles adsorbed on them due to static electricity will be generated on the wafer surface. In order to prevent process residues and dust particles from affecting the production qualification rate of chips, the wafers need to be cleaned after each processing step.

[0003] At present, the cleaning of wafers during the processing process is mainly achieved by fixing the wafers in the cleaning equipment, spraying the cleaning agent onto the wafer surface and brushing it with a roller brush. For example, a patent with the announcement number CN113140485A discloses a wafer cleaning device, which fixes the wafer by the friction of the cleaning table, sprays the cleaning agent onto the wafer surface by a jet component, and cooperates with the brush head in the cleaning component to fit the wafer surface and rotate, and moves the swing arm on the wafer surface when the brush head rotates to complete the wafer cleaning. However, the existing wafer cleaning device can only clean two wafers at a time when in use, and cannot continuously clean large quantities of wafers, resulting in low cleaning efficiency. In addition, only one side of the wafer can be cleaned each time, and the cleaning is not comprehensive. Therefore, a horizontal transmission wafer clamping and rotating cleaning device is proposed to address the above problems. Summary of the Invention

[0004] In order to make up for the shortcomings of the existing technology, the present invention proposes a horizontal transmission wafer clamping and rotating cleaning device to address the problems that the existing technology is not suitable for continuous cleaning operations, has low cleaning efficiency, can only clean one side of the wafer each time, and is not comprehensive.

[0005] The technical solution adopted by the present invention to solve the technical problem is as follows: the horizontal transmission wafer clamping and rotating cleaning device of the present invention includes an equipment box supported and fixed by a base; the equipment box is sequentially provided with a megasonic chamber, a first roller brush chamber, a second roller brush chamber, and a drying chamber; a transmission assembly is provided in the equipment box, and a clamping and rotating assembly is provided in each of the multiple chambers in the equipment box; Two sliding frames are slidably provided in the clamping rotating assembly, one of the sliding frames is rotatably mounted with two support shafts, the other sliding frame is rotatably mounted with a driving shaft and an encoder fixed thereon, the encoder is rotatably mounted with a speed measuring shaft, a driving wheel is fixedly connected to the driving shaft, and driven wheels are fixedly connected to the top ends of the support shaft and the speed measuring shaft, and the driving wheel and three driven wheels are arranged in a square array within the transmission gap of the transmission assembly; The megaacoustic chamber and the drying chamber are respectively provided with a megaacoustic component and a drying component, and the No. 1 roller brush chamber and the No. 2 roller brush chamber are both provided with a roller brush component; The driving ends of the plurality of clamping and rotating assemblies are all arranged at the bottom of the equipment box, the driving assembly is installed on the base, and the driving end of the driving assembly is simultaneously transmission-connected with the driving ends of the plurality of clamping and rotating assemblies.

[0006] Preferably, the transmission component includes rollers that are evenly transmitted and arranged in multiple bins, and the adjacent rollers are connected by transmission rubber rings. Motor No. 1 is fixed on the outer wall of the equipment box, and the central axis of the roller located on the side is arranged outside the equipment box and is connected to the output end of motor No. 1 through a belt. Anti-slip rings are provided on the rollers for anti-slip, and a material transfer trough for communication is provided on the bin partition of the equipment box. A feed port is provided on the side wall of the megaacoustic bin, and a discharge port is provided on the side wall of the drying bin. Closing components for sealing are provided at the openings of the feed port and the discharge port, and mechanical arms for wafer clamping are provided at the openings of the feed port and the discharge port. A liquid recovery component is installed on the base, which is respectively connected to the megaacoustic bin, the No. 1 roller brush bin, the No. 2 roller brush bin and the drying bin.

[0007] Preferably, the clamping and rotating assembly includes three No. 1 through slots that are opened through the side of the equipment box, wherein two of the No. 1 through slots are respectively provided with limit rods, and the two sliding frames are slidably set on the two limit rods, and are both perpendicular to the limit rods. Two baffles are commonly fixed on the two limit rods, and the two baffles are respectively slidably fitted on the inner wall of the equipment box through limit bars, and the outer side surfaces of the two sliding frames are respectively fixed with L-shaped pull rods, and the two L-shaped pull rods are respectively slid through the side surfaces of the baffles, and the two L-shaped pull rods are respectively provided in another No. 1 through slot located on both sides of the equipment box.

[0008] Preferably, the clamping and rotating assembly also includes a No. 2 through slot opened on one side of the equipment box, wherein a spline sleeve is rotatably installed on one side of the baffle, and a spline shaft is slidably arranged in the spline sleeve, and a shaft sleeve is fixed to the side of one of the sliding frames through a bracket, a spline shaft is rotatably installed in the shaft sleeve, and the spline sleeve is slidably engaged on the spline shaft, and the end of the spline shaft is connected to the bottom end of the drive shaft through a gear meshing transmission, the end of the spline sleeve passes through the No. 2 through slot and is connected to a No. 2 motor for driving, and the No. 2 motor is fixed to the side of the baffle.

[0009] Preferably, a lifting frame is commonly fixed between the ends of the same side of the two limit rods, a No. 1 hydraulic rod is fixed under the lifting frame, and the No. 1 hydraulic rod is fixed to the outer wall of the equipment box, and a hollow shaft is sleeved on the vertical sections of the two L-shaped pull rods, and a No. 1 rack is fixed to the bottom end of the two hollow shafts, and the two No. 1 racks are slidably set at the bottom of the equipment box through a No. 1 guide bar, and a No. 1 gear with a common meshing transmission is provided between the two No. 1 racks, and the No. 1 gear is rotatably installed at the bottom of the equipment box, and the No. 1 gear is simultaneously connected to the driving end of the driving assembly.

