Automatic alignment and synchronous detection method for double-sided inkjet circuit of ceramic circuit board

Abstract

The application discloses a kind of automatic alignment and synchronous detection method of ceramic circuit board double-sided inkjet line, belong to ceramic circuit board technical field, comprising: ceramic circuit board surface is scanned by laser, and ceramic circuit board positioning data is generated;Ceramic circuit board line pattern is compared based on ceramic circuit board positioning data, ceramic circuit board is fine-tuned by servo motor drive alignment platform, and automatic accurate alignment is realized;Ceramic circuit board is synchronously detected based on automatic optical detection, and the positioning classification result of ceramic circuit board defect is determined, and ceramic circuit board is maintained and managed and feedback optimization.The application solves the problem that existing ceramic circuit board double-sided inkjet line cannot be automatically aligned and synchronously detected, reduces product quality.The application can automatically align and synchronously detect ceramic circuit board double-sided inkjet line, can realize high-precision, high-efficiency ceramic circuit board manufacturing, reduce defect rate in production process, and improve product quality.

Description

Technical Field

[0001] This invention relates to the field of ceramic circuit board technology, specifically to an automatic alignment and synchronous detection method for double-sided inkjet lines on ceramic circuit boards. Background Technology

[0002] A ceramic circuit board includes a ceramic substrate and circuit units disposed on the ceramic substrate. Chinese Patent Publication No. CN117098324A discloses a method for manufacturing a ceramic circuit board. The ceramic circuit board includes a ceramic substrate and multiple circuit units disposed on the ceramic substrate, the circuit units being separated from each other. The manufacturing method includes the following steps: fabricating etch-resistant conductive leads on a first copper foil layer on the surface of the ceramic substrate, the conductive leads being used to form electrical connections between the multiple circuit units; performing patterned electroplating on the first copper foil layer to obtain a second copper foil layer matching the multiple circuit units, the thickness of the second copper foil layer being greater than the thickness of the first copper foil layer; etching the first copper foil layer to obtain multiple circuit units; electroplating a metal protective layer on the surface and sidewalls of the circuit units; and disconnecting the conductive leads between the multiple circuit units to block the electrical connections between them. This method can obtain circuit units with better pattern accuracy on the ceramic substrate, and the sidewalls of the circuit units can also be effectively protected. However, this patent has the following drawbacks:

[0003] Existing technologies cannot automatically align and synchronously inspect double-sided inkjet-printed circuits on ceramic circuit boards, thus failing to achieve high-precision and high-efficiency ceramic circuit board manufacturing. Furthermore, they increase the defect rate during the production process and reduce product quality. Summary of the Invention

[0004] The purpose of this invention is to provide an automatic alignment and synchronous detection method for double-sided inkjet printing lines on ceramic circuit boards. This method can automatically align and synchronously detect double-sided inkjet printing lines on ceramic circuit boards, enabling high-precision and high-efficiency manufacturing of ceramic circuit boards, reducing the defect rate in the production process, and improving product quality, thus solving the problems mentioned in the background art.

[0005] To achieve the above objectives, the present invention provides the following technical solution:

[0006] An automatic alignment and synchronous detection method for double-sided inkjet printing lines on ceramic circuit boards includes:

[0007] Laser scanning is performed on the surface of the ceramic circuit board to generate positioning data for the ceramic circuit board;

[0008] The circuit diagram of the ceramic circuit board is compared based on the positioning data of the ceramic circuit board, and the alignment platform driven by the servo motor is used to fine-tune the ceramic circuit board to achieve automatic and accurate alignment.

[0009] The ceramic circuit board is simultaneously inspected using automated optical inspection to determine the location and classification of defects, and to perform maintenance management and feedback optimization.

[0010] Preferably, the circuit pattern of the ceramic circuit board is compared based on the positioning data of the ceramic circuit board, including:

[0011] A high-precision laser scanner is used to scan the surface of a ceramic circuit board to obtain reference points or feature patterns on the surface of the ceramic circuit board, thereby generating accurate positioning data for the ceramic circuit board.

[0012] Real-time monitoring of inkjet lines on the surface of ceramic circuit boards is performed using a high-resolution CCD camera to collect data on the inkjet lines of ceramic circuit boards.

[0013] Based on the positioning data of the ceramic circuit board, the inkjet circuit data of the ceramic circuit board is compared, analyzed and identified. By identifying the reference points or feature patterns on the surface of the ceramic circuit board, the automatic alignment result of the double-sided inkjet circuit of the ceramic circuit board is determined.

[0014] Preferably, the automatic alignment result of the double-sided inkjet lines on the ceramic circuit board is determined by identifying reference points or feature patterns on the surface of the ceramic circuit board, including:

[0015] Feature matching based on a calibration board is performed on the high-resolution CCD camera and high-precision laser scanner in advance, and the initial mapping relationship between the ceramic circuit board positioning data and the ceramic circuit board inkjet line data is determined based on the feature matching results.

