Intelligent anti-theft production plastic mold alarm equipment

Abstract

The invention belongs to the field of alarm, and relates to intelligent anti-theft production plastic mold alarm equipment, which comprises an MCU (Microprogrammed Control Unit), and a GPS (Global Positioning System) positioning chip, a vibration sensing circuit, a Hall sensing circuit, a communication circuit, a charging management circuit, a voltage stabilizing circuit and an LED (Light Emitting Diode) display circuit which are electrically connected with the MCU of the intelligent anti-theft production plastic mold alarm equipment, the intelligent anti-theft production plastic mold alarm equipment MCU is used for controlling the intelligent anti-theft production plastic mold alarm equipment GPS positioning chip, the intelligent anti-theft production plastic mold alarm equipment vibration sensing circuit, the intelligent anti-theft production plastic mold alarm equipment Hall sensing circuit and the intelligent anti-theft production plastic mold alarm equipment communication circuit. And an intelligent anti-theft production plastic mold alarm device charging management circuit. Accurate positioning and tracking, vibration and impact force monitoring, magnetic mark detection, remote monitoring and data exchange and intelligent battery management can be carried out, and power supply stability guarantee is achieved.

Description

Technical Field

[0001] The present invention relates to the field of alarm technology, and more particularly to an intelligent anti-theft production plastic mold alarm device. Background Art

[0002] In modern manufacturing, molds are critical equipment in the production process, and their operating status directly impacts product quality and production efficiency. However, traditional mold management systems have numerous shortcomings in terms of mold position monitoring, status monitoring, and fault warning. These include inaccurate positioning, which relies on manual records or simple electronic tags, resulting in large positioning errors and difficulty meeting the needs of refined management. Status perception is lagging, and the lack of real-time status monitoring methods leads to late detection of mold failures, resulting in high repair costs and impacting production schedules. Furthermore, unclear alarm messages and the limited data exchange capabilities of traditional systems make remote monitoring and data analysis difficult. These issues not only increase production costs but can also lead to safety incidents. Summary of the Invention

[0003] In view of the above-mentioned defects of the prior art, the present invention provides an intelligent anti-theft production plastic mold alarm device, comprising:

[0004] MCU, a GPS positioning chip, a vibration sensing circuit, a Hall sensing circuit, a communication circuit, a charging management circuit, a voltage stabilizing circuit and an LED display circuit electrically connected to the MCU respectively, the MCU is used to control the GPS positioning chip, the vibration sensing circuit, the Hall sensing circuit, the communication circuit, the charging management circuit, the voltage stabilizing circuit and the LED display circuit, the GPS positioning chip is used to track and locate the position of the mold, the vibration sensing circuit is used to sense the vibration or impact force acting on the mold, the Hall sensing circuit is used to detect the position status of the magnetic mark or magnetic component on the mold, the communication circuit is used for data exchange between the device and the remote monitoring system, the charging management circuit is used to monitor the voltage and current status information of the battery in real time, the voltage stabilizing circuit is used to maintain the stability of the power supply voltage inside the device to prevent equipment failure or performance degradation due to power supply voltage fluctuations, and the LED display circuit is used to display the working status and alarm information of the device.

[0005] Preferably, the MCU includes: any one of APM32F003, STM32F103C8T6, ATmega328, ESP32, HC32M1 and HC32M4.

[0006] Preferably, the GPS positioning chip includes any one of SiRFstar III, u-blox G5, AT9880U-B and AT6558R-5N32.

[0007] Preferably, the vibration sensing circuit includes: one end of a switch S1 is grounded, the other end of the switch S1 is connected to one end of a resistor R8, and the other end of the resistor R8 is connected to one end of a capacitor C9 and one end of a resistor R7 respectively.

[0008] Preferably, the Hall sensing circuit includes: pin 1 of the Hall sensor U5 is connected to the drain of the MOSFET tube Q2, the source of the MOSFET tube Q2 is connected to one end of the resistor R12, and the gate of the MOSFET tube Q2 is respectively connected to the other end of the resistor R12 and one end of the resistor R13.

[0009] Preferably, the communication circuit includes: pin 8 of the wireless communication module chip U3 is connected to the drain of the MOSFET tube Q1, the source of the MOSFET tube Q1 is connected to one end of the resistor R10, and the gate of the MOSFET tube Q1 is respectively connected to the other end of the resistor R10 and one end of the resistor R11.

[0010] Preferably, the charging management circuit includes: pin 1 of the charging management chip U1 is respectively connected to one end of the resistor R1 and pin 3 of the charging management chip U1 and is grounded, pin 2 of the charging management chip U1 is connected to the other end of the resistor R1, pin 4 of the charging management chip U1 is respectively connected to one end of the capacitor C1 and pin 2 of the connection terminal J1, pin 1 of the connection terminal J1 is connected to the other end of the capacitor C1, pin 5 of the charging management chip U1 is respectively connected to pin 1 of the diode D3, pin 2 of the diode D3, one end of the battery pack BT1, and one end of the capacitor C2, and the other end of the battery pack BT1 is connected to the capacitor The other end of C2 is connected and grounded, pin 6 of the charging management chip U1 is connected to one end of the resistor R3, pin 7 of the charging management chip U1 is connected to one end of the resistor R2, pin 8 of the charging management chip U1 is connected to pin 2 of the LED lamp LED2, pin 1 of the LED lamp LED2 is connected to the other end of the resistor R2, pin 3 of the LED lamp LED2 is connected to the other end of the resistor R3, pin 3 of the diode D3 is connected to one end of the resistor R4, the other end of the resistor R4 is respectively connected to one end of the capacitor C3 and one end of the resistor R5, and the other end of the capacitor C3 is connected to the other end of the resistor R5 and grounded.

