Assembly jig and assembly method

Abstract

The invention relates to an assembling jig and an assembling method. By arranging the base, the guide assembly and the moving part, when the central axis of the bearing part is located at the preset position, the first face and the second face can abut against the adsorption part, so that the central axis of the adsorption part coincides with the central axis of the bearing part, and then the concentricity of the adsorption part and the bearing part is improved; and the quality of the wafer in the subsequent polishing process can be improved. The first moving part located at the first position or the second moving part located at the second position serves as the reference standard for assembling the adsorption part to the bearing part, so that an operator can have a more reliable basis when fixing the adsorption part to the bearing part, and errors caused by human factors are reduced. Meanwhile, the guide assembly is arranged on the first side of the base, the first guide piece is matched with the first moving part, and the second guide piece is matched with the second moving part, so that the moving pieces move more stably and smoothly, and the accuracy and reliability of the whole assembling process are indirectly improved.

Description

Technical Field

[0001] The present application relates to the field of wafer regeneration technology, and in particular to an assembly jig and an assembly method. Background Art

[0002] Wafer reconditioning refers to the recycling of test wafers used in chip production. Wafer reconditioning not only reduces production costs for downstream integrated circuit manufacturers, but also reduces resource waste and achieves sustainable development. Test wafers include control wafers and baffles. The wafer reconditioning process primarily involves film removal, rough polishing, fine polishing, cleaning, and monitoring of the control and baffles to ensure wafer flatness and particle-free residue.

[0003] However, in the related art, there is a problem of poor polishing quality of the wafer during the wafer polishing process. Summary of the Invention

[0004] Based on this, it is necessary to provide an assembly jig and an assembly method to improve the polishing quality of wafers.

[0005] According to one aspect of the present application, an embodiment of the present application provides an assembly jig for assembling a carrier and a suction member, wherein the suction member is used to suction a wafer, and the assembly jig includes:

[0006] The base has a first side and a second side arranged opposite to each other along a first direction; the first side of the base is used to support the carrier, and the side of the carrier facing away from the base is used to support the adsorption member;

[0007] A guide assembly is provided on a first side of the base; the guide assembly includes a first guide member and a second guide member; and

[0008] The moving member includes a first moving portion and a second moving portion, wherein the first moving portion is movably connected to the first guide member along a first direction, and the second moving portion is movably connected to the second guide member along the first direction;

[0009] The moving member has a first state in which the first moving portion and the second moving portion cooperate with each other, and a second state in which the first moving portion and the second moving portion are separated;

[0010] In the first state, the first movable portion has a first surface arranged toward the second movable portion, and the second movable portion has a second surface arranged toward the first movable portion, and the first surface and the second surface jointly define an adjustment space for adjusting the position of the adsorption member; the first state includes a first sub-state for, when the central axis of the carrier is in a preset position, both the first surface and the second surface abut against the adsorption member so that the central axis of the adsorption member coincides with the central axis of the carrier; in the first sub-state, the first movable portion is in the first position, and the second movable portion is in the second position;

[0011] In the second state, the first moving portion at the first position or the second moving portion at the second position is used as a reference for assembling the suction component to the carrier.

[0012] In one embodiment, in the first sub-state, both the first surface and the second surface abut against the adsorption member;

[0013] Wherein, in the first sub-state, the first surface abuts against the adsorption component in a first manner, the first manner including point abutment, line abutment or surface abutment; and / or

[0014] In the first sub-state, the second surface abuts against the adsorption component in a second manner, which includes point abutment, line abutment, or surface abutment.

[0015] In one embodiment, in the first state, the first surface and the second surface form a combined surface, and the extension direction of the central axis L of the combined surface and the first direction are parallel to each other;

[0016] In the first sub-state, the first surface is in linear contact with the adsorption element, the second surface is in linear contact with the adsorption element, and the central axes of the combined surface, the adsorption element, and the carrier element coincide with each other.

[0017] In one embodiment, the cross-sectional area of ​​the combined surface decreases along the direction from the second side to the first side, and the minimum dimension of the cross-sectional area of ​​the combined surface decreases along the direction perpendicular to the first direction;

[0018] The cross section of the combined surface is perpendicular to the first direction.

[0019] In one embodiment, a surface parallel to the first direction and on which the central axis of the combined surface lies is defined as a reference surface;

[0020] The intersection line of the reference surface and the combined surface is the first intersection line and the second intersection line. The first intersection line and the second intersection line are symmetrically arranged about the central axis of the combined surface. The first intersection line and the second intersection line are close to each other at one end away from the base, and the first intersection line and the second intersection line are extended away from each other at one end close to the base.

[0021] In one embodiment, the first intersection line and the second intersection line are both straight lines.

[0022] In one embodiment, the adjustment space is also used to adjust the posture of the carrier;

[0023] The first state further includes a second sub-state in which both the first surface and the second surface are in contact with the carrier, so that the central axis of the carrier is at a preset position.

[0024] In one embodiment, the assembly jig further includes a plurality of first adjustment members, the first adjustment members being movably connected to the base along a direction perpendicular to the first direction;

[0025] The plurality of first adjustment members are used to fix the supporting member when the central axis of the supporting member is at a preset position.

[0026] In one embodiment, the assembly jig further includes a plurality of second adjustment members, the second adjustment members being movably connected to the base along a direction perpendicular to the first direction;

[0027] The plurality of second adjustment members are used to define a fixed space for fixing the supporting member so that the central axis of the supporting member is located at a preset position.

[0028] In one embodiment, the base is provided with a plurality of guide grooves corresponding to the plurality of second adjustment members, and the second adjustment members are movably connected to the base along a direction perpendicular to the first direction by means of the corresponding guide grooves;

[0029] The base is provided with an identification portion located on the target side of the guide groove. The target side of the guide groove is at least one side of the two sides of the guide groove along the preset direction. The preset direction, the first direction and the extension direction of the guide groove are perpendicular to each other.

[0030] In one embodiment, the assembly jig further includes a first fixing member, the first fixing member being movably connected to the first guide member along a first direction, and the first fixing member being located between the first movable portion and the base, and the first fixing member being configured to maintain the first movable portion in the first position; and / or

[0031] The assembly jig further includes a second fixing member, which is movably connected to the second guide member along the first direction and is located between the second movable portion and the base. The second fixing member is configured to keep the second movable portion at the second position.

[0032] According to another aspect of the present application, an embodiment of the present application provides an assembly method, using an assembly jig as described in any of the above embodiments to assemble a carrier and an adsorption member; the assembly method includes:

[0033] placing the carrier on the first side of the base so that the central axis of the carrier is at a preset position;

[0034] Placing the adsorption member on a side of the carrier away from the base, and controlling the movable member in the first state to move toward the base in a first direction so that the movable member is in the first sub-state and the central axis of the adsorption member coincides with the central axis of the carrier;

[0035] The moving member is controlled to be in the second state, and the adsorption member is fixed on the carrying member based on the first moving portion being in the first position or the second moving portion being in the second position.

[0036] In one embodiment, placing the carrier on the first side of the base so that the central axis of the carrier is at the preset position includes:

[0037] The supporting member is placed on the first side of the base, and the movable member in the first state is controlled to move toward the base along the first direction so that the movable member is in the second sub-state; in the second sub-state, the first surface and the second surface are both in contact with the supporting member, and the central axis of the supporting member is in a preset position.

[0038] In one embodiment, placing the carrier on the first side of the base so that the central axis of the carrier is at a predetermined position includes:

[0039] The supporting member is fixed by a plurality of first adjusting members so that the central axis of the supporting member is at a preset position; the first adjusting members are movably connected to the base along a direction perpendicular to the first direction.