[0016] Based on the mapping relationship, the inkjet line data of the ceramic circuit board is projected onto the positioning data of the ceramic circuit board to obtain the projected line data. Sampling coordinate data that matches the reference point or feature pattern is retrieved from the projected line data to obtain the projection position relationship between the sampling coordinate data. The position offset between the projection position relationship and the camera position relationship determined by the inkjet line data of the ceramic circuit board is determined.

[0017] Based on the above method, the position offsets corresponding to multiple frames of data on the surface of the ceramic circuit board are determined respectively. The horizontal offset and the vertical offset are determined from the position offsets. Combined with the frame features, the horizontal offset sequence and the vertical offset sequence are obtained.

[0018] Determine whether the trends of the horizontal offset sequence and the vertical offset sequence are regular and identical;

[0019] If so, determine the correction coefficient for the initial mapping relationship based on the pattern of the sequence trend;

[0020] Otherwise, a correction coefficient for the initial mapping relationship is determined based on the average horizontal offset and average vertical offset of the horizontal offset sequence and the vertical offset sequence;

[0021] The initial mapping relationship is corrected based on the correction coefficient to obtain the target mapping relationship;

[0022] Based on the target mapping relationship, and combined with the reference point or feature pattern, the positioning data of the ceramic circuit board and the inkjet circuit data of the ceramic circuit board are matched to determine the automatic alignment result of the double-sided inkjet circuit of the ceramic circuit board.

[0023] Preferably, the inkjet circuit data of the ceramic circuit board is compared, analyzed, and identified based on the positioning data of the ceramic circuit board, including:

[0024] When the inkjet circuit data of the ceramic circuit board is within the positioning data range of the ceramic circuit board, the automatic alignment result of the double-sided inkjet circuit of the ceramic circuit board is that the double-sided inkjet circuit of the ceramic circuit board has been automatically and accurately aligned.

[0025] When the inkjet printing line data of the ceramic circuit board is not within the positioning data range of the ceramic circuit board, the automatic alignment result of the double-sided inkjet printing line of the ceramic circuit board is that the double-sided inkjet printing line of the ceramic circuit board is not automatically and accurately aligned. At this time, the ceramic circuit board alignment platform is moved by the servo motor to make fine adjustments to the ceramic circuit board in order to achieve automatic and accurate alignment of the double-sided inkjet printing line of the ceramic circuit board.

[0026] Preferably, fine-tuning the ceramic circuit board includes:

[0027] The positioning holes on the ceramic circuit board are detected by a high-precision camera, and the center coordinates of the positioning holes on the ceramic circuit board are extracted by an image processing algorithm.

[0028] Based on the center coordinates of the positioning holes on the ceramic circuit board, calculate the direction and distance that the ceramic circuit board alignment platform needs to move, and determine the real-time deviation information.

[0029] The real-time deviation information is sent to the servo driver, which then sends control signals to the servo motor and feeds back the real-time deviation information. The servo motor dynamically adjusts the alignment parameters, driving the ceramic circuit board alignment platform to move precisely to the target position, enabling it to fine-tune the ceramic circuit board and form a closed-loop control.

[0030] After the ceramic circuit board is aligned, it is fixed on the ceramic circuit board alignment platform by a fixture or vacuum adsorption device to ensure that the ceramic circuit board is in a stable position during the printing process.

[0031] Preferably, synchronous inspection of ceramic circuit boards based on automated optical inspection includes:

[0032] Based on automatic optical inspection, a high-resolution CCD camera is used to monitor the double-sided inkjet lines of the ceramic circuit board in real time and collect real-time image data of the ceramic circuit board.

[0033] Preprocess the real-time image data of the ceramic circuit board to determine the characteristic image data of the ceramic circuit board;

[0034] Based on deep learning technology, a ceramic circuit board defect localization and classification model is constructed. The feature image data of the ceramic circuit board is input into the ceramic circuit board defect localization and classification model. The feature image data of the ceramic circuit board is analyzed and identified according to the ceramic circuit board defect localization and classification model, and the ceramic circuit board is detected simultaneously to determine the ceramic circuit board defect localization and classification result.

[0035] The results of defect location and classification on ceramic circuit boards are recorded in the database to provide a basis for subsequent processing.

[0036] Preferably, the defect location and classification results of the ceramic circuit board include the location and type information of the ceramic circuit board defect; when a defect is detected in the ceramic circuit board, the defect is automatically marked and an alarm is triggered, and a maintenance and management plan for the ceramic circuit board is promptly formulated to guide operators in maintaining and managing the defective ceramic circuit board.