[0010] The two gears are connected to each other through the two guide rails, and the two guide rails are connected with the two guide rails respectively.

[0011] Preferably, the closing component includes a lifting plate that is slidably attached to the side wall of the equipment box through a limit bar, a No. 3 hydraulic rod is fixed to the lifting plate, and the No. 3 hydraulic rod is fixed to the outer wall of the equipment box, the liquid medicine recovery component includes a storage tank fixed to the base, a filter bin connected to it is installed on the storage tank, a closing door is provided at the opening of the filter bin, a filter element is fixed on the side of the closing door, connecting pipes are fixed to the filter bin, and the top ends of multiple connecting pipes are respectively connected to the megaacoustic bin, the No. 1 roller brush bin, the No. 2 roller brush bin and the bottom of the drying bin.

[0012] Preferably, the driving assembly includes a guide seat fixed on the base, a No. 3 guide bar is slidably provided on the guide seat, a No. 4 rack is fixed to the No. 3 guide bar, and the No. 4 rack is simultaneously engaged and transmission-connected with multiple No. 1 gears, a No. 4 hydraulic rod is fixed to the side of the No. 4 rack, and the No. 4 hydraulic rod is fixed to the base, and nozzle plates are fixed to the side walls of the bin body in the equipment box, and bin covers are rotatably hinged at the top openings of the megaacoustic bin, No. 1 roller brush bin, No. 2 roller brush bin and drying bin.

[0013] Preferably, the megasonic component includes two megasonic generating modules fixed on the inner wall of the megasonic bin, and a liquid spray pipe is fixedly connected between the two megasonic generating modules. The drying component includes two nitrogen nozzles and two pure water nozzles fixedly connected to the inner wall of the drying bin, and the two megasonic generating modules, nitrogen nozzles and pure water nozzles are respectively located on the upper and lower sides of the transmission surface of multiple rollers in the bin body, and are located in the transmission holes of the multiple rollers.

[0014] The present invention is beneficial in that: 1. The present invention transports the wafer in sequence through the megasonic chamber, the No. 1 roller brush chamber, the No. 2 roller brush chamber and the drying chamber under the transportation of the conveying assembly, and uses two sliding frames to move inward at the same time to center and clamp the wafer, and after clamping, drives the drive shaft to drive the drive wheel to rotate, thereby realizing the cleaning of the wafer surface during the rotation process, and at the same time, the rotation of the wafer drives the rotation of the speed measuring shaft to realize the rotation speed measurement, which is adapted to different process cleaning requirements.

[0015] 2. The present invention uses two roller brush assemblies to double-brush the wafer surface to remove chemical residues or stains on the wafer surface. The wafers after brushing enter the drying chamber for drying. As the wafers are continuously fed in, continuous processing is carried out to improve cleaning efficiency.

[0016] 3. The present invention drives the lifting plate to rise and fall by extending and retracting the No. 3 hydraulic rod to close the equipment box, and the filter element recovers and filters the cleaning agent discharged from the corresponding warehouse body to save production costs. The nozzle plate is used to spray the cleaning agent into the warehouse body to flush the stains remaining in the warehouse body to ensure the cleanliness of the warehouse body. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the following briefly introduces the drawings required for use in the embodiments or the description of the prior art. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying any creative work.

[0018] Figure 1 Schematic diagram of the first three-dimensional structure in this embodiment; Figure 2 This is an enlarged schematic diagram of the main compartment structure of the equipment box in this embodiment; Figure 3 This is an enlarged cross-sectional view of the main structure of the transmission component in this embodiment; Figure 4 This is an enlarged schematic diagram of the installation structure of the roller brush assembly, megasonic assembly and drying assembly body in this embodiment; Figure 5This is an enlarged schematic diagram of the installation structure of the clamping and rotating assembly and the transmission assembly body in this embodiment; Figure 6 This is an enlarged cross-sectional view of the main structure of the clamping and rotating assembly in this embodiment; Figure 7 This is an enlarged cutaway schematic diagram of the main mounting structure of the drive assembly in this embodiment; Figure 8 This is an enlarged cutaway schematic diagram of the roller brush assembly main body mounting structure in this embodiment; Figure 9 This is an enlarged schematic diagram of the main installation structure of the liquid medicine recovery component in this embodiment; Figure 10 This is an enlarged cross-sectional view of the main structure of the closure assembly in this embodiment; Figure 11 This is an enlarged schematic diagram of area A in the cross-sectional view of the main structure of the clamping and rotating assembly in this embodiment; Figure 12 This is an enlarged schematic diagram of area B in the cross-sectional view of the drive assembly main body installation structure in this embodiment.

