A flow transfer device for chip testing

Abstract

The chip test flow transfer device provided by the application concentrates the feeding mechanism, the material collecting mechanism, the pre-warming mechanism, the tray temporary storage mechanism and the transfer station on the Y direction front side function area of the loading platform, and sets the overhead transfer mechanism above the function area to transfer the chips and the trays; sets the testing mechanism on the rear side function area, and sets the shuttle transfer mechanism which can be connected with the overhead transfer mechanism to realize the transmission of the chips before and after the testing. Only one overhead transfer mechanism and one shuttle transfer mechanism are needed to cooperate, and the full-process flow transfer of the chips and the trays can be realized, the mechanical structure of the three-temperature testing and sorting machine is greatly simplified, and the manufacturing cost is reduced. Meanwhile, the variable-distance chip taking and placing assembly is arranged on the overhead transfer mechanism, a plurality of chips can be transferred at the same time and the adaptive variable distance can be realized, and the double-layer tray is combined to switch and transfer the tested and tested chips, so that the transfer efficiency is high, and the testing efficiency of the chips is greatly improved.

Description

Technical Field

[0001] This invention relates to the field of chip testing, and more particularly to a transfer device for chip testing. Background Technology

[0002] Three-temperature testing and sorting machines are widely used in the chip manufacturing and testing fields. They simulate low temperature, room temperature and high temperature environments to perform performance testing and quality sorting on some high-performance chips (such as automotive-grade chips).

[0003] Due to limitations in the mechanical structure and conventional layout, the current three-temperature testing and sorting machine's transfer device has the following problems: Existing devices generally use separate loading and unloading components in different areas to load and unload chips, and use a separate set of material tray moving arms to transfer the trays, which has a high cost; the horizontal layout area is large, the transfer path is long, and the overall size of the equipment is large; there are many steps in connecting multiple sets of loading and unloading components, resulting in a low transfer rate.

[0004] In view of this, it is necessary to improve the existing chip testing transfer apparatus to solve the above problems. It should be noted that the above description of the background technology is only for the purpose of clearly and completely explaining the technical solutions of this application and facilitating understanding by those skilled in the art. It should not be assumed that these solutions are known to those skilled in the art simply because they have been described in the background technology section of this application. Summary of the Invention

[0005] The purpose of this invention is to disclose a transfer device for chip testing, which solves the problems of complex structure, low transfer efficiency and high cost of the transfer device of the existing three-temperature test sorting machine.

[0006] To achieve the above objectives, the present invention provides a transfer device for chip testing. This transfer device comprises several functional mechanisms and a transfer station located in the forward functional area of ​​a Y-shaped platform, a testing mechanism located in the rearward functional area of ​​the Y-shaped platform and directly behind the transfer station, and a shuttle transfer mechanism and an overhead transfer mechanism located on the platform.

[0007] The testing mechanism is equipped with a test base and a floating test module disposed above the test base. The floating test module is equipped with an adsorption component for adsorbing the chip.

[0008] The shuttle transfer mechanism has at least two layers of carrier trays, and the at least two layers of carrier trays are configured to reciprocate between the transfer station and the testing mechanism. The carrier trays are configured to carry chips and can pass through the test base and the floating test module.

[0009] The overhead transfer mechanism is equipped with a moving component, which is overhead above the Y-front functional area of ​​the platform and moves along the XY direction. The moving component is equipped with a tray picking and placing component that can be raised and lowered along the Z direction, at least two sets of chip picking and placing components that can be raised and lowered along the Z direction, and an X-direction slide rail. At least one set of chip picking and placing components is slidably connected to the X-direction slide rail. The sliding stroke of the chip picking and placing components on the X-direction slide rail is controlled to adjust the spacing between adjacent chip picking and placing components.

[0010] As a further improvement of the present invention, at least two of the carrier trays do not have overlapping areas in the Z direction. At the transfer station, the projections of at least two of the carrier trays on the XY plane do not have overlapping areas, and the height of the carrier tray located on the Y-front side is higher than the height of the carrier tray located on the Y-rear side.

[0011] As a further improvement of the present invention, the shuttle transfer mechanism is configured with a temperature control component connected to at least one layer of the carrier trays, and the carrier trays with the temperature control component configured are at a lower height in the Z direction than the carrier trays without the temperature control component configured.

[0012] As a further improvement of the present invention, the functional mechanism includes a pre-temperature mechanism. The pre-temperature mechanism, the shuttle transfer mechanism, and the floating test module are all equipped with temperature control components for temperature control, so that the chip under test, which has been pre-temperatured by the pre-temperature mechanism, maintains a constant temperature during the process of being transferred to the test socket through the carrier and the floating test module for testing.

[0013] As a further improvement of the present invention, the transfer device is equipped with a height measuring sensor assembly, which is located on the Y-front side of the testing mechanism, and the height of the bottom end face of the height measuring sensor assembly is higher than the height of the top end face of the uppermost carrier plate.

[0014] As a further improvement of the present invention, the functional mechanism includes a feeding mechanism, a receiving mechanism, and a preheating mechanism. The feeding mechanism and the receiving mechanism are configured with a tray for batch carrying chips, and the tray is provided with a plurality of first receiving slots for accommodating chips. The preheating mechanism is configured with a temperature-adjustable preheating plate, and the preheating plate is provided with a plurality of second receiving slots for accommodating chips. The carrier tray is provided with a plurality of third receiving slots for accommodating chips.

