Laser processing control method and device

Abstract

The invention is suitable for the technical field of material processing, and provides a laser processing control method and device, and the method comprises the steps: obtaining a plurality of processing instructions related to a target workpiece; determining a plurality of task processing areas of the target workpiece according to the plurality of processing instructions; according to a preset galvanometer working range of the galvanometer laser assembly, the multiple machining instructions in each task machining area are grouped, and multiple machining area groups are obtained; and then, according to the types of the plurality of processing area groups, original coordinate values in the plurality of processing instructions contained in each processing area group are converted into synthetic coordinate values, and a target instruction for processing the target workpiece is generated, so that a galvanometer laser assembly or a linear motion assembly is controlled to process the target workpiece according to the target instruction. The machining advantages of the galvanometer laser assembly and the linear motion assembly can be fully exerted, and the machining effects of improving the machining speed and increasing the machining size are achieved.

Description

Technical Field

[0001] The present application belongs to the field of material processing technology, and in particular relates to a laser processing control method and device. Background Art

[0002] Currently, the main processing methods for engraving or cutting by laser are the galvanometer laser method and the linear motion laser method.

[0003] The galvanometer laser method achieves engraving or cutting by changing the angle of the reflector in the galvanometer system to control the direction of the laser beam. This method does not require moving the laser head or worktable, and the engraving or cutting speed is fast, reaching several meters per second, but the processing area is generally small. The linear motion laser method, also known as the XY motion laser, achieves engraving or cutting by moving the laser head or worktable through a mechanical system. This method is suitable for engraving or cutting large areas, but because it requires moving mechanical parts, the processing speed is limited by the acceleration and maximum speed of the mechanical system, resulting in a slow processing speed. Therefore, existing laser processing methods have the problem of not being able to balance processing speed and processing size. Summary of the Invention

[0004] The embodiments of the present application provide a laser processing control method and device, which can solve the problem that existing laser processing methods cannot take into account both processing speed and processing size.

[0005] In a first aspect, an embodiment of the present application provides a laser processing control method, which is applied to a laser processing device, wherein the laser processing device includes a galvanometer laser assembly and a linear motion assembly, and the method includes:

[0006] Acquire a plurality of processing instructions related to a target workpiece, wherein the processing instructions at least include original coordinate values;

[0007] determining a plurality of task processing areas of the target workpiece according to a plurality of the processing instructions;

[0008] According to a preset galvanometer working range of the galvanometer laser assembly, the plurality of processing instructions in each task processing area are grouped to obtain a plurality of processing area groups, wherein the preset galvanometer working range is determined based on a maximum working distance between a transverse axis and a longitudinal axis of the galvanometer laser assembly; and each processing area group contains at least one processing instruction;

[0009] According to the categories of the multiple processing area groups, the original coordinate values ​​in the multiple processing instructions contained in each processing area group are converted into synthetic coordinate values, and target instructions for processing the target workpiece are generated to control the galvanometer laser assembly or the linear motion assembly to process the target workpiece according to the target instructions.

[0010] In a possible implementation of the first aspect, the plurality of processing instructions in each task processing area are grouped according to a preset galvanometer working range of the galvanometer laser assembly to obtain a plurality of processing area groups, including:

[0011] Determining the maximum working rectangle of the galvanometer laser assembly according to the preset galvanometer working range;

[0012] Calculating each of the processing instructions in the task processing area to obtain a minimum enclosing rectangle corresponding to each of the processing instructions;

[0013] According to the minimum enclosing rectangle corresponding to each processing instruction and the maximum working rectangle of the galvanometer laser assembly, the multiple processing instructions in the task processing area are grouped to determine the multiple processing area groups in the task processing area.

[0014] In a possible implementation of the first aspect, the categories of the processing area groups include a first area category and a second area category, and the grouping of the multiple processing instructions in the task processing area according to the minimum enclosing rectangle corresponding to each processing instruction and the maximum working rectangle of the galvanometer laser assembly to determine the multiple processing area groups in the task processing area includes:

[0015] Calculating the original coordinate values ​​in the current processing instruction to obtain a minimum enclosing rectangle corresponding to the current processing instruction;

[0016] Comparing the minimum enclosing rectangle corresponding to the current processing instruction with the maximum working rectangle of the galvanometer laser assembly;

[0017] If the minimum enclosing rectangle corresponding to the current processing instruction is within the range of the maximum working rectangle of the galvanometer laser assembly, the minimum enclosing rectangle corresponding to the current processing instruction is used as the first processing area group, and the category of the first processing area group is determined to be the first area category;

[0018] If the minimum enclosing rectangle corresponding to the current processing instruction exceeds the range of the maximum working rectangle of the galvanometer laser assembly, the minimum enclosing rectangle corresponding to the current processing instruction is used as the second processing area group, and the category of the second processing area group is determined to be the second area category.

[0019] In a possible implementation of the first aspect, after obtaining the minimum enclosing rectangle corresponding to the current processing instruction as the first processing area group, the method includes:

[0020] Calculating the original coordinate values ​​in the next processing instruction to obtain a minimum enclosing rectangle corresponding to the next processing instruction;

[0021] comparing the minimum enclosing rectangle corresponding to the next processing instruction with the maximum working rectangle of the galvanometer laser assembly;

[0022] If the minimum enclosing rectangle corresponding to the next processing instruction is within the range of the maximum working rectangle of the galvanometer laser assembly and the area formed by the minimum enclosing rectangle corresponding to the next processing instruction and the minimum enclosing rectangle corresponding to the current processing instruction is within the range of the maximum working rectangle of the galvanometer laser assembly, then the minimum enclosing rectangle corresponding to the next processing instruction is divided into the first processing area group;

[0023] If the minimum enclosing rectangle corresponding to the next processing instruction is within the range of the maximum working rectangle of the galvanometer laser assembly and the area formed by the minimum enclosing rectangle corresponding to the next processing instruction and the minimum enclosing rectangle corresponding to the current processing instruction is not within the range of the maximum working rectangle of the galvanometer laser assembly, the minimum enclosing rectangle corresponding to the next processing instruction is used as a third processing area group, and the category of the third processing area group is determined to be the first area category;

[0024] If the minimum enclosing rectangle corresponding to the next processing instruction is not within the range of the maximum working rectangle of the galvanometer laser assembly, the minimum enclosing rectangle corresponding to the next processing instruction is used as the fourth processing area group, and the category of the fourth processing area group is determined to be the second area category.

[0025] In a possible implementation of the first aspect, the original coordinate values ​​include original horizontal coordinate values ​​and original vertical coordinate values, and the composite coordinate values ​​include composite horizontal coordinate values ​​and composite vertical coordinate values; and the converting, based on the categories of the plurality of processing area groups, the original coordinate values ​​in the plurality of processing instructions included in each processing area group into composite coordinate values ​​to generate a target instruction for processing the target workpiece includes:

[0026] When the category of the processing area group is the first area category, determining the galvanometer working center point coordinate value and the galvanometer working axis coordinate value of the processing area group according to the original coordinate values ​​in the plurality of processing instructions included in the processing area group, wherein the galvanometer working center point coordinate value includes a center point transverse coordinate value and a center point longitudinal coordinate value; the galvanometer working axis coordinate value includes a galvanometer transverse axis coordinate value and a galvanometer longitudinal axis coordinate value;

[0027] Converting the original coordinate values ​​of the plurality of machining instructions included in the machining area group into the synthesized coordinate values ​​according to the coordinate value of the galvanometer working center point and the coordinate value of the galvanometer working axis in the machining area group, and generating a first target instruction for machining the target workpiece corresponding to the first area category;

[0028] When the category of the processing area group is the second area category, the original coordinate values ​​in the plurality of processing instructions included in the processing area group are directly used as the synthesized coordinate values ​​to generate a second target instruction for processing the target workpiece corresponding to the second area category.

[0029] In a possible implementation of the first aspect, converting the original coordinate values ​​in the plurality of machining instructions included in the machining area group into the synthesized coordinate values ​​based on the coordinate value of the galvanometer working center point and the coordinate value of the galvanometer working axis in the machining area group, and generating a first target instruction for machining the target workpiece corresponding to the first area category, includes:

[0030] Obtaining the synthesized transverse coordinate value according to the transverse coordinate value of the center point and the transverse axis coordinate value of the galvanometer;

[0031] Obtaining the composite longitudinal coordinate value according to the longitudinal coordinate value of the center point and the longitudinal axis coordinate value of the galvanometer;

[0032] Obtaining the synthesized coordinate value corresponding to the original coordinate value in each processing instruction according to the synthesized horizontal coordinate value and the synthesized vertical coordinate value;

[0033] The first target instruction for processing the target workpiece corresponding to the first area category is generated according to the plurality of synthesized coordinate values ​​in the processing area group.

[0034] In a possible implementation of the first aspect, controlling the galvanometer laser assembly or the linear motion assembly to process the target workpiece according to the target instruction includes:

[0035] When the target instruction is the first target instruction, controlling the galvanometer laser assembly to move and processing the target workpiece according to the first target instruction;

[0036] When the target instruction is the second target instruction, the linear motion component and the galvanometer laser component are controlled to move in combination and the target workpiece is processed according to the second target instruction.