[0011] Preferably, the voltage stabilizing circuit includes: pin 1 of the voltage regulator chip U4 is respectively connected to pin 3 of the voltage regulator chip U4 and one end of the capacitor C4, pin 2 of the voltage regulator chip U4 is connected to the other end of the capacitor C4 and grounded, pin 5 of the voltage regulator chip U4 is connected to one end of the capacitor C5, and the other end of the capacitor C5 is grounded.

[0012] Preferably, the LED display circuit includes: the cathode of the LED lamp LED1 is connected to one end of the resistor R9, and the anode of the LED lamp LED1 is connected to a 3.3V voltage.

[0013] Preferably, the device further comprises: a USB interface, wherein the USB interface comprises a pin 2 of a terminal J3 connected to one end of a resistor R14, and the other end of the resistor R14 is connected to a 3.3V voltage.

[0014] The intelligent anti-theft production plastic mold alarm device of the present invention has the following beneficial effects:

[0015] (1) Accurate positioning and tracking: Through the built-in GPS positioning chip, the position information of the mold can be tracked and accurately located in real time, which greatly facilitates mold scheduling, maintenance and management, and effectively solves the problem of difficult to accurately track the mold position in traditional methods;

[0016] (2) Vibration and impact force monitoring: The vibration sensing circuit can sensitively capture the vibration or impact force acting on the mold, which is crucial for preventing damage to the mold due to excessive use or abnormal operation. Through data analysis, potential failures can be warned in advance, reducing unplanned downtime;

[0017] (3) Magnetic mark detection: The application of Hall sensing circuit can accurately detect the position status of magnetic marks or magnetic components on the mold, which is of great significance for the automated control of mold assembly, disassembly and quality inspection, and improves the accuracy and efficiency of operation.

[0018] (4) Remote monitoring and data exchange: The establishment of communication circuits enables this device to seamlessly connect with the remote monitoring system and realize real-time data transmission and sharing. This not only enhances management flexibility, but also provides a rich data source for data analysis and fault diagnosis.

[0019] (5) Intelligent battery management: The charging management circuit monitors the battery status in real time to ensure that the battery operates under safe and efficient conditions, extending the service life of the equipment and reducing equipment failures caused by battery problems;

[0020] (6) Power supply stability guarantee: The application of voltage stabilization circuit effectively prevents the influence of power supply voltage fluctuation on equipment performance, ensures the stable operation of the device under various working conditions, and improves the reliability and stability of the system.

[0021] (7) Intuitive information display: The LED display circuit provides clear working status indication and alarm information, allowing operators to quickly understand the equipment status and take timely response measures, enhancing the intuitiveness and response speed of on-site management. BRIEF DESCRIPTION OF THE DRAWINGS

[0022] In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the following briefly introduces the drawings required for the embodiments or the description of the prior art. Obviously, the drawings described below are only some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on the structures shown in these drawings without creative work. The present invention will be further explained below in conjunction with the drawings and embodiments. In the drawings:

[0023] Figure 1 This is a schematic diagram of the module structure of the intelligent anti-theft production plastic mold alarm device of the present invention;

[0024] Figure 2 This is the circuit diagram of the vibration sensor circuit of the intelligent anti-theft production plastic mold alarm device of the present invention;

[0025] Figure 3 This is the Hall effect circuit diagram of the intelligent anti-theft production plastic mold alarm device of the present invention;

[0026] Figure 4 This is a circuit diagram of the communication circuit of the intelligent anti-theft production plastic mold alarm device of the present invention;

[0027] Figure 5 This is a circuit diagram of the charging management circuit of the intelligent anti-theft production plastic mold alarm device of the present invention;

[0028] Figure 6 This is the circuit diagram of the voltage stabilizing circuit of the intelligent anti-theft production plastic mold alarm device of the present invention;

[0029] Figure 7 This is the LED display circuit diagram of the intelligent anti-theft production plastic mold alarm device of the present invention;

[0030] Figure 8 This is a circuit diagram of a USB interface circuit of an intelligent anti-theft production plastic mold alarm device of the present invention. DETAILED DESCRIPTION

[0031] The following will clearly and completely describe the technical solutions in the embodiments of the present invention in conjunction with the accompanying drawings. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. All other embodiments obtained by ordinary technicians in this field based on the embodiments of the present invention without making any creative efforts shall fall within the scope of protection of the present invention.

[0032] It should be noted that if the embodiments of the present invention involve directional indications (such as up, down, left, right, front, back, etc.), such directional indications are only used to explain the relative position relationship, movement status, etc. between the various components under a certain specific posture (as shown in the accompanying drawings). If the specific posture changes, the directional indication will also change accordingly.