[0037] Preferably, the defect type information of the ceramic circuit board includes broken wires, short circuits, misalignment, and uneven ink droplets;

[0038] For ceramic circuit board defects such as broken lines or uneven ink droplets, corrections are made by manually adding ink or reprinting. In addition, piezoelectric inkjet printheads are used to precisely control the ink droplet ejection frequency and position to achieve high-resolution line printing and optimize the printing path to achieve consistent printed lines.

[0039] For defects in ceramic circuit boards such as short circuits or misalignment, local repairs are performed using robotic arms or robots. After maintenance and management, the ceramic circuit boards are subjected to automatic optical inspection again. The effectiveness of the maintenance and management is verified based on the inspection results, and the maintenance and management plan is optimized based on the feedback from the inspection results, so that the defects in the ceramic circuit boards are completely resolved.

[0040] Preferably, the real-time image data of the ceramic circuit board is preprocessed, including:

[0041] Denoising of real-time image data of ceramic circuit boards is performed based on Gaussian filtering to remove Gaussian noise from the real-time image data of ceramic circuit boards while preserving edge information.

[0042] Histogram equalization is used to enhance the contrast of real-time image data of ceramic circuit boards, thereby improving the image contrast and highlighting the details on the ceramic circuit boards.

[0043] Furthermore, non-critical areas of the real-time image data of the ceramic circuit board are cropped out, and the images in the real-time image data of the ceramic circuit board are scaled to a specific resolution, and the color images are converted into grayscale images.

[0044] By setting a threshold, the image in the real-time image data of the ceramic circuit board is segmented into foreground and background. The boundary information of the ceramic circuit board is extracted using the Canny operator, and key features in the real-time image data of the ceramic circuit board are extracted to determine the feature image data of the ceramic circuit board.

[0045] Preferably, the displacement deviation and scaling deviation are obtained from the real-time deviation information;

[0046] Design a nozzle coordinate offset that is opposite to the displacement deviation as a coordinate adjustment parameter;

[0047] The line spacing deviation and line length deviation are obtained from the scaling deviation, and the adjustment amount of the nozzle speed is calculated based on the line spacing deviation and line length deviation.

[0048] Obtain the second line spacing deviation under the adjusted nozzle speed, and calculate the adjustment amount of the nozzle pulse frequency;

[0049] The servo motor dynamically adjusts the alignment parameters based on the coordinate adjustment parameters, the adjustment amount of the nozzle speed, and the adjustment amount of the nozzle pulse frequency.

[0050] Compared with the prior art, the beneficial effects of the present invention are:

[0051] 1. This invention uses a high-precision laser scanner to scan the surface of a ceramic circuit board, obtaining reference points or feature patterns on the surface to generate accurate positioning data. A high-resolution CCD camera monitors the inkjet lines on the ceramic circuit board in real time, collecting inkjet line data. Based on the positioning data, the inkjet line data is compared, analyzed, and identified. By identifying the reference points or feature patterns on the surface of the ceramic circuit board, the automatic alignment result of the double-sided inkjet lines is determined. Furthermore, a servo motor drives the alignment platform to move, fine-tuning the ceramic circuit board to achieve automatic and precise alignment of the double-sided inkjet lines.

[0052] 2. This invention is based on automatic optical inspection. It uses a high-resolution CCD camera to monitor the double-sided inkjet lines of ceramic circuit boards in real time, acquiring real-time image data of the ceramic circuit boards. The real-time image data of the ceramic circuit boards is preprocessed to determine the characteristic image data of the ceramic circuit boards. Based on deep learning technology, a defect location and classification model of ceramic circuit boards is constructed. The characteristic image data of ceramic circuit boards is analyzed and identified according to the defect location and classification model, and the ceramic circuit boards are detected simultaneously to determine the defect location and classification results. When a defect is detected simultaneously, the defect is automatically marked and an alarm is triggered. A maintenance and management plan for the ceramic circuit boards is promptly formulated to guide operators in maintaining and managing defective ceramic circuit boards. It can automatically align and synchronously detect the double-sided inkjet lines of ceramic circuit boards, achieving high-precision and high-efficiency ceramic circuit board manufacturing, reducing the defect rate in the production process, and improving product quality. Attached Figure Description

[0053] Figure 1 This is a flowchart of the automatic alignment and synchronous detection method for double-sided inkjet circuits on ceramic circuit boards according to the present invention. Detailed Implementation

[0054] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0055] To address the current limitations of automatic alignment and synchronous inspection of double-sided inkjet printing lines on ceramic circuit boards, which hinders high-precision and high-efficiency ceramic circuit board manufacturing and increases defect rates and reduces product quality, please refer to [link to relevant documentation]. Figure 1 This embodiment provides the following technical solution:

[0056] Example 1

[0057] An automatic alignment and synchronous detection method for double-sided inkjet printing lines on ceramic circuit boards includes:

[0058] Laser scanning is performed on the surface of the ceramic circuit board to generate positioning data for the ceramic circuit board;

[0059] The circuit diagram of the ceramic circuit board is compared based on the positioning data of the ceramic circuit board, and the alignment platform driven by the servo motor is used to fine-tune the ceramic circuit board to achieve automatic and accurate alignment.