[0037] In a possible implementation of the first aspect, the processing instruction includes at least one of the following: a rapid positioning instruction, a linear processing instruction;

[0038] The step of determining a plurality of task processing areas of the target workpiece according to the plurality of processing instructions includes:

[0039] Determine the currently appearing quick positioning instruction as the first quick positioning instruction;

[0040] determining the next occurring quick positioning instruction as a second quick positioning instruction;

[0041] A plurality of task processing areas for processing the target workpiece are determined according to the first rapid positioning instruction and the plurality of linear processing instructions between the first rapid positioning instruction and the second rapid positioning instruction.

[0042] In a possible implementation of the first aspect, determining the plurality of task processing areas for processing the target workpiece according to the first rapid positioning instruction and the plurality of linear processing instructions between the first rapid positioning instruction and the second rapid positioning instruction includes:

[0043] Extracting coordinate values ​​of the first rapid positioning instruction and a plurality of the linear processing instructions between the first rapid positioning instruction and the second rapid positioning instruction respectively, to obtain a plurality of position coordinate values ​​in each of the processing instructions;

[0044] Determine a minimum position coordinate value and a maximum position coordinate value from the plurality of position coordinate values;

[0045] The task processing area corresponding to the first rapid positioning instruction and the second rapid positioning instruction is determined according to the minimum position coordinate value and the maximum position coordinate value.

[0046] In a possible implementation of the first aspect, obtaining a plurality of processing instructions related to the target workpiece includes:

[0047] Acquire processing task data related to the target workpiece, wherein the processing task data contains object information for processing the target workpiece into a plurality of target objects, wherein the target objects include at least one of the following: text, graphics, and images;

[0048] The object information of the plurality of target objects is converted to generate the plurality of machining instructions related to the target workpiece.

[0049] In a second aspect, an embodiment of the present application provides a laser processing control device, which is applied to a laser processing device, wherein the laser processing device includes a galvanometer laser assembly and a linear motion assembly, and the device includes:

[0050] An acquisition module, configured to acquire a plurality of processing instructions related to a target workpiece, wherein the processing instructions at least include original coordinate values;

[0051] A processing module, configured to determine a plurality of task processing areas of the target workpiece according to the plurality of processing instructions;

[0052] a grouping module, configured to group the plurality of processing instructions in each task processing area according to a preset galvanometer working range of the galvanometer laser assembly to obtain a plurality of processing area groups, wherein the preset galvanometer working range is determined based on a maximum working distance between a transverse axis and a longitudinal axis of the galvanometer laser assembly; and each processing area group contains at least one processing instruction;

[0053] A conversion module is used to convert the original coordinate values ​​in the multiple processing instructions contained in each processing area group into synthetic coordinate values ​​according to the categories of the multiple processing area groups, generate target instructions for processing the target workpiece, and control the galvanometer laser assembly or the linear motion assembly to process the target workpiece according to the target instructions.

[0054] In a third aspect, an embodiment of the present application provides an electronic device comprising a memory, a processor, and a computer program stored in the memory and executable on the processor, wherein the processor implements any of the above-described laser processing control methods when executing the computer program.

[0055] In a fourth aspect, an embodiment of the present application provides a computer-readable storage medium, wherein the computer-readable storage medium stores a computer program, and when the computer program is executed by a processor, the laser processing control method described in any one of the above items is implemented.

[0056] In a fifth aspect, an embodiment of the present application provides a computer program product, which, when executed on a terminal device, enables the terminal device to execute the laser processing control method described in any one of the above-mentioned first aspects.

[0057] Compared with the prior art, the embodiments of the present application have the following beneficial effects:

[0058] The present application provides a laser processing control method, which is applied to a laser processing device including a galvanometer laser assembly and a linear motion assembly, and includes: obtaining multiple processing instructions related to a target workpiece, wherein the processing instructions include at least raw coordinate values; determining multiple task processing areas of the target workpiece based on the multiple processing instructions; grouping the multiple processing instructions in each task processing area according to a preset galvanometer working range of the galvanometer laser assembly to obtain multiple processing area groups, wherein the preset galvanometer working range is determined based on the maximum working distance of the transverse axis and the longitudinal axis of the galvanometer laser assembly, and each processing area group includes at least one processing instruction; then, based on the categories of the multiple processing area groups, converting the raw coordinate values ​​in the multiple processing instructions included in each processing area group into composite coordinate values, generating a target instruction for processing the target workpiece, and controlling the galvanometer laser assembly or the linear motion assembly to process the target workpiece according to the target instruction. By analyzing and converting the processing instructions related to the target workpiece to generate new target instructions for processing the target workpiece, the processing advantages of the galvanometer laser assembly and the linear motion assembly can be fully utilized to achieve the processing effect of increasing processing speed and increasing processing size. BRIEF DESCRIPTION OF THE DRAWINGS

[0059] In order to more clearly illustrate the technical solutions in the embodiments of the present application, the following briefly introduces the drawings required for use in the embodiments or descriptions of the prior art. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without any creative work.

[0060] Figure 1 This is a flow chart of a laser processing control method provided in one embodiment of the present application;

[0061] Figure 2 This is a schematic diagram of a task processing area provided by an embodiment of the present application;

[0062] Figure 3 This is a schematic diagram of a processing area group provided by an embodiment of the present application;

[0063] Figure 4 is a schematic diagram of processing a target workpiece according to a second target instruction provided by an embodiment of the present application;

[0064] Figure 5 This is a structural diagram of a laser processing control device provided in one embodiment of the present application;

[0065] Figure 6 This is a structural diagram of an electronic device provided in one embodiment of the present application. DETAILED DESCRIPTION

[0066] In the following description, specific details such as specific system structures and techniques are provided for purposes of illustration rather than limitation to facilitate a thorough understanding of the embodiments of the present application. However, it will be apparent to those skilled in the art that the present application may be implemented in other embodiments without these specific details. In other cases, detailed descriptions of well-known systems, devices, circuits, and methods are omitted to avoid obscuring the description of the present application with unnecessary detail.

[0067] It should be understood that when used in the present specification and the appended claims, the term "comprising" indicates the presence of described features, integers, steps, operations, elements and / or components, but does not preclude the presence or addition of one or more other features, integers, steps, operations, elements, components and / or collections thereof.

[0068] It will also be understood that the term "and / or" used in this specification and the appended claims refers to and includes any and all possible combinations of one or more of the associated listed items.

[0069] As used in this specification and the appended claims, the term "if" can be interpreted as "when" or "upon" or "in response to determining" or "in response to detecting," depending on the context. Similarly, the phrase "if it is determined" or "if [described condition or event] is detected" can be interpreted as meaning "upon determination" or "in response to determining" or "upon detection of [described condition or event]" or "in response to detecting [described condition or event]," depending on the context.

[0070] In addition, in the description of the present application specification and the appended claims, the terms "first", "second", "third", etc. are only used to distinguish the descriptions and cannot be understood as indicating or implying relative importance.

[0071] References to "one embodiment" or "some embodiments" in this specification mean that a particular feature, structure, or characteristic described in conjunction with that embodiment is included in one or more embodiments of the present application. Thus, phrases such as "in one embodiment," "in some embodiments," "in other embodiments," and "in other embodiments" appearing in various places in this specification do not necessarily refer to the same embodiment, but rather mean "one or more but not all embodiments," unless otherwise specifically emphasized. The terms "including," "comprising," "having," and variations thereof all mean "including but not limited to," unless otherwise specifically emphasized.

[0072] Currently, the main processing methods for engraving or cutting by laser are the galvanometer laser method and the linear motion laser method.

[0073] The galvanometer laser method uses a galvanometer system to control the direction of the laser beam. This system consists of two high-speed rotating mirrors. By changing the mirror angles, the laser beam is rapidly moved to achieve engraving or cutting. The galvanometer laser method does not require movement of the laser head or worktable; the laser beam is moved by rapidly adjusting the galvanometer mirrors. This method typically achieves faster processing speeds, reaching several meters per second. However, due to the limited deflection angle of the laser beam, the working area is typically smaller.

[0074] Linear motion laser processing (also known as XY motion laser processing) uses a mechanical system to move the laser head or worktable to achieve engraving or cutting. The laser head moves along the X and Y axes, engraving or cutting point by point or line by line. Linear motion laser processing is suitable for engraving and cutting large areas and is typically used in applications requiring a large working range. However, because linear motion laser processing requires moving mechanical components to achieve engraving or cutting, processing speed is limited by the acceleration and maximum speed of the mechanical system, resulting in relatively slow processing speeds.

[0075] Therefore, in the embodiment of the present application, the advantages of the galvanometer laser method and the XY motion laser method are combined together to overcome the disadvantages of the galvanometer laser and the XY motion laser, forming a galvanometer and XY mixed motion laser, thereby giving full play to the advantages of the galvanometer laser and the XY motion laser to solve the problem that the existing laser processing method cannot take into account both processing speed and processing size.

[0076] See also Figure 1 , Figure 1 FIG. 1 is a flow chart of a laser processing control method provided in one embodiment of the present application. The laser processing control method includes:

[0077] S11. Acquire multiple processing instructions related to the target workpiece, wherein the processing instructions at least include original coordinate values.

[0078] S12. Determine multiple task processing areas of the target workpiece according to the multiple processing instructions.

[0079] S13. According to the preset galvanometer working range of the galvanometer laser assembly, multiple processing instructions in each initial processing area are grouped to obtain multiple processing area groups, wherein the preset galvanometer working range is determined based on the maximum working distance of the transverse axis and the longitudinal axis in the galvanometer laser assembly; and the processing area group contains at least one processing instruction.

