Adjustable carbon fiber shell mold cooling device

Abstract

The application discloses a kind of adjustable carbon fiber shell mould cooling equipment, including mould body and the cooling cavity being opened in its bottom, the bottom of mould body is equipped with storage tank, the bottom of storage tank is fixedly installed with the semiconductor refrigerator of equidistance arrangement, the semiconductor refrigerator carries out refrigeration to the cooling liquid inside storage tank, the top of storage tank is sequentially provided with heat exchange structure, auxiliary stripping structure and shunt structure from top to bottom, and main processor is integrated in the inside of storage tank.The application, in the intelligent temperature control aspect system, accurately controls the cooling liquid flow of each area by main processor, can realize accurate gradient cooling according to product demand, and this differentiated cooling mode is suitable for processing complex curved surface and carbon fiber shell with uneven thickness, cooperates with the double monitoring of liquid level and temperature sensor, ensures the cooling uniformity, avoids the stress concentration problem caused by traditional cooling mode, significantly improves cooling precision and energy utilization efficiency.

Description

Technical Field

[0001] This invention relates to the field of carbon fiber shell processing and cooling technology, and more specifically, to an adjustable carbon fiber shell mold cooling device. Background Technology

[0002] Carbon fiber composites are widely used in aerospace, automotive manufacturing, and sporting goods due to their excellent specific strength, specific stiffness, and corrosion resistance. However, carbon fiber shells face many technical challenges during the molding process, especially in the demolding and cooling stages.

[0003] Traditional cooling methods often employ single-cycle water cooling or air cooling systems. This uniform cooling approach struggles to adapt to the complex geometry and thickness variations of carbon fiber shells, easily generating uneven thermal stress during cooling and leading to quality issues such as warping and deformation. More problematic is the strong physical adhesion between carbon fiber and the mold surface; conventional cooling processes often require manual demolding, which is not only inefficient but also prone to surface damage. Existing cooling systems also suffer from low energy efficiency and are ineffective in meeting the increasingly demanding precision molding requirements of modern manufacturing. This is particularly pronounced when fabricating large, complex curved components, where localized overheating and uneven cooling severely restrict product yield and production efficiency. Summary of the Invention

[0004] In view of the problems existing in the prior art, the purpose of this invention is to provide an adjustable carbon fiber shell mold cooling device to solve the problems in the background art.

[0005] To achieve the above objectives, the present invention adopts the following technical solution;

[0006] An adjustable carbon fiber shell mold cooling device includes a mold body and a cooling cavity at its bottom. A storage box is installed at the bottom of the mold body, and semiconductor coolers arranged at equal intervals are fixedly installed at the bottom of the storage box. The semiconductor coolers cool the coolant inside the storage box. A heat exchange structure, an auxiliary demolding structure, and a flow distribution structure are arranged sequentially from top to bottom on the top of the storage box. A main processor is integrated inside the storage box. The main processor can be controlled and the parameters of electrical components can be adjusted by a background process. The semiconductor coolers are signal-connected to the main processor. The main processor controls the opening and closing of the semiconductor coolers upon receiving instructions from the background process.

[0007] The heat exchange structure includes a heat-conducting plate, which is fixedly installed on the inner wall of the cooling chamber. A uniformly distributed rectangular frame is integrally formed at the bottom of the heat-conducting plate. A spiral cooling bend that fits against the inner wall of the rectangular frame is fixedly installed inside the frame. A cold water pipe and a hot water pipe are respectively installed at the bottom end of the spiral cooling bend.

