Beam shape and position monitoring device based on temperature detection

Abstract

The invention discloses a beam shape and position monitoring device based on temperature detection, and the device comprises a base which is internally provided with a cooling liquid channel; the cooling target head is arranged at the upper end of the base, a cooling cavity communicated with the cooling liquid flow channel is formed in the cooling target head, and the cooling cavity is filled with cooling liquid; the beam target surface is formed on one side of the cooling target head and is used for receiving beam irradiation; the plurality of rows of heat pipes are arranged in the cooling cavity on the rear side of the beam target surface at intervals along the height direction of the beam target surface and are used for transferring heat of the beam target surface into the cooling liquid; and the plurality of measuring thermometers are arranged on the rear side of the beam target surface between the heat discharge pipes and are used for detecting the temperature of each position of the beam target surface. The problem of heat concentration generated by high-power heavy ion irradiation is effectively solved, the defect that a traditional beam spot measurement technology depends on a camera is overcome, and the method is particularly suitable for scenes where the radiation environment is severe and the fluorescent target and the camera cannot work normally.

Description

Technical Field

[0001] The present invention belongs to the technical field of ion beam irradiation, and in particular relates to a beam shape position monitoring device based on temperature detection. Background Art

[0002] During heavy ion irradiation modification experiments, the irradiation terminal of a heavy ion accelerator must first detect the ion beam spot used during irradiation. The traditional method involves bombarding a luminescent material (such as a fluorescent target) to produce a spot, which is then observed by a camera installed in an observation window to determine the beam's location. With the advancement of accelerator technology, the resulting beams will have high power density and high energy. This is accompanied by strong neutron and gamma ray radiation. The intense radiation environment limits beam spot detection methods based on cameras (with CCDs as the photosensitive element, a semiconductor device that is not radiation-resistant). The traditional method of using fluorescent targets in conjunction with cameras is no longer suitable. Furthermore, the high power density of the beam intensities creates bottlenecks in traditional water-cooling methods. Under continuous heating conditions, the heat carried by the ion beam cannot be removed promptly, resulting in heat accumulation, melting and burning the metal, and thus compromising the vacuum system. Therefore, a new beam position and shape detection device is needed that is independent of cameras and can effectively remove the heat generated by the high-power ion beam. Summary of the Invention

[0003] The present invention aims to solve at least one of the technical problems existing in the prior art. To this end, the present invention provides a beam shape and position monitoring device based on temperature detection, which is designed to detect the shape and position distribution of a fast heavy ion beam in a high-power, strong irradiation environment.

[0004] To achieve the above objectives, the present invention adopts the following technical solution: a beam shape and position monitoring device based on temperature detection, comprising:

[0005] A base, suitable for being mounted on a rotary lifting platform and having a cooling liquid flow channel formed therein;

[0006] A cooling target head is arranged at the upper end of the base and has a cooling cavity formed therein that is connected to the coolant flow channel, and the cooling cavity is filled with coolant;

[0007] A beam target surface is formed on one side of the cooling target head and is used to receive beam irradiation;

[0008] Heat pipes, multiple rows of which are evenly arranged on the entire beam target surface. The heat pipes are tubular structures with closed ends, and their interiors are vacuum and filled with a heat-conducting medium. One end of the heat pipe is vertically buried behind the beam target surface, and the other end of the heat pipe extends into the cooling cavity of the cooling target head, for transferring heat from the beam target surface to the coolant.

[0009] Measuring thermometers, a plurality of which are arranged at the rear side of the beam target surface between the rows of heat pipes, for detecting the temperature at various positions on the beam target surface;

[0010] When the beam is irradiated on the beam target surface, the temperature signal at each position of the beam target surface is obtained by the measuring thermometers of the array, and then processed by a computer and converted into a corresponding temperature distribution map. The shape and position distribution information of the beam can be obtained through the temperature distribution map.

[0011] Preferably, the cooling target head is a semi-cylindrical water tank, and its axial section forms the beam target surface.

[0012] Preferably, the thickness of the beam target surface is not less than 15 mm, a plurality of temperature measuring slots for placing the measuring thermometers are provided between each row of the heat pipes on the rear side of the beam target surface, and each of the temperature measuring slots is located on the same plane.

[0013] Preferably, the measuring thermometer is composed of a ceramic PCB and a plurality of platinum resistors fixed on the ceramic PCB.

