A wafer laser-assisted self-rotation grinding device based on workpiece center position recognition and laser pose regulation integrated structure

Abstract

A wafer laser-assisted spin grinding device based on an integrated structure for workpiece center position recognition and laser pose control is disclosed, relating to the field of spin grinding technology for crystal materials. This invention addresses the problems of low accuracy and efficiency in existing methods that manually adjust the relative position of the laser projection point to the wafer. The invention includes a grinding assembly and a laser-assisted assembly. The laser-assisted assembly includes a protective assembly, a workpiece temperature property testing platform, an integrated workpiece center position recognition and laser pose control device, and a temperature measuring device. The protective assembly is located outside the grinding assembly to provide protection during the grinding process. The workpiece temperature property testing platform is located inside the protective assembly and rotatably connected to it. The integrated workpiece center position recognition and laser pose control device is fixed to the top of the protective assembly via a fixed suspension. The temperature measuring device is fixed to the front side of the protective assembly. This invention is used for wafer grinding.

Description

Technical Field

[0001] This invention relates to the field of crystal material self-rotation grinding technology, specifically to a wafer laser-assisted self-rotation grinding device based on an integrated structure of workpiece center position recognition and laser pose control. Background Technology

[0002] Spin grinding is an effective processing method for obtaining high-precision surfaces. Introducing laser assistance can further improve the processing effect when spin grinding certain hard and brittle wafer materials. Existing spin grinding equipment lacks a dedicated laser-assisted system. During laser-assisted spin grinding, the laser needs to be manually clamped onto a support, and the laser projection position needs to be manually adjusted until the processing requirements are met. Because different lasers have different power ranges, various lasers with different shapes and structures are sometimes required in laser-assisted spin grinding, and existing supports cannot properly clamp these lasers. Manual adjustment also makes the relationship between the laser projection point and the wafer position unclear, which is detrimental to experimentally exploring the improvement effect of laser assistance on spin grinding. Furthermore, this adjustment method is inefficient. In addition, the diffuse reflection generated by the laser is harmful to the health of experimental personnel; relevant protective measures should be considered when designing the laser-assisted system. To solve the above problems, this invention provides an integrated device for workpiece center position identification and laser pose control in wafer laser-assisted spin grinding. Summary of the Invention

[0003] To address the problems of existing laser holders being unable to accommodate lasers with different structures and power ranges to meet various experimental requirements, as well as the low precision and efficiency of manually adjusting the relative position of the laser projection point and the wafer, and the need for protective measures for experimental personnel in the laser-assisted self-rotation grinding experiment, this invention proposes a wafer laser-assisted self-rotation grinding device based on an integrated structure of workpiece center position recognition and laser pose control.

[0004] The technical solution adopted by the present invention to solve the above-mentioned technical problems is as follows:

[0005] A wafer laser-assisted self-rotating grinding device based on an integrated structure of workpiece center position recognition and laser pose control includes a grinding component and a laser-assisted component. The laser-assisted component includes a protective component, a workpiece temperature rise property testing platform, an integrated device for workpiece center position recognition and laser pose control, and a temperature measuring device. The protective component is located outside the grinding component to provide protection during the grinding process. The workpiece temperature rise property testing platform is located at one end of the front side inside the protective component and is rotatably connected to the protective component. The integrated device for workpiece center position recognition and laser pose control is fixed to the top of the protective component via a fixed suspension. The temperature measuring device is fixed to the front side inside the protective component.

[0006] Furthermore, the grinding assembly includes a workpiece moving stage, a spindle moving stage, a machine tool platform, a spindle and grinding wheel, and a vacuum chuck. The machine tool platform is horizontally arranged, the spindle moving stage is located on one side of the upper surface of the machine tool platform and can move along the length of the machine tool platform, the workpiece moving stage is located on the other side of the upper surface of the machine tool platform and can move along the width of the machine tool platform, the spindle and grinding wheel are located on the inner end of the spindle moving stage to grind the workpiece, and the vacuum chuck is located on the inner end of the workpiece moving stage to adsorb and fix the workpiece.

[0007] Furthermore, the protective assembly includes a light-blocking housing, a front door, and a rear door. The light-blocking housing is positioned above the machine tool platform. Doorways are provided on both the front and rear sides of the light-blocking housing. The front door is positioned outside the front doorway, and the rear door is positioned outside the rear doorway. The upper ends of the front door and the rear door are rotatably connected to the light-blocking housing, respectively.

[0008] Furthermore, the workpiece temperature rise property testing platform includes a temperature rise property testing platform, a wall support frame, a platform pivot, and a light-blocking and heat-insulating back plate. The temperature rise property testing platform is rotatably connected to the inner side of the light-blocking shell through the platform pivot. The wall support frame is fixedly connected to the lower part of the temperature rise property testing platform, and the light-blocking and heat-insulating back plate is inserted into the upper part of the temperature rise property testing platform through a slot.

[0009] Furthermore, the temperature measuring device includes an infrared temperature probe, a secondary telescopic rod, a temperature measuring device base, a temperature measuring device turntable, a primary telescopic rod, a probe bracket, and a probe shaft. The temperature measuring device base is fixedly connected to the machine tool platform. The lower fixed end of the temperature measuring device turntable is fixedly connected to the temperature measuring device base. The primary telescopic rod is vertically fixed to the upper rotating end of the temperature measuring device turntable. The lower end of the secondary telescopic rod is inserted into the inner side of the upper end of the primary telescopic rod and is slidably connected along the height direction. The probe bracket is rotatably connected to the upper end of the secondary telescopic rod through the probe shaft. The infrared temperature probe is inserted into the probe bracket and locked in place by a tightening screw.

