Electronic device

Abstract

The invention discloses electronic equipment, and belongs to the technical field of electronic equipment. The electronic equipment comprises a first circuit board, a sensing module, a battery, a second circuit board and a component, the first circuit board is provided with a hollow area; the sensing module and the battery are arranged on the two sides of the first circuit board respectively, and at least part of at least one of the battery and the sensing module is arranged in the hollow area; the second circuit board is positioned on one side of the first circuit board; the number of the components is multiple, and the multiple components are arranged on the first circuit board and the second circuit board respectively.

Description

Technical Field

[0001] The present application belongs to the technical field of electronic equipment, and specifically relates to an electronic equipment. Background Art

[0002] Currently, a smart watch is provided with a PPG sensor, a circuit board and a battery, and the battery, the circuit board and the PPG sensor are stacked along the thickness direction of the smart watch.

[0003] In the related art, in order to reduce the thickness of the smart watch, an air-avoidance hole is opened on the circuit board, and the PPG sensor is embedded in the air-avoidance hole. However, opening the air-avoidance hole on the circuit board will cause the area of ​​the circuit board to be reduced, which in turn leads to insufficient space for the arrangement of components on the circuit board. Summary of the Invention

[0004] The present application aims to provide an electronic device that at least solves the problem of insufficient arrangement space for components on the circuit board due to the reduction in the area of ​​the circuit board.

[0005] In order to solve the above technical problems, this application is implemented as follows:

[0006] In a first aspect, an embodiment of the present application proposes an electronic device, comprising a first circuit board, a sensor module, a battery, a second circuit board and components; the first circuit board is provided with a hollow area; the sensor module and the battery are respectively arranged on both sides of the first circuit board, and at least a portion of at least one of the battery and the sensor module is arranged in the hollow area; the second circuit board is located on one side of the first circuit board; the number of components is multiple, and the multiple components are respectively arranged on the first circuit board and the second circuit board.

[0007] In an embodiment of the present application, the electronic device includes a first circuit board, a sensor module and a battery, and the first circuit board is provided with a hollow area; the sensor module and the battery are respectively arranged on both sides of the first circuit board, and at least a portion of at least one of the battery and the sensor module is arranged in the hollow area, thereby reducing the space occupied by the sensor module and / or the battery in the thickness direction of the electronic device, making the first circuit board, the battery and the sensor module more compact, thereby making the thickness of the electronic device smaller, and facilitating the thinness and lightness of the electronic device.

[0008] The electronic device also includes a second circuit board and components. The second circuit board is located on one side of the first circuit board. There are multiple components, and the multiple components are respectively arranged on the first circuit board and the second circuit board. The second circuit board enables the internal circuit board of the electronic device to have a larger installation area, and the components have a more sufficient installation area, thereby making the layout of the components more convenient and improving the stability of the electronic device during operation.

[0009] Additional aspects and advantages of the present application will be given in part in the description below, and in part will become obvious from the description below, or will be learned through practice of the present application. BRIEF DESCRIPTION OF THE DRAWINGS

[0010] The above and / or additional aspects and advantages of the present application will become apparent and easily understood from the description of the embodiments in conjunction with the following drawings, in which:

[0011] Figure 1 This is one of the structural diagrams of an electronic device according to an embodiment of the present application;

[0012] Figure 2 is one of the schematic diagrams of the three-dimensional structure of an electronic device according to an embodiment of the present application;

[0013] Figure 3 This is a second schematic diagram of a three-dimensional structure of an electronic device according to an embodiment of the present application;

[0014] Figure 4 for Figure 3 A cross-sectional view of the electronic device (at the first circuit board) along AA according to an embodiment of the present application is shown;

[0015] Figure 5 for Figure 3 A cross-sectional view of the electronic device (at the second circuit board) along AA according to an embodiment of the present application is shown;

[0016] Figure 6 This is a third schematic diagram of a three-dimensional structure of an electronic device according to an embodiment of the present application;

[0017] Figure 7 This is a fourth schematic diagram of a three-dimensional structure of an electronic device according to an embodiment of the present application;

