Spray electrostatic chuck design

Abstract

Embodiments of the invention include a substrate support including a metal body having a substrate surface, a plurality of lift pin holes formed in the body, and a dielectric coating disposed on the substrate surface of the body. Each of the plurality of lift pin bores includes a through bore and a chamfered face configured to mate with the lift pin sleeve. The dielectric coating includes a substrate support surface, a thickness, and a pattern disposed in the substrate support surface.

Description

Technical Field

[0001] Embodiments of the present invention generally relate to semiconductor chamber components, and more particularly to a sleeve and substrate plate assembly for use in a substrate support. Background Art

[0002] Reliably producing nanometer and smaller features is one of the key technical challenges for the next generation of very large scale integration (VLSI) and ultra-large scale integration (ULSI) of semiconductor components. However, as the limits of circuit technology continue to increase, the dimensions of VLSI and ULSI interconnect technologies continue to shrink, placing additional demands on processing capabilities. Reliable formation of gate structures on substrates is crucial to the success of VLSI and ULSI, as well as the ongoing efforts to increase circuit density and the quality of individual substrates and chips.

[0003] To reduce manufacturing costs, integrated chip (IC) manufacturers demand higher throughput, better component yields, and superior performance for each silicon substrate processed. Some manufacturing techniques being explored for next-generation semiconductor component manufacturing require processing without concern for arcing between the various components of the substrate support assembly. Coatings are often applied to components to help prevent arcing, but surfaces with small features often result in incomplete coatings or porous areas. A critical area of ​​the substrate support is the area near the lift pins. The lift pins are used to raise and lower the substrate on the substrate support assembly. The lift pins pass through a small area of ​​the substrate support assembly. Previous designs have experienced poor and / or inconsistent coating characteristics in the areas of the substrate support assembly where the lift pins pass through.

[0004] Therefore, there is a need for an improved substrate support assembly that solves the above problems. Summary of the Invention

[0005] Embodiments of the present invention generally relate to a body of a substrate support having lift pin bushings therein. More specifically, embodiments described herein provide apparatus and methods for a body of a substrate support assembly having a coating and lift pin holes.

[0006] In one embodiment, a substrate support is provided. The substrate support includes a metal body having a substrate surface, a plurality of lift pin holes formed in the body, and a dielectric coating disposed on the substrate surface of the body. Each of the plurality of lift pin holes includes a through-hole and a chamfered surface configured to mate with a lift pin sleeve. The dielectric coating includes a substrate supporting surface, a thickness, and a pattern disposed on the substrate supporting surface.

[0007] In another embodiment, an electrostatic chuck assembly is provided. The electrostatic chuck assembly is configured to support a substrate while the substrate is disposed on the electrostatic chuck, wherein the electrostatic chuck assembly includes a body of the electrostatic chuck assembly, a substrate face configured to face the substrate, a dielectric coating disposed on the body, a plurality of lift pin holes disposed in the body, and a plurality of lift pin sleeves disposed within the plurality of lift pin holes. The dielectric coating includes a top portion, a thickness, and a pattern disposed in the substrate face. Each of the plurality of lift pin holes includes a top surface coated with the dielectric coating, a chamfered surface coated with the dielectric coating, and a depth. Each of the plurality of lift pin sleeves includes a sleeve material, a sleeve body, a substrate face, a pin hole disposed through the sleeve body, and a chamfer disposed on an exterior of the sleeve body.

[0008] In another embodiment, a method of manufacturing a body for an electrostatic chuck assembly is provided. The method includes forming a body having a substrate face; and a base face, flattening the substrate face and the base face of the body, forming a plurality of lift pin holes through the body, chamfering the plurality of lift pin holes in the substrate face of the body, coating the body with a dielectric coating, cutting a pattern into the dielectric coating, and polishing the dielectric coating.

