Wafer processing positioning and cutting apparatus

Abstract

The application discloses a wafer processing positioning and cutting device and relates to the technical field of wafer processing. The device comprises a cutting assembly and a pushing assembly, and an alternating assembly and a detecting assembly are arranged in the cutting assembly. When the device is used, a servo motor is started, two placing tables are driven to rotate along the arc-shaped guide rail through the alternating plate, the two placing tables are exchanged in position when the servo motor is automatically turned off, a cylinder is started again to fix the standby placing table, then two electromagnets are turned off, the wafer to be cut is placed on the standby placing table, the cutting assembly is started, the pushing assembly is started at the same time, the cut wafer is pushed out, and the wafer is conveniently taken out by the staff. Under the cooperation of the alternating assembly and the cutting assembly, the cut wafer does not need to be taken out to put in a new wafer, manual operation is simplified, it is more convenient, more time is saved, and the wafer processing efficiency is greatly improved.

Description

Technical Field

[0001] This invention relates to the field of wafer processing technology, specifically to a wafer processing positioning and cutting device. Background Technology

[0002] A wafer is a thin sheet of semiconductor material, typically made of single-crystal silicon. In semiconductor manufacturing, wafers are the fundamental material used to create integrated circuits and other electronic devices. After a series of processing steps, a wafer can be used to produce multiple small chips, called "chips" or "die-cores." Multiple integrated circuit chips are usually manufactured on a single wafer. Through dicing, these chips can be precisely separated from the wafer, making them independent units for subsequent packaging, testing, and other processes, ultimately creating semiconductor devices that can be used in various electronic devices.

[0003] In existing technologies, laser cutting offers extremely high processing precision, enabling the precise cutting of micro-sized chips. Laser cutting is non-contact, eliminating mechanical stress on the wafer and reducing the risk of cracks and damage. However, after laser cutting, the wafer needs to be manually removed from the processing table and then placed back in for the next processing step. This process takes time, and since wafers are typically thin, removing them can be inconvenient. If the wafer isn't removed completely in one go, the operator needs to change positions or methods to continue handling it, further increasing time consumption and significantly reducing wafer processing efficiency, which is detrimental to overall production efficiency.

[0004] Therefore, we propose a wafer processing positioning and cutting device to solve the problems mentioned in the background art. Summary of the Invention

[0005] The purpose of this invention is to provide a wafer processing positioning and cutting device to solve the problem mentioned in the background art that after the wafer has completed laser cutting, it is necessary to manually remove the wafer and put in a new wafer. The wafer thickness is usually small, making the operation inconvenient and time-consuming, which greatly reduces the wafer processing efficiency and is not conducive to the overall production efficiency.

[0006] To achieve the above objectives, the present invention provides the following technical solution: a wafer processing positioning and cutting device, comprising a cutting component and a feeding component, wherein the cutting component is internally provided with an alternating component and a detection component;

[0007] The alternating assembly includes an alternating plate and two placement stages. Two electromagnets are fixedly installed inside the alternating plate. Multiple arc-shaped grooves are formed on the outer surfaces of the two placement stages. Arc-shaped metal blocks are fixedly installed inside the multiple arc-shaped grooves. The two placement stages are used to place wafers to be cut and cut wafers, respectively. The alternating plate is responsible for rotating the two placement stages to exchange positions.

[0008] The alternating component also includes a feeding platform, on the outer surface of which two arc-shaped guide rails are fixedly installed;

[0009] The cutting assembly includes a cutting box, and a high-precision motion platform is set on the bottom surface inside the cutting box.

[0010] Preferably, the alternating assembly further includes a fixed plate and a servo motor. The output end of the servo motor is fixedly installed on the bottom of the alternating plate. The servo motor is installed inside the fixed plate by bolts. Anti-slip pads are fixedly connected to the center of the bottom of the two placement platforms. Four positioning holes are opened at the edge of the top of the two placement platforms. The bottom of one of the anti-slip pads is in contact with the top of the unloading platform.