[0010] Furthermore, the integrated device for workpiece center position recognition and laser pose control includes a wall-mounted bracket, a boom rotating base, a boom swing joint, a boom servo motor, a boom, a forearm, a forearm servo motor, a high-power laser head, a clamping assembly, a mechanism pitch servo motor, a wrist, and a wrist servo motor. The wall-mounted bracket is fixed to a fixed suspension, and the boom rotating base is fixed to the wall-mounted bracket. The boom rotating base contains a built-in motor, and a base cover is fixed to the upper end of the boom rotating base. The boom swing joint is located above the base cover and is connected to the output shaft of the built-in motor via a base shaft. The built-in motor can drive the boom swing joint to rotate, and the boom servo motor... The mechanism is fixed to one side of the swing joint of the upper arm. The rear end of the upper arm is connected to the upper arm servo motor through the upper arm pivot. The upper arm servo motor can drive the upper arm to rotate. The forearm servo motor is fixed to the front end of the upper arm. The rear end of the forearm is connected to the forearm servo motor through the forearm pivot. The forearm servo motor can drive the forearm to rotate. The wrist servo motor is fixed to the front end of the forearm. The rear end of the wrist is connected to the wrist servo motor through the wrist pivot. The wrist servo motor can drive the wrist to rotate. The mechanism pitch servo motor is connected to the mechanism fixed to the front end of the wrist through the wrist servo motor. The clamping assembly is connected to the mechanism pitch servo motor through the clamping assembly pivot. The mechanism pitch servo motor can drive the clamping assembly to rotate. The clamping assembly clamps and fixes the high-power laser head.

[0011] Furthermore, the clamping assembly includes an adjustable-distance chassis, a vision module, a wiring mechanism, and two clamping mechanisms. The rear end face of the adjustable-distance chassis is fixedly connected to the rotating shaft of the clamping assembly. The clamping mechanisms are symmetrically arranged on both sides of the front end face of the adjustable-distance chassis to clamp and fix the high-power laser head. The vision module is fixedly connected to one side of the upper end of the adjustable-distance chassis. The wiring mechanism is located in the middle of the lower end of the adjustable-distance chassis and can swing along the front and rear directions of the adjustable-distance chassis.

[0012] Furthermore, the distance between the two clamping mechanisms can be adjusted via an adjustable pitch chassis.

[0013] Furthermore, the clamping mechanism includes a jaw bearing support, a jaw shaft, a bird-shaped jaw, a crank, a clamp slider, a mirror clamp slider, a rocker arm, and a clamp pull rod. A clamping motor is fixedly connected to the inner side of the jaw seat. A pin on the lower side of the rear end face of the crank passes through the crank shaft mounting hole on the jaw seat and connects to the output shaft of the clamping motor. The clamping motor drives the crank to rotate. One end of the rocker arm is rotatably connected to the pin on the upper side of the front end face of the crank, and the other end of the rocker arm is connected to the upper part of the clamp pull rod through a clamp cylindrical pin. The clamp slider and the mirror clamp... The sliders are fixedly connected in parallel to form a slider group. The slider group is set in the gripper seat and can slide along the height direction of the gripper seat. The lower part of the clamping rod is embedded in the upper part of the slider group. A gripper groove is opened on the inner end face of the slider group. The gripper bearing is fixedly connected to the inner side of the gripper seat. The bird-shaped gripper is rotatably connected to the gripper bearing through the gripper shaft. The clamping end of the bird-shaped gripper faces inward. The tail end of the bird-shaped gripper is set in the gripper groove, and the arc-shaped surface on the lower side of the tail end of the bird-shaped gripper contacts the arc-shaped surface of the lower side of the groove wall of the gripper groove.

[0014] Furthermore, the cable gathering mechanism includes a cable gathering bracket, a left cable gathering ring, a right cable gathering ring, and a spring clip. The upper end of the cable gathering bracket is connected to the adjustable pitch chassis, and the cable gathering bracket and the adjustable pitch chassis can rotate relative to each other. The left and right cable gathering rings are both semi-circular rings, with their openings facing each other. One end of the left and right cable gathering rings is connected to the lower end of the cable gathering bracket, and the left and right cable gathering rings can rotate relative to the cable gathering bracket. The other ends of the left and right cable gathering rings are connected by a spring clip.

[0015] The beneficial effects of this invention compared to the prior art are:

[0016] This invention proposes a wafer laser-assisted spin grinding device based on an integrated structure of workpiece center position recognition and laser pose control. The device utilizes a clamping mechanism with an adjustable base to effectively clamp lasers of different structures, enabling the clamping of laser heads with various power levels. Simultaneously, a vision module acquires the relative position information between the laser projection point and the wafer, and a computer algorithm controls the wrist axis and clamping component axis to precisely adjust the laser projection point position, thereby improving the accuracy and efficiency of the wafer laser-assisted spin grinding experiment. Furthermore, to meet the needs of the wafer laser-assisted spin grinding experiment, a temperature measuring device, a workpiece temperature rise test platform made of heat-insulating and light-insulating materials, and a housing are included. These can be used to test the laser-assisted effect of materials before the experiment and to detect the temperature of the workpiece and equipment during the experiment, while isolating the laser's influence without affecting the experimental operation, thus protecting the experimental personnel. Attached Figure Description

[0017] Figure 1 This is a schematic diagram of the overall structure of the present invention;

[0018] Figure 2 This is a schematic diagram of the structure of the temperature rise property testing platform in this invention;

[0019] Figure 3 This is a schematic diagram of the temperature measuring device in this invention;

[0020] Figure 4 This is a schematic diagram of the integrated device for workpiece center position recognition and laser pose control in this invention;

[0021] Figure 5 This is a side view of the integrated device for workpiece center position recognition and laser pose control in this invention.

[0022] Figure 6 This is a top view of the integrated device for workpiece center position recognition and laser pose control in this invention.

[0023] Figure 7 This is a schematic diagram of the clamping component in this invention;

[0024] Figure 8 This is a schematic diagram of the adjustable pitch chassis in this invention;

[0025] Figure 9 This is a schematic diagram of the main structure of the adjustable chassis in this invention;

[0026] Figure 10 yes Figure 9 Sectional view along line AA in the middle;

[0027] Figure 11 yes Figure 9 BB-direction sectional view in the middle;

[0028] Figure 12 This is a schematic diagram of the clamping mechanism in this invention;

[0029] Figure 13 This is a rear view schematic diagram of the clamping mechanism in this invention;

[0030] Figure 14 yes Figure 13 CC-direction section view;

[0031] Figure 15 This is a schematic diagram of the structure of the vision module in this invention;

[0032] Figure 16 This is a schematic diagram of the hub mechanism in this invention;

[0033] Figure 17 This is a schematic diagram of the structure of the clamping component in this invention clamping the head of a low-power laser. Detailed Implementation

[0034] To make the technical problems solved, the technical solutions, and the beneficial effects of the present invention clearer, the invention will be further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are only for explaining the invention and are not intended to limit the invention.