[0015] The spacing along the X-direction between adjacent chip pick-and-place components changes as the moving component drives the components to move to the tray, the preheating tray, or the carrier tray, corresponding to the spacing between adjacent first receiving slots, adjacent second receiving slots, or adjacent third receiving slots.

[0016] As a further improvement of the present invention, the functional mechanism further includes a material tray temporary storage mechanism. The feeding mechanism and the receiving mechanism are arranged in sequence along the Y-direction, while the preheating mechanism, the transfer station and the material tray temporary storage mechanism are arranged in sequence along the X-direction, and the material tray picking and placing component is configured to transfer the material tray according to a preset material tray flow path.

[0017] As a further improvement of the present invention, the functional mechanism includes a feeding mechanism and a receiving mechanism. The feeding mechanism and the receiving mechanism are each provided with a hopper for accommodating the material tray, a lifting mechanism located below the hopper for driving the material tray to move up and down, and a positioning component for positioning when the topmost material tray is lifted to a preset position.

[0018] The positioning component includes support members disposed on both sides of the top of the hopper in the X direction, an end positioning member disposed on the front end of the hopper in the Y direction, and / or a side positioning member disposed on one side of the hopper in the X direction.

[0019] As a further improvement of the present invention, the overhead transfer mechanism is configured with an XY-axis guide frame, the XY-axis guide frame including a Y-axis guide assembly disposed on the platform and an X-axis guide assembly overhead connected to the Y-axis guide assembly, the moving assembly being disposed on the X-axis guide assembly; the X-axis guide assembly is configured with a vacuum generator, the chip picking and placing assembly and the tray picking and placing assembly are both configured with an adsorption module and a Z-axis drive assembly for driving the adsorption module to move up and down along the Z-axis, and the vacuum generator provides a vacuum source for adsorption to the adsorption module.

[0020] As a further improvement of the present invention, the chip pick-and-place assembly is configured with a first adsorption module and a first Z-axis driving assembly. The first adsorption module includes a suction rod, an adapter disposed at the upper end of the suction rod, and a suction nozzle disposed at the lower end of the suction rod. The suction rod is connected to the vacuum generator through the adapter via a vacuum tube. The first Z-axis driving assembly includes a first power source, a first belt drive assembly driven by the first power source, and a first sliding assembly driven by the first belt drive assembly. The suction rod is linked to the first sliding assembly. Both the first belt drive assembly and the first sliding assembly extend along the Z-axis.

[0021] The material tray loading and unloading assembly is configured with a second adsorption module and a second Z-axis driving assembly. The second Z-axis driving assembly includes a second power source and a second sliding assembly driven by the second power source. The second sliding assembly is linked to the second adsorption module and extends along the Z-axis. The central area of ​​the material tray is provided with an adsorption part for the second adsorption module to position and adsorb.

[0022] Compared with the prior art, the beneficial effects of the present invention are:

[0023] The chip testing transfer device provided by this invention centrally arranges the feeding mechanism, receiving mechanism, preheating mechanism, tray storage mechanism, and transfer station in the Y-front functional area of ​​the platform. An overhead transfer mechanism is positioned above the Y-front functional area to transfer chips and trays. The testing mechanism is located in the rear functional area and directly behind the transfer station. At least two layers of trays, capable of interfacing with the overhead transfer mechanism, shuttle between the transfer station and the testing mechanism to achieve chip transfer before and after testing, resulting in high transfer efficiency. A variable-pitch chip pick-and-place component and a tray pick-and-place component are integrated into the moving component of the overhead transfer mechanism. This allows for the simultaneous transfer of multiple chips with adaptive pitch adjustment for trays, preheating trays, and carrier trays with different chip placement slots, and timely transfer of empty trays using a single moving component.

[0024] The transfer device has a compact horizontal layout and requires only one overhead transfer mechanism and one shuttle transfer mechanism to achieve the entire process of chip and material tray transfer during chip testing. This greatly simplifies the mechanical structure of the three-temperature test sorting machine and reduces the cost. In addition, the overhead transfer mechanism and the shuttle transfer mechanism have short travel distances, which saves transfer time and thus greatly improves the chip testing efficiency. Attached Figure Description

[0025] Figure 1 This is a schematic diagram of the layout of a chip testing transfer device provided by the present invention;

[0026] Figure 2 A three-dimensional structural schematic diagram of a chip testing transfer device provided by the present invention;

[0027] Figure 3 for Figure 2 A three-dimensional structural diagram of the flow device shown from another angle;

[0028] Figure 4 A three-dimensional structural diagram of a feeding mechanism and a receiving mechanism provided by the present invention;

[0029] Figure 5 A three-dimensional structural schematic diagram of an overhead transfer mechanism provided by the present invention;

[0030] Figure 6 This is a three-dimensional structural diagram of the second moving component in the overhead transfer mechanism provided by the present invention;

[0031] Figure 7 This is a top view schematic diagram of a material tray structure;

[0032] Figure 8 This is a schematic diagram of a preheating mechanism;

[0033] Figure 9 is Figure 3 an enlarged schematic view of the shuttle transfer mechanism in

[0034] Figure 10 This is a side view schematic diagram of the configuration of the trays when a shuttle transfer mechanism provided by the present invention uses two trays as an example, at the transfer station and the test station. Specific embodiments

[0035] The following will describe the present application in detail in conjunction with the embodiments shown in the drawings. It should be noted that these embodiments are not limitations on the present application, and any equivalent transformation or substitution in terms of function, method, or structure made by those of ordinary skill in the art based on these embodiments shall fall within the protection scope of the present application.