[0040] The above-mentioned assembly jig and assembly method include at least a base, a guide assembly, and a movable member, wherein the guide assembly includes a first guide member and a second guide member. By providing the base, the guide assembly, and the movable member, in a first state, when the central axis of the carrier is in a preset position, the first surface of the first movable member and the second surface of the second movable member can abut against the adsorption member, thereby causing the central axis of the adsorption member to coincide with the central axis of the carrier, thereby improving the concentricity between the adsorption member and the carrier, which is beneficial for improving the quality of the wafer during the subsequent polishing process and improving the uniformity of the wafer polishing. In the second state, the first movable member in the first position or the second movable member in the second position can serve as a reference for assembling the adsorption member to the carrier, so that the operator has a more reliable basis when fixing the adsorption member to the carrier, reducing errors caused by human factors. At the same time, the guide assembly is arranged on the first side of the base, the first guide member cooperates with the first movable member, and the second guide member cooperates with the second movable member, so that the movement of the movable member is more stable and smooth, reducing shaking and deviation during the movement process, thereby indirectly improving the accuracy and reliability of the entire assembly process.

[0041] Additional aspects and advantages of the embodiments of the present application will be given in part in the description below, and in part will become apparent from the description below, or will be learned through practice of the embodiments of the present application. BRIEF DESCRIPTION OF THE DRAWINGS

[0042] Various other advantages and benefits will become apparent to those skilled in the art upon reading the detailed description of the embodiments below. The accompanying drawings are for illustration purposes only and are not to be considered as limiting the present application. The same reference numerals are used throughout the accompanying drawings to represent the same components.

[0043] In the attached figure:

[0044] Figure 1 A schematic diagram of the three-dimensional structure of an assembly jig provided in some embodiments of the present application;

[0045] Figure 2 A schematic diagram of the exploded structure of an assembly jig provided in some embodiments of the present application;

[0046] Figure 3 A schematic cross-sectional view of an assembly jig according to some embodiments of the present application;

[0047] Figure 4 A schematic cross-sectional view of an assembly jig in one state provided by some embodiments of the present application;

[0048] Figure 5 A schematic flow chart of an assembly method for an assembly jig provided in some embodiments of the present application;

[0049] Figure 6 A schematic flow chart of an assembly method for an assembly jig provided in some other embodiments of the present application;

[0050] Figure 7 Schematic diagram of the flow of an assembly method of an assembly jig provided in some embodiments of the present application.

[0051] The accompanying drawings in the specific implementation manner are as follows:

[0052] Assembly jig 100;

[0053] Base 110, first side 111, second side 112, guide groove c;

[0054] Guide assembly 120, first guide member 121, second guide member 122;

[0055] Moving member 130, first moving portion 131, first surface m1, second moving portion 132, second surface m2; adjustment space K;

[0056] First intersection line X1, second intersection line X2;

[0057] First adjusting member T1, second adjusting member T2, fixed space G;

[0058] A first fixing member 140, a second fixing member 150;

[0059] Carrier 200;

[0060] Adsorption element 300;

[0061] Central axis L;

[0062] First direction F1. DETAILED DESCRIPTION

[0063] To make the above-mentioned objects, features, and advantages of the present application more clearly understood, the specific embodiments of the present application are described in detail below with reference to the accompanying drawings. The following description sets forth many specific details to facilitate a full understanding of the present application. However, the present application can be implemented in many other ways than those described herein, and those skilled in the art can make similar improvements without violating the scope of the present application. Therefore, the present application is not limited to the specific embodiments disclosed below.

[0064] In the description of this application, it should be understood that if the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise", "axial", "radial", "circumferential", etc. appear, the orientation or position relationship indicated by these terms is based on the orientation or position relationship shown in the accompanying drawings, which is only for the convenience of describing this application and simplifying the description, and does not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on this application.

[0065] In addition, if the terms "first" or "second" appear, these terms are used for descriptive purposes only and should not be understood to indicate or imply relative importance or implicitly specify the number of technical features indicated. Therefore, a feature specified as "first" or "second" may explicitly or implicitly include at least one of such features. In the description of this application, if the term "plurality" appears, "plurality" means at least two, for example, two, three, etc., unless otherwise specifically defined.

[0066] In this application, unless otherwise specified or limited, the terms "mounted," "connected," "connected," "fixed," etc., should be interpreted broadly. For example, these terms may refer to fixed connections, removable connections, or integration; mechanical connections or electrical connections; direct connections or indirect connections through an intermediary; and internal communication between two components or interaction between two components, unless otherwise specified. Those skilled in the art will understand the specific meanings of these terms in this application based on the specific circumstances.

[0067] In this application, unless otherwise expressly specified or limited, if a first feature is described as being "above" or "below" a second feature, or similar descriptions, this may mean that the first and second features are in direct contact, or that the first and second features are in indirect contact through an intermediate medium. Furthermore, when a first feature is described as being "above," "above," or "above" a second feature, it may mean that the first feature is directly above or diagonally above the second feature, or simply means that the first feature is at a higher level than the second feature. When a first feature is described as being "below," "below," or "below" a second feature, it may mean that the first feature is directly below or diagonally below the second feature, or simply means that the first feature is at a lower level than the second feature.

[0068] It should be noted that if an element is referred to as being "fixed to" or "disposed on" another element, it may be directly on the other element or there may be an intermediate element. If an element is considered to be "connected to" another element, it may be directly connected to the other element or there may be an intermediate element. If any, the terms "vertical", "horizontal", "upper", "lower", "left", "right" and similar expressions used in this application are for illustrative purposes only and do not represent the only embodiment.

[0069] In the field of wafer regeneration, the recycling and reuse of test pieces is involved. The test pieces include control pieces and baffles. The control pieces are mainly used to monitor the stability and reliability of the machinery and equipment on the production line. Before production and during mass production, it is necessary to use test control pieces to determine whether the machinery and equipment are operating normally. The baffles are mainly used to maintain stability during the production process. For example, the baffles used in the furnace tube are mainly used to be placed on the top and bottom layers of a batch of wafers to block the airflow in the furnace tube or fill the empty spaces in the furnace tube to ensure that the middle wafer is heated evenly and improve the production yield. Among them, in the wafer regeneration process, polishing the test piece is crucial. However, the inventors of this application noticed that during the polishing process, the carrier is connected to the processing equipment, the adsorbent is fixed on the carrier, and then the adsorbent is used to adsorb the wafer. When the processing equipment drives the carrier, the adsorbent and the wafer to move toward the polishing table for polishing, there will be a problem of low uniformity in the polishing of the wafer surface, which leads to poor wafer polishing quality. During the polishing process, when the wafer contacts the polishing table, the carrier and the adsorption member can apply pressure to the wafer toward the polishing table, thereby enabling the polishing table to polish the wafer.

[0070] In addition, the inventors of the present application also noticed that during the polishing process, the adsorption part adsorbs the wafer to enable the wafer to be polished. The adsorption part is easily damaged by factors such as mechanical polishing friction or chemical corrosion of the polishing liquid, and the adsorption part needs to be replaced frequently. However, since the operator needs to fix the adsorption part to the carrier, after replacing the adsorption part, during the polishing process, the pressure applied by the adsorption part and the carrier on the wafer is uneven, and there is still a problem of low uniformity in the polishing of the wafer surface, which leads to poor wafer polishing quality.

[0071] Figure 1 A schematic diagram of the three-dimensional structure of an assembly jig provided in some embodiments of the present application is shown; Figure 2 A schematic diagram of the exploded structure of an assembly jig provided in some embodiments of the present application is shown; Figure 3 A schematic cross-sectional structure diagram of an assembly jig provided in some embodiments of the present application is shown from one perspective; for ease of explanation, only the content related to the embodiments of the present application is shown.