[0008] The auxiliary demolding structure includes an auxiliary box, which is fixedly installed on the top of the distribution box. A piston plate is slidably installed on the inner wall of the auxiliary box. A nitrogen chamber is formed between the bottom of the piston plate and the side wall of the auxiliary box. The nitrogen chamber is filled with a mixture of nitrogen and sulfur hexafluoride. Evenly distributed impact rods are fixedly installed on the top of the piston plate. The top of the impact rods penetrates the auxiliary box and extends into the interior of the rectangular frame. Spiral heat-conducting bends arranged at equal intervals are fixedly installed on the inner wall of the auxiliary box. The bottom end of the hot water pipe penetrates the auxiliary box and the piston plate and is connected to the top end of the spiral heat-conducting bends. A return pipe is fixedly installed at the bottom end of the spiral heat-conducting bends.

[0009] The diversion structure includes diversion boxes arranged at equal intervals. The diversion boxes are fixedly installed on the top of the storage box. Flow pumps arranged at equal intervals are fixedly installed on the inner wall of the diversion boxes. The bottom end of the cold water pipe passes through the auxiliary box and the diversion boxes and is connected to the flow pumps. A liquid pump arranged at equal intervals is fixedly installed on the left side of the storage box. The liquid pump is connected to the interior of the storage box and the diversion boxes through two pipes respectively. The flow pump is signal-connected to the main processor. The main processor controls the power of the flow pump according to a threshold set in the background, thereby changing the flow rate of the corresponding cold water pipe.

[0010] As a further description of the above technical solution: a liquid level sensor is fixedly installed on the inner wall of the diversion box. The liquid level sensor and the pump are both connected to the main processor. The liquid level sensor is used to detect the height of the liquid level inside the diversion box and transmit the value to the main processor. The main processor controls the opening and closing of the pump by comparing the received liquid level value with the liquid level threshold set in the background.

[0011] As a further description of the above technical solution: a baffle is fixedly installed on the inner wall of the storage box, the baffle is located on the top of the semiconductor cooler, and the top of the baffle is inclined.

[0012] As a further description of the above technical solution: the impact rod is hollow, and a soft pad is connected to the top of the impact rod.

[0013] As a further description of the above technical solution: A temperature sensor is fixedly installed on the side wall of the storage box. The temperature sensor is located on the right side of the baffle. The temperature sensor is connected to the main processor for signal transmission. The temperature sensor is used to detect the temperature of the returning coolant and transmit the numerical signal to the main processor.

[0014] As a further description of the above technical solution: a magnet is fixedly installed on the inner wall of the auxiliary box, and a metal iron plate magnetically connected to the magnet is fixedly installed at the bottom of the piston plate.

[0015] As a further description of the above technical solution: both the cold water pipe and the hot water pipe are subject to sliding sealing treatment with the piston plate.

[0016] As a further description of the above technical solution: a microprocessor is installed inside the flow divider box, which is used to receive and transmit signals from the main processor and control the flow pump.

[0017] Compared with the prior art, the advantages of this invention are:

[0018] In terms of intelligent temperature control, the system precisely regulates the coolant flow in each area through the main processor, and can achieve precise gradient cooling according to product requirements. This differentiated cooling method is suitable for handling complex curved surfaces and carbon fiber shells with uneven thickness. With the dual monitoring of liquid level and temperature sensors, it not only ensures cooling uniformity, but also avoids the stress concentration problem caused by traditional cooling methods, significantly improving cooling accuracy and energy utilization efficiency.

[0019] In terms of energy circulation, an innovative system combining waste heat recovery and mechanical demolding was designed. The heat of the high-temperature coolant is converted into mechanical energy for automatic demolding, while pre-cooling the return liquid is completed, which can prevent the shell from sticking and improve cooling efficiency. Attached Figure Description

[0020] Figure 1 This is a three-dimensional structural diagram of the cooling device of the present invention;

[0021] Figure 2 This is a frontal cross-sectional view of the present invention.

[0022] Figure 3 For the present invention Figure 2 Enlarged structural diagram at point A in the middle;

[0023] Figure 4 This is a three-dimensional structural diagram of the spiral heat-conducting bend and the spiral cooling bend of the present invention;

[0024] Figure 5 This is a schematic diagram illustrating the principle of the present invention.

