Automatic wafer dicing and feeding device

Abstract

The present application relates to the field of semiconductor manufacturing, specifically to a kind of automatic slicing of silicon wafer loading device. Including workbench, bernoulli chuck, fixture, buffer mechanism and limiting mechanism, the middle part of workbench is provided with avoiding hole, bernoulli chuck is movably arranged above workbench;Fixture moves vertically through jacking mechanism, circle center holds tight mechanism cooperates with limiting rubber pole to position silicon wafer, the cylindrical space is formed after the closure of the wind cover of two groups of buffer mechanism, air disc provides supporting airflow to make silicon wafer suspended, the flexible claw of limiting mechanism is limited to prevent deviation. Device is separated by bernoulli chuck non-contact slicing, wind cover airflow buffering and flexible claw limiting, realize the lossless separation and accurate temporary storage of silicon wafer, solve the problems such as contact damage, positioning precision deficiency of traditional device. With the advantages of non-contact, high precision, high cleanliness, high degree of automation etc., it is suitable for the automatic slicing of semiconductor silicon wafer loading process.

Description

TECHNICAL FIELD

[0001] The present application relates to the field of semiconductor manufacturing, in particular to a kind of automatic wafer slicing of silicon wafer loading device. BACKGROUND

[0002] In the field of semiconductor manufacturing, automatic wafer slicing of silicon wafer loading is the front link of key processes such as lithography, etching, etc., and its device performance directly affects product yield and production efficiency, and traditional wafer slicing loading device has many defects:

[0003] First, the contact type wafer slicing is seriously damaged, such as the patent with the announcement number CN109979870B discloses a kind of automatic wafer slicing of silicon wafer loading mechanism, the device uses the way of brush rubbing, and separates silicon wafer by physical contact, which is easy to produce scratches, edge collapse and other mechanical damage on the surface, especially for the ultra-thin wafer with small thickness or the wafer with processed device layer on the surface, the damage risk is significant, which leads to the decrease of subsequent process yield.

[0004] Second, wafer slicing by vacuum chuck has the risk of negative pressure deformation, and some devices rely on vacuum chuck to adsorb silicon wafer, but the adsorption force generated by negative pressure is easy to cause local stress concentration of wafer, especially for thin wafer, which may cause warping deformation, affect wafer flatness, and further interfere with the precision of subsequent precision machining process.

[0005] Third, the precision of air flow wafer slicing is insufficient, and some devices only blow air to the gap between silicon wafers through air jet nozzle to realize wafer slicing, which is affected by air flow stability, and the position of silicon wafer is easy to deviate or tilt when it is separated, which is difficult to meet the requirement of wafer positioning precision of high-end semiconductor process, and increases the action error of subsequent grabbing device.

[0006] Fourth, the cleanliness does not meet the standard, and the mechanical parts (such as brush or mechanical claw) of traditional contact type wafer slicing device are easy to wear and produce debris in long-term use, and unfiltered air flow may also carry particles in the air, which leads to the pollution of silicon wafer surface, affects the electrical performance and yield of semiconductor device, and cannot meet the process requirement of super-clean workshop.

[0007] Therefore, it is necessary to design a kind of automatic wafer slicing of silicon wafer loading device. SUMMARY

[0008] Based on this, it is necessary to provide a kind of automatic wafer slicing of silicon wafer loading device for the problems in the prior art.

[0009] To solve the problems in the prior art, the technical scheme adopted by the present application is:

[0010] An automatic wafer slicing of silicon wafer loading device, comprising:

[0011] The workbench is centrally formed with a relief hole, two slide rails are fixedly connected to the upper end of the workbench, a Bernoulli chuck is movably arranged above the workbench, a clamp for clamping silicon wafers in a stacked state is arranged below the middle of the workbench, and a jacking mechanism is arranged at the lower end of the clamp;

[0012] Two groups of buffer mechanisms are arranged at the upper end of the workbench, the buffer mechanism comprises a wind cover slidably arranged above the workbench, and the lower end of the wind cover is fixedly connected with an air disc; the wind covers of the two groups of buffer mechanisms abut to form a cylindrical space, and the two air discs provide air flow for the cylindrical space from bottom to top;

[0013] A limiting mechanism is arranged at the upper part of each wind cover, and the limiting mechanism comprises an angle-adjustable flexible claw.