[0035] Specific implementation method one: Combining Figures 1 to 17 This embodiment describes a wafer laser-assisted self-rotating grinding device based on an integrated structure for workpiece center position recognition and laser pose control. The device includes a grinding assembly and a laser-assisted assembly. The laser-assisted assembly includes a protective assembly, a workpiece temperature rise property testing platform 2, an integrated workpiece center position recognition and laser pose control device 5, and a temperature measuring device 11. The protective assembly is located outside the grinding assembly to provide protection during the grinding process. The workpiece temperature rise property testing platform 2 is located at one end of the front side inside the protective assembly and is rotatably connected to it. The integrated workpiece center position recognition and laser pose control device 5 is fixedly connected to the top of the protective assembly via a fixed suspension 6. The temperature measuring device 11 is fixedly connected to the front side inside the protective assembly.

[0036] The apparatus of this invention is mainly used for experiments on laser-assisted spin grinding of wafers to study the improvement effect of laser assistance on spin grinding. The materials processed in the experiments are generally hard and brittle materials such as silicon carbide, diamond, and gallium nitride. These materials are prone to brittle fracture during processing, and due to their high hardness, the grinding wheel wears severely during processing, resulting in less than ideal processing effects from ordinary spin grinding. Therefore, this invention adds a laser-assisted system to the spin grinding experimental platform. Using a laser to treat the wafer material can reduce the surface hardness and increase its plasticity, reducing cracks generated during processing and improving the processing accuracy and efficiency of spin grinding. To quantitatively explore the improvement effect of laser assistance on spin grinding of different wafer materials and the underlying mechanisms, a workpiece temperature rise property testing platform 2, an integrated device for workpiece center position recognition and laser pose control 5, a temperature measuring device 11, a high-power laser head 33, and a low-power laser head 88 are set up. The main parameter controlled by the laser assistance is the laser power, and the temperature of the workpiece during the grinding process needs to be monitored over time. A pre-experimental workpiece, identical in material to the workpiece in the formal experiment, is fixed on the heating property testing platform 2 to conduct a pre-experiment on the laser-assisted heating effect of the test material. The laser head is clamped by the integrated device 5 for workpiece center position recognition and laser pose control, and the laser is projected onto the center position of the workpiece. The laser power is adjusted to a pre-designed value, and then the temperature of the workpiece is detected by the temperature measuring device 11. The temperature test results are compared with those of the control material under the same laser power to evaluate the laser-assisted heating properties of the experimental material, predict the heating effect of different laser powers on the material in the experiment, and design the laser power used in the experiment. The formal experiment then proceeds. The workpiece is mounted on the vacuum chuck 13, and the laser head is clamped using the integrated workpiece center position recognition and laser pose control device 5. The device identifies and positions the center position of the workpiece and the laser projection point, and automatically adjusts the laser projection point so that the laser falls on a predetermined position on the workpiece. This predetermined position must avoid the area covered by the grinding wheel on the workpiece to prevent damage to the grinding wheel. Subsequently, the positions of the workpiece moving stage 3 and the spindle moving stage 8 are adjusted via the CNC panel to bring the workpiece into contact with the grinding wheel for grinding. During the experiment, the temperature of the workpiece is monitored in real time using the temperature measuring device 11, and the laser power is adjusted as necessary. After completing one set of experiments, the workpiece is removed, a new workpiece is installed, and the relative position of the laser projection point and the workpiece is adjusted to be the same as in the previous set of experiments using the integrated workpiece center position recognition and laser pose control device 5. Different laser powers are selected, and the above process is repeated to obtain multiple sets of experimental data, thus completing the wafer laser-assisted self-rotation grinding experiment.

[0037] Specific Implementation Method Two: Combining Figure 1This embodiment describes a grinding assembly comprising a workpiece moving stage 3, a spindle moving stage 8, a machine tool platform 10, a spindle and grinding wheel 12, and a vacuum chuck 13. The machine tool platform 10 is horizontally positioned. The spindle moving stage 8 is located on one side of the upper surface of the machine tool platform 10 and can move along the length of the machine tool platform 10. The workpiece moving stage 3 is located on the other side of the upper surface of the machine tool platform 10 and can move along the width of the machine tool platform 10. The spindle and grinding wheel 12 are located on the inner end of the spindle moving stage 8 to grind the workpiece, and the vacuum chuck 13 is located on the inner end of the workpiece moving stage 3 to adsorb and fix the workpiece.

[0038] The undisclosed technical features in this embodiment are the same as those in Specific Embodiment 1.

[0039] The workpiece is adsorbed by the vacuum chuck 13, and then the vacuum chuck 13, the spindle and the grinding wheel 12 are rotated. The moving axis moving table 8 and the workpiece moving table 3 make the grinding wheel and the workpiece contact each other and perform self-rotating grinding.

[0040] Limiting baffles 9 are provided at both the starting point and the ending point of the movement of the main spindle moving table 8 and the workpiece moving table 3.

[0041] Specific implementation method three: Combining Figure 1 This embodiment describes a protective assembly comprising a light-blocking housing 1, a front door 4, and a rear door 7. The light-blocking housing 1 is positioned above the machine tool platform 10. Doorways are provided on both the front and rear sides of the light-blocking housing 1. The front door 4 is positioned outside the front doorway, and the rear door 7 is positioned outside the rear doorway. The upper ends of the front door 4 and the rear door 7 are rotatably connected to the light-blocking housing 1, respectively.

[0042] The undisclosed technical features in this embodiment are the same as those in Specific Embodiment Two.

[0043] The front door 4 and the rear door 7 are connected to the light-blocking housing 1 and can rotate up and down to open and close the device.

