Micro-negative pressure glue joint removing process for solid wood panels

Abstract

The present application provides a kind of micro-negative pressure glue joint removing process for solid wood panel, relate to wood processing technical field.The process is preset on the joint surface with a fine seam, and embedded with glue guide fiber structure with air and adsorption function, and the glue guide structure includes elastic porous inner layer and hydrophilic liquid absorbing outer layer.After the plate is combined, the panel is placed in a sealed environment, and the glue is driven by micro-negative pressure to migrate along the glue guide channel, and the outer layer material synchronously absorbs excess glue, effectively removes the glue residue and bubbles in the joint.The process realizes the controllable glue migration path, uniform and thorough glue removal process, significantly improves the appearance of glue joint, bonding strength and flatness, has strong adaptability, simple process and is easy to popularize.

Description

Technical Field

[0001] This invention belongs to the field of wood processing technology, specifically a micro-negative pressure glue removal process for solid wood panels. Background Technology

[0002] Solid wood splicing is a crucial basic process that joins multiple solid wood boards together with adhesives to form a large-size monolithic panel. It is widely used in the manufacturing of wood products such as furniture, flooring, doors and windows, cabinets, and solid wood veneer panels. During the splicing process, to ensure structural strength and lifespan, splicing adhesive is usually applied to the joint surfaces of the boards, and a certain amount of pressure is applied to bond and fix the boards in place. However, in traditional splicing processes, it is often difficult to control the diffusion and residue path of the adhesive during application, splicing, and pressing, especially in the joint area. Due to the small gaps, uneven stress, and difficulty in air expulsion, adhesive easily accumulates or contains air bubbles, forming obvious adhesive marks or voids in the joints, affecting the surface quality and structural strength of the spliced ​​panel.

[0003] To reduce adhesive residue, a common method is to manually scrape or grind away excess adhesive after assembly. However, this method mainly works on the outer surface of the seam and cannot effectively remove residual adhesive or air bubbles inside the seam. Not only does the cleaning effect rely on manual judgment, resulting in low efficiency and poor consistency, but excessive scraping can also damage the seam edges and even affect the bonding quality. Some companies have tried using negative pressure-assisted adhesive removal, placing the panels in a vacuum environment after assembly to allow the adhesive to migrate and precipitate under pressure. However, due to obstructed adhesive paths and uneven distribution of the negative pressure field, problems such as "inability to extract, incomplete extraction, and uncontrollable extraction position" often occur, resulting in unsatisfactory practical application effects and failing to completely solve the technical bottlenecks of adhesive residue, sinking, and stress concentration in the seams.

[0004] Furthermore, existing negative pressure adhesive removal methods generally lack structured control over the adhesive migration path. Negative pressure is applied only at a macroscopic level, lacking a "guiding channel" adapted to the microstructure of the adhesive joint. Especially during board splicing, adhesive often stagnates in the joint or flows outwards disorderly, further affecting the flatness, aesthetics, and bonding uniformity of the joint. Therefore, how to precisely guide the automatic migration and effective removal of adhesive during splicing through structural means, without increasing equipment complexity or altering the original process, and how to establish a stable and controllable adhesive joint cleaning mechanism under negative pressure, is a crucial technical problem urgently needing to be solved in current solid wood panel manufacturing. Summary of the Invention

[0005] The purpose of this invention is to disclose a micro-negative pressure glue removal process for solid wood panels. This invention not only achieves precise control and cleaning removal of glue in the joints, but also improves the splicing strength, aesthetics, and flatness of the joints, while reducing post-processing costs. It meets the comprehensive requirements of high-standard wood products for joint quality, appearance, and durability, and has broad application prospects and practical engineering value in the fields of solid wood furniture, door and window panels, and decorative panels.

[0006] The technical solution adopted in this invention is as follows:

[0007] A micro-negative pressure glue removal process for solid wood panels includes the following steps:

[0008] ① A narrow slit is made along the length of the splicing surface of at least one solid wood board, the narrow slit being used to accommodate the adhesive-conducting fiber tube;

[0009] ② The adhesive-conducting fiber tube is embedded in the narrow slit, wherein the adhesive-conducting fiber tube comprises:

[0010] An elastic porous inner layer is used to form a continuous airflow channel under negative pressure.

