Display device

Abstract

A display device includes a substrate, a pixel structure, a signal line, and a first inorganic insulating pattern. The substrate has an island region, a bridge region and a connection region, wherein the connection region is adjacent to the island region and connected with the bridge region. The pixel structure is arranged in the island region and comprises a light-emitting element. The signal line is located in the bridging area, extends to the connecting area and is electrically connected with the pixel structure. The first inorganic insulating pattern is located in the connection region and has a gap. The orthographic projection of the signal line on the substrate overlaps the orthographic projection of the gap on the substrate.

Description

Technical Field

[0001] The present invention relates to a photoelectric device, and in particular to a display device. Background Art

[0002] As display devices continue to innovate, stretchability, flexibility, and unrestricted form factors are gaining increasing attention, satisfying users' desire to freely stretch or bend displays. To maximize the stretchability and flexibility of display devices, one current approach is to fabricate pixel cells in an island-like form and connect them with bridge-like wiring structures.

[0003] However, current stretchable display devices often have metal residues between adjacent signal lines at the junction of pixel units and circuit structures, causing signal short circuits and abnormal signals, resulting in reduced product yield. Summary of the Invention

[0004] The present invention provides a display device with improved product yield.

[0005] The present invention provides a method for manufacturing a display device, which can improve the product yield of the display device.

[0006] One embodiment of the present invention provides a display device comprising a substrate, a pixel structure, a signal line, and a first inorganic insulating pattern. The substrate comprises an island region, a bridging region, and a connecting region, wherein the connecting region is adjacent to the island region and connected to the bridging region. The pixel structure is disposed in the island region and includes a light-emitting element. The signal line is located in the bridging region and extends to the connecting region, and is electrically connected to the pixel structure. The first inorganic insulating pattern is located in the connecting region and has a notch, wherein the orthographic projection of the signal line on the substrate overlaps the orthographic projection of the notch on the substrate.

[0007] In one embodiment of the present invention, the notch has an arc-shaped profile.

[0008] In one embodiment of the present invention, the portion of the first inorganic insulating pattern overlapping the signal line has a first maximum size, the portion of the first inorganic insulating pattern not overlapping the signal line has a second maximum size, and the first maximum size is smaller than the second maximum size.

[0009] In one embodiment of the present invention, the first inorganic insulating pattern is located between the substrate and the signal line.

[0010] In one embodiment of the present invention, the display device further includes an additional signal line, wherein the additional signal line is located between the substrate and the first inorganic insulating pattern.

[0011] In one embodiment of the present invention, the first inorganic insulating pattern has an opening, and the opening divides the first inorganic insulating pattern.

[0012] In one embodiment of the present invention, the opening is connected to the notch.

[0013] In one embodiment of the present invention, the signal line overlaps the opening.

[0014] In one embodiment of the present invention, the signal line includes a first signal line and a second signal line, and the first inorganic insulating pattern has a plurality of gaps, wherein the first signal line and the second signal line respectively overlap the plurality of gaps.

[0015] In one embodiment of the present invention, the first signal line and the second signal line are connected to the first signal source and the second signal source respectively.

[0016] In one embodiment of the present invention, the display device further includes a plurality of second inorganic insulating patterns, and the plurality of second inorganic insulating patterns are located in the bridging region and are physically separated from each other.

[0017] In one embodiment of the present invention, a portion of the second inorganic insulating patterns overlaps the signal line, and another portion of the second inorganic insulating patterns does not overlap the signal line.

[0018] In one embodiment of the present invention, the display device further includes an organic insulating layer, and the organic insulating layer surrounds the signal line, the first inorganic insulating pattern, and the second inorganic insulating pattern.

[0019] In one embodiment of the present invention, the light emitting element includes a micro light emitting diode or an organic light emitting diode.

[0020] In one embodiment of the present invention, the island region has a rectangular outline, and the bridge region has a U-shaped, V-shaped, or S-shaped outline.

[0021] In order to make the above features and advantages of the present invention more clearly understood, embodiments are given below and described in detail with reference to the accompanying drawings. BRIEF DESCRIPTION OF THE DRAWINGS

[0022] Figure 1A FIG. 1 is a partial top view of a display device according to an embodiment of the present invention.

[0023] Figure 1B yes Figure 1A A circuit diagram of an embodiment of a pixel structure of a display device.

[0024] Figure 1C yes Figure 1A An enlarged schematic diagram of the connection area of ​​the display device.