[0044] The integrated device 5 for workpiece center position recognition and laser pose control is mounted on the top inner side of the light-blocking housing 1 via a fixed suspension 6. The temperature measuring device 11 is mounted in the front area of ​​the spindle moving stage 8, facing the machine tool platform 10 and the workpiece temperature rise property testing platform 2.

[0045] Specific implementation method four: Combination Figures 1 to 2 This embodiment describes a workpiece temperature rise property testing platform 2, which includes a temperature rise property testing table 14, a wall support frame 15, a platform pivot 16, and a light-blocking and heat-insulating back plate 17. The temperature rise property testing table 14 is rotatably connected to the inner side of the light-blocking shell 1 via the platform pivot 16. The wall support frame 15 is fixedly connected to the lower part of the temperature rise property testing table 14, and the light-blocking and heat-insulating back plate 17 is inserted into the upper part of the temperature rise property testing table 14 via a slot.

[0046] The undisclosed technical features in this embodiment are the same as those in Specific Embodiment Three.

[0047] The workpiece temperature rise property test platform 2 is connected to the inside of the light-blocking shell 1 via a rotating shaft. After the test is completed, it can be flipped up and attached to the inner wall of the light-blocking shell 1 to save space.

[0048] In this embodiment, the heating property test platform 14 is connected to the light-blocking housing 1 via the platform pivot 16. When not in use, it can be rotated upwards to fit against the inner wall of the light-blocking housing 1 and then secured with clips, saving space. In use, the heating property test platform 14 is rotated to a horizontal position and supported by the wall support frame 15. The light-blocking and heat-insulating back plate 17 is inserted into the slot. Both the heating property test platform 14 and the light-blocking and heat-insulating back plate 17 are made of heat-insulating material. The experimental workpiece is fixed on the heating property test platform 14 using a fixing device for laser-assisted performance testing.

[0049] Specific Implementation Method Five: Combining Figure 1 and Figure 3 This embodiment describes a temperature measuring device 11 comprising an infrared temperature probe 18, a secondary telescopic rod 19, a temperature measuring device base 20, a temperature measuring device turntable 21, a primary telescopic rod 22, a probe bracket 23, and a probe shaft 24. The temperature measuring device base 20 is fixedly connected to the machine tool platform 10. The lower fixed end of the temperature measuring device turntable 21 is fixedly connected to the temperature measuring device base 20. The primary telescopic rod 22 is vertically fixedly connected to the upper rotating end of the temperature measuring device turntable 21. The lower end of the secondary telescopic rod 19 is inserted into the inner side of the upper end of the primary telescopic rod 22 and is slidably connected along the height direction. The probe bracket 23 is rotatably connected to the upper end of the secondary telescopic rod 19 through the probe shaft 24. The infrared temperature probe 18 is inserted into the probe bracket 23 and is locked and fixed by a tightening screw.

[0050] The undisclosed technical features in this embodiment are the same as those in Specific Embodiment Two.

[0051] The temperature measuring device base 20 is connected to the pre-set threaded hole on the machine tool platform 10 by screws. The position of the temperature measuring device base 20 can also be adjusted by removing the screws. The temperature measuring device turntable 21 can rotate the upper structure to adjust the orientation of the infrared temperature measuring probe 18. The height of the infrared temperature measuring probe 18 can be adjusted by using the secondary telescopic rod 19 and the primary telescopic rod 22. The angle of the infrared temperature measuring probe 18 can be adjusted by the probe rotating shaft 24, so that the infrared temperature measuring probe 18 can face the workpiece and detect the temperature of the workpiece during the pre-experiment and self-rotating grinding experiment.

[0052] Specific Implementation Method Six: Combination Figure 1 and Figures 4 to 17This embodiment describes an integrated device 5 for workpiece center position recognition and laser pose control, comprising a wall-mounted bracket 25, a boom rotating base 26, a boom swing joint 28, a boom servo motor 29, a boom 30, a forearm 31, a forearm servo motor 32, a high-power laser head 33, a clamping assembly 34, a mechanism pitch servo motor 35, a wrist 36, and a wrist servo motor 37. The wall-mounted bracket 25 is fixedly connected to a fixed suspension 6. The boom rotating base 26 is fixedly connected to the wall-mounted bracket 25. The boom rotating base 26 has a built-in motor, and a base cover 27 is fixedly connected to the upper end of the boom rotating base 26. The boom swing joint 28 is located above the base cover 27 and is connected to the output shaft of the built-in motor via a base pivot 38. The built-in motor can drive the boom swing joint 28 to rotate. The boom servo motor 29 is fixedly connected to the wall-mounted bracket 25, a boom rotating base 26, a forearm swing joint 28, a forearm swing joint 28, a boom ... Connected to one side of the upper arm swing joint 28, the rear end of the upper arm 30 is connected to the upper arm servo 29 via the upper arm pivot 42. The upper arm servo 29 can drive the upper arm 30 to rotate. The forearm servo 32 is fixed to the front end of the upper arm 30. The rear end of the forearm 31 is connected to the forearm servo 32 via the forearm pivot 39. The forearm servo 31 can drive the forearm 32 to rotate. The wrist servo 37 is fixed to the front end of the forearm 31. The rear end of the wrist 36 is connected to the wrist servo 37 via the wrist pivot 41. The wrist servo 37 can drive the wrist 36 to rotate. The mechanism pitch servo 35 is fixed to the front end of the wrist 36 via the wrist servo connecting mechanism 40. The clamping assembly 34 is connected to the mechanism pitch servo 35 via the clamping assembly pivot 43. The mechanism pitch servo 35 can drive the clamping assembly 34 to rotate. The clamping assembly 34 clamps and fixes the high-power laser head 33.

[0053] The undisclosed technical features in this embodiment are the same as those in Specific Embodiment 1.