[0036] In conjunction with Figures 1 to 7 , the present application provides a transfer device 100 for chip testing, which is applicable to a three-temperature test sorter. Through the transfer of chips on the transfer device 100, the chips are preheated, tested, screened, and classified. In the three-dimensional coordinate system involved in the drawings, the direction where the X-axis is located corresponds to the horizontal transverse direction of this embodiment, the direction where the Y-axis is located corresponds to the horizontal longitudinal direction of this embodiment, and the direction where the Z-axis is located corresponds to the vertical direction, that is, the height direction, in this embodiment.

[0037] As Figures 1 to 3 shown, the transfer device 100 is configured with a first functional area, a second functional area, and a third functional area arranged in sequence along the Y direction. The first functional area is arranged with a feeding station for chip loading and at least two receiving stations for chip unloading in sequence along the X direction. The second functional area is arranged with a preheating station for chip preheating, a transfer station for chip transfer before and after testing, and a temporary storage station for temporarily storing trays in sequence along the X direction. The third functional area is arranged with a testing station for testing chips. [[ID=!]]

[0038] A feeding mechanism 10 is provided at the feeding station, a preheating mechanism 20 is provided at the preheating station, a testing mechanism 3 is provided at the testing station, a tray temporary storage mechanism 40 is provided at the temporary storage station, and a receiving mechanism 50 is provided at the receiving station.

[0039] It should be noted that there seems to be a small error in the original text where it says "a testing mechanism 3" instead of "a testing mechanism 30" in line 26. The above translation is based on the corrected content.In this embodiment, due to the influence of the mechanical mechanism, the feeding mechanism 10, receiving mechanism 50, preheating mechanism 20, and tray temporary storage mechanism 40 have a relatively low height in the Z-direction, while the testing mechanism 30 has a relatively high height in the Z-direction, and it is impossible to pick up or place chips from above the testing mechanism 30. In order to arrange the functional areas reasonably and compactly as much as possible, and to achieve the transfer of chips (not shown) and trays 80 between multiple stations with as few transfer mechanisms as possible, the transfer device 100 provided in this application sets the transfer station between the preheating station and the temporary storage station in the second functional area, and the testing station is set directly behind the transfer station along the Y-direction. Thus, the reciprocating transfer of chips between the transfer station and the testing station can be achieved by setting only one shuttle transfer mechanism 60, and the shuttle transfer mechanism 60 is also configured to have a relatively low height in the Z-direction. Furthermore, by simply setting up an overhead transfer mechanism 70 with a gantry structure, chips and material trays 80 can be efficiently transferred between the feeding mechanism 10, the preheating mechanism 20, the shuttle transfer mechanism 60, the material tray temporary storage mechanism 40, and the receiving mechanism 50.

[0040] In one embodiment, the functional mechanisms on the feeding station, receiving station, preheating station, transfer station, testing station, and temporary storage station, as well as the overhead transfer mechanism 70 and shuttle transfer mechanism 60, can be arranged on the same platform.

[0041] In another embodiment, for example, since lifting mechanisms 12 are provided below both the feeding mechanism 10 and the receiving mechanism 50, the relative height of the feeding mechanism 10 and the receiving mechanism 50 is relatively high. In order to reduce the Z-axis displacement of the overhead transfer mechanism 70 during the transfer process, two platforms with a height difference on the front and rear sides can be provided to reduce the relative height difference between the feeding mechanism 10 and the receiving mechanism 50 and the preheating, shuttle transfer mechanism 60 and the material tray temporary storage mechanism 40. Specifically, see... Figure 2 As shown, a first platform 110 is provided in the front area and a second platform 120 is provided in the rear area. The height of the first platform 110 in the Z-direction is lower than the height of the second platform 120 in the Z-direction. The first platform 110 is used to realize the arrangement of the workstations and their functional mechanisms in the first functional area, and the second platform 120 is used to realize the arrangement of the workstations and their functional mechanisms in the second functional area.

[0042] Combination Figures 2 to 4 As shown, both the feeding mechanism 10 and the receiving mechanism 50 are equipped with a hopper for placing the material tray 80. The hopper of the feeding mechanism 10 is defined as the feeding hopper 101, and the hopper of the receiving mechanism 50 is defined as the receiving hopper 501.

[0043] Before the transfer device 100 operates, trays 80 carrying the chips to be tested are placed in the feeding bin 101 in advance. When loading, it is preferred to stack multiple trays 80 to reduce the number of loading and unloading times. Only one empty tray 80 needs to be placed in the receiving bin 501 in advance. During operation, when the chips on the tray 80 in the receiving bin 501 are full, an empty tray 80 is replenished through the transfer device 100, and the replenished empty tray 80 is stacked on the upper layer of the full tray 80.

[0044] In one embodiment, the transfer device 100 is further configured with a plurality of lifting mechanisms 12 for driving the trays 80 in the bins of the feeding mechanism 10 and the receiving mechanism 50 to lift. The plurality of lifting mechanisms 12 are respectively arranged below the feeding bin 101 and the receiving bin 501. The lifting mechanism 12 arranged below the feeding mechanism 10 can push the entire stack of trays 80 upward from the bottommost tray 80 to push the topmost tray 80 to a preset height; the lifting mechanism 12 arranged below the feeding mechanism 10 can support the entire stack of trays 80 from the bottommost tray 80 and lower the topmost tray 80 to a preset height. For example, the lifting mechanism 12 is configured with a lifting plate 121 that can lift along the Z direction. The lifting plate 121 can penetrate the bottom of the feeding bin 101 or the receiving bin 501, and the bottommost tray 80 is placed on the upper end surface of the lifting plate 121 to lift the entire stack of trays 80 through the lifting plate.