[0025] Figure 1D It is along Figure 1C Schematic cross-sectional view taken along section line AA'.

[0026] Figure 1E It is along Figure 1A Schematic cross-sectional view taken along section line BB'.

[0027] Figure 1F It is along Figure 1A Schematic cross-sectional view taken along section line C-C'.

[0028] Figure 1G yes Figure 1A A partial top view of an inorganic insulating pattern of a display device.

[0029] Figures 2A to 4A yes Figure 1A A partial cross-sectional schematic diagram of the steps of the manufacturing method of the display device.

[0030] Figures 2B to 4B They are Figures 2A to 4A Partial top view.

[0031] Figure 5 FIG. 1 is a top view of a connection area of ​​a display device according to an embodiment of the present invention.

[0032] Figure 6 FIG. 1 is a top view of a connection area of ​​a display device according to an embodiment of the present invention.

[0033] Figure 7 FIG. 1 is a top view of a connection area of ​​a display device according to an embodiment of the present invention.

[0034] Figure 8 FIG. 1 is a partial top view of a display device according to an embodiment of the present invention.

[0035] Figure 9 FIG. 1 is a partial top view of a display device according to an embodiment of the present invention.

[0036] Description of reference numerals:

[0037] 10~60: Display device

[0038] 110: Substrate

[0039] 120, 120a, 120b, 120c: Island

[0040] 130: Bridge

[0041] 140~147,140b,SL,DL1,DL2,DL3,Vdd,Vss,EM:Signal line

[0042] 140': conductive layer

[0043] 150,150',150a,150b,152,154: Inorganic insulation pattern

[0044] 151,151': Gap

[0045] 160: Organic insulating layer

[0046] A-A', B-B', C-C': hatching

[0047] AB: Bridge Area

[0048] AI: Island

[0049] C1, C2, C3: storage capacitors

[0050] CP: connection surface

[0051] DC: driving element

[0052] IE, IEa, IEb, IEc: connection area

[0053] L, L1, L2, W: Maximum size

[0054] LD, LD1, LD2, LD3: light-emitting elements

[0055] OP: Opening

[0056] PS: Pixel structure

[0057] T11, T12, T13, T21, T22, T23, T31, T32, T33: transistors

[0058] θ: acute angle DETAILED DESCRIPTION

[0059] As used herein, "about," "approximately," or "substantially" includes the stated value and an average value within an acceptable range of deviation for the particular value as determined by one of ordinary skill in the art, taking into account the measurement in question and the specific amount of error associated with the measurement (i.e., the limitations of the measurement system). For example, "about" can mean within one or more standard deviations of the stated value, or within ±30%, ±20%, ±10%, or ±5%. Furthermore, as used herein, "about," "approximately," or "substantially" can be used to select a more acceptable range of deviations or standard deviations depending on the optical property, etching property, or other property, rather than using a single standard deviation for all properties.

[0060] In addition, relative terms such as "lower" or "bottom" and "upper" or "top" may be used herein to describe the relationship of one element to another element, as shown in the figures. It should be understood that relative terms are intended to include different orientations of the device in addition to the orientation shown in the figures. For example, if the device in one figure is turned over, the element described as being on the "lower" side of the other elements will be oriented on the "upper" side of the other elements. Thus, the exemplary term "lower" can include both "lower" and "upper" orientations, depending on the particular orientation of the figure. Similarly, if the device in one figure is turned over, the element described as being "lower" or "below" the other elements will be oriented as being "above" the other elements. Thus, the exemplary terms "lower" or "below" can include both "lower" and "upper" orientations.

[0061] Figure 1A FIG. 1 is a partial top view of a display device 10 according to an embodiment of the present invention. Figure 1B yes Figure 1A FIG. 1 is a circuit diagram of an embodiment of a pixel structure PS of a display device 10 . Figure 1C yes Figure 1A FIG. 1 is an enlarged schematic diagram of the connection area IE of the display device 10 . Figure 1D It is along Figure 1C Schematic cross-sectional view taken along section line AA'. Figure 1E It is along Figure 1A Schematic cross-sectional view taken along section line BB'. Figure 1F It is along Figure 1A Schematic cross-sectional view taken along section line C-C'. Figure 1G yes Figure 1A A partial top view of the inorganic insulating pattern 150 of the display device 10 is shown below. Figures 1A to 1G , the implementation of each element and film layer of the display device 10 is further described, but the present invention is not limited thereto.