[0014] Further, the clamp comprises a central clamping mechanism, the fixed end of the central clamping mechanism is fixedly connected with the output end of the jacking mechanism, and the upper end of the central clamping mechanism is fixedly connected with a rubber disc for supporting the silicon wafer;

[0015] The output end of the central clamping mechanism is fixedly connected with a positioning block, and a limiting rubber rod for positioning the edge of the silicon wafer is adjustably arranged on the positioning block.

[0016] Further, a tension spring is arranged at the lower end of the positioning block, the tension spring is sleeved outside the limiting rubber rod, the lower end of the limiting rubber rod is fixedly connected with a guide plate, one end of the tension spring is fixedly connected with the positioning block, and the other end of the tension spring is fixedly connected with the guide plate;

[0017] The two sides of the limiting rubber rod are provided with telescopic guide rods, one end of the telescopic guide rod is fixedly connected with the positioning block, and the other end of the telescopic guide rod is fixedly connected with the guide plate.

[0018] Further, a gas chamber is arranged in the middle of the air disc, a moving pipe is fixedly connected to the middle of the gas chamber in communication with the gas chamber, the buffer mechanism further comprises a gas pump arranged at the lower part of the workbench, a curved pipe is arranged at the upper end of the gas pump and fixedly connected with the workbench through a pipe base, one end of the curved pipe is in communication with the output end of the gas pump, and the other end of the curved pipe is in sealing connection with the moving pipe;

[0019] The moving pipe is slidably connected with the two slide rails through a pipe frame, a plurality of air nozzles are arranged at the upper end of the air disc at equal angles in the circumferential direction, the number of the air nozzles is not less than four, and the lower end of the air nozzle is in communication with the gas chamber after penetrating through the air disc.

[0020] Further, the buffer mechanism further comprises a gas cylinder fixedly arranged at the upper end of the workbench, a supporting plate is fixedly connected to the side of the wind cover close to the gas cylinder, the output end of the gas cylinder is fixedly connected with the supporting plate, and the lower end of the air disc is slidably connected with the two slide rails.

[0021] Further, the two sides of one wind cover are provided with touch pressure blocks, the two sides of the other wind cover are provided with touch pressure sensors, and the output end of the touch pressure sensor and the touch pressure block abut when the two wind covers are close to each other.

[0022] Further, the air baffle and the air disc are provided with rubber strips on the side close to the center of the avoiding hole, and the shape of the rubber strips is the same as the cross section of the air baffle and the air disc.

[0023] Further, the inner wall of the air baffle is provided with anti-collision strips at equal angles.

[0024] Further, a plurality of through air holes are formed on the outer wall of the air baffle, the number of the through air holes is double and not less than two, the outer wall of the air baffle is fixedly connected with disc seats corresponding to the through air holes, the disc seats are coaxial with the through air holes, a rotating disc is rotatably arranged in the middle part of the disc seat, a rotating rod is fixedly connected to the upper end of the rotating disc, and the rotating rod is rotatably connected to the upper end of the disc seat.

[0025] The rotating disc is externally sleeved with two sealing rings, and the sealing rings are in interference connection with the inner wall of the disc seat.

[0026] Further, claw seats are fixedly connected to the outer walls of the two air baffles, an electric push rod is fixedly connected to the top of the air baffle, the output end of the electric push rod is fixedly connected with a guide shaft in sliding connection with the claw seat.

[0027] A claw rod is fixedly inserted into the middle part of the flexible claw, a rack is slidably arranged in the inner part of the claw seat and fixedly connected to the lower end of the guide shaft, a main gear is rotatably arranged on the side of the rack and engaged with the rack, two auxiliary gears are rotatably arranged on the side of the main gear and engaged with the main gear, and the two auxiliary gears are coaxially fixedly connected to the end of the claw rod away from the flexible claw.

[0028] Compared with the prior art, the present application has the following beneficial effects:

[0029] Firstly, the present device uses Bernoulli suction cups to non-contact adsorb silicon wafers, cooperates with air flow buffering in the air baffle, avoids physical contact of traditional brushes or mechanical claws, can effectively prevent scratches, edge collapse and other damages on the surface of the silicon wafer, is especially suitable for ultra-thin wafers and wafers with device layers, and improves the yield of the wafer splitting process.

