Method and system for preventing burning of infrared detector

Abstract

The invention relates to a method and system for preventing burning of an infrared detector, and the method comprises the steps: reading the data of the infrared detector, and obtaining pixel points in a continuous multi-frame image and monitoring points in a pixel dot matrix; judging the burning state of the infrared detector according to the monitoring points in the pixel dot matrix; and according to the burning state of the infrared detector, protecting the infrared detector according to preset anti-burning measures. According to the anti-burn method disclosed by the invention, the burn state of the detector can be detected in real time, the burn state and degree of the detector can be obtained, burn is actively blocked, the protection effect is good, and the detector can be protected for a long time until burn is finished.

Description

Technical Field

[0001] The present invention relates to the field of infrared detector detection technology, and in particular to a method and system for preventing infrared detectors from being burned. Background Art

[0002] Infrared detectors work based on the response characteristics of materials to infrared radiation. Observing high-temperature objects will cause burns to the infrared detectors. Existing technology generally prevents external detector burns by installing matching lens coatings, special glass, etc. on infrared detectors. Coating and special glass technology can reduce the intensity of sunlight passing through the lens, reduce the damage of sunlight to the detector, and provide short-term passive protection for the detector.

[0003] However, the effective protection time of lens coatings is very short, and they can only passively reduce the severity of burns. If strong light exposure exceeds the effective protection time, it will damage the detector, and the coating will affect lens performance such as light transmittance. Therefore, there is an urgent need for a method and system to prevent infrared detector burns, which can help detectors trigger active protection and prevent burns. Summary of the Invention

[0004] In view of the above problems, the present invention is proposed to provide a method and system for preventing infrared detectors from being burned, which overcomes the above problems or at least partially solves the above problems.

[0005] In order to solve the above technical problems, the embodiments of the present application disclose the following technical solutions:

[0006] In a first aspect, an embodiment of the present invention discloses a method for preventing burns of an infrared detector, comprising:

[0007] S100. Read the infrared detector data to obtain the pixels in the continuous multi-frame image and the monitoring points in the pixel matrix;

[0008] S200. Determine the burn status of the infrared detector according to the monitoring points in the pixel matrix;

[0009] S300. According to the burn status of the infrared detector, the infrared detector is protected according to preset burn prevention measures.

[0010] Furthermore, in S200, judging the burn status of the infrared detector according to the monitoring points in the pixel matrix includes:

[0011] S201. Traverse all monitoring points in the pixel matrix to determine whether there is a burn spot in the pixel matrix;

[0012] S202. When a burn spot exists in the pixel array, filtering out bad pixels according to the area of ​​the burn spot;

[0013] S203. If a burn spot exists in the pixel array of the consecutive multiple frames of images, obtain the coordinate position of the burn spot in the pixel array coordinate system of each frame of the image, and determine whether the burn spot is rapidly moving based on the coordinate position of the burn spot;

[0014] S204. Adjust the detector response rate gear to the detector detection gear, and determine the degree of burns by the infrared energy value X16;

[0015] S205. Determine the burn status of the infrared detector based on the determination result of the rapid movement of the burn spot at the same monitoring point in the pixel array and the burn degree.

[0016] Furthermore, in S201, traversing all monitoring points in the pixel matrix to determine whether there is a burn spot in the pixel matrix includes:

[0017] The pixel points in the pixel matrix are sampled, and the infrared energy value X16 of the sampling point is read. If the infrared energy value X16 of the sampling point is in a bias state, the sampling point is used as a monitoring point. If a plurality of consecutive pixel points in the vertical and horizontal directions centered on the monitoring point are in a bias state, the area composed of the plurality of consecutive pixel points in the vertical and horizontal directions centered on the monitoring point in the bias state is determined to be a burn spot.

[0018] Furthermore, in S202, when a burn spot exists in the pixel matrix, bad pixels are filtered out according to the area of ​​the burn spot. The specific method includes:

[0019] All burn spots are traversed, and if the area of ​​the current burn spot is smaller than a preset threshold, all pixels contained in the burn spot are determined to be bad pixels and filtered.