[0014] Preferably, each of the measuring thermometers has 16 leads, which can measure the temperature of 8 locations simultaneously. The 16 measuring thermometers are evenly distributed behind the beam target surface, and a total of 128 temperature signals are output, thereby reflecting the temperature distribution of the beam target surface.

[0015] Preferably, the measuring thermometer and the water-cooling target head are fixed with a connecting piece, and the connecting piece is in a square frame shape and has screw holes formed thereon for fixing the measuring thermometer and the cooling target head.

[0016] Preferably, the lower end of the base is mounted on the rotary lifting platform via a sealing flange, and a plurality of lead flanges are provided on the sealing flange, each of the lead flanges being formed with a pin header for connecting to the lead end of the ceramic PCB board, and the pin header can pass through 64 leads to lead out 32 temperature signals.

[0017] The present invention has the following advantages due to the adoption of the above technical solution:

[0018] In view of the characteristics of high-power heavy ion beams, such as strong current, large heat generation and strong radiation, the present invention designs a beam shape and position monitoring device based on temperature detection. A heat pipe plus water cooling method is adopted, and the heat emitted by the high-power heavy ion beam is taken away by water cooling, thereby ensuring the efficiency and uniformity of cooling, and effectively solving the problem of heat concentration generated by high-power heavy ion irradiation. In addition, a temperature distribution detection method is adopted to obtain beam shape and position distribution information, avoiding the use of fragile device cameras in radiation environments, and overcoming the shortcomings of traditional beam spot measurement technology that relies on cameras. The device is particularly suitable for scenarios with harsh radiation environments and where fluorescent targets and cameras cannot work normally. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] Various other advantages and benefits will become apparent to those skilled in the art upon reading the detailed description of the preferred embodiment below. The accompanying drawings are for illustration purposes only and are not to be considered as limiting the present invention. Throughout the drawings, the same reference numerals are used to denote the same components. In the drawings:

[0020] Figure 1 3D schematic diagram of a beam shape and position monitoring device based on temperature detection provided by one embodiment of the present invention;

[0021] Figure 2 is a front view of a beam shape and position monitoring device based on temperature detection provided by this embodiment of the present invention;

[0022] Figure 3 is a rear view of a beam target surface provided by one embodiment of the present invention;

[0023] Figure 4 It is a structural schematic diagram of a lead flange provided by one embodiment of the present invention.

[0024] The reference numerals in the figures are as follows:

[0025] 1-base; 2-cooling target head; 3-beam target surface; 4-heat pipe; 5-measuring thermometer; 6-temperature measuring slot; 7-connector; 8-sealing flange; 9-lead flange; 10-pin header; 11-rotating lifting platform. DETAILED DESCRIPTION

[0026] To make the objectives, technical solutions, and advantages of the present invention more apparent, specific embodiments of the present invention are further described below with reference to the accompanying drawings. Although exemplary embodiments of the present invention are shown in the accompanying drawings, it should be understood that the present invention can be implemented in various forms and should not be limited by the embodiments described herein. Rather, these embodiments are provided to enable a more thorough understanding of the present invention and to fully convey the scope of the present invention to those skilled in the art.

[0027] In the description of the present invention, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise", "axial", "radial", "circumferential" and the like to indicate orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as limiting the present invention.

[0028] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of the technical features being referred to. Thus, a feature identified as "first" or "second" may explicitly or implicitly include one or more of the features. In the description of the present invention, "plurality" means more than two, unless otherwise specifically defined.

[0029] In the present invention, unless otherwise expressly specified or limited, the terms "mounted," "connected," "connect," "fixed," etc. should be understood broadly. For example, they may refer to fixed connection, detachable connection, or integration; mechanical connection or electrical connection; direct connection or indirect connection through an intermediate medium; internal communication between two components or interaction between two components. Those skilled in the art will understand the specific meanings of the above terms in the present invention based on specific circumstances.

[0030] In the present invention, unless otherwise expressly specified or limited, when a first feature is "above" or "below" a second feature, it may mean that the first and second features are in direct contact, or that the first and second features are in indirect contact through an intermediary. Furthermore, when a first feature is "above," "above," or "above" a second feature, it may mean that the first feature is directly above or diagonally above the second feature, or simply means that the first feature is at a higher level than the second feature. When a first feature is "below," "below," or "below" a second feature, it may mean that the first feature is directly below or diagonally below the second feature, or simply means that the first feature is at a lower level than the second feature.