[0009] Embodiments of the present invention include a method of manufacturing a body for an electrostatic chuck assembly, comprising: forming a body including a substrate surface and a base surface; forming a plurality of lift pin holes extending through the substrate surface of the body to the base surface of the body; chamfering the plurality of lift pin holes in the substrate surface of the body; coating the body with a dielectric coating; forming a pattern in the dielectric coating disposed on the substrate surface; and polishing the dielectric coating disposed on the substrate surface. BRIEF DESCRIPTION OF THE DRAWINGS

[0010] Thus, the manner in which the above-described features of the present disclosure may be understood in detail may be that the disclosure, briefly summarized above, may be more particularly described with reference to embodiments, some of which are illustrated in the accompanying drawings. However, it should be noted that the drawings illustrate only exemplary embodiments and are therefore not to be considered limiting of the scope, as other equally effective embodiments may be admitted.

[0011] Figure 1 is a schematic cross-sectional view of an exemplary plasma processing chamber according to an embodiment.

[0012] Figure 2 is a schematic cross-sectional view of an exemplary substrate support assembly according to an embodiment.

[0013] Figure 3 yes Figure 2 Schematic cross-section of a portion of a substrate support assembly.

[0014] Figure 4 is a schematic cross-sectional view of the sleeve disclosed herein.

[0015] Figure 5 is a schematic cross-sectional view of the sleeve disclosed herein.

[0016] Figure 5A is a schematic cross-sectional view of the sleeve disclosed herein.

[0017] Figure 6 is a schematic cross-sectional view of the sleeve disclosed herein.

[0018] To facilitate understanding, identical reference numerals have been used, where possible, to designate identical elements that are common to the figures. It is contemplated that elements and features of one embodiment may be beneficially incorporated in other embodiments without further recitation. DETAILED DESCRIPTION

[0019] Embodiments of the present invention generally relate to electrostatic chuck assemblies suitable for use in semiconductor manufacturing processes. In one or more embodiments, the electrostatic chuck assembly is used at high process temperatures greater than 50°C, such as greater than 150°C. In one or more alternative embodiments, the electrostatic chuck assembly is used at low process temperatures below 0°C and below -10°C (e.g., approximately -50°C). For example, the electrostatic chuck assembly is used at low process temperatures of about -50°C to about -150°C.

[0020] Figure 1 FIG2 is a schematic cross-sectional view of an exemplary plasma processing chamber 100 having a substrate support assembly 126, the plasma processing chamber 100 being configured as an etch chamber. The substrate support assembly 126 may also be used in other types of processing plasma chambers, such as plasma processing chambers, annealing chambers, physical vapor deposition (PVD) chambers, chemical vapor deposition (CVD) chambers, ion implantation chambers, and other systems requiring the ability to control processing uniformity across a surface or substrate.

[0021] The plasma processing chamber 100 includes a chamber body 102 having sidewalls 104, a bottom 106, and a lid 108 that enclose an interior processing region 110. An injection assembly 112 is coupled to the sidewalls 104 and / or the lid 108 of the chamber body 102. A gas panel 114 is coupled to the injection assembly 112 to allow process gases to be provided into the processing region 110. The injection assembly 112 may be one or more nozzles or inlets, or alternatively, a showerhead. In other embodiments, the injection assembly 112 may be replaced by a PVD target or a gas delivery showerhead. The process gases and any process byproducts may be removed from the processing region 110 via an exhaust port 128 formed in the sidewalls 104 or the bottom 106 of the chamber body 102. The exhaust port 128 is coupled to a pumping system 132 that includes a throttle valve and a pump for controlling the vacuum level within the processing region 110.

[0022] In some embodiments, the process gas may be excited to form a plasma within the process region 110. The process gas may be excited by capacitively or inductively coupling RF power to the process gas. Figure 1 In the example shown, a plurality of coils 116 are disposed above the lid 108 of the plasma processing chamber 100 and are coupled to an RF power source 120 through a matching circuit 118 .

[0023] The substrate support assembly 126 is disposed in the processing region 110 below the injector 112. The substrate support assembly 126 includes an electrostatic chuck (ESC) assembly 184 and a facilities plate 145. The facilities plate 145 is supported by a pedestal 176. The pedestal 176 is supported by one of the sidewalls 104 and / or the bottom 106 of the processing chamber. The substrate support assembly 126 may further include a heater assembly (not shown). Furthermore, the substrate support assembly 126 may include a facilities plate 145 and / or an insulating plate 144 disposed between the ESC assembly 184 and the pedestal 176 to facilitate electrical, cooling, and gas connections to the substrate support assembly 126.