[0018] Figure 8 for Figure 7 A cross-sectional view of the electronic device (at the first circuit board) along line BB according to an embodiment of the present application is shown;

[0019] Figure 9 for Figure 7 A cross-sectional view of the electronic device (at the second circuit board) along line BB according to an embodiment of the present application is shown;

[0020] Figure 10 This is one of the assembly diagrams of the second circuit board and the support structure according to an embodiment of the present application;

[0021] Figure 11 This is a second schematic diagram of the assembly of the second circuit board and the support structure according to an embodiment of the present application;

[0022] Figure 12This is a third assembly diagram of the second circuit board and the support structure according to an embodiment of the present application;

[0023] Figure 13 This is a fifth schematic diagram of a three-dimensional structure of an electronic device according to an embodiment of the present application;

[0024] Figure 14 for Figure 13 A cross-sectional view of an electronic device along CC according to an embodiment of the present application is shown;

[0025] Figure 15 This is a second structural diagram of an electronic device according to an embodiment of the present application;

[0026] Figure 16 This is a fourth schematic diagram of the assembly of the second circuit board and the support structure according to an embodiment of the present application;

[0027] Figure 17 This is a fifth assembly diagram of the second circuit board and the support structure according to an embodiment of the present application;

[0028] Figure 18 This is the sixth schematic diagram of the three-dimensional structure of the electronic device according to the embodiment of the present application.

[0029] Reference numerals:

[0030] 100 first circuit board, 110 hollow area, 120 notch, 200 sensor module, 300 battery, 400 second circuit board, 500 components, 510 first device, 520 second device, 600 supporting structure, 710 first solder, 720 second solder, 810 shielding cover, 820 speaker, 830 motor. DETAILED DESCRIPTION

[0031] The embodiments of the present application will be described in detail below. Examples of the embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals throughout represent the same or similar elements or elements having the same or similar functions. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain the present application and are not to be construed as limiting the present application. Based on the embodiments in the present application, all other embodiments obtained by ordinary technicians in this field without making creative efforts are within the scope of protection of this application.

[0032] The terms "first" and "second" in the specification and claims of this application may explicitly or implicitly refer to one or more of the features. Throughout the description of this application, unless otherwise specified, "plurality" means two or more. Furthermore, "and / or" in the specification and claims refers to at least one of the connected entities, and the character " / " generally indicates an "or" relationship between the connected entities.

[0033] In the description of the present application, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise", "axial", "radial", "circumferential" and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as a limitation on the present application.

[0034] In the description of this application, it should be noted that, unless otherwise expressly specified or limited, the terms "mounted," "connected," and "connected" should be understood in a broad sense. For example, they can refer to fixed connections, detachable connections, or integral connections; mechanical connections or electrical connections; direct connections or indirect connections through an intermediate medium; and internal connections between two components. Those skilled in the art will understand the specific meanings of the above terms in this application based on the specific circumstances.

[0035] The following combination Figures 1 to 18 An electronic device according to an embodiment of the present application is described.

[0036] like Figure 1 and Figure 2 As shown, an electronic device according to some embodiments of the present application includes a first circuit board 100, a sensor module 200, a battery 300, a second circuit board 400 and components 500; the first circuit board 100 is provided with a hollow area 110; the sensor module 200 and the battery 300 are respectively arranged on both sides of the first circuit board 100, and at least part of at least one of the battery 300 and the sensor module 200 is arranged in the hollow area 110; the second circuit board 400 is located on one side of the first circuit board 100; the number of components 500 is multiple, and the multiple components 500 are respectively arranged on the first circuit board 100 and the second circuit board 400.

[0037] In an embodiment of the present application, the electronic device includes a first circuit board 100, a sensor module 200, and a battery 300. The first circuit board 100 is provided with a hollow area 110; the sensor module 200 and the battery 300 are respectively arranged on both sides of the first circuit board 100, and at least a portion of at least one of the battery 300 and the sensor module 200 is arranged in the hollow area 110, thereby reducing the thickness direction (the thickness direction) of the electronic device caused by the sensor module 200 and / or the battery 300. Figure 1The space occupied by the first circuit board 100, the battery 300 and the sensor module 200 is reduced, so that the thickness of the electronic device is reduced, which is conducive to the lightweight and thinning of the electronic device.