[0030] Secondly, the present device uses air flow negative pressure non-contact adsorption of the Bernoulli suction cup, avoids local stress concentration caused by negative pressure of traditional vacuum suction cups, prevents the silicon wafer from warping, ensures the flatness of the wafer, and provides stable base conditions for subsequent precise processes such as photoetching and etching.

[0031] Thirdly, the present device uses the cylindrical space formed by the closed air baffle and the uniform supporting air flow, and the flexible claw positioning of the limiting mechanism, can effectively control the position deviation and angle inclination of the silicon wafer after splitting, provides accurate feeding reference for the subsequent grabbing device, and meets the positioning accuracy requirements of high-end semiconductor processes.

[0032] Fourthly, the airflow in the wind cover is filtered, and the rubber strip sealing and the anti-collision strip design can reduce the particulate pollution and mechanical wear debris, ensure the silicon wafer in the slicing process in a clean environment, meet the process standard of the semiconductor super-clean workshop, and reduce the device failure risk caused by pollution. BRIEF DESCRIPTION OF DRAWINGS

[0033] Figure 1 is a perspective structural schematic diagram of an embodiment;

[0034] Figure 2 is a front view of an embodiment;

[0035] Figure 3 is a partial structural schematic diagram of an embodiment;

[0036] Figure 4 is a perspective structural schematic diagram of a center-hugging mechanism and a workbench in an embodiment;

[0037] Figure 5 is a perspective structural half-sectional view of a wind cover in an embodiment;

[0038] Figure 6 is Figure 5 an enlarged view of structure at A in an embodiment;

[0039] Figure 7 is a perspective structural schematic diagram of a wind cover and a rubber strip in an embodiment;

[0040] Figure 8 is Figure 7 an enlarged view of structure at B in an embodiment.

[0041] Reference numerals in the drawings are as follows:

[0042] 1, silicon wafer; 2, Bernoulli chuck; 3, workbench; 4, avoidance hole; 5, clamp; 6, rubber disc; 7, center-hugging mechanism; 8, positioning block; 9, limiting rubber rod; 10, tension spring; 11, telescopic guide rod; 12, guide plate; 13, jacking mechanism; 14, buffer mechanism; 15, wind cover; 16, touch pressure block; 17, touch pressure sensor; 18, rubber strip; 19, anti-collision strip; 20, through wind hole; 21, disc seat; 22, rotating disc; 23, sealing ring; 24, rotating rod; 25, air disc; 26, air chamber; 27, air pump; 28, moving pipe; 29, pipe rack; 30, curved pipe; 31, air nozzle; 32, air cylinder; 33, slide rail; 34, supporting plate; 35, limiting mechanism; 36, flexible claw; 37, claw rod; 38, claw seat; 39, electric push rod; 40, guide shaft; 41, rack; 42, main gear; 43, auxiliary gear. DETAILED DESCRIPTION

[0043] In order to further understand the features, technical means and specific purposes and functions achieved by the present application, the present application is described in further detail below in conjunction with the drawings and specific embodiments.

[0044] Reference Figures 1 to 8 A silicon wafer automatic slicing and feeding device, comprising:

[0045] The workbench 3 is formed in the middle part with an avoiding hole 4, and two sliding rails 33 are fixedly connected to the upper end of the workbench 3. A Bernoulli chuck 2 is movably arranged above the workbench 3. A clamp 5 is arranged below the middle part of the workbench 3 to clamp the silicon wafers 1 in a stacked state. A jacking mechanism 13 is arranged at the lower end of the clamp 5. The clamp 5 is connected to the output end of the jacking mechanism 13 and can displace in the vertical direction.

[0046] Two sets of buffer mechanisms 14 are arranged at the upper end of the workbench 3. Each buffer mechanism 14 comprises a wind cover 15 movably arranged above the workbench 3. The lower end of the wind cover 15 is fixedly connected to an air disc 25. The wind covers 15 of the two sets of buffer mechanisms 14 abut to form a cylindrical space. The two air discs 25 provide air flow for the cylindrical space from bottom to top.

[0047] A limiting mechanism 35 is arranged at the upper part of each wind cover 15. The limiting mechanism 35 comprises a flexible claw 36 with adjustable angle. When the silicon wafers 1 are lifted upward by the air flow in the cylindrical space of the wind cover 15, the flexible claw 36 abuts against the upper end of the silicon wafers 1.

