Optical module

Abstract

The optical module provided by the invention comprises a circuit board, a first signal processing chip, a first lens assembly and a first cover. A first light emitting chip and a first light receiving chip are arranged on the surface of the circuit board. The first signal processing chip is electrically connected with the first light emitting chip and / or the first light receiving chip. The surface of the first signal processing chip dissipates heat through a heat-conducting medium. The first lens assembly covers the surfaces of the first light emitting chip and the first light receiving chip. An open cavity is formed between the first lens assembly and the surface of the circuit board. The open type cavity is provided with an opening which is open towards the first signal processing chip. A first cover is arranged on the top of the first lens assembly and comprises a baffle. The baffle faces the opening. The baffle plate forms a partition between the opening and the first signal processing chip so as to prevent a heat-conducting medium on the surface of the first signal processing chip from entering the open cavity through the opening, thereby preventing an optical chip in the open cavity from being polluted.

Description

Technical Field

[0001] The present disclosure relates to the field of optical communication technology, and in particular to an optical module. Background Art

[0002] With the development of new services and applications such as cloud computing, mobile internet, and video, advances in optical communication technology are becoming increasingly important. As a key component in optical communication equipment, optical modules enable photoelectric signal conversion. As optical communication technology evolves, the data transmission rate of these modules continues to increase. Summary of the Invention

[0003] The embodiments of the present disclosure provide an optical module adapted to a signal processing chip to improve high-frequency signal transmission performance.

[0004] The optical module provided in the embodiment of the present disclosure includes:

[0005] A circuit board, with a first light emitting chip and a first light receiving chip provided on the surface;

[0006] a first signal processing chip, electrically connected to the circuit board, located on the same surface of the circuit board as the first light emitting chip and the first light receiving chip, the first signal processing chip being electrically connected to the first light emitting chip and / or the first light receiving chip; a surface of the first signal processing chip dissipating heat via a heat conducting medium;

[0007] a first lens assembly, located on the same surface of a circuit board as the first signal processing chip, forming an open cavity between the first lens assembly and the surface of the circuit board, the open cavity having an opening open toward the first signal processing chip, the first light emitting chip and the first light receiving chip being located within the open cavity, the first lens assembly covering the first light receiving chip and the surface of the first light emitting chip to change the transmission direction of the optical signal to be transmitted to the first light receiving chip and to change the transmission direction of the optical transmission signal generated by the first light emitting chip;

[0008] The first cover includes a top plate and a baffle, wherein the top plate is overlapped on the first lens assembly; the baffle faces the opening, and forms a barrier between the opening and the first signal processing chip to prevent the heat-conducting medium from entering the open cavity through the opening.

[0009] The optical module provided in the present disclosure includes a circuit board, a first signal processing chip, a first lens assembly, and a first cover. A first light emitting chip and a first light receiving chip are provided on the surface of the circuit board. A first digital signal processing signal is electrically connected to the circuit board and is located on the same surface of the circuit board as the first light emitting chip and the first light receiving chip. The first signal processing chip is electrically connected to the first light emitting chip and / or the first light receiving chip. Heat is dissipated from the surface of the first signal processing chip via a heat conducting medium. The first lens assembly and the first digital signal processing signal are located on the same surface of the circuit board. The first lens assembly covers the surfaces of the first light emitting chip and the first light receiving chip to change the transmission direction of the optical signal to be transmitted to the first light receiving chip and to change the transmission direction of the optical transmission signal generated by the first light emitting chip. Since the first signal processing chip is electrically connected to the first light emitting chip and / or the first light receiving chip, and the first lens assembly covers the surfaces of the first light emitting chip and the first light receiving chip, the first signal processing chip and the first lens assembly should be arranged in close proximity to ensure the electrical connection distance between the first signal processing chip and the first light emitting chip and the first light receiving chip, thereby ensuring signal transmission performance. An open cavity is formed between the first lens assembly and the surface of the circuit board, which is open to the first signal processing chip. The open cavity has an opening facing the first signal processing chip. The first light emitting chip and the first light receiving chip are located in the open cavity. The existence of the open cavity causes the bottom of the first lens assembly to be open to the first signal processing chip. For this purpose, a first cover is provided on the top of the first lens assembly, and the first cover includes a baffle. The baffle is arranged toward the opening. The baffle forms a barrier between the opening and the first signal processing chip, restricting the heat-conducting medium to one side of the baffle, so as to prevent the heat-conducting medium on the surface of the first signal processing chip from entering the open cavity through the opening, thereby preventing the optical chip in the open cavity from being contaminated. BRIEF DESCRIPTION OF THE DRAWINGS

[0010] To more clearly illustrate the technical solutions of the present disclosure, the following briefly describes the drawings used in some embodiments of the present disclosure. Obviously, the drawings described below are merely illustrations of some embodiments of the present disclosure, and those skilled in the art can also derive other drawings based on these drawings. Furthermore, the drawings described below are schematic diagrams and are not intended to limit the actual dimensions of the products, actual processes of the methods, actual timing of signals, and the like involved in the embodiments of the present disclosure.

[0011] Figure 1 A partial architecture diagram of an optical communication system provided according to some embodiments of the present disclosure;

[0012] Figure 2 A partial structural diagram of a host computer provided according to some embodiments of the present disclosure;

[0013] Figure 3A structural diagram of an optical module provided according to some embodiments of the present disclosure;

[0014] Figure 4 An exploded view of an optical module provided according to some embodiments of the present disclosure;

[0015] Figure 5 A schematic diagram of a layout structure inside an optical module provided according to some embodiments of the present disclosure;

[0016] Figure 6 A layout cross-sectional structure inside an optical module provided according to some embodiments of the present disclosure Figure 1 ;

[0017] Figure 7 A local cross-sectional structure inside an optical module provided according to some embodiments of the present disclosure Figure 2 ;

[0018] Figure 8 A schematic diagram of a light path corresponding to a layout inside an optical module according to some embodiments of the present disclosure Figure 1 ;

[0019] Figure 9 A schematic diagram of a light path corresponding to a layout inside an optical module according to some embodiments of the present disclosure Figure 2 ;

[0020] Figure 10 An assembly diagram of a first lens assembly and a first signal processing chip according to some embodiments of the present disclosure;

[0021] Figure 11 This is a structural diagram of an end face of a first lens assembly facing a first signal processing chip according to some embodiments of the present disclosure;

[0022] Figure 12 A diagram showing a layout structure of an optical module according to some embodiments of the present disclosure;

[0023] Figure 13 A layout decomposition of an optical module provided according to some embodiments of the present disclosure Figure 1 ;

[0024] Figure 14 A layout decomposition of an optical module provided according to some embodiments of the present disclosure Figure 2 ;

[0025] Figure 15 A schematic side view of an optical module layout according to some embodiments of the present disclosure;

[0026] Figure 16 This is another layout diagram of an optical module provided according to some embodiments of the present disclosure;

[0027] Figure 17 Another layout decomposition structure of an optical module provided according to some embodiments of the present disclosure Figure 1 ;

[0028] Figure 18 Another layout decomposition structure of an optical module provided according to some embodiments of the present disclosure Figure 2 ;

[0029] Figure 19 This is another layout structure diagram of an optical module provided according to some embodiments of the present disclosure;

[0030] Figure 20 Another layout decomposition of an optical module provided according to some embodiments of the present disclosure Figure 1 ;

[0031] Figure 21 Another layout decomposition of an optical module provided according to some embodiments of the present disclosure Figure 2 ;

[0032] Figure 22 Another layout diagram of an optical module provided according to some embodiments of the present disclosure;

[0033] Figure 23 A surface structure diagram of another layout circuit board of an optical module provided according to some embodiments of the present disclosure;

[0034] Figure 24 This is a structural diagram of a circuit board provided with a first signal processing chip and a second signal processing chip on its surface according to some embodiments of the present disclosure;

[0035] Figure 25 A structural diagram of a first lens assembly and a second lens assembly provided on a circuit board surface according to some embodiments of the present disclosure;

[0036] Figure 26 A schematic diagram of an optical module optical path according to some embodiments of the present disclosure Figure 1 ;

[0037] Figure 27 A schematic diagram of an optical module optical path according to some embodiments of the present disclosure Figure 2 ;

[0038] Figure 28 A circuit board surface structure provided according to some embodiments of the present disclosure Figure 1 ;

[0039] Figure 29 A circuit board surface structure provided according to some embodiments of the present disclosure Figure 2 ;

[0040] Figure 30 A circuit board surface structure provided according to some embodiments of the present disclosure Figure 3 ;

[0041] Figure 31 A schematic diagram of a circuit board surface layout according to some embodiments of the present disclosure Figure 1 ;

[0042] Figure 32 A schematic diagram of a circuit board surface layout according to some embodiments of the present disclosure Figure 2 ;

[0043] Figure 33 A side structural diagram of a first lens assembly provided according to some embodiments of the present disclosure;

[0044] Figure 34 A structural diagram of a first heat dissipation element provided according to some embodiments of the present disclosure;

[0045] Figure 35 A schematic diagram of a circuit board surface layout provided in some embodiments of the present disclosure Figure 3 ;

[0046] Figure 36 A schematic diagram of a circuit board surface layout according to some embodiments of the present disclosure Figure 4 ;

[0047] Figure 37 A structural diagram of a third heat dissipation element provided according to some embodiments of the present disclosure;

[0048] Figure 38 A schematic diagram of a circuit board surface layout according to some embodiments of the present disclosure Figure 5 ;

[0049] Figure 39 A schematic diagram of a circuit board surface layout according to some embodiments of the present disclosure Figure 6 ;

[0050] Figure 40 A bottom structural diagram of a first lens assembly provided according to some embodiments of the present disclosure;

[0051] Figure 41 An exploded view of an assembly of a first lens assembly and a first optical fiber support provided according to some embodiments of the present disclosure;

[0052] Figure 42 This is a structural diagram of the end face of a first lens assembly facing the optical port provided according to some embodiments of the present disclosure;

[0053] Figure 43A cross-sectional structural diagram of an assembly of a first lens assembly and a first optical fiber support according to some embodiments of the present disclosure;

[0054] Figure 44 A cross-sectional structural diagram of a first lens assembly provided according to some embodiments of the present disclosure;

[0055] Figure 45 This is a bottom surface structural diagram of a first lens assembly provided according to some embodiments of the present disclosure. DETAILED DESCRIPTION

[0056] Some embodiments of the present disclosure will be described in detail below with reference to the accompanying drawings. However, the embodiments described are only some of the embodiments of the present disclosure, not all of them. All other embodiments obtained by those of ordinary skill in the art based on the embodiments provided in the present disclosure are within the scope of protection of the present disclosure.

[0057] Unless the context requires otherwise, throughout the specification and claims, the term "including" is to be interpreted as open and inclusive, that is, "including, but not limited to"; the terms "first" and "second" are not to be understood as indicating or implying relative importance or indicating an upper limit on quantity; the term "plurality" means two or more; the term "connected" is to be understood in a broad sense, for example, "connected" can be a fixed connection, a detachable connection, or an integral connection, and can be directly connected or indirectly connected through an intermediate medium; the use of the terms "suitable for" or "configured to" means open and inclusive language, which does not exclude equipment that is suitable for or configured to perform additional tasks or steps; terms such as "parallel", "perpendicular", "same", "consistent", "level" and so on are not limited to absolute mathematical theoretical relationships, but also include acceptable error ranges generated in practice, and also include differences based on the same design concept but due to manufacturing reasons.

[0058] In optical communication technology, to establish information transmission between information processing devices, it is necessary to load the information onto light and use the propagation of light to achieve information transmission. Here, the light loaded with information is an optical signal. When transmitting optical signals within information transmission equipment, they can reduce optical power loss, thereby achieving high-speed, long-distance, and low-cost information transmission. The signals that information processing equipment can recognize and process are electrical signals. Information processing equipment typically includes optical network units (ONUs), gateways, routers, switches, mobile phones, computers, servers, tablets, televisions, etc., and information transmission equipment typically includes optical fibers and optical waveguides.

[0059] Optical modules can convert optical signals into electrical signals between information processing devices and information transmission devices. For example, at least one of the optical signal input or output ends of an optical module is connected to an optical fiber, and at least one of the electrical signal input or output ends of the optical module is connected to an optical network terminal. A first optical signal from the optical fiber is transmitted to the optical module, which converts the first optical signal into a first electrical signal and transmits the first electrical signal to the optical network terminal. A second electrical signal from the optical network terminal is transmitted to the optical module, which converts the second electrical signal into a second optical signal and transmits the second optical signal to the optical fiber. Because multiple information processing devices can transmit information via electrical signals, at least one of the multiple information processing devices needs to be directly connected to the optical module, rather than all of them. Here, the information processing device directly connected to the optical module is referred to as the optical module's host computer. Furthermore, the optical signal input or output end of the optical module can be referred to as an optical port, and the electrical signal input or output end of the optical module can be referred to as an electrical port.

[0060] Figure 1 FIG. 1 is a partial structural diagram of an optical communication system according to some embodiments. Figure 1 As shown, the optical communication system mainly includes a remote information processing device 1000 , a local information processing device 2000 , a host computer 100 , an optical module 200 , an optical fiber 101 and a network cable 103 .

[0061] One end of optical fiber 101 extends toward remote information processing device 1000, and the other end of optical fiber 101 is connected to optical module 200 through the optical port of optical module 200. Optical signals can be totally reflected in optical fiber 101, and the propagation of the optical signal in the direction of total reflection can almost maintain the original optical power. The optical signal undergoes multiple total reflections in optical fiber 101 to transmit the optical signal from remote information processing device 1000 to optical module 200, and vice versa, thereby achieving long-distance, low-power information transmission.

[0062] The optical communication system may include one or more optical fibers 101, and the optical fibers 101 may be detachably connected or fixedly connected to the optical module 200. The host computer 100 is configured to provide data signals to the optical module 200, receive data signals from the optical module 200, or monitor or control the operating status of the optical module 200.

[0063] The host computer 100 includes a substantially rectangular housing and an optical module interface 102 disposed on the housing. The optical module interface 102 is configured to connect to the optical module 200 to establish a unidirectional or bidirectional electrical signal connection between the host computer 100 and the optical module 200.

[0064] The host computer 100 also includes an external electrical interface that can access an electrical signal network. For example, the external electrical interface includes a Universal Serial Bus (USB) interface or a network cable interface 104. The network cable interface 104 is configured to access a network cable 103 so that the host computer 100 establishes a unidirectional or bidirectional electrical signal connection with the network cable 103. One end of the network cable 103 is connected to the local information processing device 2000, and the other end of the network cable 103 is connected to the host computer 100, so that an electrical signal connection is established between the local information processing device 2000 and the host computer 100 via the network cable 103. For example, a third electrical signal emitted by the local information processing device 2000 is transmitted to the host computer 100 via the network cable 103. The host computer 100 generates a second electrical signal based on the third electrical signal. The second electrical signal from the host computer 100 is transmitted to the optical module 200. The optical module 200 converts the second electrical signal into a second optical signal and transmits the second optical signal to the optical fiber 101. The second optical signal is then transmitted to the remote information processing device within the optical fiber 101. For example, a first optical signal from the remote information processing device 1000 is transmitted through the optical fiber 101. The first optical signal from the optical fiber 101 is transmitted to the optical module 200. The optical module 200 converts the first optical signal into a first electrical signal. The optical module 200 transmits the first electrical signal to the host computer 100. The host computer 100 generates a fourth electrical signal based on the first electrical signal and transmits the fourth electrical signal to the local information processing device 2000. It should be noted that optical modules are tools for converting optical signals into electrical signals. During this conversion process, the information does not change, but the encoding and decoding methods of the information can change.

