Circular plate secondary groove machining method and device, computer equipment and storage medium

Abstract

The invention discloses a circular plate secondary groove machining method and device, computer equipment and a storage medium, and belongs to the technical field of groove laser cutting. By using the automatic edge searching function of the capacitive sensor, the edge coordinate and the center point position of the circular plate can be accurately obtained without manual intervention, so that the radius and the center coordinate of the circular plate are automatically calculated, the precision and the efficiency of machining positioning are remarkably improved, and the machining precision is improved. And cutting deviation caused by manual measurement or inaccurate alignment is avoided. In addition, by obtaining the machining parameters and automatically generating the corresponding numerical control programming program, full-process automation from measurement to machining is achieved, and operation steps and personal errors are greatly reduced. The method is suitable for the secondary groove machining technology with the high precision requirement, the machining quality and consistency are improved, the intelligent level and the flexible production capacity of equipment are enhanced, and the good application and popularization value is achieved.

Description

Technical Field

[0001] The present application belongs to the field of groove laser cutting technology, and specifically relates to a method, device, computer equipment and storage medium for secondary groove processing of circular plates. Background Art

[0002] Laser bevel cutting technology, due to its advantages such as high precision, high efficiency, and minimal heat impact, is widely used in sheet metal processing. It is particularly suitable for complex shapes and demanding welding pre-processing scenarios. In the sheet metal processing industry, stamped or single-formed circular sheets are often used to manufacture structural components such as flanges, tube sheets, and end caps. These components often require bevel processing before subsequent welding to ensure weld strength and forming quality. Since these parts are often mass-produced, accurate and rapid secondary bevel processing has become a key step in increasing production capacity and reducing costs. Therefore, there is a certain demand for secondary bevel processing of stamped or single-formed circular sheets.

[0003] Traditional secondary processing methods for grooves often rely on mechanical fixtures, combined with mapping programs or vision systems for positioning and processing. However, for round materials, the installation of specialized fixtures presents challenges such as complex structure, poor adaptability, and lengthy debugging times, significantly limiting their flexibility and versatility. Furthermore, mapping programs typically require independent programming of processing paths for each part, creating a cumbersome programming process that not only increases the programmer's workload but also increases manual intervention on the job site. This approach is particularly inefficient in small- and medium-volume or high-variety production models, making it difficult to meet the demands of flexible manufacturing and automation. Summary of the Invention

[0004] The purpose of the embodiments of the present application is to propose a method, device, computer equipment and storage medium for secondary groove processing of circular plates to solve the technical problems that the traditional method of adding tooling has great limitations and the output of the drawing program increases labor costs to a certain extent.

[0005] In order to solve the above technical problems, the present invention provides a method for processing a secondary groove of a circular plate, which adopts the following technical solution:

[0006] A method for processing a secondary bevel of a circular plate is disclosed. The method is applied to a bevel laser cutting device. The bevel laser cutting device includes a laser cutting head and a workbench. The laser cutting head is disposed above the workbench. The workbench is used to place the circular plate to be cut. The method includes:

[0007] Move the laser cutting head to any position on the circular plate to obtain the first edge-finding point;

[0008] Based on the first edge search landing point, an edge search operation is performed on a preset first coordinate axis to obtain a first edge search end point and a second edge search end point;

[0009] Determine a second edge-finding landing point based on the first edge-finding end point and the second edge-finding end point;

[0010] Based on the second edge search landing point, an edge search operation is performed on a preset second coordinate axis to obtain a third edge search end point and a fourth edge search end point, wherein the first coordinate axis is perpendicular to the second coordinate axis;

[0011] Determine the center point and radius of the circular plate based on the third edge-finding end point and the fourth edge-finding end point;

[0012] Machining parameters of the secondary groove processing are obtained, a numerical control programming program of the secondary groove processing is generated based on the machining parameters, a center point and a radius of the circular plate, and the numerical control programming program is executed to complete the secondary groove processing of the circular plate.

[0013] Furthermore, the groove laser cutting equipment further includes a nozzle, which is located below the laser cutting head and has a capacitive sensor installed on the nozzle. The processing method further includes:

[0014] During the edge-finding operation, the edge-finding endpoint is determined by the change in the capacitance value of the capacitive sensor.

[0015] Furthermore, before moving the laser cutting head to any position on the circular plate to obtain the first edge-finding landing point, the processing method further includes:

[0016] A plane rectangular coordinate system is constructed in the plane where the circular plate is located, wherein the first coordinate axis is the X axis or the Y axis of the plane rectangular coordinate system.

[0017] Furthermore, based on the first edge search landing point, an edge search operation is performed on a preset first coordinate axis to obtain a first edge search end point and a second edge search end point, specifically including:

[0018] Taking the first edge-finding landing point as a starting point, the laser cutting head is moved along a first axial direction of the first coordinate axis, and during the movement of the laser cutting head, a position where a capacitance value of the capacitive sensor suddenly changes is identified to obtain a first position;

[0019] Determine the point corresponding to the first position on the plane rectangular coordinate system as the first edge search end point;

[0020] The laser cutting head is moved to the first edge-finding landing point, and the laser cutting head is moved again along the second axial direction of the first coordinate axis with the first edge-finding landing point as the starting point. During the movement of the laser cutting head, a position where the capacitance value of the capacitive sensor suddenly changes is identified to obtain a second position;

[0021] The point corresponding to the second position on the plane rectangular coordinate system is determined as the second edge-finding end point.

[0022] Further, determining a second edge-finding landing point based on the first edge-finding endpoint and the second edge-finding endpoint specifically includes:

[0023] Determine the midpoint of the line connecting the first edge search endpoint and the second edge search endpoint to obtain the first edge search midpoint;

[0024] The midpoint of the first edge search is determined as the landing point of the second edge search.

[0025] Furthermore, based on the second edge search landing point, an edge search operation is performed on a preset second coordinate axis to obtain a third edge search end point and a fourth edge search end point, specifically including:

[0026] Move the laser cutting head to the second edge-finding landing point, and with the second edge-finding landing point as a starting point, move the laser cutting head along the first axial direction of the second coordinate axis, and during the movement of the laser cutting head, identify the position where the capacitance value of the capacitive sensor suddenly changes, to obtain a third position;

[0027] Determine the point corresponding to the third position on the plane rectangular coordinate system as the third edge-finding end point;

[0028] The laser cutting head is moved to a second edge-finding landing point, and the laser cutting head is again moved along a second axial direction of the second coordinate axis with the second edge-finding landing point as a starting point. During the movement of the laser cutting head, a position where a sudden change occurs in the capacitance value of the capacitive sensor is identified to obtain a fourth position;

[0029] The point corresponding to the fourth position on the plane rectangular coordinate system is determined as the fourth edge-finding end point.