[0080] S14. According to the categories of the multiple processing area groups, the original coordinate values ​​in the multiple processing instructions contained in each processing area group are converted into synthetic coordinate values, and a target instruction for processing the target workpiece is generated to control the galvanometer laser assembly or the linear motion assembly to process the target workpiece according to the target instruction.

[0081] By way of example and not limitation, the laser processing control method can be applied to a laser processing device comprising a galvanometer laser assembly and a linear motion assembly. The laser processing device is configured to execute the laser processing control method to control the galvanometer laser assembly or the linear motion assembly to process a target workpiece. The galvanometer laser assembly is the component that processes the target workpiece using a galvanometer laser method, and the linear motion assembly is the component that processes the target workpiece using an XY motion laser method.

[0082] It should be noted that, in this embodiment, the execution entity may be a terminal device such as a server, and there is no specific limitation on this.

[0083] In step S11, the target workpiece is a part or product that requires laser processing, such as engraving or cutting. Processing instructions are instructions used to direct the galvanometer laser assembly or linear motion assembly in the laser processing equipment to perform processing operations on the target workpiece. Each processing instruction includes at least raw coordinate values ​​used to determine the starting and ending positions of the processing operation in the target workpiece coordinate system. Processing instructions may also include parameters such as processing speed and processing power.

[0084] In one possible implementation, obtaining multiple processing instructions related to a target workpiece includes:

[0085] Processing task data related to the target workpiece is acquired, wherein the processing task data contains object information for processing the target workpiece into multiple target objects, and the target objects include at least one of the following: text, graphics, and images.

[0086] The object information of a plurality of target objects is converted to generate a plurality of machining instructions related to the target workpieces.

[0087] Specifically, first, processing task data related to the processing of the target workpiece is obtained from the design file or other data sources. These processing task data contain object information for processing the target workpiece into various target objects such as text, graphics, and images. That is, the target objects that need to be processed on the target workpiece are in various forms such as text, graphics, and images. Then, the object information of these target objects is converted in sequence (such as coordinate conversion, parameter setting, instruction formatting, etc.) to generate the required processing instructions. Coordinate conversion is to convert the position coordinates in the object information into a coordinate format that can be recognized by the laser processing equipment; parameter setting is to set the corresponding processing parameters according to the type and characteristics of the target object; instruction formatting is to organize the converted coordinates and parameters according to the instruction format supported by the laser processing equipment. For example, in this example, the object information is converted into the G code format used by the galvanometer laser assembly and the linear motion assembly.

[0088] It should be noted that after obtaining the target object information in the target workpiece, different target objects can be set in different processing layers. Each processing layer is set with parameters such as speed, power, and working mode. Different processing layers can have different speed, power, working mode, etc. Working modes can include line, stroke, fill, image, etc.

[0089] In step S12, the task processing area is defined as the processing area separated by rapid positioning instructions (i.e., G0 instructions) within the processing instructions. This area consists of multiple linear processing instructions (i.e., G1 instructions) between one rapid positioning instruction and the next. The processing instructions associated with the target workpiece can define multiple task processing areas, meaning each task processing area can contain multiple linear processing instructions.

[0090] In a possible implementation, the processing instruction includes at least one of the following: a rapid positioning instruction and a linear processing instruction.

[0091] Determine multiple task processing areas of the target workpiece based on multiple processing instructions, including:

[0092] The currently appearing quick positioning instruction is determined as the first quick positioning instruction.

[0093] The next occurring fast positioning instruction is determined as the second fast positioning instruction.

[0094] According to the first rapid positioning instruction and a plurality of linear processing instructions between the first rapid positioning instruction and the second rapid positioning instruction, a plurality of task processing areas for processing the target workpiece are determined.

[0095] It should be noted that, in this embodiment, processing instructions may include rapid positioning instructions (i.e., G0 instructions) and linear processing instructions (i.e., G1 instructions). Rapid positioning instructions are mainly used for rapid jumps, that is, moving the laser head to the target position. At this time, no processing operations such as cutting or engraving are performed; linear processing instructions are mainly used for linear movement of engraving or cutting, that is, moving the laser head along a linear trajectory at a specified feed speed and performing processing operations such as cutting or engraving. Among them, the X-axis coordinate involved in the coordinate values ​​in the rapid positioning instructions and linear processing instructions is called X1, and the Y-axis coordinate is called Y1, for the convenience of subsequent explanation.

[0096] During the laser cutting process, the entire processing instructions are first traversed, and the first appearing fast positioning instruction is taken as the first fast positioning instruction, that is, the first starting position; the next appearing fast positioning instruction is taken as the second fast positioning instruction, that is, the starting position of the next fast movement; then, the first fast positioning instruction and the multiple straight line processing instructions between the first fast positioning instruction and the second fast positioning instruction are defined as a task processing area.

[0097] Assume that the multiple machining instructions related to the target workpiece are as follows:

[0098] G0 X203 Y160

[0099] G1 X320 Y160

[0100] G1 X379 Y160

[0101] G1 X394 Y160

[0102] G0 X406 Y150

[0103] G1 X407 Y150

[0104] G1 X406 Y140......

[0105] Among them, G0 X203 Y160 is the first rapid positioning instruction, G0 X406 Y150 is the second rapid positioning instruction, G1X320Y160, G1 X379 Y160, and G1 X394 Y160 are multiple linear processing instructions between the first rapid positioning instruction and the second rapid positioning instruction. The area determined by the processing instructions G0 X203 Y160, G1 X320 Y160, G1 X379 Y160, and G1 X394 Y160 is a task processing area.

[0106] In one possible implementation, determining multiple task processing areas for processing a target workpiece based on a first rapid positioning instruction and multiple linear processing instructions between the first rapid positioning instruction and the second rapid positioning instruction includes:

[0107] Coordinate values ​​of the first rapid positioning instruction and a plurality of linear processing instructions between the first rapid positioning instruction and the second rapid positioning instruction are extracted respectively to obtain a plurality of position coordinate values ​​in each processing instruction.

[0108] A minimum position coordinate value and a maximum position coordinate value are determined from the plurality of position coordinate values.

[0109] The task processing area corresponding to the first rapid positioning instruction and the second rapid positioning instruction is determined according to the minimum position coordinate value and the maximum position coordinate value.

[0110] Specifically, the processing instruction sequence consisting of the first rapid positioning instruction and multiple straight line processing instructions between the first rapid positioning instruction and the second rapid positioning instruction is traversed, and the coordinate values ​​in the first rapid positioning instruction and each straight line processing instruction are extracted to obtain multiple position coordinate values. These position coordinate values ​​are summarized to form a coordinate set. Then, from the coordinate set, the minimum position coordinate value and the maximum position coordinate value are selected. The area surrounded by the minimum position coordinate value and the maximum position coordinate value is the task processing area corresponding to the first rapid positioning instruction and the second rapid positioning instruction. Figure 2 As shown, Figure 2 This is a schematic diagram of a task processing area provided by an embodiment of the present application. Figure 2 In the figure, the lower left corner coordinate (x1, y1) is the minimum position coordinate value, the upper right corner coordinate (x2, y2) is the maximum position coordinate value, and the boundary range of the area surrounded by the lower left corner coordinate (x1, y1) and the upper right corner coordinate (x2, y2) is the task processing area.

[0111] In step S13, the galvanometer laser assembly usually also includes an X-axis (horizontal axis) and a Y-axis (longitudinal axis). For the sake of distinction, the X-axis when the galvanometer is working is called the B-axis, and the Y-axis is called the C-axis. The maximum working distance of the galvanometer's horizontal axis (B-axis) is called b1, and the maximum working distance of the galvanometer's longitudinal axis (C-axis) is called c1. The preset galvanometer working range is the maximum processing area size that the galvanometer laser assembly can cover in one processing process, which is usually the area composed of the maximum working distance b1 of the galvanometer's horizontal axis and the maximum working distance c1 of the longitudinal axis. For example, in the galvanometer coordinate system, the coordinate value of the lower left corner is (0,0), and the coordinate value of the upper right corner is (b1, c1). Then the rectangular area composed of the lower left corner coordinate value (0,0) and the upper right corner coordinate value (b1, c1) is the preset galvanometer working range.

[0112] A processing area group is a collection of areas created by grouping multiple processing instructions within each task processing area based on the preset galvanometer working range. Each processing area group can include one or more processing instructions. Multiple processing instructions within each processing area group can be processed within the single working range of the galvanometer laser assembly. This means that multiple processing instructions within a processing area group can be completed with just a single movement of the galvanometer laser assembly. This improves processing efficiency and reduces the need for frequent movement and adjustment of the galvanometer laser assembly.

[0113] In step S14, the synthesized coordinate values ​​are new coordinate position values ​​obtained by converting the original coordinate values ​​in the multiple processing instructions included in each processing area group. Specifically, the original coordinate values ​​are converted into coordinate position values ​​in the coordinate system of the laser processing equipment including the galvanometer laser assembly and the linear motion assembly. The synthesized coordinate values ​​can be used to generate target instructions for processing the target workpiece. The target instructions can be used to control the galvanometer laser assembly or the linear motion assembly to process the target workpiece according to the specified processing path and parameters.