[0024] The facility plate 145 is formed of or includes one or more metallic materials. The facility plate 145 may include a plurality of cooling channels formed therein. The cooling channels may be connected to a heat transfer fluid source (not shown). The heat transfer fluid source provides a heat transfer fluid, such as a liquid, a gas, or a combination thereof, which circulates through one or more cooling channels disposed in the facility plate 145. Fluids flowing through adjacent cooling channels may be isolated to enable localized control of heat transfer between different areas of the ESC assembly 184 and the facility plate 145, which helps control the lateral temperature distribution of the base plate 124.

[0025] The ESC assembly 184 includes one or more chuck electrodes 186 disposed within the ESC assembly 184. The chuck electrodes 186 are connected to a power supply 187. In some embodiments, the ESC assembly 184 is a monopolar ESC, and the chuck electrodes 186 use the power supply 187 to bias the ESC assembly 184 to secure the substrate during deposition processing. The power supply 187 is connected to the ESC assembly 184 to generate an electrical bias using the electrodes 186. The power supply 187 can be connected to the connector 190 via a threaded connection or other suitable connection method. The ESC assembly 184 is disposed between the processing region 110 and the facility plate 145. The ESC assembly 184 has a substrate supporting surface 137 and a facility plate surface 133 opposite the substrate supporting surface 137. The substrate supporting surface 137 of the ESC assembly 184 contacts the substrate 124 at the ESC surface 182 of the substrate 124. In some embodiments, the substrate supporting surface 137 is the top surface of the coating.

[0026] The plasma processing chamber 100 also includes a lift pin assembly. The lift pin assembly includes an actuator 146 that can be connected to at least some of the chamber walls 104, 106, 108. The lift pin assembly also includes a bellows 147. The bellows 147 seals the actuator 146 from the processing region 110. The lift pin assembly also includes a lift pin plate 148 configured to raise a plurality of lift pins 149. The lift pins are connected to the lift pin plate 148. The lift pin plate 148 is connected to the actuator 146. The lift pin holes 300 ( Figure 3 14) allows the lift pins 149 to pass through the ESC assembly 184 to accommodate the lift pins 149 and lift the substrate 124 above the substrate support surface 137. The substrate 124 is lifted above the substrate support surface 137 to facilitate the robotic transfer unit in and out of the plasma processing chamber 100.

[0027] A bonding layer is disposed between the facility plate 145 and the ESC assembly 184. The bonding layer secures the ESC assembly 184 to the facility plate 145. In other embodiments, the bonding layer is disposed between the ESC assembly 184 and a lower plate (not shown), which is disposed between the ESC assembly 184 and the facility plate 145. In some embodiments, the ESC assembly 184 and the facility plate 145 are connected by mechanical means, but may also be connected by adhesive or any combination of means.

[0028] Figure 2 A schematic side view of a cross-section of an ESC upper region 200 is depicted, according to one or more embodiments described and discussed herein. The ESC upper region 200 shows the ESC assembly 184 disposed between the baseplate 124 and the facility plate 145. According to some embodiments, the ESC assembly 184 and the facility plate 145 are a single body. The baseplate 124 includes a processing surface 124a facing the processing volume and a support surface 124b in contact with the baseplate face 180a of the ESC assembly 184. The ESC assembly 184 includes a radially outward face 201 extending along the diameter of the ESC assembly 184. The diameter of the ESC assembly 184 can be between approximately 100 mm and approximately 600 mm, for example, between 200 mm and approximately 500 mm. The width of the outward face 201 is equal to the thickness of the ESC assembly 184. The width of the ESC assembly 184 can be defined by the distance between the baseplate face 180a and the base surface 180b of the ESC assembly 184. The width of the outer face 201 can be between about 5 mm and about 35 mm, for example, between about 5 mm and about 25 mm. The ESC assembly 184 can be made of a material that can include stainless steel, aluminum, or titanium, or any combination thereof, although other materials are also contemplated. In some embodiments, the ESC assembly 184 has edge features, such as shoulders, that allow an edge ring to be positioned thereon or minimize gaps around the ESC assembly 184. Figure 3 Further shown is a lift pin hole 300 in the ESC assembly 184 .