[0011] Preferably, the high-precision motion platform is provided with a rotating platform on top, and a fixed platform is fixedly installed on the top of the rotating platform, and the bottom of the other anti-slip pad is in contact with the top of the fixed platform.

[0012] Preferably, a cylinder is fixedly installed at the center of the top of the rotating platform, a movable plate is fixedly installed at the output end of the cylinder, and four positioning rods are fixedly installed on the top of the movable plate. The outer surfaces of the four positioning rods are movably embedded inside the fixed platform, and the top ends of the four positioning rods are respectively movably embedded inside the four positioning holes.

[0013] Preferably, a control system is provided on the outer surface of the cutting box, a feeding system is provided on the rear surface inside the cutting box, a laser is provided on the front surface of the feeding system, a positioning frame is fixedly installed on the top surface inside the cutting box, and a positioning camera is fixedly installed on the bottom of the positioning frame.

[0014] Preferably, the detection component includes a mounting frame, a detection camera is fixedly mounted on the top surface inside the mounting frame, a fixing plate is fixedly mounted on the bottom of the mounting frame, the bottom of the unloading platform is fixedly mounted on the bottom surface inside the mounting frame, and one outer surface of the mounting frame is fixedly mounted on one side inside the cutting box.

[0015] Preferably, the detection assembly further includes an electric actuator, a limiting plate is fixedly installed at the top of the electric actuator, four limiting rods are fixedly installed at the top of the limiting plate, the tops of the four limiting rods are movably embedded inside the unloading platform, the outer surface of the electric actuator is located inside the unloading platform, and the bottom end of the electric actuator is fixedly installed on the bottom surface inside the mounting frame.

[0016] Preferably, the pushing assembly includes two L-shaped rods, one end of which is fixedly mounted with an arc-shaped push plate, and the other end of which is fixedly mounted with a movable rod. Both ends of the two movable rods are movably fitted with pulleys.

[0017] Preferably, the feeding assembly further includes two stepped slides and a hydraulic rod. A movable block is fixedly installed at one end of the hydraulic rod, and an elastic telescopic rod is fixedly installed at the bottom of the movable block. The bottom end of the elastic telescopic rod is fixedly installed at the center of the outer surface of the movable rod. The rear surfaces of the two stepped slides and the other end of the hydraulic rod are all fixedly installed on the rear surface inside the cutting box.

[0018] Preferably, the detection assembly further includes a pressure sensor, which is bolted to the center of the bottom of the unloading platform. The two ends of the moving rod are respectively movably embedded inside the two stepped slides. The outer surfaces of the two pulleys are respectively movably embedded inside the two stepped slides. A support rod is movably embedded inside the moving block, and one end of the support rod is fixedly installed on the rear surface wall inside the cutting box.

[0019] Compared with the prior art, the beneficial effects of the present invention are:

[0020] 1. In use, the servo motor is started, driving two placement stages to rotate along the arc-shaped guide rail via an alternating plate. When the servo motor automatically shuts off, the two placement stages exchange positions. The cylinder is then activated again to fix the spare placement stage, and then the two electromagnets are deactivated. Next, the wafer to be cut is placed on the spare placement stage, and the cutting assembly is started. Simultaneously, the pusher assembly is activated to push the cut wafer forward, making it convenient for the operator to remove. With the cooperation of the alternating and cutting assemblies, it is not necessary to remove the cut wafer before placing a new wafer, simplifying manual operation, making it more convenient, saving more time, and greatly improving wafer processing efficiency.

[0021] 2. In use, this invention involves activating a high-precision motion platform, driving a rotating platform and the wafer to be cut to move backward to the positioning camera. The positioning camera captures image information of the wafer surface and compares it with a pre-set standard position to calculate the wafer's offset and rotation angle in the plane. Finally, the high-precision motion platform and rotating platform move and adjust the wafer to the precise cutting position below the laser, achieving accurate wafer positioning. Then, the laser is activated, and under the drive of the high-precision motion platform and rotating platform, the wafer is laser-cut.