[0031] In the description of this specification, the reference terms "one embodiment", "some embodiments", "example", "specific example", or "some examples" mean that the specific features, structures, materials or characteristics described in conjunction with the embodiment or example are included in at least one embodiment or example of the present invention. In this specification, the schematic representations of the above terms do not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials or characteristics described can be combined in any one or more embodiments or examples in a suitable manner. In addition, those skilled in the art can combine and combine different embodiments or examples described in this specification and features of different embodiments or examples without contradiction.

[0032] The temperature detection-based beam shape position monitoring device provided by the present invention includes: a base, in which a coolant flow channel is formed; a cooling target head, which is arranged at the upper end of the base and has a cooling cavity connected to the coolant flow channel formed therein, and the cooling cavity is filled with coolant; a beam target surface, which is formed on one side of the cooling target head and is used to receive beam irradiation; a heat pipe, in which a plurality of heat exhaust pipes are arranged in the cooling cavity behind the beam target surface at intervals along the height direction of the beam target surface, and are used to quickly and efficiently transfer the heat of the beam target surface to the coolant; and a measuring thermometer, in which a plurality of measuring thermometers are arranged behind the beam target surface between the heat exhaust pipes, and are used to detect the temperature at various positions on the beam target surface. The present invention effectively solves the problem of heat concentration generated by high-power heavy ion irradiation, overcomes the disadvantage of traditional beam spot measurement technology that relies on cameras, and is particularly suitable for scenarios where the radiation environment is harsh and the fluorescent target and camera cannot work normally.

[0033] Hereinafter, a beam shape and position monitoring device based on temperature detection provided by an embodiment of the present invention will be described in detail with reference to the accompanying drawings.

[0034] See also Figures 1 to 3 An embodiment of the present invention provides a beam shape position monitoring device based on temperature detection, comprising: a base 1, suitable for being mounted on a rotary lifting platform 11 and having a coolant flow channel formed therein (not shown in the figure); a cooling target head 2, arranged at the upper end of the base 1 and having a cooling cavity formed therein that is connected to the coolant flow channel, the cooling cavity being filled with coolant; a beam target surface 3, formed on one side of the cooling target head 2 and used for receiving beam irradiation; a heat pipe 4, wherein a plurality of heat exhaust pipes 4 are arranged at intervals in the cooling cavity behind the beam target surface 3 along the height direction of the beam target surface 3, and are used for transferring heat from the beam target surface 3 to the coolant; and a measuring thermometer 5, wherein a plurality of measuring thermometers 5 are arranged at the rear side of the beam target surface 3 between the heat exhaust pipes 4, and are used for detecting the temperature at various positions on the beam target surface 3.

[0035] In the above embodiment, preferably, the cooling target head 2 is a semi-cylindrical water tank, and its axial section forms the beam target surface 3 .

[0036] In the above embodiment, preferably, please refer to Figure 3 The beam target surface 3 has a certain thickness (not less than 15 mm), and a plurality of temperature measuring slots 6 for placing measuring thermometers 5 are opened between the heat exhaust pipes 4 on the rear side of the beam target surface 3, and the temperature measuring slots 6 are located on the same plane.

[0037] In the above embodiment, preferably, please continue to refer to Figure 3 Multiple rows of heat pipes 4 are evenly arranged across the entire beam target surface 3. The heat pipes 4 are tubular structures with closed ends. Their interiors are vacuum-filled and partially filled with a heat-conducting medium. One end of the heat pipe 4 is vertically buried behind the beam target surface 3, while the other end extends into the cooling cavity of the cooling target head 2. Through this arrangement, the heat pipes 4 uniformly cool the beam target surface 3, ensuring that the heat generated by the beam irradiation on the beam target surface 3 is radially conducted through the heat pipes 4 and that heat exchange between the heat pipes 4 and the coolant is maintained. This design ensures that the temperature distribution of the beam target surface 3 is consistent with the shape and position of the beam spot, allowing the temperature distribution of the beam target surface 3 to reflect the shape and position of the beam spot.

[0038] In the above embodiment, preferably, the measuring thermometer 5 is composed of a ceramic PCB and a plurality of platinum resistors fixed on the ceramic PCB. Each measuring thermometer 5 has 16 leads and can measure the temperature of 8 locations simultaneously. The 16 measuring thermometers 5 are evenly distributed behind the beam target surface 3, and a total of 128 temperature signals are drawn out, thereby reflecting the temperature distribution of the beam target surface 3.

[0039] In the above embodiment, preferably, please refer to Figure 2 The measuring thermometer 5 and the cooling target head 2 are fixed with a connecting piece 7. The connecting piece 7 is in a square frame shape and has screw holes for fixing the measuring thermometer 5 and the cooling target head 2.