[0054] In this embodiment, the wall-mounted bracket 25 of the integrated device 5 for workpiece center position recognition and laser pose control is connected to the fixed suspension 6 by bolts. The base pivot 38, forearm pivot 39, wrist pivot 41, upper arm pivot 42, and clamping assembly pivot 43 drive the rotation of various structural components, including the upper arm swing joint 28, upper arm 30, forearm 31, clamping assembly 34, and wrist 36, thereby achieving five degrees of freedom movement of the clamping assembly 34 and adjusting the position and orientation of the laser head within the device. Before the experiment, the high-power laser head 33 is clamped using the clamping mechanism 35 on the clamping assembly 34. Then, the laser's pre-aiming function is activated to adjust the position of the laser projection point. The integrated device 5 for center position recognition and laser pose control has both manual and automatic adjustment modes. First, the manual adjustment function is used to adjust the angles of each pivot, adjusting the position of the laser projection point (a red dot in pre-aiming mode) to near the workpiece, allowing the vision module 46 to acquire an image simultaneously containing the laser projection point position and the workpiece. Then, the automatic adjustment mode is activated. The vision module 46 acquires images, the computer processes the images, the Canny edge detection algorithm is used to extract the contour information of the workpiece, the shape of the workpiece is analyzed and the center position of the workpiece is calculated, the HSV color space threshold segmentation algorithm is used to separate and position the laser pre-aiming red dot, the deviation between the red dot and the center position of the workpiece is calculated, and then the wrist pivot 41 and the clamping component pivot 43 are automatically controlled to adjust the red dot to the center position of the workpiece, or the laser projection pre-aiming red dot is moved to other set positions on the workpiece as needed.

[0055] Specific implementation method seven: Combination Figure 1 and Figures 4 to 17 This embodiment describes a clamping assembly 34 comprising an adjustable base 44, a vision module 46, a wiring mechanism 47, and two clamping mechanisms 45. The rear end face of the adjustable base 44 is fixedly connected to the rotating shaft 43 of the clamping assembly. The clamping mechanisms 45 are symmetrically arranged on both sides of the front end face of the adjustable base 44 to clamp and fix the high-power laser head 33. The vision module 46 is fixedly connected to one side of the upper end of the adjustable base 44. The wiring mechanism 47 is located in the middle of the lower end of the adjustable base 44 and can swing along the front-back direction of the adjustable base 44.

[0056] The undisclosed technical features in this embodiment are the same as those in Specific Embodiment Six.

[0057] The vision module 46 includes a camera bracket base 78, a camera bracket rod 79, bracket clamping screws 80, a camera mounting bracket 81, a camera mounting plate 82, and an industrial camera 83. The camera bracket base 78 is connected to the clamping base mounting plate 51 by screws, and the camera bracket base 78 is connected to the camera bracket rod 79 above it by threads. The camera mounting bracket 81 has openings and fits onto the camera bracket rod 79, allowing the orientation of the industrial camera 83 to be adjusted by rotation on a horizontal plane. It can then be clamped and fixed by the bracket clamping screws 80. The camera mounting plate 82 is connected to the camera mounting bracket 81 by a pivot, allowing the orientation of the industrial camera 83 to be adjusted by rotation of the camera mounting plate 82. The industrial camera 83 is fixed to the outside of the camera mounting plate 82 by screws.

[0058] In this embodiment, after adjusting the orientation of the camera mounting bracket 81, tighten the bracket clamping screw 80 to fix it. Then, rotate the camera mounting plate 82 to adjust the orientation of the industrial camera 83 so that the orientation of the industrial camera 83 is roughly consistent with the direction of the laser emitted by the laser head, so as to obtain an image containing the laser pre-aiming red dot and the positional relationship of the workpiece.

[0059] Specific implementation method eight: Combination Figure 1 and Figures 4 to 17 In this embodiment, the distance between the two clamping mechanisms 45 can be adjusted by the adjustable base plate 44.

[0060] The undisclosed technical features in this embodiment are the same as those in Specific Embodiment Seven.

[0061] After adjusting the spacing of the clamping mechanism 45 via the adjustable base 44, the clamping assembly 34 can be used to fix the low-power laser head 88, thereby achieving clamping of laser heads of different power.

[0062] The adjustable distance chassis 44 includes a laser head clamping base plate 50, a right side shaft fixing plate 52, a clamping component connecting mechanism 53, a drive gear shaft 54, an adjustment knob 55, a left side shaft fixing plate 56, a front driven gear 57, a drive gear 59, a rear driven gear 62, a rear threaded gear shaft 64, a front threaded gear shaft 67, two gripper seats 48, and two gripper seat mounting plates 51. A high-temperature resistant rubber material layer is fixed to the front end face of the laser head clamping base plate 50 to increase the friction between it and the laser. The rear end face of the laser head clamping base plate 50 is provided with a clamping component connecting mechanism 53, which connects it to the laser head clamping base plate 50. The clamping assembly is connected to the rotating shaft 43. The gripper seat mounting plates 51 are respectively fixed to both sides of the laser head clamping base plate 50. Each gripper seat mounting plate 51 is provided with a gripper seat 48, and the gripper seat 48 can slide along the length direction on the upper surface of the gripper seat mounting plate 51. The rear threaded gear shaft 64 and the front threaded gear shaft 67 are inserted side by side in parallel into the lower part of the gripper seat 48 and are located below the gripper seat mounting plate 51. The rear threaded gear shaft 64 and the front threaded gear shaft 67 are provided with a threaded section on one side and an optical axis section on the other side. The optical axis section of the rear threaded gear shaft 64 is connected to the gripper seat on the left side. The rear threaded gear shaft 64 is slidably connected to the right gripper seat 48 via a sliding connection. The threaded section of the rear threaded gear shaft 64 is threadedly connected to the right gripper seat 48, and the threaded section of the front threaded gear shaft 67 is threadedly connected to the left gripper seat 48. The smooth shaft section of the front threaded gear shaft 67 is slidably connected to the right gripper seat 48. A left shaft fixing plate 56 is vertically fixed to the lower outer end of the left gripper seat mounting plate 51, and a right shaft fixing plate 52 is vertically fixed to the lower outer end of the right gripper seat mounting plate 51. The rear threaded gear shaft 64 is rotatably connected to the left shaft fixing plate 56 and the right shaft fixing plate 52 via bearing 63 and bearing 65, respectively. The front threaded gear shaft 67 is rotatably connected to the right shaft fixing plate 52 and the left shaft fixing plate 56 via bearing No. 3 66 and bearing No. 4 68, respectively. The drive gear shaft 54 ​​is rotatably connected to the left shaft fixing plate 56. An adjustment knob 55 is provided on the outside of the drive gear shaft 54. A drive gear 59 is mounted on the inside of the drive gear shaft 54. The front driven gear 57 and the rear driven gear 62 are respectively located on both sides of the drive gear 59 and mesh with the drive gear 59. The front driven gear 57 and the rear driven gear 62 are respectively located on the front threaded gear shaft 67 and the rear threaded gear shaft 64.