[0022] 3. When using this invention, the inspection camera is activated to perform rapid visual inspection of the diced wafers and transmits the inspection results to the control system. This allows staff to promptly identify problems that may occur during the dicing process. Automated visual inspection reduces the workload and errors of manual inspection and improves inspection efficiency. The electric push rod is activated, and the limiting plate pushes the limiting rod into the four positioning holes to limit the placement stage and prevent the positioning holes from shifting during subsequent material feeding, thus avoiding rotation of the placement stage.

[0023] 4. When this invention is used, after the pressure sensor detects the pressure signal, the control system controls the hydraulic rod to start, pushing the moving block, elastic telescopic rod and moving rod to move. When the pulley rolls from a high place to a low place, it drives the arc-shaped push plate to move to a low place. When the pulley continues to move to a flat area at the low place, the arc-shaped push plate moves to the placement table and pushes out the wafer, making it easy for the staff to remove the wafer easily and quickly, making material handling more convenient and saving time. Attached Figure Description

[0024] Figure 1 This is a front perspective view of a wafer processing positioning and cutting device according to the present invention;

[0025] Figure 2 This is a cross-sectional view of the structure of a wafer processing positioning and cutting device according to the present invention;

[0026] Figure 3 This is a cross-sectional view of the cutting component in a wafer processing positioning and cutting device according to the present invention;

[0027] Figure 4 This is a three-dimensional view of the structure of alternating components in a wafer processing positioning and cutting device according to the present invention;

[0028] Figure 5 This is a cross-sectional schematic diagram of the fixed stage in a wafer processing positioning and cutting device according to the present invention;

[0029] Figure 6 This is a schematic diagram of the unloading platform in a wafer processing positioning and cutting device of the present invention;

[0030] Figure 7This is a three-dimensional view of the structure of the moving plate in a wafer processing positioning and cutting device of the present invention;

[0031] Figure 8 This is a cross-sectional schematic diagram of the detection component in a wafer processing positioning and cutting device according to the present invention;

[0032] Figure 9 This is a cross-sectional view of the unloading platform in a wafer processing positioning and cutting device according to the present invention;

[0033] Figure 10 This is a three-dimensional view of the pusher assembly in a wafer processing positioning and cutting device according to the present invention.

[0034] Figure 11 This is a schematic diagram of the alternating plate structure in a wafer processing positioning and cutting device according to the present invention.

[0035] In the picture:

[0036] 1. Cutting assembly; 101. Cutting box; 102. Control system; 103. Feeding system; 104. Laser; 105. High-precision motion platform; 106. Rotating platform; 107. Positioning frame; 108. Positioning camera; 109. Fixed table; 110. Cylinder; 111. Moving plate; 112. Positioning rod; 2. Alternating assembly; 201. Fixed plate; 202. Servo motor; 203. Alternating plate; 204. Electromagnet; 205. Placement table; 206. Arc groove; 207. Arc metal 1. Block; 208. Anti-slip mat; 209. Positioning hole; 210. Unloading platform; 211. Arc-shaped guide rail; 3. Detection component; 301. Mounting bracket; 302. Detection camera; 303. Electric push rod; 304. Limit plate; 305. Limit rod; 306. Pressure sensor; 4. Pushing component; 401. Stepped slide; 402. Hydraulic rod; 403. Support rod; 404. Moving block; 405. Elastic telescopic rod; 406. Moving rod; 407. L-shaped rod; 408. Arc-shaped push plate; 409. Pulley. Detailed Implementation