[0045] Both the feeding mechanism 10 and the receiving mechanism 50 are provided with positioning components 13 for supporting and positioning when the topmost tray 80 is lifted to a preset position, so as to be applicable to trays 80 of various specifications and have high positioning stability. In one embodiment, the positioning component 13 includes a plurality of support members 131 arranged on both sides in the X direction at the top of the bin and an end positioning member 132 arranged at the front end in the Y direction of the bin. Among them, the support members 131 are used to support the topmost tray 80, and the end positioning member 132 can move relatively along the Y direction to move away from or close to the end of the tray 80. Further, the positioning component 13 can also be provided with a side positioning member 133 on one side in the X direction of the bin, and the side positioning member 133 can move relatively along the X direction to move away from or close to the side of the tray 80.

[0046] The transfer device 100 is configured with at least two receiving stations, that is, at least two receiving mechanisms 50 are configured. For example, in one embodiment, the transfer device 100 is configured with three receiving mechanisms 50. Among them, the first receiving mechanism 51 is used to receive the chips that pass the inspection, the second receiving mechanism 52 is used to receive the chips that fail the inspection, and the third receiving mechanism 53 is used as a backup. For example, the third receiving mechanism 53 can cooperate with the first receiving mechanism 51 to jointly receive the qualified chips.

[0047] See Figure 7As shown, the tray 80 is used to carry chips in batches. The tray 80 is equipped with a plurality of first receiving slots 811 for accommodating the chips, and the first receiving slots 811 are arranged in an array along the X and Y directions. For trays 80 of the same specifications, the size of the first receiving slots 811 is preferably the same to carry chips matching the size of the first receiving slots 811 in batches. The spacing between adjacent first receiving slots 811 is also preferably the same to facilitate batch loading, unloading, and transfer of chips. The first receiving slot 811 has an annular first positioning structure 812 for positioning the chips. Furthermore, the central region of the tray 80 is also equipped with an adsorption part 821, for example, formed by an annular second positioning structure 822, for positioning the tray 80 when the overhead transfer mechanism 70 adsorbs the chips.

[0048] Combination Figure 2 , Figure 3 and Figure 8 As shown, the preheating mechanism 20 is equipped with a preheating plate 21, a first fixing seat 22 for placing the preheating plate 21, and a first temperature control component for controlling the temperature of the preheating plate 21. The first temperature control component includes a first cooling unit 24 for cooling the preheating plate 21 and a first heating unit 23 for heating the preheating plate 21. When performing low-temperature testing on the chip, the first cooling unit 24 cools the preheating plate 21 to provide a low-temperature environment (generally below 0°C) for the chip placed on the preheating plate 21; when performing high-temperature testing on the chip, the first heating unit 23 heats the preheating plate 21 to provide a high-temperature environment (generally above room temperature by 25°C) for the chip placed on the preheating plate 21.

[0049] In one embodiment, the first refrigeration unit 24, the first heating unit 23, and the preheating plate 21 are stacked from bottom to top along the Z-direction, wherein the first refrigeration unit 24 is fixedly mounted on the first fixed base 22. The first refrigeration unit 24 has a refrigeration channel for refrigerant circulation, and the input and output ports of the refrigeration channel are connected to the refrigeration system, which provides refrigerant at a preset temperature. The first heating unit 23 includes a heating plate and several sets of resistance wires evenly arranged on the heating plate. Positioning the first heating unit 23 above the first refrigeration unit 24, i.e., closer to the preheating plate 21, allows for better temperature control of the preheating plate 21. For example, if the preset preheating temperature is -40°C, and the temperature of the previous test is -45°C, the heating plate can directly heat the preheating plate 21 to -40°C, resulting in a faster temperature control rate compared to adjusting the temperature of the refrigerant in the first refrigeration unit 24.

[0050] The preheating tray 21 is provided with a plurality of second receiving slots 211 for accommodating chips, and the second receiving slots 211 are arranged in an array along the X and Y directions. For preheating trays 21 of the same specification, the size of the second receiving slots 211 is preferably the same, so as to preheat chips of the same size as the second receiving slots 211 in batches. The spacing between adjacent second receiving slots 211 is also preferably the same, so as to facilitate positioning calculations when transferring chips.

[0051] In order to enable the transfer device 100 to be applied to the testing of chips of various sizes, in one embodiment, the preheating plate 21 is detachable from the first fixed base 22 so that different sizes of preheating plates 21 are used for preheating according to different chip sizes.

[0052] Combination Figure 1 , Figure 3 , Figure 9 and Figure 10 As shown, the shuttle transfer mechanism 60 includes a first moving component 602 disposed on the Y-guide rail assembly 601. The first moving component 602 is configured to reciprocate between the transfer station and the testing station. The first moving component 602 is configured with at least two layers of carrier trays 61, and the at least two layers of carrier trays 61 do not overlap in the Z-direction to avoid interference between the carrier trays 61 during reciprocating movement. At least one carrier tray 61 is used to place the chip under test, which refers to the chip that has been preheated from the preheating tray 21 and transferred to the first moving component 602 and further transferred to the testing mechanism 30 for testing; at least one carrier tray 61 is used to place the tested chip, which refers to the chip that has been tested from the testing mechanism 30 and transferred to the first moving component 602 and further transferred to the receiving mechanism 50 for receiving.