[0048] In the operation of the device, the silicon wafers 1 stacked together are placed in the clamp 5 in advance. The Bernoulli chuck 2 passes through the avoiding hole 4 downward to adsorb the topmost silicon wafer 1. The silicon wafer 1 is adsorbed by the Bernoulli chuck 2 and passes through the avoiding hole 4 upward to complete the automatic slicing. In this process, the two sets of buffer mechanisms 14 are started to drive the corresponding wind covers 15 and air discs 25 to move. Then, the two sets of wind covers 15 abut each other until the wind cover 15 abuts against the wind cover 15 and the air disc 25 abuts against the air disc 25. The wind cover 15 and the air disc 25 form a cylindrical space. The silicon wafer 1 adsorbed by the Bernoulli chuck 2 is located inside the cylindrical space. At this time, the Bernoulli chuck 2 releases the silicon wafer 1. Since the two air discs 25 provide support for the silicon wafer 1 from bottom to top, the silicon wafer 1 can be suspended in the cylindrical space formed by the two wind covers 15. The flexible claw 36 limits the upper end of the suspended silicon wafer 1 to prevent the silicon wafer 1 from separating from the wind cover 15.

[0049] In the above-mentioned silicon wafer 1 slicing, the silicon wafer 1 is separated from the Bernoulli chuck 2, and after being floated by the airflow of the two air hoods 15, the "single wafer" and "non-contact temporary storage" are realized. In this process, the silicon wafer 1 is moved in a non-contact manner, ensuring the quality of the silicon wafer 1, and because the lower end of the silicon wafer 1 located in the cylindrical space formed by the two air hoods 15 has a buffer space formed by the airflow, a stable grabbing station is provided for the subsequent grabbing device.

[0050] In order to supplement the specific structure of the clamp 5, the following features are further provided:

[0051] The clamp 5 comprises a central clamping mechanism 7, the fixed end of the central clamping mechanism 7 is fixedly connected with the output end of the jacking mechanism 13, and the upper end of the central clamping mechanism 7 is fixedly connected with a rubber disc 6 for supporting the silicon wafer 1 (as shown in Figure 4 );

[0052] The output end of the central clamping mechanism 7 is fixedly connected with a positioning block 8, and the positioning block 8 is adjustably provided with a limiting rubber rod 9 for positioning the edge of the silicon wafer 1. When the central clamping mechanism 7 is started, the output ends of the central clamping mechanism 7 will drive the limiting rubber rods 9 to move through the positioning block 8, and the limiting rubber rods 9 will abut against the edge of the silicon wafer 1 to limit the silicon wafer 1, while the rubber disc 6 is used to support the bottom of the silicon wafer 1 to ensure the stability of the stacked state.

[0053] When the jacking mechanism 13 pushes the clamp 5 to move upward, the silicon wafer 1 in the stacked state will move upward as a whole, and at this time the upper end of the limiting rubber rod 9 will abut against the lower end of the workbench 3. In order to facilitate the movement of the limiting rubber rod 9 for positioning the edge of the silicon wafer 1, the following features are further provided:

[0054] The lower end of the positioning block 8 is provided with a tension spring 10 (as shown in Figure 8 ), the tension spring 10 is sleeved outside the limiting rubber rod 9, the lower end of the limiting rubber rod 9 is fixedly connected with a guide plate 12, one end of the tension spring 10 is fixedly connected with the positioning block 8, and the other end is fixedly connected with the guide plate 12;

[0055] The two sides of the limiting rubber rod 9 are provided with telescopic guide rods 11, one end of the telescopic guide rod 11 is fixedly connected with the positioning block 8, and the other end is fixedly connected with the guide plate 12. When the jacking mechanism 13 pushes the clamp 5 to move upward, the silicon wafer 1 in the stacked state will move in the direction of avoiding the hole 4 in the middle of the workbench 3, at this time the upper end of the limiting rubber rod 9 abuts against the lower end of the workbench 3, the tension spring 10 is deformed, and the limiting rubber rods 9 form a fence type surrounding to the silicon wafer 1, preventing the silicon wafer 1 in the stacked state from tilting and causing the positioning of the Bernoulli chuck 2 to deviate.