[0029] Figure 3 A more detailed view of the lift pin hole 300 through the ESC assembly 184 is shown. According to some embodiments, the ESC assembly 184 includes a chuck plate body 180. The lift pin hole 300 includes a lift pin area 307. The lift pin area 307 is an area on the base surface 180a of the body 180 of the ESC assembly 184 that contains a chamfered surface 301 of the lift pin hole 300. The chamfered surface 301 terminates at the start of the hole body area 321 within the body 180. The chamfered surface 301 has a chamfered transverse thickness 319 and a chamfered depth 317. The thickness and depth 317, 319 can range from approximately 1 mm to approximately 20 mm and can be equal or vary. For example, the thickness and depth 317, 319 can range from approximately 1 mm to approximately 15 mm. The chamfered surface 301 forms an angle 309 with the body base surface 180a. The chamfered surface 301 forms an angle 311 with the pin hole wall 303. Angles 309 and 311 may each be between approximately 90° and approximately 180°. Angles 309 and 311 may be equal or different. For example, angles 309 and 311 may both be 135°. As shown, pin hole wall 303 has a left side 303a and a right side 303b. The main hole area 321 of lift pin hole 300 has a diameter 313. Diameter 313 may be between approximately 1 mm and approximately 40 mm, for example, between approximately 5 mm and approximately 30 mm. Lift pin hole 300 also includes an outer diameter 323 of chamfered surface 301, defined by diameter 313 combined with twice the lateral width 319 of chamfered surface 301. The main hole area 321 has a depth 315. For example, main hole depth 315 may be between approximately 10 mm and approximately 120 mm. For example, main hole depth 315 may be between approximately 20 mm and approximately 120 mm. The chamfer depth 317 and the body depth 315 are equal to the width between the body base surface 180a and the body base surface 180b. In addition to chamfers, other embodiments of the lift pin hole 300 include a lift pin hole 300 with rounded corners and a concave shoulder, a square hole lift pin hole 300, and / or a lift pin hole 300 without features.

[0030] Figure 4An embodiment of an ESC assembly 184 is shown, comprising a body 180, a sleeve assembly 400 mounted within the body 180, and a coating 401 disposed thereon. In some embodiments, the body 180 comprises the coating 401 and a lift pin sleeve 409 inserted into the lift pin hole 300. The coating 401 comprises a dielectric material disposed on the substrate surface 180a of the body 180. In some embodiments, the coating 401 comprises a dielectric material such as aluminum oxide, magnesium oxide, zirconium oxide, chromium oxide, titanium dioxide, yttria-stabilized zirconium oxide, and magnesium aluminate. The coating 401 has a top surface 403 and a thickness 405 between the top surface 403 and the substrate surface 180a of the body 180. For example, the thickness 405 is between approximately 0 mm and approximately 0.7 mm, such as between approximately 0.01 mm and approximately 0.5 mm. The coating 401 also includes a pattern formed in the top surface 403 by a machining process. The pattern can be a mesa pattern, having individual square mesas 450 that are higher than the rest of the top surface 403. In some embodiments, the tops of the mesas 450 are the substrate support surface 137. Each mesa 450 has a height 451 above the top surface 403 and a width 453. For example, the height 451 can be between about 0 mm and about 0.7 mm, such as between about 0.01 mm and about 0.5 mm. For example, the width 453 can be between about 0 mm and about 0.7 mm, such as between about 0.01 mm and about 0.5 mm. The pattern can also be any other suitable design. The coating 401 extends along the chamfered surface 301 to a depth 407 and has a thickness 435 along the chamfered surface 301. For example, the thickness 435 is between about 2 mm and about 5 mm. For example, the depth 407 is between about 0 mm and about 15 mm. When applying the coating 401 using a sprayer, overspray may occur and contact certain areas of the lift pin hole 300. To reduce overspray, the lift pin hole can be inserted with a filler feature during the coating process. For example, if the design does not want the coating 401 to be located within the uncoated length 421, a temporary feature can be inserted to ensure that the coating is contained only within the chamfered surface 301. The coating 401 on the chamfered surface 301 can prevent contact between the base plate 127 and the body 180. The lift pin hole 300 can include an uncoated length 421, which is defined as the distance from the depth 407 to the base surface 180b. The uncoated length 421 can be between approximately 1 mm and approximately 100 mm. The chamfered coating 425 forms an angle 427 and contacts the mating surface 417 of the lift pin sleeve 409. For example, the angle 427 can be approximately equal to the chamfered surface angle 311. In some embodiments, the angle 427 can be between approximately 90° and approximately 180°.