[0030] Furthermore, determining the center point and radius of the circular plate based on the third edge-finding endpoint and the fourth edge-finding endpoint specifically includes:

[0031] Determine the midpoint of the line connecting the third edge search endpoint and the fourth edge search endpoint to obtain the second edge search midpoint;

[0032] Determine the second edge search midpoint as the center point of the circular plate;

[0033] The coordinate difference between the third edge search end point or the fourth edge search end point and the second edge search midpoint is calculated, and the coordinate difference is determined as the radius of the circular plate.

[0034] In order to solve the above technical problems, the present application also provides a circular plate secondary groove processing device, which adopts the following technical solution:

[0035] A circular plate secondary beveling processing device performs the circular plate secondary beveling processing method described above. The processing method is applied to a beveling laser cutting device. The beveling laser cutting device includes a laser cutting head and a workbench. The laser cutting head is arranged above the workbench. The workbench is used to place the circular plate to be cut. The processing device includes:

[0036] The first landing point module is used to move the laser cutting head to any position on the circular plate to obtain the first edge-finding landing point;

[0037] A first edge-finding module is configured to perform an edge-finding operation on a preset first coordinate axis based on a first edge-finding landing point to obtain a first edge-finding end point and a second edge-finding end point;

[0038] A second landing point module is used to determine a second edge-finding landing point based on the first edge-finding end point and the second edge-finding end point;

[0039] A second edge-finding module is configured to perform an edge-finding operation on a preset second coordinate axis based on the second edge-finding landing point to obtain a third edge-finding end point and a fourth edge-finding end point, wherein the first coordinate axis is perpendicular to the second coordinate axis;

[0040] A circle center determination module, configured to determine the center point and radius of the circular plate based on the third edge-finding endpoint and the fourth edge-finding endpoint;

[0041] The secondary processing module is used to obtain processing parameters of the secondary groove processing, generate a NC programming program for the secondary groove processing based on the processing parameters, the center point and radius of the circular plate, and execute the NC programming program to complete the secondary groove processing of the circular plate.

[0042] In order to solve the above technical problems, the embodiment of the present application further provides a computer device, which adopts the following technical solution:

[0043] A computer device includes a memory and a processor, wherein the memory stores computer-readable instructions, and when the processor executes the computer-readable instructions, the steps of the circular plate secondary groove processing method as described in any one of the above are implemented.

[0044] In order to solve the above technical problems, the embodiment of the present application further provides a computer-readable storage medium, which adopts the following technical solution:

[0045] A computer-readable storage medium stores computer-readable instructions, which, when executed by a processor, implement the steps of the circular plate secondary groove processing method as described in any one of the above.

[0046] Compared with the prior art, the embodiments of the present application have the following beneficial effects:

[0047] The present application discloses a method, device, computer equipment and storage medium for secondary groove processing of circular plates, which belongs to the field of groove laser cutting technology. By using the automatic edge-finding function of the capacitive sensor, the present application can accurately obtain the edge coordinates and center point position of the circular plate without human intervention, thereby automatically calculating the radius and center coordinates of the circular plate, significantly improving the accuracy and efficiency of processing positioning, and avoiding cutting deviations caused by manual measurement or inaccurate alignment. In addition, by obtaining processing parameters and automatically generating corresponding CNC programming programs, the entire process from measurement to processing is automated, greatly reducing the number of operating steps and human errors. The present application is suitable for secondary groove processing processes with high precision requirements. It not only improves the processing quality and consistency, but also enhances the intelligence level and flexible production capacity of the equipment, and has good application and promotion value. BRIEF DESCRIPTION OF THE DRAWINGS

[0048] In order to more clearly illustrate the solutions in this application, a brief introduction will be given below to the drawings required for use in the description of the embodiments of this application. Obviously, the drawings described below are some embodiments of this application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without any creative work.

[0049] Figure 1 shows an exemplary system architecture diagram in which the present application can be applied;

[0050] Figure 2 A flow chart showing an embodiment of a method for secondary groove processing of a circular plate according to the present application is shown;

[0051] Figure 3 Shown Figure 2 A flowchart of an embodiment of steps S202-S203;

[0052] Figure 4 Shown Figure 2 A flowchart of an embodiment of steps S204-S205;

[0053] Figure 5 One of the schematic diagrams showing the edge-finding operation of the circular plate secondary groove processing method according to the present application is shown;

[0054] Figure 6 A second schematic diagram showing an edge-finding operation according to the circular plate secondary groove processing method of the present application is shown;

[0055] Figure 7 A schematic structural diagram of an embodiment of a circular plate secondary groove processing device according to the present application is shown;

[0056] Figure 8A schematic structural diagram of an embodiment of a computer device according to the present application is shown. DETAILED DESCRIPTION

[0057] Unless otherwise defined, all technical and scientific terms used herein have the same meanings as commonly understood by those skilled in the art to which this application belongs. The terms used in the specification of the application are for the purpose of describing specific embodiments only and are not intended to limit this application. The terms "including" and "having" and any variations thereof in the specification and claims of this application and the above-mentioned drawings are intended to cover non-exclusive inclusions. The terms "first", "second", etc. in the specification and claims of this application or the above-mentioned drawings are used to distinguish different objects, not to describe a specific order.

[0058] References herein to "embodiments" mean that a particular feature, structure, or characteristic described in connection with the embodiments may be included in at least one embodiment of the present application. The appearance of this phrase in various places in the specification does not necessarily refer to the same embodiment, nor does it constitute an independent or alternative embodiment that is mutually exclusive of other embodiments. It is understood, both explicitly and implicitly, by those skilled in the art that the embodiments described herein may be combined with other embodiments.

[0059] In order to enable those skilled in the art to better understand the solution of the present application, the technical solution in the embodiments of the present application will be clearly and completely described below in conjunction with the accompanying drawings.

[0060] like Figure 1 As shown, system architecture 100 may include a terminal device 101, a network 102, and a server 103. Terminal device 101 may be a laptop computer 1011, a tablet computer 1012, or a mobile phone 1013. Network 102 is a medium for providing a communication link between terminal device 101 and server 103. Network 102 may include various connection types, such as wired or wireless communication links or fiber optic cables.

[0061] The user can use the terminal device 101 to interact with the server 103 via the network 102 to receive or send messages, etc. Various communication client applications can be installed on the terminal device 101, such as web browser applications, shopping applications, search applications, instant messaging tools, email clients, social platform software, etc.

[0062] The terminal device 101 can be various electronic devices with a display screen and supporting web browsing. In addition to the laptop computer 1011, tablet computer 1012 or mobile phone 1013, the terminal device 101 can also be an e-book reader, an MP3 player (Moving Picture Experts Group Audio Layer III), an MP4 (Moving Picture Experts Group Audio Layer IV) player, a laptop computer and a desktop computer, etc.

[0063] The server 103 may be a server that provides various services, such as a background server that provides support for web pages displayed on the terminal device 101 .