[0053] The upper surface of the carrier 61 is recessed with a third receiving groove 610 for accommodating the chip. Multiple third receiving grooves 610 can be arranged along the X direction or in multiple rows along the Y direction. To facilitate the measurement of the height of the carrier 61 and the height and flatness of the chip placement, preferably, multiple height sensors 302 are fixed to the Y-front side of the bracket 301 located in the test mechanism 30. The height sensors 302 can move along the Y direction. During the debugging stage, the carrier 61 is moved to the Y-front side of the bracket 301, and the position of the height sensors 302 is adjusted laterally to measure the relative height of the carrier 61 and the relative height of the third receiving groove 610 before and after the chip is placed. The test data is then transmitted to the controller.

[0054] In one embodiment, the first moving component 602 is configured with a base (not shown) for fixing the tray 61 and driving the tray 61 to slide. The base is slidably connected to the Y-guide rail assembly 601. For trays 61 of the same specification, the size and spacing of the third receiving slots 610 are preferably the same. To enable the transfer device 100 to be applied to the testing of chips of various sizes, the tray 61 is preferably configured to be detachable from the base so that different sized trays 61 can be used to support chips of different specifications.

[0055] To prevent excessive temperature loss during the transfer of the pre-warmed chip from the carrier 61 to the testing station, in one embodiment, the first moving component 602 is further configured with a second temperature control component (not shown) for temperature compensation of the carrier 61. The second temperature control component includes a second cooling unit and a second heating unit. During low-temperature testing of the chip, the second cooling unit provides the chip placed on the carrier 61 with the same low temperature as the pre-warming tray 21, ensuring a constant low temperature during the transfer of the chip from the carrier 61 to the testing station. During high-temperature testing of the chip, the second heating unit provides the chip placed on the carrier 61 with the same high temperature as the pre-warming tray 21, ensuring a constant high temperature during the transfer of the chip from the carrier 61 to the testing station.

[0056] At the transfer station, the projections of at least two layers of carrier trays 61 on the XY plane do not overlap. The height of the carrier tray 61 located on the Y-front side is higher than the height of the carrier tray located on the Y-rear side, thus avoiding interference with the overhead transfer mechanism 70 during transfer at the transfer station. Furthermore, the lower layer carrier tray 61 is configured to receive the chip under test preheated by the preheating tray 21, and the higher layer carrier tray 61 is configured to receive the chip already tested. When the chip already tested is removed, the overhead transfer mechanism 70 has a relatively short docking stroke with the higher layer carrier tray 61. The second temperature control component (not shown) only needs to be set below the lower layer carrier tray 61 that carries the chip under test, and its structural setting is the same as that of the first temperature control component below the preheating tray 21.

[0057] Specifically, for example, combining Figure 9 and Figure 10The diagram illustrates a setup with two layers of carrier trays 61. At the transfer station, the tray 61 with the lower height is positioned rearward in the Y-direction and is defined as the lower carrier tray 611. The tray 61 with the higher height is positioned forward in the Y-direction and is defined as the upper carrier tray 612. The lower carrier tray 611 is mounted on a first base 6110, and the upper carrier tray 612 is mounted on a second base 6120. A Y-guide rail assembly 601 configures the first Y-guide rail 6011 and the second Y-guide rail 6012. The first base 6110 is slidably connected to the first Y-guide rail 6011, the second Y-guide rail 6012 is fixed to the first base 6110, and the second base 6120 is slidably connected to the second Y-guide rail 6011. Two independent drive mechanisms drive the displacement strokes of the first base 6110 and the second base 6120 respectively, thereby controlling the reciprocating movement of the lower carrier tray 611 and the upper carrier tray 612 between the transfer station and the testing station according to a preset travel distance.

[0058] In other alternative embodiments, the first moving component 602 may also be configured with three or more carrier disks 61, and the switching method for moving among the multiple carrier disks 61 may be configured as needed.

[0059] Combination Figures 1 to 3 As shown, the testing mechanism 30 includes a test base 31 and a floating test module 32 located above the test base 31. The test base 31 is connected to a testing device (not shown) and is used to perform chip testing and verification. During chip testing, the floating test module 32 is pressed against the test base 31 to hold the chip between the lower end face of the floating test module 32 and the test base 31, providing a certain pressure to the chip under test to ensure the stability of the test and the reliability of the data. The floating test module 32 is fixed to the bracket 301. Due to the need for the floating test module 32 to be suspended above the test base 31 along the Z-axis and to move up and down via a Z-axis guide rail, the testing mechanism 30 has a relatively high height along the Z-axis.

[0060] The floating test module 32 is equipped with an adsorption component (not shown) for adsorbing chips. After a batch of chips is tested, the first moving component 602 is moved between the test holder 31 and the floating test module 32. The adsorption component first adsorbs the tested chips on the test holder 31 into the third receiving slot 610 of the carrier 61. Then, the adsorption component adsorbs the chip to be tested in another third receiving slot 610 on the carrier 61 onto the test holder 31. At the same time, it provides a stable holding force for the chip when it is tested on the test holder 31.