[0072] Please refer to Figures 1 to 3 An embodiment of the present application provides an assembly jig 100 for assembling a carrier 200 and an adsorption member 300 . The adsorption member 300 is used to adsorb wafers. The assembly jig 100 includes a base 110 , a guide assembly 120 , and a moving member 130 .

[0073] The base 110 has a first side 111 and a second side 112 arranged opposite each other along a first direction F1. The first side 111 of the base 110 is used to support the carrier 200, and the side of the carrier 200 facing away from the base 110 is used to support the adsorbent 300. It is understood that the base 110 provides an assembly foundation and stable support for components such as the carrier 200 and the adsorbent 300. The base 110 can be made of polyvinyl chloride (PVC) or other materials, and can be configured according to actual circumstances. This embodiment of the present application does not impose specific limitations on this.

[0074] In an embodiment of the present application, the carrier 200 is a cylinder, and the size and dimensions of the adsorbent 300 match the shape and dimensions of the carrier 200. The adsorbent 300 may have a groove that matches the size of the wafer, and the bottom of the groove may be provided with a plurality of holes. The adsorbent 300 may utilize water tension to adsorb the wafer in order to reduce production costs. Of course, in other embodiments, the adsorbent 300 may also utilize vacuum adsorption to adsorb the wafer, and may be configured according to actual conditions, without specific limitation herein. In addition, in an embodiment of the present application, the size of the wafer adsorbed by the adsorbent 300 is 12 inches. In other embodiments, the size of the wafer may also be 8 inches or other sizes, without specific limitation herein.

[0075] The guide assembly 120 is disposed on a first side of the base 110. The guide assembly 120 includes a first guide member 121 and a second guide member 122. The movable member 130 includes a first movable portion 131 and a second movable portion 132. Specifically, the first movable portion 131 is movably connected to the first guide member 121 along a first direction F1, and the second movable portion 132 is movably connected to the second guide member 122 along the first direction F1.

[0076] It is understood that the guide assembly refers to a component that provides a guide for the movable member 130 to move more accurately along the first direction F1. The first movable portion 131 is movably connected to the first guide member 121 along the first direction F1, and the second movable portion 132 is movably connected to the second guide member 122 along the first direction F1, so that the positions of the first movable portion 131 and the second movable portion 132 can be changed more flexibly.

[0077] like Figure 1 As shown, in the embodiment of the present application, there are two first guide members 121 and two second guide members 122. Of course, in other embodiments, the number of the first guide members 121 and the second guide members 122 can also be three or other numbers, which is not specifically limited.

[0078] The guide assembly 120 can be made of stainless steel or other materials, depending on the actual situation. This embodiment of the present application does not impose any specific restrictions on this. The moving member 130 can be made of polyvinyl chloride (PVC) or other materials, depending on the actual situation. This embodiment of the present application does not impose any specific restrictions on this.

[0079] The moving member 130 has a first state in which the first moving portion 131 and the second moving portion 132 cooperate with each other, and a second state in which the first moving portion 131 and the second moving portion 132 are separated.

[0080] In the first state, the first movable part 131 has a first surface m1 disposed toward the second movable part 132, and the second movable part 132 has a second surface m2 disposed toward the first movable part 131. The first surface m1 and the second surface m2 together define an adjustment space for adjusting the position of the adsorbent 300. The first state includes a first sub-state in which, when the central axis L of the carrier 200 is in a preset position, the first surface m1 and the second surface m2 are both in contact with the adsorbent 300 so that the central axis L of the adsorbent 300 coincides with the central axis L of the carrier 200. In the first sub-state, the first movable part 131 is in the first position and the second movable part 132 is in the second position. In the second state, the first movable part 131 in the first position or the second movable part 132 in the second position is used as a reference for assembling the adsorbent 300 to the carrier 200.

[0081] It is understood that the first movable portion 131 and the second movable portion 132 can be adapted to engage with each other and to separate from each other by abutting against each other. The first movable portion 131 and the second movable portion 132 can also be adapted to engage with each other and to separate from each other by a detachable connection such as a snap connection or a bolt connection. The specific method can be set according to actual circumstances and is not specifically limited in the present embodiment.

[0082] The central axis L of the carrier 200 is in a preset position. It can be understood that the central axis L of the carrier 200 is in a preset position. The preset position can be a position where the central axis L of the carrier 200 coincides with the central axis L of the base 110, or a position where the central axis L of the carrier 200 does not coincide with the central axis L of the base 110. As long as the central axis L of the carrier 200 is in the preset position, the central axis L of the adsorption component 300 can coincide with the central axis L of the carrier 200.

[0083] It should be noted that the first sub-state is that in the first state, when the central axis L of the carrier 200 is in a preset position, the first movable part 131 and the second movable part 132 are moved so that the first movable part 131 is in the first position and the second movable part 132 is in the second position, and the first surface m1 and the second surface m2 are both in contact with the adsorption part 300, so that the central axis L of the adsorption part 300 coincides with the central axis L of the carrier 200.

[0084] Figure 4 FIG. 1 shows a schematic cross-sectional structure diagram of an assembly jig provided in some embodiments of the present application in a certain state, such as Figure 4, which illustrates a first sub-state in which the first surface m1 of the first moving portion 131 and the second surface m2 of the second moving portion 132 are in contact with the adsorption member 300 so that the central axis L of the adsorption member 300 coincides with the center of the carrier 200 .

[0085] When the moving member is in the second state, the first moving portion 131 in the first position or the second moving portion 132 can serve as a reference for assembling the suction member 300 to the carrier 200 .

[0086] It is understood that the second state is when the first movable portion 131 and the second movable portion 132 are separated from each other. There are three possible situations: 1. The first movable portion 131 and the second movable portion 132 are separated from each other by a certain distance; 2. The first movable portion 131 is removed from the first guide member 121 and the second movable portion 132 is in the second position on the second guide member 122; 3. The second movable portion 132 is removed from the second guide member 122 and the first movable portion 131 is in the first position on the first guide member 121.

[0087] In the first state, the adsorption member 300 is placed on the carrier 200 , and the side of the adsorption member 300 close to the carrier 200 has adhesive and adhesive film. At this time, the adsorption member 300 has not yet been fixed to the carrier 200 .

[0088] When the first movable portion 131 is in the first position and serves as a reference for assembling the adsorbent 300 onto the carrier 200, the first movable portion 131 is stationary relative to the first guide 121, and the second movable portion 132 is separated from the first movable portion 131. That is, the second movable portion 132 can move a certain distance on the second guide 122 along the first direction F1 away from the base 110. The second movable portion 132 can also be removed from the second guide 122 by an operator. The specific configuration can be based on actual conditions. Afterwards, for example, the adsorbent 300 can be lifted from the carrier 200 by an operator, who tears off the adhesive film on the side of the adsorbent 300 facing the carrier 200 and affixes the adsorbent 300 to the carrier 200. Specifically, the adsorption member 300 with the adhesive film torn off can move toward the carrier 200 along the first surface m1 of the first moving part 131 until the adsorption member 300 is attached to the carrier 200. At this time, the central axis L of the adsorption member 300 coincides with the central axis L of the carrier 200.

[0089] When the second movable portion 132 is in the second position and serves as a reference for assembling the adsorbent 300 onto the carrier 200, the second movable portion 132 is stationary relative to the second guide 122, and the first movable portion 131 is separated from the second movable portion 132. That is, the first movable portion 131 can move a certain distance on the first guide 121 along the first direction F1 away from the base 110. The first movable portion 131 can also be removed from the first guide 121 by an operator, and the specific configuration can be based on actual conditions. For example, the adsorbent 300 can then be lifted from the carrier 200 by an operator, who can tear off the adhesive film on the side of the adsorbent 300 facing the carrier 200 and affix the adsorbent 300 to the carrier 200. Specifically, the side of the adsorption component 300 with the adhesive film torn off, close to the first surface m1, can move toward the carrier 200 along the direction of extension of the first surface m2 of the second movable part 132 until the adsorption component 300 is adhered to the carrier 200. At this time, the central axis L of the adsorption component 300 coincides with the central axis L of the carrier 200.