[0038] The electronic device also includes a second circuit board 400 and components 500. The second circuit board 400 is located on one side of the first circuit board 100. There are multiple components 500, and the multiple components 500 are respectively arranged on the first circuit board 100 and the second circuit board 400. The second circuit board 400 enables the internal circuit board of the electronic device to have a larger installation area, and the components 500 have a more sufficient installation area, thereby making the layout of the components 500 more convenient and improving the stability of the electronic device during operation.

[0039] The battery 300 can provide power to the sensor module 200 , the first circuit board 100 , the second circuit board 400 and the components 500 , thereby ensuring the smooth operation of the sensor module 200 and the components 500 .

[0040] The electronic device provided in the present application can reduce the thickness of the electronic device by more than 0.6 mm while saving the internal layout space of the electronic device, thereby meeting the structural requirements of the device for the direction of lightweight and thin electronic devices, while improving the stacking layout density of the components 500 and improving the overall stacking reliability, thereby improving the user experience.

[0041] Furthermore, the electronic device also includes a shell, and the first circuit board 100, sensor module 200, battery 300, second circuit board 400 and components 500 are all arranged in the shell, and the shell is used to support, install and fix the first circuit board 100, sensor module 200, battery 300, second circuit board 400 and components 500, thereby improving the stability of the first circuit board 100, sensor module 200, battery 300, second circuit board 400 and components 500 during the operation of the electronic device.

[0042] The electronic device further includes buttons, which are arranged on the housing, and a user can operate the electronic device through the buttons.

[0043] The electronic device also includes a bracket, which is arranged in the shell, the sensor module 200 is arranged on the bracket, the battery 300 is opposite to the sensor module 200, and abuts against the bracket, further reducing the space occupied by the stacking of the sensor module 200, the first circuit board 100 and the battery 300 in the thickness direction of the electronic device.

[0044] Sensor module 200 is a photoplethysmography (PPG) sensor. It uses optical technology to detect changes in the amount of light reflected from blood beneath the skin to measure heart rate, blood oxygen saturation, and other physiological parameters. The PPG sensor includes a photodiode (PD) and a light-emitting diode (LED).

[0045] The second circuit board 400 is parallel to the first circuit board 100 .

[0046] The battery 300 is connected to the first circuit board 100 or the second circuit board 400 through a board-to-board connector, or the battery 300 is connected to the first circuit board 100 or the second circuit board 400 by welding wires.

[0047] Furthermore, if Figure 3 、 Figure 4 and Figure 5 As shown, multiple components 500 include a first device 510 and a second device 520, the first device 510 is arranged on the first circuit board 100, the second device 520 is arranged on the second circuit board 400, the length of the second device 520 is greater than the length of the first device 510, and / or the width of the second device 520 is greater than the width of the first device 510.

[0048] There are multiple first devices 510 , and the multiple first devices 510 are attached to one side of the first circuit board 100 , or the multiple first devices 510 are attached to both sides of the first circuit board 100 .

[0049] The plurality of components 500 include large-sized integrated circuits, which are disposed on the second circuit board 400 .

[0050] Furthermore, the electronic device includes a mobile phone, a tablet computer, a smart wearable device, an e-book or a laptop computer. The smart wearable device includes a smart watch or a smart bracelet.

[0051] Specifically, the first circuit board 100 and the second circuit board 400 are both printed circuit boards (PCBs). The first circuit board 100 may be a main board of an electronic device.