[0011] The absorbent outer layer is used to absorb the adhesive and the moisture that migrates with it.

[0012] ③ Apply splicing adhesive to the splicing surface of the fiber tube containing the adhesive;

[0013] ④ Align and splice the two boards and apply clamping pressure to make the spliced ​​surfaces fit tightly together, so that the adhesive fiber tube remains stable in the narrow gap;

[0014] ⑤ Seal the assembled boards in a sealing bag or sealing frame and connect a vacuum pump to extract air and create a micro negative pressure environment. This allows excess adhesive in the joints to be absorbed by the liquid-absorbing outer layer, promoting uniform dispersion of the adhesive and allowing excess adhesive to migrate to the ends or the outside along the channels in the middle of the elastic porous inner layer of the adhesive-conducting fiber tube.

[0015] ⑥ After removing the adhesive, stop the vacuuming and release the negative pressure;

[0016] ⑦ Perform curing treatment on the panels to allow the adhesive to fully cure. The adhesive-conducting fiber tubes can be left in the adhesive joints as a reinforcing structure or removed before the adhesive cures.

[0017] The slit has a rectangular, trapezoidal, or semi-circular cross-section with a width of 0.5–1.5 mm and a depth of 0.5–2 mm, and its dimensions are closely matched with the outer diameter of the adhesive fiber tube.

[0018] The inner layer of the conductive fiber tube is made of open-pore silicone foam or foamed polyurethane, which has gas permeability and resilience.

[0019] The outer layer of the adhesive-conducting fiber tube is a hydrophilic, highly absorbent material selected from sponge, fleece fabric, or absorbent fiber felt.

[0020] Before splicing, the joint area is locally humidified and the back of the board is locally dried to create a moisture content gradient to promote the migration of the adhesive to the adhesive structure.

[0021] The adhesive-conducting fiber tube is a detachable structure, and can be removed by pulling out the end before the adhesive cures after the panels are assembled.

[0022] The outer layer of the adhesive-conducting fiber tube contains an additive that promotes the curing of the adhesive solution, which can accelerate the local curing speed when the adhesive solution is adsorbed.

[0023] During the air extraction process, a pressure sensor or acoustic recognition module is installed to monitor the negative pressure state or the degree of adhesive removal completion, and automatically control the termination of air extraction.

[0024] The adhesive-conducting fiber tube is made of a material compatible with the splicing adhesive, and is embedded in the adhesive joint to form a reinforcing structure during the adhesive curing process without needing to be removed.

[0025] The beneficial effects of this invention include:

[0026] This invention effectively guides the adhesive to migrate along a predetermined path by pre-setting fine seams in the splicing surface of solid wood panels and embedding adhesive-guiding fiber structures, combined with applying slight negative pressure after splicing. This achieves the active removal and controllable cleaning of excess adhesive inside the splicing seams, solving long-standing problems in traditional splicing processes such as low adhesive removal efficiency, obvious adhesive marks on the surface, air bubbles trapped inside the adhesive seams, and unstable structural bonding strength.

[0027] Compared to existing technologies, the greatest advantage of this invention lies in establishing a stable, continuous, and controlled adhesive removal system through synergistic optimization of structure and process. Embedding an adhesive-guiding structure within the pre-designed seams on the splicing surface prevents it from collapsing under splicing pressure, ensuring the integrity and functional continuity of its internal ventilation channels. The adhesive-guiding structure is made of an elastic porous material with excellent axial air conduction and stress adaptability, while its outer layer is coated with a hydrophilic adsorbent material, effectively capturing and retaining the adhesive during negative pressure suction. Because the adhesive-guiding structure fits tightly into the seam channels, the adhesive in the middle of the seam can be quickly drawn and migrated to both ends under negative pressure and adsorbed and fixed by the outer layer, thus avoiding problems such as adhesive stagnation in the middle of the seam, air bubble inclusions, or adhesive buildup clogging the seams, which are common in traditional processes.