[0062] First, please refer to Figure 1A The display device 10 includes a substrate 110, which may include an island area AI, a bridging area AB, and a connecting area IE. The connecting area IE may be adjacent to the island area AI and may connect to the bridging area AB. In some embodiments, the island area AI and the connecting area IE together form a rectangular outline, but this is not limited to this. In other embodiments, the island area AI and the connecting area IE may have various geometric outlines, such as circular, polygonal, or irregular shapes, as desired. In some embodiments, the bridging area AB has a U-shaped outline, but this is not limited to this.

[0063] The substrate 110 of the display device 10 may be a flexible substrate. The substrate 110 may be made of, for example, polyimide (PI), polycarbonate (PC), polyester (PET), cyclic olefin copolymer (COC), metallocene-based cyclic olefin copolymer (mCOC), or other suitable materials, but is not limited thereto.

[0064] The display device 10 may further include an island portion 120 and a bridge portion 130. The island portion 120 may be disposed in the island area AI, and the bridge portion 130 may be disposed in the bridge area AB. In some embodiments, the island area AI may refer to the region where the island portion 120 is located, and the bridge area AB may refer to the region where the bridge portion 130 is located. The substrate 110 of the display device 10 may be used to support the island portion 120 and the bridge portion 130. The bridge portion 130 may be electrically connected to the island portion 120.

[0065] In some embodiments, the substrate 110 includes multiple islands AI, multiple bridges AB, and multiple connection areas IE. The bridges AB can be located between two islands AI. The connection areas IE can be adjacent to the islands AI and can connect the corresponding bridges AB to the islands AI. In some embodiments, one island AI can be connected to multiple bridges AB via multiple connection areas IE. In some embodiments, the display device 10 includes multiple islands 120 and multiple bridges 130. The islands 120 are disposed in the islands AI, and the bridges 130 are disposed in the bridges AB, each electrically connecting two islands 120.

[0066] In some embodiments, the plurality of islands AI of the substrate 110 are arranged in an array, and the plurality of island portions 120 of the display device 10 are respectively disposed in the plurality of islands AI and arranged in an array accordingly. For example, the island portions 120 may be arranged side by side.

[0067] Please refer to Figure 1B, each island portion 120 can, for example, constitute a pixel or sub-pixel of the display device 10. The island portion 120 can include a pixel structure PS. In some embodiments, the pixel structure PS includes a light-emitting element LD. The light-emitting element LD can be, for example, a micro light-emitting diode, an organic light-emitting diode or other self-luminous element. For example, each pixel structure PS includes three light-emitting elements LD1, LD2, and LD3, and the three light-emitting elements LD1, LD2, and LD3 can have different light colors. For example, the light-emitting element LD1 can emit red light, the light-emitting element LD2 can emit green light, and the light-emitting element LD3 can emit blue light, so that each island portion 120 can constitute a pixel of the display device 10, thereby achieving a full-color display effect. However, there is no special limitation on the number or light color of the light-emitting elements LD. In some embodiments, each island portion 120 can include one, two, four or more light-emitting elements LD.

[0068] For example, the pixel structure PS may further include transistors T11, T12, T13, transistors T21, T22, T23, transistors T31, T32, T33, and capacitors C1, C2, and C3, respectively, which are arranged corresponding to the light-emitting elements LD1, LD2, and LD3. The gates of the transistors T11, T12, and T13 may be electrically connected to the corresponding bridge portion 130 via a signal line SL (e.g., serving as a scan line) to receive a gate signal via the corresponding bridge portion 130. The sources of the transistors T11, T12, and T13 may be electrically connected to the corresponding bridge portion 130 via signal lines DL1, DL2, and DL3 (e.g., serving as data lines) to receive a source signal via the corresponding bridge portion 130. The drains of the transistors T11, T12, and T13 may be electrically connected to the gates of the transistors T21, T22, and T23, respectively, to control the on or off of the transistors T21, T22, and T23. The sources of transistors T21, T22, and T23 and the cathodes of light-emitting elements LD1, LD2, and LD3 can be electrically connected to the corresponding bridge portion 130 via signal lines Vdd and Vss (e.g., serving as power lines), respectively, to be electrically connected to a voltage source via the corresponding bridge portion 130. The drains of transistors T21, T22, and T23 can be electrically connected to the sources of transistors T31, T32, and T33, respectively. The gates of transistors T31, T32, and T33 can be electrically connected to the signal line EM, respectively. The drains of transistors T31, T32, and T33 can be electrically connected to the anodes of light-emitting elements LD1, LD2, and LD3, respectively. Transistors T31, T32, and T33 can serve as switching elements to control the light-emitting time of light-emitting elements LD1, LD2, and LD3, respectively. In addition, the two ends of capacitors C1, C2, and C3 can be electrically connected to the drains of transistors T11, T12, and T13 and the sources of transistors T21, T22, and T23, respectively. Transistors T11, T12, and T13 can control the charging time of capacitors C1, C2, and C3, respectively. Transistors T11, T12, and T13 and transistors T21, T22, and T23 can respectively provide stable current to light-emitting elements LD1, LD2, and LD3 within a frame time. In addition, capacitors C1, C2, and C3 can maintain the gate voltage of transistors T21, T22, and T23 after the scan pulse signals of transistors T11, T12, and T13 end, thereby providing a continuous driving current to light-emitting elements LD1, LD2, and LD3 until the end of a frame time.