[0060] In this embodiment, a high-precision laser scanner is used to scan the surface of the ceramic circuit board to obtain reference points or feature patterns on the surface of the ceramic circuit board, thereby generating accurate positioning data of the ceramic circuit board.

[0061] Real-time monitoring of inkjet lines on the surface of ceramic circuit boards is performed using a high-resolution CCD camera to collect data on the inkjet lines of ceramic circuit boards.

[0062] Based on the positioning data of the ceramic circuit board, the inkjet circuit data of the ceramic circuit board is compared, analyzed and identified. By identifying the reference points or feature patterns on the surface of the ceramic circuit board, the automatic alignment result of the double-sided inkjet circuit of the ceramic circuit board is determined.

[0063] When the inkjet circuit data of the ceramic circuit board is within the positioning data range of the ceramic circuit board, the automatic alignment result of the double-sided inkjet circuit of the ceramic circuit board is that the double-sided inkjet circuit of the ceramic circuit board has been automatically and accurately aligned.

[0064] When the inkjet line data of the ceramic circuit board is not within the positioning data range of the ceramic circuit board, the automatic alignment result of the double-sided inkjet line of the ceramic circuit board is that the double-sided inkjet line of the ceramic circuit board is not automatically and accurately aligned. At this time, the ceramic circuit board alignment platform is moved by the servo motor to make fine adjustments to the ceramic circuit board in order to achieve automatic and accurate alignment of the double-sided inkjet line of the ceramic circuit board.

[0065] In this embodiment, the automatic alignment result of the double-sided inkjet lines on the ceramic circuit board is determined by identifying reference points or feature patterns on the surface of the ceramic circuit board, including:

[0066] Feature matching based on a calibration board is performed on the high-resolution CCD camera and high-precision laser scanner in advance, and the initial mapping relationship between the ceramic circuit board positioning data and the ceramic circuit board inkjet line data is determined based on the feature matching results.

[0067] Based on the mapping relationship, the inkjet line data of the ceramic circuit board is projected onto the positioning data of the ceramic circuit board to obtain the projected line data. Sampling coordinate data that matches the reference point or feature pattern is retrieved from the projected line data to obtain the projection position relationship between the sampling coordinate data. The position offset between the projection position relationship and the camera position relationship determined by the inkjet line data of the ceramic circuit board is determined.

[0068] Based on the above method, the position offsets corresponding to multiple frames of data on the surface of the ceramic circuit board are determined respectively. The horizontal offset and the vertical offset are determined from the position offsets. Combined with the frame features, the horizontal offset sequence and the vertical offset sequence are obtained.

[0069] Determine whether the trends of the horizontal offset sequence and the vertical offset sequence are regular and identical;

[0070] If so, determine the correction coefficient for the initial mapping relationship based on the pattern of the sequence trend;

[0071] Otherwise, a correction coefficient for the initial mapping relationship is determined based on the average horizontal offset and average vertical offset of the horizontal offset sequence and the vertical offset sequence;

[0072] The initial mapping relationship is corrected based on the correction coefficient to obtain the target mapping relationship;

[0073] Based on the target mapping relationship, and combined with the reference point or feature pattern, the positioning data of the ceramic circuit board and the inkjet circuit data of the ceramic circuit board are matched to determine the automatic alignment result of the double-sided inkjet circuit of the ceramic circuit board.

[0074] In this embodiment, a high-precision calibration board (such as a checkerboard pattern plus corners / planes detectable by LiDAR) is specifically placed based on feature matching of the calibration board, and is simultaneously observed by the camera and LiDAR, thereby establishing the correspondence between the two and obtaining the initial mapping relationship.

[0075] In this embodiment, the sampled coordinate data that matches the reference point or feature pattern is retrieved from the projection line data. The sampled coordinate data is located at the location of the reference point or feature pattern or is very close to the reference point or feature pattern.

[0076] In this embodiment, the frame feature specifically refers to the temporal correlation between multiple frames of data.

[0077] In this embodiment, the trend of the horizontal offset sequence and the vertical offset sequence is, for example, gradually increasing or decreasing according to a specific offset, or the offset remains unchanged, while the size of the irregular offset changes irregularly.