[0065] In addition to the optical network terminal, the host computer 100 also includes an optical line terminal (OLT), an optical network device (ONT), or a data center server.

[0066] Figure 2 FIG1 is a partial structural diagram of a host computer according to some embodiments. In order to clearly show the connection relationship between the optical module 200 and the host computer 100, Figure 2 Only the structure of the host computer 100 related to the optical module 200 is shown. Figure 2 As shown, the host computer 100 further includes a PCB 105 disposed within the housing, a cage 106 disposed on the surface of the PCB 105, a heat sink 107 disposed on the cage 106, and an electrical connector disposed within the cage 106. The electrical connector is configured to connect to the electrical port of the optical module 200; the heat sink 107 has protruding structures such as fins to increase the heat dissipation area.

[0067] The optical module 200 is inserted into the cage 106 of the host computer 100. The cage 106 secures the optical module 200. Heat generated by the optical module 200 is transferred to the cage 106 and then dissipated through the heat sink 107. After the optical module 200 is inserted into the cage 106, the electrical port of the optical module 200 connects with the electrical connector inside the cage 106, thereby establishing a bidirectional electrical signal connection between the optical module 200 and the host computer 100. Furthermore, the optical port of the optical module 200 connects to the optical fiber 101, thereby establishing a bidirectional optical signal connection between the optical module 200 and the optical fiber 101.

[0068] Figure 3 is a structural diagram of an optical module according to some embodiments. Figure 4 FIG. 1 is an exploded view of an optical module according to some embodiments. Figure 3 and Figure 4 As shown, the optical module 200 includes a housing, a circuit board 300 disposed within the housing, and a lens assembly. In some embodiments, a first lens assembly 400 and a second lens assembly 500 are disposed on the surface of the circuit board 300. The housing comprises an upper housing 201 and a lower housing 202. The upper housing 201 covers the lower housing 202 to form the aforementioned housing with two openings 204 and 205. The outer contour of the housing generally presents a square shape.

[0069] In some embodiments, the lower shell 202 includes a base plate 2021 and two lower side plates 2022 located on both sides of the base plate 2021 and arranged perpendicular to the base plate 2021; the upper shell 201 includes a cover plate 2011, and the cover plate 2011 covers the two lower side plates 2022 of the lower shell 202 to form the above-mentioned shell.

[0070] In some embodiments, the lower shell 202 includes a base plate 2021 and two lower side plates 2022 located on both sides of the base plate 2021 and arranged perpendicularly to the base plate 2021; the upper shell 201 includes a cover plate 2011 and two upper side plates located on both sides of the cover plate 2011 and arranged perpendicularly to the cover plate 2011. The two upper side plates are combined with the two lower side plates 2022 to achieve the upper shell 201 covering the lower shell 202.

[0071] The direction of the line connecting the two openings 204 and 205 may be consistent with the length direction of the optical module 200, or may be inconsistent with the length direction of the optical module 200. For example, the opening 204 is located at the end of the optical module 200 ( Figure 3 The opening 205 is also located at the end of the optical module 200 ( Figure 3Alternatively, opening 204 is located at the end of optical module 200, while opening 205 is located on the side of optical module 200. Opening 204 is an electrical port, through which the gold finger 301 of circuit board 300 extends and is inserted into the electrical connector of host computer 100. Opening 205 is an optical port, configured to receive an external optical fiber 101, thereby connecting optical fiber 101 to the first lens assembly 400 and the second lens assembly 500 in optical module 200.

[0072] The combined assembly of upper and lower housings 201 and 202 facilitates installation of the circuit board 300 and other components within the housing, with the upper and lower housings 201 and 202 providing encapsulation and protection for the components. Furthermore, during assembly of the circuit board 300 and other components, positioning components, heat dissipation components, and electromagnetic shielding components of these components are easily positioned, facilitating automated production.

[0073] In some embodiments, the upper shell 201 and the lower shell 202 are made of metal materials, which facilitates electromagnetic shielding and heat dissipation.

[0074] In some embodiments, the optical module 200 further includes an unlocking component 600 located outside its housing. The unlocking component 600 is configured to achieve a fixed connection between the optical module 200 and the host computer, or to release the fixed connection between the optical module 200 and the host computer.

[0075] For example, the unlocking component 600 is located on the outside of the two lower side panels 2022 of the lower housing 202 and includes a snap-fit ​​component that mates with the cage 106 of the host computer 100. When the optical module 200 is inserted into the cage 106, the snap-fit ​​component of the unlocking component 600 secures the optical module 200 in the cage 106. When the unlocking component 600 is pulled, the snap-fit ​​component of the unlocking component 600 moves accordingly, thereby changing the connection between the snap-fit ​​component and the host computer, thereby releasing the optical module 200 from the cage 106 and allowing the optical module 200 to be removed from the cage 106.

[0076] The circuit board 300 includes circuit traces, electronic components, and chips. The electronic components and chips are connected according to the circuit design through the circuit traces to achieve functions such as power supply, electrical signal transmission, and grounding. Electronic components may include, for example, capacitors, resistors, transistors, and metal-oxide-semiconductor field-effect transistors (MOSFETs). Chips may include, for example, microcontroller units (MCUs), laser driver chips, transimpedance amplifiers (TIAs), limiting amplifiers, clock and data recovery chips (CDRs), power management chips, and digital signal processing (DSP) chips.

[0077] The circuit board 300 is generally a rigid circuit board. Due to its relatively hard material, the rigid circuit board can also realize the load-bearing function. For example, the rigid circuit board can stably carry the above-mentioned electronic components and chips; the rigid circuit board can also be inserted into the electrical connector in the cage 106 of the host computer 100.

[0078] The circuit board 300 further includes a gold finger 301 formed on the end surface thereof. The gold finger 301 is composed of a plurality of independent pins. The circuit board 300 is inserted into the cage 106, and the gold finger 301 is connected to the electrical connector in the cage 106. The gold finger 301 can be provided on only one side of the circuit board 300 (e.g. Figure 4 The top surface shown in FIG300 can also be located on the upper and lower surfaces of the circuit board 300 to provide a greater number of pins, thus adapting to applications requiring a large number of pins. Gold fingers 301 are configured to establish an electrical connection with a host computer to facilitate power supply, grounding, two-wire synchronous serial (Inter-Integrated Circuit, I2C) signal transmission, data signal transmission, and more. Of course, some optical modules also use flexible circuit boards. Flexible circuit boards are generally used in conjunction with rigid circuit boards to supplement them.

[0079] In some embodiments, the lens assembly is connected to a fiber optic support. The fiber optic support allows the fiber array to pass through and secure the fiber array. For example, the first lens assembly 400 is connected to the first fiber optic support 700, and the second lens assembly 500 is connected to the second fiber optic support 800.

[0080] Figure 5 FIG. 1 is a schematic diagram of a layout structure inside an optical module provided in some embodiments of the present disclosure. Figure 5As shown, in some embodiments, the first lens assembly 400 and the second lens assembly 500 are arranged along the length direction of the circuit board 300. Exemplarily, the second lens assembly 500 is arranged between the first lens assembly 400 and the signal processing chip 302. Exemplarily, the signal processing chip 302 is a DSP chip.

[0081] In some embodiments, the second lens assembly 500 is farther from the optical port than the first lens assembly 400. The optical fiber array connected to the second optical fiber bracket 800 passes along the surface of the first lens assembly 400 until it is connected to the second lens assembly 500.

[0082] In some embodiments, a first optical fiber array 700 a is provided between the first optical fiber bracket 700 and the optical fiber adapter 900 , and a second optical fiber array 800 a is provided between the second optical fiber bracket 800 and the optical fiber adapter 900 .

[0083] The first optical fiber array 700 a and the second optical fiber array 800 a are arranged parallel to the surface of the circuit board 300 , so the optical signal transmission direction is parallel to the surface of the circuit board 300 .

[0084] In some embodiments, a light receiving chip 303 , a TIA 3031 , a light emitting chip 304 , and a laser driving chip 3041 are provided on the surface of the circuit board 300 .

[0085] In some embodiments, the light receiving chip 303 is disposed adjacent to the TIA 3031. The light receiving chip 303 is configured to convert a received light signal into a photocurrent signal, and the TIA 3031 is configured to convert the photocurrent signal into a voltage signal and amplify the voltage signal.

[0086] In some embodiments, the light emitting chip 304 is disposed adjacent to the laser driver chip 3041. The laser driver chip 3041 is configured to generate a drive signal and transmit the drive signal to the light emitting chip 304. The light emitting chip 304 converts the received electrical signal into an optical signal under the action of the drive signal.

[0087] In some embodiments, the first lens assembly 400 and the second lens assembly 500 are in a buckle-type configuration and can be buckled onto the surface of the circuit board 300 .

[0088] In some embodiments, the first lens assembly 400 and the surface of the circuit board 300 form an open cavity 400b. For example, the light receiving chip 303, TIA 3031, light emitting chip 304, and laser driver chip 3041 are located on the surface of the circuit board 300 and are covered by the first lens assembly 400.

[0089] In some embodiments, the first lens assembly 400 is disposed on the surfaces of the light receiving chip 303, TIA 3031, light emitting chip 304, and laser driver chip 3041. The second lens assembly 500 is also disposed on the surfaces of another group of light receiving chips 303, TIA 3031, light emitting chip 304, and laser driver chip 3041.

[0090] In some embodiments, a housing tail cavity is formed at the end of the first lens assembly 400 and the end of the second lens assembly 500 to house the TIA 3031 and the laser driver chip 3041 .

[0091] In some embodiments, the first lens assembly 400 and the second lens assembly 500 have an optical path turning function, which can turn the transmission direction of the optical signal transmitted in the first optical fiber array 700a and the second optical fiber array 800a from parallel to the surface of the circuit board 300 to perpendicular to the circuit board 300, so as to be transmitted to the optical receiving chip 303.

[0092] In some embodiments, the first lens assembly 400 and the second lens assembly 500 have an optical path turning function, which can turn the transmission direction of the optical signal emitted upward from the light emitting chip 304 along the surface of the circuit board 300 to be parallel to the surface of the circuit board 300, so as to output the optical signal emitted by the light emitting chip 304 along the first optical fiber array 700a and the second optical fiber array 800a to the outside of the optical module.

[0093] Figure 6 A layout cross-sectional structure inside an optical module provided according to some embodiments of the present disclosure Figure 1 , Figure 7 A local cross-sectional structure inside an optical module provided according to some embodiments of the present disclosure Figure 2 .like Figure 6 and Figure 7 As shown, in some embodiments, the second lens assembly 500 is disposed between the first lens assembly 400 and the DSP 302 .

[0094] In some embodiments, the first lens assembly 400 is disposed on a surface of a group of light receiving chips 303 and light emitting chips 304 .

[0095] In some embodiments, the second lens assembly 500 is disposed on the surface of another group of light receiving chips 303 and light emitting chips 304 .

[0096] In some embodiments, a TIA 3031 is provided between the optical receiving chip 303 and the signal processing chip 302 , and a laser driving chip 3041 is provided between the optical transmitting chip 304 and the signal processing chip 302 .

[0097] In some embodiments, the signal processing chip 302 is electrically connected to the gold finger 301 .

[0098] In some embodiments, the signal processing chip 302 can be flip-chip mounted on the surface of the circuit board 300. For example, solder bumps on the bottom surface of the signal processing chip 302 are connected downward to the surface of the circuit board 300. Wires are routed from the solder bumps along the surface of the circuit board 300 to electrically connect to the gold fingers 301.

[0099] In some embodiments, after the solder bumps of the signal processing chip 302 are connected to the surface pads of the circuit board 300 by heating and pressurizing, a viscous filler is filled in both directions along the edge of the signal processing chip 302. The gap between the signal processing chip 302 and the circuit board 300 has a capillary siphon effect, and the filled viscous filler is sucked in and flows toward the center, thereby filling the gap between the signal processing chip 302 and the circuit board 300, thereby achieving stable fitting between the signal processing chip 302 and the circuit board 300.

[0100] In some embodiments, the signal processing chip 302 is electrically connected to the gold fingers 301 through solder bumps via traces on the surface of the circuit board 300 .

[0101] In some embodiments, the light receiving chip 303 and the light transmitting chip 304 covered under the second lens assembly 500 are electrically connected to the signal processing chip 302 by wire bonding.

[0102] The light receiving chip 303 and the light emitting chip 304 covered under the first lens assembly 400 are electrically connected to the signal processing chip 302 in a through-hole manner.

[0103] In some embodiments, a first optical path turning surface 401 is formed on the surface of the first lens assembly 400, and a second optical path turning surface 501 is formed on the surface of the second lens assembly 500. The first optical path turning surface 401 and the second optical path turning surface 501 have the same structure and function, and the first optical path turning surface 401 is used as an example for exemplary description below.

[0104] A light receiving chip 303 and a light emitting chip 304 are disposed below the first optical path turning surface 401. The light receiving chip 303 and the light emitting chip 304 are arranged along the width of the circuit board 300. The light receiving direction of the light receiving chip 303 is perpendicular to the surface of the circuit board 300, and the light emitting direction of the light emitting chip 304 is perpendicular to the surface of the circuit board 300.

[0105] In some embodiments, the optical paths of the optical receiving chip 303 and the optical transmitting chip 304 are both deflected via the first optical path deflection surface 401. The first optical path deflection surface 401 has a reflective function. The reflection from the first optical path deflection surface 401 can deflect the optical path of the optical signal transmitted into the optical module so that it can be received by the optical receiving chip 303. It can also deflect the optical path of the optical signal emitted by the optical transmitting chip 304 so that it can be output outside the optical module along the optical fiber array.

[0106] Exemplarily, the optical signal transmitted to the interior of the optical module is reflected by the first optical path turning surface 401 to achieve optical path turning, turning the optical path from parallel to the surface of the circuit board 300 to perpendicular to the surface of the circuit board 300, so that the optical signal transmitted to the interior of the optical module can be received by the optical receiving chip 303.

[0107] Exemplarily, the optical signal generated by the optical emitting chip 304 is reflected by the first optical path turning surface 401 to achieve optical path turning, turning the optical path from perpendicular to the surface of the circuit board 300 to parallel to the surface of the circuit board 300, so that the optical signal generated by the optical emitting chip 304 can be transmitted along the optical fiber array to the outside of the optical module.

[0108] Figure 8 A schematic diagram of a light path corresponding to a layout inside an optical module according to some embodiments of the present disclosure Figure 1 , Figure 9 A schematic diagram of a light path corresponding to a layout inside an optical module according to some embodiments of the present disclosure Figure 2 .like Figure 8 and Figure 9 As shown, in some embodiments, the first lens assembly 400 has an optical path turning function.

[0109] In some embodiments, the optical path turning of the light receiving chip 303 and the light emitting chip 304 are both achieved through the first optical path turning surface 401 .