[0090] For example, after the suction member 300 is fixed to the carrier 200, the side of the carrier 200 facing away from the suction member 300 is mounted on the polishing processing equipment. It should be noted that the central axis of the carrier 200 also coincides with the central axis of the component connected to the carrier 200. Afterwards, the operator or the control device can control the equipment for carrying the wafer to carry the wafer below the carrier 200 and the suction member 300. It should be understood that the equipment for carrying the wafer can carry the wafer to a preset position so that the central axis of the wafer coincides with the central axis of the carrier 200 and the component connected to the carrier 200. Then, the processing equipment controls the carrier 200 and the adsorbent 300 to move toward the direction close to the wafer. At the same time, the processing equipment can use some tools to brush water onto the adsorbent 300. When the adsorbent 300 approaches and contacts the wafer, the adsorbent 300 can use the pressure exerted on the wafer and the tension of the water to adsorb the wafer on the adsorbent 300. At this time, the central axis L of the carrier 200, the central axis L of the adsorbent 300, and the central axis L of the wafer coincide with each other. Subsequently, the processing equipment drives the carrier 200, the adsorbent 300 and the wafer to move above the polishing table. The processing equipment controls the carrier 200, the adsorbent 300 and the wafer to move toward the polishing table. When the wafer contacts the polishing table and the carrier 200 can exert pressure on the wafer, the polishing table starts to rotate to polish the wafer. At the same time, the carrier 200 can also drive the adsorbent 300 and the wafer to rotate. In this way, the polishing of the wafer can be made more uniform, thereby improving the polishing effect of the wafer. Of course, when the polishing table rotates to polish the wafer, the carrier 200 may not rotate.

[0091] Thus, by providing the base 110, the guide assembly 120, and the movable member 130, in the first state, when the central axis L of the carrier 200 is in a preset position, the first surface m1 of the first movable portion 131 and the second surface m2 of the second movable portion 132 can abut against the adsorption member 300, thereby causing the central axis L of the adsorption member 300 to coincide with the central axis L of the carrier 200, thereby improving the concentricity between the adsorption member 300 and the carrier 200, which is beneficial to improving the polishing quality of subsequent wafers and improving the uniformity of wafer polishing. In the second state, the first movable portion 131 in the first position or the second movable portion 132 in the second position can serve as a reference for assembling the adsorption member 300 to the carrier 200, so that the operator can have a more reliable basis when fixing the adsorption member 300 to the carrier 200, thereby reducing errors caused by human factors. At the same time, the guide assembly 120 is arranged on the first side 111 of the base 110, the first guide member 121 cooperates with the first moving part 131, and the second guide member 122 cooperates with the second moving part 132, so that the movement of the moving member 130 is more stable and smooth, reducing the shaking and deviation during the movement, thereby indirectly improving the accuracy and reliability of the entire assembly process.

[0092] In addition, in some embodiments, the inventors found that when the wafer is adsorbed by vacuum adsorption, it is difficult to ensure that the vacuum degree of the entire surface of the wafer is uniform during the vacuum adsorption process, and uneven adsorption force is likely to occur, which may cause the wafer to deform during the processing process. In addition, the use of vacuum adsorption requires the opening of additional vacuum channels, which increases production costs. And when the wafer size is large, the risk of wafer deformation is more prominent. Subsequently, the inventors found that the tension of water can be used to adsorb the wafer, which can reduce production costs. Water has fluidity, which can make every part of the wafer able to be adsorbed, reducing the risk of wafer deformation during processing. Due to the fluidity of water, the adsorption force of water is relatively small. During the polishing process, the wafer and the adsorption member may move relative to each other, affecting the polishing quality of the wafer.

[0093] Based on this, the inventors of the present application have found through in-depth research that, under the premise of not affecting the process of wafer polishing, an assembly jig is designed so that the central axis of the adsorbent coincides with the central axis of the carrier, and a groove that matches the size of the wafer is provided on the adsorbent. When the central axis of the adsorbent coincides with the central axis of the carrier, when the adsorbent is used to adsorb the wafer, the wafer can be adsorbed in the groove that matches the size of the wafer, and the central axis of the adsorbent can also coincide with the central axis of the wafer, which can improve the situation where the wafer deviates from the adsorbent, improve the concentricity of the adsorbent and the carrier, and use water for adsorption can also reduce the production cost of wafer regeneration, and can also facilitate the adsorption of the wafer by the adsorbent during the subsequent polishing process. At the same time, during the polishing process, when the wafer contacts the polishing table, the carrier and the adsorbent can apply more uniform pressure to the wafer toward the polishing table, which can also improve the stability of the wafer polishing, reduce the risk of the wafer moving relative to the adsorbent, and improve the quality of the wafer polishing.

[0094] In some embodiments, please refer to Figure 1 and Figure 3 In the first sub-state, both the first surface m1 and the second surface m2 are in contact with the adsorption component 300 .

[0095] In which, in the first sub-state, the first surface m1 abuts against the adsorption part 300 in a first manner, the first manner including point abutment, line abutment or surface abutment; and / or, in the first sub-state, the second surface m2 abuts against the adsorption part 300 in a second manner, the second manner including point abutment, line abutment or surface abutment.

[0096] Specifically, the first surface m1 abuts against the adsorbent 300 in a point-contact manner, that is, a point on the first surface m1 abuts against a point on the adsorbent 300, so that the central axis L of the carrier 200 coincides with the central axis L of the adsorbent 300. The first surface m1 abuts against the adsorbent 300 in a line-contact manner, that is, a line or an edge of the first surface m1 abuts against the corresponding adsorbent 300, so that the central axis L of the carrier 200 coincides with the central axis L of the adsorbent 300. The first surface m1 abuts against the adsorbent 300 in a surface-contact manner, that is, a portion of the plane or the entire plane on the first surface m1 abuts against the adsorbent 300, so that the central axis L of the carrier 200 coincides with the central axis L of the adsorbent 300. At the same time, the abutment manner of the second surface m2 against the adsorbent 300 is similar to the aforementioned case where the first surface m1 abuts against the adsorbent 300 in the first manner, and will not be repeated here.

[0097] In this way, in the first sub-state, the first surface m1 is abutted against the adsorption part 300 in a first manner, and the second surface m2 is abutted against the adsorption part 300 in a second manner, which can provide more flexibility and adaptability for the use of the assembly jig 100 in different situations, so as to better realize the assembly of the adsorption part 300 on the carrier 200 and improve the concentricity of the adsorption part 300 and the carrier 200.

[0098] In some embodiments, please refer to Figure 3 In the first state, the first surface m1 and the second surface m2 constitute a combined surface, and the extension direction of the central axis L of the combined surface and the first direction F1 are parallel to each other.

[0099] In the first sub-state, the first surface m1 is in linear contact with the adsorption member 300 , the second surface m2 is in linear contact with the adsorption member 300 , and the central axis L of the combined surface, the central axis L of the adsorption member 300 and the central axis L of the carrier 200 coincide with each other.

[0100] It is understood that in the first state, the first moving portion 131 and the second moving portion 132 cooperate to form a single, integrated plane with the first surface m1 and the second surface m2. The first surface m1 is brought into line contact with the adsorbent 300, and the second surface m2 is brought into line contact with the adsorbent 300. That is, the first surface m1 and the second surface m2 are brought into line contact with the adsorbent 300, respectively, thereby positioning and adjusting the adsorbent 300.