[0114] The galvanometer laser assembly and the linear motion assembly are mixed in the laser processing equipment. The X-axis and Y-axis of the linear motion laser assembly are called the X2-axis and Y2-axis. The horizontal coordinate corresponding to the X-axis of the laser processing equipment is composed of the X2-axis of the linear motion assembly and the B-axis of the galvanometer laser assembly, that is, (X2, B). The vertical coordinate corresponding to the Y-axis of the laser processing equipment is composed of the Y2-axis of the linear motion assembly and the C-axis of the galvanometer laser assembly, that is, (Y2, C). In other words, the processing instructions that originally only supported linear motion XY engraving or cutting were changed into processing instructions that support the mixed operation of linear motion XY and galvanometer laser BC. This can overcome the shortcomings of galvanometer lasers and XY linear motion lasers and give full play to the advantages of galvanometer lasers and XY linear motion lasers.

[0115] It is understood that an embodiment of the present application provides a laser processing control method, which is applied to a laser processing device including a galvanometer laser assembly and a linear motion assembly, and includes: obtaining multiple processing instructions related to a target workpiece, wherein the processing instructions include at least raw coordinate values; determining multiple task processing areas of the target workpiece based on the multiple processing instructions; grouping the multiple processing instructions in each task processing area according to a preset galvanometer working range of the galvanometer laser assembly to obtain multiple processing area groups, wherein the preset galvanometer working range is determined based on the maximum working distance of the transverse axis and the longitudinal axis of the galvanometer laser assembly; each processing area group includes at least one processing instruction; then, based on the categories of the multiple processing area groups, converting the raw coordinate values ​​in the multiple processing instructions included in each processing area group into synthetic coordinate values, generating a target instruction for processing the target workpiece, and controlling the galvanometer laser assembly or the linear motion assembly to process the target workpiece according to the target instruction. By analyzing and converting the processing instructions related to the target workpiece to generate new target instructions for processing the target workpiece, the processing advantages of the galvanometer laser assembly and the linear motion assembly can be fully utilized to achieve the processing effect of increasing processing speed and increasing processing size.

[0116] In one possible implementation, multiple processing instructions in each task processing area are grouped according to a preset galvanometer working range of the galvanometer laser assembly to obtain multiple processing area groups, including:

[0117] According to the preset galvanometer working range, determine the maximum working rectangle of the galvanometer laser assembly.

[0118] Calculate each processing instruction in the task processing area to obtain the minimum enclosing rectangle corresponding to each processing instruction.

[0119] According to the minimum enclosing rectangle corresponding to each processing instruction and the maximum working rectangle of the galvanometer laser assembly, multiple processing instructions in the task processing area are grouped to determine multiple processing area groups in each task processing area.

[0120] In this embodiment, the maximum working rectangle can be understood as the maximum rectangular area that the galvanometer laser assembly can cover within the preset galvanometer working range. Figure 3 As shown, Figure 3 This is a schematic diagram of a processing area group provided by an embodiment of the present application. Figure 3 In the figure, the dotted rectangle represents the maximum working rectangle of the galvanometer laser assembly. This maximum working rectangle represents the maximum processing capability of the galvanometer laser assembly.

[0121] The minimum enclosing rectangle is the rectangular area represented by the original coordinate values ​​in the machining instruction, which is used to simplify subsequent grouping and calculation. Figure 3 In the figure, R1-R7 represent the minimum enclosing rectangles corresponding to 7 different machining instructions.

[0122] Specifically, first, according to the preset galvanometer working range of the galvanometer laser assembly, the maximum working rectangle of the galvanometer laser assembly, that is, its maximum processing capacity, is determined. Also, the original coordinate values ​​of all processing instructions in the task processing area are traversed to obtain the minimum enclosing rectangle corresponding to each processing instruction. Then, the minimum enclosing rectangle corresponding to each processing instruction is compared with the maximum working rectangle of the galvanometer laser assembly, and all processing instructions are grouped to obtain the processing area group corresponding to each processing instruction, and also obtain multiple processing area groups in each task processing area. Figure 3 In the figure, the minimum enclosing rectangle R2 corresponding to the processing instruction and the minimum enclosing rectangle R3 corresponding to the processing instruction are divided into one processing area group, the minimum enclosing rectangle R4 corresponding to the processing instruction, the minimum enclosing rectangle R5 corresponding to the processing instruction and the minimum enclosing rectangle R6 corresponding to the processing instruction are divided into another processing area group, the minimum enclosing rectangle R1 corresponding to the processing instruction is another processing area group, and the minimum enclosing rectangle R7 corresponding to the processing instruction is another processing area group.

[0123] It should be understood that by dividing the multiple processing instructions in each task processing area into multiple processing area groups according to the working range of the galvanometer laser assembly, it can help optimize the laser processing path, improve the processing speed and ensure the processing quality.

[0124] In a possible implementation, the categories of the processing area group include a first area category and a second area category. According to the minimum enclosing rectangle corresponding to each task processing area and the maximum working rectangle of the galvanometer laser assembly, multiple processing instructions in the task processing area are grouped to determine multiple processing area groups in the task processing area, including:

[0125] The original coordinate values ​​in the current processing instruction are calculated to obtain the minimum enclosing rectangle corresponding to the current processing instruction.

[0126] Compare the minimum enclosing rectangle corresponding to the current processing instruction with the maximum working rectangle of the galvanometer laser assembly.

[0127] If the minimum enclosing rectangle corresponding to the current processing instruction is within the range of the maximum working rectangle of the galvanometer laser assembly, the minimum enclosing rectangle corresponding to the current processing instruction is used as the first processing area group, and the category of the first processing area group is determined to be the first area category.

[0128] If the minimum enclosing rectangle corresponding to the current processing instruction exceeds the range of the maximum working rectangle of the galvanometer laser assembly, the minimum enclosing rectangle corresponding to the current processing instruction is used as the second processing area group, and the category of the second processing area group is determined to be the second area category.

[0129] In this embodiment, when the category of the processing area group is the first area category, it means that the processing area group can be processed by the galvanometer laser assembly; when the category of the processing area group is the second area category, it means that the processing area group can be processed by the combined movement of the linear motion assembly and the galvanometer laser assembly.

[0130] Specifically, when grouping multiple processing instructions in each task processing area, first, the current processing instruction (i.e., the processing instruction that appears for the first time) is calculated to obtain the minimum enclosing rectangle corresponding to the current processing instruction; then, the minimum enclosing rectangle corresponding to the current processing instruction is compared with the maximum working rectangle of the galvanometer laser assembly. If the minimum enclosing rectangle corresponding to the current processing instruction is completely within the range of the maximum working rectangle of the galvanometer laser assembly, that is, the target workpiece can be processed by the galvanometer laser assembly according to the current processing instruction, then the minimum enclosing rectangle corresponding to the current processing instruction is used as the first processing area group, and the category of the first processing area group is the first area category; if the minimum enclosing rectangle corresponding to the current processing instruction completely exceeds the range of the maximum working rectangle of the galvanometer laser assembly, that is, it exceeds the maximum processing capacity of the galvanometer laser assembly, and the target workpiece can be processed according to the current processing instruction by the combined motion of the linear motion assembly and the galvanometer laser assembly, then the minimum enclosing rectangle corresponding to the current processing instruction is used as the second processing area group, and the category of the second processing area group is the second area category. At this time, the second processing area group is a processing area group different from the first processing area group.

[0131] Furthermore, after obtaining the minimum enclosing rectangle corresponding to the current processing instruction as the first processing area group, it is necessary to group the subsequent multiple processing instructions. The method includes:

[0132] The original coordinate values ​​in the next processing instruction are calculated to obtain the minimum enclosing rectangle corresponding to the next processing instruction.

[0133] The minimum enclosing rectangle corresponding to the next machining instruction is compared with the maximum working rectangle of the galvanometer laser assembly.

[0134] If the minimum enclosing rectangle corresponding to the next processing instruction is within the range of the maximum working rectangle of the galvanometer laser assembly and the area formed by the minimum enclosing rectangle corresponding to the next processing instruction and the minimum enclosing rectangle corresponding to the current processing instruction is within the range of the maximum working rectangle of the galvanometer laser assembly, then the minimum enclosing rectangle corresponding to the next processing instruction is divided into the first processing area group.

[0135] If the minimum enclosing rectangle corresponding to the next processing instruction is within the range of the maximum working rectangle of the galvanometer laser assembly and the area formed by the minimum enclosing rectangle corresponding to the next processing instruction and the minimum enclosing rectangle corresponding to the current processing instruction is not within the range of the maximum working rectangle of the galvanometer laser assembly, then the minimum enclosing rectangle corresponding to the next processing instruction is used as the third processing area group, and the category of the third processing area group is determined to be the first area category.

[0136] If the minimum enclosing rectangle corresponding to the next processing instruction is not within the range of the maximum working rectangle of the galvanometer laser assembly, the minimum enclosing rectangle corresponding to the next processing instruction is used as the fourth processing area group, and the category of the fourth processing area group is determined to be the second area category.

[0137] Specifically, the calculation is continued for the next processing instruction to obtain the minimum enclosing rectangle corresponding to the next processing instruction, and then the minimum enclosing rectangle corresponding to the next processing instruction is compared with the maximum working rectangle of the galvanometer laser assembly.