[0052] Specifically, if Figure 6 As shown, taking the electronic device provided in this application as a smart wearable device as an example, the maximum diameter of the circular periphery of the first circuit board 100 is about 42 mm, and the internal hollow diameter is about 30 mm (that is, the outer diameter R1 of the annular first circuit board 100 is about 42 mm, and the inner diameter R2 of the annular first circuit board 100 is about 30 mm). No components 500 are placed in the hollowed-out part of the structure and the opposite interference position. Calculated as half of the circle, the device layout area on the front and back sides of the first circuit board 100 is 678 mm.2 The width W1 of the second circuit board 400 with the cavity structure is designed to be 8 mm, the length L1 of the second circuit board 400 is designed to be 16 mm, and the surface area of ​​the second circuit board 400 is 128 mm. 2 The total layout area of ​​the first circuit board 100 and the second circuit board 400 is 806mm 2 , which can meet the area required for product device layout (the area required for product device layout is approximately 650mm 2 ).

[0053] It should be noted here that the sizes of the first circuit board 100 and the second circuit board 400 provided above are only for reference to illustrate that the first circuit board 100 and the second circuit board 400 have more sufficient component area, thereby making the layout of the components 500 on the first circuit board 100 and the second circuit board 400 more flexible. The actual sizes of the first circuit board 100 and the second circuit board 400 can be adjusted according to different product designs, device layout requirements, and device sizes. The shapes of the first circuit board 100 and the second circuit board 400 can both be irregular, and avoid positions where there is structural interference.

[0054] According to some embodiments of the present application, Figure 7 、 Figure 8 and Figure 9 As shown, the electronic device further includes a supporting structure 600 , a first end of the supporting structure 600 is connected to the first circuit board 100 , and a second end of the supporting structure 600 is connected to the second circuit board 400 .

[0055] In this embodiment, the electronic device further includes a support structure 600, through which the second circuit board 400 is mounted on the first circuit board 100, thereby improving the stability of the second circuit board 400. Furthermore, the support structure 600 supports the second circuit board 400, thereby maintaining a certain distance between the second circuit board 400 and the first circuit board 100, thereby providing more sufficient installation space for the second circuit board 400. The second circuit board 400 can also have a larger area, further improving the convenience of the layout of the components 500.

[0056] Furthermore, the second circuit board 400 is supported by the support structure 600, so that the first circuit board 100 and the second circuit board 400 form a novel semicircular hollowed-out three-dimensional (3D) printed circuit board assembly (PCBA) architecture stacking method.

[0057] According to some embodiments of the present application, Figure 7 、 Figure 8 and Figure 9As shown, the number of support structures 600 is at least two; the first circuit board 100 is provided with a notch 120, and the notch 120 is located between at least two support structures 600; the electronic device also includes a motor 830, and the motor 830 is arranged between at least two support structures 600; wherein, when the electronic device is projected along the thickness direction of the electronic device, the projection of the second circuit board 400 at least covers the notch 120.

[0058] In this embodiment, there are at least two support structures 600, which provides more stable support for the second circuit board 400. The first circuit board 100 is provided with a notch 120 located between the at least two support structures 600. The motor 830 is disposed between the at least two support structures 600, thereby utilizing the space between the first circuit board 100 and the second circuit board 400 and further improving the internal space utilization of the electronic device. Furthermore, the notch 120 disposed between the at least two support structures 600 provides more space for the motor 830 to be installed, reducing the difficulty and facilitating assembly of the motor 830.

[0059] When projecting the electronic device along its thickness direction, the projected area of ​​the second circuit board 400 is greater than or equal to the projected area of ​​the notch 120 , further increasing the area of ​​the second circuit board 400 , allowing larger components 500 to be arranged on the second circuit board 400 , thereby improving the convenience of the layout of the components 500 .

[0060] Furthermore, there are two supporting structures 600 , which are respectively supported on two sides of the second circuit board 400 , and the two supporting structures 600 are parallel.

[0061] There are three support structures 600 , two of which are supported on both sides of the second circuit board 400 , another support structure 600 is supported on the third side of the second circuit board 400 , or another support structure 600 is supported between the two support structures 600 .

[0062] The notch 120 is arranged opposite to the button on the housing and in the radial direction of the electronic device.