[0031] The body 180 can be formed from a sheet or plate of material that is machined to allow for the desired features and dimensions of the body 180. Once formed, the body 180 will have a lift pin bore 300 with a chamfered surface 301. The body 180 is then coated with a dielectric coating 401. The coating 401 can be sprayed and / or applied manually, such as with a paint coating. Other application methods, such as electroplating, are also contemplated. Once applied, the coating 401 is polished and a pattern is cut into the coating 401. After the pattern is cut, a lift pin sleeve 409 is secured into the lift pin bore 300.

[0032] According to some embodiments, a lift pin sleeve 409 includes a sleeve body 423 and a chamfered region 415. The sleeve body 423 includes an inner diameter 429, an outer body diameter 430, and a body thickness 431. The inner diameter 429 can be between approximately 4 mm and approximately 12 mm. The outer body diameter 430 can be between approximately 8 mm and approximately 22 mm and is generally sized to fit within the diameter 313 formed in the body 180. The body thickness 431 of the lift pin sleeve 409 can be between approximately 4 mm and approximately 18 mm. The chamfered region 415 includes a top surface 411, a corner 413, and a seating distance 433 measured from the coating top surface 403 to the sleeve top surface 411. The seating distance 433 can be between 0 mm and approximately 5 mm. In some embodiments, an overall depth 419 is defined as the distance from the coating top surface 403 to the base surface 180b of the chuck plate. The overall depth 419 can be between approximately 5 mm and approximately 25 mm. In some embodiments, when the ESC assembly 184 and the facility plate 145 are a single body, the depth 419 is the depth of the facility plate plus a value between about 5 mm and about 25 mm. In some embodiments, the sleeve is secured in the ESC assembly 184 by at least a press fit, an interference fit, by an adhesive, and / or any combination thereof. Other methods of securing the sleeve 409 are contemplated.

[0033] Figure 5 、 5A 6 show three embodiments of the lift pin sleeve 409 , including methods of securing the sleeve 409 into the ESC assembly 184 .

[0034] Figure 5A threaded embodiment 500 of a lift pin sleeve 409 and body 180 is shown, including threads 505 and 511. The lift pin sleeve 409 has a threaded region with a top 509, an inner diameter 429, an outer diameter 519, and a length 513. The sleeve threads 511 are of a standard thread size, with the pitch, thread angle, inner diameter, and outer diameter depending on the design. As shown, the threads 511 are pointed threads, but other thread types, such as square or tapered threads, are also contemplated. In some embodiments, the threads are fine threads (e.g., uniform national fine (UNF) threads) to minimize the volume of fluid trapped between the mating thread sets, allowing for efficient evacuation of the threaded region during processing. The threaded region 513 may extend to the sleeve base 515 but may also include a tip feature 518. The threaded region 513 may be between approximately 25 mm and approximately 35 mm in length, but typically includes at least three engaged threads. As shown, the tip feature 518 is a non-threaded locating portion. The alignment or positioning feature 518 has no threads of length 517. Length 517 can be between 0 and approximately 25 mm, for example, between approximately 5 mm and approximately 15 mm. The sleeve thread 511 is threaded into the plate thread 505. The plate thread 505 has a starting point 503 at the end of the chamfered surface 301 and an end point 507. The lift pin hole 300 has a diameter 313 concentric with the sleeve outer diameter 519. The thread starting point 503 can be further recessed into the lift pin hole 300, for example, the starting point 503 can be recessed approximately 10 mm. As shown, the thread terminates at an end point 507, which is the chuck plate base surface 180 b. The end point 507 can also be located within the lift pin hole 300, offset from the base surface 180 b, for example, the end point 507 can be offset from the base surface 180 b by between approximately 0 mm and approximately 10 mm. The plate thread 505 has a length 501 defined by the starting point 503 and the end point 507. The length 501 can be about 5 mm to about 15 mm. The lift pin sleeve 409 is screwed into the body 180 to a certain depth. This depth can be the depth when the sleeve top 509 is coplanar with the coating top 403. In addition, the lift pin sleeve 409 can be screwed in so that the surface of the sleeve top 509 is located above or below the top 403 of the coating 401. For example, the sleeve 409 can be screwed in so that the sleeve top 509 is aligned with the body substrate surface 180a.

