Welding heat dissipation structure and preparation method thereof

Abstract

The invention belongs to the technical field of heat dissipation structures, and discloses a welding heat dissipation structure and a preparation method thereof.The welding heat dissipation structure comprises a plate structure and a cooling fin, the cooling fin is of a strip-shaped bent structure and is bent in the longitudinal direction to form a lower side welding part and an upper side positioning part which are alternately arranged, and the upper side positioning part transversely forms a downwards-concave positioning groove; the lower side welding part is welded and fixed with the back of the plate structure. Through the cooperation of the transverse positioning clamp, the longitudinal positioning clamp and the pressure clamp, the cooling fins are positioned on the back face of the plate structure and are welded and fixed, so that heat dissipation is directly conducted out on the back face of the plate structure, and the preparation efficiency is effectively improved. And the plate structure welded with the cooling fins can be directly provided with a cooling water jacket, liquid flows through the cooling fins to take away heat generated on the plate structure, direct liquid cooling of the plate structure is achieved, the cooling efficiency is improved, and the plate structure can be directly applied to various plate structures and has high preparation flexibility.

Description

Technical Field

[0001] The present invention belongs to the technical field of heat dissipation structures, and in particular relates to a welding heat dissipation structure and a preparation method thereof. Background Art

[0002] In electronic device design, especially in high-power density or high-frequency applications, electronic components on circuit boards, such as central processing units (CPUs), power amplifiers, and power management chips, generate significant heat. Excessive temperatures can severely impact the performance stability, reliability, and service life of electronic components, and can even cause device damage. Therefore, efficient and reliable heat dissipation design has become a key technical challenge in circuit board construction. To achieve more efficient heat dissipation, common circuit board heat dissipation structures include: replacing traditional epoxy fiberglass substrates with metal or ceramic substrates with high thermal conductivity; designing large-area heat dissipation copper clad areas and heat dissipation pads within traditional laminate structures, interconnecting them with inner layers or even opposite heat dissipation layers through a high-density array of metalized vias, significantly improving vertical thermal conductivity between internal layers; attaching aluminum or copper fin-type heat sinks to the surfaces of key heat-generating components or specific areas of the circuit board, thermally connecting them using thermal grease, thermal pads, or soldering to increase the heat dissipation area; embedding solid copper blocks beneath key heat sources within the board; and designing heat diffusion layers utilizing the PCB's wiring layer structure.

[0003] Traditional thermally conductive media limit the heat dissipation capabilities of heat dissipation designs. Therefore, to further enhance heat dissipation performance, existing technologies have begun to adopt liquid cooling designs. However, typical liquid cooling radiators use processes such as cold forging, brazing, and friction welding. The radiator production process has many complex steps or high-temperature operations, which means that the liquid cooling radiator can only be produced separately and then the circuit substrate is installed into the liquid cooling radiator. This method cannot directly process liquid cooling on the existing circuit substrate, resulting in insufficient flexibility in the application of liquid cooling. Summary of the Invention

[0004] The technical problem to be solved by the present invention is to overcome the defect in the prior art that liquid cooling cannot be directly applied to existing plate structures, resulting in limited application, thereby providing a welding heat dissipation structure and a preparation method thereof.

[0005] A method for preparing a welded heat dissipation structure, comprising the following steps: A plate structure and a plurality of heat sinks are provided; the heat sinks are strip-shaped bent structures, bent longitudinally to form alternating lower welding portions and upper positioning portions, and the upper positioning portions are laterally formed with concave positioning grooves; Positioning a transverse positioning fixture on the back of the plate structure; forming a plurality of mutually parallel transverse positioning strips on one side of the transverse positioning fixture; Positioning a longitudinal positioning fixture on the upper side of the transverse positioning fixture; the longitudinal positioning fixture forms a plurality of longitudinal positioning strips parallel to each other; placing a plurality of the heat sinks in the transverse positioning fixture and the longitudinal positioning fixture; Placing a pressure fixture on the upper side of the heat sink; forming a plurality of pressure bars in the pressure fixture, and placing the pressure bars in the positioning grooves of the upper positioning portion; Welding the heat sink to the back of the plate structure through the lower welding portion; Remove the pressure fixture and longitudinal positioning fixture from the upper side in turn; remove the transverse positioning fixture from the side.