[0028] This structured adhesive migration path not only improves the thoroughness of adhesive removal but also enhances the uniformity and density of the adhesive layer. This results in higher bonding strength and a lower bubble rate at the joints after curing, more stable shear performance of the adhesive joints, and increased overall resistance to deformation of the panels. Simultaneously, because the surface adhesive is pre-migrated and absorbed during the internal removal stage, the joints appear cleaner, eliminating the need for tedious scraping or sanding. This significantly reduces surface treatment time and labor, improving subsequent coating efficiency and the overall aesthetics of the finished product.

[0029] Furthermore, the adhesive guiding structure used in this invention can be selectively retained in the adhesive joint, depending on actual needs. For applications requiring highly clean joints, it can be removed before the adhesive initially cures, leaving no residue. For scenarios requiring enhanced joint strength, it can be integrally embedded and cured to form structural reinforcement, exhibiting high process flexibility and product adaptability. The entire solution does not change commonly used adhesive types, does not rely on special equipment, and is easily integrated into existing panel production lines, demonstrating significant engineering feasibility and potential for large-scale promotion.

[0030] Through the synergistic effect of the above-mentioned structural design and process control, this invention not only achieves precise control and cleaning removal of the joint adhesive, but also improves the splicing strength, aesthetics and flatness of the joints, while reducing post-processing costs. It meets the comprehensive requirements of high-standard wood products for joint quality, appearance and durability, and has broad application prospects and practical engineering value in the fields of solid wood furniture, door and window panels, and decorative panels. Attached Figure Description

[0031] Figure 1 This is a schematic diagram of the process of the present invention;

[0032] Figure 2 This is a schematic diagram of the splicing of the sheet metal in this invention;

[0033] Figure 3 This is a schematic diagram of the plate material with narrow seams according to the present invention;

[0034] Figure 4 This is a cross-sectional schematic diagram of the adhesive-conducting fiber tube of the present invention;

[0035] Figure 5 This is a schematic diagram of the adhesive-conducting fiber tube of Embodiment 2 of the present invention.

[0036] In the diagram, 1 is the board material; 11 is the splicing surface; 12 is the seam; 13 is the back area; 2 is the adhesive-conducting fiber tube; 21 is the elastic porous inner layer; 22 is the liquid-absorbing outer layer; 23 is the middle flow guide section; and 24 is the adhesive-limiting and air-conducting sections at both ends. Detailed Implementation

[0037] To make the objectives, technical solutions, and advantages of this invention clearer, the invention will be further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative and not intended to limit the invention. Example

[0038] See Figures 1 to 4 This embodiment provides a micro-negative pressure glue removal process for solid wood panels, applicable to common solid wood panel production scenarios such as rubberwood, beech, and pine. This process involves pre-setting glue-guiding slits 12 on the splicing surface 11 and embedding a composite tubular structure with glue-guiding and adsorption functions. Under the combined action of splicing pressure and a negative pressure environment, the glue is guided to migrate orderly and effectively removed, thus significantly improving problems such as incomplete glue removal, glue residue, and unstable glue joints in traditional splicing methods.

[0039] In the specific implementation process, firstly, two solid wood boards 1 with a thickness of 15 to 30 mm are prepared, and their splicing surfaces 11 are planed to make them flat, clean, and with a moisture content controlled between 8% and 12%. Then, a linear slit 12 is made along the length of the splicing surface 11 of one of the boards 1. The slit 12 can be processed by CNC equipment or laser engraving equipment. The slit 12 is preferably rectangular or semi-circular in cross-section, with a width of 1.0 to 1.2 mm, a depth of 1.0 to 1.5 mm, and a length consistent with the splicing edge of the boards, such as 600 mm or 1200 mm.