[0037] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0038] Example 1: Please refer to Figures 1-11As shown, the present invention provides a technical solution: a wafer processing positioning and cutting device, including a cutting component 1 and a feeding component 4. The cutting component 1 is internally provided with an alternating component 2 and a detection component 3. The alternating component 2 includes an alternating plate 203 and two placement stages 205. Two electromagnets 204 are fixedly installed inside the alternating plate 203. Multiple arc-shaped grooves 206 are formed on the outer surface of each of the two placement stages 205. Arc-shaped metal blocks 207 are fixedly installed inside each of the multiple arc-shaped grooves 206. The two placement stages 205 are respectively used to place the wafer to be cut and the cut wafer. The alternating plate 203 is responsible for rotating the two placement stages 205 circumferentially to exchange their positions. The alternating component 2 also includes a lower... The material platform 210 has two arc-shaped guide rails 211 fixedly installed on its outer surface; the cutting assembly 1 includes a cutting box 101, and a high-precision motion platform 105 is set on the bottom surface inside the cutting box 101; the alternating assembly 2 also includes a fixed plate 201 and a servo motor 202, the output end of the servo motor 202 is fixedly installed on the bottom of the alternating plate 203, and the servo motor 202 is installed inside the fixed plate 201 by bolts; anti-slip pads 208 are fixedly connected to the center of the bottom of the two placement platforms 205, and four positioning holes 209 are opened at the top edge of the two placement platforms 205, and the bottom of one of the anti-slip pads 208 contacts the top of the material platform 210.

[0039] In this embodiment, during use, after laser cutting is completed, the rotating platform 106 drives the wafer to return to its initial state, and the high-precision motion platform 105 drives the wafer to move to its initial position. Then, two electromagnets 204 are activated simultaneously to generate magnetic attraction. The two electromagnets 204 firmly magnetically attract the arc-shaped metal blocks 207 on the sides of the two placement stages 205, thereby fixing the two placement stages 205 inside the alternating plate 203. This prevents the placement stages 205 from deviating in position during subsequent rotation, which would affect the insertion of the positioning rod 112 and the limiting rod 305 into the positioning hole 209. Next, the cylinder 110 is activated, pulling the moving plate 111 downward, causing the positioning rod 112 to slide down from the positioning hole 209 into the fixed stage 109. At this time, both the placement stage 205 and the wafer are no longer fixed. The next step is to start the servo motor 202. The rotation of the output of the servo motor 202 drives the alternating plate 203 to rotate, which in turn drives the two placement stages 205 to rotate from the fixed stage 109 and the unloading stage 210 to the arc-shaped guide rail 211, and they continue to rotate along the arc-shaped trajectory of the arc-shaped guide rail 211. When the servo motor 202 automatically shuts off, the alternating plate 203 has rotated exactly 180 degrees, causing the two placement stages 205 to exchange positions. At this time, the placement stage 205 on the left and the diced wafer rotate to the unloading stage 210, while the spare placement stage 205 on the right rotates to the fixed stage 109. Then, the cylinder 110 is started again, so that the positioning rod 112 is inserted into the positioning hole 209 on the side of the spare placement stage 205 to fix the spare placement stage 205. At the same time, the detection component 3 is started to detect the diced wafer on the right and limit the placement stage 205. Then, the two electromagnets 204 are turned off, the magnetism disappears, and the connection between the placement stage 205 and the alternating plate 203 is lost. Next, the operator places the new wafer to be cut onto the spare placement stage 205 on the left. Finally, the cutting assembly 1 is activated to position and laser-cut the new wafer. Simultaneously, the pusher assembly 4 is activated to push the cut wafer forward from the placement stage 205, making it easier for the operator to remove the wafer. With the cooperation of the alternating assembly 2 and the cutting assembly 1, it is not necessary to remove the cut wafer before placing a new one, simplifying manual operation, saving time, and greatly improving wafer processing efficiency. This solves the problem that after laser cutting, wafers need to be manually removed and new wafers placed, which is inconvenient and time-consuming due to the typically small thickness of the wafers, significantly reducing wafer processing efficiency and hindering overall production efficiency.