[0033] In addition, if there are descriptions involving "first", "second", etc. in the embodiments of the present invention, the descriptions of "first", "second", etc. are only for descriptive purposes and cannot be understood as indicating or implying their relative importance or implicitly indicating the number of the indicated technical features. Therefore, the features specified as "first" and "second" may explicitly or implicitly include at least one of such features. In addition, the technical solutions between the various embodiments can be combined with each other, but this must be based on the fact that ordinary technicians in this field can implement them. When the combination of technical solutions is contradictory or cannot be implemented, it should be deemed that such a combination of technical solutions does not exist and is not within the scope of protection required by the present invention.

[0034] See also Figure 1 , is a schematic diagram of the components of the intelligent anti-theft production plastic mold alarm device of the present invention. Figure 1 As shown, the intelligent anti-theft production plastic mold alarm device provided in the first embodiment of the present invention at least includes an MCU, a GPS positioning chip, a vibration sensing circuit, a Hall sensing circuit, a communication circuit, a charging management circuit, a voltage stabilizing circuit and an LED display circuit electrically connected to the MCU respectively. The MCU is used to control the GPS positioning chip, the vibration sensing circuit, the Hall sensing circuit, the communication circuit, the charging management circuit, the voltage stabilizing circuit and the LED display circuit. The GPS positioning chip is used to track and locate the position of the mold. The vibration sensing circuit is used to sense the vibration or impact force acting on the mold. The Hall sensing circuit is used to detect the position status of the magnetic mark or magnetic component on the mold. The communication circuit is used for data exchange between the device and the remote monitoring system. The charging management circuit is used to monitor the voltage and current status information of the battery in real time. The voltage stabilizing circuit is used to maintain the stability of the power supply voltage inside the device to prevent equipment failure or performance degradation due to power supply voltage fluctuations. The LED display circuit is used to display the working status and alarm information of the device.

[0035] In a specific implementation, the MCU includes but is not limited to: any one of APM32F003, STM32F103C8T6, ATmega328, ESP32, HC32M1 and HC32M4.

[0036] In this embodiment, the MCU selected is the APM32F003. The APM32F003 is an industrial-grade general-purpose microcontroller (MCU) launched by Polar Semiconductor, based on the Arm® Cortex®-M0+ core. This chip integrates high performance, low power consumption, and a rich set of peripheral resources.

[0037] In terms of performance, the APM32F003 boasts a maximum operating frequency of 48MHz, a supply voltage range of 2.0 to 5.5V, and provides 32Kbytes of Flash and 4Kbytes of SRAM on-chip storage, sufficient to meet the resource requirements of device operation. Furthermore, the chip is housed in a highly compact 3×3mm QFN20 package, which not only improves system integration and enhances product efficiency, but also reduces BOM costs.

[0038] The APM32F003 also excels in stability and adaptability. Its temperature rating covers -40°C to +105°C, offering strong temperature adaptability and ensuring stable operation in diverse temperature scenarios. Furthermore, the chip boasts an ESD rating of 8kV, providing strong immunity to electrostatic interference. Its integrated HSI internal high-speed oscillator offers an accuracy of ±3% across the entire range, helping to improve the operational sensitivity of the product.

[0039] In terms of functionality, the APM32F003 integrates multiple UART, SPI, and I2C communication interfaces, as well as peripheral resources such as a 16-bit general-purpose timer, an 8-bit basic timer, and a 12-bit ADC (8 channels, supporting differential inputs). This high level of integration helps enhance the product's diverse control and extensive connectivity, meeting the needs of a wider range of development applications.

[0040] The MCU is responsible for data processing, logical judgment, and control output in intelligent anti-theft plastic mold production alarm equipment. Specifically, the MCU's functions include:

[0041] (1) Data acquisition: Through the integrated ADC (analog-to-digital converter) or GPIO interface, the MCU can directly connect to various sensors (such as temperature, pressure, vibration, etc.) to collect real-time status data of the mold and the environment.

[0042] (2) Logical operations: Execute preset control algorithms (such as PID control, fuzzy logic, etc.), analyze input data, and generate control instructions. In intelligent anti-theft production plastic mold alarm equipment, the MCU will determine whether the collected data exceeds the normal range and decide whether to trigger an alarm.

[0043] (3) Output drive: Controls the actions of actuators (such as LED indicators, buzzers, etc.) through output modules such as PWM, DAC (digital-to-analog converter), or relays. When an abnormality occurs in the mold, the MCU will control the LED indicator to flash or the buzzer to sound to alert the operator.

[0044] (4) Peripheral management: The MCU has multiple built-in interfaces (such as UART, SPI, I2C, CAN, etc.) that can be connected to peripherals such as display screens, keyboards, and storage modules to achieve human-computer interaction and data storage. In intelligent anti-theft production plastic mold alarm equipment, the MCU is connected to GPS positioning chips and communication circuits through interfaces to achieve location information acquisition and remote communication.

[0045] (5) Network communication: Supports Ethernet, Wi-Fi, Bluetooth and other protocols, enabling the device to access the Industrial Internet of Things (IIoT) and achieve remote monitoring and cloud collaboration. The intelligent anti-theft production plastic mold alarm device is connected to the remote monitoring system through a communication circuit and uploads mold status data in real time.