[0019] In the figure: 1. Equipment box; 101. Megasound chamber; 102. Roller brush chamber No. 1; 103. Roller brush chamber No. 2; 104. Drying chamber; 105. Feed inlet; 106. Discharge outlet; 107. Chamber cover; 108. Robotic arm; 109. Base; 1011. Printhead plate; 1012. Material transfer chute; 2. Transmission assembly; 21. Roller; 22. Transmission rubber ring; 23. Anti-slip ring; 24. Motor No. 1; 3. Clamping and rotating assembly; 31. No. 1 through-slot; 32. Limit rod; 33. Sliding frame; 34. Support shaft; 35. Driven pulley; 36. Drive shaft; 37. Drive wheel; 38. Baffle; 39. L-shaped pull rod; 310. Hollow shaft; 311. No. 1 guide bar; 312. No. 1 rack; 313. No. 1 gear; 314. Bushing; 315. Spline shaft; 316. Spline sleeve; 317. No. 2 motor; 318. Lifting frame; 319. No. 1 hydraulic rod; 320. No. 2 through-slot; 321. Speed ​​measuring shaft; 322. Encoder; 4. Roller brush assembly; 41. Strip groove; 42. Guide bar No. 2; 43. Sliding seat; 44. Brush roller; 45. Rack No. 2; 46. Rack No. 3; 47. Gear No. 2; 48. Hydraulic rod No. 2; 49. Detergent nozzle; 410. Motor No. 3; 5. Closure assembly; 51. No. 3 hydraulic rod; 52. Lifting plate; 6. Liquid recovery assembly; 61. Storage tank; 62. Filter chamber; 63. Closing door; 64. Filter element; 65. Connecting pipe; 7. Megasound component; 71. Megasound generating module; 72. Liquid spray pipe; 8. Drying assembly; 81. Nitrogen nozzle; 82. Pure water nozzle; 9. Drive assembly; 91. Guide seat; 92. Guide bar No. 3; 93. Rack No. 4; 94. Hydraulic rod No. 4. DETAILED DESCRIPTION

[0020] The following will clearly and completely describe the technical solutions in the embodiments of the present invention in conjunction with the accompanying drawings. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative efforts are within the scope of protection of the present invention.

[0021] For examples, see Figure 1-12 As shown, a horizontal transfer wafer clamping and rotating cleaning device includes an equipment box 1 supported and fixed by a base 109; Figure 2 、 Figure 3 and Figure 5 In the equipment box 1, a megasonic bin 101, a No. 1 roller brush bin 102, a No. 2 roller brush bin 103 and a drying bin 104 are sequentially separated and arranged. A transmission component 2 is provided in the equipment box 1. A plurality of bins in the equipment box 1 are each provided with a clamping and rotating component 3. The wafer is transported by the transmission component 2 to the megasonic bin 101, the No. 1 roller brush bin 102, the No. 2 roller brush bin 103 and the drying bin 104 in sequence. When the wafer is transported to the plurality of bins, the clamping and rotating component 3 can be used to clamp and rotate the wafer, so that the surface of the wafer can be cleaned during its rotation. like Figure 2 、 Figure 3 、 Figure 4 and Figure 5 In the clamping rotating assembly 3, two sliding frames 33 are slidably provided, one of the sliding frames 33 is rotatably mounted with two support shafts 34, the other sliding frame 33 is rotatably mounted with a driving shaft 36 and an encoder 322 fixed thereon, the encoder 322 is rotatably mounted with a speed measuring shaft 321, the driving shaft 36 is fixedly connected with a driving wheel 37, the top ends of the support shaft 34 and the speed measuring shaft 321 are fixedly connected with driven wheels 35, and the driving wheel 37 and the three driven wheels 35 are arranged in a square array for transmission. In the transmission gap of the component 2, the wafer is transported by the transmission between the multiple rollers 21, and the two sliding frames 33 are simultaneously moved inward to center and clamp the wafer. After clamping, the drive shaft 36 is driven to drive the drive wheel 37 to rotate. When the drive wheel 37 rotates, it drives the wafer to rotate between the drive wheel 37 and the three driven wheels 35, thereby achieving cleaning of the wafer surface during the rotation process. At the same time, the rotation of the wafer drives the speed measuring shaft 321 to rotate, realizing speed measurement, adapting to different process cleaning requirements; like Figure 2 、 Figure 3 and Figure 4 In the embodiment, the megasonic chamber 101 and the drying chamber 104 are respectively provided with a megasonic component 7 and a drying component 8, and the No. 1 roller brush chamber 102 and the No. 2 roller brush chamber 103 are both provided with a roller brush component 4. The megasonic component 7 is used to perform megasonic cleaning on the wafers fed into the megasonic chamber 101. The cavitation effect and microflow effect generated by the megasonic waves emitted by the megasonic component 7 are used to achieve efficient removal of nano-scale particles on the wafer surface. At the same time, the two roller brush assemblies 4 are used to perform double brushing on the wafer surface to remove chemical residues or stains on the wafer surface. The washed wafers enter the drying chamber 104 for drying. As the wafers are continuously fed in, continuous processing is performed to improve the cleaning efficiency. like Figure 1 、 Figure 3 、 Figure 5 and Figure 7 In the figure, the driving ends of the multiple clamping rotating components 3 are all arranged at the bottom of the equipment box 1, and the driving component 9 is installed on the base 109, and the driving end of the driving component 9 is simultaneously connected to the driving ends of the multiple clamping rotating components 3. The driving component 9 is used to drive the multiple clamping rotating components 3 at the same time to ensure the synchronization during the operation of the equipment, so that the multiple clamping rotating components 3 can perform clamping actions at the same time.