[0056] In order to provide sufficient gas for the air disc 25, so that the lower end of the silicon wafer 1 has sufficient airflow, the following features are further provided:

[0057] The middle part of the air disc 25 is provided with an air chamber 26 (as shown in Figure 3 Fig. 2), the middle part of the air chamber 26 is fixedly connected with a moving pipe 28 in communication therewith, and the buffer mechanism 14 further comprises an air pump 27 arranged at the lower part of the workbench 3, the upper end of the air pump 27 is provided with a curved pipe 30 fixedly connected with the workbench 3 through a pipe base, one end of the curved pipe 30 is in communication with the output end of the air pump 27, and the other end is in dynamic sealing connection with the moving pipe 28;

[0058] The moving pipe 28 is in sliding connection with two slide rails 33 through a pipe support 29, and the upper end of the air disc 25 is arranged with air nozzles 31 in an equiangular array in the circumferential direction, the number of the air nozzles 31 is not less than four, and the lower end of the air nozzles 31 is in communication with the air chamber 26 after penetrating through the air disc 25.

[0059] After the air pump 27 is started, air flows into the moving pipe 28 through the curved pipe 30 and flows into the air chamber 26, and since the upper end of the air disc 25 is arranged with not less than four air nozzles 31 in an equiangular array in the circumferential direction, the air can be uniformly sprayed upward through the air nozzles 31. The moving pipe 28 is in sliding connection with the slide rails 33 through the pipe support 29, and when the buffer mechanism 14 drives the wind shield 15 to move, the moving pipe 28 can slide synchronously along the dynamic sealing interface of the curved pipe 30, so as to ensure that the air supply is not interrupted; the arrangement of the air chamber 26 can balance the air pressure, so as to avoid uneven air flow speed at the air nozzles 31, thereby forming a stable supporting air film below the silicon wafer 1.

[0060] In order to drive the air disc 25 and the wind shield 15 to move, so as to realize that the two wind shields 15 are buckled together to form a cylindrical space, the following features are further arranged:

[0061] The buffer mechanism 14 further comprises an air cylinder 32 fixedly arranged at the upper end of the workbench 3, and the side of the wind shield 15 close to the air cylinder 32 is fixedly connected with a supporting plate 34 (as shown in Figure 1 Fig. 3), the output end of the air cylinder 32 is fixedly connected with the supporting plate 34, and the lower end of the air disc 25 is in sliding connection with the two slide rails 33. When the output end of the air cylinder 32 pushes the supporting plate 34, the supporting plate 34 drives the wind shield 15 to slide along the slide rails 33, and the lower end of the air disc 25 is in sliding connection with the slide rails 33 to ensure the stability of movement. The air cylinders 32 of the two sets of buffer mechanisms 14 act synchronously, so that the wind shield 15 and the wind shield 15, and the air disc 25 and the air disc 25 gradually abut against each other to form a complete cylindrical space.

[0062] In order to limit the moving range of the wind shield 15 and the air disc 25, and ensure that the wind shield 15 and the air disc 25 can abut tightly after moving, the following features are further arranged:

[0063] The two sides of one wind shield 15 are provided with a pressure block 16 (as shown in Figure 2As shown, pressure sensors 17 are installed on both sides of another fan cover 15. When the two fan covers 15 approach each other, the output end of the pressure sensor 17 abuts against the pressure block 16. During the process of the two fan covers 15 approaching each other, the pressure block 16 gradually contacts the pressure sensor 17. When the pressure sensor 17 detects a preset pressure value, it transmits this signal to the controller. The controller then controls the cylinder 32 to stop operating, ensuring that the fan cover 15 closes accurately. The positions of the pressure block 16 and the pressure sensor 17 are correspondingly set, which can provide real-time feedback on the closing status of the fan cover 15, avoiding incomplete closure due to mechanical errors, and ensuring the sealing of the cylindrical space and the airflow buffering effect.

[0064] To ensure a good seal between the wind shields 15 and between the air plates 25, the following features are specifically provided:

[0065] The wind shield 15 and the air plate 25 are respectively provided with rubber strips 18 on the side near the center of the clearance hole 4 (e.g. Figure 5 As shown), the shape of the rubber strip 18 is the same as the cross-section of the wind shield 15 and the air plate 25 (as shown). Figure 7 (As shown). When the shroud 15 and the air plate 25 are closed, the rubber strip 18 abuts against the corresponding rubber strip 18 on the opposite side. Since the shape of the rubber strip 18 is the same as the cross-section of the shroud 15 and the air plate 25, an annular sealing structure can be formed to prevent airflow from leaking out from the connection. The rubber strip 18 is made of elastic silicone material, which can compensate for component processing errors, ensure sealing reliability, and avoid structural damage caused by rigid collisions.