[0006] Furthermore, the width of the transverse positioning strip of the transverse positioning fixture is equal to the spacing between adjacent lower welding portions, and the spacing between adjacent transverse positioning strips is equal to the length of the lower welding portion; the same end of the transverse positioning strip is located at the edge of the transverse positioning fixture; The width of the longitudinal positioning strips of the longitudinal positioning fixture is equal to the spacing between adjacent heat sinks, and the spacing between adjacent transverse positioning strips is equal to the width of the heat sink.

[0007] Furthermore, the transverse positioning bars and the longitudinal positioning bars of the transverse positioning fixture and the longitudinal positioning fixture are staggered to form a plurality of squares, each of the squares accommodates one of the lower side welding portions, so that the plurality of heat sinks are placed parallel to each other.

[0008] Furthermore, the method further includes the following steps: A heat dissipation water jacket is provided; the heat dissipation water jacket is fixed to the back of the plate structure, and the heat sink is surrounded between the heat dissipation water jacket and the plate structure.

[0009] Furthermore, the lower welding portion of the heat sink is welded to the back side of the plate structure by laser welding.

[0010] Furthermore, during laser welding, the plurality of lower side welding portions are welded in a jump-like manner, and adjacent lower side welding portions are welded discontinuously.

[0011] A welded heat dissipation structure is prepared by the above-mentioned preparation method, comprising a plate structure and a plurality of heat sinks, wherein the heat sinks are strip-shaped bent structures, bent longitudinally to form alternating lower welding portions and upper positioning portions, and the upper positioning portions form concave positioning grooves laterally; the lower welding portions of the heat sinks are welded and fixed to the back of the plate structure.

[0012] Furthermore, it also includes a heat dissipation water jacket, which is fixed to the back of the plate structure, and a liquid cooling cavity is formed between the heat dissipation water jacket and the plate structure. The liquid cooling cavity accommodates the heat sink, and the two ends of the heat dissipation water jacket respectively form a water inlet and a water outlet connected to the liquid cooling cavity.

[0013] Furthermore, each of the upper positioning portions of the heat sink is flush and the spacing between adjacent upper positioning portions is the same, each of the lower welding portions is flush and the spacing between adjacent lower welding portions is the same; each of the heat sinks is parallel to each other, the spacing between adjacent heat sinks is the same, and the upper positioning portions are aligned with the lower welding portions of adjacent heat sinks.

[0014] Furthermore, the lower welding portion of the heat sink is welded to a corresponding position of the heat source of the front circuit of the board structure.

[0015] Beneficial effects: The present invention discloses a welded heat dissipation structure and a preparation method thereof. The welded heat dissipation structure includes a plate structure and a heat sink. The heat sink is a strip-shaped bent structure, which is bent longitudinally to form alternating lower welding portions and upper positioning portions. The upper positioning portion forms a concave positioning groove laterally, and the lower welding portion is welded and fixed to the back of the plate structure. The heat sink is positioned on the back of the plate structure and welded and fixed by the cooperation of a transverse positioning fixture, a longitudinal positioning fixture, and a pressure fixture, thereby directly realizing heat dissipation on the back of the plate structure, effectively improving the preparation efficiency. In addition, the plate structure with the welded heat sink can be directly installed with a heat dissipation water jacket. The liquid flows through the heat sink to take away the heat generated on the plate structure, realizing direct liquid cooling of the plate structure, improving the heat dissipation efficiency, and can be directly applied to various plate structures, with strong preparation flexibility. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] In order to more clearly illustrate the embodiments of the present application or the technical solutions in the prior art, the following briefly introduces the drawings required for use in the embodiments or the description of the prior art. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without any creative work.