[0110] In some embodiments, the optical signal transmitted along the optical fiber array to the interior of the optical module reaches the first optical path turning surface 401, and the optical path is turned by downward reflection from the first optical path turning surface 401, thereby turning the optical path to a direction perpendicular to the circuit board 300 so as to be received by the optical receiving chip 303.

[0111] In some embodiments, the optical signal generated by the light emitting chip 304 is transmitted upward along the surface of the circuit board 300 to the first optical path turning surface 401, and is reflected by the first optical path turning surface 401 to achieve optical path turning. Exemplarily, the first optical path turning surface 401 reflects the optical signal output by the light emitting chip 304 toward the optical port, thereby turning the optical path transmission direction so that it can be transmitted along the optical fiber array, thereby transmitting the optical signal generated by the light emitting chip 304 to the outside of the optical module.

[0112] In some embodiments, the gold finger 301 is electrically connected to one end of the signal processing chip 302, and the other end of the signal processing chip 302 is electrically connected to the laser driver chip 3041 and TIA3031 respectively. Then the laser driver chip 3041 is electrically connected to the light emitting chip 304, and the TIA3031 is electrically connected to the light receiving chip 303.

[0113] In some embodiments, the gold finger 301 is electrically connected to one end of the signal processing chip 302 , and the other end of the signal processing chip 302 is directly electrically connected to the light emitting chip 304 and / or the light receiving chip 303 .

[0114] In some embodiments, the gold finger 301 is electrically connected to one end of the signal processing chip 302, and the other end of the signal processing chip 302 is directly electrically connected to the light emitting chip 304. For example, the laser driver chip 3041 can be integrated into the signal processing chip 302 to reduce power consumption.

[0115] In some embodiments, the gold finger 301 is electrically connected to one end of the signal processing chip 302, and the other end of the signal processing chip 302 is directly electrically connected to the optical receiving chip 303. For example, the TIA 3031 can be integrated into the signal processing chip 302 to reduce power consumption.

[0116] In some embodiments, the gold finger 301 is electrically connected to one end of the signal processing chip 302, and the other end of the signal processing chip 302 is electrically connected to the optical receiving chip 303 and the optical transmitting chip 304. For example, the laser driver chip 3041 and the TIA 3031 are integrated into the signal processing chip 302 to reduce power consumption.

[0117] In some embodiments, the laser driving chip 3041 and / or the TIA 3031 are integrated in the signal processing chip 302 , and the signal processing chip 302 generates a large amount of heat and has a large heat dissipation requirement.

[0118] In some embodiments, the surface of the signal processing chip 302 is cooled by a heat-conducting medium. For example, the heat-conducting medium is a heat-conducting gel. The heat-conducting gel has a certain fluidity.

[0119] In some embodiments, a heat-conducting medium such as thermal conductive gel can be filled between the signal processing chip 302 and the upper shell 201 to conduct the heat generated by the signal processing chip 302 to the upper shell 201 through the thermal conductive gel, and then dissipate the heat to the outside through the upper shell 201, thereby dissipating heat from the signal processing chip 302.

[0120] In some embodiments, the first lens assembly 400 is projected onto the surfaces of the first light emitting chip 304 and the first light receiving chip 303. The first lens assembly 400 is used to change the transmission direction of the optical signal to be transmitted to the first light receiving chip 303 and to change the transmission direction of the optical transmission signal generated by the first light emitting chip 304.

[0121] Since the signal processing chip 302 is electrically connected to the first light emitting chip 304 and / or the first light receiving chip 303, and the first lens assembly 400 is projected onto the surfaces of the first light emitting chip 304 and the first light receiving chip 303, the signal processing chip 302 and the first lens assembly 400 should be arranged in close proximity to ensure the electrical connection distance between the signal processing chip 302 and the first light emitting chip 304 and the first light receiving chip 303, respectively, thereby ensuring the high-frequency signal transmission performance between the first signal processing chip 305 and the first light emitting chip 304 and the first light receiving chip 303, respectively.

[0122] Figure 10 This is an assembly diagram of a first lens assembly and a first signal processing chip according to some embodiments of the present disclosure. Figure 11 This is a structural diagram of the end face of a first lens assembly facing the first signal processing chip according to some embodiments of the present disclosure. Figure 10 and Figure 11 As shown, in some embodiments, an open cavity 400b is formed between the first lens assembly 400 and the surface of the circuit board 300. The first light emitting chip 304 and the first light receiving chip 303 are located in the open cavity 400b. The open cavity 400b is open to the signal processing chip.

[0123] In some embodiments, the open cavity 400b has an opening therein that opens toward the first signal processing chip 305. The provision of the open cavity 400b enables the first lens assembly 400 to be miniaturized.

[0124] In some embodiments, the open cavity 400b is open toward the first signal processing chip 305, and the bottom of the first lens assembly 400 is open to the signal processing chip. The optical path of the first lens assembly 400 dictates that the opening of the open cavity 400b has a certain height. This relatively large opening allows thermally conductive gel on the surface of the signal processing chip to easily overflow into the open cavity 400b, contaminating the optical chip. The opening of the open cavity 400b is high enough to clear the wiring on the circuit board 300 surface and allow the thermally conductive gel to pass through.

[0125] In some embodiments, a sidewall may be formed on the side of the first lens assembly 400 facing the signal processing chip to block the opening of the open cavity 400b. Due to the material and process of the first lens assembly 400, the thickness of the formed sidewall is relatively large, which undoubtedly increases the distance between the first lens assembly 400 and the signal processing chip.

[0126] In some embodiments, to prevent the thermally conductive gel on the surface of the signal processing chip from overflowing into the open cavity 400b through the opening of the open cavity 400b, a heat sink is provided on the surface of the signal processing chip. The heat sink surface can both support the thermally conductive medium and create a barrier between the signal processing chip and the open cavity 400b. The barrier faces the opening of the open cavity 400b and forms a barrier between the opening and the signal processing chip, confining the thermally conductive medium to the surface of the heat sink, thereby preventing the thermally conductive medium from overflowing into the open cavity 400b through the opening, thereby preventing contamination of the optical chip.

[0127] In some embodiments, to prevent thermally conductive gel on the surface of the signal processing chip from overflowing into the open cavity 400b through the opening of the open cavity 400b, a first cover is provided on the first lens assembly 400. The first cover includes a baffle. The baffle is positioned toward the opening. The baffle forms a barrier between the opening and the signal processing chip, confining the thermally conductive medium to one side of the baffle. This prevents the thermally conductive medium on the surface of the signal processing chip from entering the open cavity through the opening, thereby preventing contamination of the optical chip within the open cavity.

[0128] Figure 12 This is a diagram of an optical module layout structure provided according to some embodiments of the present disclosure. Figure 13 A layout decomposition of an optical module provided according to some embodiments of the present disclosure Figure 1 , Figure 14 A layout decomposition of an optical module provided according to some embodiments of the present disclosure Figure 2 .like Figures 12 to 14 As shown, in some embodiments, the first lens assembly 400 , the first signal processing chip 305 , the second lens assembly 500 , and the second signal processing chip 306 are disposed on the same surface of the circuit board 300 .

[0129] In some embodiments, a heat dissipation duct may be formed between the upper housing 201 of the optical module and the cage 106 of the host computer 100 , so the upper housing 201 has a better heat dissipation effect than the lower housing 202 .

[0130] In some embodiments, the first lens assembly 400, the first signal processing chip 305, the second lens assembly 500, and the second signal processing chip 306 are arranged on the upper surface of the circuit board 300 to fully utilize the space between the circuit board 300 and the upper shell 201, and utilize the heat dissipation characteristics of the upper shell 201.

[0131] In some embodiments, the first lens assembly 400 is connected to a first optical fiber bracket 710 in which a first optical fiber array is fixed, and the second lens assembly 500 is connected to a second optical fiber bracket 720 in which a second optical fiber array is fixed.

[0132] In some embodiments, the first optical fiber bracket 710, the first lens assembly 400, and the first signal processing chip 305 cooperate with each other to realize the transmission and reception of four optical signals; the second optical fiber bracket 720, the second lens assembly 500, and the second signal processing chip 306 cooperate with each other to realize the transmission and reception of another four optical signals.

[0133] In some embodiments, compared to using one signal processing chip, using the first signal processing chip 305 and the second signal processing chip 306 respectively can simultaneously ensure that the first lens assembly 400 and the first signal processing chip 305 are set close to each other, and the second lens assembly 500 and the second signal processing chip 306 are set close to each other.

[0134] In some embodiments, the first signal processing chip 305 is located on the same surface of the circuit board 300 as the first light receiving chip 303 and the first light emitting chip 304 , and the first lens assembly 400 is located on the same surface of the circuit board 300 .

[0135] In some embodiments, the first signal processing chip 305 is electrically connected to the first light transmitting chip 304 and / or the first light receiving chip 303 .

[0136] In some embodiments, an open cavity 400b is formed between the first lens assembly 400 and the surface of the circuit board 300. The first light receiving chip 303 and the first light emitting chip 304 are located within the open cavity 400b. For example, the first light receiving chip 303 and the first light emitting chip 304 are disposed on the surface of the circuit board 300 and are covered by the first lens assembly 400.

[0137] In some embodiments, an open cavity 400b is formed between the second lens assembly 500 and the surface of the circuit board 300. The second light receiving chip 303a and the second light emitting chip 304a are located within the open cavity. For example, the second light receiving chip 303a and the second light emitting chip 304a are disposed on the surface of the circuit board 300 and are illuminated from above by the second lens assembly 500.

[0138] In some embodiments, the provision of the open cavity 400 b enables the first lens assembly 400 to be miniaturized, which facilitates the first signal processing chip 305 to be close to the first lens assembly 400 .

[0139] In some embodiments, the open cavity 400 b has an opening that opens toward the first signal processing chip 305 .

[0140] The presence of the open cavity 400b causes the bottom of the first lens assembly 400 to be open to the first signal processing chip 305. Therefore, the thermal conductive gel on the surface of the first signal processing chip 305 may overflow into the open cavity 400b through the opening of the open cavity 400b, causing contamination to the first light emitting chip 304 and the first light receiving chip 303 in the open cavity 400b.

[0141] In some embodiments, a first heat sink 810 is provided on the surface of the first signal processing chip 305, and a second heat sink 820 is provided on the surface of the second signal processing chip 306. The first heat sink 810 and the second heat sink 820 have the same structure and function. The structure and function of the heat sinks are described below using the first heat sink 810 as an example.

[0142] In some embodiments, the first heat sink 810 includes a first bearing surface 811, a first blocking surface 812, and a first support portion 813. The first bearing surface 811 is disposed horizontally relative to the surface of the circuit board 300, while the first blocking surface 812 is disposed vertically relative to the surface of the circuit board 300. The first blocking surface 812 is connected to the end of the first bearing surface 811, and the first support portion 813 is disposed at the bottom of the first bearing surface 811.

[0143] In some embodiments, the second heat dissipation element 820 includes a second bearing surface 821, a second blocking surface 822, and a second support portion 823. Each surface has the same configuration and function as the first heat dissipation element 810. The following description will be made using the first heat dissipation element 810 as an example.

[0144] In some embodiments, the first supporting surface 811 is located above the first signal processing chip 305. A heat-conducting medium can be provided on the surface of the first supporting surface 811 to dissipate heat from the first signal processing chip 305. Exemplarily, the heat-conducting medium is a thermally conductive gel, which is thermally connected to a heat dissipation boss provided on the bottom surface of the upper housing 201, thereby transferring heat generated by the first signal processing chip 305 through the upper housing 201.

[0145] In some embodiments, the first blocking surface 812 faces the opening of the open cavity 400b. The first blocking surface 812 is located on one side of the first lens assembly 400. The first blocking surface 812 stands between the opening of the open cavity 400b and the first supporting surface 811, thereby forming a certain barrier between the first signal processing chip 305 and the first lens assembly 400. This confines the thermally conductive gel to the first supporting surface 811, thereby preventing the thermally conductive gel on the surface of the first supporting surface 811 from overflowing through the opening of the open cavity 400b into the open cavity 400b.

[0146] In some embodiments, the bottom end of the first support portion 813 is connected to the surface of the circuit board 300. The first support portion 813 is used to support the first supporting surface 811 to a certain height, so as to support the first supporting surface 811 above the first signal processing chip 305. At the same time, the first support portion 813 can realize the connection between the first heat sink 810 and the circuit board 300.

[0147] In some embodiments, the first signal processing chip 305 is electrically connected to the first optical receiving chip 303 and the first optical transmitting chip 304. For example, the first signal processing chip 305 integrates a laser driver chip and a TIA.

[0148] In some embodiments, the first signal processing chip 305 faces both the first light receiving chip 303 and the first light emitting chip 304 . The first light receiving chip 303 and the first light emitting chip 304 are located on the same side of the first signal processing chip 305 .

[0149] In some embodiments, the first signal processing chip 305 and the second signal processing chip 306 are electrically connected to the gold fingers 301 , respectively.

[0150] In some embodiments, the first signal processing chip 305 is electrically connected to the circuit board 300 via the bottom surface. Solder bumps are formed on the bottom surface of the first signal processing chip 305, and the solder bumps are electrically connected to the surface traces of the circuit board 300, thereby achieving an electrical connection between the first signal processing chip 305 and the circuit board 300.

[0151] In some embodiments, the wiring on the surface of the circuit board 300 passes from one side of the first blocking surface 812 through the other side of the first blocking surface 812 and extends into the open cavity 400 b , with a solder pad formed at the end of the wiring.

[0152] The first light receiving chip 303 and the first light emitting chip 304 are electrically connected to the pads at the ends of the traces, respectively, so that the first signal processing chip 305 is electrically connected to the first light receiving chip 303 and the first light emitting chip 304, respectively.

[0153] In some embodiments, a gap is formed between the first blocking surface 812 and the surface of the circuit board 300 to avoid wiring on the surface of the circuit board 300 .

[0154] In some embodiments, two heat dissipation bosses are provided on the bottom surface of the upper housing 201 , which are thermally connected to the first signal processing chip 305 and the second signal processing chip 306 respectively, so as to transfer the heat generated by the signal processing chips to the upper housing 201 through the heat dissipation bosses.

[0155] In some embodiments, the first lens assembly 400 and the second lens assembly 500 are staggered on the same surface of the circuit board 300 so that the optical fiber arrays corresponding to the two lens assemblies are staggered, thereby preventing the optical fiber array connected to the second lens assembly 500 from passing through the surface of the first lens assembly 400 and the first signal processing chip 305, thereby preventing the optical fiber array connected to the second lens assembly 500 from being covered by the heat dissipation boss thermally connected to the first signal processing chip 305, thereby protecting the optical fiber array.

[0156] In some embodiments, a backlight detector 307 is disposed on the surface of the first lens assembly 400 . The backlight detector 307 is disposed on the surface of the circuit board 300 .

[0157] In some embodiments, the backlight detector 307 is located on a side of the first light emitting chip 304 facing the first optical fiber holder 710 to monitor the light power emitted by the first light emitting chip 304 .

[0158] In some embodiments, the first light emitting chip 304 is disposed between the backlight detector 307 and the first signal processing chip 305 .

[0159] In some embodiments, the optical surface of the first lens assembly 400 is fixed, and the relative position of the backlight detector 307 and the first light emitting chip 304 is fixed.