[0046] (6) Real-time guarantee: Through the interrupt system and real-time operating system (RTOS), a rapid response to emergency events is ensured. When the mold has an abnormality, the MCU can quickly trigger an alarm to reduce downtime.

[0047] The GPS positioning chip includes but is not limited to: any one of SiRFstar III, u-blox G5, AT9880U-B and AT6558R-5N32.

[0048] The SiRFstar III is a third-generation GPS chip developed by SiRF Corporation in the United States and released in 2004. It utilizes 200,000-times / frequency correlator technology, significantly improving positioning sensitivity and response speed. It supports simultaneous tracking of 20 satellite channels and boasts a cold start time of just 42 seconds. The chip integrates RF circuitry, a digital signal processor, and embedded software, optimizing startup time and adaptability to multiple scenarios, making it a core component of non-standalone GPS receivers.

[0049] u-blox G5: u-blox is a renowned manufacturer of GPS systems. Its G5 chip features high sensitivity and low power consumption. The G5 chip boasts over one million parallel correlators, a sensitivity of at least -160dBm, and consumes less than 50mW. It supports both GPS and Galileo positioning platforms, reducing cold start time to 29 seconds. With AGPS-assisted positioning technology, outdoor cold start times can be reduced to less than one second.

[0050] Beidou multi-frequency navigation and positioning chips such as AT9880U-B and AT6558R-5N32 not only support the Beidou system, but are also compatible with other global navigation systems such as GPS and GLONASS, providing wider positioning coverage and higher positioning accuracy.

[0051] In this embodiment, the GPS positioning chip is selected as AT9880U-B.

[0052] The functions of GPS positioning chip mainly include:

[0053] (1) Provide accurate location information: The GPS positioning chip can obtain the latitude and longitude information of the mold in real time, with an accuracy of meters or even higher. When the mold is lost or stolen, the operator can quickly find it through GPS positioning information.

[0054] (2) Assisted remote monitoring: Combined with the communication circuit, the GPS positioning chip can upload the mold's location information to the remote monitoring system in real time. Operators can view the mold's distribution and movement trajectory in real time at the monitoring center.

[0055] Figure 2 This is the circuit diagram of the vibration sensor circuit of the intelligent anti-theft production plastic mold alarm device of the present invention. Figure 2 As shown, the vibration sensing circuit includes: one end of the switch S1 is grounded, the other end of the switch S1 is connected to one end of the resistor R8, and the other end of the resistor R8 is respectively connected to one end of the capacitor C9 and one end of the resistor R7.

[0056] The vibration sensing circuit is used to sense the vibration or impact force acting on the mold. When the mold is abnormal (such as broken, loose, etc.), it often generates abnormal vibration signals. The functions of the vibration sensing circuit include:

[0057] (1) Monitoring vibration signals: The vibration sensing circuit converts mechanical vibration into electrical signals through sensors such as piezoelectric ceramic elements. When the mold is subjected to abnormal vibration, the sensor will output a corresponding electrical signal.

[0058] (2) Signal amplification and filtering: Vibration sensing circuits usually include signal amplifiers and filters, which are used to amplify the weak signals output by the sensor and filter out noise interference, thereby improving the signal-to-noise ratio.

[0059] (3) Triggering an alarm: When the vibration signal exceeds the preset threshold, the vibration sensing circuit sends an alarm signal to the MCU. After receiving the signal, the MCU controls the LED indicator to flash or the buzzer to sound to alert the operator that the mold may be abnormal.

[0060] Figure 3 This is the Hall effect circuit diagram of the intelligent anti-theft production plastic mold alarm device of the present invention. Figure 3 As shown, the Hall sensing circuit includes: pin 1 of the Hall sensor U5 is connected to the drain of the MOSFET tube Q2, the source of the MOSFET tube Q2 is connected to one end of the resistor R12, and the gate of the MOSFET tube Q2 is connected to the other end of the resistor R12 and one end of the resistor R13 respectively.

[0061] Hall effect circuits operate based on the Hall effect principle and can detect the proximity of magnetic objects. In intelligent anti-theft plastic mold production alarm devices, Hall effect circuits are primarily used to detect the position of magnetic marks or magnetic components on the mold. Their functions include:

[0062] (1) Detecting magnetic objects: The Hall sensor circuit detects the proximity of magnetic objects through the Hall sensor. When a magnetic object approaches the sensor, the sensor will output a corresponding electrical signal.

[0063] (2) Position status monitoring: Magnetic markers or magnetic components are set on the mold, and the position status of these markers or components can be monitored in real time through the Hall effect sensing circuit. When the position changes (such as the mold component loosening or falling off), the Hall effect sensing circuit will send an alarm signal to the MCU.

[0064] (3) Triggering alarm and recording: After the MCU receives the alarm signal from the Hall sensor circuit, it triggers an alarm and records the abnormal location information. This helps the operator quickly locate the mold fault point and perform repairs.

[0065] Figure 4 This is the communication circuit diagram of the intelligent anti-theft production plastic mold alarm device of the present invention. Figure 4 As shown, the communication circuit includes: pin 8 of the wireless communication module chip U3 is connected to the drain of the MOSFET tube Q1, the source of the MOSFET tube Q1 is connected to one end of the resistor R10, and the gate of the MOSFET tube Q1 is connected to the other end of the resistor R10 and one end of the resistor R11 respectively.