[0017] Figure 1 This is a schematic diagram of the overall structure of the welding heat dissipation structure with high heat dissipation efficiency of the present invention; Figure 2 This is a schematic diagram of the installation structure of the lateral positioning fixture of the present invention; Figure 3 This is a schematic diagram of the installation structure of the longitudinal positioning fixture of the present invention; Figure 4 This is a schematic diagram of the installation structure of the pressure clamp of the present invention; Figure 5It is a schematic diagram of the installation structure of the heat dissipation water jacket of the present invention.

[0018] Description of reference numerals: 1. Plate structure; 11. Positioning hole; 2. Heat sink; 21. Upper positioning portion; 22. Lower welding portion; 3. Horizontal positioning fixture; 4. Vertical positioning fixture; 5. Pressure fixture; 6. Heat dissipation water jacket. DETAILED DESCRIPTION

[0019] To make the above-mentioned objects, features, and advantages of the present application more clearly understood, the specific embodiments of the present application are described in detail below with reference to the accompanying drawings. The following description sets forth many specific details to facilitate a full understanding of the present application. However, the present application can be implemented in many other ways than those described herein, and those skilled in the art can make similar improvements without violating the scope of the present application. Therefore, the present application is not limited to the specific embodiments disclosed below.

[0020] In the description of the present application, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise", "axial", "radial", "circumferential" and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as a limitation on the present application.

[0021] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of the technical features being referred to. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one of such features. Throughout the description of this application, "plurality" means at least two, for example, two, three, etc., unless otherwise specifically defined.

[0022] In this application, unless otherwise specified or limited, the terms "installed," "connected," "connect," "fixed," etc. should be understood in a broad sense. For example, they can refer to fixed connection, detachable connection, or integration; mechanical connection or electrical connection; direct connection or indirect connection through an intermediate medium; internal communication between two elements or interaction between two elements, unless otherwise specified. Those skilled in the art will understand the specific meanings of the above terms in this application based on specific circumstances.

[0023] Example 1: Reference Figures 1 to 5 As shown, this embodiment provides a method for preparing a welded heat dissipation structure, including the following method steps: Step S1: providing a plate structure 1 and a plurality of heat sinks 2; the heat sink 2 is a strip-shaped bent structure, bent longitudinally to form alternating lower welding portions 22 and upper positioning portions 21, and the upper positioning portions 21 are laterally formed with concave positioning grooves; Step S2: Positioning the transverse positioning fixture 3 on the back of the plate structure 1; forming a plurality of mutually parallel transverse positioning strips on one side of the transverse positioning fixture 3; Step S3: positioning the longitudinal positioning fixture 4 on the upper side of the transverse positioning fixture 3; the longitudinal positioning fixture 4 forms a plurality of longitudinal positioning strips parallel to each other; Step S4: placing the plurality of heat sinks 2 in the transverse positioning fixture 3 and the longitudinal positioning fixture 4; Step S5: placing a pressure fixture 5 on the upper side of the heat sink 2; forming a plurality of pressure bars in the pressure fixture 5, and placing the pressure bars in the positioning grooves of the upper positioning portion 21; Step S6: Welding the heat sink 2 to the back of the plate structure 1 through the lower welding portion 22; Step S7: Take out the pressure fixture 5 and the longitudinal positioning fixture 4 from the upper side in sequence; and pull out the transverse positioning fixture 3 from the side; Step S8: providing a heat dissipation water jacket 6 ; fixing the heat dissipation water jacket 6 on the back of the plate structure 1 , and surrounding the heat sink 2 between the heat dissipation water jacket 6 and the plate structure 1 .

[0024] Specifically, the width of the transverse positioning strip of the transverse positioning fixture 3 is equal to the spacing between adjacent lower welding portions 22, and the spacing between adjacent transverse positioning strips is equal to the length of the lower welding portion 22; the same end of the transverse positioning strip is located at the edge of the transverse positioning fixture 3, so that it can be pulled out from the side after the heat sink 2 is welded; The width of the longitudinal positioning strips of the longitudinal positioning fixture 4 is equal to the spacing between adjacent heat sinks 2 , and the spacing between adjacent transverse positioning strips is equal to the width of the heat sink 2 .

[0025] The transverse positioning bars and the longitudinal positioning bars of the transverse positioning fixture 3 and the longitudinal positioning fixture 4 are staggered to form a plurality of squares, each of which accommodates one of the lower welding portions 22 , so that the plurality of heat sinks 2 are placed parallel to each other.