[0025] Explanation of the labels in the diagram:

[0026] 1. Mold body; 2. Cooling chamber; 3. Storage box; 4. Semiconductor cooler; 5. Heat exchange structure; 501. Heat-conducting plate; 502. Rectangular frame; 503. Spiral cooling bend; 504. Cold water pipe; 505. Hot water pipe; 6. Auxiliary demolding structure; 601. Auxiliary box; 602. Piston plate; 603. Nitrogen chamber; 604. Impact rod; 605. Spiral heat-conducting bend; 606. Return pipe; 7. Flow distribution structure; 701. Flow distribution box; 702. Flow pump; 8. Main processor; 9. Liquid pump; 10. Liquid level sensor; 11. Baffle; 12. Soft pad; 13. Temperature sensor; 14. Magnet; 15. Metal plate; 16. Microprocessor. Detailed Implementation

[0027] The technical solutions of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention;

[0028] Please see Figures 1-5 In this invention, an adjustable carbon fiber shell mold cooling device includes a mold body 1 and a cooling cavity 2 opened at its bottom. A storage box 3 is installed at the bottom of the mold body 1. Semiconductor coolers 4 are fixedly installed at equal intervals at the bottom of the storage box 3. A baffle 11 is fixedly installed on the inner wall of the storage box 3. The baffle 11 is located on top of the semiconductor coolers 4. The top of the baffle 11 is inclined. The semiconductor cooler 4 cools the coolant inside the storage box 3. A heat exchange structure 5, an auxiliary demolding structure 6, and a flow diversion structure 7 are arranged sequentially from top to bottom on the top of the storage box 3. A main processor 8 is integrated inside the storage box 3. The main processor 8 can be controlled and the electrical component parameters can be adjusted by the background. The semiconductor coolers 4 are signal connected to the main processor 8. The main processor 8 receives instructions from the background to control the semiconductor coolers 4 to open and close.

[0029] A temperature sensor 13 is fixedly installed on the side wall of the storage box 3. The temperature sensor 13 is located on the right side of the baffle 11. The temperature sensor 13 is connected to the main processor 8. The temperature sensor 13 is used to detect the temperature of the returning coolant and transmit the numerical signal to the main processor 8.

[0030] The heat exchange structure 5 includes a heat-conducting plate 501, which is fixedly installed on the inner wall of the cooling chamber 2. A uniformly distributed rectangular frame 502 is integrally formed at the bottom of the heat-conducting plate 501. A spiral cooling bend 503, fitted to the inner wall of the rectangular frame 502, is fixedly installed inside the frame. A cold water pipe 504 and a hot water pipe 505 are respectively installed at the bottom of the spiral cooling bend 503. The auxiliary demolding structure 6 includes an auxiliary box 601, which is fixedly installed on the top of the distribution box 701. A piston plate 602 is slidably installed on the inner wall of the auxiliary box 601. A magnet 14 is fixedly installed on the inner wall of the auxiliary box 601. A metal plate 15, magnetically connected to the magnet 14, is fixedly installed at the bottom of the piston plate 602. A nitrogen chamber 603 is formed between the bottom of the piston plate 602 and the side wall of the auxiliary box 601. The nitrogen chamber 603 is filled with a mixture of nitrogen and sulfur hexafluoride. A uniformly distributed impact rod 604 is fixedly installed on the top of the piston plate 602. The top of the impact rod 604 passes through the auxiliary box 601 and extends into the interior of the rectangular frame 502. Spiral heat-conducting bends 605 arranged at equal intervals are fixedly installed on the inner wall of the auxiliary box 601. The bottom end of the hot water pipe 505 passes through the auxiliary box 601 and the piston plate 602 and is connected to the top end of the spiral heat-conducting bend 605. A return pipe 606 is fixedly installed at the bottom end of the spiral heat-conducting bend 605. Both the cold water pipe 504 and the hot water pipe 505 are slidably sealed with the piston plate 602.