[0066] The communication circuit is used to realize data exchange between the intelligent anti-theft production plastic mold alarm device and the remote monitoring system. Its functions include:

[0067] (1) Data transmission: The communication circuit uploads the mold status data to the remote monitoring system in real time through wired or wireless means (such as Ethernet, Wi-Fi, Bluetooth, etc.). At the same time, it can also receive control instructions from the monitoring system.

[0068] (2) Remote monitoring and alarm: Combined with functional modules such as MCU and GPS positioning chip, the communication circuit can realize remote monitoring and real-time alarm of the mold. When the mold has an abnormality, the operator can view the alarm information in real time in the monitoring center and take appropriate measures.

[0069] (3) Data backup and recovery: The communication circuit can also be used for data backup and recovery operations. When the intelligent anti-theft production plastic mold alarm device fails or data is lost, the backup data can be restored to the device through the communication circuit.

[0070] Figure 5 This is the circuit diagram of the charging management circuit of the intelligent anti-theft production plastic mold alarm device of the present invention. Figure 5 As shown, the charging management circuit includes: pin 1 of the charging management chip U1 is respectively connected to one end of the resistor R1 and pin 3 of the charging management chip U1 and is grounded, pin 2 of the charging management chip U1 is connected to the other end of the resistor R1, pin 4 of the charging management chip U1 is respectively connected to one end of the capacitor C1 and pin 2 of the connection terminal J1, pin 1 of the connection terminal J1 is connected to the other end of the capacitor C1, pin 5 of the charging management chip U1 is respectively connected to pin 1 of the diode D3, pin 2 of the diode D3, one end of the battery pack BT1, and one end of the capacitor C2, and the other end of the battery pack BT1 is connected to the capacitor C 2 is connected and grounded, pin 6 of the charging management chip U1 is connected to one end of the resistor R3, pin 7 of the charging management chip U1 is connected to one end of the resistor R2, pin 8 of the charging management chip U1 is connected to pin 2 of the LED lamp LED2, pin 1 of the LED lamp LED2 is connected to the other end of the resistor R2, pin 3 of the LED lamp LED2 is connected to the other end of the resistor R3, pin 3 of the diode D3 is connected to one end of the resistor R4, the other end of the resistor R4 is respectively connected to one end of the capacitor C3 and one end of the resistor R5, the other end of the capacitor C3 is connected to the other end of the resistor R5 and grounded.

[0071] In this embodiment, the charge management chip U1 is the ME4057. The ME4057 is a constant-voltage, constant-current charge management chip designed specifically for single-cell lithium-ion batteries. This chip integrates high-precision constant-voltage and constant-current controllers, automatically switching charging modes based on the battery's voltage and current status during the charging process, ensuring safe and efficient charging of the battery.

[0072] The charging management circuit is used to manage the battery charging process of the intelligent anti-theft plastic mold production alarm device to ensure safe and efficient battery charging. Its functions include:

[0073] (1) Battery status monitoring: The charging management circuit can monitor the battery status information such as voltage and current in real time and adjust the charging strategy based on this information.

[0074] (2) Intelligent charging control: Based on the remaining battery power and charging status, the charging management circuit intelligently controls the charging current and voltage to achieve a fast and safe charging process. At the same time, it can also avoid battery damage such as overcharging and over-discharging.

[0075] (3) Charging protection and fault alarm: During the charging process, the charging management circuit will protect the battery (such as over-temperature protection, short-circuit protection, etc.) and send an alarm signal to the MCU when a fault occurs. After receiving the signal, the MCU will control the LED indicator to flash or the buzzer to sound to remind the operator to take timely action.

[0076] Figure 6 This is the circuit diagram of the voltage stabilizing circuit of the intelligent anti-theft production plastic mold alarm device of the present invention. Figure 6 As shown, the voltage stabilizing circuit includes: pin 1 of the voltage regulator chip U4 is connected to pin 3 of the voltage regulator chip U4 and one end of the capacitor C4 respectively, pin 2 of the voltage regulator chip U4 is connected to the other end of the capacitor C4 and grounded, pin 5 of the voltage regulator chip U4 is connected to one end of the capacitor C5, and the other end of the capacitor C5 is grounded.

[0077] In this embodiment, the voltage regulator chip U4 is the SGM2019. The SGM2019 is a low-power, low-noise, low-dropout CMOS linear regulator chip. It is designed for low-voltage, low-power applications and operates with an input voltage range of 2.5V to 5.5V.

[0078] The SGM2019 chip features significantly low ground current, effectively extending the battery life of portable electronic products. It also provides ultra-low drain voltage, further enhancing its energy-saving effects.

[0079] The SGM2019 excels in noise control. It boasts ultra-low output noise, typically 30μVRMS, which is particularly important for systems requiring a quiet voltage source, such as RF (radio frequency) applications. Furthermore, its high power supply rejection ratio (PSRR), reaching 74dB at 1kHz, effectively suppresses the effects of power supply noise on circuits.