[0022] like Figure 2 、 Figure 3 、 Figure 4 and Figure 5In the embodiment, the transmission component 2 includes rollers 21 that are evenly transmitted and arranged in multiple warehouse bodies. Adjacent rollers 21 are connected by transmission rubber rings 22. A No. 1 motor 24 is fixed on the outer wall of the equipment box 1. The central axis of the roller 21 located on the side is set outside the equipment box 1 and is connected to the output end of the No. 1 motor 24 through a belt. The rollers 21 are all provided with anti-slip rings 23 for anti-slip, and a material transfer trough 1012 for communication is provided on the warehouse body partition in the equipment box 1. A feed port 105 is set through the side wall of the megasonic warehouse 101, and a discharge port 106 is set through the side wall of the drying warehouse 104. The openings of the feed port 105 and the discharge port 106 are both provided with A sealing component 5 is provided for sealing, and a robotic arm 108 for wafer clamping is provided at the openings of the feed port 105 and the discharge port 106. A liquid recovery component 6 is installed on the base 109, which is respectively connected to the megasonic chamber 101, the No. 1 roller brush chamber 102, the No. 2 roller brush chamber 103 and the drying chamber 104. The robotic arm 108 is used to deliver the wafer to be cleaned from the feed port 105 into the megasonic chamber 101, and the robotic arm 108 is used to take out the dried wafer in the drying chamber 104 to realize continuous cleaning processing, and the sealing component 5 is used to seal the feed port 105 and the discharge port 106 to seal the equipment box 1 to prevent the chemical liquid from volatilizing and accelerating the aging and corrosion of equipment components after the cleaning chamber is opened.

[0023] like Figure 3 、 Figure 4 and Figure 6 In the embodiment, the clamping and rotating assembly 3 includes three No. 1 through slots 31 that are opened on the side of the equipment box 1, wherein two of the No. 1 through slots 31 are penetrated by limit rods 32, and the two sliding racks 33 are slidably set on the two limit rods 32, and are both perpendicular to the limit rods 32. Two baffles 38 are fixedly connected to the two limit rods 32, and the two baffles 38 are respectively slidably fitted on the inner wall of the equipment box 1 through the limit strips. The outer sides of the two sliding racks 33 are fixedly connected with L-shaped pull rods 39, and the two Each of the L-shaped pull rods 39 is slidably arranged on the side of the baffle 38, and the two L-shaped pull rods 39 are respectively arranged in another No. 1 through slot 31 located on both sides of the equipment box 1. The two limit rods 32 are used to slide and limit the sliding frame 33 to ensure the stability of the clamping operation, and the baffle 38 is used to close the opening of the No. 1 through slot 31 to ensure the sealing effect inside the equipment box 1. At the same time, the two L-shaped pull rods 39 are used to push the two sliding frames 33 to move inward or pull outward at the same time to center and clamp the wafer.

[0024] like Figure 2 、 Figure 6 and Figure 11In the embodiment, the clamping rotation assembly 3 also includes a second through slot 320 that runs through one side of the equipment box 1, a spline sleeve 316 is rotatably installed on the side of one of the baffles 38, a spline shaft 315 is slidably provided in the spline sleeve 316, a sleeve 314 is fixed to the side of one of the sliding frames 33 through a bracket, a spline shaft 315 is rotatably installed in the sleeve 314, and the spline sleeve 316 is slidably engaged with the spline shaft 315, and the end of the spline shaft 315 is engaged with the bottom end of the drive shaft 36 through a gear. Dynamic connection, the end of the spline sleeve 316 passes through the No. 2 through slot 320 and is connected to the No. 2 motor 317 for driving, and the No. 2 motor 317 is fixed to the side of the baffle 38, and the spline shaft 315 is driven to rotate when the spline sleeve 316 rotates, and the drive shaft 36 is driven to rotate when the spline shaft 315 rotates, and then the wafer is driven to rotate when it is clamped, so as to achieve the function of wafer rotation driving, and the two sliding frames 33 can drive the spline shaft 315 to slide in the spline sleeve 316 when they move, to ensure stable driving.

[0025] like Figure 6 、 Figure 7 and Figure 11 In the embodiment, a lifting frame 318 is fixedly connected between the ends of the same side of the two limit rods 32. A hydraulic rod 319 is fixedly connected to the bottom of the lifting frame 318, and the hydraulic rod 319 is fixed to the outer wall of the equipment box 1. A hollow shaft 310 is sleeved on the vertical section of the two L-shaped pull rods 39. The bottom ends of the two hollow shafts 310 are fixedly connected to a rack 312. The two racks 312 are slidably arranged at the bottom of the equipment box 1 through a guide bar 311. The two racks 312 are fixed to the bottom of the equipment box 1 through a guide bar 311. A number one gear 313 for common meshing transmission is provided between the bars 312, and the number one gear 313 is rotatably installed at the bottom of the equipment box 1. The number one gear 313 is also connected to the driving end of the driving component 9. The driving component 9 is used to drive the number one gear 313 in multiple clamping rotating components 3 so that multiple clamping rotating components 3 can operate synchronously, and the number one hydraulic rod 319 is used to drive the limit rod 32 to rise and fall, thereby lifting and moving the clamped wafer so as to drive the wafer to rotate.