[0020] Furthermore, in S203, the rapid movement of the burn spot is determined based on the coordinate position of the burn spot, and the specific method includes:

[0021] Multiple frames of continuous pixel dot matrix data are detected within a test period of a preset length. If a burn spot exists in the multiple frames of continuous pixel dot matrix data, the coordinate position of the burn spot in each frame of pixel dot matrix data is obtained. If the coordinate position of the burn spot changes by more than a preset pixel point distance within the preset time length, it is determined that the burn spot is moving rapidly; otherwise, it is determined that the burn spot has not moved.

[0022] Furthermore, in S204, the detector response rate gear is adjusted to the detector detection gear, and the degree of burns is determined by the size of the infrared energy value X16. The specific method includes: adjusting the detector gear to the detector detection gear, the detector detection gear satisfies the zero bias state of the detector response rate to sunlight, obtaining the size of the detector infrared energy value X16, and judging the degree of burns of the detector according to the size of the infrared energy value X16. The degree of burns of the detector includes sun burns and flame burns.

[0023] Furthermore, in S205, the burn state of the current infrared detector is determined based on the rapid movement of the burn spot at the same monitoring point in the pixel array and the burn degree. The specific method includes:

[0024] If a burn spot exists at the same monitoring point in the pixel matrix for multiple consecutive frames and the burn spot does not move, the detector is determined to be burned. When the burn degree of the detector is continuously obtained, if the burn degree of the detector is only caused by sun burn, the burn state of the detector is determined to be strong burn; if the burn degree of the detector is only caused by flame burn, the burn state of the detector is determined to be weak burn; if the burn degree of the detector is caused by both sun burn and flame burn, the burn state of the detector is determined to be mixed strong burn.

[0025] Furthermore, in S300, based on the burn state of the infrared detector, the infrared detector is protected according to preset anti-burn measures, and the specific method includes: when the burn state of the infrared detector is severe burn, taking active anti-burn measures to protect the infrared detector; the active anti-burn measures include at least one of strong light blocking measures, strong light avoiding measures, shutter closing measures and viewing angle shifting measures; when the burn state of the infrared detector is mixed strong burn or weak burn, no active anti-burn measures are taken.

[0026] In a second aspect, an embodiment of the present invention discloses a system for preventing infrared detector burns, comprising: an infrared energy value acquisition unit, an infrared detector burn state judgment unit, and an infrared detector protection unit; wherein:

[0027] Infrared detector data acquisition unit, used to read infrared detector data, obtain pixel points in continuous multi-frame images and monitoring points in the pixel matrix;

[0028] an infrared detector burn state judgment unit, configured to judge the burn state of the infrared detector according to monitoring points in the pixel matrix;

[0029] The infrared detector protection unit is used to protect the infrared detector according to the burn state of the infrared detector and the preset anti-burn measures.

[0030] In a third aspect, an embodiment of the present invention discloses an electronic device, including:

[0031] one or more processors;

[0032] a memory for storing one or more programs;

[0033] When the one or more programs are executed by the one or more processors, the one or more processors implement the infrared detector anti-burning method.

[0034] The beneficial effects of the above technical solutions provided by the embodiments of the present invention include at least:

[0035] The present invention discloses a method for preventing infrared detector burns, comprising: reading infrared detector data to obtain pixel points in multiple consecutive image frames and monitoring points in a pixel matrix; determining the burn status of the infrared detector based on the monitoring points in the pixel matrix; and protecting the infrared detector according to preset burn prevention measures based on the burn status of the infrared detector. The burn prevention method disclosed in the present invention can detect the detector burn status in real time, determine the detector burn status and extent, actively block the burn, and provide effective protection, capable of long-term detector protection until the burn is resolved.