[0026] In some embodiments of the present invention, the width of each of the transverse positioning bars of the transverse positioning fixture 3 is equal, and the spacing between adjacent transverse positioning bars is equal; the width of the longitudinal positioning bars of the longitudinal positioning fixture 4 is equal, and the spacing between adjacent longitudinal positioning bars is equal. The longitudinal positioning bars and the grids formed by the staggered longitudinal positioning bars are of the same size and shape.

[0027] In this embodiment, the plate structure 1 can be a component connected to the structure to be cooled, as part of a welded cooling structure, or it can be part of the structure to be cooled, directly cooling the structure based on the plate structure 1.

[0028] In this embodiment, the heat sink 2 is a metal sheet, which can be an aluminum sheet or a copper sheet. In this embodiment, it is preferably a copper sheet, so as to have good thermal conductivity. As a preferred embodiment of this embodiment, the board structure 1 is a circuit carrier. Specifically, the board structure 1 is a pressed insulated metal substrate, and can also be a thick copper PCB board, or an IMB board; the circuit of the board structure 1 is formed on its front side, and the back side is a heat dissipation surface. As a preferred embodiment of this embodiment, the board structure 1 is an insulated metal substrate, including an upper surface circuit layer, an insulating layer, and a heat dissipation layer stacked in sequence, forming an effective heat dissipation surface on the back side, and having good insulation formation, providing conditions for being part of a liquid cooling cavity.

[0029] Specifically, the middle portion of the pressure fixture 5 forms multiple parallel connecting strips, whose width and position correspond to the gaps between adjacent heat sinks 2. Pressure strips are formed between the connecting strips, running perpendicular to the connecting strips and connecting between adjacent connecting strips. Their width and position correspond to the positioning grooves of the upper positioning portions 21 of the heat sink 2. Consequently, the middle portion of the pressure fixture 5 vertically blocks only the gaps between the heat sinks 2 and the positioning grooves of the upper positioning portions 21, leaving the lower welding portion 22 exposed, enabling laser welding on the upper side.

[0030] As a preferred embodiment of this embodiment, the lower welding portion 22 of the heat sink 2 is laser welded to the back of the plate structure 1. During laser welding, multiple lower welding portions 22 are welded in a jump-type manner, and adjacent lower welding portions 22 are welded discontinuously. Since a large amount of heat is generated at the welding points during the laser welding process, it is necessary to control the sequence of laser welding to ensure that the welding process does not cause local overheating, thereby damaging the insulating layer of the insulated metal substrate. In this embodiment, the welding method is a clockwise multi-weld jump-type method, and two consecutive welds will not weld adjacent lower welding portions 22, thereby ensuring that local overheating does not occur during the welding process and ensuring the reliability of the plate structure 1.

[0031] In this embodiment, the plate structure 1 is provided with a plurality of through-holes 11, and the transverse positioning fixture 3 and the longitudinal positioning fixture 4 are provided with corresponding through-holes for positioning and securing the fixtures. Specifically, four positioning holes are formed on either side of the welding position of the heat sink 2 of the plate structure 1, four corresponding positioning holes are formed on one side of the transverse positioning fixture 3, and four positioning holes are formed on either side of the longitudinal positioning fixture 4.

[0032] The heat dissipation water jacket 6 is provided with a plurality of through positioning holes corresponding to the plate structure 1, so as to achieve effective fixed installation with the plate structure 1. The heat dissipation water jacket 6 is formed with eight positioning holes corresponding to the plate structure 1.