[0069] In some embodiments, the bridge portion 130 includes signal lines 140 and 141 . The signal lines 140 and 141 may be located in the bridge area AB and extend to the connection area IE to electrically connect the pixel structure PS.

[0070] Please refer to Figure 1CThe display device 10 further includes an inorganic insulating pattern 150 , and the inorganic insulating pattern 150 may be disposed in the connection region IE. In other words, the inorganic insulating pattern 150 may be disposed at a connection point between the island portion 120 and the bridge portion 130 .

[0071] Please also refer to Figure 1C and Figure 1D In some embodiments, the inorganic insulating pattern 150 may be disposed near the slope of the signal line 141 (i.e., the bend of the signal line 141 caused by the undulating terrain). When the display device 10 is deformed by external tension or compression, the slope within the connection area IE may be a location within the island portion 120 that experiences relatively large strain. The provision of the inorganic insulating pattern 150 can disperse the strain, thereby improving the strain tolerance of the display device 10.

[0072] The inorganic insulating pattern 150 may have an irregular profile with a notch 151 (or a depression). In some embodiments, the inorganic insulating pattern 150 has a rectangular profile with the notch 151 (or a depression). The orthographic projections of the signal lines 140 and 141 on the substrate 110 overlap the orthographic projections of the notch 151 on the substrate 110. For example, the inorganic insulating pattern 150 may have two arc-shaped notches 151, and the signal lines 140 and 141 overlap the two arc-shaped notches 151, respectively. The notch 151 helps to accelerate the etching rate of the conductive material (e.g., metal) during the etching process for forming the signal lines 140 and 141, thereby preventing the conductive material from remaining between the signal lines 140 and 141 and causing a short circuit between the signal lines 140 and 141.

[0073] In some embodiments, the portion of the inorganic insulating pattern 150 overlapping the signal lines 140 and 141 has a maximum size L1 , and the portion of the inorganic insulating pattern 150 not overlapping the signal lines 140 and 141 has a maximum size L2 , and the maximum size L1 is smaller than the maximum size L2 .

[0074] In some embodiments, the display device 10 further includes signal lines 143, 145, and 147. The signal lines 143, 145, and 147 may substantially overlap the signal line 141. The signal lines 141, 143, 145, and 147 may each transmit a different signal, such as a scan signal, a data signal, or a power signal, but are not limited thereto. In some embodiments, any two of the signal lines 141, 143, 145, and 147 may transmit the same signal.

[0075] In some embodiments, the inorganic insulating pattern 150 is disposed between the signal line 141 and the substrate 110. In some embodiments, the inorganic insulating pattern 150 is disposed between the additional signal line 143 and the signal line 145, such that the additional signal line 143 is located between the substrate 110 and the inorganic insulating pattern 150. In some embodiments, the inorganic insulating pattern 150 may be disposed between the signal line 141 and the substrate 110, and another inorganic insulating pattern 150 may be disposed between the additional signal line 143 and the signal line 145, such that the additional signal line 143 is located between the substrate 110 and the other inorganic insulating pattern 150. In other embodiments, the inorganic insulating pattern 150 is disposed between the additional signal line 143 and the signal line 145, such that the additional signal line 143 is located between the substrate 110 and the inorganic insulating pattern 150, while the inorganic insulating pattern 150 is not disposed between the signal line 141 and the substrate 110.