[0026] like Figure 1 、 Figure 4 and Figure 8In the embodiment, the roller brush assembly 4 includes a strip groove 41 that runs through the side of the equipment box 1 and two cleaning agent nozzles 49 fixed to the side wall of the equipment box 1, and a No. 2 guide bar 42 is fixed on both sides of the opening of the strip groove 41, and two sliding seats 43 are slidably provided on the No. 2 guide bar 42 on both sides, and a brush roller 44 is rotatably provided between the sliding seats 43 on both sides, and the two brush rollers 44 are both set through the equipment box 1, and one end of the central axis of the two brush rollers 44 is connected to a No. 3 motor 410 for driving, and the two No. 3 motors 410 are respectively fixed on the two sliding seats 43, and the side of the sliding seat 43 on the upper side is fixed with a No. 2 rack 45, and the side of the sliding seat 43 on the lower side is fixed with a No. 3 rack 46, and the side of the No. 3 rack 46 is provided with a No. 2 gear engaged with it for transmission. Gear 47, and the No. 2 gear 47 is rotatably mounted on the outer wall of the equipment box 1, the vertical section of the No. 2 rack 45 is bent downward and meshed with the side opposite to the No. 2 gear 47 and the No. 3 rack 46, and the No. 2 rack 45 is fixed with a No. 2 hydraulic rod 48, and the No. 2 hydraulic rod 48 is fixed on the outside of the equipment box 1, and the No. 3 motor 410 is used to drive the brush roller 44, and the No. 2 hydraulic rod 48 can drive the No. 2 rack 45 and the upper sliding seat 43 connected thereto to slide when it is extended and retracted, and when the upper sliding seat 43 slides, the lower sliding seat 43 can be driven to rise through the opposite meshing of the No. 2 rack 45, the No. 3 rack 46 and the No. 2 gear 47, and cooperate with the cleaning agent nozzle 49 to spray the cleaning agent on the surface of the wafer, thereby brushing the upper and lower side surfaces of the wafer, and at the same time, ensuring that the wafer is fully cleaned under the action of the wafer rotation.

[0027] like Figure 1 、 Figure 9 and Figure 10 In the figure, the closing component 5 includes a lifting plate 52 that is slidably attached to the side wall of the equipment box 1 through a limit bar, and a No. 3 hydraulic rod 51 is fixed to the lifting plate 52, and the No. 3 hydraulic rod 51 is fixed to the outer wall of the equipment box 1. The liquid recovery component 6 includes a storage tank 61 fixed to the base 109, and a filter bin 62 connected thereto is installed on the storage tank 61. A closed door 63 is provided at the opening of the filter bin 62, and a filter element 64 is fixed on the side of the closed door 63. Connecting pipes 65 are fixed to the filter bin 62, and the top ends of multiple connecting pipes 65 are respectively connected to the bottom of the megasonic bin 101, the No. 1 roller brush bin 102, the No. 2 roller brush bin 103 and the drying bin 104. The lifting plate 52 is lifted and lowered by the extension and retraction of the No. 3 hydraulic rod 51 to close the equipment box 1, and the filter element 64 recovers and filters the cleaning agent discharged from the corresponding bin body to save production costs.

[0028] like Figure 1 、 Figure 7 and Figure 12In the embodiment, the driving assembly 9 includes a guide seat 91 fixed on the base 109, a No. 3 guide bar 92 is slidably provided on the guide seat 91, a No. 4 rack 93 is fixedly connected to the No. 3 guide bar 92, and the No. 4 rack 93 is simultaneously meshed and connected with a plurality of No. 1 gears 313, a No. 4 hydraulic rod 94 is fixedly connected to the side of the No. 4 rack 93, and the No. 4 hydraulic rod 94 is fixed to the base 109, and a nozzle plate 1011 is fixedly connected to the side wall of the warehouse body in the equipment box 1, the megaacoustic warehouse 101, the No. 1 roller brush The top openings of the bin 102, the No. 2 roller brush bin 103 and the drying bin 104 are all rotatably hinged with a bin cover 107. The No. 4 hydraulic rod 94 is extended and retracted to drive the No. 1 gear 313 in the multiple clamping rotating components 3 to rotate, thereby driving the multiple clamping rotating components 3 at the same time, and multiple bin covers 107 are used to close the equipment box 1 for easy maintenance, and the nozzle plate 1011 is used to spray the cleaning agent into the bin body to flush the stains remaining in the bin body to ensure the cleanliness of the bin body.

[0029] like Figure 2 、 Figure 3 and Figure 4 In the embodiment, the megasonic component 7 includes two megasonic generating modules 71 fixed on the inner wall of the megasonic chamber 101, and a liquid spray pipe 72 is fixedly connected between the two megasonic generating modules 71. The drying component 8 includes two nitrogen nozzles 81 and two pure water nozzles 82 fixedly connected to the inner wall of the drying chamber 104. The two megasonic generating modules 71, the nitrogen nozzles 81 and the pure water nozzles 82 are respectively located on the upper and lower sides of the transmission surfaces of the multiple rollers 21 in the chamber body, and are located in the transmission holes of the multiple rollers 21. The megasonic waves emitted by the megasonic generating module 71 are used, and the megasonic waves are transmitted to the surface of the wafer through the liquid spray pipe 72 to clean the dust on the wafer. The pure water nozzle 82 is used to spray pure water, and the cleaning agent on the wafer is used to rinse it clean. The nitrogen nozzle 81 is used to spray nitrogen to dry the remaining water stains on the wafer to complete the drying of the wafer.