[0061] In the above-described embodiment with a double-layer carrier, the coordination between the upper carrier 612 and the lower carrier 611 for chip testing transfer can be achieved, for example, in the following manner: When a batch of chips is being tested, the chip to be tested on the feed tray 80 in the feeding mechanism 10 is transferred to the preheating tray 21 by the chip pick-and-place assembly 71. Then, the chip to be tested, after being preheated by the preheating tray 21, is transferred to the lower carrier 611 by the chip pick-and-place assembly 71. The lower carrier 611 carrying the chip to be tested and the empty upper carrier 612 are both moved backward along the Y direction to a position close to the test holder 31. After the batch of chips is tested, the adsorption component of the floating test module 32 first adsorbs the tested chip on the test holder 31, and then drives the upper carrier 612 and the lower carrier 611 to move in a stacked manner. The device moves between the test stand 31 and the floating test module 32. The floating test module 32 uses its suction device to place the chip under test on the test stand 31 into the third receiving slot 610 of the upper carrier 612. The upper carrier 612 moves backward along the Y direction to the initial position of its transfer station. The floating test module 32 suctions the chip under test from the third receiving slot 610 of the lower carrier 611 into the test stand 31. The lower carrier 611 moves forward along the Y direction and resets to the initial position of its transfer station. The chip pick-and-place component 71 transfers the chip under test on the upper carrier 612 to the corresponding receiving hopper 501 tray 80 according to the test results. This constitutes one movement cycle of the shuttle transfer mechanism 60 moving between the transfer station and the test station to transfer the chip under test and the chip under test.

[0062] After the lower carrier 611 and the upper carrier 612 are reset to the transfer station, the chip pick-and-place component 71 transfers the tested chips on the upper carrier 612 to the corresponding receiving tray 80 of the receiving hopper 501 according to the test results. Then, the next batch of chips to be tested after preheating is transferred from the preheating tray 21 to the lower carrier 611.

[0063] In one embodiment, the floating test module 32 is further configured with a third temperature control component (not shown) for temperature control of the adsorbent. The third temperature control component includes a third cooling unit and a third heating unit. During testing, the floating test module 32 is pressed against the upper surface of the chip. When performing low-temperature testing on the chip, the third cooling unit controls the low-temperature of the adsorbent to provide the chip with a low temperature matching the preset low-temperature test conditions. When performing high-temperature testing on the chip, the third heating unit controls the high-temperature of the floating test module 32 to provide the chip with a high temperature matching the preset high-temperature test conditions. The third temperature control component is disposed above the adsorbent, and its structural configuration is similar to that of the first temperature control component below the temperature plate 21, including a configuration where the third heating unit is closer to the adsorbent than the third cooling unit.

[0064] Combination Figures 1 to 6As shown, the overhead transfer mechanism 70 includes an XY-axis guide frame and a second moving component 701 mounted on the XY-axis guide frame. In one embodiment, the XY-axis guide frame adopts a gantry structure, with an X-axis guide component 702 and a Y-axis guide component 703 mounted at at least one end of the X-axis guide component 702. The XY-axis guide frame enables the second moving component 701 to move above the feeding mechanism 10, the preheating mechanism 20, the shuttle transfer mechanism 60, the tray temporary storage mechanism 40, and the receiving mechanism 50, and to be positioned directly above the adsorption portion 821 of the chip to be tested or the tray to be retrieved 80. Further, the second moving component 701 is equipped with a chip pick-and-place component 71 and a tray pick-and-place component 72, which move along the Z-axis to pick up and place the chip and the tray 80 respectively.

[0065] It should be noted that the picking and placing of the material tray 80 mentioned in this embodiment refers to the picking and placing of empty material trays 80. After all the chips on the uppermost material tray 80 of the material supply hopper 101 have been tested and transferred to the receiving mechanism 50, the material tray picking and placing component 72 transfers the hole material tray 80 to the material tray temporary storage mechanism 40; when the uppermost material tray 80 of any receiving hopper 501 in the receiving mechanism 50 is full of tested chips, the empty material tray 80 on the material tray temporary storage mechanism 40 is transferred to the top layer of that hopper 11 by the material tray picking and placing component 72. (See reference...) Figure 2 and Figure 3 As shown, in one embodiment, the material tray temporary storage mechanism 40 includes a third fixed seat (not shown) for placing an empty material tray 80, and a limiting structure (not shown) for limiting the empty material tray 80 is provided on the third fixed seat.

[0066] The second moving component 701 is configured with a first substrate 73 slidably connected to the X-axis guide component 702 and a vacuum generator 74 disposed on the first substrate 73. The chip picking and placing component 71 and the tray picking and placing component 72 are both configured with an adsorption module and a Z-axis driving component for driving the adsorption module to move up and down along the Z-axis, and the vacuum generator 74 provides a vacuum source for adsorption to the adsorption module.

[0067] Combination Figure 5 and Figure 6 As shown, the chip pick-and-place assembly 71 is configured with a first adsorption module 711 and a first Z-direction drive assembly for driving the first adsorption module 711 to move along the Z-direction.

[0068] The first adsorption module 711 includes a suction rod 7111, an adapter 7112 disposed at the upper end of the suction rod 7111, and a suction nozzle 7113 disposed at the lower end of the suction rod 7111. The suction rod 7111 is connected to the vacuum generator 74 through the adapter 7112 via a vacuum tube.

[0069] In one embodiment, a first Z-axis driving assembly is configured with a first connecting seat 712 fixed to a first base plate 73, a first power source 713 fixed to the first connecting seat 712, and a first Z-axis transmission assembly 714. The first Z-axis transmission assembly is driveably connected between the first power source 713 and the first adsorption module 711, wherein the first Z-axis transmission assembly is driven by a first belt assembly 714 to drive a first sliding assembly 715. The first belt assembly 714 includes a first main pulley 7141, a first belt 7142, and a first driven pulley 7143. The first sliding assembly 715 includes a first adapter block 7151 and a first slide rod 7152 for connecting the first adapter block 7151 and the suction rod 7111. The first slide rod 7152 is slidably connected to the first connecting seat 712 along the Z-axis.