[0040] Subsequently, a fiber optic tube 2 is embedded into the slit 12. The fiber optic tube 2 includes an elastic porous inner layer 21 and a liquid-absorbing outer layer 22. The inner layer is made of an elastic and porous material, such as open-cell silicone foam or micro-foamed TPU, which has good compression recovery and axial airflow permeability. The outer layer is an absorbent material, such as hydrophilic sponge, fleece nonwoven fabric, or absorbent fiber felt, with a thickness of generally 0.2 to 0.4 mm, covering the outer surface of the inner layer to absorb the adhesive and the moisture that moves with the adhesive. The outer diameter of the entire tube is closely matched with the size of the pre-set slit 12, so that it is stably fixed after embedding and will not be crushed under splicing pressure, thus maintaining the unobstructed internal channels.

[0041] If it is necessary to improve the efficiency of the initial stage of suction, flared structures can be set at both ends of the tube, with a flare diameter of 1.5 to 2.0 mm, to facilitate the rapid establishment of negative pressure from both ends during suction.

[0042] After inserting the adhesive-conducting fiber tube 2 into the slit 12, apply adhesive evenly to the two splicing surfaces using a scraper or roller, controlling the amount of adhesive applied to be between 150 and 250 grams per square meter, ensuring that the surface of the adhesive-conducting fiber tube 2 is also covered with adhesive but does not block its internal channels. Then, align and splice the two boards 1, applying clamping pressure using a splicing clamp, with the pressure range controlled between 3 and 6 MPa. After splicing, the adhesive-conducting fiber tube 2 is completely embedded in the slit 12. Because it is placed within the slit 12, it can still maintain its shape and flow-conducting capacity under pressure.

[0043] After assembly, place the entire assembly in a sealed bag or frame and connect it to the vacuum pump system through the pre-reserved end caps or vents. Start the vacuum system to gradually build up a slight negative pressure in the sealed environment, ranging from -20 to -60 kPa. Under this negative pressure, excess uncured adhesive in the joint is guided to migrate orderly to both ends along the ventilation channels formed in the inner layer of the adhesive guide tube. Simultaneously, the outer material absorbs the adhesive and moisture, preventing backflow or residue on the joint surface.

[0044] The vacuuming process lasts 3 to 10 minutes, adjusting the time as needed based on the type of adhesive, panel size, and joint condition. When no obvious excess or residue of adhesive is observed on the joint surface, turn off the vacuuming equipment, release the negative pressure, and remove the panel.

[0045] The panels are then placed in a well-ventilated environment for curing for at least 24 hours to ensure complete adhesive curing. Before curing is complete, if a detachable adhesive-conducting fiber tube 2 is used, it can be pulled out of the slit 12 by pulling at both ends; if the adhesive-conducting fiber tube 2 is made of a material compatible with the adhesive, it can also be left in the adhesive joint as part of the reinforcing structure.

[0046] Finally, the surface of the panels is sanded and leveled. Panels treated with this process have clean glue joints without glue residue, tight seams, and a stable structure, making them suitable for high-standard wood products such as furniture, flooring, and door panels.

[0047] In traditional solid wood panel gluing processes, minor unevenness at the joint surfaces often leads to localized glue accumulation after application and pressure. This is especially true in areas with narrow gaps or uneven pressure distribution, where glue is extremely difficult to remove. This results in glue overflow at the joints, surface contamination, discontinuous glue joints, and glue marks, voids, or weak bonds after curing. While existing manual glue scraping or negative pressure-assisted methods offer some improvement, they often lack internal guiding structures or have obstructed glue extraction paths, making it difficult to effectively control the direction of glue migration and achieve effective removal.

[0048] The key breakthrough of this invention lies in embedding a specialized adhesive-conducting fiber structure into the center of the splicing surface of solid wood panels, combined with a micro-negative pressure suction mechanism, to construct a structurally stable, clearly defined, and dynamically controlled adhesive removal channel system. Before splicing, a narrow slit is precisely machined along the length of the splicing surface of one panel. The size of this slit matches the adhesive-conducting fiber structure, allowing it to be embedded and preventing it from being crushed during subsequent splicing pressure. This embedded arrangement not only protects the morphological stability of the adhesive-conducting material during clamping but also achieves physical decoupling between splicing pressure and the adhesive removal function.