[0101] In this way, by linearly contacting the first surface m1 with the adsorption component 300, and linearly contacting the second surface m2 with the adsorption component 300, the posture of the adsorption component 300 can be adjusted more stably and reliably. At the same time, the central axis L of the combined surface is set to be parallel to the first direction F1, so that during the assembly process, the relative position relationship of the various components of the entire assembly jig 100 is more stable. When the operator moves the moving part 130 to adjust the posture of the adsorption component 300, the operation can be completed more steadily and smoothly, reducing the shaking and instability caused by changes in direction or inconsistencies, and helping to more stably assemble the adsorption component 300 to the carrier 200, thereby improving the stability and reliability of the assembly process.

[0102] In some embodiments, please refer to Figure 3 The cross-sectional area of ​​the combined surface decreases along the direction from the second side 112 to the first side 111, and the minimum dimension of the cross-sectional area of ​​the combined surface decreases along the direction perpendicular to the first direction F1. The cross-sectional area of ​​the combined surface is perpendicular to the first direction F1.

[0103] Specifically, the interface area of ​​the combined surface gradually decreases in the direction from the second side 112 of the base 110 to the first side 111. It should be noted that the cross-sectional area of ​​the combined surface near the base 110 can be larger than the area of ​​the carrier 200 and the area of ​​the adsorbent 300, while the cross-sectional area of ​​the combined surface away from the base 110 can be smaller than the area of ​​the carrier 200 and the area of ​​the adsorbent 300, so as to better define the adjustment space for adjusting the position of the adsorbent 300.

[0104] In addition, since the cross-sectional area of ​​the combined surface tends to decrease along the direction from the second side 112 to the first side 111, the entire assembly jig 100 can be applied to adsorption parts 300, carriers 200 and wafers of different sizes, thereby improving the versatility of the assembly jig 100.

[0105] In this way, by setting the cross-sectional area of ​​the combined surface in a decreasing trend along the direction from the second side 112 to the first side 111, it is helpful to more accurately constrain and guide the adsorption component 300 during the assembly process, so that the adsorption component 300 can more accurately adjust its own position and posture according to the change in the cross-sectional size area of ​​the combined surface, thereby making the central axis L of the adsorption component 300 coincide with the central axis L of the carrier 200.

[0106] In some embodiments, please refer to Figure 3 and Figure 4 , define the surface parallel to the first direction F1 and where the central axis L of the combined surface is located as the reference surface.

[0107] The intersection line of the reference surface and the combined surface is the first intersection line X1 and the second intersection line X2. The first intersection line X1 and the second intersection line X2 are symmetrically arranged about the central axis L of the combined surface. The first intersection line X1 and the second intersection line X2 are close to each other at one end away from the base 110, and the first intersection line X1 and the second intersection line X2 are extended away from each other at one end close to the base 110.

[0108] It should be noted that if Figure 3 and Figure 4 As shown, Figure 3 and Figure 4 The cross-sectional structure of the assembly jig 100 is shown with the reference plane as the cross-sectional view, and the intersection lines of the reference plane and the combination plane are shown as the first intersection line X1 and the second intersection line X2.

[0109] Specifically, the first intersection line X1 and the second intersection line X2 can be symmetrically arranged about the central axis L of the combined surface. It can be understood that with the central axis L of the combined surface as the symmetry axis, the first intersection line X1 and the second intersection line X2 present a symmetrical shape.

[0110] The first intersection line X1 and the second intersection line X2 can be extended close to each other at the ends away from the base 110, and can be extended away from each other at the ends of the first intersection line X1 and the second intersection line X2 close to the base 110. When the adsorbent 300 is placed on the carrier 200 and the central axis L of the adsorbent 300 does not coincide with the central axis L of the carrier 200, the first intersection line X1 and the second intersection line X2 can provide guidance for the movement and position adjustment of the adsorbent 300 so that the central axis L of the adsorbent 300 coincides with the central axis L of the carrier 200.

[0111] In this way, symmetrically arranging the first intersection line X1 and the second intersection line X2 about the central axis L of the combined surface can provide symmetrical positioning guidance for the adsorption component 300. When adjusting the position and posture of the adsorption component, the operator can more intuitively judge whether the central axis L of the adsorption component 300 coincides with the central axis L of the carrier 200. At the same time, extending the first intersection line X1 and the second intersection line X2 so that they are close to each other away from the end of the base 110 and away from each other near the end of the base 110 can better enable the adsorption component 300 to move on the carrier 200, making it easier for the operator to assemble the adsorption component 300 to the carrier 200 more smoothly, reducing the error of manual adjustment, improving the concentricity of the adsorption component 300 and the carrier 200, and also improving the convenience and efficiency of the assembly operation.

[0112] Of course, in other embodiments, the first intersection line X1 and the second intersection line X2 may also be asymmetrically arranged with respect to the central axis L of the combined surface. This arrangement may be made according to actual conditions and is not specifically limited herein.

[0113] In some embodiments, please refer to Figure 3 and Figure 4 , the first intersection line X1 and the second intersection line X2 are both straight lines.

[0114] Specifically, if Figure 4 As shown, the first intersection line X1 and the second intersection line X2 are both straight lines. It is understandable that the first intersection line X1 and the second intersection line X2 do not have complex morphological changes such as bends and turns. The first intersection line X1 and the second intersection line X2 show a linear direction within the spatial range where the reference surface and the combined surface intersect.

[0115] In this way, by setting the first intersection line X1 and the second intersection line X2 as straight lines, during the process of assembling the carrier 200 and the adsorption part 300, since the first intersection line X1 and the second intersection line X2 are straight lines, the first surface m1 and the second surface m2 can be better abutted against the adsorption part 300. At the same time, setting the first intersection line X1 and the second intersection line X2 as straight lines can also make the movement of the first movable part 131 and the second movable part 132 smoother. When the size of the adsorption part 300 changes, each part of the first surface m1 and the second surface m2 can adapt to adsorption parts 300 of different sizes, so that the center of the adsorption part 300 coincides with the center of the carrier 200.

[0116] In some embodiments, please refer to Figure 1 and Figure 3 The adjustment space K is also used to adjust the posture of the carrier 200.

[0117] The first state further includes a second sub-state in which both the first surface m1 and the second surface m2 abut against the carrier 200 so that the central axis L of the carrier 200 is at a preset position.

[0118] Specifically, before the carrier 200 carries the adsorption member 300, when the carrier 200 is placed on the first side 111 of the base 110, the adjustment space K defined by the first surface m1 and the second surface m2 can also be used to adjust the position of the carrier 200. The first movable portion 131 and the second movable portion 132 are moved so that both the first surface m1 and the second surface m2 abut against the carrier 200, similar to the aforementioned situation where both the first surface m1 and the second surface m2 abut against the adsorption member 300, and will not be further elaborated here.

[0119] It should be noted that the second sub-state is a state before the first sub-state in the first state. In the second sub-state, the first moving portion 131 and the second moving portion 132 are moved so that the first surface m1 and the second surface m2 are both in contact with the carrier 200, thereby placing the central axis L of the carrier 200 in a preset position. The preset position may be such that the central axis L of the carrier 200, the central axis L of the combination surface, and the central axis L of the base 110 coincide with each other, or the central axis L of the carrier 200 coincides with the central axis L of the combination surface but does not coincide with the central axis L of the base 110. As long as, during the subsequent assembly of the adsorbent 300 on the carrier 200, the first surface m1 and the second surface m2 are both in contact with the adsorbent 300, so that the central axis L of the adsorbent 300 is aligned with the central axis L of the carrier 200, no specific limitation is imposed herein.