[0064] It should be noted that the circular plate secondary groove processing method provided in the embodiment of the present application is generally executed by a server / terminal device, and accordingly, the circular plate secondary groove processing device is generally set in the server / terminal device.

[0065] It should be understood that Figure 1 The numbers of terminal devices, networks and servers in the embodiment are merely illustrative. The above system may have any number of terminal devices, networks and servers according to implementation requirements.

[0066] A method for secondary beveling of circular plates is disclosed. The method is applied to bevel laser cutting equipment. The bevel laser cutting equipment includes a laser cutting head and a worktable. The laser cutting head is positioned above the worktable, and the worktable is used to place the circular plate to be cut. Furthermore, the bevel laser cutting equipment also includes a nozzle located below the laser cutting head. The laser nozzle is an auxiliary component of the cutting head, typically located below the cutting head, and is used to assist in gas injection, helping to remove slag generated during the cutting process and cooling the cutting area.

[0067] A capacitive sensor is installed on the nozzle. The height distance between the capacitive sensor and the cutting plate is equivalent to the distance between the two electrodes of the capacitor. The detection capacitance value of the capacitive sensor changes with the distance between the electrodes. By detecting the feedback capacitance value, it can be identified whether the edge of the cutting plate is found, thereby obtaining the corresponding coordinates of the plate edge, and using this to calculate the coordinates of the center of the circle and the size of the disk.

[0068] Continue to refer Figure 2 , shows a flow chart of an embodiment of a method for secondary beveling of a circular plate according to the present application. The method for secondary beveling of a circular plate comprises the following steps:

[0069] S201, moving the laser cutting head to any position on the circular plate to obtain the first edge-finding landing point;

[0070] Specifically, a plane rectangular coordinate system is constructed in the plane where the circular plate is located. The laser cutting equipment control system moves the cutting head to any contact point position of the circular plate according to the initially set displacement parameters, and uses the contact point position as the first edge-finding landing point. The position coordinates of the contact point position are determined based on the constructed plane rectangular coordinate system and the displacement parameters, that is, the position coordinates of the first edge-finding landing point.

[0071] S202, performing an edge search operation on a preset first coordinate axis based on the first edge search landing point to obtain a first edge search end point and a second edge search end point;

[0072] Specifically, with the first edge-finding landing point as the starting position, the laser cutting head is controlled to move along the two directions of the preset first coordinate axis (X-axis or Y-axis). At the same time, the change in capacitance value is monitored by the capacitive sensor to determine in real time whether the cutting head contacts the edge of the plate. The position where the laser cutting head leaves the plate in the two directions of the first coordinate axis is recorded respectively as the first edge-finding end point and the second edge-finding end point.

[0073] S203, determining a second edge search landing point based on the first edge search endpoint and the second edge search endpoint;

[0074] Specifically, the first edge-finding end point and the second edge-finding end point are connected, the midpoint position of the line connecting the first edge-finding end point and the second edge-finding end point is determined, the first edge-finding midpoint is obtained, and the midpoint coordinates are determined. The first edge-finding midpoint is also the second edge-finding landing point, which is located on the center line of the circular plate in the direction of the first coordinate axis and is the key starting point for vertical edge-finding.

[0075] S204, performing an edge search operation on a preset second coordinate axis based on the second edge search landing point to obtain a third edge search end point and a fourth edge search end point, wherein the first coordinate axis is perpendicular to the second coordinate axis;

[0076] Specifically, the laser cutting head is controlled to move to the midpoint of the line connecting the first edge-finding end point and the second edge-finding end point, that is, the second edge-finding landing point. Starting from this second edge-finding landing point, the cutting head is moved in two directions of the second coordinate axis perpendicular to the first coordinate axis (such as when the first coordinate axis is the X-axis, the second coordinate axis is the Y-axis; when the first coordinate axis is the Y-axis, the second coordinate axis is the X-axis), and the capacitive sensor is used to continue to detect the edge contact situation, and the position of the laser cutting head leaving the plate in two directions of the second coordinate axis is recorded respectively as the third edge-finding end point and the fourth edge-finding end point.

[0077] S205, determining the center point and radius of the circular plate based on the third edge-finding endpoint and the fourth edge-finding endpoint;

[0078] Specifically, connect the third edge-finding end point and the fourth edge-finding end point, determine the midpoint position of the line connecting the third edge-finding end point and the fourth edge-finding end point, that is, the second edge-finding midpoint, determine the midpoint coordinates, the second edge-finding midpoint is also the center point of the circular plate, calculate the coordinate difference between the third edge-finding end point or the fourth edge-finding end point and the second edge-finding midpoint, and determine the coordinate difference as the radius of the circular plate.

[0079] S206 , obtaining processing parameters for the secondary groove processing, generating a numerical control programming program for the secondary groove processing based on the processing parameters, the center point and radius of the circular plate, and executing the numerical control programming program to complete the secondary groove processing of the circular plate.

[0080] Specifically, the system automatically generates a G-code program for the CNC machine tool by importing machining parameters such as the groove angle, plate thickness, and part radius based on the machining task requirements. This program is combined with the measured center coordinates and radius to control the laser cutting head, executing the machining operation according to the preset path and parameters, completing the secondary groove cutting task on the circular plate.

[0081] In the above embodiment, the present application discloses a method for secondary groove processing of circular plates, which belongs to the field of groove laser cutting technology. The present application uses the automatic edge finding function of the capacitive sensor to accurately obtain the edge coordinates and center point position of the circular plate without human intervention, thereby automatically calculating the radius and center coordinates of the circular plate, significantly improving the accuracy and efficiency of processing positioning, and avoiding cutting deviations caused by manual measurement or inaccurate alignment. In addition, by obtaining processing parameters and automatically generating corresponding CNC programming programs, the entire process from measurement to processing is automated, greatly reducing the number of operating steps and human errors. The present application is suitable for secondary groove processing processes with high precision requirements. It not only improves the processing quality and consistency, but also enhances the intelligence level and flexible production capacity of the equipment, and has good application and promotion value.

[0082] Furthermore, before moving the laser cutting head to any position on the circular plate to obtain the first edge-finding landing point, the processing method further includes:

[0083] A rectangular coordinate system is constructed within the plane of the circular plate, wherein the first coordinate axis is the X-axis or Y-axis of the rectangular coordinate system. Specifically, when the first coordinate axis is the X-axis, the second coordinate axis is the Y-axis; when the first coordinate axis is the Y-axis, the second coordinate axis is the X-axis.