[0030] During operation, the existing wafer cleaning device can only clean two wafers at a time and cannot continuously clean a large number of wafers, resulting in low cleaning efficiency. In addition, only one side of the wafer can be cleaned at a time, and the cleaning is not comprehensive. In this solution, a robotic arm 108 is used to feed the wafer to be cleaned into the megasonic chamber 101 through the feed port 105 and place it on multiple rollers 21 in the megasonic chamber 101. Then, the third hydraulic rod 51 at the feed port 105 is extended and retracted to drive the lifting plate 52 to close the feed port 105. Then, the clamping and rotating assembly 3 in the megasonic chamber 101 performs a clamping action. When the wafer is clamped by the clamping rotating assembly 3, the fourth hydraulic rod 94 is controlled to extend and retract to drive the fourth rack 93 to slide on the guide seat 91 through the third guide bar 92. When the fourth rack 93 slides, it drives multiple first gears 313 to rotate, thereby driving multiple clamping rotating assemblies 3. Secondly, when the first gear 313 rotates, it drives the two oppositely arranged first racks 312 to slide on the bottom of the equipment box 1 through the first guide bar 311, and the two first racks 312 will move inward at the same time. When the first rack 312 moves, it will pass through the hollow shaft 3 connected to its end. 10 drives the two L-shaped pull rods 39 to move inward at the same time, and when the two L-shaped pull rods 39 move inward at the same time, they push the two sliding frames 33 inward. When the two sliding frames 33 move inward, they drive the two support shafts 34, the speed measuring shaft 321 and the driving shaft 36 installed thereon to move inward at the same time, thereby causing the driving wheel 37 and the three driven wheels 35 to be centered and clamped to complete the wafer clamping action. At the same time, when the two L-shaped pull rods 39 move inward at the same time, they will slide and retract on the sides of the two baffles 38 respectively, and when the sliding frame 33 drives the driving shaft 36 to move, they will simultaneously drive The spline shaft 315 slides and retracts in the spline sleeve 316, and then controls the No. 1 hydraulic rod 319 on both sides to extend to drive the two limit rods 32 to lift through the lifting frame 318. When the two limit rods 32 are lifted, they will drive the driving wheel 37 and the three driven wheels 35 to lift in the gap between the roller shaft 21, so as to lift the wafer clamped between the driving wheel 37 and the three driven wheels 35, so that the wafer is moved away from the transmission surface of the multiple roller shafts 21. At the same time, the lifting of the two limit rods 32 will drive the two baffles 38 to slide against the inner wall of the warehouse, and when the baffles 38 slide, they will drive the spline sleeve 3 16 and the second motor 317 are synchronously lifted in the second through slot 320, and then the second motor 317 is controlled to drive the spline sleeve 316 to drive the spline shaft 315 to rotate through the spline sleeve 316. When the spline shaft 315 rotates, it will drive the drive shaft 36 to rotate, thereby driving the drive wheel 37 to rotate. When the drive wheel 37 rotates, it will drive the wafer to rotate between the drive wheel 37 and the three driven wheels 35, thereby realizing the cleaning of the wafer surface during the rotation process. At the same time, the rotation of the wafer drives the speed measuring shaft 321 to rotate, realizing speed measurement, and adapting to different process cleaning requirements; At this time, while the wafer in the megasonic chamber 101 is being held and rotated by the clamping and rotating assembly 3, the two liquid spray pipes 72 are controlled to spray cleaning agent onto the upper and lower surfaces of the wafer, and the megasonic generating module 71 is controlled to emit megasonic waves. The cavitation effect and microflow effect of the megahertz-level high-frequency ultrasonic waves are utilized to achieve efficient removal of nano-scale particles, thereby performing preliminary cleaning of the wafer. After the preliminary cleaning, the rotation drive of the wafer by the No. 2 motor 317 is stopped, and the No. 1 hydraulic rod 319 is controlled to be retracted to lower the wafer to the transmission surface of the multiple rollers 21. At the same time, the No. 4 hydraulic rod 94 is controlled to retract in the opposite direction to drive the two sliding racks 33 to expand outward, so that the driving wheel 37 and the three driven wheels 35 release the clamping of the wafer. Then the No. 1 motor 24 is controlled to drive the multiple rollers 21 to drive the wafer to the next warehouse. When the wafer is transported to the No. 1 roller brush warehouse 102, the robot arm 108 can be used to send the subsequent wafer into the megasonic warehouse 101, and the wafers in the megasonic warehouse 101 and the No. 1 roller brush warehouse 102 are centered, clamped and rotationally driven by the clamping and rotating assembly 3. At this time, the roller brush assembly 4 is controlled to clean the wafer in the No. 1 roller brush warehouse 102. When the roller brush assembly 4 is used to brush the wafer, the cleaning agent is sprayed onto the wafer surface through the two cleaning agent nozzles 49, and then the two No. 2 hydraulic rods 48 are controlled to extend. When the No. 2 hydraulic rod 48 is extended, it pushes the No. 2 rack 45 downward. When the No. 2 rack 45 moves downward, it drives the upper sliding seat 43 to slide downward. When the upper sliding seat 43 slides downward, the No. 2 rack 45 and the No. 2 gear 47 engage with each other on both sides of the No. 2 gear 47, which drives the lower sliding seat 43 to slide upward. Then, the two brush rollers 44 are respectively attached to the upper and lower sides of the wafer, and under the driving action of the No. 3 motor 410 on the brush rollers 44, the brush rollers 44 roll on the wafer surface, and under the action of the wafer rotation, the wafer surface is fully brushed. At this time, the megaacoustic assembly 7 in the megaacoustic chamber 101 will perform megaacoustic cleaning on the wafer therein. After the wafer is initially brushed, it is placed on the transmission surface of the conveyor assembly 2 for conveyance again, and is conveyed to the No. 2 roller brush bin 103 for secondary brushing. The brushing action in the No. 2 roller brush bin 103 is consistent with the brushing action of the roller brush assembly 4 in the No. 1 roller brush bin 102. The double brushing improves the cleaning effect and ensures the cleanliness of the wafer. Alternatively, different cleaning agents of different properties can be sprayed onto the wafer during the two brushing processes to clean different chemical residues or stains on the wafer surface. After the secondary cleaning, the wafer is transported to the drying chamber 104 through the conveying assembly 2, and the wafer is clamped and rotated again under the action of the clamping and rotating assembly 3 therein. During this process, pure water is first sprayed onto the surface of the wafer through two pure water nozzles 82 to wash away the residual cleaning agent on the wafer. After the cleaning agent is washed away, high-pressure nitrogen is sprayed onto the surface of the wafer through two nitrogen nozzles 81 to blow away the remaining water stains on the wafer, thereby completing the drying of the wafer. After the drying is completed, the rotation drive of the wafer is stopped, and the robotic arm 108 is used to clamp the wafer in the clamped state and take it out from the discharge port 106 to complete the wafer cleaning operation; The cleaning agent or other liquid generated during the wafer cleaning process will be recovered and filtered through the liquid recovery assembly 6 connected to the lower part of the chamber. During the recovery, the cleaning agent liquid will enter the filter chamber 62 through the connecting pipe 65, and the impurities in the liquid will be filtered and adsorbed under the filtering action of the filter element 64. The filtered liquid will be retained in the storage tank 61 to recycle the cleaning agent liquid and save production costs. The combination achieves the effect of continuous wafer cleaning. Compared with traditional wafer cleaning devices, the cleaning is more comprehensive, and can continuously clean large quantities of wafers with higher cleaning efficiency.