[0080] The SGM2019's output voltage is preset to a range of 1.2V to 5.0V and can be adjusted as needed. It also incorporates multiple protection features, including a 10nA logic-controlled shutdown mode, foldback current limiting, and thermal shutdown protection, to ensure circuit stability and reliability.

[0081] The voltage stabilization circuit is used to maintain the stability of the internal power supply voltage of the intelligent anti-theft plastic mold production alarm device to prevent equipment failure or performance degradation due to power supply voltage fluctuations. Its functions include:

[0082] (1) Voltage stabilization output: The voltage stabilization circuit compensates for input voltage fluctuations or load changes by adjusting the impedance of components (such as voltage regulators, adjustment transistors, etc.), thereby maintaining the stability of the output voltage.

[0083] (2) Overvoltage protection and undervoltage protection: When the input voltage exceeds or falls below the preset range, the voltage regulator circuit will automatically cut off or limit the output voltage to prevent the device from being damaged due to overvoltage or undervoltage.

[0084] (3) Improve equipment reliability: The voltage stabilizing circuit can ensure that the intelligent anti-theft production plastic mold alarm device can still work normally in an environment with large power supply voltage fluctuations, thereby improving the reliability and stability of the equipment.

[0085] Figure 7 This is the LED display circuit diagram of the intelligent anti-theft production plastic mold alarm device of the present invention. Figure 7 As shown, the LED display circuit includes: the cathode of the LED lamp LED1 is connected to one end of the resistor R9, and the anode of the LED lamp LED1 is connected to a 3.3V voltage.

[0086] The LED display circuit is used to display the working status and alarm information of the intelligent anti-theft production plastic mold alarm device. Its functions include:

[0087] (1) Status indication: The working status (such as normal, alarm, etc.) of the intelligent anti-theft production plastic mold alarm device can be intuitively displayed through different flashing modes or color changes of the LED indicator light.

[0088] (2) Alarm information display: When the mold is abnormal, the LED display circuit will control the corresponding LED indicator to flash or light up to indicate the type and location of the alarm information. This helps the operator quickly locate and deal with the mold failure.

[0089] (3) Human-computer interaction: Combined with the MCU and other functional modules, the LED display circuit can also realize human-computer interaction functions. For example, the operator can view the mold's historical alarm records or adjust parameters such as alarm thresholds by pressing keys.

[0090] Figure 8 This is the USB interface circuit diagram of the intelligent anti-theft production plastic mold alarm device of the present invention. Figure 8 As shown, in a specific implementation, the device of this embodiment further includes a USB interface, wherein pin 2 of terminal J3 is connected to one end of resistor R14, and the other end of resistor R14 is connected to a 3.3V voltage. Through the USB interface, users can also download status information of the intelligent anti-theft plastic mold production alarm device of the present invention, thereby expanding the application of the present invention.

[0091] In some optional implementations of this embodiment, the intelligent anti-theft plastic mold production alarm device can also connect to the injection molding machine controller via an industrial IoT smart gateway to collect real-time production data from the injection molding machine, such as the number of injections and mold opening and closing times. This data is processed by the MCU and automatically reported to a remote monitoring system via a communication circuit.

[0092] The working principle of the automatic reporting function of production count is:

[0093] (1) Data collection: During the production process, the controller of the injection molding machine will record the production data in real time. The intelligent anti-theft device establishes communication with the injection molding machine controller through the gateway and collects this data in real time.

[0094] (2) Data processing: After receiving the collected data, the MCU performs preprocessing and statistics to calculate the number of times the mold is used and the production quantity.

[0095] (3) Data reporting: The processed data is automatically reported to the remote monitoring system through communication circuits (such as 4G / 5G, Wi-Fi, etc.) for management personnel to view and analyze in real time.

[0096] In some optional implementations of this embodiment, the intelligent anti-theft plastic mold production alarm device of the present invention can also provide an anti-movement alarm function by combining a GPS positioning chip and a Hall effect sensing circuit. The GPS positioning chip is used to track and locate the mold's position in real time, while the Hall effect sensing circuit is used to detect whether the mold has been illegally moved or disassembled.

[0097] The GPS positioning chip built into the intelligent anti-theft device receives satellite signals to locate the mold in real time. The MCU regularly reads GPS data and uploads it to the remote monitoring system, allowing managers to monitor the mold's location at all times.

[0098] The Hall effect sensor circuit determines whether the mold has been moved or removed by detecting the position of magnetic marks or magnetic components on the mold. When the mold position changes, the Hall effect sensor circuit immediately sends a signal to the MCU.

[0099] When the MCU receives the signal from the Hall effect sensor circuit, it determines that the device is being moved or disassembled illegally and immediately triggers an alarm. The alarm is displayed on the LED display circuit and sent to the remote monitoring system via the communication circuit, simultaneously triggering an audible or visual alarm.

[0100] In some optional implementations of this embodiment, the GPS positioning chip and communication circuitry in the intelligent anti-theft plastic mold production alarm device of the present invention can realize a GPS location map function. The GPS positioning chip collects mold location information in real time and uploads it to a remote monitoring system via the communication circuitry, which then displays the mold location on a map in real time.

[0101] GPS data collection: The GPS positioning chip receives satellite signals through the antenna and converts them into location information. This information includes longitude, latitude, altitude, etc.