[0049] The adhesive-conducting fiber structure adopts a double-layer design. The inner layer is an elastic porous material with axial rebound capability and air-permeable and liquid-conducting function. Under clamping pressure, it can be locally compressed but will not completely collapse, ensuring that its internal porous structure is always maintained. The outer layer is covered with a highly absorbent material, such as fluff, fiber felt or hydrophilic sponge, which can quickly absorb the migrated adhesive, lock in the adhesive and prevent it from flowing back or spreading and causing contamination.

[0050] After the splicing and gluing are completed, the entire panel is sealed in a negative pressure environment. The negative pressure extraction system establishes a stable pressure gradient at both ends of the adhesive-guiding structure. At this time, excess adhesive in the middle of the joint will preferentially migrate towards the cavity channel formed by the inner layer of the adhesive-guiding structure under the action of negative pressure. The inner layer of the adhesive-guiding structure acts as a low-resistance gas-liquid pathway throughout the process, effectively guiding the directional movement of the adhesive, while the outer layer acts as a sealant and absorbent at the terminal position, ensuring that the adhesive "can leave but will not flow back," achieving a continuous adhesive removal effect with controlled path and adjustable process.

[0051] In this process, the migration behavior of the adhesive in the seam is not only affected by the pressure difference, but also jointly regulated by the arrangement of the adhesive guiding structure, the hydrophilicity of the material, the adsorption rate, and the protective mechanism of the seam structure. The elastic adhesive guiding channel forms a "traction path", the adsorption outer layer forms a "capture terminal", and the embedded seam provides a "deformation buffer space". The three work together to construct a complete physical migration-dynamic adsorption-structurally stable adhesive removal microsystem.

[0052] Furthermore, this invention boasts excellent adaptability in its structural design. The adhesive guiding structure can be either detachable, allowing for complete removal by pulling out both ends after the adhesive has initially cured, leaving no foreign matter, or it can utilize a covering material compatible with the panel adhesive, embedding itself entirely into the adhesive joint during the adhesive curing process to provide internal reinforcement without requiring removal. This dual-mode strategy ensures the operability and adaptability of this solution under different product requirements.

[0053] Through the above structural design and process linkage, this invention achieves active guidance of glue migration path, efficient removal of residual glue in glue seams, traceless treatment of spliced ​​surfaces, and consistent guarantee of adhesive strength in solid wood splicing. Its implementation principle is based on an innovative mechanism of negative pressure suction coupled with structural embedding. It does not rely on complex equipment or high-cost materials, and features controllable process, easy production, and simple modification. It represents a systematic optimization and disruptive improvement of traditional glue removal methods for spliced ​​boards.

[0054] The following are relevant tests of the present invention, which aim to verify, by comparing actual test data, whether the panel splicing process proposed in this invention, which embeds a guide structure in the splicing surface and applies a micro negative pressure to assist in glue removal, is superior to existing conventional panel splicing processes in terms of glue seam quality, glue removal efficiency, splicing strength and surface aesthetics.

[0055] The experimental control groups are shown in the table below:

[0056] The experimental materials and parameters are set as follows:

[0057] Board type: rubberwood, dimensions 600mm×100mm×18mm, moisture content 9.8%;

[0058] Panel adhesive: Water-based PVAc panel adhesive, viscosity 5000cps;

[0059] Adhesive application method: Double-sided application, 150g / m²;

[0060] Splicing pressure: 5MPa, constant pressure clamping for 30 minutes;

[0061] Adhesive-conducting structure: outer diameter 1.1mm, inner core is open-cell silicone foam, outer layer is fluffy non-woven fabric;

[0062] Negative pressure evacuation conditions: evacuation time 5 minutes, negative pressure intensity -40 kPa;

[0063] Health conditions: Temperature 25℃, humidity 55%, natural ventilation for 24 hours.

[0064] The sample preparation and testing method is as follows: 10 sets of spliced ​​samples are prepared for each group; 5 test points are preset in the splice area of ​​each sample to perform multiple parameter tests and take the average value.