[0036] The technical solution of the present invention is further described in detail below through the accompanying drawings and embodiments. BRIEF DESCRIPTION OF THE DRAWINGS

[0037] The accompanying drawings are used to provide a further understanding of the present invention and constitute a part of the specification. Together with the embodiments of the present invention, they are used to explain the present invention and do not constitute a limitation of the present invention. In the accompanying drawings:

[0038] Figure 1 This is a flow chart of a method for preventing burns on infrared detectors in Example 1 of the present invention;

[0039] Figure 2 This is a schematic diagram of determining whether there are burn spots in the dot matrix in Example 1 of the present invention;

[0040] Figure 3 This is a structural diagram of a system for preventing infrared detector burns in Example 2 of the present invention;

[0041] Figure 4 This is a schematic structural diagram of an electronic device in Example 3 of the present invention. DETAILED DESCRIPTION

[0042] Exemplary embodiments of the present disclosure will be described in more detail below with reference to the accompanying drawings. Although exemplary embodiments of the present disclosure are shown in the accompanying drawings, it should be understood that the present disclosure can be implemented in various forms and should not be limited by the embodiments set forth herein. Rather, these embodiments are provided to enable a more thorough understanding of the present disclosure and to fully convey the scope of the present disclosure to those skilled in the art.

[0043] In order to solve the problems existing in the prior art, embodiments of the present invention provide a method and system for preventing burns of infrared detectors.

[0044] Example 1: The present invention discloses a method for preventing infrared detectors from being burned. Figure 1 ,include:

[0045] S100. Read infrared detector data to obtain pixel points in multiple consecutive frames of images and monitoring points in the pixel matrix; for example Figure 2 As shown, when sampling the pixel points in the pixel matrix, the infrared energy value X16 of the sampling point is read. Figure 2 The sampling point appears biased (i.e. Figure 2 The current sampling point is used as the current monitoring point. The infrared energy value X16 refers to the energy carried by the infrared radiation emitted by the object due to its temperature. In this embodiment, the infrared radiation intensity emitted by the object is measured using a non-contact device such as an infrared thermal imager to determine its surface temperature distribution, thereby reflecting the infrared energy value.

[0046] S200. Determine the burn status of the infrared detector based on the monitoring points in the pixel matrix; wherein the burn status of the infrared detector generally refers to the phenomenon that the detector performance is degraded or permanently damaged due to exposure to excessive infrared radiation (such as laser, high temperature heat source or direct sunlight).

[0047] In S200 of this embodiment, the burn status of the infrared detector is determined according to the monitoring points in the pixel matrix. The specific steps include:

[0048] S201. Traverse all monitoring points in the pixel matrix to determine whether there is a burn spot in the pixel matrix;

[0049] In S201 of some preferred embodiments, traversing all monitoring points in the pixel matrix to determine whether there is a burn spot in the pixel matrix includes:

[0050] The pixel points in the pixel matrix are sampled, and the infrared energy value X16 of the sampling point is read. If the infrared energy value X16 of the sampling point is in a bias state, the sampling point is used as a monitoring point. If a plurality of consecutive pixel points in the vertical and horizontal directions centered on the monitoring point are in a bias state, the area consisting of the plurality of consecutive pixel points in the vertical and horizontal directions in the bias state centered on the monitoring point is determined to be a burn spot.

[0051] For example Figure 2 As shown, the infrared energy value X16 is read from the 9 vertical and horizontal points centered on the monitoring point for judgment. If 5 consecutive points meet the conditions, the largest square formed by the horizontal and vertical monitoring points that meet the conditions will be used as the burn spot, as shown in the figure. Figure 2 The 5*5 square area in the figure corresponds to the burn spot.

[0052] S202. When a burn spot exists in the pixel array, bad pixels are filtered out based on the area of ​​the burn spot. In this embodiment, S202 of the present invention filters out bad pixels based on the area of ​​the burn spot. The specific method includes traversing all burn spots. If the area of ​​the current burn spot is less than a preset threshold, all pixels contained in the current burn spot are determined to be bad pixels and filtered out. Preferably, the size of the burn spot of a bad pixel is generally less than 5*5p. The bad pixels are screened based on the burn spot size, and smaller bad pixels and burn spots are filtered out, thereby eliminating the influence of bad pixels.