[0076] In some embodiments, the display device 10 further includes an organic insulating layer 160, and the organic insulating layer 160 may surround the inorganic insulating pattern 150. The organic insulating layer 160 may also be located between any two of the signal lines 141, 143, 145, and 147. In some embodiments, the organic insulating layer 160 may surround each of the signal lines 141, 143, 145, and 147. The material of the organic insulating layer 160 may include, for example, acrylic, siloxane, polyimide, epoxy, etc., but is not limited thereto. In some embodiments, the organic insulating layer 160 may have a single-layer structure or a multi-layer structure. When the organic insulating layer 160 has a multi-layer structure, each layer in the multi-layer structure may include the same material or different materials.

[0077] Please refer to Figure 1E and Figure 1G , the display device 10 may further include a plurality of inorganic insulating patterns 152 disposed in the bridge area AB. A portion of the plurality of inorganic insulating patterns 152 may overlap the signal lines 140, 141, and the plurality of inorganic insulating patterns 152 may be physically separated from each other by the organic insulating layer 160. In other words, the plurality of inorganic insulating patterns 152 may be discontinuously distributed between the signal lines 140, 141 and the substrate 110, and the organic insulating layer 160 may surround each inorganic insulating pattern 152. For example, Figure 1E The dotted lines in ⊂ may represent the multi-layer structure of the organic insulating layer 160 .

[0078] In some embodiments, the display device 10 further includes signal lines 142, 144, and 146. The signal lines 142, 144, and 146 may substantially overlap the signal line 140. In some embodiments, a portion of the inorganic insulating pattern 152 is located between any two of the signal lines 140, 142, 144, and 146 and / or between any two of the signal lines 141, 143, 145, and 147, thereby improving the problem of poor adhesion between the organic insulating layer 160 and the signal lines 140 to 147. In some embodiments, as Figure 1B Any of the signal lines SL, DL1, DL2, DL3, Vdd, Vss, and EM shown may be electrically connected to any of the signal lines 140-147, respectively.

[0079] In some embodiments, the signal lines 140-147 have a rectangular shape, but are not limited thereto. The signal lines 140-147 may have good electrical conductivity and ductility or stretchability. Specifically, the material of the signal lines 140-147 may have a relatively low resistivity. For example, the resistivity of the signal lines 140-147 may be between 1.5x10 -5 Up to 5x10 -4 Ω*mm. For example, the signal lines 140-147 may include metal materials such as titanium, aluminum, copper, silver, or alloys thereof, but are not limited thereto. In some embodiments, the signal lines 140-147 also include conductive oxides (such as indium tin oxide, zinc aluminum oxide, zinc gallium oxide, zinc indium oxide, etc.), conductive polymers (such as poly(3,4-ethylenedioxythiophene):poly(styrene sulfonate) (PEDOT:PSS)), metal nanowires (such as silver nanowires) or combinations thereof. In some embodiments, the signal lines 140-147 may respectively have a single-layer structure or a multi-layer structure. When the signal lines 140-147 have a multi-layer structure, the layers in the multi-layer structure may include the same material or different materials from each other.

[0080] Please refer to Figure 1FIn some embodiments, part of the inorganic insulating pattern 152 does not overlap the signal lines 140 to 147. For example, part of the inorganic insulating pattern 152 does not overlap the signal lines 140 and 141 and is located between the organic insulating layer 160 and the substrate 110, thereby improving the problem of poor adhesion between the organic insulating layer 160 and the substrate 110. In some embodiments, the inorganic insulating pattern 152 is located between multiple layers of the multi-layer structure of the organic insulating layer 160, so that the organic insulating layer 160 surrounds each inorganic insulating pattern 152. In this way, through the support or buffering of each inorganic insulating pattern 150 and 152, when the display device 10 is deformed, the stress borne by the connection area IE of the island portion 120 can be reduced, and the strain of the bridge portion 130 in the tensile state can be dispersed, so that the amount of stretch that the connection area IE and the bridge portion 130 can withstand is increased, thereby improving the stretchability and elastic recovery of the display device 10.

[0081] In some embodiments, some of the inorganic insulating patterns 152 belong to the same film layer, while others belong to different film layers. The materials of the inorganic insulating patterns 150 and 152 may include, but are not limited to, silicon nitride (SiNx), silicon oxide (SiOx), silicon oxynitride (SiNxOy), titanium oxide (TiO), etc. In some embodiments, the inorganic insulating patterns 150 and 152 may have a single-layer structure or a multi-layer structure. When the inorganic insulating patterns 150 and 152 have a multi-layer structure, each layer in the multi-layer structure may include the same material or different materials.