[0031] The flow distribution structure 7 includes equidistantly arranged flow distribution boxes 701, which are fixedly installed on the top of the storage box 3. Flow pumps 702, arranged at equal intervals, are fixedly installed on the inner wall of the flow distribution boxes 701. The bottom end of the cold water pipe 504 passes through the auxiliary box 601 and the flow distribution box 701 and is connected to the flow pumps 702. A liquid extraction pump 9, arranged at equal intervals, is fixedly installed on the left side of the storage box 3. The liquid extraction pump 9 is connected to the interior of the storage box 3 and the flow distribution box 701 via two pipes respectively. The flow pumps 702 are connected to the main processor 8. The main processor 8 controls the power of the flow pump 702 according to the threshold set in the background, thereby changing the flow rate of the corresponding cold water pipe 504. A liquid level sensor 10 is fixedly installed on the inner wall of the distribution box 701. The liquid level sensor 10 and the liquid pump 9 are both connected to the main processor 8 via signal. The liquid level sensor 10 is used to detect the height of the liquid level inside the distribution box 701 and transmit the value to the main processor 8. The main processor 8 controls the opening and closing of the liquid pump 9 by comparing the liquid level threshold set in the background with the received liquid level value.

[0032] First, the mold body 1 is used to form the carbon fiber shell. After forming, it needs to be cooled before demolding. The user needs to adjust the cooling equipment according to the requirements of the carbon fiber shell to be formed. The operator can adjust the flow settings of multiple flow pumps 702 to meet the heat dissipation requirements of different locations.

[0033] When cooling of the carbon fiber shell mold is required, the back-end operator starts the system through the main processor 8. The semiconductor cooler 4 in the storage box 3 first starts working based on the initial coolant temperature fed back by the temperature sensor 13, and cools the coolant to the set temperature range.

[0034] The pump 9 pumps the cooled liquid through the pipeline to the distribution box 701. The liquid level sensor 10 monitors the liquid level in real time and controls the pump 9 to start and stop when the threshold is reached. The main processor 8 controls each flow pump 702 to pump the coolant into the spiral cooling bend 503 through the cold water pipe 504 at a differentiated flow rate according to the preset parameters. When the coolant flows through the rectangular frame 502, it exchanges heat efficiently with the mold body 1 through the heat conduction plate 501, so that the carbon fiber shell cools down quickly.

[0035] After heat exchange, the high-temperature coolant flows into the spiral heat-conducting bend 605 of the auxiliary box 601 through the hot water pipe 505. The high-temperature liquid undergoes secondary heat exchange with the nitrogen and sulfur hexafluoride mixed gas in the nitrogen chamber 603. On the one hand, the high-temperature gas expands and tends to move upward, and on the other hand, the temperature of the returning coolant continues to decrease.

[0036] The cooled coolant returns to the storage tank 3 via the return pipe 606. The inclined design of the baffle 11 ensures that the return coolant flows evenly across the cooling surface of the semiconductor cooler 4. The temperature sensor 13 monitors the return temperature in real time and feeds the data back to the main processor 8. The system automatically adjusts the cooling power of the semiconductor cooler 4 according to the temperature change, forming a closed-loop temperature control system.

[0037] The above cooling process continues. After a certain period of operation, the internal temperature of the nitrogen chamber 603 continues to rise. When the nitrogen pressure reaches the critical value, the magnetic attraction between the metal plate 15 at the bottom of the piston plate 602 and the magnet 14 is broken. The piston plate 602 drives the impact rod 604 to impact the rectangular frame 502 at high speed, generating vibration waves. This effectively breaks the adhesion between the carbon fiber shell and the mold. The sliding seal treatment of the cold water pipe 504 and hot water pipe 505 ensures the sealing of the pipeline system when the piston moves.