[0035] Figure 5A Shows the Figure 5 A similar embodiment is shown, but with the addition of sleeve shoulder 550. Sleeve shoulder 550 has a width between approximately 0 mm and 10 mm, for example, 5 mm to about 7 mm. Sleeve shoulder 550 corresponds to bore shoulder 551. Bore shoulder 551 has a width between approximately 0 mm and 10 mm, for example, 5 mm to about 7 mm. According to some embodiments, coating 401 continues from chamfer coating 425 on top of bore shoulder 551.

[0036] Figure 6 A nut embodiment 600 of a lift pin sleeve 409 and a body 180 having a securing method is shown, wherein the lift pin sleeve 409 is secured to the body 180 by a nut 615. In some embodiments, the lift pin sleeve 409 has a sleeve top 509, an inner diameter 429, an outer diameter 625, and a lower threaded portion 611. The outer diameter 625 can be from about 5 mm to about 10 mm. The lower threaded portion 611 includes threads 601 extending a thread length 603. The thread length 603 can be from about 0 mm to about 15 mm. The sleeve threads 603 mate with the nut threads 605. The nut 615 can be round, hexagonal, or other suitable nut shapes. The nut 615 can be made of a material containing Teflon TM Materials containing PEEK TM Materials and / or containing Rexolite TM and / or any other suitable material. For example, the nut can be made of a material comprising a non-conductive ceramic. The nut 615 has a thickness 607 and a diameter 627 or outermost point, which is sized to fit within the nut recess 621 of the body 180. For example, the nut diameter 627 can be approximately 20 mm to approximately 31 mm, and the nut thickness 607 can be approximately 5 mm to approximately 20 mm. The nut recess 621 has a diameter 619 and a depth 617. The nut recess diameter 619 can be approximately 25 mm to approximately 45 mm. The nut recess depth 617 can be approximately 5 mm to approximately 20 mm. In some embodiments, the nut recess 621 is configured to enable a 5 / 8 nut under ASME B1.1, UNC to be secured to the lift pin sleeve 409, wherein the nut 615 body is located between the body base surface 180a and the base surface 180b. The diameter 619 is concentric with the inner diameter 313. In other embodiments, the nut recess 621 is not concentric with the inner diameter 313 of the lift pin bore. Furthermore, in other embodiments, the recess 621 is square or scale-like in shape and can be designed to hold the nut 615 in place as the sleeve 409 is threaded in. Additionally, the nut 615 can secure the lift pin sleeve 409 so that the surface of the sleeve top 509 is above or below the top 403 of the coating 401. For example, the nut 615 can be tightened to align the sleeve top 509 with the body substrate surface 180a.

[0037] While the foregoing is directed to examples of the present invention, other and further examples may be devised without departing from the basic scope thereof, and the scope of the present invention is determined by the appended claims.

Claims

1. A substrate support, comprising: a body having a substrate surface, wherein the body comprises metal; a plurality of lift pin holes formed in the body, wherein each of the plurality of lift pin holes comprises: through holes; and a chamfered surface extending between the substrate surface and the through-hole, wherein the chamfered surface is configured to mate with a lift pin bushing of a plurality of lift pin bushings; and A dielectric coating is disposed on the substrate surface and the chamfered surface, wherein the dielectric coating comprises: a substrate support surface; thickness; and A pattern is disposed in the substrate supporting surface.

2. The substrate support of claim 1 , further comprising a plurality of lift pin bushings, wherein each of the plurality of lift pin bushings comprises: a bore body comprising a sleeve material; substrate surface; a pin hole disposed through the body; a chamfer, the chamfer being provided on the exterior of the main body; and A threaded region is disposed on the exterior of the body.