[0033] The present embodiment provides a preparation method for a welded heat dissipation structure, wherein the welded heat dissipation structure includes a plate structure 1 and a heat sink 2. The heat sink 2 is a strip-shaped bent structure, which is bent longitudinally to form alternating lower welding portions 22 and upper positioning portions 21. The upper positioning portion 21 forms a concave positioning groove in the transverse direction, and the lower welding portion 22 is welded and fixed to the back of the plate structure 1. The heat sink 2 is positioned on the back of the plate structure 1 and welded and fixed by the cooperation of the transverse positioning fixture 3, the longitudinal positioning fixture 4 and the pressure fixture 5, thereby directly realizing heat dissipation on the back of the plate structure 1, effectively improving the preparation efficiency. In addition, the plate structure 1 with the welded heat sink 2 can be directly installed with a heat dissipation water jacket 6. The liquid flows through the heat sink 2 and takes away the heat generated on the plate structure 1, realizing direct liquid cooling of the plate structure 1, improving the heat dissipation efficiency, and can be directly applied to various plate structures 1, with strong preparation flexibility.

[0034] Example 2: This embodiment provides a welded heat dissipation structure, fabricated using the method described in Example 1. The structure comprises a plate structure 1 and a plurality of heat sinks 2. The heat sinks 2 are strip-shaped, bent structures, bent longitudinally to form alternating lower welded portions 22 and upper positioning portions 21. The upper positioning portions 21 are laterally formed into concave positioning grooves. The lower welded portions 22 of the heat sinks 2 are welded and fixed to the back surface of the plate structure 1. In this embodiment, both ends of the heat sink 2 are lower welded portions 22.

[0035] This embodiment also includes a heat dissipation water jacket 6, which is fixed to the back of the plate structure 1. A liquid cooling cavity is formed between the heat dissipation water jacket 6 and the plate structure 1. The liquid cooling cavity accommodates the heat sink 2. The ends of the heat dissipation water jacket 6 respectively form a water inlet and a water outlet that communicate with the liquid cooling cavity. Specifically, the horizontal shape of the heat dissipation water jacket 6 is the same as that of the plate structure 1. After being fixed, the liquid cooling cavity formed only has water inlets and outlets on the left and right sides, thereby ensuring the airtightness of the liquid cooling device and the waterproof safety of the circuit.

[0036] In some implementations of this embodiment, each upper positioning portion 21 of the heat sink 2 is flush with each other, and the spacing between adjacent upper positioning portions 21 is the same. Each lower welding portion 22 is flush with each other, and the spacing between adjacent lower welding portions 22 is the same. Each heat sink 2 is parallel to each other, the spacing between adjacent heat sinks 2 is the same, and the upper positioning portion 21 is aligned with the lower welding portion 22 of adjacent heat sinks 2. This regular structure allows the coolant to form a stable turbulent flow when flowing through the heat sink 2, thereby effectively and evenly removing heat from each heat sink 2, ensuring heat dissipation performance.

[0037] In other implementations of this embodiment, the lower welding portion 22 of the heat sink 2 is welded to a position corresponding to the heat source of the front circuit of the board structure 1. Through a specially designed preparation fixture structure, the lower welding portion 22 of the heat sink 2 with high performance is welded to a position corresponding to the heat source of the front circuit of the board structure 1, so that the heat generated by the front circuit structure can be conducted to the lower welding portion 22 and its corresponding heat sink 2 through the board structure 1 at the shortest distance. The heat is quickly carried away by the coolant flowing through the heat sink 2, effectively improving the heat dissipation efficiency.

[0038] The technical features of the above-mentioned embodiments can be combined arbitrarily. In order to make the description concise, not all possible combinations of the technical features in the above-mentioned embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0039] The above-described embodiments merely represent several implementation methods of the present application. While the descriptions are relatively specific and detailed, they should not be construed as limiting the scope of the patent application. It should be noted that a person of ordinary skill in the art may make various modifications and improvements without departing from the spirit of the present application, and these modifications and improvements fall within the scope of protection of the present application. Therefore, the scope of protection of the present patent application shall be determined by the appended claims.