[0053] S203. If a burn spot exists in the pixel array of the consecutive multiple frames of images, obtain the coordinate position of the burn spot in the pixel array coordinate system of each frame of the image, and determine whether the burn spot is rapidly moving based on the coordinate position of the burn spot;

[0054] In S203 of this embodiment, the rapid movement of the burn spot is determined based on the coordinate position of the burn spot. The specific method includes:

[0055] Multiple frames of continuous pixel dot matrix data are detected within a test period of a preset length. If a burn spot exists in the multiple frames of continuous pixel dot matrix data, the coordinate position of the burn spot in each frame of pixel dot matrix data is obtained. If the coordinate position of the burn spot changes by more than a preset pixel point distance within the preset time length, it is determined that the burn spot is moving rapidly; otherwise, it is determined that the burn spot has not moved.

[0056] Specifically, a short-term burn does not significantly affect the detector. The duration of a single burn determination for an infrared detector is generally 100ms, as measured by actual testing. Multiple frames of dot matrix data are continuously detected within this 100ms test period. If a burn spot is present in multiple consecutive dot matrix frames, the coordinate position of the burn spot in the dot matrix coordinate system of each frame is obtained. If the coordinate position of the burn spot remains unchanged within 100ms, it is determined that the burn spot has not moved. If the coordinate position changes and the change exceeds the jitter error (typically 15 pixels), the burn spot is determined to be moving rapidly.

[0057] S204. Adjust the detector gear to the detector detection gear and determine the degree of burn based on the infrared energy value X16. In this embodiment, S204 adjusts the detector responsivity gear to the detector detection gear and determines the degree of burn based on the infrared energy value X16. The specific method includes: adjusting the detector gear to the detector detection gear that satisfies the zero-bias state of the detector responsivity to sunlight, obtaining the infrared energy value X16 of the detector, and determining the degree of burn based on the infrared energy value X16. The degree of burn includes both sun burn and flame burn. Specifically, experimental data shows that the infrared energy value X16 of the sun is much stronger than that of flame. The infrared energy value X16 of a 500-degree flame is generally detected as 11,000, while the infrared energy value X16 of the sun is generally detected as 14,765, a significant difference. By reading the detection value X16 of the pixels of the burn spot, it can be determined whether the burn spot on the detector is caused by flame or sun, thereby determining the degree of burn on the detector. Specifically, when the detector infrared energy X16 is below 11000, the current burn degree is flame burn; when the detector infrared energy X16 is above 14765, the current burn degree is sun burn; when the detector infrared energy X16 is between 11000-14765, the current burn degree is both sun burn and flame burn.

[0058] S205. Determine the burn status of the infrared detector based on the result of the rapid movement of the burn and the degree of the burn at the same monitoring point in the pixel array. In S205 of this embodiment, the burn status of the current infrared detector is determined based on the result of the rapid movement of the burn and the degree of the burn at the same monitoring point in the pixel array. The specific method includes: if a burn spot exists at the same monitoring point in the pixel array for multiple consecutive frames of pixel arrays and the burn spot does not move, then the detector is determined to be burned, and the degree of the detector burn is continuously obtained. If the detector burn degree only reflects sun burn, the detector burn state is determined to be strong burn; if the detector burn degree only reflects flame burn, the detector burn state is determined to be weak burn; if the detector burn degree reflects both sun burn and flame burn, the detector burn state is determined to be mixed strong burn.

[0059] Specifically, when the pixel point X16 of the burn spot in the detection file is read and it is found that the burn spot is only caused by sun burn, the burn state of the detector is strong burn; when the pixel point X16 of the burn spot in the detection file is read and it is found that the burn spot is caused by both sun burn and flame burn, the burn state of the detector is mixed strong burn; when the pixel point X16 of the burn spot in the detection file is read and it is found that the burn spot is only caused by flame burn, the burn state of the detector is weak burn.

[0060] S300. Protect the infrared detector according to the burn status of the infrared detector in accordance with preset anti-burn measures. The step of protecting the infrared detector according to the burn status of the infrared detector in accordance with preset anti-burn measures includes: when the burn status of the infrared detector is severe, taking active anti-burn measures to protect the infrared detector; the active anti-burn measures include at least one of strong light shielding measures, strong light avoidance measures, shutter closing measures, and viewing angle shifting measures; and when the burn status of the infrared detector is mixed severe burn or weak burn, not taking active anti-burn measures.