[0066] To prevent the silicon wafer 1 from rigidly colliding with the inner wall of the shroud 15, the following features are specifically provided:

[0067] The inner wall of the wind shield 15 is provided with anti-collision strips 19 arranged in an evenly spaced array (such as... Figure 5 (As shown). When the silicon wafer 1 is suspended inside the wind shield 15, if it comes into contact with the inner wall of the wind shield 15 due to airflow fluctuations, the anti-collision strip 19 can absorb the collision energy. The anti-collision strip 19 is made of low-hardness polyurethane material and is arranged in an equidistant array on the inner wall of the wind shield 15. It can evenly distribute the collision force and prevent the edge of the silicon wafer 1 from cracking due to local impact. At the same time, its smooth surface design can reduce the risk of scratches on the surface of the silicon wafer 1.

[0068] In order to enable the opening and closing of the through vent 20, and thus control the air leakage of the two hoods 15, the following features are specifically designed:

[0069] Multiple through-holes 20 are formed on the outer wall of the shroud 15 (e.g. Figure 7 As shown), the number of through-holes 20 is even and not less than two. A disc base 21 corresponding to the through-holes 20 is fixedly connected to the outer wall of the hood 15. The disc base 21 is coaxially arranged with the through-holes 20. A turntable 22 (as shown) is rotatably arranged in the middle of the disc base 21.Figure 8 The upper end of the rotating disc 22 is fixedly connected with a rotating rod 24, and the rotating rod 24 is rotationally connected with the upper end of the disc seat 21.

[0070] The rotating disc 22 is externally sleeved with two sealing rings 23, and the sealing rings 23 are in interference connection with the inner wall of the disc seat 21.

[0071] When it is necessary to adjust the air leakage amount of the two air hoods 15, the rotating rod 24 is rotated to drive the rotating disc 22 to rotate in the disc seat 21, and the sealing ring 23 between the rotating disc 22 and the disc seat 21 can ensure the sealing property during rotation. The rotating angle of the rotating disc 22 determines the opening area of the through air hole 20, thereby controlling the air leakage amount; the disc seat 21 is coaxially arranged with the through air hole 20, thereby ensuring the uniform air flow discharge, and the air flow pressure in the two air hoods 15 can be changed by adjusting the air leakage amount, so as to adapt to the suspension requirement of the silicon wafer 1 with different thicknesses.

[0072] In order to supplement the specific structure of the limiting mechanism 35, so that the flexible claw 36 can be deflected and avoid the silicon wafer 1 when the subsequent grabbing device takes out the silicon wafer 1 from the two air hoods 15, the following features are further provided:

[0073] The outer wall of the two air hoods 15 is fixedly connected with a claw seat 38 (as shown in Figure 7 The claw seat 38 is provided above with an electric push rod 39 fixedly connected with the top of the air hood 15, and the output end of the electric push rod 39 is fixedly connected with a guide shaft 40 in sliding connection with the claw seat 38.

[0074] The middle part of the flexible claw 36 is fixedly inserted with a claw rod 37 (as shown in Figure 6 The inside of the claw seat 38 is slidingly provided with a rack 41 fixedly connected with the lower end of the guide shaft 40, the side of the rack 41 is rotationally provided with a main gear 42 engaged with the rack 41, and the side of the main gear 42 is rotationally provided with two secondary gears 43 engaged with the main gear 42, and the two secondary gears 43 are coaxially fixedly connected with the end of the claw rod 37 away from the flexible claw 36.

[0075] When the subsequent grabbing device approaches the silicon wafer 1, the electric push rod 39 drives the guide shaft 40 to move downward, the rack 41 at the lower end of the guide shaft 40 drives the main gear 42 to rotate, the main gear 42 drives the claw rod 37 to rotate through the engaged secondary gears 43, so that the flexible claw 36 is deflected to the outside of the air hood 15, and space is left for the grabbing device. When the grabbing device leaves, the electric push rod 39 resets, and the flexible claw 36 returns to the limiting state; the transmission ratio of the rack 41, the main gear 42 and the secondary gear 43 can ensure that the two flexible claws 36 are synchronously deflected, so as to avoid the silicon wafer 1 from being deviated due to the asynchronous action.