Claims

1. A method for preparing a welded heat dissipation structure, characterized in that: The method comprises the following steps: A plate structure (1) and a plurality of heat sinks (2) are provided; the heat sinks (2) are strip-shaped bent structures, bent longitudinally to form alternating lower welding portions (22) and upper positioning portions (21), and the upper positioning portions (21) are laterally formed with concave positioning grooves; Positioning a transverse positioning fixture (3) on the back side of the plate structure (1); forming a plurality of mutually parallel transverse positioning strips on one side of the transverse positioning fixture (3); Positioning the longitudinal positioning fixture (4) on the upper side of the transverse positioning fixture (3); the longitudinal positioning fixture (4) forms a plurality of longitudinal positioning strips parallel to each other; Placing the plurality of heat sinks (2) in the transverse positioning fixture (3) and the longitudinal positioning fixture (4); The pressure fixture (5) is placed on the upper side of the heat sink (2); a plurality of pressure bars are formed in the pressure fixture (5), and the pressure bars are placed in the positioning grooves of the upper positioning portion (21); Welding the heat sink (2) to the back of the plate structure (1) via a lower welding portion (22); Remove the pressure fixture (5) and the longitudinal positioning fixture (4) from the upper side in sequence; and remove the transverse positioning fixture (3) from the side.

2. The method for preparing a welded heat dissipation structure according to claim 1, wherein: The width of the transverse positioning strip of the transverse positioning fixture (3) is equal to the spacing between adjacent lower welding portions (22), and the spacing between adjacent transverse positioning strips is equal to the length of the lower welding portions (22); the same end of the transverse positioning strip is located at the edge of the transverse positioning fixture (3); The width of the longitudinal positioning strips of the longitudinal positioning fixture (4) is equal to the spacing between adjacent heat sinks (2), and the spacing between adjacent transverse positioning strips is equal to the width of the heat sink (2).

3. The method for preparing a welded heat dissipation structure according to claim 1, wherein: The transverse positioning bars and the longitudinal positioning bars of the transverse positioning fixture (3) and the longitudinal positioning fixture (4) are staggered to form a plurality of squares, each of which accommodates one of the lower welding portions (22), so that the plurality of heat sinks (2) are placed parallel to each other.

4. The method for preparing a welded heat dissipation structure according to claim 1, wherein: The following method steps are also included: A heat dissipation water jacket (6) is provided; the heat dissipation water jacket (6) is fixed to the back of the plate structure (1), and the heat sink (2) is surrounded between the heat dissipation water jacket (6) and the plate structure (1).

5. The method for preparing a welded heat dissipation structure according to claim 1, wherein: The lower welding portion (22) of the heat sink (2) is welded to the back side of the plate structure (1) by laser welding.

6. The method for preparing a welded heat dissipation structure according to claim 5, characterized in that: During laser welding, a plurality of the lower side welding portions (22) are welded in a jump-like manner, and adjacent lower side welding portions (22) are welded discontinuously.

7. A welded heat dissipation structure, prepared by the preparation method according to any one of claims 1 to 6, characterized in that: The heat sink (2) comprises a plate structure (1) and a plurality of heat sinks (2), wherein the heat sink (2) is a strip-shaped bent structure, bent longitudinally to form alternating lower welding portions (22) and upper positioning portions (21), and the upper positioning portions (21) are laterally formed into concave positioning grooves; the lower welding portions (22) of the heat sink (2) are welded and fixed to the back of the plate structure (1).

8. A welding heat dissipation structure according to claim 7, characterized in that: It also includes a heat dissipation water jacket (6), which is fixed to the back of the plate structure (1), and a liquid cooling cavity is formed between the heat dissipation water jacket (6) and the plate structure (1), and the liquid cooling cavity accommodates the heat sink (2), and the two ends of the heat dissipation water jacket (6) respectively form a water inlet and a water outlet connected to the liquid cooling cavity.

9. The welding heat dissipation structure according to claim 7, characterized in that: Each upper positioning portion (21) of the heat sink (2) is flush and the spacing between adjacent upper positioning portions (21) is the same, each lower welding portion (22) is flush and the spacing between adjacent lower welding portions (22) is the same; each heat sink (2) is parallel to each other, the spacing between adjacent heat sinks (2) is the same, and the upper positioning portion (21) is aligned with the lower welding portion (22) of the adjacent heat sink (2).

10. The welding heat dissipation structure according to claim 7, characterized in that: The lower side welding portion (22) of the heat sink (2) is welded to a corresponding position of the heat source of the front circuit of the board structure (1).

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