[0138] If the minimum enclosing rectangle corresponding to the next processing instruction is within the range of the maximum working rectangle of the galvanometer laser assembly and the area formed by the minimum enclosing rectangle corresponding to the next processing instruction and the minimum enclosing rectangle corresponding to the current processing instruction is within the range of the maximum working rectangle of the galvanometer laser assembly, then the minimum enclosing rectangle corresponding to the next processing instruction is divided into the first processing area group where the current processing instruction is located.

[0139] If the minimum enclosing rectangle corresponding to the next processing instruction is within the maximum working rectangle of the galvanometer laser assembly, and the area formed by the minimum enclosing rectangle corresponding to the next processing instruction and the minimum enclosing rectangle corresponding to the current processing instruction is not within the maximum working rectangle of the galvanometer laser assembly, then the minimum enclosing rectangle corresponding to the next processing instruction is used as the third processing area group. In other words, the minimum enclosing rectangle corresponding to the next processing instruction is re-divided into a processing area group, and the category of the third processing area group is determined to be the first area category. In other words, in the third processing area group, the target workpiece can still be processed by the galvanometer laser assembly according to the processing instructions in the third processing area group.

[0140] If the minimum enclosing rectangle corresponding to the next processing instruction is not within the maximum working rectangle of the galvanometer laser assembly, that is, the minimum enclosing rectangle corresponding to the next processing instruction exceeds the maximum processing capacity of the galvanometer laser assembly, the target workpiece can be processed according to the next processing instruction through the combined movement of the linear motion assembly and the galvanometer laser assembly. In this case, the minimum enclosing rectangle corresponding to the next processing instruction is used as the fourth processing area group. At this time, the category of the fourth processing area group is the second area category.

[0141] It should be noted that the calculation is continued for the third processing instruction (i.e., the next processing instruction, that is, the processing instruction after the above-mentioned next processing instruction) to obtain the minimum enclosing rectangle corresponding to the third processing instruction. Then, the minimum enclosing rectangle corresponding to the third processing instruction is compared with the maximum working rectangle of the galvanometer laser assembly.

[0142] If the minimum enclosing rectangle corresponding to the third processing instruction is within the range of the maximum working rectangle of the galvanometer laser assembly, and at the same time, the minimum enclosing rectangle corresponding to the third processing instruction is within the first processing area group where the current processing instruction is located, then the minimum enclosing rectangle corresponding to the third processing instruction is divided into the first processing area group; or, if the minimum enclosing rectangle corresponding to the third processing instruction is within the range of the maximum working rectangle of the galvanometer laser assembly, and at the same time, the minimum enclosing rectangle corresponding to the third processing instruction is within the third processing area group where the next processing instruction is located, then the minimum enclosing rectangle corresponding to the third processing instruction is divided into the third processing area group.

[0143] If the minimum enclosing rectangle corresponding to the third processing instruction is within the range of the maximum working rectangle of the galvanometer laser assembly, but the minimum enclosing rectangle corresponding to the third processing instruction is not within the first processing area group where the current processing instruction is located, nor is it within the third processing area group where the next processing instruction is located, then the minimum enclosing rectangle corresponding to the third processing instruction is included in the fifth processing area group; that is, the minimum enclosing rectangle corresponding to the third processing instruction is re-divided into a processing area group, and the category of the fifth processing area group is determined to be the first area category.

[0144] like Figure 3As shown, first, the minimum enclosing rectangle R1 corresponding to the processing instruction is compared with the maximum working rectangle of the galvanometer laser assembly (the dotted rectangular box in the figure). If the minimum enclosing rectangle R1 corresponding to the processing instruction exceeds the range of the maximum working rectangle of the galvanometer laser assembly, the minimum enclosing rectangle R1 corresponding to the processing instruction is regarded as a processing area group A1; secondly, the minimum enclosing rectangle R2 corresponding to the processing instruction is compared with the maximum working rectangle of the galvanometer laser assembly. If the minimum enclosing rectangle R2 corresponding to the processing instruction is within the range of the maximum working rectangle of the galvanometer laser assembly, the minimum enclosing rectangle R2 corresponding to the processing instruction is regarded as a processing area group A2; then, the minimum enclosing rectangle R3 corresponding to the processing instruction is compared with the maximum working rectangle of the galvanometer laser assembly. If the minimum enclosing rectangle R3 corresponding to the processing instruction is within the range of the maximum working rectangle of the galvanometer laser assembly and the minimum enclosing rectangle R3 corresponding to the processing instruction is still within the range of the processing area group A2, the minimum enclosing rectangle R3 corresponding to the processing instruction is divided into the processing area group A2. Using the same comparison method as above, if the minimum enclosing rectangle R4 corresponding to the processing instruction is within the range of the maximum working rectangle of the galvanometer laser assembly but not within the range of processing area group A2, then the minimum enclosing rectangle R4 corresponding to the processing instruction is divided into processing area group A3. Similarly, the minimum enclosing rectangle R5 and the minimum enclosing rectangle R6 corresponding to the processing instruction are also within processing area group A3, and the minimum enclosing rectangle R7 corresponding to the processing instruction is within processing area group A4. It should also be noted that if there is a subsequent processing instruction, that is, the minimum enclosing rectangle R8 corresponding to the processing instruction (not shown in the figure), it is necessary to first check whether the minimum enclosing rectangle R8 corresponding to the processing instruction is within the range of the previously existing processing area group A2 or processing area group A3. If the minimum enclosing rectangle R8 corresponding to the processing instruction is in the processing area group A2 or the processing area group A3, the minimum enclosing rectangle R8 corresponding to the processing instruction is divided into the processing area group A2 or the processing area group A3; if the minimum enclosing rectangle R8 corresponding to the processing instruction is not in the processing area group A2 or the processing area group A3, a new processing area group is re-divided for the minimum enclosing rectangle R8 corresponding to the processing instruction (not shown in the figure).

[0145] It should be understood that by dividing the multiple processing instructions in each task processing area into multiple processing area groups according to the working range of the galvanometer laser assembly, and dividing the processing area groups into two categories, it can help optimize the laser processing path, improve the processing speed and ensure the processing quality.

[0146] In one possible implementation, the original coordinate values ​​include original horizontal coordinate values ​​and original vertical coordinate values, and the composite coordinate values ​​include composite horizontal coordinate values ​​and composite vertical coordinate values. According to the categories of the plurality of processing area groups, the original coordinate values ​​in the plurality of processing instructions included in each processing area group are converted into composite coordinate values ​​to generate a target instruction for processing the target workpiece, including:

[0147] When the category of the processing area group is the first area category, the galvanometer working center point coordinate value and the galvanometer working axis coordinate value of the processing area group are determined according to the original coordinate values ​​in the multiple processing instructions contained in the processing area group, wherein the galvanometer working center point coordinate value includes the center point horizontal coordinate value and the center point vertical coordinate value; the galvanometer working axis coordinate value includes the galvanometer horizontal axis coordinate value and the galvanometer vertical axis coordinate value.

[0148] According to the coordinate value of the galvanometer working center point and the coordinate value of the galvanometer working axis in the processing area group, the original coordinate values ​​in the multiple processing instructions contained in the processing area group are converted into synthetic coordinate values ​​to generate a first target instruction for processing the target workpiece corresponding to the first area category.

[0149] When the category of the processing area group is the second area category, the original coordinate values ​​in the plurality of processing instructions included in the processing area group are directly used as the synthesized coordinate values ​​to generate a second target instruction for processing the target workpiece corresponding to the second area category.

[0150] It should be noted that after grouping multiple processing instructions in each task processing area into multiple processing area groups, the original coordinate values ​​in the processing instructions need to be converted according to the category of the processing area group to generate target instructions that can be recognized by the laser processing equipment to process the target workpiece.

[0151] Specifically, when the category of the processing area group is the first area category, that is, the target workpiece needs to be processed by the galvanometer laser assembly, first, it is necessary to determine the galvanometer work center point coordinate value based on all the original coordinate values ​​in all the processing instructions contained in the processing area group, that is, the position to which the galvanometer laser assembly needs to move in the target workpiece, as well as the galvanometer work axis coordinate value. Among them, the galvanometer work center point coordinate value includes the center point transverse coordinate value and the center point longitudinal coordinate value. In this embodiment, the center point transverse coordinate value can be determined by calculating the average value of the original transverse coordinate value of all the original coordinate values ​​in the processing area group, and the center point longitudinal coordinate value can be determined by calculating the average value of the original longitudinal coordinate value of all the original coordinate values ​​in the processing area group. The galvanometer work axis coordinate value includes the galvanometer transverse axis coordinate value and the galvanometer longitudinal axis coordinate value. Then, according to the galvanometer work center point coordinate value and the galvanometer work axis coordinate value, the original coordinate values ​​in the multiple processing instructions in the processing area group are converted into synthetic coordinate values ​​to generate the first target instruction. The first target instruction is a target instruction for processing a processing area group belonging to a first area category in the target workpiece, indicating that the relevant processing area group in the target workpiece can be processed by controlling the galvanometer laser assembly.

[0152] Furthermore, according to the coordinate value of the galvanometer working center point and the coordinate value of the galvanometer working axis of the processing area group, the original coordinate values ​​in the plurality of processing instructions included in the processing area group are converted into synthetic coordinate values, and a first target instruction for processing the target workpiece corresponding to the first area category is generated, including:

[0153] The composite horizontal coordinate value is obtained according to the horizontal coordinate value of the center point and the horizontal axis coordinate value of the galvanometer.

[0154] The composite longitudinal coordinate value is obtained according to the longitudinal coordinate value of the center point and the longitudinal axis coordinate value of the galvanometer.