[0082] Please refer to Figure 1G In some embodiments, the display device 10 further includes an inorganic insulating pattern 154, and the inorganic insulating pattern 154 is located in the island area AI. The inorganic insulating pattern 154 can, for example, serve as an insulating layer between conductive film layers of transistors or capacitors. For example, Figure 1BIn the illustrated pixel structure PS, a portion of the transistors T11, T12, T13, T21, T22, T23, T31, T32, T33 and the capacitors C1, C2, and C3 may be located below the inorganic insulating pattern 154 (i.e., between the inorganic insulating pattern 154 and the substrate 110), while another portion of the transistors T11, T12, T13, T21, T22, T23, T31, T32, T33 and the capacitors C1, C2, and C3 may be located above the inorganic insulating pattern 154. In some embodiments, any of the signal lines 140-147 may be electrically connected to the components below the inorganic insulating pattern 154 via a through hole (not shown) in the inorganic insulating pattern 154. For example, when the signal line 140 serves as the signal line SL for transmitting a scan signal and the gates of the transistors T11, T12, and T13 are located below the inorganic insulating pattern 154, the signal line 140 can be electrically connected to the gates of the transistors T11, T12, and T13 via vias in the inorganic insulating pattern 154. In some embodiments, the material of the gates of the transistors T11, T12, and T13 may not be ductile or stretchable.

[0083] In some embodiments, a connection plane CP is defined between the connection region IE and the bridge region AB. The inorganic insulating pattern 150 has a maximum dimension W in a direction parallel to the connection plane CP closest to the connection region IE. The connection region IE has a maximum dimension L in a direction parallel to the connection plane CP closest to the connection region IE, and L / 6 ≤ W ≤ L / 2. In some embodiments, the maximum dimension W is approximately L / 3.

[0084] Figures 2A to 4A yes Figure 1A A partial cross-sectional schematic diagram of the steps of the manufacturing method of the display device 10 is shown. Figures 2B to 4B They are Figures 2A to 4A Partial top view. Figures 2A to 4A Along the Figures 2B to 4B A top view of line AA'.

[0085] Please also refer to Figure 2A and Figure 2B An inorganic insulating pattern 150' having a notch 151' is formed in a predetermined connection region IE on the substrate 110. The inorganic insulating pattern 150' may have an acute angle θ adjacent to the notch 151'. Thin film deposition, photolithography, and etching processes may be used to form the inorganic insulating pattern 150'. In some embodiments, the aforementioned inorganic insulating pattern 152 is also formed in a predetermined bridge region AB on the substrate 110. The bridge region AB may be adjacent to the connection region IE. In other words, the inorganic insulating pattern 152 and the inorganic insulating pattern 150' may belong to the same film layer.

[0086] Please also refer to Figure 3A and Figure 3B , forming a blanket conductive layer 140' on the substrate 110 and the inorganic insulating pattern 150'. A thin film deposition process (e.g., physical vapor deposition or electroplating) can be used to form the conductive layer 140'. Before forming the conductive layer 140', an organic insulating layer 160 can be formed on the substrate 110 and around the inorganic insulating pattern 150'. In some embodiments, a spin coating process can be used to form the organic insulating layer 160. The organic insulating layer 160 allows the conductive layer 140' to be formed on a relatively flat surface.

[0087] Please also refer to Figure 4A and Figure 4B , etching the conductive layer 140' to form signal lines 140, 141. The conductive layer 140' can be etched using, for example, an isotropic etching process. The signal lines 140, 141 can be located in the bridging area AB, and the signal lines 140, 141 can extend from the bridging area AB to the connection area IE. In some embodiments, the signal lines 140, 141 can also be electrically connected from the connection area IE to other areas within the island area AI, such as a component area where a transistor or capacitor is provided. By making the predetermined formation positions of the signal lines 140, 141 overlap the notches 151' of the inorganic insulating pattern 150', during the etching process of the conductive layer 140', the area adjacent to the notches 151' can have a faster etching rate, thereby preventing the material of the conductive layer 140' from remaining between the signal lines 140, 141, thereby reducing the possibility of a short circuit between the signal lines 140 and 141.