[0070] The first power source 713 drives the first adapter block 7151 to reciprocate up and down along the Z-axis via the first main pulley 7141, the first belt 7142 and the first slave pulley 7143, and simultaneously drives the suction nozzle 7113 to reciprocate up and down along the Z-axis via the first sliding component 715.

[0071] In one embodiment, at least two chip pick-and-place components 71 are disposed on the second moving component 701 to simultaneously pick up at least two chips. Since the spacing between adjacent first receiving slots 811 on the tray 80, the spacing between adjacent second receiving slots 211 on the preheating tray 21, and the spacing between adjacent third receiving slots 610 on the carrier tray 61 are not equal in most cases, if it is necessary to simultaneously transfer at least two chips between the tray 80, the preheating tray 21, the lower carrier tray 611, and the upper carrier tray 612 using at least two chip pick-and-place components 71, the relative distance between the at least two chip pick-and-place components 71 along the X-direction needs to be variable during the transfer process.

[0072] Therefore, the second moving component 701 is further configured with an X-axis sliding component 75. The X-axis guide rail 751 of the X-axis sliding component 75 is fixed to the first substrate 73. If N chip pick-and-place components 71 are provided, then N-1 chip pick-and-place components 71 are slidably connected to the X-axis guide rail 751 of the X-axis sliding component 75. By controlling the sliding stroke of the chip pick-and-place components 71 on the X-axis guide rail 751, the spacing between adjacent chip pick-and-place components 71 can be adjusted. For example, Figure 6 The diagram shows two chip pick-and-place components 71. The chip pick-and-place component 71 located on the left side in the X direction is directly fixed to the first substrate 73, while the chip pick-and-place component 71 located on the right side in the X direction is connected to the first substrate 73 through an X-direction sliding component 75. By driving the chip pick-and-place component 71 located on the right side in the X direction to slide along the X direction, the distance between the two chip pick-and-place components 71 along the X direction can be adjusted, thereby adjusting the distance between the two suction nozzles 7113 used to adsorb chips along the X direction.

[0073] The second moving component 701 is configured to dock with the first moving component 602 at the intermediate station, so that the chip pick-and-place component 71 can place the chip to be tested and transfer the tested chip. The tray pick-and-place component 72 is configured to transfer the empty tray 80 on the upper layer of the feeding mechanism 10 to the tray temporary storage mechanism 40 for temporary storage, and to provide an empty tray 80 for the receiving mechanism 50. The tray pick-and-place component 72 is equipped with a second adsorption module 721 and a second Z-axis drive component for driving the second adsorption module 721 to move along the Z-axis.

[0074] The second Z-axis driving component is configured with a second power source (not shown) and a second sliding component 722 driven by the second power source (not shown). The second sliding component 722 is linked to the second adsorption module 721. The second sliding component 722 extends along the Z-axis and can reciprocate along the Z-axis, synchronously driving the second adsorption module 721 to reciprocate along the Z-axis. The second adsorption module 721 is connected to the vacuum generator 74 through a vacuum tube, and the second adsorption module 721 is used to pick up and put on the material tray 80.

[0075] Specifically, when the second adsorption module 721 adsorbs the material tray 80, it first needs to position the adsorption part 821 in the central area of ​​the material tray 80, and then adsorb the material tray 80 through vacuum negative pressure.

[0076] In one embodiment, the second sliding component 722 is configured with a second connecting seat (not shown), which is fixed to the first substrate 73 so that the first substrate 73 drives the second sliding component 722 and the second adsorption module 721 to move in the XY direction.

[0077] To achieve precise control of the displacement of the second moving component 701 in the X and Y directions, a first ranging component (not shown) is configured on the X-axis guide component 702. The first ranging component includes a first displacement sensor disposed at one end of the X-axis guide component 702 and a second displacement sensor disposed on the first substrate 73. The relative displacement between the second displacement sensor and the first displacement sensor is calculated to control the moving distance of the second moving component 701 in the X direction. A second ranging component (not shown) is configured on the Y-axis guide component 703. The second ranging component includes a third displacement sensor disposed at the limiting end of the Y-axis guide component 703 and a fourth displacement sensor disposed at the connection end between the X-axis guide component 702 and the Y-axis guide component 703. The relative displacement between the fourth displacement sensor and the third displacement sensor is calculated to control the moving distance of the second moving component 701 in the Y direction.

[0078] The detailed descriptions listed above are merely specific descriptions of feasible embodiments of the present invention, and are not intended to limit the scope of protection of the present invention. All equivalent embodiments or modifications made without departing from the spirit of the present invention should be included within the scope of protection of the present invention.

[0079] It will be apparent to those skilled in the art that the present invention is not limited to the details of the exemplary embodiments described above, and that the invention can be implemented in other specific forms without departing from its spirit or essential characteristics. Therefore, the embodiments should be considered in all respects as exemplary and non-limiting, and the scope of the invention is defined by the appended claims rather than the foregoing description. Thus, all variations falling within the meaning and scope of equivalents of the claims are intended to be included within the present invention. No reference numerals in the claims should be construed as limiting the scope of the claims.

[0080] Furthermore, it should be understood that although this specification describes embodiments, not every embodiment contains only one independent technical solution. This narrative style is merely for clarity. Those skilled in the art should consider the specification as a whole, and the technical solutions in each embodiment can also be appropriately combined to form other embodiments that can be understood by those skilled in the art.