[0160] Figure 15 FIG1 is a schematic side view of an optical module layout according to some embodiments of the present disclosure. Figure 15 As shown, in some embodiments, a first heat sink 810 is provided on the surface of the first signal processing chip 305. The first heat sink 810 includes a first carrying surface 811, a first blocking surface 812, and a first supporting portion 813.

[0161] The first blocking surface 812 forms a certain barrier between the first signal processing chip 305 and the first lens assembly 400 to prevent the thermal conductive gel on the surface of the first supporting surface 811 from overflowing into the open cavity 400b, thereby preventing the thermal conductive gel from contaminating the first light receiving chip 303 and the first light emitting chip 304 in the open cavity 400b.

[0162] In the above embodiment, the first heat sink 810 can not only carry the thermally conductive gel to dissipate heat for the first signal processing chip 305, but also limit the thermally conductive gel on the first heat sink 810, thereby preventing the thermally conductive gel from overflowing through the opening into the open cavity 400b, thereby providing the necessary conditions for the first lens assembly 400 and the first signal processing chip 305 to be arranged in close proximity, thereby ensuring the signal transmission performance between the first light receiving chip covered under the first lens assembly 400 and the built-in TIA of the first signal processing chip 305; and at the same time, ensuring the signal transmission performance between the first light transmitting chip covered under the first lens assembly 400 and the built-in laser driver chip of the first signal processing chip 305.

[0163] Figure 16 This is another layout diagram of an optical module provided according to some embodiments of the present disclosure. Figure 17 Another layout decomposition structure of an optical module provided according to some embodiments of the present disclosure Figure 1 , Figure 18 Another layout decomposition structure of an optical module provided according to some embodiments of the present disclosure Figure 2 .like Figure 16-Figure 18 As shown, in some embodiments, the first lens assembly 400 , the first signal processing chip 305 , the second lens assembly 500 , and the second signal processing chip 306 are located on the same surface of the circuit board 300 .

[0164] In some embodiments, the first lens assembly 400, the first signal processing chip 305, the second lens assembly 500, and the second signal processing chip 306 are arranged on the upper surface of the circuit board 300 to fully utilize the space between the circuit board 300 and the upper shell 201, and utilize the heat dissipation characteristics of the upper shell 201.

[0165] In some embodiments, the end surface of the first lens assembly 400 facing the first signal processing chip 305 is relatively flat, and the end surface of the second lens assembly 500 facing the second signal processing chip 306 is relatively flat.

[0166] In some embodiments, a first light receiving chip 303 and a first light emitting chip 304 are positioned beneath the first lens assembly 400 to enable reception and transmission of optical signals. A second light receiving chip 303a and a second light emitting chip 304a are positioned beneath the second lens assembly 500. The following embodiments use the first lens assembly 400, the first light receiving chip 303, and the first light emitting chip 304 as examples.

[0167] In some embodiments, the first signal processing chip 305 is located on the same surface of the circuit board 300 as the first light receiving chip 303 and the first light emitting chip 304 , and the first lens assembly 400 is located on the same surface of the circuit board 300 .

[0168] In some embodiments, the first signal processing chip 305 is electrically connected to the first light emitting chip 304. The first signal processing chip 305 has a built-in laser driving chip.

[0169] In some embodiments, an open cavity 400b is formed between the first lens assembly 400 and the surface of the circuit board 300. The first light receiving chip 303 and the first light emitting chip 304 are located within the open cavity 400b. For example, the first light receiving chip 303 and the first light emitting chip 304 are disposed on the surface of the circuit board 300 and are covered by the first lens assembly 400.

[0170] As described above, the presence of the open cavity 400b causes the bottom of the first lens assembly 400 to be open to the first signal processing chip 305. In this case, the thermal conductive gel on the surface of the first signal processing chip 305 may overflow into the open cavity 400b through the opening of the open cavity 400b, causing contamination to the first light emitting chip 304 and the first light receiving chip 303 in the open cavity 400b.

[0171] In some embodiments, the TIA 3031 is disposed inside the first signal processing chip 305 , and the laser driving chip is disposed outside the first signal processing chip 305 .

[0172] In some embodiments, the laser driving chip is disposed inside the first signal processing chip 305 , and the TIA 3031 is disposed outside the first signal processing chip 305 .

[0173] In some embodiments, the laser driving chip is disposed inside the first signal processing chip 305 , and the TIA 3031 is disposed outside the first lens assembly 400 .

[0174] In some embodiments, the laser driver chip is disposed within the first signal processing chip 305, and the TIA 3031 is disposed within the open cavity 400b formed by the first lens assembly 400 and the surface of the circuit board 300. For example, the TIA 3031 is disposed on the surface of the circuit board 300 and is covered by the first lens assembly 400.

[0175] In some embodiments, placing the TIA within the open cavity 400b defined by the first lens assembly 400 and the surface of the circuit board 300 is limited by the size of the open cavity 400b. Different types of TIAs 3031 have different sizes. To maintain a stable structure and size of the first lens assembly 400, placing the TIA within the open cavity 400b defined by the first lens assembly 400 and the surface of the circuit board 300 is more suitable for smaller TIAs. Of course, the size of the first lens assembly 400 can also be adjusted to accommodate TIAs of varying sizes.

[0176] In some embodiments, the TIA 3031 is disposed on the side of the first optical receiving chip 303 facing the first optical fiber bracket 710 , that is, the TIA 3031 is located on the side of the first optical receiving chip 303 away from the first signal processing chip 305 , thereby shortening the distance between the first lens assembly 400 and the first signal processing chip 305 .

[0177] In some embodiments, the optical path of the first lens assembly 400 determines that the open cavity 400b has a certain height, so the open space of the open cavity 400b is relatively large, and the thermal conductive gel on the surface of the first signal processing chip 305 can easily overflow into the open cavity 400b, causing contamination to the optical chip.

[0178] In some embodiments, the surface of the first signal processing chip 305 may be covered with the first heat sink 810. The first blocking surface 812 of the first heat sink 810 forms a barrier between the first signal processing chip 305 and the opening of the open cavity 400b, confining the thermally conductive gel to the first supporting surface 811, thereby preventing the thermally conductive gel from overflowing into the open cavity 400b and thereby preventing the thermally conductive gel from contaminating the first light receiving chip 303 and the first light emitting chip 304 within the open cavity 400b.

[0179] In some embodiments, a third heat sink 850 may be provided on the surface of the first signal processing chip 305 , and a fourth heat sink 860 may be provided on the surface of the second signal processing chip 306 .

[0180] In some embodiments, the structure of the third heat dissipation element 850 is similar to that of the first heat dissipation element 810 , so in different embodiments, these two heat dissipation elements are arranged in parallel, and either structure of the heat dissipation element can be used.

[0181] In some embodiments, the third heat dissipation element 850 includes a third supporting surface 851 , a third blocking surface 852 , and a third supporting portion 853 .

[0182] In some embodiments, a heat-conducting medium, such as a heat-conducting gel, may be provided on the third supporting surface 851 to transfer heat generated by the first signal processing chip 305 to the upper housing 201 .

[0183] In some embodiments, a third blocking surface 852 is positioned on the end of the third supporting surface 851 proximal to the first lens assembly 400. The third blocking surface 852 faces the opening of the open cavity 400b, confining the thermally conductive gel to the third supporting surface 851 and thereby preventing it from overflowing into the open cavity 400b. The third blocking surface 852 creates a barrier between the third supporting surface 851 and the open cavity 400b, providing a certain degree of sealing within the open cavity 400b and preventing the thermally conductive gel from overflowing into the open cavity 400b and contaminating the optical chip.

[0184] In some embodiments, a third support portion 853 is provided at the bottom of the third supporting surface 851 to support the third supporting surface 851 above the first signal processing chip 305. Exemplarily, the length of the third support portion 853 is longer than the length of the first support portion 813. Exemplarily, a gap is defined between the third supporting surface 851 and the first signal processing chip 305.

[0185] In some embodiments, the first signal processing chip 305 faces both the first light receiving chip 303 and the first light emitting chip 304 .

[0186] In some embodiments, the first optical receiving chip 303 is located between the TIA 3031 and the first signal processing chip 305. For example, the TIA 3031, the first optical receiving chip 303, and the first signal processing chip 305 are arranged in sequence.

[0187] In some embodiments, the surface pads of the TIA 3031 are connected to the surface pads of the first light receiving chip 303 by wire bonding, thereby achieving electrical connection between the TIA 3031 and the first light receiving chip 303 .

[0188] In some embodiments, the surface pads of the TIA 3031 are connected to the surface of the circuit board 300 by wire bonding to achieve electrical connection between the TIA 3031 and the circuit board 300 .

[0189] In some embodiments, pads are formed around the surface of TIA3031, wherein the pad close to the first light receiving chip 303 is electrically connected to the surface pad of the first light receiving chip 303, and the pads on the other three sides are electrically connected to the surface of the circuit board 300.

[0190] In some embodiments, when the TIA3031 is arranged on the side of the first optical receiving chip 303 facing the first optical fiber bracket 710, the pads on the surface of the TIA3031 used for electrical connection with the first optical receiving chip 303 are arranged adjacent to the pads on the surface of the first optical receiving chip 303 to ensure that the bonding length between the TIA3031 and the first optical receiving chip 303 is short.

[0191] In some embodiments, the position of the pads electrically connected to the first light receiving chip 303 on the surface of the TIA3031 is fixed, and the position of the pads electrically connected to the first light receiving chip 303 on the surface of the TIA3031 is fixed. Figure 5 The relative position relationship between the first light receiving chip 303 and the TIA 3031 is achieved by rotating 180° toward the first optical fiber bracket 710 .

[0192] In some embodiments, the first light emitting chip 304 is located on one side of the first signal processing chip 305 , which can ensure high-frequency signal transmission performance between the first light emitting chip 304 and the first signal processing chip 305 .

[0193] In some embodiments, the first signal processing chip 305 is electrically connected to the circuit board 300 via the bottom surface. Solder bumps are formed on the bottom surface of the first signal processing chip 305, and the solder bumps are electrically connected to the surface traces of the circuit board 300, thereby achieving an electrical connection between the first signal processing chip 305 and the circuit board 300.

[0194] In some embodiments, the traces on the surface of the circuit board 300 pass from one side of the third blocking surface 852 through the other side of the third blocking surface 852 and extend into the open cavity 400 b , with solder pads formed at the ends of the traces.

[0195] The first light emitting chip 304 is electrically connected to the pad at the end of the trace, thereby achieving electrical connection between the first signal processing chip 305 and the first light emitting chip 304 .

[0196] In some embodiments, a backlight detector 307 is provided on a side of the first light emitting chip 304 away from the first signal processing chip 305. The backlight detector 307 is located in the open cavity 400b.

[0197] In some embodiments, the backlight detector 307 is located on a side of the first light emitting chip 304 facing the first fiber support 710 . The first lens assembly 400 splits light to the backlight detector 307 to monitor the light power emitted by the first light emitting chip 304 .

[0198] In some embodiments, the first light emitting chip 304 is disposed between the backlight detector 307 and the first signal processing chip 305 .

[0199] In some embodiments, the optical surface of the first lens assembly 400 is fixed, and the relative position of the backlight detector 307 and the first light emitting chip 304 is fixed.

[0200] In some embodiments, the first signal processing chip 305 is electrically connected to the first light receiving chip 303. The first signal processing chip 305 is integrated with a TIA.

[0201] The laser driver chip is disposed on the side of the first light emitting chip 304 away from the first signal processing chip 305. In this case, the first lens assembly 400 does not perform light splitting. In other words, the backlight detector 307 is not disposed on the side of the first light emitting chip 304 away from the first signal processing chip 305.

[0202] In some embodiments, the first lens assembly 400 and the second lens assembly 500 are offset on the surface of the circuit board 300 so that the optical fiber arrays connected to the two lens assemblies are correspondingly offset on the surface of the circuit board 300, thereby preventing the optical fiber array connected to the second lens assembly 500 from passing through the surface of the first lens assembly 400 and the first signal processing chip 305, thereby preventing the optical fiber array connected to the second lens assembly 500 from being covered by the heat dissipation boss thermally connected to the first signal processing chip 305, thereby protecting the optical fiber array.

[0203] In the above embodiment, the TIA is disposed within the open cavity 400b formed by the first lens assembly 400 and the circuit board 300. The TIA is located on one side of the first light receiving chip 303, thereby ensuring signal transmission performance between the TIA and the first light receiving chip 303. The laser driver chip is embedded in the first signal processing chip 305, which is then electrically connected to the first light emitting chip 304. A third heat sink 850 is positioned above the first signal processing chip 305. This third heat sink 850 not only carries thermally conductive gel to dissipate heat from the first signal processing chip 305 but also prevents any surface thermally conductive gel from escaping into the open cavity 400b. This ensures the close proximity of the first lens assembly 400 and the first signal processing chip 305, thereby ensuring high-frequency signal transmission performance between the first light emitting chip 304, which is projected below the first lens assembly 400, and the laser driver chip within the first signal processing chip 305.

[0204] Figure 19 FIG. 1 is another layout diagram of an optical module provided according to some embodiments of the present disclosure. Figure 20 Another layout decomposition of an optical module provided according to some embodiments of the present disclosure Figure 1 , Figure 21 Another layout decomposition of an optical module provided according to some embodiments of the present disclosure Figure 2 .like Figures 19-21 As shown, in some embodiments, the first lens assembly 400 , the first signal processing chip 305 , the second lens assembly 500 , and the second signal processing chip 306 are disposed on the same surface of the circuit board 300 .

[0205] In some embodiments, the first lens assembly 400, the first signal processing chip 305, the second lens assembly 500, and the second signal processing chip 306 are arranged on the upper surface of the circuit board 300 to fully utilize the space between the circuit board 300 and the upper shell 201, and utilize the heat dissipation characteristics of the upper shell 201.

[0206] In some embodiments, the first signal processing chip 305 is located on the same surface of the circuit board 300 as the first light receiving chip 303 and the first light emitting chip 304 , and the first lens assembly 400 is located on the same surface of the circuit board 300 .

[0207] In some embodiments, the first signal processing chip 305 is electrically connected to the first light transmitting chip 304 and / or the first light receiving chip 303 .

[0208] In some embodiments, an open cavity 400b is formed between the first lens assembly 400 and the surface of the circuit board 300. The first light receiving chip 303 and the first light emitting chip 304 are located within the open cavity 400b. For example, the first light receiving chip 303 and the first light emitting chip 304 are disposed on the surface of the circuit board 300 and are covered by the first lens assembly 400.

[0209] As described above, the presence of the open cavity 400b causes the bottom of the first lens assembly 400 to be open to the first signal processing chip 305. In this case, the thermal conductive gel on the surface of the first signal processing chip 305 may overflow into the open cavity 400b through the opening of the open cavity 400b, causing contamination to the first light emitting chip 304 and the first light receiving chip 303 in the open cavity 400b.

[0210] In some embodiments, a first cover 910 is provided on the surface of the first lens assembly 400 .

[0211] In some embodiments, the first cover 910 includes a top plate 911 , a support plate 912 , and a baffle 913 .

[0212] The top plate 911 is overlapped on the first lens assembly 400. One end of the top plate 911 is disposed on the surface of the first lens assembly 400, and the other end is connected to the baffle 913.