[0061] Specifically, strong light shielding measures directly block the path of strong light incidence through physical shielding means, reducing the light intensity on the detector surface and preventing local overheating or energy overload. A rotatable or retractable mechanical sunshade can be installed at the front end of the detector, and the shielding angle can be adjusted by motor or manual control. Electrochromic or liquid crystal filters can also be used to adjust the filter transmittance through voltage to achieve fast-response strong light attenuation. Strong light avoidance measures use spatial displacement or angle adjustment to enable the detector to actively avoid the direction of strong light sources and reduce direct light intensity. The detector can be installed on a turntable that can rotate horizontally / vertically, and the angle can be adjusted in real time through feedback from the light intensity sensor. Closed shutter measures control the opening and closing of the detector's photosensitive window through a mechanical shutter or an electronic shutter to block strong light incidence. Electromagnetic or piezoelectric ceramic driven leaf shutters can be used, and a virtual shutter effect can be achieved by adjusting the detector integration time or gain. It is suitable for CMOS / CCD type detectors. The perspective shifting measures can avoid looking directly at a strong light source for a long time by adjusting the detector's field of view or switching the observation target. A zoom or spectroscopic lens system can be designed to achieve polling observation of the target area by switching between different fields of view.

[0062] The burn prevention method disclosed in this embodiment can detect the burn status of the detector in real time, obtain the burn status and degree of the detector, actively block the burn, and has a good protection effect. It can protect the detector for a long time until the burn is over.

[0063] Example 2: Based on the same inventive concept, the present disclosure also provides a system for preventing infrared detectors from burning, such as Figure 3, including: an infrared energy value acquisition unit, an infrared detector burn state judgment unit and an infrared detector protection unit; wherein:

[0064] Infrared detector data acquisition unit, used to read infrared detector data, obtain pixel points in continuous multi-frame images and monitoring points in the pixel matrix;

[0065] an infrared detector burn state judgment unit, configured to judge the burn state of the infrared detector according to monitoring points in the pixel matrix;

[0066] The infrared detector protection unit is used to protect the infrared detector according to the burn state of the infrared detector and the preset anti-burn measures.

[0067] The specific working methods of the infrared detector data acquisition unit, the infrared detector burn state judgment unit and the infrared detector protection unit have been described in detail in Example 1 and will not be repeated in this embodiment.

[0068] Example 3: Based on the same inventive concept, the embodiment of the present disclosure also provides an electronic device. Figure 4 FIG. 1 is a schematic diagram of the structure of an electronic device according to an embodiment of the present disclosure. Figure 4 As shown, an embodiment of the present disclosure provides an electronic device comprising: one or more processors 101, a memory 102, and one or more I / O interfaces 103. The memory 102 stores one or more programs, and when the one or more programs are executed by the one or more processors, the one or more processors implement any of the optimization methods described in the above embodiments; the one or more I / O interfaces 103 are connected between the processor and the memory and are configured to implement information exchange between the processor and the memory.

[0069] Among them, the processor 101 is a device with data processing capabilities, including but not limited to a central processing unit (CPU); the memory 102 is a device with data storage capabilities, including but not limited to random access memory (RAM, more specifically such as SDRAM, DDR, etc.), read-only memory (ROM), electrically erasable programmable read-only memory (EEPROM), and flash memory (FLASH); the I / O interface (read-write interface) 103 is connected between the processor 101 and the memory 102, and can realize information interaction between the processor 101 and the memory 102, including but not limited to a data bus (Bus), etc.

[0070] In some embodiments, the processor 101 , the memory 102 , and the I / O interface 103 are connected to each other via a bus 104 , and further connected to other components of the computing device.

[0071] In some embodiments, the one or more processors 101 include a field programmable gate array.

[0072] According to an embodiment of the present disclosure, a computer-readable medium is further provided, wherein a computer program is stored on the computer-readable medium, wherein when the program is executed by a processor, the steps of any optimization method in the above-mentioned embodiment 1 are implemented.

[0073] It should be understood that the specific order or hierarchy of steps in the disclosed processes is an example of an exemplary method. Based on design preferences, it should be understood that the specific order or hierarchy of steps in the process can be rearranged without departing from the scope of the present disclosure. The accompanying method claims present elements of the various steps in an exemplary order and are not intended to be limited to the specific order or hierarchy described.