[0065] The detection indicators and methods are as follows:

[0066] The comparative test data table is as follows:

[0067] The experimental results show that the solution of the present invention is significantly better than the control group in several key performance indicators:

[0068] The strongest adhesive residue control: Through the preset adhesive guiding path and negative pressure directional migration, there is almost no adhesive residue on the splice surface, with an average score of 1.2, which is significantly better than the control group;

[0069] High adhesive utilization rate and low waste: The adhesive removal rate reaches 91.4%, effectively reducing adhesive accumulation and saving costs, compared to only 23.6% in control group A;

[0070] Significantly improved bonding strength: Shear strength reached 10.5 MPa, nearly 48% higher than the group without adhesive removal, indicating that the adhesive joint thickness formed by the present invention is more reasonable and the adhesive layer is more compact;

[0071] Better splicing flatness: The problem of unevenness in the splicing seam caused by residual glue is effectively avoided in this solution, and the splicing height error is controlled within 0.16mm;

[0072] Superior appearance and less sanding work: scoring near perfect marks, sanding of the glue joint can be completed in just 25 seconds, significantly reducing subsequent costs;

[0073] Lower bubble rate and stronger joint density: The micro negative pressure not only removes the adhesive but also removes the gas in the joint, resulting in the lowest bubble rate in the joint, at only 1.3%.

[0074] In summary, the micro-negative pressure adhesive removal process proposed in this invention demonstrates superior overall performance compared to existing technologies in terms of adhesive removal efficiency, bonding strength, visual effect, and process simplification. It can effectively replace existing traditional methods for removing adhesive from spliced ​​panels and has broad prospects for application in furniture manufacturing, solid wood composite boards, and solid wood doors and windows. Example

[0075] See Figure 5 Based on Example 1, in order to further prevent the adhesive from being instantly evacuated due to insufficient flow resistance during the negative pressure suction process, resulting in insufficient bonding or voids at the joint edges, this example optimizes the structure of the adhesive guiding fiber tube 2. It adopts an axial resistance gradient design and a two-end adhesive-limiting air guiding coupling structure to achieve spatial control of the adhesive migration speed and effective transmission of negative pressure.

[0076] The adhesive-conducting fiber tube 2 is a flexible hollow structure arranged along the length of the joint, and is generally rope-shaped with a length that is basically consistent with the joint of the board. Its structure consists of three parts:

[0077] Central guide section 23: Located in the central region of the adhesive-conducting fiber tube 2, accounting for approximately 60% of the total length. This section is made of highly permeable porous materials, such as hollow PTFE microporous fibers or loosely woven natural hemp fibers, which have low flow resistance and good elasticity. Under splicing pressure, it can be locally compressed but still maintain the ability to allow air and adhesive to pass through, serving as the preferred migration path for the adhesive.

[0078] The two-end adhesive-limiting air-conducting sections 24 are located at both ends of the adhesive-conducting fiber tube 2, each accounting for approximately 20% of the total length. This section is externally covered with a high capillary resistance flow-limiting band, made of needle-punched nonwoven fabric or compressed cotton fiber material with a pore size of 3-10 μm, which significantly increases the flow resistance of the adhesive and slows down the diffusion rate of the adhesive to both ends. To ensure that the negative pressure can be transmitted to the middle of the adhesive-conducting structure, multiple radial micro-ventilation channels are set inside the flow-limiting layer, or a spiral groove fiber winding structure is used, allowing air to enter the middle of the tube through micropores or spiral gaps, thereby ensuring uniform distribution of negative pressure.

[0079] Adsorption coating layer (liquid-absorbing outer layer 22): The outer side of the adhesive-conducting fiber tube 2 is entirely covered with a layer of hydrophilic adsorption material, such as compressed sponge, long-staple cotton fleece or moisture-sensitive flocked polyester layer. This adsorption layer can quickly capture and lock the migrated adhesive during negative pressure suction, preventing the adhesive from overflowing or remaining on the seam surface.

[0080] The process implementation steps are basically the same as in Example 1. The difference lies in the fact that during the negative pressure suction process, the adhesive will preferentially migrate slowly from the middle of the seam to both ends. Due to the presence of the flow-limiting structure, the adhesive at both ends is only gradually released after the middle section of the seam has been extracted, forming a dynamic process of adhesive discharge with "middle first, ends lagging behind". Since the structure at both ends allows air to enter, the negative pressure can be continuously applied throughout the entire adhesive guiding structure, so that the adhesive extraction efficiency and the adhesive migration speed are synchronized and coordinated, avoiding problems such as vacuuming, delamination, or sinking.