[0031] The basic principles, main features, and advantages of the present invention are shown and described above. Those skilled in the art should understand that the present invention is not limited to the above embodiments. The above embodiments and descriptions are merely illustrative of the principles of the present invention. Various changes and modifications may be made to the present invention without departing from the spirit and scope of the present invention, and such changes and modifications fall within the scope of the invention as claimed.

Claims

1. A horizontal transfer wafer clamping and rotating cleaning device, characterized by: It comprises an equipment box (1) supported and fixed by a base (109); the equipment box (1) is provided with a megasonic bin (101), a first roller brush bin (102), a second roller brush bin (103) and a drying bin (104) in sequence; a transmission assembly (2) is provided in the equipment box (1); and a plurality of bin bodies in the equipment box (1) are provided with a clamping rotation assembly (3); Two sliding frames (33) are slidably provided in the clamping rotating assembly (3), wherein two support shafts (34) are rotatably mounted on one of the sliding frames (33), and a driving shaft (36) and an encoder (322) fixed thereon are rotatably mounted on the other sliding frame (33), a speed measuring shaft (321) is rotatably mounted on the encoder (322), a driving wheel (37) is fixedly connected to the driving shaft (36), and driven wheels (35) are fixedly connected to the top ends of the support shaft (34) and the speed measuring shaft (321), and the driving wheel (37) and the three driven wheels (35) are arranged in a square array within the transmission gap of the transmission assembly (2); The megasonic chamber (101) and the drying chamber (104) are respectively provided with a megasonic assembly (7) and a drying assembly (8), and the first roller brush chamber (102) and the second roller brush chamber (103) are both provided with a roller brush assembly (4); The driving ends of the plurality of clamping rotating assemblies (3) are all arranged at the bottom of the equipment box (1), a driving assembly (9) is mounted on the base (109), and the driving end of the driving assembly (9) is simultaneously connected to the driving ends of the plurality of clamping rotating assemblies (3).

2. The horizontal transfer wafer clamping and rotating cleaning device according to claim 1, characterized in that: The transmission assembly (2) includes rollers (21) uniformly transmitted and arranged in a plurality of bin bodies, and adjacent rollers (21) are connected by transmission rubber rings (22). A No. 1 motor (24) is fixed on the outer wall of the equipment box (1). The central axis of the roller (21) located on the side passes through the outside of the equipment box (1) and is connected to the output end of the No. 1 motor (24) by a belt. The rollers (21) are all provided with anti-skid rings (23) for anti-skid, and a material transfer trough (1012) for communication is provided on the bin body partition of the equipment box (1). The megasonic bin A feed port (105) is provided through the side wall of (101), a discharge port (106) is provided through the side wall of the drying chamber (104), a sealing assembly (5) for sealing is provided at the openings of the feed port (105) and the discharge port (106), a robotic arm (108) for wafer clamping is provided at the openings of the feed port (105) and the discharge port (106), and a liquid recovery assembly (6) is installed on the base (109) which is connected to the megasonic chamber (101), the No. 1 roller brush chamber (102), the No. 2 roller brush chamber (103) and the drying chamber (104) respectively.

3. The horizontal transfer wafer clamping and rotating cleaning device according to claim 1, characterized in that: The clamping rotation assembly (3) includes three No. 1 through slots (31) extending through the side of the equipment box (1), wherein two of the No. 1 through slots (31) are provided with limit rods (32), and the two sliding frames (33) are slidably provided on the two limit rods (32) and are both perpendicular to the limit rods (32), two baffles (38) are fixedly connected to the two limit rods (32), and the two baffles (38) are respectively slidably fitted on the inner wall of the equipment box (1) through the limit bars, and the outer side surfaces of the two sliding frames (33) are fixedly provided with L-shaped pull rods (39), and the two L-shaped pull rods (39) are respectively slidably provided on the side surfaces of the baffles (38), and the two L-shaped pull rods (39) are respectively provided in another No. 1 through slot (31) located on both sides of the equipment box (1).