[0063] When the pitch adjustment knob 55 is rotated, the rotation of the drive gear shaft 54 ​​is transmitted to the drive gear 59 through the drive gear key 60. The rotation of the drive gear 59 is transmitted to the front driven gear 57 and the rear driven gear 62. The rotation of the front driven gear 57 and the rear driven gear 62 is transmitted to the front threaded gear shaft 67 and the rear threaded gear shaft 64 through the front driven gear key 58 and the rear driven gear key 61, respectively. The rotation of the front threaded gear shaft 67 and the rear threaded gear shaft 64 will cause the left gripper seat 48 and the right gripper seat 48 to move along the length of the gripper seat mounting plate 51, respectively. The threaded sections on the front threaded gear shaft 67 and the rear threaded gear shaft 64 are opposite. Thus, by rotating the pitch adjustment knob 55, the two gripper seats 48 can move in opposite directions, thereby adjusting the distance between the two gripper seats 48.

[0064] In this embodiment, the adjustable pitch chassis 44 serves as the main body, on which a clamping mechanism 45, a vision module 46, and a wiring mechanism 47 are mounted. Rotating the pitch adjustment knob 55 clockwise causes the drive gear 59 to rotate clockwise via the drive gear key 60 on the drive gear shaft 54. This, in turn, causes the front driven gear 57 and the rear driven gear 62 to rotate counterclockwise via the drive gear 59. This rotation is then transmitted to the front threaded gear shaft 67 and the rear threaded gear shaft 64 via the front driven gear key 58 and the rear driven gear key 61. The front threaded gear shaft 67 and the rear threaded gear shaft 64 are provided with opposing threads. Thus, the threaded transmission causes the left gripper seat 48 to move to the right and the right gripper seat 48 to move to the left, thereby shortening the distance between the two gripper seats. Conversely, rotating the pitch adjustment knob 55 counterclockwise can widen the distance between the two gripper seats, thereby accommodating the size of laser heads with different power.

[0065] Specific Implementation Method Nine: Combining Figure 1 and Figures 4 to 17This embodiment describes a clamping mechanism 45 comprising a jaw bearing support 49, a jaw shaft 69, a bird-shaped jaw 70, a crank 72, a clamp slider 73, a mirror-image clamp slider 74, a rocker arm 76, and a clamping pull rod 77. A clamping motor is fixedly connected to the inner side of the jaw seat 48. A pin on the lower side of the rear end face of the crank 72 passes through a crank shaft mounting hole 71 on the jaw seat 48 and connects to the output shaft of the clamping motor, driving the crank 72 to rotate. One end of the rocker arm 76 is rotatably connected to a pin on the upper side of the front end face of the crank 72, and the other end of the rocker arm 76 is connected to the upper part of the clamping pull rod 77 via a clamping cylindrical pin 75. The clamp slider 73 and the mirror clamp slider 74 are fixedly connected side by side to form a slider group. The slider group is set in the jaw seat 48 and can slide along the height direction of the jaw seat 48. The lower part of the clamp pull rod 77 is embedded in the upper part of the slider group. A jaw groove is opened on the inner end face of the slider group. The jaw bearing support 49 is fixed to the inner side of the jaw seat 48. The bird-shaped jaw 70 is rotatably connected to the jaw bearing support 49 through the jaw shaft 69. The clamping end of the bird-shaped jaw 70 is set inward. The tail end of the bird-shaped jaw 70 is set in the jaw groove, and the arc surface on the lower side of the tail end of the bird-shaped jaw 70 is in contact with the arc surface of the lower side of the jaw groove.

[0066] The undisclosed technical features in this embodiment are the same as those in Specific Embodiment Seven.

[0067] As crank 72 rotates, rocker arm 76 drives clamp lever 77, clamp slider 73, and mirror clamp slider 74 to move up and down within clamp holder 48. Bird-shaped clamp 70 is mounted on clamp shaft 69 via a shaft hole, and clamp shaft 69 is mounted on clamp bearing support 49. The arc-shaped surfaces of clamp slider 73 and mirror clamp slider 74 contact the arc-shaped surface of the tail of bird-shaped clamp 70. As clamp slider 73 and mirror clamp slider 74 move upward, the tail of bird-shaped clamp 70 is raised, bird-shaped clamp 70 rotates around clamp shaft 69, and the head of bird-shaped clamp 70 descends to clamp and fix the laser head.

[0068] In this embodiment, the lower end face of the gripper seat 48 is attached to the groove of the gripper seat mounting plate 51, facing the bird-shaped gripper 70. The left hole on the lower side of the gripper seat 48 is a threaded hole, and the right hole is a through hole. The two holes on the lower side are installed on the front threaded gear shaft 67 and the rear threaded gear shaft 64, and the installation positions of the left and right gripper seats 48 need to be symmetrical. Before placing the laser head, the crank 72 is driven by the motor to rotate downwards, and the rocker arm 76 pushes the clamping rod 77, clamping slider 73 and mirror clamping slider 74 downwards, causing the bird-shaped gripper 70 to rotate around the gripper shaft 69, raising its head and placing the laser head on the laser head clamping base plate 50. The distance adjustment knob 55 is rotated to adjust the gripper to a suitable position above the laser head being clamped. The crank 72 is driven by the motor to rotate upwards again, and the rocker arm 76 pulls the clamping rod 77, clamping slider 73 and mirror clamping slider 74 upwards, causing the bird-shaped gripper 70 to rotate around the gripper shaft 69, lowering its head and clamping the laser head.