[0120] By moving the first moving part 131 and the second moving part 132, the first surface m1 and the second surface m2 are both abutted against the carrier 200, so that the central axis L of the carrier 200 is adjusted to a preset position. In this way, the adjustment space K can not only adjust the posture of the adsorption component 300, but also be used to adjust the posture of the carrier 200. In the second sub-state of the first state, the first surface m1 and the second surface m2 are both abutted against the carrier 200 so that the central axis of the carrier 200 is in a preset position. The adjustment space K can be used to adjust the posture of the carrier 200 more flexibly, which can effectively solve the problems that may be encountered such as the initial position deviation of the carrier or the poor cooperation between the adsorption component and the carrier, making the assembly process smoother. When the adsorption component 300 is subsequently assembled to the carrier 200, based on the position of the carrier 200, it is easier to achieve the coincidence of the central axes of the adsorption component 300 and the carrier 200, thereby improving the accuracy of the entire assembly process. Furthermore, the adjustment space K allows for simultaneous adjustments to the position of both the carrier and the suction element, allowing the assembly jig 100 to better accommodate carriers 200 and suction elements 300 of varying sizes and shapes. By adaptively adjusting the position of carriers 200 of varying sizes and shapes through the adjustment space K, more accurate assembly with the suction element 300 can be achieved in all situations, improving the assembly jig's versatility and applicability while reducing the cost of jig replacement due to changes in product specifications.

[0121] In some embodiments, please refer to Figure 1 and Figure 2 The assembly jig 100 further includes a plurality of first adjustment members T1 , which are movably connected to the base 110 along a direction perpendicular to the first direction F1 .

[0122] Specifically, the plurality of first adjustment members T1 are used to secure the carrier 200 when the central axis L of the carrier 200 is at a predetermined position. It is understood that when the central axis L of the carrier 200 is at the predetermined position, the first adjustment members T1 move on the base 110 in a direction perpendicular to the first direction F1 to secure the carrier 200.

[0123] It should be noted that in the embodiment of the present application, the number of first adjustment parts T1 is 4. Of course, in other embodiments, the number of first adjustment parts T1 can also be 5, 6, etc., which can be set according to actual conditions and is not specifically limited here.

[0124] Thus, by providing a plurality of first adjustment members T1 for fixing the carrier 200 when the central axis L of the carrier 200 is at a preset position, the carrier 200 can be fixed more stably, unnecessary shaking of the carrier 200 can be reduced, and subsequent operations can be facilitated.

[0125] In some embodiments, please refer to Figure 1 and Figure 2 The assembly jig 100 further includes a plurality of second adjustment members T2 , which are movably connected to the base 110 along a direction perpendicular to the first direction F1 .

[0126] Specifically, the plurality of second adjustment members T2 are used to define a fixed space G for securing the carrier 200, so that the central axis L of the carrier 200 is located at a predetermined position. It will be appreciated that the plurality of second adjustment members T2 move along a direction perpendicular to the first direction F1 on the first side 111 of the base 110, enclosing and defining the fixed space G. The carrier 200 is placed within the fixed space G, thereby maintaining the central axis L of the carrier 200 at the predetermined position.

[0127] It should be noted that in the embodiment of the present application, the number of second adjustment parts T2 is 4. Of course, in other embodiments, the number of second adjustment parts T2 can also be 5, 6, etc., which can be set according to actual conditions and is not specifically limited here.

[0128] In this way, by setting up multiple second adjustment parts T2 to define a fixed space G for fixing the carrier 200, the center axis L of the carrier 200 can be placed at a preset position on the base 110, and the carrier 200 can be better fixed, reducing unnecessary shaking of the carrier 200, which helps to improve the accuracy and reliability of the entire assembly process.

[0129] In some embodiments, please refer to Figure 1 and Figure 2 The base 110 is provided with a plurality of guide grooves c corresponding to the plurality of second adjustment members T2 , and the second adjustment member T2 is movably connected to the base 110 along a direction perpendicular to the first direction F1 by means of the corresponding guide grooves c.

[0130] Specifically, the base 110 is provided with an identification portion (not shown in the figure) located on the target side of the guide groove c. The target side of the guide groove c is at least one side of the two sides of the guide groove c along the preset direction. The preset direction, the first direction F1 and the extension direction of the guide groove c are perpendicular to each other.

[0131] An identification portion is provided on the target side of the guide groove c, and the positions of the second adjustment members T2 on the base 110 can be moved according to the identification portion, so that the central axis L of the carrier 200 is more conveniently located at a preset position on the base 110 .

[0132] It should be noted that the identification portion can be a scale line, or a raised structure or a recessed structure arranged at intervals, and can be set according to actual conditions. The embodiments of the present application do not impose specific restrictions on this.

[0133] The target side of the guide groove c is set to at least one side of the two sides of the guide groove c along the preset direction, that is, the target side of the guide groove c can be one side of the two sides of the guide groove along the preset direction, or can be both sides of the guide groove along the preset direction. It can be set according to actual conditions and is not specifically limited here.

[0134] In this way, by providing an identification portion located on the target side of the guide groove c on the base 110, the movement of multiple second adjustment parts T2 is made more direct and convenient, thereby enabling the carrier 200 to be more accurately fixed in a suitable position, and the center axis L of the carrier 200 to be more accurately in a preset position, thereby effectively improving the assembly accuracy of the entire assembly jig 100.

[0135] In some embodiments, please refer to Figure 1 and Figure 2 The assembly jig 100 further includes a first fixing member 140, which is movably connected to the first guide member 121 along the first direction F1, and the first fixing member 140 is located between the first movable portion 131 and the base 110, and the first fixing member 140 is configured to maintain the first movable portion 131 in the first position; and / or, the assembly jig 100 further includes a second fixing member 150, which is movably connected to the second guide member 122 along the first direction F1, and the second fixing member 150 is located between the second movable portion 132 and the base 110, and the second fixing member 150 is configured to maintain the second movable portion 132 in the second position.

[0136] Specifically, when the first movable portion 131 is in the first position and the second movable portion 132 is separated from the first movable portion 131, the first fixing member 140 can be used to maintain the first movable portion 131 in the first position, so that after the adhesive backing of the adsorbent 300 is subsequently removed, the adsorbent 300 can be attached to the carrier 200 along the first surface m1, and the central axis L of the adsorbent 300 coincides with the central axis L of the carrier 200. When the second movable portion 132 is in the second position and the first movable portion 131 is separated from the second movable portion 132, the second fixing member 150 can be used to maintain the second movable portion 132 in the second position, so that after the adhesive backing of the adsorbent 300 is subsequently removed, the adsorbent 300 can be attached to the carrier 200 along the second surface m2, and the central axis L of the adsorbent 300 coincides with the central axis L of the carrier 200.

[0137] It should be noted that the first fixing member 140 can fix the first movable part 131 in the first position by being bolted to the first guide member 121; or a matching slot and pin structure can be provided on the first fixing member 140 and the first guide member 121. When the first movable part 131 is in the first position, the pin is inserted into the slot so that the first fixing member and the first guide member 121 are mutually locked, thereby limiting the movement of the first movable part 131. The first movable part 131 can also be maintained in the first position by other means, and the embodiments of the present application do not impose specific restrictions on this. In addition, the thickness of the first fixing member 140 along the first direction F1 is less than the thickness of the supporting member 200 along the first direction F1, so that the first surface m1 can better abut against the adsorption member 300 and the supporting member 200. The second fixing member 150 is similar to the first fixing member 140 mentioned above and will not be described in detail here.