[0155] According to the synthesized horizontal coordinate value and the synthesized vertical coordinate value, the synthesized coordinate value corresponding to the original coordinate value in each processing instruction is obtained.

[0156] A first target instruction for processing a target workpiece corresponding to a first area category is generated according to a plurality of composite coordinate values ​​in the processing area group.

[0157] In this embodiment, the specific process for converting the original coordinate values ​​in multiple processing instructions into composite coordinate values ​​is as follows: first, the horizontal coordinate value of the center point in the galvanometer working center point coordinate value and the galvanometer transverse axis coordinate value are added to obtain a composite horizontal coordinate value; and then, the vertical coordinate value of the center point in the galvanometer working center point coordinate value and the galvanometer longitudinal axis coordinate value are added to obtain a composite vertical coordinate value. Then, the composite horizontal coordinate value and the composite vertical coordinate value are combined to obtain the composite coordinate value corresponding to the original coordinate value in each processing instruction. Then, the composite coordinate values ​​corresponding to each processing instruction in the processing area group are summarized to generate a first target instruction.

[0158] In the case where the category of the processing area group is the second area category, that is, the target workpiece needs to be processed by the combined movement of the linear motion component and the galvanometer laser component, and the original coordinate value in the processing instruction is directly used as the synthetic coordinate value without the need for coordinate value conversion to generate the second target instruction. The second target instruction is the target instruction for processing the processing area group belonging to the second area category in the target workpiece, indicating that the relevant processing area group in the target workpiece can be processed by controlling the combination of the linear motion component and the galvanometer laser component. That is, in the case where the category of the processing area group is the second area category, according to the second target instruction, it is necessary to control the linear motion component to cooperate with the galvanometer laser component to complete the processing of the relevant processing area group in the target workpiece.

[0159] It should be understood that by generating different target instructions through different categories of processing area groups, the galvanometer laser assembly or linear motion assembly can be controlled to process the target workpiece according to different target instructions, so as to give full play to the processing advantages of the galvanometer laser assembly and the linear motion assembly.

[0160] In one possible implementation, controlling a galvanometer laser assembly or a linear motion assembly to process a target workpiece according to a target instruction includes:

[0161] When the target instruction is the first target instruction, the galvanometer laser assembly is controlled to move and the target workpiece is processed according to the first target instruction.

[0162] When the target instruction is the second target instruction, the linear motion component and the galvanometer laser component are controlled to move in combination and the target workpiece is processed according to the second target instruction.

[0163] Specifically, when the target instruction is the first target instruction, it means that the target workpiece can be processed by moving the galvanometer laser assembly; when the target instruction is the second target instruction, it means that the processing area is larger than the galvanometer processing range, and large-scale movement processing is required, that is, the target workpiece can be processed by moving the linear motion assembly and the galvanometer laser assembly in combination.

[0164] In one example, if Figure 4 As shown, Figure 4 This is a schematic diagram of processing a target workpiece according to a second target instruction provided in an embodiment of the present application. Figure 4 (4-a), (4-b), (4-c), and (4-d) in the figure respectively illustrate processing trajectories at multiple different angles. The target instruction corresponding to this type of processing trajectory is the second target instruction, that is, when the category of the processing area group is the second area category, that is, at this time, the processing area range of this type of processing trajectory exceeds the preset galvanometer working range of the galvanometer laser assembly. The motion of the linear motion assembly and the galvanometer laser assembly can be proportionally distributed according to the motion length in the processing trajectory, and the processing of the processing area range can be completed through the combination of the linear motion assembly and the galvanometer laser assembly. For example, Figure 4 In , the motion trajectory represented by the dotted arrow can be assigned to the linear motion component to complete, and the direction of the motion trajectory represented by the dotted arrow is determined by analyzing the motion angles of two adjacent processing instructions. The motion trajectory represented by the solid arrow here indicates that its motion length has exceeded the working range of the galvanometer laser component. At this time, the motion of the linear motion component and the galvanometer laser component needs to be allocated in proportion. If the motion length of the motion trajectory represented by the current solid arrow is d, and the maximum distance of the galvanometer laser component in the direction of the current solid arrow is z (at this time, z is determined based on the preset galvanometer working range of the galvanometer laser component and the direction of the solid arrow), then the working distance allocated to the galvanometer laser component in proportion is z, then the working distance allocated to the linear motion component is m=dz, thereby completing the processing of this type of processing trajectory through the combined motion of the linear motion component and the galvanometer laser component. From Figure 4 It can be seen that when the category of the processing area group is the second area category, the processing of the target workpiece at any angle can be completed through the combined movement of the linear motion component and the galvanometer laser component.

[0165] It should be noted that under certain working conditions, such as when cutting large-sized workpieces, the galvanometer laser assembly can also be locked and processing can be performed only by moving the linear motion assembly.

[0166] In some examples, suppose that during the processing of a target workpiece, both a fill task and a stroke task are required for the same target object. The fill task is in processing layer m, and the stroke task is in processing layer n. Processing layer m has 200 sub-tasks and 8 work area groups. Processing layer n also has 200 sub-tasks. Therefore, the work area groups in processing layer n need to inherit the work area groups in processing layer m. This ensures that the stroke and fill tasks for the same target object overlap.

[0167] It should be understood that the size of the serial numbers of the steps in the above embodiments does not mean the order of execution. The execution order of each process should be determined by its function and internal logic, and should not constitute any limitation on the implementation process of the embodiments of this application.

[0168] A laser processing control method corresponding to the above embodiment, Figure 5 A schematic structural diagram of a laser processing control device provided in one embodiment of the present application is shown. For ease of explanation, only the parts related to the embodiment of the present application are shown.

[0169] Reference Figure 5 The laser processing control device 2 of this embodiment is applied to laser processing equipment. The laser processing equipment includes a galvanometer laser component and a linear motion component. The laser processing control device 2 includes:

[0170] The acquisition module 21 is configured to acquire a plurality of processing instructions related to the target workpiece, wherein the processing instructions at least include original coordinate values.

[0171] The processing module 22 is configured to determine a plurality of task processing areas of the target workpiece according to a plurality of processing instructions.

[0172] The grouping module 23 is used to group multiple processing instructions in each task processing area according to the preset galvanometer working range of the galvanometer laser assembly to obtain multiple processing area groups, wherein the preset galvanometer working range is determined based on the maximum working distance of the transverse axis and the longitudinal axis in the galvanometer laser assembly; and the processing area group contains at least one processing instruction.

[0173] The conversion module 24 is used to convert the original coordinate values ​​in the multiple processing instructions contained in each processing area group into synthetic coordinate values ​​according to the categories of the multiple processing area groups, generate target instructions for processing the target workpiece, and control the galvanometer laser assembly or the linear motion assembly to process the target workpiece according to the target instructions.

[0174] It can be understood that an embodiment of the present application provides a laser processing control device, which is applied to a laser processing equipment including a galvanometer laser assembly and a linear motion assembly. The acquisition module 21 in the laser processing control device 2 acquires multiple processing instructions related to the target workpiece, wherein the processing instructions include at least original coordinate values; the processing module 22 determines multiple task processing areas of the target workpiece based on the multiple processing instructions; the grouping module 23 groups the multiple processing instructions in each task processing area according to the preset galvanometer working range of the galvanometer laser assembly to obtain multiple processing area groups, wherein the preset galvanometer working range is determined based on the maximum working distance of the transverse axis and the longitudinal axis in the galvanometer laser assembly, and the processing area group contains at least one processing instruction; the conversion module 24 converts the original coordinate values ​​in the multiple processing instructions contained in each processing area group into synthetic coordinate values ​​according to the categories of the multiple processing area groups, and generates a target instruction for processing the target workpiece, so as to control the galvanometer laser assembly or the linear motion assembly to process the target workpiece according to the target instruction. The laser processing control device 2 generates new target instructions for processing the target workpiece by analyzing and converting the processing instructions related to the target workpiece, which can give full play to the processing advantages of the galvanometer laser component and the linear motion component to achieve the processing effect of increasing the processing speed and increasing the processing size.

[0175] Furthermore, the grouping module 23 includes:

[0176] The first rectangle determining unit is used to determine the maximum working rectangle of the galvanometer laser assembly according to a preset galvanometer working range.

[0177] The second rectangle determining unit is configured to calculate each processing instruction in the task processing area to obtain a minimum enclosing rectangle corresponding to each processing instruction.

[0178] The grouping unit is used to group multiple processing instructions in the task processing area according to the minimum enclosing rectangle corresponding to each processing instruction and the maximum working rectangle of the galvanometer laser assembly, and determine multiple processing area groups in each task processing area.

[0179] Furthermore, the categories of the processing area group include a first area category and a second area category, and the grouping unit is specifically used to:

[0180] The original coordinate values ​​in the current processing instruction are calculated to obtain the minimum enclosing rectangle corresponding to the current processing instruction.

[0181] Compare the minimum enclosing rectangle corresponding to the current processing instruction with the maximum working rectangle of the galvanometer laser assembly.

[0182] If the minimum enclosing rectangle corresponding to the current processing instruction is within the range of the maximum working rectangle of the galvanometer laser assembly, the minimum enclosing rectangle corresponding to the current processing instruction is used as the first processing area group, and the category of the first processing area group is determined to be the first area category.