[0063] Furthermore, the motor 830 is disposed on the side of the battery 300. The motor 830 is connected to the first circuit board 100 or the second circuit board 400 via a flexible circuit board and a spring, or the motor 830 is connected to the first circuit board 100 or the second circuit board 400 via a board-to-board connector.

[0064] Specifically, projecting the electronic device along the thickness direction of the electronic device means that the light required for projection propagates along the thickness direction of the electronic device and then forms a projection on a plane perpendicular to the thickness direction of the electronic device.

[0065] According to some embodiments of the present application, Figure 6 、 Figure 7 、 Figure 8 and Figure 9 As shown, in the circumferential direction ( Figure 7 In the direction indicated by the arrow D), the length L1 of the second circuit board 400 is greater than the length L2 of the notch 120; and / or in the radial direction of the first circuit board 100 ( Figure 7 In the direction indicated by the arrow E in the middle, the width W1 of the second circuit board 400 is greater than the width W2 of the notch 120.

[0066] In this embodiment, in the circumferential direction of the first circuit board 100, the length of the second circuit board 400 is greater than the length of the notch 120, and / or in the radial direction of the first circuit board 100, the width of the second circuit board 400 is greater than the width of the notch 120, thereby further increasing the area of ​​the second circuit board 400, allowing larger components 500 to be arranged on the second circuit board 400, thereby improving the convenience of the layout of the components 500.

[0067] Furthermore, the support structure 600 is disposed at the edge of the notch 120 , and the edge of the second circuit board 400 extends to the outside of the support structure 600 , so that the second circuit board 400 may have a larger area.

[0068] According to some embodiments of the present application, Figure 10 and Figure 11 As shown, the support structure 600 and the second circuit board 400 are an integrated structure; Figure 10 and Figure 12 As shown, the support structure 600 is soldered to the second circuit board 400 .

[0069] In this embodiment, the support structure 600 and the second circuit board 400 are integrally formed, which reduces the difficulty of assembling the first circuit board 100 and the second circuit board 400, making assembly of the second circuit board 400 and the first circuit board 100 more convenient. The support structure 600 is welded to the second circuit board 400, which reduces the difficulty of manufacturing the second circuit board 400 and the support structure 600, improves the ease of manufacturing the second circuit board 400 and the support structure 600, and reduces the manufacturing cost of the second circuit board 400.

[0070] Furthermore, if Figure 10 and Figure 12As shown, the electronic device further includes a first solder 710. When the support structure 600 is soldered to the second circuit board 400, the first solder 710 is disposed between the support structure 600 and the second circuit board 400. This allows the support structure 600 to be soldered to the second circuit board 400 via the first solder 710, thereby improving the reliability of the connection between the support structure 600 and the second circuit board 400. Furthermore, the first solder 710 achieves soldering between the support structure 600 and the second circuit board 400, and the first solder 710 does not affect the transmission of power and data between the second circuit board 400 and the support structure 600, thereby improving the stability of the second circuit board 400 during operation of the electronic device.

[0071] According to some embodiments of the present application, Figure 13 and Figure 14 As shown, the second circuit board 400 is electrically connected to the first circuit board 100 via the support structure 600 .

[0072] In this embodiment, the second circuit board 400 is electrically connected to the first circuit board 100 through the support structure 600. While the second circuit board 400 is supported by the support structure 600, the transmission of electrical energy and data between the first circuit board 100 and the second circuit board 400 is achieved through the support structure 600, thereby simplifying the layout structure of the first circuit board 100 and the second circuit board 400 and reducing the occupation of the internal space of the electronic device by the first circuit board 100 and the second circuit board 400.

[0073] Furthermore, if Figure 13 and Figure 14 As shown, the electronic device further includes a second solder 720. When the support structure 600 is soldered to the first circuit board 100, the second solder 720 is disposed between the support structure 600 and the first circuit board 100. This allows the support structure 600 to be soldered to the first circuit board 100 via the second solder 720, thereby improving the reliability of the connection between the support structure 600 and the first circuit board 100. Furthermore, the second solder 720 achieves soldering between the support structure 600 and the first circuit board 100, and the second solder 720 does not affect the transmission of power and data between the first circuit board 100 and the support structure 600, thereby improving the stability of the first circuit board 100 during operation of the electronic device.