[0078] The beneficial effects of the above design scheme are as follows: By performing feature matching based on a calibration board on a high-resolution CCD camera and a high-precision laser scanner in advance, the initial mapping relationship between the ceramic circuit board positioning data and the ceramic circuit board inkjet line data is determined according to the feature matching results, thus achieving preliminary mapping matching between the positioning data and the line data. Based on the projected line data, sampled coordinate data matching the reference point or feature pattern is retrieved, and the projected positional relationship between the sampled coordinate data is obtained. The positional offset between the projected positional relationship and the camera positional relationship determined by the ceramic circuit board inkjet line data is determined. Based on the positional offset and considering the combination of multiple frames of data, the initial mapping relationship is finally corrected to ensure the accuracy and stability of the obtained target mapping relationship. Ultimately, based on the target mapping relationship and combined with the reference point or feature pattern, the ceramic circuit board positioning data and the ceramic circuit board inkjet line data are matched to determine the accuracy of the automatic alignment result of the double-sided inkjet line of the ceramic circuit board, providing an accurate reference basis for the automatic alignment of the double-sided inkjet line of the ceramic circuit board during operation.

[0079] Example 2

[0080] In this embodiment, fine-tuning the ceramic circuit board includes:

[0081] The positioning holes on the ceramic circuit board are detected by a high-precision camera, and the center coordinates of the positioning holes on the ceramic circuit board are extracted by an image processing algorithm.

[0082] Based on the center coordinates of the positioning holes on the ceramic circuit board, calculate the direction and distance that the ceramic circuit board alignment platform needs to move, and determine the real-time deviation information.

[0083] The real-time deviation information is sent to the servo driver, which then sends control signals to the servo motor and feeds back the real-time deviation information. The servo motor dynamically adjusts the alignment parameters, driving the ceramic circuit board alignment platform to move precisely to the target position, enabling it to fine-tune the ceramic circuit board and form a closed-loop control.

[0084] After the ceramic circuit board is aligned, it is fixed on the ceramic circuit board alignment platform by a fixture or vacuum adsorption device to ensure that the ceramic circuit board is in a stable position during the printing process.

[0085] Specifically, the inkjet circuit data of the ceramic circuit board is compared, analyzed and identified based on the positioning data of the ceramic circuit board. The automatic alignment results of the double-sided inkjet circuit of the ceramic circuit board are shown in Table 1.

[0086] Table 1: Automatic Alignment Results of Double-Sided Inkjet Circuit Boards on Ceramic Circuit Boards

[0087]

[0088] Therefore, when the double-sided inkjet lines of a ceramic circuit board are not automatically and accurately aligned, a servo motor drives the alignment platform of the ceramic circuit board to move, so as to make fine adjustments to the ceramic circuit board and realize the automatic and accurate alignment of the double-sided inkjet lines of the ceramic circuit board. This can improve the manufacturing precision of the ceramic circuit board.

[0089] In one embodiment, a servo driver sends a control signal to a servo motor and provides real-time deviation information, allowing the servo motor to dynamically adjust its alignment parameters, including:

[0090] The displacement deviation and scaling deviation are obtained from the real-time deviation information;

[0091] Design a nozzle coordinate offset that is opposite to the displacement deviation as a coordinate adjustment parameter;

[0092] The line spacing deviation and line length deviation are obtained from the scaling deviation, and the adjustment amount of the nozzle speed is calculated based on the line spacing deviation and line length deviation.

[0093] The formula for calculating the nozzle speed adjustment amount H is as follows:

[0094]

[0095] Where V represents the current nozzle speed, C represents the reference constant, and ΔE represents the line spacing deviation. max Indicates the preset maximum line spacing deviation, ΔE min ΔR represents the preset minimum line spacing deviation, and ΔR represents the line length deviation. max Indicates the preset maximum line length deviation, ΔR min This indicates the preset minimum line length deviation;

[0096] Obtain the second line spacing deviation under the adjusted nozzle speed, and calculate the adjustment amount of the nozzle pulse frequency;

[0097] The formula for calculating the adjustment amount of the nozzle pulse frequency is as follows:

[0098]

[0099] Where K represents the adjustment amount of the nozzle pulse frequency, P represents the current nozzle pulse frequency, ΔE2 represents the second line spacing deviation, Δxy represents the nozzle coordinate offset, and Δxy0 represents the reference nozzle coordinate offset.

[0100] The servo motor dynamically adjusts the alignment parameters based on the coordinate adjustment parameters, the adjustment amount of the nozzle speed, and the adjustment amount of the nozzle pulse frequency.

[0101] In this embodiment, the scaling deviation is the dimensional scaling caused by thermal expansion and contraction of the substrate or material deformation, specifically the deviation in length and spacing.

[0102] In this embodiment, the nozzle speed affects the line spacing and line length, and the nozzle pulse frequency affects the line spacing deviation.

[0103] In this embodiment, the preset maximum line spacing deviation, preset minimum line spacing deviation, preset maximum line length deviation, and preset minimum line length deviation are preset based on actual conditions and equipment characteristics.