[0069] Specific Implementation Method Ten: Combining Figure 1 and Figures 4 to 17 This embodiment describes a cable management mechanism 47 comprising a cable management bracket 84, a left cable management ring 85, a right cable management ring 86, and a spring clip 87. The upper end of the cable management bracket 84 is connected to an adjustable base 44, and the cable management bracket 84 and the adjustable base 44 are rotatable relative to each other. The left cable management ring 85 and the right cable management ring 86 are both semicircular rings, with their openings facing each other. One end of the left cable management ring 85 and the right cable management ring 86 is connected to the lower end of the cable management bracket 84, and the left cable management ring 85 and the right cable management ring 86 are rotatable relative to the cable management bracket 84. The other ends of the left cable management ring 85 and the right cable management ring 86 are connected by the spring clip 87.

[0070] The undisclosed technical features in this embodiment are the same as those in Specific Embodiment Seven.

[0071] The cable tray 84 is connected to the two inner sides of the adjustable base 44 via threaded shaft screws, allowing it to swing back and forth. The left cable ring 85 and right cable ring 86 are mounted to the cable tray 84 via threaded shaft screws, allowing them to rotate around an axis for opening and closing. The rings on both sides of the spring clip 87 fit over the protruding structures of the left cable ring 85 and right cable ring 86, limiting their opening and closing range through the spring force.

[0072] In this embodiment, the spring clip 87 is first removed, and the left and right cable collection rings 85 and 86 are opened to both sides by rotating the shaft to organize the lines below the laser head. Then, the left and right cable collection rings 85 and 86 are closed inward and the spring clip 87 is put on to organize the pipelines in the collection device and avoid interference or entanglement during the movement of the mechanism.

[0073] Work process

[0074] First, lower the temperature property test platform 14 and insert the light-blocking and heat-insulating backplate 17 into the slot. Fix the pre-experiment workpiece on the temperature property test platform 2 to prepare for the pre-experiment of the laser-assisted effect of the test material. Adjust the infrared temperature probe 18 in the temperature measuring device 11 to face the pre-experiment workpiece. After adjusting the distance of the clamping mechanism 45 by rotating the distance adjustment knob 55 in the integrated device 5 for workpiece center position recognition and laser pose control, use the clamping component 34 to fix the laser head and adjust the orientation of the industrial camera 83 to be roughly consistent with the direction of the laser emitted by the laser head. Then, use the manual adjustment function to adjust the position of the laser projection point to be near the workpiece, and then use the automatic adjustment mode to accurately adjust the position of the laser projection point before the pre-experiment can begin. After completing the preliminary experiment, remove the preliminary experimental workpiece, retract the temperature rise property test platform 2, install the experimental workpiece onto the vacuum chuck 13, adjust the infrared temperature probe 18 in the temperature measuring device 11 to face the formal experimental workpiece, then use the manual adjustment function again to adjust the position of the laser projection point to be near the workpiece on the vacuum chuck 13, and then use the automatic adjustment mode to accurately adjust the position of the laser projection point. Only then can the wafer laser-assisted self-rotation grinding experiment be carried out according to the experimental parameters designed based on the preliminary experimental results.

[0075] The foregoing has shown and described the basic principles, main features, and advantages of the present invention. Those skilled in the art should understand that the present invention is not limited to the above embodiments. The embodiments and descriptions in the specification are merely illustrative of the principles of the invention. Various changes and modifications can be made to the invention without departing from its spirit and scope, and all such changes and modifications fall within the scope of the present invention as claimed. The scope of protection of this invention is defined by the appended claims and their equivalents.

Claims

1. A wafer laser-assisted self-rotation grinding device based on an integrated structure of workpiece center position recognition and laser pose regulation, characterized in that: It includes a grinding processing component and a laser auxiliary component. The laser auxiliary component includes a protective component, a workpiece heating property testing platform (2), an integrated device for workpiece center position recognition and laser pose control (5), and a temperature measuring device (11). The protective component is set on the outside of the grinding processing component to achieve protection during the grinding process. The workpiece heating property testing platform (2) is set on one end of the front side inside the protective component and is rotatably connected to the protective component. The integrated device for workpiece center position recognition and laser pose control (5) is fixed to the top inside the protective component through a fixed suspension (6). The temperature measuring device (11) is fixed to the front side inside the protective component. The grinding assembly includes a workpiece moving stage (3), a spindle moving stage (8), a machine tool platform (10), a spindle and grinding wheel (12), and a vacuum chuck (13). The machine tool platform (10) is horizontally arranged. The spindle moving stage (8) is located on one side of the upper end face of the machine tool platform (10) and can move along the length of the machine tool platform (10). The workpiece moving stage (3) is located on the other side of the upper end face of the machine tool platform (10) and can move along the width of the machine tool platform (10). The spindle and grinding wheel (12) are located on the inner end of the spindle moving stage (8) to grind the workpiece. The vacuum chuck (13) is located on the inner end of the workpiece moving stage (3) to adsorb and fix the workpiece. The protective assembly includes a light-blocking shell (1), a front door (4) and a rear door (7). The light-blocking shell (1) is located above the machine tool platform (10). Doors are opened on both the front and rear sides of the light-blocking shell (1). The front door (4) is located on the outside of the front door and the rear door (7) is located on the outside of the rear door. The upper ends of the front door (4) and the rear door (7) are rotatably connected to the light-blocking shell (1). The workpiece heating property testing platform (2) includes a heating property testing platform (14), a wall support frame (15), a platform pivot (16), and a light-blocking and heat-insulating back plate (17). The heating property testing platform (14) is rotatably connected to the inner side of the light-blocking shell (1) through the platform pivot (16). The wall support frame (15) is fixedly connected to the bottom of the heating property testing platform (14). The light-blocking and heat-insulating back plate (17) is inserted into the top of the heating property testing platform (14) through a slot. 2.The wafer laser-assisted self-rotation lapping device based on the integrated structure of workpiece center position recognition and laser pose regulation according to claim 1, wherein: The temperature measuring device (11) includes an infrared temperature measuring probe (18), a secondary telescopic rod (19), a temperature measuring device base (20), a temperature measuring device turntable (21), a primary telescopic rod (22), a probe bracket (23), and a probe shaft (24). The temperature measuring device base (20) is fixedly connected to the machine tool platform (10). The lower fixed end of the temperature measuring device turntable (21) is fixedly connected to the temperature measuring device base (20). The primary telescopic rod (22) is vertically fixedly connected to the upper rotating end of the temperature measuring device turntable (21). The lower end of the secondary telescopic rod (19) is inserted into the inner side of the upper end of the primary telescopic rod (22) and is slidably connected along the height direction. The probe bracket (23) is rotatably connected to the upper end of the secondary telescopic rod (19) through the probe shaft (24). The infrared temperature measuring probe (18) is inserted into the probe bracket (23) and is locked and fixed by a tightening screw. 3.The wafer laser-assisted self-rotation lapping device based on the integrated structure of workpiece center position recognition and laser pose regulation according to claim 1, wherein: The integrated device (5) for workpiece center position recognition and laser pose control includes a wall-mounted bracket (25), a large arm rotating base (26), a large arm swing joint (28), a large arm servo motor (29), a large arm (30), a forearm (31), a forearm servo motor (32), a high-power laser head (33), a clamping assembly (34), a mechanism pitch servo motor (35), a wrist (36), and a wrist servo motor (37). The wall-mounted bracket (25) is fixed to a fixed suspension ( 6) The boom rotating base (26) is fixed to the wall-mounted bracket (25). The boom rotating base (26) has a built-in motor. The upper end of the boom rotating base (26) is fixed to the base box cover (27). The boom swing joint (28) is located above the base box cover (27) and is connected to the output shaft of the built-in motor through the base rotating shaft (38). The built-in motor can drive the boom swing joint (28) to rotate. The boom servo motor (29) is fixed to the boom swing joint (28). On one side, the rear end of the upper arm (30) is connected to the upper arm servo (29) via the upper arm pivot (42), and the upper arm servo (29) can drive the upper arm (30) to rotate. The forearm servo (32) is fixed to the front end of the upper arm (30). The rear end of the forearm (31) is connected to the forearm servo (32) via the forearm pivot (39), and the forearm servo (32) can drive the forearm (31) to rotate. The wrist servo (37) is fixed to the front end of the forearm (31), and the rear end of the wrist (36) is connected to the wrist servo (37) via the wrist pivot (42). The pivot (41) is connected to the wrist servo (37), which can drive the wrist (36) to rotate. The mechanism pitch servo (35) is fixed to the front end of the wrist (36) through the wrist servo connecting mechanism (40). The clamping assembly (34) is connected to the mechanism pitch servo (35) through the clamping assembly pivot (43), which can drive the clamping assembly (34) to rotate. The clamping assembly (34) clamps and fixes the head (33) of the high-power laser.