[0138] In this way, by setting the first fixing member 140, the first fixing member 140 can be movably connected to the first guide member 121 along the first direction F1, and the first fixing member 140 is located between the first movable part 131 and the base 110. When the first movable part 131 is in the first position and the second movable part 132 is separated from the first movable part 131, the first fixing member 140 can more stably maintain the first movable part 131 in the first position, so that the operator can better fix the adsorption member 300 to the carrier 200, improve the concentricity of the adsorption member 300 and the carrier 200, and thus enable the wafer to be polished more evenly during the polishing process, thereby improving the polishing quality. By setting up the second fixing member 150, the second fixing member 150 can be movably connected to the second guide member 122 along the first direction F1, and the second fixing member 150 is located between the second movable part 132 and the base 110. When the second movable part 132 is in the second position and the first movable part 131 is separated from the second movable part 132, the second fixing member 150 can more stably maintain the second movable part 132 in the second position, so that the operator can better fix the adsorption member 300 to the carrier 200, improve the concentricity of the adsorption member 300 and the carrier 200, and thus enable the wafer to be polished more evenly during the polishing process, thereby improving the polishing quality.

[0139] Figure 5 A flow chart of an assembly method of an assembly jig provided in one embodiment of the present application is shown; for ease of explanation, only the content related to the embodiment of the present application is shown.

[0140] Based on the same invention concept, please refer to Figure 5 The present invention provides an assembly method for assembling a carrier 200 and an adsorption member 300 using an assembly jig 100 as described in any of the above embodiments. The assembly method includes the following steps:

[0141] Step S110: placing the carrier 200 on the first side 111 of the base 110 so that the central axis L of the carrier 200 is at a predetermined position;

[0142] Step S120: Place the adsorption member 300 on a side of the carrier 200 facing away from the base 110, and control the movable member 130 in the first state to move toward the base 110 along the first direction F1, so that the movable member 130 is in the first sub-state and the central axis L of the adsorption member 300 coincides with the central axis L of the carrier 200.

[0143] Step S130 , controlling the movable member 130 to be in the second state, and fixing the adsorption member 300 on the carrier 200 based on the first movable portion 131 being in the first position or the second movable portion 132 being in the second position.

[0144] In step S110, the operator or the picking device may place the carrier 200 on the first side 111 of the base 110 so that the central axis L of the carrier 200 is at a preset position. It should be noted that when the movable member 130 is not initially located on the guide assembly 120, the operator or the picking device may place the carrier 200 on the first side of the base 110 along the first direction F toward the base 110; when the movable member 130 is initially located on the guide assembly 120, the movable member 130 may be moved to an end of the guide assembly 120 away from the base 110, and the operator or the picking device may place the carrier 200 on the first side 111 of the base 110 from the side of the movable member 130 close to the base 110 and in a direction perpendicular to the first direction F1.

[0145] In step S120, the operator or the picking device places the adsorption member 300 on the side of the carrier 200 away from the base 110, and controls the first movable part 131 and the second movable part 132 to move toward the base 110 along the first direction F1, so that the first surface m1 of the first movable part 131 and the second surface m2 of the second movable part 132 are both in contact with the adsorption member 300, and the central axis L of the adsorption member 300 coincides with the central axis L of the carrier 200. It should be noted that when the movable part 130 is not located on the guide assembly 120, the operator or the picking device can place the adsorption part 300 on the side of the supporting part 200 facing away from the base 110 along the first direction F toward the base 110; when the movable part 130 is located on the guide assembly 120, the movable part 130 can be moved to the end of the guide assembly 120 away from the base 110, and the operator or the picking device can place the adsorption part 300 on the side of the supporting part 200 facing away from the base 110 from the side of the movable part 130 close to the base 110 and along a direction perpendicular to the first direction F1.

[0146] In step S130, the operator or the picking device controls the movable member 130 to be in the second state, that is, the state in which the first movable portion 131 and the second movable portion 132 are separated from each other. Based on the first movable portion 131 being in the first position and the second movable portion 132 being separated from the first movable portion 131, the operator or the picking device picks up the adsorbent 300 from the carrier 200, removes the adhesive backing of the adsorbent 300, and then moves the adsorbent 300 toward the carrier 200 along the direction in which the first surface m1 extends, thereby adhering and fixing the adsorbent 300 to the carrier 200; or, based on the second movable portion 132 being in the second position and the first movable portion 131 being separated from the second movable portion 132, the operator or the picking device picks up the adsorbent 300 from the carrier 200, removes the adhesive backing of the adsorbent 300, and then moves the adsorbent 300 toward the carrier 200 along the direction in which the second surface m2 extends, thereby adhering and fixing the adsorbent 300 to the carrier 200.

[0147] In this way, through these steps, the central axis L of the adsorption part 300 can be made to coincide with the central axis L of the carrier 200, thereby improving the concentricity between the adsorption part 300 and the carrier 200, thereby making the wafer more evenly polished during the subsequent wafer polishing process and improving the polishing quality of the wafer.

[0148] Figure 6 A flow chart of an assembly method of an assembly jig provided in some other embodiments of the present application is shown; for ease of explanation, only the content related to the embodiments of the present application is shown.

[0149] In some embodiments, please refer to Figure 6 , placing the carrier 200 on the first side 111 of the base 110 so that the central axis L of the carrier 200 is at a predetermined position, including the following steps:

[0150] Step S111, place the carrier 200 on the first side 111 of the base 110, and control the movable member 130 in the first state to move toward the base 110 along the first direction F1, so that the movable member 130 is in the second sub-state; in the second sub-state, the first surface m1 and the second surface m2 are both in contact with the carrier 200, and the central axis L of the carrier 200 is in a preset position.

[0151] In step S111, the operator or the picking device places the carrier 200 on the first side 111 of the base 110, and controls the first movable part 131 and the second movable part 132 to move toward the base 110 along the first direction F1, so that the first surface m1 and the second surface m2 are both in contact with the carrier 200, and the central axis L of the carrier 200 is in a preset position.

[0152] It should be noted that the control of the first moving part 131 and the second moving part 132 to move along the first direction F1 toward the base 110 may be as follows: 1. First, the first moving part 131 is controlled to move along the first direction F1 toward the base 110 so that the first surface m1 abuts against the carrier 200, and then the second moving part 132 is controlled to move along the first direction F1 toward the base 110 so that the second surface m2 abuts against the carrier 200. Finally, the first moving part 131 and the second moving part are in a relatively stationary position; 2. First, the second moving part 132 is controlled to move along the first direction F1 toward the base 110 so that the second surface m2 abuts against the carrier 200. Move toward the base 110 so that the second surface m2 abuts against the carrier 200, and then control the first moving part 131 to move toward the base 110 along the first direction F1 so that the first surface m1 abuts against the carrier 200. Finally, the first moving part 131 and the second moving part are in a relatively stationary position; third, the first moving part 131 and the second moving part 132 move together along the first direction F1 toward the base 110 so that the first surface m1 and the second surface m2 both abut against the carrier 200. Finally, the first moving part 131 and the second moving part are in a relatively stationary position.

[0153] In this way, through these steps, problems such as the initial position deviation of the carrier 200 or the poor fit between the adsorption component and the carrier can be effectively solved, so that in the subsequent process of assembling the adsorption component 300 to the carrier 200, based on the position of the carrier 200, it is easier to achieve the overlap of the central axis of the adsorption component 300 and the carrier 200, thereby improving the accuracy of the entire assembly process.

[0154] Figure 7 A flow chart of an assembly method of an assembly jig provided by some other embodiments of the present application is shown; for ease of explanation, only the content related to the embodiments of the present application is shown.

[0155] In some embodiments, please refer to Figure 7 , placing the carrier 200 on the first side 111 of the base 110 so that the central axis L of the carrier 200 is at a predetermined position, including the following steps:

[0156] Step S112 , fixing the carrier 200 by a plurality of first adjustment members T1 so that the central axis L of the carrier 200 is at a preset position; the first adjustment members T1 are movably connected to the base 110 along a direction perpendicular to the first direction F1 .