[0076] The working principle of the device is as follows: firstly, a plurality of silicon wafers 1 are placed on the rubber pad 6 of the clamp 5, and the clamp 5 is connected to the jacking mechanism 13 through the center-holding mechanism 7. After the jacking mechanism 13 is started, the clamp 5 and the silicon wafers 1 are moved upward, and at this time, the upper end of the limiting rubber rod 9 abuts against the lower end of the workbench 3, and under the action of the tension spring 10 and the telescopic guide rod 11, the limiting rubber rod 9 protects the silicon wafers 1 in the stacked state in a ring shape. The Bernoulli chuck 2 moves from top to bottom to the upper side of the avoiding hole 4, penetrates through the avoiding hole 4 downward, and uses air flow negative pressure to non-contact adsorb the topmost silicon wafer 1, and then moves upward to complete the wafer separation.

[0077] During the upward movement of the silicon wafers 1, the air cylinders 32 of the two sets of buffer mechanisms 14 push the wind cover 15 to move along the slide rail 33 until the wind cover 15 abuts against the wind cover 15 and the air disc 25 abuts against the air disc 25, forming a cylindrical space. The air pump 27 supplies air to the air chamber 26 of the air disc 25 through the curved pipe 30 and the moving pipe 28, and the air flow is injected from bottom to top through the air nozzle 31, forming a supporting air film under the silicon wafers 1, so that the silicon wafers 1 are suspended in the wind cover 15. At this time, the electric push rod 39 of the limiting mechanism 35 drives the guide shaft 40 to move downward, and the flexible claw 36 abuts against the upper end of the silicon wafers 1 through the rack 41 gear transmission, limiting the upward displacement of the silicon wafers 1, and avoiding the disengagement of the wind cover 15.

[0078] When the subsequent grabbing device approaches, the electric push rod 39 drives the flexible claw 36 to deflect and avoid, and the grabbing device penetrates into the wind cover 15 to adsorb the silicon wafers 1. At the same time, the air pump 27 stops supplying air, the wind cover 15 is opened under the action of the air cylinder 32, the grabbing device carries the silicon wafers 1 away, and the feeding is completed. During the whole process, the touch pressure block 16 and the touch pressure sensor 17 monitor the closed state of the wind cover 15 in real time, the rubber strip 18 and the anti-collision strip 19 ensure the sealing and buffering, and the lossless wafer separation and accurate feeding of the silicon wafers 1 are realized.

[0079] The above embodiments only express one or several embodiments of the present application, and the description is more specific and detailed, but it cannot be understood as a limitation on the scope of the patent of the present application. It should be noted that for ordinary skilled persons in the art, without departing from the concept of the present application, a number of modifications and improvements can be made, which all belong to the protection scope of the present application. Therefore, the protection scope of the patent of the present application should be subject to the appended claims.

Claims

1. An automatic silicon wafer sewing and feeding device, characterized in that, include: A worktable (3) with a clearance hole (4) in the middle is formed. Two slide rails (33) are fixed to the upper end of the worktable (3). A Bernoulli suction cup (2) is movably arranged above the worktable (3). A clamp (5) is arranged in the lower middle part of the worktable (3) to clamp the stacked silicon wafers (1). A lifting mechanism (13) is arranged at the lower end of the clamp (5). Two sets of buffer mechanisms (14) are provided on the upper end of the workbench (3). The buffer mechanism (14) includes a wind hood (15) that is slidably set above the workbench (3). An air disk (25) is fixedly connected to the lower end of the wind hood (15). The wind hoods (15) in the two sets of buffer mechanisms (14) abut against each other to form a cylindrical space. The two air disks (25) provide airflow to the cylindrical space from bottom to top. Each wind shield (15) is provided with a limit mechanism (35) on its upper part, and the limit mechanism (35) includes an angle-adjustable flexible claw (36).

2. The automatic silicon wafer sewing and feeding device according to claim 1, characterized in that, The clamp (5) includes a central clamping mechanism (7), the fixed end of the central clamping mechanism (7) is fixedly connected to the output end of the lifting mechanism (13), and the upper end of the central clamping mechanism (7) is fixedly connected to a plastic tray (6) for supporting the silicon wafer (1). The output end of the center clamping mechanism (7) is fixedly connected to a positioning block (8), and the positioning block (8) is adjustablely provided with a limiting rubber rod (9) for positioning the edge of the silicon wafer (1).