[0084] For further information, please refer to Figure 3 Based on the first edge search landing point, an edge search operation is performed on a preset first coordinate axis to obtain a first edge search end point and a second edge search end point, specifically including:

[0085] S301, moving the laser cutting head along a first axial direction of a first coordinate axis with the first edge search landing point as a starting point, and identifying a position where a capacitance value of the capacitive sensor suddenly changes during the movement of the laser cutting head to obtain a first position;

[0086] S302, determining the point corresponding to the first position on the plane rectangular coordinate system as the first edge search end point;

[0087] S303, moving the laser cutting head to the first edge-finding landing point, and again moving the laser cutting head along the second axial direction of the first coordinate axis with the first edge-finding landing point as the starting point. During the movement of the laser cutting head, identifying the position where the capacitance value of the capacitive sensor suddenly changes, to obtain a second position;

[0088] S304: Determine the point on the plane rectangular coordinate system corresponding to the second position as the second edge search end point.

[0089] In this embodiment, the edge-finding operation of the laser cutting head effectively identifies the edge position of the worktable surface through a capacitive sensor. In steps S301 and S302, the laser cutting head moves along the first axial direction of the first coordinate axis, and accurately locates the first edge-finding end point by monitoring the sudden change in the capacitance value, and provides real-time feedback through the capacitive sensor to ensure high precision and reliability of position identification. Steps S303 and S304 correspondingly perform edge-finding operations in the second direction, further expanding the detection range, not only improving the speed of edge detection, but also ensuring the consistency and accuracy of position identification in different directions. Through the cyclic edge-finding operation, the positioning error in the entire cutting process is greatly reduced.

[0090] Through the above steps, high-precision and fast edge detection is achieved, which improves the accuracy and automation of laser cutting.

[0091] Further, determining a second edge-finding landing point based on the first edge-finding endpoint and the second edge-finding endpoint specifically includes:

[0092] S305, determining the midpoint of the line connecting the first edge search endpoint and the second edge search endpoint to obtain the first edge search midpoint;

[0093] S306: Determine the midpoint of the first edge search as the second edge search landing point.

[0094] In this embodiment, the second edge search landing point can be accurately determined based on the line connecting the first edge search endpoint and the second edge search endpoint. Specifically, step S305 calculates the midpoint of the line connecting the first edge search endpoint and the second edge search endpoint to obtain the first edge search midpoint. Step S306 sets the first edge search midpoint as the second edge search landing point, allowing the subsequent secondary edge search operation to start from a more central position, ensuring symmetry and balance of the overall processing.

[0095] Through the above steps, the solution improves the accuracy and efficiency of the cutting path and ensures the smoothness and quality of the secondary edge-finding process.

[0096] For further information, please refer to Figure 4 Based on the second edge search landing point, an edge search operation is performed on the preset second coordinate axis to obtain a third edge search end point and a fourth edge search end point, specifically including:

[0097] S401, moving the laser cutting head to a second edge-finding landing point, moving the laser cutting head along a first axial direction of a second coordinate axis with the second edge-finding landing point as a starting point, and identifying a position where a capacitance value of the capacitive sensor suddenly changes during the movement of the laser cutting head to obtain a third position;

[0098] S402, determining a point corresponding to the third position on the plane rectangular coordinate system as a third edge search end point;

[0099] S403, moving the laser cutting head to a second edge-finding landing point, and again moving the laser cutting head along a second axial direction of the second coordinate axis with the second edge-finding landing point as a starting point. During the movement of the laser cutting head, identifying a position where a sudden change in the capacitance value of the capacitive sensor occurs, to obtain a fourth position;

[0100] S404: Determine the point on the plane rectangular coordinate system corresponding to the fourth position as the fourth edge search end point.

[0101] In this embodiment, the edge-finding operation based on the second edge-finding landing point can efficiently obtain the third edge-finding end point and the fourth edge-finding end point. In step S401, the laser cutting head starts from the second edge-finding landing point according to the setting, moves along the first axial direction of the second coordinate axis, and accurately identifies the position where the capacitance value suddenly changes by monitoring the reading change of the capacitance sensor, and determines it as the third position point. Subsequently, in step S402, this third position is converted into a point on the plane rectangular coordinate system and marked as the third edge-finding end point. Then, in step S403, the laser cutting head returns to the second edge-finding landing point again, moves along the second axial direction of the second coordinate axis in the same way, and identifies the capacitance value change again to determine the fourth position, and finally marks it as the fourth edge-finding end point in step S404.

[0102] Through the above steps, high-precision and fast edge detection is achieved, which improves the accuracy and automation of laser cutting.

[0103] Furthermore, determining the center point and radius of the circular plate based on the third edge-finding endpoint and the fourth edge-finding endpoint specifically includes:

[0104] S405, determining the midpoint of the line connecting the third edge search endpoint and the fourth edge search endpoint to obtain the second edge search midpoint;

[0105] S406, determining the second edge search midpoint as the center point of the circular plate;

[0106] S407 , calculating a coordinate difference between the third edge-finding end point or the fourth edge-finding end point and the second edge-finding midpoint, and determining the coordinate difference as the radius of the circular plate.

[0107] In this embodiment, the center point and radius of the circular plate can be accurately determined based on the line connecting the third and fourth edge-finding endpoints. Step S405 calculates the midpoint of the line connecting the third and fourth edge-finding endpoints to determine the second edge-finding midpoint, which serves as the center point of the circular plate, ensuring highly accurate positioning of the circle center. In step S407, the coordinate difference between the third or fourth edge-finding endpoint and the center point is calculated; this difference is defined as the radius of the circular plate.

[0108] Through the above steps, high-precision determination of the geometric features of the circular plate is achieved.

[0109] Example 1

[0110] For example, take the first coordinate axis as X axis and the second coordinate axis as Y axis. Figure 5 , P 01 (X 01 ,Y 01 ) is the first edge search landing point, move the laser cutting head to the first edge search landing point, and perform edge search operation on the X axis based on the first edge search landing point. Move the laser cutting head to the X+ direction first. When the capacitance value of the capacitive sensor changes suddenly, the first edge search end point P is found. 11 (X 11 ,Y 01 ); then move the laser cutting head to the X-direction, and when the capacitance value of the capacitance sensor changes suddenly again, the second edge search end point P is found. 12 (X 12 ,Y 01 ), according to the first edge search endpoint P 11 (X 11 ,Y 01 ) and the second edge search endpoint P 12 (X 12 ,Y 01 ) Determine the second edge search point P 10 , the second edge search point P 10 is the midpoint of the line connecting the first edge search end point and the second edge search end point. Therefore, the second edge search point P 10 The X-axis coordinate is (X 11 +X 12 ) / 2, the second edge search point P 10 The coordinates are [(X 11 +X 12 ) / 2,Y 01].