[0040] Example 2: Figures 1-3As shown, the cutting assembly 1 includes a cutting box 101. A high-precision motion platform 105 is installed on the bottom surface inside the cutting box 101. A rotating platform 106 is installed on the top of the high-precision motion platform 105. A fixed platform 109 is fixedly installed on the top of the rotating platform 106. The bottom of another anti-slip pad 208 is in contact with the top of the fixed platform 109. A cylinder 110 is fixedly installed at the center of the top of the rotating platform 106. A moving plate 111 is fixedly installed at the output end of the cylinder 110. Four fixed... Positioning rods 112, the outer surfaces of the four positioning rods 112 are movably embedded inside the fixed platform 109, and the top ends of the four positioning rods 112 are respectively movably embedded inside the four positioning holes 209. The outer surface of the cutting box 101 is provided with a control system 102, the rear surface inside the cutting box 101 is provided with a feeding system 103, the front surface of the feeding system 103 is provided with a laser 104, the top surface inside the cutting box 101 is fixedly installed with a positioning frame 107, and the bottom of the positioning frame 107 is fixedly installed with a positioning camera 108.

[0041] In this embodiment, during use, the feeding system 103, laser 104, high-precision motion platform 105, rotating platform 106, positioning camera 108, cylinder 110, servo motor 202, electromagnet 204, detection camera 302, electric push rod 303, pressure sensor 306, hydraulic rod 402, and control system 102 are electrically connected. An abnormality indicator light is provided on the front surface of the control system 102. The initial states of the two placement platforms 205 are as follows: Figure 11As shown, one placement platform 205 is placed on a fixed platform 109, with the top end of a positioning rod 112 embedded in a positioning hole 209 at the edge of the platform. The platform 205 is fixed by the positioning rod 112. Another placement platform 205 is placed on top of the unloading platform 210. The wafer to be cut is placed on the left placement platform 205, positioned between the top ends of the four positioning rods 112. The positioning rods 112 fix the position of the wafer to prevent accidental displacement and affect subsequent cutting. The high-precision motion platform 105 is activated, driving the rotating platform 106, the fixed stage 109, the left placement stage 205, and the wafer to be cut to move backward. When the placement stage 205 moves to the positioning camera 108, the high-precision motion platform 105 automatically pauses for a moment, and the positioning camera 108 is activated to take pictures of the wafer below. The positioning camera 108 will collect image information of the wafer surface, which includes alignment marks or feature patterns on the wafer. Then, the image processing algorithm is used to analyze and process the collected images, identify the position of these alignment marks or feature patterns, and compare them with the preset standard position to calculate the wafer's offset and rotation angle in the plane. Finally, the high-precision motion platform 105 and the rotating platform 106 precisely adjust the position of the wafer according to the calculated offset and rotation angle, and further move the wafer to the accurate cutting position below the laser 104, thereby achieving precise wafer positioning. Then, the laser 104 is activated to generate a high-energy-density laser beam. An optical system ensures the laser beam is precisely positioned on the wafer. Driven by the high-precision motion platform 105 and the rotating platform 106, the wafer moves to perform laser cutting. After laser cutting, the rotating platform 106 drives the wafer back to its initial state, and the high-precision motion platform 105 moves the wafer to its initial position. Then, the alternate assembly 2 replaces the spare placement stage 205 to begin cutting the next wafer.

[0042] Example 3: Figures 2-4 , Figure 6 and Figures 8-9 As shown, the detection component 3 includes a mounting frame 301, a detection camera 302 is fixedly mounted on the top surface inside the mounting frame 301, a fixing plate 201 is fixedly mounted on the bottom of the mounting frame 301, the bottom of the unloading platform 210 is fixedly mounted on the bottom surface inside the mounting frame 301, and one outer surface of the mounting frame 301 is fixedly mounted on one side inside the cutting box 101. The detection component 3 also includes an electric push rod 303, a limiting plate 304 is fixedly mounted on the top of the electric push rod 303, four limiting rods 305 are fixedly mounted on the top of the limiting plate 304, the tops of the four limiting rods 305 are movably embedded inside the unloading platform 210, the outer surface of the electric push rod 303 is located inside the unloading platform 210, and the bottom end of the electric push rod 303 is fixedly mounted on the bottom surface inside the mounting frame 301.