[0213] The support plates 912 on either side stand on the surface of the circuit board 300, with their bottom ends positioned on the surface of the circuit board 300. The support plates 912 are of a certain height, supporting the top plate 911 to a certain height, allowing the top plate 911 to rest on the surface of the first lens assembly 400. The support plates 912 on either side provide enclosure and protection for the TIA 3031 from both sides.

[0214] The baffle 913 faces the first signal processing chip 305 on one side and the opening of the open cavity 400b on the other. The baffle 913 forms a barrier between the opening of the open cavity 400b and the first signal processing chip 305, confining the thermal conductive medium to one side of the baffle 913. This prevents the thermal conductive medium on the surface of the first signal processing chip 305 from entering the open cavity 400b through the opening, thereby preventing contamination of the optical chip in the open cavity 400b.

[0215] In some embodiments, the first signal processing chip 305 is electrically connected to the first light emitting chip 304 , and the laser driving chip is built into the first signal processing chip 305 .

[0216] In some embodiments, the first cover 910 is made of a different material than the first lens assembly 400. Based on the material and process of the first cover 910, the first cover 910 forms a sidewall blocking the opening relative to the first lens assembly 400 itself, and can have a smaller thickness, thereby shortening the distance between the first lens assembly 400 and the first signal processing chip 305.

[0217] In some embodiments, the TIA 3031 is disposed outside the first signal processing chip 305 and also outside the open cavity 400 b .

[0218] In some embodiments, the TIA 3031 is disposed between the first lens assembly 400 and the first signal processing chip 305 .

[0219] In some embodiments, the TIA 3031 is located below the first cover 910 . The first cover 910 covers the surface of the TIA 3031 .

[0220] The top plate 911 can not only fix the first cover 910 on the surface of the first lens assembly 400 , but also cover and protect the TIA 3031 from above.

[0221] In some embodiments, the TIA 3031 is electrically connected to the first light receiving chip 303 , and wire bonding is performed between surface pads of the TIA 3031 and surface pads of the first light receiving chip 303 , thereby achieving electrical connection between the TIA 3031 and the first light receiving chip 303 .

[0222] In some embodiments, the opening of the open cavity 400 b can avoid wire bonding between the TIA 3031 and the first light receiving chip 303 .

[0223] In some embodiments, the first signal processing chip 305 is electrically connected to the circuit board 300 via the bottom surface. Solder bumps are formed on the bottom surface of the first signal processing chip 305, and the solder bumps are electrically connected to the surface traces of the circuit board 300, thereby achieving an electrical connection between the first signal processing chip 305 and the circuit board 300.

[0224] In some embodiments, the wiring on the surface of the circuit board 300 passes from one side of the baffle 913 through the other side of the baffle 913 and extends into the open cavity 400 b , with a solder pad formed at the end of the wiring.

[0225] The first light emitting chip 304 is electrically connected to the pad at the end of the trace, thereby achieving electrical connection between the first signal processing chip 305 and the first light emitting chip 304 .

[0226] In some embodiments, a certain gap is provided between the baffle 913 and the surface of the circuit board 300 to avoid wiring on the surface of the circuit board 300 .

[0227] In some embodiments, both sides of the top plate 911 are expanded and bent outward to form bent portions 9111. Bosses 400a are formed on both sidewalls of the first lens assembly 400, and the bent portions 9111 are disposed on the bosses 400a, thereby securing the first cover 910 to the sidewalls of the first lens assembly 400. It is understood that the first cover 910 can also be secured without forming the bosses 400a.

[0228] In some embodiments, a fifth heat sink 830 is provided on the surface of the first signal processing chip 305 , and a sixth heat sink 840 is provided on the surface of the second signal processing chip 306 .

[0229] In some embodiments, the fifth heat dissipation element 830 includes a supporting surface 831 and a supporting portion 832 located on a bottom surface of the supporting surface 831 .

[0230] The bearing surface 831 is provided on the surface of the first signal processing chip 305. A heat-conducting medium, such as thermally conductive gel, may be provided on the bearing surface 831. The thermally conductive gel is thermally connected to the heat dissipation bosses on the upper housing 201. Heat generated by the first signal processing chip 305 is transferred sequentially through the thermally conductive gel and the heat dissipation bosses to the upper housing 201. The heat is then conducted to the exterior of the optical module through the upper housing 201.

[0231] The bottom end of the support portion 832 is connected to the circuit board 300 . The support portion 832 is used to prop up the carrying surface 831 to a certain height, so that the carrying surface 831 covers the first signal processing chip 305 .

[0232] In some embodiments, the carrying surface 831 is covered on the surface of the first signal processing chip 305, and the baffle 913 can form a barrier between the first lens assembly 400 and the first signal processing chip 305, thereby preventing the thermal conductive gel on the surface of the carrying surface 831 from overflowing into the open cavity 400b, thereby preventing the optical chip from being contaminated by the thermal conductive gel.

[0233] In some embodiments, the TIA 3031 is located outside the first lens assembly 400 and is shielded and protected by a first cover 910. This structure is not limited by the internal space of the first lens assembly 400 and can accommodate TIAs 3031 of different sizes while maintaining the structure of the first fixing assembly 400. For example, the size of the first cover 910 can be adjusted according to the size of the TIA.

[0234] In some embodiments, the TIA 3031 is disposed on a side of the first optical receiving chip 303 facing the first signal processing chip 305 , which ensures that the TIA 3031 and the first optical receiving chip 303 are disposed close to each other, thereby ensuring high-frequency signal transmission performance between the two.

[0235] In some embodiments, a backlight detector 307 is disposed on the surface of the first lens assembly 400 . The backlight detector 307 is disposed on the surface of the circuit board 300 .

[0236] In some embodiments, the backlight detector 307 is disposed on one side of the first light emitting chip 304 to monitor the light emission power of the light emitting chip 304 .

[0237] In some embodiments, the first light emitting chip 304 is disposed between the backlight detector 307 and the first signal processing chip 305 .

[0238] It can be understood that the above embodiment takes the TIA as an example in which the TIA is external to the signal processing chip and the laser driver chip is built into the signal processing chip. Therefore, the technical solution disclosed in the above embodiment is also applicable to the embodiment in which the laser driver chip is external to the signal processing chip and the TIA is built into the signal processing chip.

[0239] In the above embodiment, the TIA 3031 is electrically connected to the first light receiving chip 303 and is located on one side of the first light receiving chip 303, ensuring high-frequency signal transmission performance between the two. The first signal processing chip 305 is electrically connected to the first light transmitting chip 304. A first cover 910 is placed on the surface of the first lens assembly 400. The baffle of the first cover 910 stands between the first lens assembly 400 and the first signal processing chip 305, thereby preventing the thermal conductive gel from escaping into the open cavity 400b. This provides the necessary conditions for the close proximity of the first lens assembly 400, the TIA, and the first signal processing chip 305. This ensures that the first laser driver chip 304, which is projected below the first lens assembly 400, is located in close proximity to the laser driver chip within the first signal processing chip 305, thereby ensuring signal transmission performance between the two.

[0240] Figure 22 FIG. 1 is another layout diagram of an optical module provided according to some embodiments of the present disclosure. Figure 23 This is another layout circuit board surface structure diagram of an optical module provided according to some embodiments of the present disclosure. Figure 22 and Figure 23 As shown, in some embodiments, the signal processing chip and the lens assembly are respectively disposed on two surfaces of the circuit board 300 .

[0241] In some embodiments, the first signal processing chip 305 and the second signal processing chip 306 are disposed on one surface of the circuit board 300. The first light receiving chip 303 and the first light emitting chip 304 are disposed on another surface of the circuit board 300. The first lens assembly 400 covers the surfaces of the first light receiving chip 303 and the first light emitting chip 304. The second lens assembly 500 and the first lens assembly 400 are respectively disposed on the other surface of the circuit board 300.

[0242] In some embodiments, the first signal processing chip 305 and the first lens assembly 400 are located on different surfaces of the circuit board 300 , and the second signal processing chip 306 and the second lens assembly 500 are located on different surfaces of the circuit board 300 .

[0243] In some embodiments, the circuit board 300 includes a first surface and a second surface. For example, the first signal processing chip 305 and the second signal processing chip 306 are disposed on the first surface of the circuit board 300, and the first lens assembly 400 and the second lens assembly 500 are disposed on the second surface of the circuit board 300. The first light receiving chip 303 and the first light emitting chip 304 are disposed on the second surface.

[0244] In some embodiments, the first surface of the circuit board 300 is the upper surface of the circuit board 300 , and the first signal processing chip 305 and the second signal processing chip 306 are disposed on the upper surface of the circuit board 300 to fully utilize the upper housing 201 to dissipate heat for the two signal processing chips.

[0245] In some embodiments, the second surface of the circuit board 300 is the lower surface of the circuit board 300 , and the first lens assembly 400 and the second lens assembly 500 are disposed on the lower surface of the circuit board 300 .

[0246] In some embodiments, the first signal processing chip 305 and the first lens assembly 400 are respectively arranged on different surfaces of the circuit board 300, and the second signal processing chip 306 and the second lens assembly 500 are respectively arranged on different surfaces of the circuit board 300, so that the first signal processing chip 305 and the first lens assembly are separated, and the second signal processing chip 306 and the second lens assembly 500 are separated, effectively preventing the thermal conductive gel on the surface of the signal processing chip from overflowing to the corresponding lens assembly, thereby avoiding contamination of the photosensitive surfaces of the lens assembly, the light receiving chip and the light emitting chip.

[0247] In some embodiments, the first lens assembly 400 is disposed over the surfaces of the first light receiving chip 303 and the first light emitting chip 304 to change the direction of the optical signal transmitted to the first light receiving chip 303 and the direction of the optical emission signal generated by the first light emitting chip 304, thereby enabling optical signal reception and transmission. The second lens assembly 500 adopts the same configuration.

[0248] The first lens assembly 400 covers the surfaces of the first light receiving chip 303 and the first light emitting chip 304 to change the transmission direction of the optical signal to be transmitted to the first light receiving chip 303 and the transmission direction of the light emitting signal generated by the first light emitting chip 304 .

[0249] In some embodiments, the first signal processing chip 305 integrates a TIA and a laser driver chip, and the second signal processing chip 306 integrates a TIA and a laser driver chip.

[0250] In some embodiments, because the first signal processing chip 305 integrates a TIA and a laser driver chip, the first lens assembly 400 is positioned vertically opposite the first signal processing chip 305 in the thickness direction of the circuit board 300. This ensures that the optical receiving chip and the TIA integrated within the first signal processing chip 305 are positioned in close proximity, and that the first optical transmitting chip and the laser driver chip integrated within the first signal processing chip 305 are positioned in close proximity, thereby ensuring signal integrity and improving high-frequency signal transmission performance. The same applies to the position between the second signal processing chip 306 and the second lens assembly 500.

[0251] In some embodiments, the first signal processing chip 305 and the first lens assembly 400 are arranged vertically opposite to each other, so that the first light receiving chip and the first light emitting chip covered by the first lens assembly 400 are respectively arranged vertically close to the first signal processing chip 305.

[0252] In some embodiments, the second signal processing chip 306 and the second lens assembly 500 are disposed vertically opposite each other, so that the first light receiving chip and the first light emitting chip covered by the second lens assembly 500 are disposed close to the second signal processing chip 306 above and below.

[0253] In some embodiments, a first heat dissipation boss 2012 and a second heat dissipation boss 2013 are formed on the bottom surface of the upper housing 201. The first heat dissipation boss 2012 is thermally connected to the first signal processing chip 305, transferring heat generated by the first signal processing chip 305 to the upper housing 201 via the first heat dissipation boss 2012. The heat is then transferred to the outside through the upper housing 201. The second heat dissipation boss 2013 is thermally connected to the second signal processing chip 306, transferring heat generated by the second signal processing chip 306 to the outside via the second heat dissipation boss 2013.

[0254] In some embodiments, the first signal processing chip 305 is integrated with a TIA or a laser driver chip, and the second signal processing chip 306 is integrated with a TIA or a laser driver chip. In this case, the first signal processing chip 305 and the second signal processing chip 306 can also be arranged on the upper surface of the circuit board 300; the first lens assembly 400 and the second lens assembly 500 can also be arranged on the lower surface of the circuit board 300.

[0255] In some embodiments, the first signal processing chip is integrated with a laser driving chip and an external TIA.

[0256] In some embodiments, the TIA may be disposed outside the first lens assembly 400 as described in the above embodiment, and the TIA and the first lens assembly 400 may be disposed together on the lower surface of the circuit board 300 .

[0257] In some embodiments, the TIA may be disposed in the open cavity 400 b enclosed by the first lens assembly 400 and the circuit board 300 as in the above embodiment, and the TIA and the first lens assembly 400 may be disposed together on the lower surface of the circuit board 300 .

[0258] Figure 24 This is a structural diagram of a circuit board provided with a first signal processing chip and a second signal processing chip on its surface according to some embodiments of the present disclosure. Figure 24 As shown, in some embodiments, the first signal processing chip 305 and the second signal processing chip 306 are disposed on the same surface of the circuit board 300 .

[0259] In some embodiments, the first signal processing chip 305 and the second signal processing chip 306 are respectively disposed on the upper surface of the circuit board 300 to fully utilize the better heat dissipation of the upper housing 201 .

[0260] In some embodiments, the first signal processing chip 305 and the second signal processing chip 306 are staggered on the upper surface of the circuit board 300 to disperse heat generated by the two signal processing chips to different areas of the circuit board 300 .

[0261] Figure 25 The following is a structural diagram of a circuit board surface provided with a first lens assembly and a second lens assembly according to some embodiments of the present disclosure. Figure 25 As shown, in some embodiments, the first lens assembly 400 and the second lens assembly 500 are disposed on the same surface of the circuit board 300 .

[0262] In some embodiments, the first lens assembly 400 and the second lens assembly 500 are disposed on the lower surface of the circuit board 300 .

[0263] In some embodiments, the first lens assembly 400 and the second lens assembly 500 are staggered and disposed on the lower surface of the circuit board 300 .

[0264] In some embodiments, the space between the lower surface of the circuit board 300 and the lower shell 202 is smaller than the space between the upper surface of the circuit board 300 and the upper shell 201, and the first lens assembly 400 and the second lens assembly 500 are thinned to adapt to the space between the lower surface of the circuit board 300 and the lower shell 202.

[0265] In some embodiments, the end face of the first lens assembly 400 is butted against the end face of the first optical fiber bracket 710 to reduce the thickness of the first lens assembly 400 and fit into the space between the lower surface of the circuit board 300 and the lower housing 202 .

[0266] In some embodiments, the first light receiving chip 303 is disposed on the lower surface of the circuit board 300 and is covered by the first lens assembly 400 .

[0267] In some embodiments, the first light emitting chip 304 is disposed on the lower surface of the circuit board 300 and is covered by the first lens assembly 400 .

[0268] In some embodiments, the external optical signal is coupled to the optical surface of the first lens assembly 400 via the optical fiber array connected to the first optical fiber bracket 710 , and is then coupled to the first light receiving chip 303 via the first lens assembly 400 .

[0269] In some embodiments, the light emitting signal generated by the first light emitting chip 304 is coupled to the optical fiber array connected to the first optical fiber holder 710 via the first lens assembly 400 , so that the light emitting signal is output along the optical fiber array.