[0038] As the temperature of the carbon fiber shell decreases, the temperature of the reflux liquid also decreases, which in turn causes the temperature and pressure inside the nitrogen chamber 603 to drop, causing the piston plate 602 to reset. The temperature of the reflux liquid will also decrease, which will be detected by the temperature sensor 13 and transmitted to the main processor 8. The main processor 8 controls the power of the semiconductor cooler 4 until it is reduced until it is closed, and then the carbon fiber shell can be removed from the mold body 1.

[0039] This invention features intelligent flow control. The main processor 8 can precisely control the differentiated operating parameters of each flow pump 702, allowing the coolant to be directionally distributed according to the heat dissipation needs of different parts of the carbon fiber shell. This design not only achieves uniform cooling of the mold but also allows for flexible adjustment of local cooling intensity according to product process requirements. In particular, it can implement gradient temperature control for shell components with complex curved surfaces or uneven thickness, effectively avoiding the stress concentration problem that is prone to occur in traditional cooling methods. At the same time, the dual feedback system constructed by the liquid level sensor 10 and the temperature sensor 13 can optimize the coolant circulation volume and cooling power in real time, significantly improving the accuracy of the cooling process and energy utilization.

[0040] Simultaneously, through the synergistic effect of the spiral heat-conducting bend 605 and the nitrogen chamber 603, the heat of the high-temperature coolant is converted into mechanical energy to drive the piston plate 602. This design utilizes the magnetic cooperation between the magnet 14 and the metal plate 15 to form a resistance threshold that can be overcome, automatically triggering the impact action of the impact rod 604 at the optimal demolding time, thereby preventing the outer shell workpiece from sticking to the mold. On the other hand, while achieving assisted demolding, the system also completes the pre-cooling treatment of the return liquid, significantly reducing the temperature of the coolant returning to the storage tank 3. This not only reduces the subsequent cooling load of the semiconductor cooler 4, but also forms a high-efficiency energy circulation system and improves cooling efficiency.

[0041] Please see Figure 1 and 2 The impact rod 604 is hollow, and a soft pad 12 is connected to the top of the impact rod 604.

[0042] In this invention, the hollow impact rod 604 can reduce the overall weight of the impact rod 604 and the piston plate 602, thereby avoiding excessive weight that would make it difficult for the high-pressure gas to be lifted.

[0043] Please see Figure 5 The flow distribution box 701 contains a microprocessor 16, which is used to receive and transmit signals from the main processor 8 and control the flow pump 702.

[0044] In this invention, the microprocessor 16 acts as a bridge architecture, reducing the load on the main processor 8, thereby enabling more precise and faster adjustment.

[0045] The above description is merely a preferred embodiment of the present invention; however, the scope of protection of the present invention is not limited thereto. Any equivalent substitutions or modifications made by those skilled in the art within the scope of the technology disclosed in the present invention, based on the technical solution and its improved concepts, should be covered within the scope of protection of the present invention.