3. The automatic silicon wafer sewing and feeding device according to claim 2, characterized in that, A tension spring (10) is provided at the lower end of the positioning block (8). The tension spring (10) is sleeved on the outside of the limiting rubber rod (9). A guide plate (12) is fixedly connected to the lower end of the limiting rubber rod (9). One end of the tension spring (10) is fixedly connected to the positioning block (8), and the other end is fixedly connected to the guide plate (12). Telescopic guide rods (11) are provided on both sides of the limiting rubber rod (9). One end of the telescopic guide rod (11) is fixedly connected to the positioning block (8), and the other end is fixedly connected to the guide plate (12).

4. The automatic silicon wafer sewing and feeding device according to claim 1, characterized in that, An air chamber (26) is provided in the middle of the air plate (25), and a moving pipe (28) connected to the air chamber (26) is fixed in the middle. The buffer mechanism (14) also includes an air pump (27) provided in the lower part of the workbench (3). A curved pipe (30) is provided at the upper end of the air pump (27) and fixed to the workbench (3) through a pipe seat. One end of the curved pipe (30) is connected to the output end of the air pump (27), and the other end is dynamically sealed to the moving pipe (28). The moving tube (28) is slidably connected to two slide rails (33) through the tube frame (29). The upper end of the air plate (25) has air nozzles (31) arranged at equal angles along the circumference. The number of air nozzles (31) is not less than four. The lower end of the air nozzles (31) passes through the air plate (25) and communicates with the air chamber (26).

5. The automatic silicon wafer sewing and feeding device according to claim 1, characterized in that, The buffer mechanism (14) also includes a cylinder (32) fixedly installed on the upper end of the workbench (3), a support plate (34) fixedly connected to the side of the hood (15) near the cylinder (32), the output end of the cylinder (32) fixedly connected to the support plate (34), and the lower end of the air plate (25) slidably connected to two slide rails (33).

6. The automatic silicon wafer sewing and feeding device according to claim 1, characterized in that, A pressure block (16) is provided on both sides of one hood (15), and a pressure sensor (17) is provided on both sides of the other hood (15). When the two hoods (15) are close to each other, the output end of the pressure sensor (17) abuts against the pressure block (16).

7. The automatic silicon wafer sewing and feeding device according to claim 1, characterized in that, The wind shield (15) and the air plate (25) are respectively provided with rubber strips (18) on the side near the center of the clearance hole (4). The shape of the rubber strips (18) is the same as the cross section of the wind shield (15) and the air plate (25).

8. The automatic silicon wafer sewing and feeding device according to claim 1, characterized in that, The inner wall of the wind shield (15) is provided with anti-collision strips (19) arranged at equal angles.

9. The automatic silicon wafer sewing and feeding device according to claim 1, characterized in that, The outer wall of the hood (15) is formed with a plurality of through air holes (20). The number of through air holes (20) is even and not less than two. The outer wall of the hood (15) is fixedly connected with a plate seat (21) corresponding to the through air holes (20). The plate seat (21) and the through air holes (20) are arranged on the same axis. A turntable (22) is rotatably arranged in the middle of the plate seat (21). A rotating rod (24) is fixedly connected to the upper end of the turntable (22). The rotating rod (24) is rotatably connected to the upper end of the plate seat (21). Two sealing rings (23) are fitted on the outside of the turntable (22), and the sealing rings (23) are interference-fitted with the inner wall of the disc base (21).

10. The automatic silicon wafer sewing and feeding device according to claim 1, characterized in that, A claw seat (38) is fixedly connected to the outer wall of the two wind shrouds 15. An electric push rod (39) is fixedly connected to the top of the wind shroud (15) above the claw seat (38). A guide shaft (40) is fixedly connected to the output end of the electric push rod (39) and is slidably connected to the claw seat (38). A claw rod (37) is fixedly inserted in the middle of the flexible claw (36). A rack (41) is slidably arranged inside the claw seat (38) and fixed to the lower end of the guide shaft (40). A main gear (42) that meshes with the rack (41) is rotatably arranged on the side of the rack (41). Two auxiliary gears (43) are rotatably arranged on the side of the main gear (42). The auxiliary gears (43) mesh with the main gear (42). The two auxiliary gears (43) are coaxially fixed to the end of the claw rod (37) away from the flexible claw (36).

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