[0270] In some embodiments, a first optical path turning surface 401 is formed on the surface of the first lens assembly 400, and an optical path turning surface 501 is formed on the surface of the second lens assembly 500. The first optical path turning surface 401 and the optical path turning surface 501 have the same structure and function.

[0271] In some embodiments, the optical path turning of the first light receiving chip 303 and the first light emitting chip 304 is achieved through the first optical path turning surface 401 .

[0272] In some embodiments, the first light path turning surface 401 is an inclined surface and has a reflective effect.

[0273] In some embodiments, the external optical signal is coupled to the first optical path turning surface 401 of the first lens assembly 400 via the optical fiber array connected to the first optical fiber bracket 710, and the optical signal transmission direction is changed by reflection from the first optical path turning surface 401, and then coupled to the first optical receiving chip 303 to realize optical signal reception.

[0274] In some embodiments, the light emission signal generated by the first light emitting chip 304 is reflected by the first lens assembly 400 and the first optical path turning surface 401, changing the transmission direction of the light emission signal, and then coupling the light emission signal to the optical fiber array connected to the first optical fiber bracket 710, and outputting the light emission signal to the outside of the optical module to realize light signal emission.

[0275] Figure 26 A schematic diagram of an optical module optical path according to some embodiments of the present disclosure Figure 1 , Figure 27 A schematic diagram of an optical module optical path according to some embodiments of the present disclosure Figure 2 .like Figure 26 and Figure 27 As shown, in some embodiments, the first signal processing chip 305 and the first lens assembly 400 are respectively located on different surfaces of the circuit board 300 .

[0276] In some embodiments, the first optical fiber support 710 is docked with the first lens assembly 400 to thin the first lens assembly 400 .

[0277] In some embodiments, the first lens assembly 400 is disposed toward the lower surface of the circuit board 300 .

[0278] In some embodiments, the first lens assembly 400 and the lower surface of the circuit board 300 form an open cavity 400 b.

[0279] In certain embodiments, the first light receiving chip 303 is disposed on the lower surface of the circuit board 300 and is covered from below by the first lens assembly 400 .

[0280] In some embodiments, the first light emitting chip 304 is disposed on the lower surface of the circuit board 300 and is covered from below by the first lens assembly 400 .

[0281] In some embodiments, a first optical path turning surface 401 is formed on the surface of the first lens assembly 400. Exemplarily, the first optical path turning surface 401 is exposed to the outside.

[0282] In some embodiments, the first light path turning surface 401 is tilted relative to the surface of the circuit board 300 and has a reflective effect, thereby playing the role of light path turning.

[0283] In some embodiments, the first optical path turning surface 401 is located at the intersection of the optical path of the first optical fiber holder 710 and the light path of the first light receiving chip 303. This position is also the intersection of the optical path of the first optical fiber holder 710 and the light path of the first light emitting chip 304.

[0284] In some embodiments, the external optical signal reaches the first optical path turning surface 401 along the optical fiber array connected to the first optical fiber bracket 710, and is reflected by the first optical path turning surface 401 so that the external optical signal is coupled to the first optical receiving chip 303 to achieve optical signal reception.

[0285] In some embodiments, the optical emission signal generated by the first optical emission chip 304 reaches the first optical path turning surface 401, and is reflected by the first optical path turning surface 401 so that the optical emission signal is coupled to the optical fiber array connected to the first optical fiber bracket 710, and output to the outside of the optical module to realize optical signal emission.

[0286] In some embodiments, the first signal processing chip 305 is electrically connected to the first light receiving chip 303. The TIA is built into the first signal processing chip 305.

[0287] In some embodiments, the first signal processing chip 305 is flip-chip mounted on the top surface of the circuit board 300, and the first light receiving chip 303 is flip-chip mounted on the bottom surface of the circuit board 300. The first signal processing chip 305 and the first light receiving chip 303 are electrically connected by drilling vias along the top and bottom surfaces of the circuit board 300.

[0288] For example, solder bumps on the bottom surface of the first signal processing chip 305 are connected downward to the upper surface of the circuit board 300, and solder bumps on the bottom surface of the first light receiving chip 303 are connected upward to the lower surface of the circuit board 300. Vias are used to electrically connect the solder bumps of the first signal processing chip 305 for electrical connection to the light receiving chip 303 and the solder bumps of the first light receiving chip 303 for electrical connection to the first signal processing chip 305.

[0289] Illustratively, the solder bumps of the first signal processing chip 305 electrically connected to the first optical receiving chip 303 are aligned vertically with the solder bumps of the first optical receiving chip 303 electrically connected to the first signal processing chip 305 to shorten the via height and improve high-frequency signal transmission performance.

[0290] In some embodiments, the first signal processing chip 305 is flip-chip mounted on the top surface of the circuit board 300. Vias are drilled along the solder bumps of the first signal processing chip 305 toward the bottom surface of the circuit board 300 to electrically connect the first signal processing chip 305 to the bottom surface of the circuit board 300. The first light receiving chip 303 is electrically connected to the bottom surface of the circuit board 300 by wire bonding. This electrically connects the first signal processing chip 305 to the first light receiving chip 303.

[0291] In some embodiments, the first signal processing chip 305 can be lowered toward the lower surface of the circuit board 300, or the first light receiving chip 303 can be moved toward the upper surface of the circuit board 300 to shorten the electrical connection distance between the first signal processing chip 305 and the first light receiving chip 303 and improve high-frequency signal transmission performance.

[0292] In some embodiments, the first light emitting chip 304 is electrically connected to the first signal processing chip 305. The laser driver chip is built into the first signal processing chip 305. The electrical connection between the first light emitting chip 304 and the first signal processing chip 305 can refer to the electrical connection between the first light receiving chip and the first signal processing chip 305 described above.

[0293] Figure 28 A circuit board surface structure provided according to some embodiments of the present disclosure Figure 1 .like Figure 28 As shown, in some embodiments, a first signal processing chip 305 and a second signal processing chip 306 are disposed on the surface of the circuit board 300 .

[0294] In some embodiments, the first signal processing chip 305 is electrically connected to the first light receiving chip 303 and the first light emitting chip 304 . The TIA and the laser driver chip are built into the first signal processing chip 305 .

[0295] In some embodiments, one side of the first signal processing chip 305 faces both the first light receiving chip 303 and the first light emitting chip 304. For example, the first light receiving chip 303 and the first light emitting chip 304 are disposed on the same side of the first signal processing chip 305.

[0296] In some embodiments, the first optical receiving chip 303 and the first signal processing chip 305 are arranged in close proximity, so that the first optical receiving chip 303 and the TIA in the first signal processing chip 305 are arranged in close proximity, ensuring high-frequency signal transmission performance between the first optical receiving chip 303 and the first signal processing chip 305.

[0297] In some embodiments, the first light emitting chip 304 and the first signal processing chip 305 are arranged in close proximity, so that the first light emitting chip 304 and the TIA in the first signal processing chip 305 are arranged in close proximity, thereby ensuring high-frequency signal transmission performance between the first light emitting chip 304 and the first signal processing chip 305.

[0298] In some embodiments, the first light receiving chip 303 is electrically connected to the first signal processing chip 305. For example, the surface pads of the first light receiving chip 303 are connected to the surface pads of the circuit board 300 by wire bonding, and the solder bumps on the bottom surface of the first signal processing chip 305 are electrically connected to the surface pads of the circuit board 300 via traces on the surface of the circuit board 300, thereby achieving electrical connection between the first light receiving chip 303 and the first signal processing chip 305.

[0299] In some embodiments, the first light emitting chip 304 is electrically connected to the first signal processing chip 305. For example, surface pads on the first light emitting chip 304 are wire-bonded to surface pads on the circuit board 300, and solder bumps on the bottom surface of the first signal processing chip 305 are electrically connected to surface pads on the circuit board 300 via traces on the surface of the circuit board 300, thereby achieving electrical connection between the first light emitting chip 304 and the first signal processing chip 305.

[0300] In some embodiments, a backlight detector 307 is provided on one side of the first light emitting chip 304 to monitor the output optical power of the first light emitting chip 304. Exemplarily, the first light emitting chip 304 is provided between the backlight detector 307 and the first signal processing chip 305.

[0301] In some embodiments, a heating element 308 is provided on one side of the first light emitting chip 304 to enable the first light emitting chip 304 to operate within a certain range and prevent high-frequency performance degradation of the first light emitting chip 304 when the chip is at a low temperature.

[0302] In some embodiments, the heating element 308 is directed toward both the first light emitting chip 304 and the backlight detector 307 .

[0303] In some embodiments, a localized copper metallization process is performed below the first light emitting chip 304 and the heater 308, so that both are located on the same copper-clad area. Heat generated by the heater 308 is transferred to the first light emitting chip 304 through the copper-clad area, thereby increasing the thermal conductivity between the heater 308 and the first light emitting chip 304.

[0304] In some embodiments, the copper cladding area is limited to below the first light emitting chip 304 and the heater 308 to prevent heat generated by the heater 308 from being transferred to other areas, thereby reducing power loss and increasing the temperature regulation efficiency of the first light emitting chip 304 .

[0305] In some embodiments, the surface of the first signal processing chip 305 may be covered with the first heat sink 810 mentioned in the above embodiment, and the first heat sink 810 includes a first blocking surface 812. The specific structure and function of the first heat sink 810 can refer to the above embodiment.

[0306] In some embodiments, the first light receiving chip 303 , the first light emitting chip 304 , the backlight detector 307 , and the heating element 308 are disposed on a surface of the circuit board 300 and are covered by the first lens assembly 400 .

[0307] In some embodiments, the first blocking surface 812 is located on one side of the first lens assembly 400. The first blocking surface 812 can form a certain barrier between the first signal processing chip 305 and the first lens assembly 400 to prevent the thermal conductive gel on the first supporting surface 811 from overflowing into the open cavity 400b, thereby preventing the optical chip from being contaminated by the thermal conductive gel.

[0308] Figure 29 A circuit board surface structure provided according to some embodiments of the present disclosure Figure 2 .like Figure 29 As shown, in some embodiments, a first signal processing chip 305 and a second signal processing chip 306 are provided on the surface of the circuit board 300. The first signal processing chip 305 and the second signal processing chip 306 are configured in the same manner, and the following exemplary description will be made using the first signal processing chip 305 as an example.

[0309] In some embodiments, the first signal processing chip 305 has a built-in laser driver chip and an external TIA 3031 .

[0310] In some embodiments, the TIA 3031 is disposed on a side of the first optical receiver chip 303 away from the first signal processing chip 305 . For example, the first optical receiver chip 303 is disposed between the TIA 3031 and the first signal processing chip 305 .

[0311] In some embodiments, the first light emitting chip 304 and the first light receiving chip 303 are disposed on the same side of the first signal processing chip 305 .

[0312] In some embodiments, a backlight detector 307 is provided on one side of the first light emitting chip 304, and a heating element 308 is provided on one side of the first light emitting chip 304 and the backlight detector 307. The relative relationship between the first light emitting chip 304, the backlight detector 307, and the heating element 308 is as follows: Figure 28 As shown, no further details are given.

[0313] In some embodiments, the first light receiving chip 303 , the TIA 3031 , the first light emitting chip 304 , the backlight detector 307 , and the heating element 308 are disposed on the surface of the circuit board 300 and are covered by the first lens assembly 400 .

[0314] In some embodiments, according to the Figure 30 The relative position relationship between the surface bonding pad of the first light receiving chip 303 and the surface bonding pad of TIA3031 is rotated 180° counterclockwise to obtain the attached Figure 29 The relative position relationship between the surface pads of the first light receiving chip 303 and the surface pads of the TIA3031.

[0315] In some embodiments, a first heat sink 810 may be provided on the surface of the first signal processing chip 305 to prevent the thermal conductive gel on the surface of the first heat sink 810 from overflowing into the open cavity 400 b and contaminating the optical chip.

[0316] In some embodiments, a third heat sink 850 may be provided on the surface of the first signal processing chip 305 to prevent the thermal conductive gel on the surface of the third heat sink 850 from overflowing into the open cavity 400 b and contaminating the optical chip.

[0317] In some embodiments, placement of the TIA within the open cavity 400b defined by the first lens assembly 400 and the surface of the circuit board 300 is limited by the size of the open cavity 400b. Different types of TIAs 3031 have different sizes. To maintain a stable structure and size of the first lens assembly 400, placement of the TIA within the open cavity 400b defined by the first lens assembly 400 and the surface of the circuit board 300 is more suitable for smaller TIAs.

[0318] Figure 29 The illustrated structure is suitable for embodiments in which a laser driver chip is built into a signal processing chip, and the TIA is built into an open cavity 400b formed by the first lens assembly 400 and the circuit board surface. In some embodiments, a solder pad 3033 is provided on the side of the TIA 3031 adjacent to the first light receiving chip 303, and a solder pad 3032 is provided on the side of the first light receiving chip 3033 adjacent to the TIA 3031. Solder pad 3033 is adjacent to and electrically connected to solder pad 3032, thereby achieving electrical connection between the TIA 3031 and the first light receiving chip 303.

[0319] Figure 30 A circuit board surface structure provided according to some embodiments of the present disclosure Figure 3 .like Figure 30 As shown, in some embodiments, a first signal processing chip 305 and a second signal processing chip 306 are provided on the surface of the circuit board 300. The first signal processing chip 305 and the second signal processing chip 306 are configured in the same manner, and the following exemplary description will be made using the first signal processing chip 305 as an example.

[0320] In some embodiments, the first signal processing chip 305 is electrically connected to the first light emitting chip 304 , and the laser driving chip is disposed within the first signal processing chip 305 .

[0321] In some embodiments, the TIA 3031 is disposed on a side of the first optical receiving chip 303 facing the first signal processing chip 305 . Exemplarily, the TIA 3031 is disposed between the first optical receiving chip 303 and the first signal processing chip 305 .

[0322] In some embodiments, the first light emitting chip 304 and the first light receiving chip 303 are disposed on the same side of the first signal processing chip 305 .

[0323] In some embodiments, the first light emitting chip 304 is electrically connected to the first signal processing chip 305. The first signal processing chip 305 is electrically connected to the surface traces of the circuit board 300 via the bottom surface. The surface traces of the circuit board 300 extend into the open cavity 400b and form solder pads at the ends. The surface solder pads of the first light emitting chip 304 are electrically connected to the solder pads at the ends of the traces, thereby achieving electrical connection between the first light emitting chip 304 and the first signal processing chip 305.

[0324] In some embodiments, the first light receiving chip 303 is electrically connected to the TIA 3031. For example, the electrical connection between the surface pads of the first light receiving chip 303 and the surface pads of the TIA 3031 is achieved by wire bonding.

[0325] In some embodiments, the solder pads on the surface of TIA3031 close to the first light receiving chip 303 are used for wire bonding with the first light receiving chip 303. The solder pads on the surface of the first light receiving chip 303 are set close to TIA3031 to shorten the bonding distance between the first light receiving chip 303 and TIA3031.

[0326] In some embodiments, a backlight detector 307 is provided on one side of the first light emitting chip 304, and a heating element 308 is provided on one side of the first light emitting chip 304 and the backlight detector 307. The relative relationship between the first light emitting chip 304, the backlight detector 307, and the heating element 308 is as follows: Figure 28 As shown, no further details are given.