[0102] Data upload: The MCU regularly reads data from the GPS positioning chip and uploads it to the remote monitoring system through communication circuits (such as 4G / 5G, Wi-Fi, etc.).

[0103] Map display: After receiving the uploaded location information, the remote monitoring system will display it on the map in real time so that managers can view the real-time location of the mold.

[0104] In some optional implementations of this embodiment, the intelligent anti-theft plastic mold production alarm device of the present invention can also realize the device vibration alarm function by using a vibration sensor circuit.

[0105] The vibration sensing circuit can sense the vibration or impact force acting on the mold and convert it into an electrical signal and transmit it to the MCU.

[0106] Vibration detection: Vibration sensing circuits use electrical measurement methods to convert vibration or impact forces on the mold into electrical signals. This conversion is usually achieved through the piezoelectric effect or strain gauges.

[0107] Signal transmission: The converted electrical signal is amplified and filtered before being transmitted to the MCU. The MCU analyzes and determines whether the signal has reached the alarm threshold.

[0108] Alarm triggering: When the vibration signal exceeds the preset alarm threshold, the MCU immediately triggers the alarm mechanism. The alarm information is displayed on the LED display circuit and transmitted to the remote monitoring system via the communication circuit. At the same time, the device may emit an audible or visual alarm to alert management personnel.

[0109] The working principle of the intelligent anti-theft production plastic mold alarm device of the present invention is:

[0110] (1) Initialization and configuration: After the equipment is started, the MCU will perform initialization operations, including configuring the working parameters of each functional module, checking the sensor status, etc. At the same time, the MCU will also establish a connection with the remote monitoring system through the communication circuit to upload the mold status data in real time.

[0111] (2) Real-time monitoring and data processing: The MCU collects data from each sensor (such as vibration signals, Hall effect sensors, etc.) in real time through the ADC interface or GPIO interface, and processes and analyzes the data. When the data exceeds the preset range, the MCU will identify it as an abnormality and trigger an alarm.

[0112] (3) Alarm triggering and response: When an abnormality occurs in the mold, the MCU controls the LED display circuit to display the corresponding alarm information (such as flashing indicator lights, color changes, etc.) and uploads the alarm information to the remote monitoring system through the communication circuit. At the same time, the MCU can also control actuators such as buzzers to sound alarms to remind operators to deal with them in a timely manner.

[0113] (4) Positioning and tracking: Combined with GPS positioning chips and communication circuits, the intelligent anti-theft production plastic mold alarm device can obtain the mold's location information in real time and upload this information to the remote monitoring system. This helps operators quickly locate the mold and track it.

[0114] (5) Charging management and battery protection: During the operation of the device, the charging management circuit will monitor the battery voltage, current and other status information in real time, and adjust the charging strategy based on this information to ensure safe and efficient charging of the battery. At the same time, the battery will be protected during the charging process to prevent damage such as overcharging and over-discharging.

[0115] (6) Data recording and analysis: The MCU will record the mold status data, alarm information, etc. into the internal memory for subsequent data analysis and troubleshooting. At the same time, the operator can also remotely download this data through the communication circuit for analysis and processing.

[0116] The present invention has the following beneficial effects through the design of the above embodiments:

[0117] (1) Accurate positioning and tracking: Through the built-in GPS positioning chip, the position information of the mold can be tracked and accurately located in real time, which greatly facilitates mold scheduling, maintenance and management, and effectively solves the problem of difficult to accurately track the mold position in traditional methods;

[0118] (2) Vibration and impact force monitoring: The vibration sensing circuit can sensitively capture the vibration or impact force acting on the mold, which is crucial for preventing damage to the mold due to excessive use or abnormal operation. Through data analysis, potential failures can be warned in advance, reducing unplanned downtime;

[0119] (3) Magnetic mark detection: The application of Hall sensing circuit can accurately detect the position status of magnetic marks or magnetic components on the mold, which is of great significance for the automated control of mold assembly, disassembly and quality inspection, and improves the accuracy and efficiency of operation.

[0120] (4) Remote monitoring and data exchange: The establishment of communication circuits enables this device to seamlessly connect with the remote monitoring system and realize real-time data transmission and sharing. This not only enhances management flexibility, but also provides a rich data source for data analysis and fault diagnosis.

[0121] (5) Intelligent battery management: The charging management circuit monitors the battery status in real time to ensure that the battery operates under safe and efficient conditions, extending the service life of the equipment and reducing equipment failures caused by battery problems;

[0122] (6) Power supply stability guarantee: The application of voltage stabilization circuit effectively prevents the influence of power supply voltage fluctuation on equipment performance, ensures the stable operation of the device under various working conditions, and improves the reliability and stability of the system.

[0123] (7) Intuitive information display: The LED display circuit provides clear working status indication and alarm information, allowing operators to quickly understand the equipment status and take timely response measures, enhancing the intuitiveness and response speed of on-site management.

[0124] While the present invention has been described with reference to specific embodiments, those skilled in the art will appreciate that various modifications and equivalents may be made without departing from the scope of the present invention. Furthermore, numerous modifications may be made to adapt the present invention to specific applications without departing from the scope of the present invention. Therefore, the present invention is not limited to the specific embodiments disclosed herein, but encompasses all embodiments falling within the scope of the claims.