Claims

1. An adjustable carbon fiber shell mold cooling device, comprising a mold body (1) and a cooling cavity (2) formed at its bottom, characterized in that: The bottom of the mold body (1) is equipped with a storage box (3), and the bottom of the storage box (3) is fixedly equipped with semiconductor coolers (4) arranged at equal distances. The semiconductor coolers (4) cool the coolant inside the storage box (3). The top of the storage box (3) is provided with a heat exchange structure (5), an auxiliary demolding structure (6) and a flow distribution structure (7) from top to bottom. The storage box (3) is equipped with a main processor (8). The main processor (8) can be controlled and the electrical component parameters can be adjusted by the background. The semiconductor coolers (4) are connected to the main processor (8) by signal. The main processor (8) receives the background command to control the semiconductor coolers (4) to open and close. The heat exchange structure (5) includes a heat-conducting plate (501), which is fixedly installed on the inner wall of the cooling chamber (2). The bottom of the heat-conducting plate (501) is integrally formed with a uniformly distributed rectangular frame (502). The inner wall of the rectangular frame (502) is fixedly installed with a spiral cooling bend (503) that fits against it. The bottom end of the spiral cooling bend (503) is respectively installed with a cold water pipe (504) and a hot water pipe (505). The auxiliary demolding structure (6) includes an auxiliary box (601), which is fixedly installed on the top of the distribution box (701). A piston plate (602) is slidably installed on the inner wall of the auxiliary box (601). A nitrogen chamber (603) is formed between the bottom of the piston plate (602) and the side wall of the auxiliary box (601). The nitrogen chamber (603) is filled with a mixture of nitrogen and sulfur hexafluoride. Uniformly distributed impact rods (604) are fixedly installed on the top of the piston plate (602). The top of the impact rod (604) passes through the auxiliary box (601) and extends into the interior of the rectangular frame (502). The inner wall of the auxiliary box (601) is fixedly installed with spiral heat-conducting bends (605) arranged at equal intervals. The bottom end of the hot water pipe (505) passes through the auxiliary box (601) and the piston plate (602) in sequence. The bottom end of the hot water pipe (505) is connected to the top of the spiral heat-conducting bend (605). The bottom end of the spiral heat-conducting bend (605) is fixedly installed with a return pipe (606). The diversion structure (7) includes diversion boxes (701) arranged at equal intervals. The diversion boxes (701) are fixedly installed on the top of the storage box (3). Flow pumps (702) arranged at equal intervals are fixedly installed on the inner wall of the diversion boxes (701). The bottom end of the cold water pipe (504) passes through the auxiliary box (601) and the diversion box (701) and is connected to the flow pump (702). Liquid pumps (9) arranged at equal intervals are fixedly installed on the left side of the storage box (3). The two ends of the liquid pump (9) are connected to the interior of the storage box (3) and the diversion box (701) respectively through pipes. The flow pump (702) is signal-connected to the main processor (8). The main processor (8) controls the power of the flow pump (702) according to the threshold set in the background, thereby changing the flow rate of the corresponding cold water pipe (504). A baffle (11) is fixedly installed on the inner wall of the storage box (3). The baffle (11) is located on the top of the semiconductor cooler (4), and the top of the baffle (11) is inclined. A temperature sensor (13) is fixedly installed on the side wall of the storage box (3). The temperature sensor (13) is located on the right side of the baffle (11). The temperature sensor (13) is connected to the main processor (8) and is used to detect the temperature of the returning coolant and transmit the numerical signal to the main processor (8).

2. The adjustable carbon fiber shell mold cooling device according to claim 1, characterized in that: A liquid level sensor (10) is fixedly installed on the inner wall of the diversion box (701). The liquid level sensor (10) and the pump (9) are both connected to the main processor (8). The liquid level sensor (10) is used to detect the height of the liquid level inside the diversion box (701) and transmit the value to the main processor (8). The main processor (8) controls the opening and closing of the pump (9) by comparing the liquid level threshold set in the background with the received liquid level value.

3. The adjustable carbon fiber shell mold cooling device according to claim 1, characterized in that: The impact rod (604) is hollow, and a soft pad (12) is connected to the top of the impact rod (604).

4. The adjustable carbon fiber shell mold cooling device according to claim 1, characterized in that: A magnet (14) is fixedly installed on the inner wall of the auxiliary box (601), and a metal iron plate (15) magnetically connected to the magnet (14) is fixedly installed on the bottom of the piston plate (602).

5. The adjustable carbon fiber shell mold cooling device according to claim 1, characterized in that: Both the cold water pipe (504) and the hot water pipe (505) are fitted with a sliding seal with the piston plate (602).

6. The adjustable carbon fiber shell mold cooling device according to claim 1, characterized in that: The flow divider (701) is equipped with a microprocessor (16) which is used to receive and transmit signals from the main processor (8) and control the flow pump (702).

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