[0111] Then, the second edge search point P 10 [(X 11 +X 12 ) / 2,Y 01 ], move the laser cutting head to the second edge search landing point, and perform edge search on the Y axis based on the second edge search landing point. Move the laser cutting head to the Y+ direction first. When the capacitance value of the capacitive sensor changes suddenly, the third edge search end point P is found. 21 [(X 11 +X 12 ) / 2,Y 21 ]; then move the laser cutting head to the Y-direction. When the capacitance value of the capacitance sensor changes suddenly again, the fourth edge search end point P is found. 22 [(X 11 +X 12 ) / 2,Y 22 ], according to the third edge search endpoint P 21 [(X 11 +X 12 ) / 2,Y 21 ] and the fourth edge search endpoint P 22 [(X 11 +X 12 ) / 2,Y 22 ]Determine the center point P of the circular plate 20 , the center point P of the circular plate 20 is the midpoint of the line connecting the third and fourth edge search endpoints. Therefore, the center point P of the circular plate is 20 The Y-axis coordinate is (Y 21 +Y 22 ) / 2, the center point P of the circular plate 20 The coordinates are [(X 11 +X 12 ) / 2,(Y 21 +

[0112] Y 22 ) / 2].

[0113] At the same time, in one embodiment of the present application, based on the third edge search end point P 21 [(X 11 +X 12 ) / 2,Y 21 ], the fourth edge search end point P 22 [(X 11 +X 12 ) / 2,Y 22 ] and the center point P of the circular plate 20 [(X 11 +X 12 ) / 2,(Y21 +Y 22 ) / 2] Calculate the radius of the circular plate. Specifically, the radius of the circular plate R1 = Y 21 -(Y 21 +Y 22 ) / 2, or, the radius of the circular plate R1=(Y 21 +Y 22 ) / 2-Y 22 In another embodiment of the present application, the third edge search endpoint P can also be used. 21 [(X 00 +X 12 ) / 2,Y 21 ] and the fourth edge search endpoint P 22 [(X 11 +X 12 ) / 2,Y 22 ]Calculate the radius of the circular plate. Specifically, the radius of the circular plate R1 = (Y 21 -Y 22 ) / 2.

[0114] Example 2

[0115] For example, take the first coordinate axis as the Y axis and the second coordinate axis as the X axis. Figure 6 , P 01 (X 00 ,Y 01 ) is the first edge search landing point. Move the laser cutting head to the first edge search landing point. Based on the first edge search landing point, perform edge search on the Y axis. Move the laser cutting head to the Y+ direction first. When the capacitance value of the capacitive sensor changes suddenly, the first edge search end point P is found. 11 (X 01 ,Y 11 ) and then move the laser cutting head to the Y-direction. When the capacitance value of the capacitance sensor changes suddenly again, the second edge search end point P is found. 12 (X 01 ,Y 12 ), according to the first edge search endpoint P 11 (X 01 ,Y 11 ) and the second edge search endpoint P 12 (X 01 ,Y 12 ) Determine the second edge search point P 10 , the second edge search point P 10 is the midpoint of the line connecting the first edge search end point and the second edge search end point. Therefore, the second edge search point P 10 The Y-axis coordinate is (Y 11 +Y 12 ) / 2, the second edge search point P 10 The coordinates are [X01 ,(Y 11 +Y 12 ) / 2].

[0116] Then, the second edge search point P 10 [X 01 ,(Y 11 +Y 12 ) / 2], move the laser cutting head to the second edge search landing point, and perform edge search on the X axis based on the second edge search landing point. Move the laser cutting head to the X+ direction first. When the capacitance value of the capacitive sensor changes suddenly, the third edge search end point P is found. 21 [X 21 ,(Y 11 +Y 12 ) / 2]; then move the laser cutting head to the X-direction, and when the capacitance value of the capacitance sensor suddenly changes again, the fourth edge search end point P is found. 22 [X 22 ,(Y 10 +Y 12 ) / 2], according to the third edge search endpoint P 21 [X 21 ,(Y 11 +Y 12 ) / 2] and the fourth edge search endpoint P 22 [X 22 ,(Y 11 +Y 12 ) / 2] Determine the center point P of the circular plate 20 , the center point P of the circular plate 20 is the midpoint of the line connecting the third and fourth edge search endpoints. Therefore, the center point P of the circular plate is 20 The X-axis coordinate is (X 21 +X 22 ) / 2, the center point P of the circular plate 20 The coordinates are [(X 21 +X 22 ) / 2,(Y 11 +

[0117] Y 12 ) / 2].

[0118] At the same time, in one embodiment of the present application, based on the third edge search end point P 21 [X 21 ,(Y 11 +Y 12 ) / 2], the fourth edge search end point P 22 [X 22 ,(Y 11 +Y 12 ) / 2] and the center point P of the circular plate 20[(X 21 +X 22 ) / 2,(Y 11 +Y 12 ) / 2] Calculate the radius of the circular plate. Specifically, the radius of the circular plate R1 = X 21 -(X 21 +X 22 ) / 2, or, the radius of the circular plate R1=(X 21 +X 22 ) / 2-X 22 In another embodiment of the present application, the third edge search endpoint P can also be used. 21 [X 21 ,(Y 11 +Y 12 ) / 2] and the fourth edge search endpoint P 22 [X 22 ,(Y 11 +Y 12 ) / 2] calculate the radius of the circular plate. Specifically, the radius of the circular plate R1 = (X 21 -X 22 ) / 2.

[0119] In the above embodiment, the present application discloses a method for secondary groove processing of circular plates, which belongs to the field of groove laser cutting technology. The present application uses the automatic edge finding function of the capacitive sensor to accurately obtain the edge coordinates and center point position of the circular plate without human intervention, thereby automatically calculating the radius and center coordinates of the circular plate, significantly improving the accuracy and efficiency of processing positioning, and avoiding cutting deviations caused by manual measurement or inaccurate alignment. In addition, by obtaining processing parameters and automatically generating corresponding CNC programming programs, the entire process from measurement to processing is automated, greatly reducing the number of operating steps and human errors. The present application is suitable for secondary groove processing processes with high precision requirements. It not only improves the processing quality and consistency, but also enhances the intelligence level and flexible production capacity of the equipment, and has good application and promotion value.

[0120] In this embodiment, the circular plate secondary groove processing method is run on the electronic device (eg Figure 1 The server shown in the figure) can receive instructions or obtain data through a wired connection or a wireless connection. It should be noted that the above-mentioned wireless connection method may include but is not limited to 3G / 4G connection, WiFi connection, Bluetooth connection, WiMAX connection, Zigbee connection, UWB (ultra wideband) connection, and other wireless connection methods currently known or to be developed in the future.

[0121] Those skilled in the art will appreciate that all or part of the processes in the above-described method embodiments can be implemented by instructing related hardware via computer-readable instructions. The computer-readable instructions can be stored in a computer-readable storage medium, and when the program is executed, it can include the processes in the above-described method embodiments. The aforementioned storage medium can be a non-volatile storage medium such as a magnetic disk, an optical disk, a read-only memory (ROM), or a random access memory (RAM).