[0074] In the foregoing detailed description, various features are grouped together in a single embodiment to simplify the disclosure. This method of disclosure should not be interpreted as reflecting an intention that embodiments of the claimed subject matter require more features than are expressly recited in each claim. On the contrary, as reflected in the appended claims, the invention comprises less than all the features of any individual disclosed embodiment. The appended claims are therefore hereby expressly incorporated into the detailed description, with each claim standing on its own as a separate preferred embodiment of the invention.

[0075] Those skilled in the art will also appreciate that the various illustrative logic blocks, modules, circuits, and algorithmic steps described in conjunction with the embodiments herein may be implemented as electronic hardware, computer software, or a combination thereof. In order to clearly illustrate the interchangeability between hardware and software, the various illustrative components, blocks, modules, circuits, and steps described above are generally described around their functions. Whether such functions are implemented as hardware or software depends on the specific application and the design constraints imposed on the entire system. A skilled person may implement the described functions in an adaptable manner for each specific application, but such implementation decisions should not be interpreted as departing from the scope of protection of this disclosure.

[0076] The steps of the methods or algorithms described in conjunction with the embodiments herein may be directly embodied as hardware, software modules executed by a processor, or a combination thereof. The software module may be located in a RAM memory, flash memory, ROM memory, EPROM memory, EEPROM memory, register, hard disk, removable disk, CD-ROM, or any other form of storage medium well known in the art. An exemplary storage medium is connected to the processor so that the processor can read information from the storage medium and write information to the storage medium. Of course, the storage medium may also be an integral part of the processor. The processor and storage medium may be located in an ASIC. The ASIC may be located in a user terminal. Of course, the processor and storage medium may also be present in a user terminal as discrete components.

[0077] For software implementation, the techniques described in this application can be implemented using modules (e.g., procedures, functions, etc.) that perform the functions described in this application. These software codes can be stored in a memory unit and executed by a processor. The memory unit can be implemented within the processor or external to the processor. In the latter case, it is communicatively coupled to the processor via various means, which are well known in the art.

[0078] The foregoing description includes examples of one or more embodiments. Of course, it is not possible to describe all possible combinations of components or methods for the purposes of describing the above embodiments, but one of ordinary skill in the art will recognize that the various embodiments may be further combined and arranged. Therefore, the embodiments described herein are intended to encompass all such changes, modifications and variations that fall within the scope of the appended claims. Furthermore, to the extent the term "comprising" is used in the specification or claims, the term is intended to be encompassed in a manner similar to the term "including," as explained in terms of "including," used as a transitional word in the claims. Furthermore, any use of the term "or" in the specification of the claims is intended to mean a "non-exclusive or."

Claims

1. A method for preventing infrared detectors from burning, characterized in that: include: S100. Read the infrared detector data to obtain the pixels in the continuous multi-frame image and the monitoring points in the pixel matrix; S200. Determine the burn status of the infrared detector according to the monitoring points in the pixel matrix; S300. According to the burn status of the infrared detector, the infrared detector is protected according to preset burn prevention measures.

2. The method for preventing infrared detectors from being burned as claimed in claim 1, wherein: In S200, judging the burn status of the infrared detector according to the monitoring points in the pixel matrix includes: S201. Traverse all monitoring points in the pixel matrix to determine whether there is a burn spot in the pixel matrix; S202. When a burn spot exists in the pixel array, filtering out bad pixels according to the area of ​​the burn spot; S203. If a burn spot exists in the pixel array of the consecutive multiple frames of images, obtain the coordinate position of the burn spot in the pixel array coordinate system of each frame of the image, and determine whether the burn spot is rapidly moving based on the coordinate position of the burn spot; S204. Adjust the detector response rate gear to the detector detection gear, and determine the degree of burns by the infrared energy value X16; S205. Determine the burn status of the infrared detector based on the determination result of the rapid movement of the burn spot at the same monitoring point in the pixel array and the burn degree.