[0327] In some embodiments, the surface of the TIA 3031 is covered with the first cover 910 mentioned in the above embodiment to protect the TIA 3031. The top surface of the first cover 910 is placed on the surface of the first lens assembly 400 to protect the TIA 3031 outside the first lens assembly 400.

[0328] In some embodiments, the first light receiving chip 303, the first light emitting chip 304, the backlight detector 307, and the heater 308 are disposed on the surface of the circuit board 300 and covered by the first lens assembly 400. The TIA 3031 is disposed outside the first lens assembly 400.

[0329] In some embodiments, the surface of the first signal processing chip 305 is covered with the fifth heat sink 830 mentioned in the above embodiment. The fifth heat sink 830 includes a bearing surface 831, and the specific structure of the fifth heat sink 830 is not repeated here.

[0330] The carrying surface 831 is provided on the surface of the first signal processing chip 305. The surface of the carrying surface 831 may be provided with a thermally conductive gel, which is thermally connected to the heat dissipation boss on the upper shell 201, so that the heat generated by the first signal processing chip 305 is transferred to the upper shell 201 in sequence through the thermally conductive gel and the heat dissipation boss, and then the heat is conducted to the outside of the optical module through the upper shell 201.

[0331] In some embodiments, the TIA 3031 is located outside the first lens assembly 400 and is shielded and protected by a first cover 910. This structure is not limited by the internal space of the first lens assembly 400 and can accommodate TIAs 3031 of different sizes while maintaining the structure of the first fixing assembly 400. For example, the size of the first cover 910 can be adjusted according to the size of the TIA.

[0332] Figure 30 The illustrated structure is suitable for embodiments in which a laser driver chip is built into a signal processing chip, and the TIA is positioned outside the first lens assembly 400 and between the first lens assembly 400 and the first signal processing chip 305. In some embodiments, a solder pad 3033 is provided on the side of the TIA 3031 adjacent to the first light receiving chip 303, and a solder pad 3032 is provided on the side of the first light receiving chip 303 adjacent to the TIA 3031. Solder pads 3033 and 3032 are positioned adjacent to and electrically connected to each other, thereby achieving electrical connection between the TIA 3031 and the first light receiving chip 303.

[0333] Will Figure 30 The TIA3031 and the first light receiving chip 303 are rotated 180° counterclockwise to obtain Figure 29 The positional relationship between the TIA3031 and the first light receiving chip 303 is shown in FIG.

[0334] Figure 31 A schematic diagram of a circuit board surface layout according to some embodiments of the present disclosure Figure 1 , Figure 32 A schematic diagram of a circuit board surface layout according to some embodiments of the present disclosure Figure 2 .like Figure 31 and Figure 32 As shown, in some embodiments, the first lens assembly 400 and the first signal processing chip 305 are disposed close to each other on the same surface of the circuit board 300. Figure 31 and attached Figure 32The structure shown can be adapted to a solution in which the first signal processing chip 305 has a built-in TIA and a laser driving chip.

[0335] In some embodiments, an open cavity 400b is formed between the bottom of the first lens assembly 400 and the surface of the circuit board 300 to shorten the distance between the first lens assembly 400 and the first signal processing chip 305. The open cavity 400b is open toward the first signal processing chip 305. However, the presence of the open cavity 400b leaves the bottom of the first lens assembly 400 open to the first signal processing chip 305. Consequently, thermally conductive gel on the surface of the first signal processing chip 305 may overflow into the open cavity 400b, contaminating the first light emitting chip 304 and the first light receiving chip 303 within the open cavity 400b.

[0336] In some embodiments, a first heat sink 810 is disposed on the surface of the first signal processing chip 305. A first bearing surface 811 of the first heat sink 810 carries thermal conductive gel to conduct heat generated by the first signal processing chip 305 to the upper housing 201.

[0337] In some embodiments, a first blocking surface 812 in the first heat sink 810 is located on one side of the first lens assembly 400. The first blocking surface 812 stands between the first lens assembly 400 and the first supporting surface 811, thereby forming a certain barrier between the first signal processing chip 305 and the first lens assembly 400, thereby preventing the thermal conductive gel on the surface of the first supporting surface 811 from overflowing into the open cavity 400b, thereby preventing the thermal conductive gel from contaminating the first light receiving chip 303 and the first light emitting chip 304 in the open cavity 400b.

[0338] In some embodiments, the end of the first heat sink 810 away from the first lens assembly 400 extends beyond the end surface of the first signal processing chip 305, thereby providing sufficient space for the thermal conductive gel on the surface and preventing the thermal conductive gel from overflowing along the end surface of the first signal processing chip to the surface of the circuit board 300.

[0339] In some embodiments, the first supporting surface 811 includes an expansion portion 8111 and a contraction portion 8112. The expansion portion 8111 is disposed adjacent to the first lens assembly 400, and the contraction portion 8112 is connected to the expansion portion 8111.

[0340] Since the width of the first lens assembly 400 is greater than that of the first signal processing chip 305 , the width of the expansion portion 8111 is greater than that of the contraction portion 8112 , thereby enclosing the end face of the first lens assembly 400 over a larger range, thereby protecting the end face of the first lens assembly 400 over a larger range.

[0341] In some embodiments, the first lens assembly 400 is formed with a first refractive surface 410 from the side, and the first refractive surface 410 is located above the first light receiving chip 303.

[0342] In some embodiments, the first refractive surface 410 is inclined relative to the surface of the circuit board 300 .

[0343] In some embodiments, the first lens assembly 400 is connected to the first optical fiber holder 710 .

[0344] In some embodiments, the first light receiving chip 303 is disposed below the first refractive surface 410. The first refractive surface 410 faces downward toward the first light receiving chip 303.

[0345] In some embodiments, the light input path of the first refractive surface 410 is toward the first optical fiber holder 710 , and the light output path is toward the first light receiving chip 303 .

[0346] In some embodiments, the external optical signal is transmitted along the first optical fiber bracket 710 to the first refractive surface 410. The first refractive surface 410 reflects the external optical signal toward the first optical receiving chip 303, thereby turning the external optical signal to the surface of the first optical receiving chip 303. The first optical receiving chip 303 converts the received optical signal into an electrical signal to complete the reception of the optical signal.

[0347] In some embodiments, the first lens assembly 400 is formed from the side with: a second refractive surface 420, a third refractive surface 430 bent and connected to the second refractive surface 420, and a fourth refractive surface 440 bent and connected to the third refractive surface 430. The second refractive surface 420 is located above the first light emitting chip 304, the third refractive surface 430 is located above the second refractive surface 420, and the fourth refractive surface 440 is located above the third refractive surface 430.

[0348] In some embodiments, the third refractive surface 430 connects one end of the second refractive surface 420 and one end of the fourth refractive surface 440 .

[0349] In some embodiments, the second refractive surface 420 , the third refractive surface 430 , and the fourth refractive surface 440 are respectively inclined relative to the surface of the circuit board 300 .

[0350] In some embodiments, the second refractive surface 420 and the third refractive surface 430 have different inclination directions, and the second refractive surface 420 and the third refractive surface 430 form a bending region shaped like a less-than sign.

[0351] In some embodiments, the third refractive surface 430 and the fourth refractive surface 440 have different inclination directions, the second refractive surface 420 and the fourth refractive surface 440 have the same inclination direction, and the third refractive surface 430 and the fourth refractive surface 440 form a bending area in the form of a greater than sign.

[0352] In some embodiments, the optical signal emitted by the first light emitting chip 304 is transmitted upward to the second refractive surface 420 in a direction perpendicular to the circuit board 300. A portion of the optical signal is reflected by the second refractive surface 420 to the backlight detector 307 for light splitting, thereby monitoring the optical power emitted by the first light emitting chip 304. Another portion of the optical signal is refracted upward from the surface of the second refractive surface 420 to the third refractive surface 430, and then refracted upward from the third refractive surface 430 to the fourth refractive surface 440. The fourth refractive surface 440 faces the first optical fiber holder 710. Therefore, the optical signal reaching the fourth refractive surface 440 is reflected by the fourth refractive surface 440 into the first optical fiber holder 710. As a result, the optical signal generated by the first light emitting chip 304 is transmitted to the outside of the optical module via the first optical fiber holder 710, completing the transmission of the optical signal.

[0353] In some embodiments, the first refractive surface 410, the second refractive surface 420, the third refractive surface 430, and the fourth refractive surface 440 are respectively located on the side surfaces of the first lens assembly 400. For example, these refractive surfaces are respectively formed by digging inward from the side surfaces of the first lens assembly 400. These refractive surfaces are all hidden in the first lens assembly 400 to prevent them from being contaminated.

[0354] In some embodiments, the top surface 450 of the first lens assembly 400 extends out to shield the first refractive surface 410 and the fourth refractive surface 440 from above to prevent these refractive surfaces from being contaminated.

[0355] In some embodiments, the first blocking surface 812 stands on the side of the refractive surfaces of the first lens assembly 400, thereby preventing the thermal conductive gel from overflowing toward the refractive surfaces, thereby ensuring the cleanliness of the refractive surfaces.

[0356] Figure 33 A lens assembly structure provided according to some embodiments of the present disclosure Figure 1 .like Figure 33 As shown, in some embodiments, a top surface 450 is formed above the first lens assembly 400 .

[0357] In some embodiments, the first lens assembly 400 is formed with a first refractive surface 410 above the first light receiving chip 303 to reflect the optical signal onto the first light receiving chip 303 .

[0358] In some embodiments, the first lens assembly 400 sequentially forms a second refractive surface 420, a third refractive surface 430, and a fourth refractive surface 440 above the first light emitting chip 304, so as to gradually transmit the optical signal generated by the first light emitting chip 304 to the fourth refractive surface 440, so as to transmit the optical signal into the first optical fiber bracket 710 through reflection by the fourth refractive surface 440, and then transmit it to the outside.

[0359] In some embodiments, the top surface 450 covers the first refractive surface 410 and the fourth refractive surface 440 from above to cover and shield the first refractive surface 410 and the fourth refractive surface 440 from above, respectively, to prevent other objects from touching the first refractive surface 410 and the fourth refractive surface 440, thereby preventing their surfaces from being contaminated and protecting the optical surface.

[0360] In some embodiments, a first groove 460 and a second groove 470 are respectively formed on both sides of the bottom surface of the first lens assembly 400. The first groove 460 and the second groove 470 are recessed upward.

[0361] In some embodiments, the bottom surface of the first lens assembly 400 is fixedly connected to the surface of the circuit board 300 , and the bottom surface of the first lens assembly 400 is covered with the first light emitting chip 304 , the first light receiving chip 303 , etc.

[0362] In some embodiments, a viscous medium is bidirectionally filled along the edges of both sides of the bottom surface of the first lens assembly 400 to secure the first lens assembly 400 to the surface of the circuit board 300. The gap between the first lens assembly 400 and the circuit board 300 has a capillary wicking effect, which draws the filled viscous medium into the gap and flows toward the center. The provision of the first groove 460 and the second groove 470 prevents the viscous filler from continuing toward the center and onto the surfaces of the first light emitting chip 304, the first light receiving chip 303, and the like, potentially contaminating them and affecting the adhesive fixation of the first lens assembly 400. Exemplarily, the viscous medium is glue.

[0363] In some embodiments, the viscous medium is bidirectionally filled on both sides of the bottom surface of the first lens assembly 400 , and the viscous medium on both sides is sucked into the first groove 460 and the second groove 470 , thereby preventing it from continuing to flow toward the center of the first lens assembly 400 .

[0364] The arrangement of the first groove 460 and the second groove 470 can form a height difference between the bottom surfaces of the two side edges of the first lens assembly 400 and the surfaces of the first groove 460 and the second groove 470, respectively, thereby reducing the capillary siphon phenomenon of the viscous medium. Therefore, the first groove 460 and the second groove 470 play a role in separating glue.

[0365] Figure 34 FIG. 1 is a structural diagram of a first heat dissipation element according to some embodiments of the present disclosure. Figure 34 As shown, in some embodiments, the first heat dissipation element 810 includes a first supporting surface 811 , a first blocking surface 812 located on one side of the first supporting surface 811 , and a first supporting portion 813 located below the first supporting surface 811 .

[0366] In some embodiments, the first supporting portions 813 are distributed on both sides below the first blocking surface 812 and on both sides below the first supporting surface 811 .

[0367] In some embodiments, a clearance gap 814 is formed between the first blocking surface 812 and the surface of the circuit board 300 to avoid the wiring between the first light receiving chip 303 and the first light transmitting chip 304 covered under the first lens assembly 400 and the first signal processing chip 305 .

[0368] Figure 35 A schematic diagram of a circuit board surface layout provided in some embodiments of the present disclosure Figure 3 , Figure 36 A schematic diagram of a circuit board surface layout according to some embodiments of the present disclosure Figure 4 .like Figure 35 and Figure 36 As shown, in some embodiments, the first lens assembly 400 and the first signal processing chip 305 are located on the same surface of the circuit board 300. Figure 35 and Figure 36 The provided structure is suitable for the first signal processing chip 305 to have a built-in laser driver chip and an external TIA. Alternatively, the first signal processing chip 305 to have a built-in TIA and an external laser driver chip.

[0369] In some embodiments, an open cavity 400 b is formed between the bottom of the first lens assembly 400 and the surface of the circuit board 300 .

[0370] In some embodiments, the TIA 3031 is disposed in an open cavity 400b formed by the first lens assembly 400 and the surface of the circuit board 300. The first light receiving chip 303 and the TIA 3031 are disposed in the open cavity 400b. The first light receiving chip 303 and the TIA 3031 are disposed on the surface of the circuit board 300 and are covered by the first lens assembly 400.

[0371] In some embodiments, a third heat sink 850 is provided on the surface of the first signal processing chip 305. The third heat sink 850 can seal the open cavity 400b, thereby preventing the thermal conductive gel from overflowing into the open cavity 400b.

[0372] In some embodiments, the first light receiving chip 303 is located between the TIA 3031 and the first signal processing chip 305 .

[0373] In some embodiments, the TIA 3031 is disposed in an open cavity 400 b enclosed by the first lens assembly 400 and the surface of the circuit board 300 , shortening the distance between the first lens assembly 400 and the first signal processing chip 305 and bringing them closer together.

[0374] Figure 37 FIG. 1 is a structural diagram of a third heat sink according to some embodiments of the present disclosure. Figure 37 As shown, in some embodiments, the third heat dissipation element 850 includes a third supporting surface 851 , a second blocking surface 82 located above one side of the third supporting surface 851 , and a third supporting portion 835 located below the third supporting surface 851 .

[0375] In some embodiments, a thermally conductive gel may be provided on the third supporting surface 851 to transfer heat generated by the first signal processing chip 305 to the upper housing 201 .

[0376] In some embodiments, the third blocking surface 852 is located at one end of the third supporting surface 851 close to the first lens assembly 400 , thereby preventing the thermally conductive gel on the third supporting surface 851 from overflowing into the open cavity 400 b while also avoiding the wiring between the first light emitting chip 304 and the first signal processing chip 305 .

[0377] In some embodiments, the third support portion 853 is disposed at the bottom of the third supporting surface 851 to prop up the third supporting surface 851 above the first signal processing chip 305. The third support portion 853 is longer than the first support portion 813.