3. The substrate support of claim 1 , further comprising a plurality of lift pin bushings, wherein each of the plurality of lift pin bushings comprises: Sleeve body; and An external thread is provided on the exterior of the sleeve body.

4. The substrate support of claim 3, further comprising a plurality of lift pin sleeves and a plurality of turnbuckles, wherein the turnbuckles are configured to secure a surface of a lift pin sleeve of the plurality of lift pin sleeves to a portion of the dielectric coating disposed above the body.

5. An electrostatic chuck assembly configured to support a substrate when the substrate is disposed on the electrostatic chuck, wherein the electrostatic chuck assembly comprises: a main body of the electrostatic chuck assembly; a substrate surface, the substrate surface being configured to face the substrate; a dielectric coating disposed on the body, wherein the dielectric coating comprises: top; thickness; and A pattern, wherein the pattern is arranged on the substrate surface; a plurality of lift pin holes disposed in the body, wherein each of the plurality of lift pin holes comprises: a top surface coated with a dielectric coating; a chamfered surface coated with the dielectric coating; and Depth; and a plurality of lift pin bushings disposed within the plurality of lift pin holes, wherein each of the plurality of lift pin bushings comprises: a sleeve body, the sleeve body comprising a sleeve material; substrate surface; a pin hole disposed through the sleeve body; and A chamfer is provided on the exterior of the sleeve body. 6 . The electrostatic chuck assembly of claim 5 , wherein each of the plurality of lift pin bushings includes a threaded region extending from the chamfered base to near a bottom surface of the lift pin bushing body.

7. The electrostatic chuck assembly of claim 5, wherein each of the plurality of lift pin bushings includes a threaded region in a lower region of the lift pin bushing body to near a bottom surface of the lift pin bushing.

8. The electrostatic chuck assembly of claim 7, wherein the threaded region of each of the plurality of lift pin sleeves is configured to be threaded into a turnbuckle.

9. The electrostatic chuck assembly of claim 8, wherein the turnbuckle is constructed from the sleeve material.

10. The electrostatic chuck assembly of claim 5, wherein the sleeve material comprises a polytetrafluoroethylene-containing material.

11. The electrostatic chuck assembly of claim 5, wherein the substrate surfaces of the plurality of lift pin bushings are aligned with the top surface of the dielectric coating.

12. The electrostatic chuck assembly of claim 5, wherein the base surface of the plurality of lift pin bushings is disposed a distance from the top surface of the dielectric coating.

13. The electrostatic chuck assembly of claim 5, wherein the pin bores of the plurality of lift pin bushings comprise a diameter configured to have a pin tolerance.

14. The electrostatic chuck assembly of claim 5, wherein the electrostatic chuck is configured as a monopolar chuck.

15. A method of manufacturing a main body of an electrostatic chuck assembly, comprising the steps of: Forming the main body, including: substrate real estate; and base surface; forming a plurality of lift pin holes, the lift pin holes passing through the substrate surface of the main body to the base surface of the main body; chamfering the plurality of lift pin holes in the substrate surface of the main body; coating the body with a dielectric coating; forming a pattern in the dielectric coating disposed on the substrate surface; and The dielectric coating disposed on the substrate surface is polished.

16. The method of claim 15, wherein coating the body comprises coating the base surface and chamfered portions of the plurality of lift pin holes while substantially preventing a coating from being disposed on surfaces of the lift pin holes and the base surface.

17. The method according to claim 15, further comprising the steps of: A plurality of nut recesses are formed in the base surface of the body.

18. The method of claim 15, wherein the plurality of lift pin holes are configured to mate with a plurality of lift pin bushings.

19. The method according to claim 18, further comprising the steps of: The plurality of lift pin holes are threaded.

20. The method according to claim 15, further comprising the steps of: A plurality of nut recesses are formed in the base surface of the body, wherein; the plurality of lift pin holes being configured to mate with a plurality of lift pin sleeves; the plurality of nut recesses being configured to receive a plurality of turnbuckles; and The plurality of lift pin holes are configured to allow the plurality of turnbuckles to secure the plurality of lift pin sleeve tubes.

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