Claims

1. An intelligent anti-theft production plastic mold alarm device, characterized in that: include: MCU, a GPS positioning chip, a vibration sensing circuit, a Hall sensing circuit, a communication circuit, a charging management circuit, a voltage stabilizing circuit and an LED display circuit electrically connected to the MCU respectively, the MCU is used to control the GPS positioning chip, the vibration sensing circuit, the Hall sensing circuit, the communication circuit, the charging management circuit, the voltage stabilizing circuit and the LED display circuit, the GPS positioning chip is used to track and locate the position of the mold, the vibration sensing circuit is used to sense the vibration or impact force acting on the mold, the Hall sensing circuit is used to detect the position status of the magnetic mark or magnetic component on the mold, the communication circuit is used for data exchange between the device and the remote monitoring system, the charging management circuit is used to monitor the voltage and current status information of the battery in real time, the voltage stabilizing circuit is used to maintain the stability of the power supply voltage inside the device to prevent equipment failure or performance degradation due to power supply voltage fluctuations, and the LED display circuit is used to display the working status and alarm information of the device.

2. The intelligent anti-theft production plastic mold alarm device according to claim 1 is characterized in that: The MCU includes any one of: APM32F003, STM32F103C8T6, ATmega328, ESP32, HC32M1 and HC32M4.

3. The intelligent anti-theft production plastic mold alarm device according to claim 1 is characterized in that: The GPS positioning chip includes any one of SiRFstar III, u-blox G5, AT9880U-B and AT6558R-5N32.

4. The intelligent anti-theft production plastic mold alarm device according to claim 1 is characterized in that: The vibration sensing circuit includes: one end of a switch S1 is grounded, the other end of the switch S1 is connected to one end of a resistor R8, and the other end of the resistor R8 is connected to one end of a capacitor C9 and one end of a resistor R7 respectively.

5. The intelligent anti-theft production plastic mold alarm device according to claim 1 is characterized in that: The Hall sensing circuit includes: pin 1 of the Hall sensor U5 is connected to the drain of the MOSFET tube Q2, the source of the MOSFET tube Q2 is connected to one end of the resistor R12, and the gate of the MOSFET tube Q2 is connected to the other end of the resistor R12 and one end of the resistor R13 respectively.

6. The intelligent anti-theft production plastic mold alarm device according to claim 1 is characterized in that: The communication circuit includes: pin 8 of the wireless communication module chip U3 is connected to the drain of the MOSFET tube Q1, the source of the MOSFET tube Q1 is connected to one end of the resistor R10, and the gate of the MOSFET tube Q1 is connected to the other end of the resistor R10 and one end of the resistor R11 respectively.

7. The intelligent anti-theft production plastic mold alarm device according to claim 1 is characterized in that: The charging management circuit includes: pin 1 of the charging management chip U1 is respectively connected to one end of the resistor R1 and pin 3 of the charging management chip U1 and is grounded; pin 2 of the charging management chip U1 is connected to the other end of the resistor R1; pin 4 of the charging management chip U1 is respectively connected to one end of the capacitor C1 and pin 2 of the connection terminal J1; pin 1 of the connection terminal J1 is connected to the other end of the capacitor C1; pin 5 of the charging management chip U1 is respectively connected to pin 1 of the diode D3, pin 2 of the diode D3, one end of the battery pack BT1, and one end of the capacitor C2; the other end of the battery pack BT1 is connected to the capacitor C2 The other end of the resistor R4 is connected and grounded, pin 6 of the charging management chip U1 is connected to one end of the resistor R3, pin 7 of the charging management chip U1 is connected to one end of the resistor R2, pin 8 of the charging management chip U1 is connected to pin 2 of the LED lamp LED2, pin 1 of the LED lamp LED2 is connected to the other end of the resistor R2, pin 3 of the LED lamp LED2 is connected to the other end of the resistor R3, pin 3 of the diode D3 is connected to one end of the resistor R4, the other end of the resistor R4 is respectively connected to one end of the capacitor C3 and one end of the resistor R5, the other end of the capacitor C3 is connected to the other end of the resistor R5 and grounded.

8. The intelligent anti-theft production plastic mold alarm device according to claim 1 is characterized in that: The voltage stabilizing circuit includes: pin 1 of the voltage regulator chip U4 is connected to pin 3 of the voltage regulator chip U4 and one end of the capacitor C4 respectively, pin 2 of the voltage regulator chip U4 is connected to the other end of the capacitor C4 and grounded, pin 5 of the voltage regulator chip U4 is connected to one end of the capacitor C5, and the other end of the capacitor C5 is grounded.

9. The intelligent anti-theft production plastic mold alarm device according to claim 1 is characterized in that: The LED display circuit includes: the cathode of the LED lamp LED1 is connected to one end of the resistor R9, and the anode of the LED lamp LED1 is connected to a 3.3V voltage.

10. The intelligent anti-theft production plastic mold alarm device according to any one of claims 1 to 9, characterized in that: The device further comprises: a USB interface, wherein the USB interface comprises a pin 2 of a terminal J3 connected to one end of a resistor R14, and the other end of the resistor R14 is connected to a 3.3V voltage.

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