3. The method for preventing infrared detectors from being burned as claimed in claim 2, wherein: In S201, traversing all monitoring points in the pixel matrix to determine whether there is a burn spot in the pixel matrix includes: The pixel points in the pixel matrix are sampled, and the infrared energy value X16 of the sampling point is read. If the infrared energy value X16 of the sampling point is in a bias state, the sampling point is used as a monitoring point. If a plurality of consecutive pixel points in the vertical and horizontal directions centered on the monitoring point are in a bias state, the area composed of the plurality of consecutive pixel points in the vertical and horizontal directions centered on the monitoring point in the bias state is determined to be a burn spot.

4. The method for preventing infrared detectors from being burned as claimed in claim 2, wherein: In S202, when a burn spot exists in the pixel matrix, bad pixels are filtered out according to the area of ​​the burn spot. The specific method includes: All burn spots are traversed, and if the area of ​​the current burn spot is smaller than a preset threshold, all pixels contained in the burn spot are determined to be bad pixels and filtered.

5. The method for preventing infrared detectors from being burned as claimed in claim 2, wherein: In S203, the rapid movement of the burn spot is determined based on the coordinate position of the burn spot. The specific method includes: Multiple frames of continuous pixel dot matrix data are detected within a test period of a preset length. If a burn spot exists in the multiple frames of continuous pixel dot matrix data, the coordinate position of the burn spot in each frame of pixel dot matrix data is obtained. If the coordinate position of the burn spot changes by more than a preset pixel point distance within the preset time length, it is determined that the burn spot is moving rapidly; otherwise, it is determined that the burn spot has not moved.

6. The method for preventing infrared detectors from being burned as claimed in claim 5, characterized in that: In S204, the detector response rate gear is adjusted to the detector detection gear, and the degree of burns is determined by the size of the infrared energy value X16. The specific method includes: adjusting the detector gear to the detector detection gear, the detector detection gear satisfies the zero bias state of the detector response rate to sunlight, obtaining the size of the detector infrared energy value X16, and judging the degree of burns of the detector according to the size of the infrared energy value X16. The degree of burns of the detector includes sun burns and flame burns.

7. The method for preventing infrared detectors from being burned as claimed in claim 6, wherein: In S205, the burn state of the infrared detector is determined based on the determination result of the rapid movement of the burn spot at the same monitoring point in the pixel array and the burn degree. The specific method includes: If a burn spot exists at the same monitoring point in the pixel matrix for multiple consecutive frames and the burn spot does not move, the detector is determined to be burned and the degree of burn of the detector is continuously obtained. When the burn degree of the detector is only caused by sun burn, the burn state of the detector is determined to be strong burn; when the burn degree of the detector is only caused by flame burn, the burn state of the detector is determined to be weak burn; when the burn degree of the detector is caused by both sun burn and flame burn, the burn state of the detector is determined to be mixed strong burn.

8. The method for preventing infrared detectors from being burned as claimed in claim 7, wherein: In S300, the infrared detector is protected according to preset anti-burn measures based on the burn state of the infrared detector. The specific method includes: when the burn state of the infrared detector is severe burn, taking active anti-burn measures to protect the infrared detector; the active anti-burn measures include at least one of strong light blocking measures, strong light avoiding measures, shutter closing measures and viewing angle shifting measures; when the burn state of the infrared detector is mixed strong burn or weak burn, no active anti-burn measures are taken.

9. A system for preventing infrared detectors from burning, using the method for preventing burning according to any one of claims 1 to 8, characterized in that: include: Infrared detector data acquisition unit, infrared detector burn status judgment unit and infrared detector protection unit; wherein: Infrared detector data acquisition unit, used to read infrared detector data, obtain pixel points in continuous multi-frame images and monitoring points in the pixel matrix; an infrared detector burn state judgment unit, configured to judge the burn state of the infrared detector according to monitoring points in the pixel matrix; The infrared detector protection unit is used to protect the infrared detector according to the burn state of the infrared detector and the preset anti-burn measures.

10. An electronic device, characterized in that: include: one or more processors; a memory for storing one or more programs; When the one or more programs are executed by the one or more processors, the one or more processors implement the burn prevention method according to any one of claims 1 to 8.

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