[0074] According to some embodiments of the present application, Figure 15 、 Figure 16 and Figure 17 As shown, the thickness of the support structure 600 decreases from an end of the support structure 600 close to the second circuit board 400 to an end of the support structure 600 close to the first circuit board 100 .

[0075] In this embodiment, the thickness of the support structure 600 decreases from the end of the support structure 600 close to the second circuit board 400 to the end of the support structure 600 close to the first circuit board 100. While ensuring the stability of the support structure 600 supporting the second circuit board 400, the space occupied by the support structure 600 on the first circuit board 100 is reduced, further increasing the space on the first circuit board 100 where components 500 can be installed.

[0076] Specifically, the outer sidewall of the support structure 600 extends obliquely relative to the thickness direction of the electronic device from the end of the support structure 600 close to the second circuit board 400 to the end of the support structure 600 close to the first circuit board 100. The inner sidewall of the support structure 600 extends along the thickness direction of the electronic device from the end of the support structure 600 close to the second circuit board 400 to the end of the support structure 600 close to the first circuit board 100.

[0077] Specifically, the outer sidewall of the support structure 600 extends along the thickness direction of the electronic device from the end of the support structure 600 close to the second circuit board 400 to the end of the support structure 600 close to the first circuit board 100. The inner sidewall of the support structure 600 extends obliquely relative to the thickness direction of the electronic device from the end of the support structure 600 close to the second circuit board 400 to the end of the support structure 600 close to the first circuit board 100.

[0078] Specifically, the outer sidewall of the support structure 600 extends obliquely relative to the thickness direction of the electronic device from the end of the support structure 600 close to the second circuit board 400 to the end of the support structure 600 close to the first circuit board 100. The inner sidewall of the support structure 600 extends obliquely relative to the thickness direction of the electronic device from the end of the support structure 600 close to the second circuit board 400 to the end of the support structure 600 close to the first circuit board 100.

[0079] The support structure 600 with inclined side walls can be processed in steps by mechanically controlled deep milling during the production of a printed circuit board, or can be produced by 3D printing.

[0080] Furthermore, if Figure 18 As shown, the support structure 600 extends obliquely relative to the thickness direction of the electronic device from one end close to the second circuit board 400 to one end close to the first circuit board 100. The distance between the ends of at least two support structures 600 close to the first circuit board 100 is smaller than the distance between the ends of at least two support structures 600 close to the second circuit board 400.

[0081] According to some embodiments of the present application, Figure 1 and Figure 2As shown, the first circuit board 100 is in an open ring shape and is arranged around the sensor module 200 ; in the radial direction of the first circuit board 100 , the second circuit board 400 is located outside the battery 300 .

[0082] In this embodiment, the first circuit board 100 is an open ring and is arranged around the sensor module 200, so that the sensor is located in the middle of the first circuit board 100. When the user wears the electronic device, the device is closer to the body, allowing the sensor module 200 to more accurately detect physiological parameters of the human body, thereby improving the user's experience of the electronic device. In the radial direction of the first circuit board 100, the second circuit board 400 is located outside the battery 300, allowing the space inside the electronic device to be more fully utilized and improving the utilization rate of the internal space of the electronic device.

[0083] Furthermore, the annular first circuit board 100 extends along the edge of the housing.

[0084] According to some embodiments of the present application, the largest component 500 among the plurality of components 500 is disposed on the second circuit board 400 .

[0085] In this embodiment, the largest component 500 among the multiple components 500 is placed on the second circuit board 400, allowing for more efficient use of the space on the second circuit board 400. Furthermore, due to the larger length and width of the second circuit board 400, it is also easier to arrange the largest component 500 on the second circuit board 400. Placing the largest component 500 among the multiple components 500 on the second circuit board 400 allows for more flexible layout of the remaining components 500 on the first circuit board 100, facilitating insulation and heat dissipation between the components 500, and thereby improving the performance of the electronic device.