[0043] In this embodiment, during use, after the diced wafer rotates onto the unloading stage 210, the detection camera 302 is activated to perform rapid visual inspection of the diced wafer, such as checking the dicing quality and for defects. The inspection results are then transmitted to the control system 102, allowing staff to promptly identify problems during the dicing process, such as chipping or cracks at the dicing edges. This enables timely adjustments to dicing parameters or equipment maintenance. Automated visual inspection reduces the workload and errors of manual inspection, improving inspection efficiency. Simultaneously, the cylinder 110 is activated again, and the electric push rod 303 is activated. The electric push rod 303 pushes the limiting plate 304 upward, causing the four limiting rods 305 to move upward and insert into the four positioning holes 209, thus limiting the placement stage 205. This prevents the placement stage 205 from rotating during subsequent dicing, which could cause the positioning holes 209 to shift. At this point, the top of the limiting rod 305 is flush with the top of the placement stage 205. Then, the two electromagnets 204 are deactivated, and while a new wafer is placed in, the dicing assembly 4 begins its dicing operation.

[0044] Example 4: Figures 2-4 and Figures 9-10 As shown, the pushing assembly 4 includes two L-shaped rods 407. An arc-shaped push plate 408 is fixedly installed at one end of each L-shaped rod 407, and a moving rod 406 is fixedly installed at the other end of each L-shaped rod 407. Both ends of the moving rods 406 are movably fitted with pulleys 409. The pushing assembly 4 also includes two stepped slides 401 and a hydraulic rod 402. A moving block 404 is fixedly installed at one end of the hydraulic rod 402, and an elastic telescopic rod 405 is fixedly installed at the bottom of the moving block 404. The bottom end of the elastic telescopic rod 405 is fixedly installed at the center of the outer surface of the moving rod 406. The two stepped slides... The rear surface of the stepped slide 401 and the other end of the hydraulic rod 402 are both fixedly installed on the rear surface inside the cutting box 101. The detection assembly 3 also includes a pressure sensor 306, which is installed at the center of the bottom of the unloading platform 210 by bolts. The two ends of the moving rod 406 are respectively movably embedded in the interior of the two stepped slides 401. The outer surfaces of the two pulleys 409 are respectively movably embedded in the interior of the two stepped slides 401. The moving block 404 is movably embedded in the interior of the support rod 403, and one end of the support rod 403 is fixedly installed on the rear surface wall inside the cutting box 101.

[0045] In this embodiment, during use, as the limiting plate 304 moves, its top gradually contacts the detection head of the pressure sensor 306. After the pressure sensor 306 detects the pressure signal, the control system 102 controls the hydraulic rod 402 to start, pushing the moving block 404 to slide forward on the outer surface of the support rod 403. The elastic telescopic rod 405 drives the moving rod 406 to move, and drives the two pulleys 409 to roll inside the corresponding stepped slide 401. The structure of the stepped slide 401 is as follows: Figure 10As shown, the height decreases in front. When the pulley 409 rolls from a high point to a low point inside the stepped slide 401, it drives the moving rod 406, L-shaped rod 407, and arc-shaped push plate 408 to move downwards together, generating a downward pulling force on the elastic telescopic rod 405, causing the elastic telescopic rod 405 to unfold downwards, as shown. Figure 11 As shown, when pulley 409 continues to move forward at the flat section at the bottom of stepped slide 401, the bottom of arc-shaped push plate 408 is just above the placement stage 205. Then, arc-shaped push plate 408 moves through the groove at the top of alternating plate 203 to the placement stage 205 and contacts the wafer. As arc-shaped push plate 408 moves, it pushes the wafer forward from the placement stage 205, making it easy and quick for workers to remove the wafer, making material handling more convenient and saving time. Next, hydraulic rod 402 pulls moving block 404 to move in the opposite direction and reset, driving elastic telescopic rod 405 and moving rod 406 to move in the opposite direction and reset, moving from the bottom of stepped slide 401 to the top. At this time, elastic telescopic rod 405 is squeezed and contracted together, further causing arc-shaped push plate 408 to move backward and increase in height, without affecting the normal rotation of the left side placement stage 205.