[0104] The beneficial effects of the above design scheme are as follows: By obtaining displacement deviation and scaling deviation from the real-time deviation information, a printhead coordinate offset opposite to the displacement deviation is designed as a coordinate adjustment parameter to eliminate the displacement deviation. The line spacing deviation and line length deviation are obtained from the scaling deviation. Based on the line spacing deviation and line length deviation, the adjustment amount of the printhead speed is calculated. The current printhead speed is considered in the calculation process, and a reference constant is added to make the calculation result more accurate. The second line spacing deviation under the adjusted printhead speed is obtained, and the adjustment amount of the printhead pulse frequency is calculated. The current printhead pulse frequency and the influence of the printhead coordinate offset error are considered in the calculation process to make the calculation result more accurate. Finally, the servo motor dynamically adjusts the alignment parameters to ensure the accuracy of the ceramic circuit board and the precise alignment of the double-sided inkjet lines of the ceramic circuit board during operation.

[0105] Example 3

[0106] The ceramic circuit board is simultaneously inspected using automated optical inspection to determine the defect location and classification results, and to perform maintenance management and feedback optimization.

[0107] In this embodiment, synchronous inspection of the ceramic circuit board based on automatic optical inspection includes:

[0108] Based on automatic optical inspection, a high-resolution CCD camera is used to monitor the double-sided inkjet lines of the ceramic circuit board in real time and collect real-time image data of the ceramic circuit board.

[0109] Preprocess the real-time image data of the ceramic circuit board to determine the characteristic image data of the ceramic circuit board;

[0110] In this embodiment, the real-time image data of the ceramic circuit board is preprocessed, including:

[0111] Denoising of real-time image data of ceramic circuit boards is performed based on Gaussian filtering to remove Gaussian noise from the real-time image data of ceramic circuit boards while preserving edge information.

[0112] Histogram equalization is used to enhance the contrast of real-time image data of ceramic circuit boards, thereby improving the image contrast and highlighting the details on the ceramic circuit boards.

[0113] Furthermore, non-critical areas of the real-time image data of the ceramic circuit board are cropped out, and the images in the real-time image data of the ceramic circuit board are scaled to a specific resolution, and the color images are converted into grayscale images.

[0114] By setting a threshold, the image in the real-time image data of the ceramic circuit board is segmented into foreground and background. The boundary information of the ceramic circuit board is extracted using the Canny operator, and key features in the real-time image data of the ceramic circuit board are extracted to determine the feature image data of the ceramic circuit board.

[0115] Based on deep learning technology, a ceramic circuit board defect localization and classification model is constructed. The feature image data of the ceramic circuit board is input into the ceramic circuit board defect localization and classification model. The ceramic circuit board feature image data is analyzed and identified according to the ceramic circuit board defect localization and classification model, and the ceramic circuit board is detected simultaneously. The ceramic circuit board defect localization and classification results are determined and recorded in the database to provide a basis for subsequent processing.

[0116] In this embodiment, the ceramic circuit board defect location and classification results include the location and type information of the ceramic circuit board defect; when a defect is detected in the ceramic circuit board, the defect is automatically marked and an alarm is triggered, and a maintenance and management plan for the ceramic circuit board is promptly formulated to guide operators in maintaining and managing the defective ceramic circuit board.

[0117] In this embodiment, the defect type information of the ceramic circuit board includes broken wires, short circuits, offsets, and uneven ink droplets;

[0118] For ceramic circuit board defects such as broken lines or uneven ink droplets, corrections are made by manually adding ink or reprinting. In addition, piezoelectric inkjet printheads are used to precisely control the ink droplet ejection frequency and position to achieve high-resolution line printing and optimize the printing path to achieve consistent printed lines.

[0119] For defects in ceramic circuit boards such as short circuits or misalignment, local repairs can be performed using robotic arms or robots;

[0120] Furthermore, the ceramic circuit boards are subjected to automatic optical inspection again after maintenance and management. The effectiveness of the maintenance and management of the ceramic circuit boards is verified based on the inspection results, and the maintenance and management plan of the ceramic circuit boards is optimized based on the feedback of the inspection results, so that the defects of the ceramic circuit boards are completely resolved.

[0121] In summary, this technology enables automatic alignment and synchronous inspection of double-sided inkjet printing lines on ceramic circuit boards, achieving high-precision and high-efficiency ceramic circuit board manufacturing, reducing the defect rate in the production process, and improving product quality.

[0122] It should be noted that, in this document, relational terms such as "first" and "second" are used only to distinguish one entity or operation from another, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Furthermore, the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such process, method, article, or apparatus.

[0123] Although embodiments of the invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the invention, the scope of which is defined by the appended claims and their equivalents.