4. The wafer laser-assisted self-rotating grinding device based on an integrated structure of workpiece center position recognition and laser pose control according to claim 3, characterized in that: The clamping assembly (34) includes an adjustable pitch chassis (44), a vision module (46), a wire-gathering mechanism (47), and two clamping mechanisms (45). The rear end face of the adjustable pitch chassis (44) is fixedly connected to the rotating shaft (43) of the clamping assembly. The clamping mechanisms (45) are symmetrically arranged on both sides of the front end face of the adjustable pitch chassis (44) to clamp and fix the high-power laser head (33). The vision module (46) is fixedly connected to one side of the upper end of the adjustable pitch chassis (44). The wire-gathering mechanism (47) is located in the middle of the lower end of the adjustable pitch chassis (44) and can swing along the front and rear directions of the adjustable pitch chassis (44).

5. The wafer laser-assisted self-rotating grinding device based on an integrated structure of workpiece center position recognition and laser pose control according to claim 4, characterized in that: The distance between the two clamping mechanisms (45) can be adjusted by the adjustable pitch chassis (44).

6. The wafer laser-assisted self-rotating grinding device based on an integrated structure of workpiece center position recognition and laser pose control according to claim 4, characterized in that: The clamping mechanism (45) includes a jaw bearing support (49), a jaw shaft (69), a bird-shaped jaw (70), a crank (72), a clamp slider (73), a mirror clamp slider (74), a rocker arm (76), and a clamp pull rod (77). A clamping motor is fixedly connected to the inner side of the jaw seat (48). The pin on the lower side of the rear end face of the crank (72) passes through the crank shaft mounting hole (71) on the jaw seat (48) and is connected to the output shaft of the clamping motor. The clamping motor drives the crank (72) to rotate. One end of the rocker arm (76) is rotatably connected to the pin on the upper side of the front end face of the crank (72). The other end of the rocker arm (76) is connected to the upper part of the clamp pull rod (77) through the clamp cylindrical pin (75). The clamp slider (73) and the mirror clamp slider (74) are fixedly connected side by side to form a slider group. The slider group is set in the jaw seat (48) and can slide along the height direction of the jaw seat (48). The lower part of the clamp pull rod (77) is embedded in the upper part of the slider group. A jaw groove is opened on the inner end face of the slider group. The jaw bearing support (49) is fixed to the inner side of the jaw seat (48). The bird-shaped jaw (70) is rotatably connected to the jaw bearing support (49) through the jaw shaft (69). The clamping end of the bird-shaped jaw (70) is set facing inward. The tail end of the bird-shaped jaw (70) is set in the jaw groove, and the arc surface on the lower side of the tail end of the bird-shaped jaw (70) is in contact with the arc surface of the lower side wall of the jaw groove.

7. The wafer laser-assisted self-rotating grinding device based on an integrated structure of workpiece center position recognition and laser pose control according to claim 4, characterized in that: The cable management mechanism (47) includes a cable management bracket (84), a left cable management ring (85), a right cable management ring (86), and a spring clip (87). The upper end of the cable management bracket (84) is connected to the adjustable pitch chassis (44), and the cable management bracket (84) and the adjustable pitch chassis (44) can rotate relative to each other. The left cable management ring (85) and the right cable management ring (86) are both semi-circular rings. The openings of the left cable management ring (85) and the right cable management ring (86) are arranged opposite to each other. One end of the left cable management ring (85) and the right cable management ring (86) are respectively connected to the lower end of the cable management bracket (84), and the left cable management ring (85) and the right cable management ring (86) can rotate relative to each other with the cable management bracket (84). The other end of the left cable management ring (85) and the right cable management ring (86) is connected by the spring clip (87).

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