[0086] According to some embodiments of the present application, Figure 1 As shown, the electronic device further includes a shielding cover 810 , which is disposed on the outside of the component 500 . The shielding cover 810 is connected to the first circuit board 100 and / or the shielding cover 810 is connected to the second circuit board 400 .

[0087] In this embodiment, the shielding cover 810 is disposed on the outside of the component 500, thereby protecting the component 500, reducing the interference of the component 500 on the surroundings, and improving the stability of the electronic device during operation.

[0088] According to some embodiments of the present application, Figure 1 As shown, the electronic device further includes a speaker 820 , which is disposed on the circumferential outer side of the first circuit board 100 and is electrically connected to the first circuit board 100 .

[0089] In this embodiment, the sound device 820 is disposed on the circumferential outer side of the first circuit board 100, further reducing the space occupied in the thickness direction of the electronic device, which is conducive to the lightweight and thinning of the electronic device.

[0090] Furthermore, the speaker 820 is connected to the first circuit board 100 or the second circuit board 400 through a flexible printed circuit board (FPC) and a spring, or the speaker 820 is connected to the first circuit board 100 or the second circuit board 400 through a board-to-board (BTB) connector.

[0091] Furthermore, the speaker 820 is located on the opposite side of the motor 830 .

[0092] Throughout this specification, reference to terms such as "one embodiment," "some embodiments," "illustrative embodiments," "examples," "specific examples," or "some examples" means that the specific features, structures, materials, or characteristics described in conjunction with the embodiment or example are included in at least one embodiment or example of the present application. In this specification, the illustrative expressions of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples.

[0093] Although the embodiments of the present application have been shown and described, those skilled in the art will appreciate that various changes, modifications, substitutions, and variations may be made to the embodiments without departing from the principles and intent of the present application, and that the scope of the present application is defined by the claims and their equivalents.

Claims

1. An electronic device, characterized in that: include: a first circuit board, wherein the first circuit board is provided with a hollow area; Sensor module; a battery, wherein the battery and the sensor module are respectively disposed on both sides of the first circuit board, and at least a portion of at least one of the battery and the sensor module is disposed within the hollow area; a second circuit board, the second circuit board being located on one side of the first circuit board; There are multiple components, and the multiple components are respectively arranged on the first circuit board and the second circuit board.

2. The electronic device according to claim 1, wherein Also includes: A supporting structure, wherein a first end of the supporting structure is connected to the first circuit board, and a second end of the supporting structure is connected to the second circuit board.

3. The electronic device according to claim 2, wherein: The number of the support structures is at least two; The first circuit board is provided with a notch, and the notch is located between at least two of the supporting structures; The electronic device further comprises a motor, wherein the motor is arranged between at least two of the support structures; Wherein, when the electronic device is projected along the thickness direction of the electronic device, the projection of the second circuit board at least covers the gap.

4. The electronic device according to claim 2, wherein: The supporting structure and the second circuit board are an integrated structure; or The supporting structure is welded to the second circuit board.

5. The electronic device according to claim 2, wherein: The second circuit board is electrically connected to the first circuit board through the supporting structure.

6. The electronic device according to claim 2, wherein: The thickness of the support structure decreases from an end of the support structure close to the second circuit board to an end of the support structure close to the first circuit board.

7. The electronic device according to claim 1, wherein: The first circuit board is in an open ring shape and is arranged around the sensor module; In a radial direction of the first circuit board, the second circuit board is located outside the battery.

8. The electronic device according to claim 1, wherein: The largest component among the plurality of components is arranged on the second circuit board.

9. The electronic device according to any one of claims 1 to 8, characterized in that: Also includes: A shielding cover is provided on the outside of the component, the shielding cover is connected to the first circuit board, and / or the shielding cover is connected to the second circuit board.

10. The electronic device according to any one of claims 1 to 8, characterized in that: Also includes: The speaker is arranged on the circumferential outer side of the first circuit board and is electrically connected to the first circuit board.

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