[0081] After adopting the improved structure of this embodiment, the bonding strength of the glue joint is further improved, the glue layer thickness is more uniform, the splicing surface is cleaner, and no additional sanding is required afterward, thus significantly optimizing the overall quality of the spliced ​​panels.

[0082] The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention. Any modifications, equivalent substitutions, and improvements made within the spirit and principles of the present invention should be included within the protection scope of the present invention.

Claims

1. A micro-negative pressure glue removal process for solid wood panels, characterized in that, Includes the following steps: ① A narrow slit (12) is made along the length of the splicing surface (11) of at least one solid wood board (1), the narrow slit (12) being used to accommodate the adhesive fiber tube (2). ② The adhesive-conducting fiber tube (2) is embedded in the slit (12), wherein the adhesive-conducting fiber tube (2) comprises: An elastic porous inner layer (21) is used to form a continuous airflow channel under negative pressure.   The absorbent outer layer (22) is used to absorb the adhesive and the moisture that accompanies the migration of the adhesive; ③ Apply splicing adhesive to the splicing surface (11) of the fiber tube containing adhesive (2); ④ Align and splice the two boards (1) and apply clamping pressure to make the splicing surfaces fit tightly together, and the adhesive fiber tube (2) remains stable in the narrow gap (12); ⑤ Seal the assembled board (1) in a sealed bag or sealed frame and connect a vacuum pump to extract air and create a micro negative pressure environment. This allows excess adhesive in the joint to absorb the adhesive and moisture through the absorbent outer layer (22), promoting uniform dispersion of the adhesive and allowing excess adhesive to migrate to the end or outside along the channel in the middle of the elastic porous inner layer (21) of the adhesive-conducting fiber tube (2). ⑥ After removing the adhesive, stop the vacuuming and release the negative pressure; ⑦ Perform curing treatment on the splicing panels to allow the adhesive to fully cure. The adhesive-conducting fiber tube (2) can be left in the adhesive joint as a reinforcing structure or removed before the adhesive cures.

2. The process according to claim 1, characterized in that: The slit (12) has a rectangular, trapezoidal or semi-circular cross-section with a width of 0.5 to 1.5 mm and a depth of 0.5 to 2 mm, and its dimensions are closely matched with the outer diameter of the adhesive fiber tube.

3. The process according to claim 1, characterized in that: The inner layer of the conductive fiber tube (2) is open-pore silicone foam or foamed polyurethane, which has gas permeability and resilience.

4. The process according to claim 1, characterized in that: The outer layer of the adhesive-conducting fiber tube (2) is a hydrophilic, highly absorbent material selected from sponge, fleece fabric or absorbent fiber felt.

5. The process according to claim 1, characterized in that: Before splicing, local humidification treatment is applied to the splicing area, and local drying treatment is applied to the back area (13) of the board (1) to form a moisture content gradient to promote the migration of the adhesive to the adhesive structure.

6. The process according to claim 1, characterized in that: The adhesive-conducting fiber tube (2) is a detachable structure. After the panels are assembled, it can be removed by pulling out the end before the adhesive is cured.

7. The process according to claim 1, characterized in that: The outer layer of the adhesive-conducting fiber tube (2) contains an additive that promotes the curing of the adhesive liquid, which can accelerate the local curing speed when the adhesive liquid is adsorbed.

8. The process according to claim 1, characterized in that: During the vacuuming process, a pressure sensor or acoustic recognition module is installed to monitor the negative pressure status or the degree of adhesive removal completion, and the vacuuming is automatically terminated.

9. The process according to claim 1, characterized in that: The adhesive-conducting fiber tube (2) is made of a material compatible with the splicing adhesive, and is embedded in the adhesive joint to form a reinforced structure during the curing process of the adhesive without needing to be removed.

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