Claims

1. An automatic alignment and synchronous detection method for double-sided inkjet printing lines on ceramic circuit boards, characterized in that, include: Laser scanning is performed on the surface of the ceramic circuit board to generate positioning data for the ceramic circuit board; The circuit diagram of the ceramic circuit board is compared based on the positioning data of the ceramic circuit board, and the alignment platform driven by the servo motor is used to fine-tune the ceramic circuit board to achieve automatic and accurate alignment. Among them, the servo driver sends control signals to the servo motor and feeds back real-time deviation information, and the servo motor dynamically adjusts the alignment parameters based on the coordinate adjustment parameters, the adjustment amount of the nozzle speed and the adjustment amount of the nozzle pulse frequency. The ceramic circuit board is simultaneously inspected using automatic optical inspection to determine the defect location and classification results, and to perform maintenance management and feedback optimization on the ceramic circuit board. The circuit patterns of ceramic circuit boards are compared based on the positioning data of the ceramic circuit boards, including: A high-precision laser scanner is used to scan the surface of a ceramic circuit board to obtain reference points or feature patterns on the surface of the ceramic circuit board, thereby generating accurate positioning data for the ceramic circuit board. Real-time monitoring of inkjet lines on the surface of ceramic circuit boards is performed using a high-resolution CCD camera to collect data on the inkjet lines of ceramic circuit boards. Based on the positioning data of the ceramic circuit board, the inkjet circuit data of the ceramic circuit board is compared, analyzed, and identified. By identifying the reference points or feature patterns on the surface of the ceramic circuit board, the automatic alignment result of the double-sided inkjet circuit of the ceramic circuit board is determined, including: Feature matching based on a calibration board is performed on the high-resolution CCD camera and high-precision laser scanner in advance, and the initial mapping relationship between the ceramic circuit board positioning data and the ceramic circuit board inkjet line data is determined based on the feature matching results. Based on the mapping relationship, the inkjet line data of the ceramic circuit board is projected onto the positioning data of the ceramic circuit board to obtain the projected line data. Sampling coordinate data that matches the reference point or feature pattern is retrieved from the projected line data to obtain the projection position relationship between the sampling coordinate data. The position offset between the projection position relationship and the camera position relationship determined by the inkjet line data of the ceramic circuit board is determined. Based on the above method, the position offsets corresponding to multiple frames of data on the surface of the ceramic circuit board are determined respectively. The horizontal offset and the vertical offset are determined from the position offsets. Combined with the frame features, the horizontal offset sequence and the vertical offset sequence are obtained. Determine whether the trends of the horizontal offset sequence and the vertical offset sequence are regular and identical; If so, determine the correction coefficient for the initial mapping relationship based on the pattern of the sequence trend; Otherwise, the correction coefficients for the initial mapping relationship are determined based on the average horizontal offset and average vertical offset of the horizontal offset sequence and the vertical offset sequence; The initial mapping relationship is corrected based on the correction coefficient to obtain the target mapping relationship; Based on the target mapping relationship, and combined with the reference point or feature pattern, the positioning data of the ceramic circuit board and the inkjet circuit data of the ceramic circuit board are matched to determine the automatic alignment result of the double-sided inkjet circuit of the ceramic circuit board.

2. The automatic alignment and synchronous detection method for double-sided inkjet circuitry on ceramic circuit boards as described in claim 1, characterized in that, Fine-tuning the ceramic circuit board includes: The positioning holes on the ceramic circuit board are detected by a high-precision camera, and the center coordinates of the positioning holes on the ceramic circuit board are extracted by an image processing algorithm. Based on the center coordinates of the positioning holes on the ceramic circuit board, calculate the direction and distance that the ceramic circuit board alignment platform needs to move, and determine the real-time deviation information. The real-time deviation information is sent to the servo driver, which then sends control signals to the servo motor and feeds back the real-time deviation information. The servo motor dynamically adjusts the alignment parameters, driving the ceramic circuit board alignment platform to move precisely to the target position, enabling it to fine-tune the ceramic circuit board and form a closed-loop control. After the ceramic circuit board is aligned, it is fixed on the ceramic circuit board alignment platform by a clamp or vacuum adsorption device to ensure that the ceramic circuit board is in a stable position during the printing process.

3. The automatic alignment and synchronous detection method for double-sided inkjet circuitry on ceramic circuit boards as described in claim 1, characterized in that, The servo motor dynamically adjusts its alignment parameters by sending control signals to the servo driver and providing real-time deviation information. The displacement deviation and scaling deviation are obtained from the real-time deviation information; Design a nozzle coordinate offset that is opposite to the displacement deviation as a coordinate adjustment parameter; The line spacing deviation and line length deviation are obtained from the scaling deviation, and the adjustment amount of the nozzle speed is calculated based on the line spacing deviation and line length deviation. Obtain the second line spacing deviation under the adjusted nozzle speed, and calculate the adjustment amount of the nozzle pulse frequency; The servo motor dynamically adjusts the alignment parameters based on the coordinate adjustment parameters, the adjustment amount of the nozzle speed, and the adjustment amount of the nozzle pulse frequency.