[0040] In the above embodiment, preferably, please refer to Figure 1 、 Figure 2 and Figure 4 The lower end of the base 1 is mounted on a rotary lifting platform 11 through a sealing flange 8, and four lead flanges 9 are provided on the sealing flange 8. Each lead flange 9 is formed with a pin header 10 for connecting to the lead end of the ceramic PCB board. The pin header 10 can pass through 64 leads and lead out 32 temperature signals.

[0041] When in use, the beam shape and position monitoring device provided by the present invention is installed inside a vacuum chamber. The leads on the measuring thermometers 5 are connected to the pin headers 10 on the lead flange 9, allowing temperature signals to be directed from the beam target surface 3 to the outside of the vacuum chamber. When the beam impinges on the beam target surface 3, the temperature signals at various locations on the beam target surface 3 are acquired by the array of measuring thermometers 5. These signals are then processed by a computer and converted into a corresponding temperature distribution map. This temperature distribution map provides information on the beam's shape and position.

[0042] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present application, rather than to limit them. Although the present application has been described in detail with reference to the aforementioned embodiments, those skilled in the art should understand that they can still modify the technical solutions described in the aforementioned embodiments, or make equivalent replacements for some or all of the technical features therein. These modifications or replacements do not deviate the essence of the corresponding technical solutions from the scope of the technical solutions of the embodiments of the present application, and they should all be included in the scope of the claims and specification of the present application. In particular, as long as there is no structural conflict, the various technical features mentioned in the various embodiments can be combined in any way. The present application is not limited to the specific embodiments disclosed herein, but includes all technical solutions that fall within the scope of the claims.

Claims

1. A beam shape position monitoring device based on temperature detection, characterized in that: include: A base, suitable for being mounted on a rotary lifting platform and having a cooling liquid flow channel formed therein; A cooling target head is arranged at the upper end of the base and has a cooling cavity formed therein that is connected to the coolant flow channel, and the cooling cavity is filled with coolant; A beam target surface is formed on one side of the cooling target head and is used to receive beam irradiation; Heat pipes, multiple rows of which are evenly arranged on the entire beam target surface. The heat pipes are tubular structures with closed ends, and their interiors are vacuum and filled with a heat-conducting medium. One end of the heat pipe is vertically buried behind the beam target surface, and the other end of the heat pipe extends into the cooling cavity of the cooling target head, for transferring heat from the beam target surface to the coolant. Measuring thermometers, a plurality of which are arranged at the rear side of the beam target surface between the rows of heat pipes, for detecting the temperature at various positions on the beam target surface; When the beam is irradiated on the beam target surface, the temperature signal at each position of the beam target surface is obtained by the measuring thermometers of the array, and then processed by a computer and converted into a corresponding temperature distribution map. The shape and position distribution information of the beam can be obtained through the temperature distribution map.

2. The beam shape position monitoring device according to claim 1, characterized in that: The cooling target head is a semi-cylindrical water tank, and its axial section forms the beam target surface.

3. The beam shape position monitoring device according to claim 1, characterized in that: The thickness of the beam target surface is not less than 15 mm. A plurality of temperature measuring slots for placing the measuring thermometers are provided between each row of the heat pipes on the rear side of the beam target surface, and each of the temperature measuring slots is located on the same plane.

4. The beam shape position monitoring device according to claim 1, characterized in that: The measuring thermometer is composed of a ceramic PCB and a plurality of platinum resistors fixed on the ceramic PCB.

5. The beam shape position monitoring device according to claim 4, characterized in that: Each of the measuring thermometers has 16 leads and can measure the temperature of 8 locations simultaneously. The 16 measuring thermometers are evenly distributed behind the beam target surface, and a total of 128 temperature signals are output, thereby reflecting the temperature distribution of the beam target surface.

6. The beam shape position monitoring device according to claim 1, characterized in that: The measuring thermometer and the water-cooling target head are fixed with a connecting piece. The connecting piece is in a square frame shape and is formed with screw holes for fixing the measuring thermometer and the cooling target head.

7. The beam shape position monitoring device according to claim 5, characterized in that: The lower end of the base is mounted on the rotary lifting platform through a sealing flange, and a plurality of lead flanges are provided on the sealing flange. Each lead flange is formed with a pin header for connecting to the lead end of the ceramic PCB board. The pin header can pass through 64 leads and lead out 32 temperature signals.

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