[0122] It should be understood that although the steps in the flowcharts of the accompanying drawings are shown in sequence as indicated by the arrows, these steps are not necessarily executed in the order indicated by the arrows. Unless otherwise specified herein, there is no strict order restriction on the execution of these steps, and they can be executed in other orders. Moreover, at least some of the steps in the flowcharts of the accompanying drawings may include multiple sub-steps or multiple stages, and these sub-steps or stages are not necessarily executed at the same time, but can be executed at different times, and their execution order is not necessarily sequential, but can be executed in turn or alternately with other steps or at least a portion of the sub-steps or stages of other steps.

[0123] Further references Figure 7 , as a response to the above Figure 2 In order to realize the method shown in the figure, the present application provides an embodiment of a circular plate secondary groove processing device. Figure 2 Corresponding to the method embodiment shown, the device can be specifically applied to various electronic devices.

[0124] like Figure 7 As shown, the circular plate secondary beveling processing device 700 described in this embodiment performs the circular plate secondary beveling processing method as described above. The processing method is applied to the beveling laser cutting equipment. The beveling laser cutting equipment includes a laser cutting head and a workbench. The laser cutting head is arranged above the workbench. The workbench is used to place the circular plate to be cut. The circular plate secondary beveling processing device 700 includes:

[0125] The first landing point module 701 is used to move the laser cutting head to any position on the circular plate to obtain the first edge-finding landing point;

[0126] A first edge-finding module 702 is configured to perform an edge-finding operation on a preset first coordinate axis based on the first edge-finding landing point to obtain a first edge-finding end point and a second edge-finding end point;

[0127] The second landing point module 703 is configured to determine a second edge search landing point based on the first edge search end point and the second edge search end point;

[0128] A second edge-finding module 704 is configured to perform an edge-finding operation on a preset second coordinate axis based on the second edge-finding landing point to obtain a third edge-finding end point and a fourth edge-finding end point, wherein the first coordinate axis is perpendicular to the second coordinate axis;

[0129] A circle center determination module 705 is configured to determine the center point and radius of the circular plate based on the third edge-finding endpoint and the fourth edge-finding endpoint;

[0130] The secondary processing module 706 is used to obtain processing parameters for secondary beveling processing, generate a NC programming program for secondary beveling processing based on the processing parameters, the center point and radius of the circular plate, and execute the NC programming program to complete the secondary beveling processing of the circular plate.

[0131] Furthermore, the groove laser cutting equipment further includes a nozzle, which is located below the laser cutting head and has a capacitive sensor installed on the nozzle. The circular plate secondary groove processing device 700 further includes:

[0132] The capacitance value determination module is used to determine the edge-seeking end point by the capacitance value change of the capacitance sensor during the edge-seeking operation.

[0133] Furthermore, before moving the laser cutting head to any position on the circular plate to obtain the first edge-finding landing point, the circular plate secondary beveling processing device 700 further includes:

[0134] The coordinate system construction module is used to construct a plane rectangular coordinate system in the plane where the circular plate is located, wherein the first coordinate axis is the X axis or Y axis of the plane rectangular coordinate system.

[0135] Furthermore, the first edge-finding module 702 specifically includes:

[0136] The first positioning unit is configured to move the laser cutting head along a first axial direction of the first coordinate axis with the first edge-finding landing point as a starting point, and identify a position where a capacitance value of the capacitive sensor suddenly changes during the movement of the laser cutting head to obtain a first position;

[0137] A first edge-finding endpoint determining unit, configured to determine a point corresponding to the first position on a plane rectangular coordinate system as a first edge-finding endpoint;

[0138] The second positioning unit is used to move the laser cutting head to the first edge-finding landing point, and again move the laser cutting head along the second axial direction of the first coordinate axis with the first edge-finding landing point as the starting point, and identify the position where the capacitance value of the capacitive sensor suddenly changes during the movement of the laser cutting head to obtain a second position;

[0139] The second edge-finding endpoint determining unit is configured to determine a point on the plane rectangular coordinate system corresponding to the second position as the second edge-finding endpoint.

[0140] Furthermore, the second landing point module 703 specifically includes:

[0141] A first edge-finding midpoint unit is configured to determine the midpoint of a line connecting a first edge-finding end point and a second edge-finding end point to obtain a first edge-finding midpoint;

[0142] The edge-finding landing point determining unit is used to determine the first edge-finding midpoint as the second edge-finding landing point.

[0143] Furthermore, the second edge-finding module 704 specifically includes:

[0144] A third positioning unit is used to move the laser cutting head to a second edge-finding landing point, and to move the laser cutting head along a first axial direction of the second coordinate axis with the second edge-finding landing point as a starting point. During the movement of the laser cutting head, a position where a sudden change occurs in the capacitance value of the capacitive sensor is identified to obtain a third position;

[0145] A third edge-finding endpoint determining unit, configured to determine a point corresponding to the third position on the plane rectangular coordinate system as a third edge-finding endpoint;

[0146] a fourth positioning unit, configured to move the laser cutting head to a second edge-finding landing point, and again move the laser cutting head along a second axial direction of the second coordinate axis with the second edge-finding landing point as a starting point, and identify a position where a sudden change in the capacitance value of the capacitive sensor occurs during the movement of the laser cutting head to obtain a fourth position;

[0147] The fourth edge-finding endpoint determining unit is configured to determine a point on the plane rectangular coordinate system corresponding to the fourth position as the fourth edge-finding endpoint.

[0148] Furthermore, the circle center determination module 705 specifically includes:

[0149] The second edge-finding midpoint unit is used to determine the midpoint of the line connecting the third edge-finding end point and the fourth edge-finding end point to obtain the second edge-finding midpoint;

[0150] a circle center determination unit, used to determine the second edge search midpoint as the center point of the circular plate;

[0151] The radius determination unit is used to calculate the coordinate difference between the third edge-finding end point or the fourth edge-finding end point and the second edge-finding midpoint, and determine the coordinate difference as the radius of the circular plate.

[0152] In the above embodiment, the present application discloses a secondary groove processing device for circular plates, which belongs to the field of groove laser cutting technology. The present application uses the automatic edge finding function of the capacitive sensor to accurately obtain the edge coordinates and center point position of the circular plate without human intervention, thereby automatically calculating the radius and center coordinates of the circular plate, significantly improving the accuracy and efficiency of processing positioning, and avoiding cutting deviations caused by manual measurement or inaccurate alignment. In addition, by obtaining processing parameters and automatically generating corresponding CNC programming programs, the entire process from measurement to processing is automated, greatly reducing the number of operating steps and human errors. The present application is suitable for secondary groove processing processes with high precision requirements. It not only improves the processing quality and consistency, but also enhances the intelligence level and flexible production capacity of the equipment, and has good application and promotion value.

[0153] To solve the above technical problems, the present application also provides a computer device. Figure 8 , Figure 8 This is a basic structural block diagram of the computer device in this embodiment.