4. The automatic alignment and synchronous detection method for double-sided inkjet circuitry on ceramic circuit boards as described in claim 1, characterized in that, Based on the positioning data of ceramic circuit boards, comparative analysis and identification of inkjet circuit data of ceramic circuit boards are performed, including: When the inkjet circuit data of the ceramic circuit board is within the positioning data range of the ceramic circuit board, the automatic alignment result of the double-sided inkjet circuit of the ceramic circuit board is that the double-sided inkjet circuit of the ceramic circuit board has been automatically and accurately aligned. When the inkjet printing line data of the ceramic circuit board is not within the positioning data range of the ceramic circuit board, the automatic alignment result of the double-sided inkjet printing line of the ceramic circuit board is that the double-sided inkjet printing line of the ceramic circuit board is not automatically and accurately aligned. At this time, the ceramic circuit board alignment platform is moved by the servo motor to make fine adjustments to the ceramic circuit board in order to achieve automatic and accurate alignment of the double-sided inkjet printing line of the ceramic circuit board.

5. The automatic alignment and synchronous detection method for double-sided inkjet circuitry on ceramic circuit boards as described in claim 1, characterized in that, Synchronous inspection of ceramic circuit boards based on automated optical inspection includes: Based on automatic optical inspection, a high-resolution CCD camera is used to monitor the double-sided inkjet lines of the ceramic circuit board in real time and collect real-time image data of the ceramic circuit board. Preprocess the real-time image data of the ceramic circuit board to determine the characteristic image data of the ceramic circuit board; Based on deep learning technology, a ceramic circuit board defect localization and classification model is constructed. The feature image data of the ceramic circuit board is input into the ceramic circuit board defect localization and classification model. The feature image data of the ceramic circuit board is analyzed and identified according to the ceramic circuit board defect localization and classification model, and the ceramic circuit board is detected simultaneously to determine the ceramic circuit board defect localization and classification result. The results of defect location and classification on ceramic circuit boards are recorded in the database to provide a basis for subsequent processing.

6. The automatic alignment and synchronous detection method for double-sided inkjet circuitry on ceramic circuit boards as described in claim 5, characterized in that, The defect location and classification results of the ceramic circuit board include the location and type information of the ceramic circuit board defect; when a defect is detected in the ceramic circuit board, the defect is automatically marked and an alarm is triggered, and a maintenance and management plan for the ceramic circuit board is promptly formulated to guide operators in maintaining and managing the defective ceramic circuit board.

7. The automatic alignment and synchronous detection method for double-sided inkjet circuitry on ceramic circuit boards as described in claim 6, characterized in that, The ceramic circuit board defect type information includes open circuit, short circuit, offset, and uneven ink droplet distribution; For ceramic circuit board defects such as broken lines or uneven ink droplets, corrections are made by manually adding ink or reprinting. In addition, piezoelectric inkjet printheads are used to precisely control the ink droplet ejection frequency and position to achieve high-resolution line printing and optimize the printing path to achieve consistent printed lines. For defects in ceramic circuit boards such as short circuits or misalignment, local repairs can be performed using robotic arms or robots; Furthermore, the ceramic circuit boards are subjected to automatic optical inspection again after maintenance and management. The effectiveness of the maintenance and management of the ceramic circuit boards is verified based on the inspection results, and the maintenance and management plan of the ceramic circuit boards is optimized based on the feedback of the inspection results, so that the defects of the ceramic circuit boards are completely resolved.

8. The automatic alignment and synchronous detection method for double-sided inkjet circuitry on ceramic circuit boards as described in claim 7, characterized in that, Preprocessing of real-time image data of ceramic circuit boards includes: Denoising of real-time image data of ceramic circuit boards is performed based on Gaussian filtering to remove Gaussian noise from the real-time image data of ceramic circuit boards while preserving edge information. Histogram equalization is used to enhance the contrast of real-time image data of ceramic circuit boards, thereby improving the image contrast and highlighting the details on the ceramic circuit boards. Furthermore, non-critical areas of the real-time image data of the ceramic circuit board are cropped out, and the images in the real-time image data of the ceramic circuit board are scaled to a specific resolution, and the color images are converted into grayscale images. By setting a threshold, the image in the real-time image data of the ceramic circuit board is segmented into foreground and background. The boundary information of the ceramic circuit board is extracted using the Canny operator, and key features in the real-time image data of the ceramic circuit board are extracted to determine the feature image data of the ceramic circuit board.

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