[0046] The overall mechanism works as follows: The wafer to be cut is placed on the placement stage 205 on the left, positioned between the tops of the four positioning rods 112. The high-precision motion platform 105 is activated, driving the rotating platform 106 and the wafer to be cut to move backward to the positioning camera 108. The high-precision motion platform 105 then pauses briefly, while the positioning camera 108 captures image information of the wafer surface. This image is compared with a pre-set standard position to calculate the wafer's offset and rotation angle in the plane. Based on the calculated offset and rotation angle, the high-precision motion platform 105 and the rotating platform 106 precisely adjust the wafer's position, moving it to the accurate cutting position below the laser 104. The laser 104 is then activated, and driven by the high-precision motion platform 105 and the rotating platform 106, the wafer moves for laser cutting. After laser cutting is completed, the rotating platform 106 drives the wafer back to its initial state, and the high-precision motion platform 105 drives the wafer to its initial position. Simultaneously, two electromagnets 204 are activated to firmly hold the arc-shaped metal block 207. Next, cylinder 110 is activated, and the moving plate 111 moves the positioning rod 112 out of the positioning hole 209. Servo motor 202 is activated, driving the alternating plate 203 to rotate, further driving the two placement stages 205 to rotate along the arc-shaped guide rail 211. When servo motor 202 automatically shuts off, the two placement stages 205 exchange positions. At this time, the detection camera 302 performs a rapid visual inspection of the diced wafer. Cylinder 110 is activated again, fixing the positioning rod 112 to the placement stage 205. Simultaneously, electric push rod 303 is activated, and limit plate 304 pushes limit rod 305 into the positioning hole 209. Then, the two electromagnets 204 are shut off. As limit plate 304 moves, pressure sensor 306 detects a pressure signal, and then control system 102 controls hydraulic rod 402 to start. When a new wafer to be cut is placed in, the hydraulic rod 402 pushes the moving block 404, the elastic telescopic rod 405 and the moving rod 406 to move, causing the pulley 409 to roll inside the stepped slide 401. When the pulley 409 rolls from a high place to a low place, it drives the moving rod 406, the L-shaped rod 407 and the arc-shaped push plate 408 to move to a lower place together. At the same time, the elastic telescopic rod 405 unfolds downward. Then the arc-shaped push plate 408 moves through the groove at the top of the alternating plate 203 to the placement stage 205, pushing the wafer forward from the placement stage 205, making it easy and quick for the staff to remove the wafer.

[0047] Among them, the control system 102, the feeding system 103, the laser 104, the high-precision motion platform 105, the rotating platform 106, the positioning camera 108, the cylinder 110, the servo motor 202, the electromagnet 204, the detection camera 302, the electric actuator 303, the pressure sensor 306, and the hydraulic rod 402 are all existing technologies, and their components and operating principles are all publicly available technologies, so they will not be explained in detail here.

[0048] Although the present invention has been described in detail with reference to the foregoing embodiments, those skilled in the art can still modify the technical solutions described in the foregoing embodiments or make equivalent substitutions for some of the technical features. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the present invention should be included within the protection scope of the present invention.

Claims

1. A wafer processing positioning and cutting device, comprising a cutting assembly (1) and a feeding assembly (4), characterized in that: The cutting component (1) is internally provided with an alternating component (2) and a detection component (3); The alternating assembly (2) includes an alternating plate (203) and two placement stages (205). Two electromagnets (204) are fixedly installed inside the alternating plate (203). Multiple arc-shaped grooves (206) are opened on the outer surface of the two placement stages (205). Arc-shaped metal blocks (207) are fixedly installed inside the multiple arc-shaped grooves (206). The two placement stages (205) are used to place the wafer to be cut and the cut wafer, respectively. The alternating plate (203) is responsible for rotating the two placement stages (205) to exchange positions. The alternating component (2) also includes a feeding platform (210), on the outer surface of which two arc-shaped guide rails (211) are fixedly installed. The cutting assembly (1) includes a cutting box (101), and a high-precision motion platform (105) is provided on the bottom surface inside the cutting box (101). The pusher assembly (4) includes two L-shaped rods (407), one end of which is fixedly mounted with an arc-shaped push plate (408), and the other end of which is fixedly mounted with a moving rod (406). Both ends of the two moving rods (406) are movably fitted with pulleys (409). The feeding assembly (4) also includes two stepped slides (401) and a hydraulic rod (402). A moving block (404) is fixedly installed at one end of the hydraulic rod (402). An elastic telescopic rod (405) is fixedly installed at the bottom of the moving block (404). The bottom end of the elastic telescopic rod (405) is fixedly installed at the center of the outer surface of the moving rod (406). The rear surfaces of the two stepped slides (401) and the other end of the hydraulic rod (402) are both fixedly installed on the rear surface inside the cutting box (101).