[0183] If the minimum enclosing rectangle corresponding to the current processing instruction exceeds the range of the maximum working rectangle of the galvanometer laser assembly, the minimum enclosing rectangle corresponding to the current processing instruction is used as the second processing area group, and the category of the second processing area group is determined to be the second area category.

[0184] Furthermore, after obtaining the minimum enclosing rectangle corresponding to the current processing instruction as the first processing area group, the grouping unit is further specifically configured to:

[0185] The original coordinate values ​​in the next processing instruction are calculated to obtain the minimum enclosing rectangle corresponding to the next processing instruction.

[0186] The minimum enclosing rectangle corresponding to the next machining instruction is compared with the maximum working rectangle of the galvanometer laser assembly.

[0187] If the minimum enclosing rectangle corresponding to the next processing instruction is within the range of the maximum working rectangle of the galvanometer laser assembly and the area formed by the minimum enclosing rectangle corresponding to the next processing instruction and the minimum enclosing rectangle corresponding to the current processing instruction is within the range of the maximum working rectangle of the galvanometer laser assembly, then the minimum enclosing rectangle corresponding to the next processing instruction is divided into the first processing area group.

[0188] If the minimum enclosing rectangle corresponding to the next processing instruction is within the range of the maximum working rectangle of the galvanometer laser assembly and the area formed by the minimum enclosing rectangle corresponding to the next processing instruction and the minimum enclosing rectangle corresponding to the current processing instruction is not within the range of the maximum working rectangle of the galvanometer laser assembly, then the minimum enclosing rectangle corresponding to the next processing instruction is used as the third processing area group, and the category of the third processing area group is determined to be the first area category.

[0189] If the minimum enclosing rectangle corresponding to the next processing instruction is not within the range of the maximum working rectangle of the galvanometer laser assembly, the minimum enclosing rectangle corresponding to the next processing instruction is used as the fourth processing area group, and the category of the fourth processing area group is determined to be the second area category.

[0190] Furthermore, the original coordinate value includes an original horizontal coordinate value and an original vertical coordinate value, and the synthesized coordinate value includes a synthesized horizontal coordinate value and a synthesized vertical coordinate value;

[0191] The conversion module 24 includes:

[0192] The first coordinate determination unit is used to determine the galvanometer working center point coordinate value and the galvanometer working axis coordinate value of the processing area group when the category of the processing area group is the first area category, according to the original coordinate values ​​in the multiple processing instructions contained in the processing area group, wherein the galvanometer working center point coordinate value includes the center point transverse coordinate value and the center point longitudinal coordinate value; the galvanometer working axis coordinate value includes the galvanometer transverse axis coordinate value and the galvanometer longitudinal axis coordinate value.

[0193] The first target instruction generating unit is used to convert the original coordinate values ​​in the multiple processing instructions contained in the processing area group into synthetic coordinate values ​​according to the coordinate value of the galvanometer working center point and the galvanometer working axis coordinate value of the processing area group, and generate the first target instruction for processing the target workpiece corresponding to the first area category.

[0194] The second target instruction generating unit is used to directly use the original coordinate values ​​in the multiple processing instructions contained in the processing area group as the synthetic coordinate values ​​when the category of the processing area group is the second area category, and generate a second target instruction corresponding to the second area category for processing the target workpiece.

[0195] Furthermore, the first target instruction generation unit is specifically configured to:

[0196] The composite horizontal coordinate value is obtained according to the horizontal coordinate value of the center point and the horizontal axis coordinate value of the galvanometer.

[0197] The composite longitudinal coordinate value is obtained according to the longitudinal coordinate value of the center point and the longitudinal axis coordinate value of the galvanometer.

[0198] According to the synthesized horizontal coordinate value and the synthesized vertical coordinate value, the synthesized coordinate value corresponding to the original coordinate value in each processing instruction is obtained.

[0199] A first target instruction for processing a target workpiece corresponding to a first area category is generated according to a plurality of composite coordinate values ​​in the processing area group.

[0200] Furthermore, the laser processing control device 2 further includes:

[0201] The first control module is used to control the movement of the galvanometer laser assembly and process the target workpiece according to the first target instruction when the target instruction is the first target instruction.

[0202] The second control module is used to control the combined movement of the linear motion component and the galvanometer laser component and to process the target workpiece according to the second target instruction when the target instruction is the second target instruction.

[0203] Furthermore, the processing instruction includes at least one of the following: a rapid positioning instruction and a linear processing instruction.

[0204] The processing module 22 includes:

[0205] The first positioning instruction determining unit is configured to determine the currently appearing fast positioning instruction as the first fast positioning instruction.

[0206] The second positioning instruction determining unit is configured to determine the next fast positioning instruction as the second fast positioning instruction.

[0207] The task processing area determining unit is used to determine a plurality of task processing areas for processing the target workpiece according to the first rapid positioning instruction and a plurality of linear processing instructions between the first rapid positioning instruction and the second rapid positioning instruction.

[0208] Furthermore, the task processing area determination unit is specifically used to:

[0209] Coordinate values ​​of the first rapid positioning instruction and a plurality of linear processing instructions between the first rapid positioning instruction and the second rapid positioning instruction are extracted respectively to obtain a plurality of position coordinate values ​​in each processing instruction.

[0210] A minimum position coordinate value and a maximum position coordinate value are determined from the plurality of position coordinate values.

[0211] The task processing area corresponding to the first rapid positioning instruction and the second rapid positioning instruction is determined according to the minimum position coordinate value and the maximum position coordinate value.

[0212] Furthermore, the acquisition module 21 includes:

[0213] The task data acquisition unit is used to acquire processing task data related to the target workpiece, wherein the processing task data contains object information of processing the target workpiece into multiple target objects, and the target objects include at least one of the following: text, graphics, and images.

[0214] The processing instruction generating unit is used to convert the object information of multiple target objects and generate multiple processing instructions related to the target workpiece.

[0215] It should be noted that the information interaction, execution process, etc. between the modules in the above-mentioned laser processing control device 2 are based on the same concept as the method embodiment of the present application. Their specific functions and technical effects can be found in the method embodiment part and will not be repeated here.

[0216] The present application also provides an electronic device, such as Figure 6 As shown, Figure 6 This is a schematic diagram of the structure of an electronic device provided in one embodiment of the present application. Figure 6The electronic device 3 of this embodiment includes: a memory 31, a processor 32, and a computer program stored in the memory 31 and executable on the processor 32. When the processor 32 executes the computer program, the steps of any one of the above-mentioned laser processing control method embodiments are implemented.

[0217] An embodiment of the present application further provides a computer-readable storage medium, which stores a computer program. When the computer program is executed by a processor, the steps in the above-mentioned method embodiments can be implemented.

[0218] An embodiment of the present application provides a computer program product. When the computer program product is run on a mobile terminal, the mobile terminal can implement the steps in the above-mentioned various method embodiments when executing the computer program product.

[0219] If the integrated unit is implemented as a software functional unit and sold or used as an independent product, it can be stored in a computer-readable storage medium. Based on this understanding, the present application can implement all or part of the process steps in the above-mentioned method embodiments by using a computer program to instruct the relevant hardware. The computer program can be stored in a computer-readable storage medium. When executed by a processor, the computer program can implement the steps of each of the above-mentioned method embodiments. The computer program includes computer program code, which can be in source code form, object code form, executable file, or some intermediate form. The computer-readable medium can at least include: any entity or device capable of carrying computer program code to the camera / terminal device, recording medium, computer memory, read-only memory (ROM), random access memory (RAM), electric carrier signal, telecommunication signal, and software distribution medium. Examples include USB flash drives, mobile hard drives, magnetic disks, or optical disks. In some jurisdictions, based on legislation and patent practice, computer-readable media cannot be electric carrier signals or telecommunication signals.

[0220] In the above embodiments, the description of each embodiment has its own focus. For parts that are not described or recorded in detail in a certain embodiment, reference can be made to the relevant description of other embodiments.

[0221] Those skilled in the art will appreciate that the units and algorithm steps of each example described in conjunction with the embodiments disclosed herein can be implemented in electronic hardware, or a combination of computer software and electronic hardware. Whether these functions are performed in hardware or software depends on the specific application and design constraints of the technical solution. Professional and technical personnel can use different methods to implement the described functions for each specific application, but such implementation should not be considered beyond the scope of this application.

[0222] In the embodiments provided in this application, it should be understood that the disclosed devices / network equipment and methods can be implemented in other ways. For example, the device / network equipment embodiments described above are merely schematic. For example, the division of modules or units is merely a logical function division. In actual implementation, there may be other division methods, such as multiple units or components can be combined or integrated into another system, or some features can be ignored or not executed. Another point is that the mutual coupling or direct coupling or communication connection shown or discussed can be through some interfaces, indirect coupling or communication connection of devices or units, which can be electrical, mechanical or other forms.

[0223] Units described as separate components may or may not be physically separate, and components shown as units may or may not be physical units, that is, they may be located in one place or distributed across multiple network units. Some or all of these units may be selected to achieve the purpose of this embodiment according to actual needs.

[0224] The above embodiments are only used to illustrate the technical solutions of the present application, rather than to limit them. Although the present application has been described in detail with reference to the aforementioned embodiments, those skilled in the art should understand that they can still modify the technical solutions described in the aforementioned embodiments, or make equivalent replacements for some of the technical features therein. These modifications or replacements do not deviate the essence of the corresponding technical solutions from the spirit and scope of the technical solutions of the various embodiments of the present application, and should all be included in the scope of protection of the present application.