4. The horizontal transfer wafer clamping and rotating cleaning device according to claim 3, characterized in that: The clamping rotation assembly (3) further includes a second through slot (320) extending through a side of the equipment box (1), wherein a spline sleeve (316) is rotatably mounted on a side of one of the baffles (38), and a spline shaft (315) is slidably arranged in the spline sleeve (316), and a shaft sleeve (314) is fixed to a side of one of the sliding frames (33) through a bracket, and a spline shaft (315) is rotatably mounted in the shaft sleeve (314), and the spline sleeve (316) is slidably engaged with the spline shaft (315), and the end of the spline shaft (315) is connected to the bottom end of the drive shaft (36) through a gear meshing transmission, and the end of the spline sleeve (316) extends through the second through slot (320) and is connected to a second motor (317) for driving, and the second motor (317) is fixed to the side of the baffle (38).

5. The horizontal transfer wafer holding and rotating cleaning device according to claim 3, characterized in that: A lifting frame (318) is fixedly connected between the ends of the same side of the two limiting rods (32), and a No. 1 hydraulic rod (319) is fixedly connected to the bottom of the lifting frame (318), and the No. 1 hydraulic rod (319) is fixed to the outer wall of the equipment box (1). A hollow shaft (310) is sleeved on the vertical section of the two L-shaped pull rods (39), and the bottom ends of the two hollow shafts (310) are fixedly connected to a No. 1 rack (312), and the two No. 1 racks (312) are slidably arranged at the bottom of the equipment box (1) through a No. 1 guide bar (311). A No. 1 gear (313) is arranged between the two No. 1 racks (312) for common meshing transmission, and the No. 1 gear (313) is rotatably installed at the bottom of the equipment box (1), and the No. 1 gear (313) is simultaneously connected to the driving end of the driving component (9).

6. The horizontal transfer wafer holding and rotating cleaning device according to claim 1, characterized in that: The roller brush assembly (4) includes a strip groove (41) extending through the side of the equipment box (1) and two cleaning agent nozzles (49) fixed to the side wall of the equipment box (1). Two guide strips (42) are fixed to both sides of the opening of the strip groove (41). Two sliding seats (43) are slidably provided on the two guide strips (42) on both sides. A brush roller (44) is rotatably provided between the sliding seats (43) on both sides. The two brush rollers (44) are both provided through the equipment box (1). One end of the central axis of the two brush rollers (44) is connected to a third motor (410) for driving, and the two third motors (410) are fixed respectively. On the two sliding seats (43), the side of the sliding seat (43) located on the upper side is fixedly connected with a No. 2 rack (45), and the side of the sliding seat (43) located on the lower side is fixedly connected with a No. 3 rack (46). The side of the No. 3 rack (46) is provided with a No. 2 gear (47) that is meshed with the No. 3 rack (46), and the No. 2 gear (47) is rotatably mounted on the outer wall of the equipment box (1). The vertical section of the No. 2 rack (45) is bent downward and meshed with the side opposite to the No. 2 gear (47) and the No. 3 rack (46). The No. 2 rack (45) is fixedly connected with a No. 2 hydraulic rod (48), and the No. 2 hydraulic rod (48) is fixed on the outer side of the equipment box (1).

7. The horizontal transfer wafer clamping and rotating cleaning device according to claim 2, characterized in that: The closing component (5) includes a lifting plate (52) that is slidably attached to the side wall of the equipment box (1) through a limit bar, a No. 3 hydraulic rod (51) is fixed to the lifting plate (52), and the No. 3 hydraulic rod (51) is fixed to the outer wall of the equipment box (1), and the liquid recovery component (6) includes a storage tank (61) fixed to the base (109), a filter bin (62) connected thereto is installed on the storage tank (61), a closing door (63) is provided at the opening of the filter bin (62), a filter element (64) is fixed to the side of the closing door (63), and connecting pipes (65) are fixed to the filter bin (62), and the top ends of the plurality of connecting pipes (65) are respectively connected to the bottom of the megasonic bin (101), the No. 1 roller brush bin (102), the No. 2 roller brush bin (103) and the drying bin (104).

8. The horizontal transfer wafer holding and rotating cleaning device according to claim 1, characterized in that: The driving assembly (9) includes a guide seat (91) fixed on the base (109), a No. 3 guide bar (92) is slidably provided on the guide seat (91), a No. 4 rack (93) is fixedly connected to the No. 3 guide bar (92), and the No. 4 rack (93) is simultaneously meshed and transmission-connected with a plurality of No. 1 gears (313), a No. 4 hydraulic rod (94) is fixedly connected to the side of the No. 4 rack (93), and the No. 4 hydraulic rod (94) is fixedly connected to the base (109), a nozzle plate (1011) is fixedly connected to the side wall of the bin body in the equipment box (1), and a bin cover (107) is rotatably hinged at the top opening of the megasonic bin (101), the No. 1 roller brush bin (102), the No. 2 roller brush bin (103) and the drying bin (104).

9. The horizontal transfer wafer clamping and rotating cleaning device according to claim 1, characterized in that: The megasonic component (7) includes two megasonic generating modules (71) fixed on the inner wall of the megasonic bin (101), and a liquid spraying pipe (72) is fixedly connected between the two megasonic generating modules (71). The drying component (8) includes two nitrogen spraying pipes (81) and two pure water spraying pipes (82) fixedly connected to the inner wall of the drying bin (104), and the two megasonic generating modules (71), the nitrogen spraying pipes (81) and the pure water spraying pipes (82) are respectively located on the upper and lower sides of the transmission surface of the multiple rollers (21) in the bin body, and are located in the transmission openings of the multiple rollers (21).

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