[0378] Figure 38 A schematic diagram of a circuit board surface layout according to some embodiments of the present disclosure Figure 5 , Figure 39 A schematic diagram of a circuit board surface layout according to some embodiments of the present disclosure Figure 6 .like Figure 38 and Figure 39 As shown, in some embodiments, the first lens assembly 400 and the first signal processing chip 305 are located on the same surface of the circuit board 300. Figure 38 and Figure 39 The structure shown is suitable for the first signal processing chip 305 having a built-in laser driver chip and an external TIA 3031. Alternatively, the first signal processing chip 305 has a built-in TIA 3031 and an external laser driver chip.

[0379] In some embodiments, the TIA 3031 is disposed outside the first lens assembly 400 . The TIA 3031 is disposed between the first lens assembly 400 and the first signal processing chip 305 .

[0380] In some embodiments, the surface of the TIA 3031 is covered with a first cover 910 . The first cover 910 is placed on the top surface of the first lens assembly 400 to protect the TIA 3031 .

[0381] Figure 40 FIG. 1 is a bottom structural diagram of a first lens assembly according to some embodiments of the present disclosure. Figure 40 As shown, in some embodiments, the first lens assembly 400 is connected to the first optical fiber holder 710 .

[0382] In some embodiments, the first optical fiber bracket 710 is contracted at one end toward the first lens assembly 400, and the contracted area does not completely enter the first lens assembly 400, so that there is a margin between the first optical fiber bracket 710 and the first lens assembly 400 to avoid mutual interference between the two due to processing errors, thereby ensuring that the two are tightly engaged with each other.

[0383] In some embodiments, one end of the first lens assembly 400 is covered with a first light receiving chip 303 , and the other end is covered with a first light emitting chip 304 , a backlight detector 307 and a heating element 308 .

[0384] Figure 41 This is an exploded view of the assembly of a first lens assembly and a first optical fiber support according to some embodiments of the present disclosure. Figure 41 As shown, in some embodiments, the first lens assembly 400 is connected to the first optical fiber holder 710 .

[0385] In some embodiments, a supporting surface 480 is formed at the rear of the first lens assembly 400 to support the first optical fiber holder 710. Exemplarily, the first optical fiber holder 710 is disposed on the surface of the supporting surface 480.

[0386] In some embodiments, a first assembly hole 711 and a second assembly hole 712 are respectively formed on both sides of the end surface where the first optical fiber bracket 710 is connected to the first lens assembly 400 to achieve assembly connection with the first lens assembly 400 .

[0387] In some embodiments, the first assembly hole 711 and the second assembly hole 712 are respectively formed with a first fiber array fixing hole 713 and a second fiber array fixing hole 714. The first fiber array fixing hole 713 is provided with a first fiber array, which is used to transmit external optical signals to the surface of the first lens assembly 400. The second fiber array fixing hole 714 is provided with a second fiber array, which is used to transmit the optical signals generated by the first light emitting chip 304 to the outside of the optical module.

[0388] Figure 42 FIG1 is a side view of a first lens assembly according to some embodiments of the present disclosure. Figure 42 As shown, in some embodiments, a supporting surface 480 is formed at the rear portion of the first lens assembly 400 to support the first optical fiber support 710 .

[0389] In some embodiments, a first limiting post 491 and a second limiting post 492 are formed on either side of the mating surface of the first optical fiber bracket 710. The first assembly hole 711 is nested in the first limiting post 491, and the second assembly hole 712 is nested in the second limiting post 492, thereby limiting the first optical fiber bracket 710 on the first lens assembly 400 and achieving a fixed connection between the first optical fiber bracket 710 and the first lens assembly 400.

[0390] In some embodiments, a first lens array 493 and a second lens array 494 are respectively formed between the first limiting pillar 491 and the second limiting pillar 492 to improve light coupling efficiency.

[0391] In some embodiments, the first lens array 493 is coupled to the first optical fiber array, and the second lens array 494 is coupled to the second optical fiber array. In some embodiments, the first lens array 493 includes a plurality of collimating lenses, and the second lens array 494 includes a plurality of converging lenses.

[0392] In some embodiments, the first lens array 493 receives the optical signal from the first optical fiber array, and the collimating lens included in the first lens array 493 collimates the signal light to obtain parallel light, which enters the first lens assembly 400.

[0393] In some embodiments, the optical signal emitted by the first optical emitting chip 304 enters the second lens array 494 after the transmission direction is turned, and the signal light is converged by the converging lens included in the second lens array 494, and then converged to the optical fiber end face and enters the second optical fiber array.

[0394] In some embodiments, the first lens array 493 and the second lens array 494 are both optical surfaces that require precision machining. During precision machining, a height difference will be formed with the surroundings, so a step surface 495 is formed between the first lens array 493 and the second lens array 494.

[0395] Figure 43 This is a cross-sectional structural diagram of a first lens assembly and a first optical fiber support assembly according to some embodiments of the present disclosure. Figure 43 As shown, in some embodiments, one end of the first optical fiber bracket 710 is embedded in the first lens assembly 400 , thereby achieving connection between the first optical fiber bracket 710 and the first lens assembly 400 .

[0396] In some embodiments, the end surface 715 of the first optical fiber holder 710 is connected to the first lens assembly 400 .

[0397] In some embodiments, the end face 715 is polished to form an inclined end face so that light reflected from the optical fiber end face is guided to the optical fiber cladding, thereby preventing the light from being returned to the optical fiber core layer and ensuring signal quality.

[0398] In some embodiments, the angle between the end face 715 and the vertical plane is 9°-10°. Exemplarily, the angle is 8° to improve the return loss.

[0399] Figure 44 FIG. 1 is a cross-sectional structural diagram of a first lens assembly provided according to some embodiments of the present disclosure. Figure 44 As shown, in some embodiments, a first inclined boss 496 is formed on one side of the first limiting column 491 , and a second inclined boss 497 is formed on one side of the second limiting column 492 .

[0400] In some embodiments, the first inclined boss 496 and the second inclined boss 497 are respectively tightly fitted and connected to the end surface 715 to increase the physical contact between the first optical fiber bracket 710 and the first lens assembly 400 to be closer.

[0401] In some embodiments, both ends of the end surface 715 are tightly fitted with the first inclined boss 496 and the second inclined boss 497 respectively.

[0402] In some embodiments, the surface of the first inclined boss 496 is protruded relative to the root of the first limiting column 491 , and the surface of the second inclined boss 497 is protruded relative to the root of the second limiting column 492 .

[0403] In some embodiments, the first inclined boss 496 and the second inclined boss 497 can provide a better fitting surface for fixation with the end face 715 , and are also easier to process than making an inclined end face from the root of the first limiting column 491 and the second limiting column 492 .

[0404] Figure 45 FIG. 1 is a bottom surface structural diagram of a first lens assembly provided according to some embodiments of the present disclosure. Figure 45 As shown, in some embodiments, a first refractive surface 410 is formed on one side of the surface of the first lens assembly 400 , and a second refractive surface 420 , a third refractive surface 430 and a fourth refractive surface 440 are formed on the other side.

[0405] In some embodiments, a third lens array 498 is formed at the bottom of the first lens assembly 400 corresponding to the first refractive surface 410 side, and a fourth lens array 499 is formed at the bottom of the first lens assembly 400 corresponding to the second refractive surface 420 side.

[0406] In some embodiments, the first light receiving chip 303 is disposed below the third lens array 498. The third lens array 498 includes a plurality of converging lenses to converge the optical signal and couple it into the first light receiving chip 303, thereby increasing optical coupling efficiency.

[0407] In some embodiments, the first light emitting chip 304 is disposed below the fourth lens array 499. For example, the fourth lens array 499 includes a plurality of collimating lenses to collimate the divergent light emitted by the first light emitting chip 304 and couple it into the first lens assembly 400 to increase light coupling efficiency.

[0408] In some embodiments, the surface where the third lens array 498 is located protrudes from the surface where the fourth lens array 499 is located, so that the focal length of the third lens array 498 falls on the first light receiving chip 303 and the focal length of the fourth lens array 499 falls on the first light emitting chip 304.

[0409] In some embodiments, the third lens array 498 and the fourth lens array 499 are optical surfaces that require precision machining, and a height difference will be formed with the surroundings during precision machining.

[0410] In some embodiments, a first groove 460 and a second groove 470 are formed at the bottom end of the first lens assembly 400 .

[0411] In some embodiments, the provision of the first groove 460 and the second groove 470 can create a height difference between the bottommost surface of the two side edges of the first lens assembly 400 and the surfaces of the first groove 460 and the second groove 470, respectively, thereby reducing the capillary wicking effect of glue on the gap between the first lens assembly 400 and the surface of the circuit board 300. The first groove 460 and the second groove 470 can also act as a glue barrier.

[0412] In some embodiments, if the gap between the surface of the third lens array 498 and the fourth lens array 499 and the circuit board 300 is large, the capillary siphoning phenomenon of the gap on the glue is weak, and the first groove 460 and the second groove 470 may not be formed.

[0413] The above description is merely a specific embodiment of the present disclosure, but the scope of protection of the present disclosure is not limited thereto. Any changes or substitutions that a person skilled in the art can conceive within the technical scope disclosed in the present disclosure should be included within the scope of protection of the present disclosure. Therefore, the scope of protection of the present disclosure should be based on the scope of protection of the claims.

Claims

1. An optical module, characterized in that: include: A circuit board, with a first light emitting chip and a first light receiving chip provided on the surface; a first signal processing chip, electrically connected to the circuit board, located on the same surface of the circuit board as the first light emitting chip and the first light receiving chip, the first signal processing chip being electrically connected to the first light emitting chip and / or the first light receiving chip; The surface of the first signal processing chip dissipates heat through a heat-conducting medium; a first lens assembly, located on the same surface of a circuit board as the first signal processing chip, forming an open cavity between the first lens assembly and the surface of the circuit board, the open cavity having an opening open toward the first signal processing chip, the first light emitting chip and the first light receiving chip being located within the open cavity, the first lens assembly covering the first light receiving chip and the surface of the first light emitting chip to change the transmission direction of the optical signal to be transmitted to the first light receiving chip and to change the transmission direction of the optical transmission signal generated by the first light emitting chip; A first cover, comprising a top plate and a baffle, wherein the top plate is overlapped on the first lens assembly; The baffle faces the opening and forms a barrier between the opening and the first signal processing chip to prevent the heat-conducting medium from entering the open cavity through the opening.

2. The optical module according to claim 1, wherein The first signal processing chip is electrically connected to the circuit board through the bottom surface; A trace is formed on the surface of the circuit board, and the trace passes through the baffle from one side and extends into the open cavity. A solder pad is formed at the end of the trace, and the first light emitting chip and / or the first light receiving chip are connected to the solder pad by wire bonding.

3. The optical module according to claim 1, wherein: The first lens assembly is formed with a first refractive surface from the side, and the first refractive surface is provided above the first light receiving chip to bend the transmission direction of the optical signal to be transmitted to the first light receiving chip; The first lens assembly is formed from the side surface from bottom to top with: a second refractive surface, a third refractive surface bent and connected to the second refractive surface, and a fourth refractive surface bent and connected to the third refractive surface, wherein the second refractive surface is arranged above the first light emitting chip; the transmission direction of the optical signal generated by the first light emitting chip is turned in sequence through the second refractive surface, the third refractive surface, and the fourth refractive surface; The top surface of the first lens component extends out to shield the first refractive surface and the fourth refractive surface from above.

4. The optical module according to claim 1, wherein: The first signal processing chip is electrically connected to the first light emitting chip and the first light receiving chip respectively; The surface of the first signal processing chip is covered with a first heat sink; The first heat dissipation element comprises: a first carrying surface, a surface of which is provided with a heat-conducting medium for dissipating heat from the first signal processing chip; a first blocking surface, provided on one side of the first bearing surface and located between the first lens assembly and the first bearing surface, to prevent the heat-conducting medium from overflowing into the open cavity; The first supporting portion is disposed at the bottom of the first carrying surface to support the first carrying surface above the first signal processing chip.

5. The optical module according to claim 1, wherein: The first signal processing chip is electrically connected to the first light emitting chip, and the TIA is disposed in the open cavity; The TIA is located on a side of the first light receiving chip away from the first signal processing chip, and the first light receiving chip is located between the TIA and the first signal processing chip; A third heat sink is provided above the first signal processing chip, and the third heat sink comprises: A third bearing surface is provided with a heat-conducting medium on its surface to dissipate heat from the first signal processing chip; a third blocking surface, standing on one end of the third supporting surface close to the first lens assembly, to prevent the heat-conducting medium from overflowing into the open cavity; The third supporting portion is located at the bottom of the third carrying surface to support the third carrying surface to above the first signal processing chip.

6. The optical module according to claim 1, wherein: The first signal processing chip is located on a surface of the circuit board, and the first signal processing chip is electrically connected to the first light receiving chip and the first light emitting chip respectively; The first light receiving chip and the first light emitting chip are located on the other surface of the circuit board, and the first lens assembly covers the surfaces of the first light receiving chip and the first light emitting chip. The first lens assembly and the first signal processing chip are correspondingly arranged up and down along the thickness direction of the circuit board. The first lens assembly covers the surfaces of the first light receiving chip and the first light emitting chip to change the transmission direction of the optical signal to be transmitted to the first light receiving chip, and change the transmission direction of the optical emission signal generated by the first light emitting chip.

7. An optical module, characterized in that: include: A circuit board, with a first light emitting chip and a first light receiving chip provided on the surface; A first signal processing chip is provided on the surface of the circuit board, and is located on the same surface of the circuit board as the first light emitting chip and the first light receiving chip, and the first signal processing chip is electrically connected to the first light emitting chip; The surface of the first signal processing chip dissipates heat through a heat-conducting medium; a first lens assembly, located on the same surface of a circuit board as the first signal processing chip, forming an open cavity between the first lens assembly and the circuit board surface, the first light emitting chip and the first light receiving chip being located within the open cavity, the first lens assembly covering the first light receiving chip and the surface of the first light emitting chip to change the transmission direction of the optical signal to be transmitted to the first light receiving chip and the transmission direction of the optical transmission signal generated by the first light emitting chip; A TIA is located outside the open cavity and is electrically connected to the first light receiving chip; A first cover is provided on the surface of the TIA, and includes a top plate, a support plate and a baffle. The top plate overlaps the surface of the first lens assembly; the support plate stands on the surface of the circuit board; the baffle faces the first signal processing chip, and the baffle stands between the first lens assembly and the first signal processing chip to form a barrier between the open cavity and the first signal processing chip.

8. The optical module according to claim 7, wherein: The bottom surface of the first signal processing chip is electrically connected to the circuit board. A trace is formed on the surface of the circuit board. The trace passes through the baffle from one side and extends into the open cavity. A solder pad is formed at the end of the trace. The first light emitting chip is connected to the solder pad by wire bonding.

9. The optical module according to claim 7, wherein: A backlight detector is provided on one side of the first light emitting chip, and the first light emitting chip is provided between the backlight detector and the first signal processing chip; A heating element is provided on one side of the first light emitting chip and the backlight detector, and the first light emitting chip and the heating element are located on the same copper cladding area.

10. The optical module according to claim 7, wherein: There is an avoidance gap between the baffle and the surface of the circuit board.

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