[0157] In step S112, a plurality of first adjustment members T1 are provided, which can move along a direction perpendicular to the first direction F1 on the base 110. The plurality of first adjustment members T1 are provided to fix the carrier 200 so that the central axis L of the carrier 200 is at a predetermined position.

[0158] It should be noted that the following situations may be included: 1. The carrier 200 is placed on the first side 111 of the base 110, and then the carrier 200 is fixed by moving multiple first adjustment parts T1 so that the central axis L of the carrier 200 is in a preset position; 2. The multiple first adjustment parts T1 can be first moved on the base 110 in a direction perpendicular to the first direction F1, and the multiple first adjustment parts T1 enclose and define a space in which the central axis L of the carrier 200 can be placed in a preset position, and then the carrier 200 is placed on the first side 111 of the base 110, and the multiple first adjustment parts T1 fix the carrier 200 so that the central axis L of the carrier 200 can be in the preset position.

[0159] In addition, multiple second adjustment members T2 may be provided. The second adjustment members T2 move on the base 110 in a direction perpendicular to the first direction F1. The multiple second adjustment members T2 can define a fixed space G for fixing the carrier 200, so that the center of the carrier 200 is at a predetermined position. The base 110 may also be provided with multiple guide slots c corresponding to the multiple second adjustment members T2. The second adjustment members T2 are movably connected to the base 110 in a direction perpendicular to the first direction F1 by means of the corresponding guide slots c.

[0160] In this way, through these steps, the central axis L of the carrier 200 can be placed at a preset position on the base 110, and the carrier 200 can be better fixed, reducing unnecessary shaking of the carrier 200, which helps to improve the accuracy and reliability of the entire assembly process.

[0161] The technical features of the above-mentioned embodiments can be combined arbitrarily. In order to make the description concise, not all possible combinations of the technical features in the above-mentioned embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0162] The above-described embodiments merely represent several implementation methods of the present application. While the descriptions are relatively specific and detailed, they should not be construed as limiting the scope of the patent application. It should be noted that a person of ordinary skill in the art may make various modifications and improvements without departing from the spirit of the present application, and these modifications and improvements fall within the scope of protection of the present application. Therefore, the scope of protection of the present patent application shall be determined by the appended claims.

Claims

1. An assembly jig for assembling a carrier and an adsorption member, wherein the adsorption member is used to adsorb wafers, characterized in that: The assembly jig comprises: A base having a first side and a second side arranged opposite to each other along a first direction; the first side of the base is used to support the supporting member, and a side of the supporting member facing away from the base is used to support the adsorption member; a guide assembly disposed on the first side of the base; the guide assembly comprises a first guide member and a second guide member; and The moving member includes a first moving portion and a second moving portion, wherein the first moving portion is movably connected to the first guide member along the first direction, and the second moving portion is movably connected to the second guide member along the first direction; The moving member has a first state in which the first moving part and the second moving part cooperate with each other, and a second state in which the first moving part and the second moving part are separated. In the first state, the first movable portion has a first surface arranged toward the second movable portion, and the second movable portion has a second surface arranged toward the first movable portion, and the first surface and the second surface jointly define an adjustment space for adjusting the position of the adsorption member; the first state includes a first sub-state in which, when the central axis of the supporting member is at a preset position, the first surface and the second surface are both in contact with the adsorption member so that the central axis of the adsorption member coincides with the central axis of the supporting member; in the first sub-state, the first movable portion is in a first position, and the second movable portion is in a second position; In the second state, the first moving portion in the first position or the second moving portion in the second position is used as a reference for assembling the adsorption component to the carrier.

2. The assembly jig according to claim 1, characterized in that: In the first sub-state, both the first surface and the second surface abut against the adsorption member; Wherein, in the first sub-state, the first surface abuts against the adsorption component in a first manner, wherein the first manner includes point abutment, line abutment or surface abutment; and / or In the first sub-state, the second surface abuts against the adsorption component in a second manner, where the second manner includes point abutment, line abutment, or surface abutment.

3. The assembly jig according to claim 2, characterized in that: In the first state, the first surface and the second surface form a combined surface, and the extension direction of the central axis of the combined surface and the first direction are parallel to each other; In the first sub-state, the first surface is in linear contact with the adsorption member, the second surface is in linear contact with the adsorption member, and the central axes of the combined surface, the adsorption member, and the supporting member coincide with each other.

4. The assembly jig according to claim 3, characterized in that: The cross-sectional area of ​​the combined surface decreases along the direction from the second side to the first side, and the minimum dimension of the cross section of the combined surface decreases along the direction perpendicular to the first direction; the cross section of the combined surface is perpendicular to the first direction; and / or A surface parallel to the first direction and on which the central axis of the combined surface is located is defined as a reference surface; the intersection line of the reference surface and the combined surface is a first intersection line and a second intersection line, the first intersection line and the second intersection line are symmetrically arranged about the central axis of the combined surface, the first intersection line and the second intersection line are close to each other at one end away from the base, and the first intersection line and the second intersection line are extended away from each other at one end close to the base.

5. The assembly jig according to any one of claims 1 to 4, characterized in that: The adjustment space is further used to adjust the posture of the carrier; the first state also includes a second sub-state in which both the first surface and the second surface are in contact with the carrier, so that the central axis of the carrier is in the preset position; Wherein, the assembly jig also includes a plurality of first adjustment members, which are movably connected to the base along a direction perpendicular to the first direction; the plurality of first adjustment members are used to fix the carrier when the central axis of the carrier is in the preset position.

6. The assembly jig according to any one of claims 1 to 4, characterized in that: The assembly jig further includes a plurality of second adjustment members, which are movably connected to the base along a direction perpendicular to the first direction; The plurality of second adjustment members are used to define a fixing space for fixing the supporting member so that the central axis of the supporting member is located at the preset position.

7. The assembly jig according to claim 6, characterized in that: The base is provided with a plurality of guide grooves corresponding to the plurality of second adjustment members one by one, and the second adjustment members are movably connected to the base along a direction perpendicular to the first direction by means of the corresponding guide grooves; The base is provided with an identification portion located on the target side of the guide groove, and the target side of the guide groove is at least one side of the two sides of the guide groove along a preset direction, and the preset direction, the first direction and the extension direction of the guide groove are perpendicular to each other.

8. The assembly jig according to any one of claims 1 to 4, characterized in that: The assembly jig further includes a first fixing member, the first fixing member being movably connected to the first guide member along the first direction, and the first fixing member being located between the first movable portion and the base, and the first fixing member being configured to maintain the first movable portion in the first position; and / or The assembly jig further includes a second fixing member, which is movably connected to the second guide member along the first direction and is located between the second movable portion and the base. The second fixing member is configured to maintain the second movable portion in the second position.

9. An assembly method, characterized in that: The assembly jig according to any one of claims 1 to 8 is used to assemble the carrier and the adsorption member; the assembly method comprises: placing a carrier on the first side of the base so that the central axis of the carrier is at the preset position; placing an adsorption member on a side of the carrier away from the base, and controlling the movable member in the first state to move toward the base along the first direction, so that the movable member is in the first sub-state and the central axis of the adsorption member coincides with the central axis of the carrier; The moving member is controlled to be in the second state, and the adsorption member is fixed on the supporting member based on the first moving portion being in the first position or the second moving portion being in the second position.

10. The assembly method according to claim 9, characterized in that: Placing the carrier on the first side of the base so that the central axis of the carrier is at the preset position includes: placing a carrier on the first side of the base, and controlling the movable member in the first state to move toward the base along the first direction, so that the movable member is in a second sub-state; in the second sub-state, both the first surface and the second surface abut against the carrier, and the central axis of the carrier is at the preset position; Alternatively, the supporting member is fixed by a plurality of first adjusting members so that the central axis of the supporting member is at the preset position; the first adjusting members are movably connected to the base along a direction perpendicular to the first direction.

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