Claims

1. A transfer device for chip testing, characterized in that, The transfer device is configured with several functional mechanisms and a transfer station in the forward functional area of ​​the Y-axis of the platform, a testing mechanism located in the rearward functional area of ​​the Y-axis of the platform and directly behind the transfer station, and a shuttle transfer mechanism and an overhead transfer mechanism on the platform. The testing mechanism is equipped with a test base and a floating test module disposed above the test base. The floating test module is equipped with an adsorption component for adsorbing the chip. The shuttle transfer mechanism is configured with at least two layers of carrier trays, which are configured to reciprocate between the transfer station and the testing mechanism. The carrier trays are configured to carry chips and can pass through the test base and the floating test module. The at least two layers of carrier trays do not overlap in the Z direction. When at the transfer station, the projections of the at least two layers of carrier trays on the XY plane do not overlap. The height of the carrier tray located on the Y-front side is higher than the height of the carrier tray located on the Y-rear side. The overhead transfer mechanism is equipped with a moving component, which is overhead above the Y-front functional area of ​​the platform and moves along the XY direction. The moving component is equipped with a tray picking and placing component that can be raised and lowered along the Z direction, at least two sets of chip picking and placing components that can be raised and lowered along the Z direction, and an X-direction slide rail. At least one set of chip picking and placing components is slidably connected to the X-direction slide rail. The sliding stroke of the chip picking and placing components on the X-direction slide rail is controlled to adjust the spacing between adjacent chip picking and placing components.

2. The chip testing transfer device according to claim 1, characterized in that, The shuttle transfer mechanism is configured with a temperature control component connected to at least one layer of the carrier trays, and the carrier trays configured with the temperature control component are at a lower height in the Z direction than the carrier trays without the temperature control component.

3. The chip testing transfer device according to claim 1, characterized in that, The functional mechanism includes a pre-temperature mechanism. The pre-temperature mechanism, the shuttle transfer mechanism, and the floating test module are all equipped with temperature control components for temperature control, so that the chip under test, which has been pre-temperatured by the pre-temperature mechanism, can maintain a constant temperature during the process of being transferred to the test socket through the carrier and the floating test module for testing.

4. The chip testing transfer device according to claim 1, characterized in that, The transfer device is equipped with a height measuring sensor assembly, which is located on the Y-front side of the testing mechanism. The height of the bottom end face of the height measuring sensor assembly is higher than the height of the top end face of the top layer of the carrier plate.

5. The chip testing transfer device according to claim 1, characterized in that, The functional mechanism includes a feeding mechanism, a receiving mechanism, and a preheating mechanism. The feeding mechanism and the receiving mechanism are configured with trays for batch carrying chips, and the trays are provided with a plurality of first receiving slots for accommodating chips. The preheating mechanism is configured with a temperature-adjustable preheating plate, and the preheating plate is provided with a plurality of second receiving slots for accommodating chips. The carrier tray is provided with a plurality of third receiving slots for accommodating chips. The spacing along the X-direction between adjacent chip pick-and-place components changes as the moving component drives the components to move to the tray, the preheating tray, or the carrier tray, corresponding to the spacing between adjacent first receiving slots, adjacent second receiving slots, or adjacent third receiving slots.

6. The chip testing transfer device according to claim 5, characterized in that, The functional mechanism also includes a material tray temporary storage mechanism. The feeding mechanism and the receiving mechanism are arranged in sequence along the Y-direction. The preheating mechanism, the transfer station and the material tray temporary storage mechanism are arranged in sequence along the X-direction and on the Y-direction rearward side. The material tray picking and placing component is configured to transfer the material tray according to a preset material tray flow path.

7. The chip testing transfer device according to claim 1, characterized in that, The functional mechanism includes a feeding mechanism and a receiving mechanism. Both the feeding mechanism and the receiving mechanism are provided with a hopper for accommodating the material tray, a lifting mechanism located below the hopper for driving the material tray to move up and down, and a positioning component for positioning when the topmost material tray is lifted to a preset position. The positioning component includes support members disposed on both sides of the top of the hopper in the X direction, an end positioning member disposed on the front end of the hopper in the Y direction, and / or a side positioning member disposed on one side of the hopper in the X direction.

8. The chip testing transfer device according to claim 1, characterized in that, The overhead transfer mechanism is equipped with an XY-axis guide frame, which includes a Y-axis guide assembly disposed on the platform and an X-axis guide assembly overhead connected to the Y-axis guide assembly. The moving component is disposed on the X-axis guide assembly. The X-axis guide assembly is equipped with a vacuum generator. The chip pick-and-place assembly and the tray pick-and-place assembly are both equipped with an adsorption module and a Z-axis drive assembly for driving the adsorption module to move up and down along the Z-axis. The vacuum generator provides a vacuum source for adsorption to the adsorption module.

9. The chip testing transfer device according to claim 8, characterized in that, The chip pick-and-place assembly is configured with a first adsorption module and a first Z-axis driving assembly. The first adsorption module includes a suction rod, an adapter disposed at the upper end of the suction rod, and a suction nozzle disposed at the lower end of the suction rod. The suction rod is connected to the vacuum generator via the adapter and a vacuum tube. The first Z-axis driving assembly includes a first power source, a first belt drive assembly driven by the first power source, and a first sliding assembly driven by the first belt drive assembly. The suction rod is linked to the first sliding assembly. Both the first belt drive assembly and the first sliding assembly extend along the Z-axis. The material tray loading and unloading assembly is configured with a second adsorption module and a second Z-axis driving assembly. The second Z-axis driving assembly includes a second power source and a second sliding assembly driven by the second power source. The second sliding assembly is linked to the second adsorption module and extends along the Z-axis. The central area of ​​the material tray is provided with an adsorption part for the second adsorption module to position and adsorb.

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