Claims

1. A laser processing control method, applied to a laser processing device, wherein the laser processing device includes a galvanometer laser component and a linear motion component, characterized in that: The method comprises: Acquire a plurality of processing instructions related to a target workpiece, wherein the processing instructions at least include original coordinate values; determining a plurality of task processing areas of the target workpiece according to the plurality of processing instructions; According to a preset galvanometer working range of the galvanometer laser assembly, the plurality of processing instructions in each task processing area are grouped to obtain a plurality of processing area groups, wherein the preset galvanometer working range is determined based on a maximum working distance between a transverse axis and a longitudinal axis of the galvanometer laser assembly; and each processing area group contains at least one processing instruction; According to the categories of the multiple processing area groups, the original coordinate values ​​in the multiple processing instructions contained in each processing area group are converted into synthetic coordinate values, and target instructions for processing the target workpiece are generated to control the galvanometer laser assembly or the linear motion assembly to process the target workpiece according to the target instructions.

2. The laser processing control method according to claim 1, wherein: The plurality of processing instructions in each of the task processing areas are grouped according to the preset galvanometer working range of the galvanometer laser assembly to obtain a plurality of processing area groups, including: Determining the maximum working rectangle of the galvanometer laser assembly according to the preset galvanometer working range; Calculating each of the processing instructions in the task processing area to obtain a minimum enclosing rectangle corresponding to each of the processing instructions; According to the minimum enclosing rectangle corresponding to each processing instruction and the maximum working rectangle of the galvanometer laser assembly, the multiple processing instructions in the task processing area are grouped to determine the multiple processing area groups in each task processing area.

3. The laser processing control method according to claim 2, wherein: The categories of the processing area group include a first area category and a second area category. The plurality of processing instructions in the task processing area are grouped according to the minimum enclosing rectangle corresponding to each processing instruction and the maximum working rectangle of the galvanometer laser assembly to determine the plurality of processing area groups in the task processing area, including: Calculating the original coordinate values ​​in the current processing instruction to obtain a minimum enclosing rectangle corresponding to the current processing instruction; Comparing the minimum enclosing rectangle corresponding to the current processing instruction with the maximum working rectangle of the galvanometer laser assembly; If the minimum enclosing rectangle corresponding to the current processing instruction is within the range of the maximum working rectangle of the galvanometer laser assembly, the minimum enclosing rectangle corresponding to the current processing instruction is used as the first processing area group, and the category of the first processing area group is determined to be the first area category; If the minimum enclosing rectangle corresponding to the current processing instruction exceeds the range of the maximum working rectangle of the galvanometer laser assembly, the minimum enclosing rectangle corresponding to the current processing instruction is used as the second processing area group, and the category of the second processing area group is determined to be the second area category.

4. The laser processing control method according to claim 3, wherein: After obtaining the minimum enclosing rectangle corresponding to the current processing instruction as the first processing area group, the method includes: Calculating the original coordinate values ​​in the next processing instruction to obtain a minimum enclosing rectangle corresponding to the next processing instruction; comparing the minimum enclosing rectangle corresponding to the next processing instruction with the maximum working rectangle of the galvanometer laser assembly; If the minimum enclosing rectangle corresponding to the next processing instruction is within the range of the maximum working rectangle of the galvanometer laser assembly and the area formed by the minimum enclosing rectangle corresponding to the next processing instruction and the minimum enclosing rectangle corresponding to the current processing instruction is within the range of the maximum working rectangle of the galvanometer laser assembly, then the minimum enclosing rectangle corresponding to the next processing instruction is divided into the first processing area group; If the minimum enclosing rectangle corresponding to the next processing instruction is within the range of the maximum working rectangle of the galvanometer laser assembly and the area formed by the minimum enclosing rectangle corresponding to the next processing instruction and the minimum enclosing rectangle corresponding to the current processing instruction is not within the range of the maximum working rectangle of the galvanometer laser assembly, the minimum enclosing rectangle corresponding to the next processing instruction is used as a third processing area group, and the category of the third processing area group is determined to be the first area category; If the minimum enclosing rectangle corresponding to the next processing instruction is not within the range of the maximum working rectangle of the galvanometer laser assembly, the minimum enclosing rectangle corresponding to the next processing instruction is used as the fourth processing area group, and the category of the fourth processing area group is determined to be the second area category.

5. The laser processing control method according to claim 4, wherein: The original coordinate values ​​include original horizontal coordinate values ​​and original vertical coordinate values, and the composite coordinate values ​​include composite horizontal coordinate values ​​and composite vertical coordinate values; converting the original coordinate values ​​in the plurality of processing instructions included in each processing area group into composite coordinate values ​​according to the categories of the plurality of processing area groups to generate a target instruction for processing the target workpiece, including: When the category of the processing area group is the first area category, determining the galvanometer working center point coordinate value and the galvanometer working axis coordinate value of the processing area group according to the original coordinate values ​​in the plurality of processing instructions included in the processing area group, wherein the galvanometer working center point coordinate value includes a center point transverse coordinate value and a center point longitudinal coordinate value; the galvanometer working axis coordinate value includes a galvanometer transverse axis coordinate value and a galvanometer longitudinal axis coordinate value; Converting the original coordinate values ​​of the plurality of machining instructions included in the machining area group into the synthesized coordinate values ​​according to the coordinate value of the galvanometer working center point and the coordinate value of the galvanometer working axis in the machining area group, and generating a first target instruction for machining the target workpiece corresponding to the first area category; When the category of the processing area group is the second area category, the original coordinate values ​​in the plurality of processing instructions included in the processing area group are directly used as the synthetic coordinate values ​​to generate a second target instruction for processing the target workpiece corresponding to the second area category.

6. The laser processing control method according to claim 5, wherein: The step of converting the original coordinate values ​​of the plurality of machining instructions included in the machining area group into the synthesized coordinate values ​​based on the coordinate value of the galvanometer working center point and the coordinate value of the galvanometer working axis in the machining area group, and generating a first target instruction for machining the target workpiece corresponding to the first area category, includes: Obtaining the synthesized transverse coordinate value according to the transverse coordinate value of the center point and the transverse axis coordinate value of the galvanometer; Obtaining the composite longitudinal coordinate value according to the longitudinal coordinate value of the center point and the longitudinal axis coordinate value of the galvanometer; Obtaining the synthesized coordinate value corresponding to the original coordinate value in each processing instruction according to the synthesized horizontal coordinate value and the synthesized vertical coordinate value; The first target instruction for processing the target workpiece corresponding to the first area category is generated according to the plurality of synthesized coordinate values ​​in the processing area group.

7. The laser processing control method according to claim 6, wherein: The controlling the galvanometer laser assembly or the linear motion assembly to process the target workpiece according to the target instruction includes: When the target instruction is the first target instruction, controlling the galvanometer laser assembly to move and processing the target workpiece according to the first target instruction; When the target instruction is the second target instruction, the linear motion component and the galvanometer laser component are controlled to move in combination and the target workpiece is processed according to the second target instruction.

8. The laser processing control method according to any one of claims 1 to 7, characterized in that: The processing instructions include at least one of the following: a rapid positioning instruction, a linear processing instruction; The step of determining a plurality of task processing areas of the target workpiece according to the plurality of processing instructions includes: Determine the currently appearing quick positioning instruction as the first quick positioning instruction; determining the next occurring quick positioning instruction as a second quick positioning instruction; A plurality of task processing areas for processing the target workpiece are determined according to the first rapid positioning instruction and the plurality of linear processing instructions between the first rapid positioning instruction and the second rapid positioning instruction.

9. The laser processing control method according to claim 8, wherein: Determining the plurality of task processing areas for processing the target workpiece according to the first rapid positioning instruction and the plurality of linear processing instructions between the first rapid positioning instruction and the second rapid positioning instruction includes: Extracting coordinate values ​​of the first rapid positioning instruction and a plurality of the linear processing instructions between the first rapid positioning instruction and the second rapid positioning instruction respectively, to obtain a plurality of position coordinate values ​​in each of the processing instructions; Determine a minimum position coordinate value and a maximum position coordinate value from the plurality of position coordinate values; The task processing area corresponding to the first rapid positioning instruction and the second rapid positioning instruction is determined according to the minimum position coordinate value and the maximum position coordinate value.

10. A laser processing control device, applied to laser processing equipment, wherein the laser processing equipment includes a galvanometer laser component and a linear motion component, characterized in that: The device comprises: An acquisition module, configured to acquire a plurality of processing instructions related to a target workpiece, wherein the processing instructions at least include original coordinate values; A processing module, configured to determine a plurality of task processing areas of the target workpiece according to the plurality of processing instructions; a grouping module, configured to group the plurality of processing instructions in each task processing area according to a preset galvanometer working range of the galvanometer laser assembly to obtain a plurality of processing area groups, wherein the preset galvanometer working range is determined based on a maximum working distance between a transverse axis and a longitudinal axis of the galvanometer laser assembly; and each processing area group contains at least one processing instruction; A conversion module is used to convert the original coordinate values ​​in the multiple processing instructions contained in each processing area group into synthetic coordinate values ​​according to the categories of the multiple processing area groups, generate target instructions for processing the target workpiece, and control the galvanometer laser assembly or the linear motion assembly to process the target workpiece according to the target instructions.

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