[0154] The computer device 8 includes a memory 81, a processor 82, and a network interface 83 that are interconnected through a system bus. It should be noted that the figure only shows a computer device 8 with a memory 81, a processor 82, and a network interface 83, but it should be understood that it is not required to implement all the components shown, and more or fewer components can be implemented instead. Among them, those skilled in the art can understand that the computer device here is a device that can automatically perform numerical calculations and / or information processing according to pre-set or stored instructions, and its hardware includes but is not limited to a microprocessor, an application specific integrated circuit (ASIC), a field-programmable gate array (FPGA), a digital signal processor (DSP), an embedded device, etc.

[0155] The computer device may be a desktop computer, notebook computer, PDA, cloud server, etc. The computer device may interact with the user via a keyboard, mouse, remote control, touchpad, or voice control device.

[0156] The memory 81 includes at least one type of readable storage medium, including flash memory, hard disk, multimedia card, card-type memory (e.g., SD or DX memory), random access memory (RAM), static random access memory (SRAM), read-only memory (ROM), electrically erasable programmable read-only memory (EEPROM), programmable read-only memory (PROM), magnetic memory, magnetic disk, optical disk, etc. In some embodiments, the memory 81 can be an internal storage unit of the computer device 8, such as the hard disk or memory of the computer device 8. In other embodiments, the memory 81 can also be an external storage device of the computer device 8, such as a plug-in hard disk equipped on the computer device 8, a smart media card (SMC), a secure digital (SD) card, a flash card, etc. Of course, the memory 81 can also include both the internal storage unit of the computer device 8 and its external storage device. In this embodiment, the memory 81 is generally used to store the operating system and various application software installed on the computer device 8, such as computer-readable instructions for the circular plate secondary groove processing method. In addition, the memory 81 can also be used to temporarily store various types of data that have been output or are to be output.

[0157] In some embodiments, the processor 82 can be a central processing unit (CPU), a controller, a microcontroller, a microprocessor, or other data processing chip. The processor 82 is generally used to control the overall operation of the computer device 8. In this embodiment, the processor 82 is used to execute computer-readable instructions or process data stored in the memory 81, such as executing computer-readable instructions for the circular plate secondary groove processing method.

[0158] The network interface 83 may include a wireless network interface or a wired network interface. The network interface 83 is generally used to establish a communication connection between the computer device 8 and other electronic devices.

[0159] The present application also provides an embodiment, namely, a computer device, comprising a memory and a processor, wherein the memory stores computer-readable instructions, and when the processor executes the computer-readable instructions, the steps of the above-mentioned user insurance demand assessment method are implemented, namely, the following steps are implemented:

[0160] A method for processing a secondary bevel of a circular plate is disclosed. The method is applied to a bevel laser cutting device. The bevel laser cutting device includes a laser cutting head and a workbench. The laser cutting head is disposed above the workbench. The workbench is used to place the circular plate to be cut. The method includes:

[0161] Move the laser cutting head to any position on the circular plate to obtain the first edge-finding point;

[0162] Based on the first edge search landing point, an edge search operation is performed on a preset first coordinate axis to obtain a first edge search end point and a second edge search end point;

[0163] Determine a second edge-finding landing point based on the first edge-finding end point and the second edge-finding end point;

[0164] Based on the second edge search landing point, an edge search operation is performed on a preset second coordinate axis to obtain a third edge search end point and a fourth edge search end point, wherein the first coordinate axis is perpendicular to the second coordinate axis;

[0165] Determine the center point and radius of the circular plate based on the third edge-finding end point and the fourth edge-finding end point;

[0166] Machining parameters of the secondary groove processing are obtained, a numerical control programming program of the secondary groove processing is generated based on the machining parameters, a center point and a radius of the circular plate, and the numerical control programming program is executed to complete the secondary groove processing of the circular plate.

[0167] The present application also provides another embodiment, namely, a computer-readable storage medium storing computer-readable instructions. The computer-readable instructions can be executed by at least one processor to cause the at least one processor to perform the steps of the above-mentioned method for secondary groove processing of a circular plate, namely, to achieve:

[0168] A method for processing a secondary bevel of a circular plate is disclosed. The method is applied to a bevel laser cutting device. The bevel laser cutting device includes a laser cutting head and a workbench. The laser cutting head is disposed above the workbench. The workbench is used to place the circular plate to be cut. The method includes:

[0169] Move the laser cutting head to any position on the circular plate to obtain the first edge-finding point;

[0170] Based on the first edge search landing point, an edge search operation is performed on a preset first coordinate axis to obtain a first edge search end point and a second edge search end point;

[0171] Determine a second edge-finding landing point based on the first edge-finding end point and the second edge-finding end point;

[0172] Based on the second edge search landing point, an edge search operation is performed on a preset second coordinate axis to obtain a third edge search end point and a fourth edge search end point, wherein the first coordinate axis is perpendicular to the second coordinate axis;

[0173] Determine the center point and radius of the circular plate based on the third edge-finding end point and the fourth edge-finding end point;

[0174] Machining parameters of the secondary groove processing are obtained, a numerical control programming program of the secondary groove processing is generated based on the machining parameters, a center point and a radius of the circular plate, and the numerical control programming program is executed to complete the secondary groove processing of the circular plate.

[0175] Through the description of the above implementation methods, those skilled in the art can clearly understand that the above-mentioned embodiment methods can be implemented by means of software plus the necessary general hardware platform, and of course can also be implemented by hardware, but in many cases the former is a better implementation method. Based on this understanding, the technical solution of the present application, or the part that contributes to the prior art, can be embodied in the form of a software product, which is stored in a storage medium (such as ROM / RAM, magnetic disk, optical disk), and includes a number of instructions for enabling a terminal device (which can be a mobile phone, computer, server, air conditioner, or network device, etc.) to execute the methods described in each embodiment of the present application.

[0176] The present application can be used in many general or special computer system environments or configurations. For example: personal computers, server computers, handheld or portable devices, tablet devices, multiprocessor systems, microprocessor-based systems, set-top boxes, programmable consumer electronic devices, network PCs, minicomputers, mainframe computers, distributed computing environments including any of the above systems or devices, etc. The present application can be described in the general context of computer-executable instructions executed by a computer, such as program modules. Generally, program modules include routines, programs, objects, components, data structures, etc. that perform specific tasks or implement specific abstract data types. The present application can also be practiced in distributed computing environments, in which tasks are performed by remote processing devices connected via a communication network. In a distributed computing environment, program modules can be located in local and remote computer storage media, including storage devices.

[0177] It should be noted that the non-Company's software tools or components appearing in the various embodiments of this application are merely examples and do not represent actual use.

[0178] Obviously, the embodiments described above are only some of the embodiments of the present application, rather than all of the embodiments. The preferred embodiments of the present application are given in the accompanying drawings, but they do not limit the patent scope of the present application. The present application can be implemented in many different forms. On the contrary, the purpose of providing these embodiments is to make the understanding of the disclosure of the present application more thorough and comprehensive. Although the present application has been described in detail with reference to the aforementioned embodiments, for those skilled in the art, it is still possible to modify the technical solutions described in the aforementioned specific embodiments, or to make equivalent replacements for some of the technical features therein. Any equivalent structure made using the contents of the present application specification and the accompanying drawings, directly or indirectly used in other related technical fields, is also within the scope of patent protection of the present application.