2. The wafer processing positioning and cutting device according to claim 1, characterized in that: The alternating component (2) also includes a fixed plate (201) and a servo motor (202). The output end of the servo motor (202) is fixedly installed on the bottom of the alternating plate (203). The servo motor (202) is installed inside the fixed plate (201) by bolts. Anti-slip pads (208) are fixedly connected to the center of the bottom of the two placement platforms (205). Four positioning holes (209) are opened at the top edge of the two placement platforms (205). The bottom of one of the anti-slip pads (208) is in contact with the top of the unloading platform (210).

3. The wafer processing positioning and cutting device according to claim 2, characterized in that: The high-precision motion platform (105) is provided with a rotating platform (106) on top, and a fixed platform (109) is fixedly installed on the top of the rotating platform (106). The bottom of another anti-slip pad (208) is in contact with the top of the fixed platform (109).

4. The wafer processing positioning and cutting device according to claim 3, characterized in that: A cylinder (110) is fixedly installed at the center of the top of the rotating platform (106). A movable plate (111) is fixedly installed at the output end of the cylinder (110). Four positioning rods (112) are fixedly installed on the top of the movable plate (111). The outer surfaces of the four positioning rods (112) are movably embedded in the interior of the fixed platform (109). The top ends of the four positioning rods (112) are respectively movably embedded in the interior of the four positioning holes (209).

5. The wafer processing positioning and cutting device according to claim 4, characterized in that: The outer surface of the cutting box (101) is provided with a control system (102), the rear surface inside the cutting box (101) is provided with a feeding system (103), the front surface of the feeding system (103) is provided with a laser (104), the top surface inside the cutting box (101) is fixedly installed with a positioning frame (107), and the bottom of the positioning frame (107) is fixedly installed with a positioning camera (108).

6. The wafer processing positioning and cutting device according to claim 5, characterized in that: The detection component (3) includes a mounting frame (301), a detection camera (302) is fixedly installed on the top surface inside the mounting frame (301), a fixing plate (201) is fixedly installed on the bottom of the mounting frame (301), the bottom of the unloading platform (210) is fixedly installed on the bottom surface inside the mounting frame (301), and one outer surface of the mounting frame (301) is fixedly installed on one side inside the cutting box (101).

7. The wafer processing positioning and cutting device according to claim 6, characterized in that: The detection component (3) also includes an electric push rod (303), the top of which is fixedly mounted with a limiting plate (304), and the top of the limiting plate (304) is fixedly mounted with four limiting rods (305). The tops of the four limiting rods (305) are movably embedded inside the unloading platform (210). The outer surface of the electric push rod (303) is located inside the unloading platform (210), and the bottom end of the electric push rod (303) is fixedly mounted on the bottom surface inside the mounting frame (301).

8. The wafer processing positioning and cutting device according to claim 7, characterized in that: The detection component (3) also includes a pressure sensor (306), which is bolted to the center of the bottom of the unloading platform (210). The two ends of the moving rod (406) are respectively movably embedded in the interior of the two stepped slides (401). The outer surfaces of the two pulleys (409) are respectively movably embedded in the interior of the two stepped slides (401). The moving block (404) is movably embedded in the interior of a support rod (403), and one end of the support rod (403) is fixedly installed on the rear surface wall inside the cutting box (101).

Images