Claims

1. A method for processing a secondary groove of a circular plate, characterized in that: The processing method is applied to a bevel laser cutting device, which includes a laser cutting head and a workbench. The laser cutting head is arranged above the workbench, and the workbench is used to place a circular plate to be cut. The processing method includes: Moving the laser cutting head to any position on the circular plate to obtain a first edge-finding landing point; Based on the first edge search landing point, an edge search operation is performed on a preset first coordinate axis to obtain a first edge search end point and a second edge search end point; Determine a second edge-finding landing point based on the first edge-finding end point and the second edge-finding end point; Based on the second edge-finding landing point, performing an edge-finding operation on a preset second coordinate axis to obtain a third edge-finding end point and a fourth edge-finding end point, wherein the first coordinate axis is perpendicular to the second coordinate axis; Determine the center point and radius of the circular plate based on the third edge-finding endpoint and the fourth edge-finding endpoint; The processing parameters of the secondary groove processing are obtained, a numerical control programming program of the secondary groove processing is generated based on the processing parameters, the center point and the radius of the circular plate, and the numerical control programming program is executed to complete the secondary groove processing of the circular plate.

2. The method for secondary groove processing of a circular plate according to claim 1, wherein: The groove laser cutting equipment further includes a nozzle, the nozzle is located below the laser cutting head, and a capacitive sensor is installed on the nozzle. The processing method further includes: During the edge-finding operation, an edge-finding end point is determined by a change in the capacitance value of the capacitive sensor.

3. The method for secondary groove processing of a circular plate according to claim 2, wherein: Before moving the laser cutting head to any position on the circular plate to obtain the first edge-finding landing point, the processing method further includes: A plane rectangular coordinate system is constructed in the plane where the circular plate is located, wherein the first coordinate axis is the X axis or the Y axis of the plane rectangular coordinate system.

4. The method for secondary groove processing of a circular plate according to claim 3, wherein: The step of performing an edge search operation on a preset first coordinate axis based on the first edge search landing point to obtain a first edge search end point and a second edge search end point specifically includes: Taking the first edge-finding landing point as a starting point, the laser cutting head is moved along a first axial direction of the first coordinate axis, and during the movement of the laser cutting head, a position where a sudden change in the capacitance value of the capacitive sensor occurs is identified to obtain a first position; Determine the point on the plane rectangular coordinate system corresponding to the first position as the first edge-finding end point; The laser cutting head is moved to the first edge-finding landing point, and the laser cutting head is again moved along the second axial direction of the first coordinate axis with the first edge-finding landing point as a starting point. During the movement of the laser cutting head, a position where a sudden change in the capacitance value of the capacitive sensor occurs is identified to obtain a second position; The second position corresponding to a point on the plane rectangular coordinate system is determined as the second edge-finding end point.

5. The method for secondary groove processing of a circular plate according to claim 1, wherein: The determining of the second edge-finding landing point based on the first edge-finding endpoint and the second edge-finding endpoint specifically includes: Determine the midpoint of a line connecting the first edge-finding endpoint and the second edge-finding endpoint to obtain a first edge-finding midpoint; The midpoint of the first edge search is determined as the end point of the second edge search.

6. The method for secondary groove processing of a circular plate according to claim 4, wherein: Based on the second edge search landing point, an edge search operation is performed on a preset second coordinate axis to obtain a third edge search end point and a fourth edge search end point, specifically including: The laser cutting head is moved to the second edge-finding landing point, and with the second edge-finding landing point as a starting point, the laser cutting head is moved along the first axial direction of the second coordinate axis, and during the movement of the laser cutting head, a position where a sudden change in the capacitance value of the capacitive sensor occurs is identified to obtain a third position; Determine the point on the plane rectangular coordinate system corresponding to the third position as the third edge-finding end point; The laser cutting head is moved to the second edge-finding landing point, and the laser cutting head is again moved along the second axial direction of the second coordinate axis with the second edge-finding landing point as a starting point. During the movement of the laser cutting head, a position where a sudden change in the capacitance value of the capacitive sensor occurs is identified to obtain a fourth position; The fourth position corresponding to a point on the plane rectangular coordinate system is determined as the fourth edge-finding end point.

7. The method for secondary groove processing of a circular plate according to claim 1, wherein: The determining of the center point and radius of the circular plate based on the third edge-finding endpoint and the fourth edge-finding endpoint specifically includes: Determine the midpoint of the line connecting the third edge-finding endpoint and the fourth edge-finding endpoint to obtain a second edge-finding midpoint; Determine the second edge-finding midpoint as the center point of the circular plate; The coordinate difference between the third edge-finding end point or the fourth edge-finding end point and the second edge-finding midpoint is calculated, and the coordinate difference is determined as the radius of the circular plate.

8. A circular plate secondary groove processing device, characterized in that: The circular plate secondary beveling processing device performs the circular plate secondary beveling processing method according to any one of claims 1 to 7, and the processing method is applied to a beveling laser cutting device, the beveling laser cutting device comprising a laser cutting head and a workbench, the laser cutting head being arranged above the workbench, the workbench being used to place a circular plate to be cut, and the processing device comprising: A first landing point module is used to move the laser cutting head to any position on the circular plate to obtain a first edge-finding landing point; A first edge-finding module is configured to perform an edge-finding operation on a preset first coordinate axis based on the first edge-finding landing point to obtain a first edge-finding end point and a second edge-finding end point; A second landing point module, configured to determine a second edge-finding landing point based on the first edge-finding endpoint and the second edge-finding endpoint; A second edge-finding module is configured to perform an edge-finding operation on a preset second coordinate axis based on the second edge-finding landing point to obtain a third edge-finding end point and a fourth edge-finding end point, wherein the first coordinate axis is perpendicular to the second coordinate axis; a circle center determination module, configured to determine the center point and radius of the circular plate based on the third edge-finding endpoint and the fourth edge-finding endpoint; The secondary processing module is used to obtain processing parameters of secondary groove processing, generate a numerical control programming program for the secondary groove processing based on the processing parameters, the center point and radius of the circular plate, and execute the numerical control programming program to complete the secondary groove processing of the circular plate.

9. A computer device, characterized in that: The method comprises a memory and a processor, wherein the memory stores computer-readable instructions, and the processor implements the steps of the circular plate secondary groove processing method according to any one of claims 1 to 7 when executing the computer-readable instructions.

10. A computer-readable storage medium, characterized in that The computer-readable storage medium stores computer-readable instructions, and when the computer-readable instructions are executed by a processor, the steps of the circular plate secondary groove processing method according to any one of claims 1 to 7 are implemented.

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