[0088] Furthermore, because the etchant used in the etching process not only removes the conductive layer 140' but also removes the inorganic insulating pattern 150', after the signal lines 140 and 141 are formed, the acute angle θ of the inorganic insulating pattern 150' is removed, and the shape of the notch 151' is slightly altered, resulting in an inorganic insulating pattern 150 having a notch 151, wherein the shape or profile of the notch 151 differs slightly from that of the notch 151'. In some embodiments, the etchant used in the etching process includes chlorine (Cl2), boron trichloride (BCl3), or a combination thereof. In some embodiments, the etchant has an etching selectivity of approximately 5 to 8:1 between the conductive layer 140' and the inorganic insulating pattern 150', for example, approximately 6.25:1.

[0089] In some embodiments, after forming the signal lines 140 and 141, the organic insulating layer 160, the signal lines 142 to 147 and other inorganic insulating patterns 150 and 152 are formed. Figures 1D to 1F After forming the signal lines 140 - 147 , a light emitting element electrically connected to at least one of the signal lines 140 - 147 may be formed in the island AI.

[0090] Figure 5FIG. 1 is a top view of a connection area IEa of a display device 20 according to an embodiment of the present invention. Figure 5 In the embodiment, the display device 20 can be regarded as Figures 1A to 1G Another embodiment of the display device 10, and the display device 20 can have all the components of the display device 10, this embodiment continues to use the same Figures 1A to 1G The same or similar component numbers and related contents are used in the embodiments.

[0091] With such Figure 1C Compared to the connection area IE of the display device 10 shown, Figure 5 The difference of the connection area IEa of the display device 20 shown is mainly that the inorganic insulating pattern 150 of the display device 20 can have an opening OP. The opening OP can divide the inorganic insulating pattern 150. For example, the opening OP separates the inorganic insulating pattern 150 into inorganic insulating patterns 150a and 150b, and the inorganic insulating patterns 150a and 150b are physically separated from each other, so as to promote the etching of the material of the conductive layer 140' located between the predetermined positions of the signal line 140 and the signal line 141 during the etching process of the conductive layer 140', and even further increase the local etching rate to avoid the material of the conductive layer 140' from remaining between the signal line 140 and the signal line 141. In other words, the signal line 140 and the signal line 141 are adjacent signal lines patterned from the same conductive layer 140'. In some embodiments, the signal line 140 is electrically connected to, for example, a scan signal source, and the signal line 141 is electrically connected to, for example, a data signal source, but is not limited thereto. The inorganic insulating pattern 150 prevents the conductive layer 140 ′ from remaining between the signal line 140 and the signal line 141 , thereby preventing the signal lines 140 and 141 connected to different signal sources from short-circuiting and causing signal anomalies, thereby improving the yield of the display device 20 .

[0092] Figure 6 FIG. 1 is a top view of a connection area IEb of a display device 30 according to an embodiment of the present invention. Figure 6 In the embodiment, the display device 30 can be regarded as Figures 1A to 1G Another embodiment of the display device 10, and the display device 30 can have all the components of the display device 10, this embodiment continues to use the same Figures 1A to 1G The same or similar component numbers and related contents are used in the embodiments.

[0093] With such Figure 1C Compared to the connection area IE of the display device 10 shown, Figure 6The main difference of the connection area IEb of the display device 30 shown is that: in addition to the signal lines 140 and 141, the display device 30 also includes a signal line 140b that is roughly parallel to the signal lines 140 and 141, and the inorganic insulating pattern 150 of the display device 30 can have more gaps 151, and the multiple gaps 151 overlap with the signal lines 140, 141, and 140b respectively to avoid the conductive layer 140' remaining between the signal lines 140, 141, and 140b, ensuring that no short circuit occurs between the signal lines 140, 141, and 140b.

[0094] Figure 7 FIG. 1 is a top view of a connection area IEc of a display device 40 according to an embodiment of the present invention. Figure 7 In the embodiment, the display device 40 can be regarded as Figures 1A to 1G Another embodiment of the display device 10, and the display device 40 can have all the components of the display device 10, this embodiment continues to use the same Figures 1A to 1G The same or similar component numbers and related contents are used in the embodiments.

[0095] With such Figure 1C Compared to the connection area IE of the display device 10 shown, Figure 7 The connection region 1Ec of the display device 40 shown differs primarily in that, in addition to the signal lines 140 and 141, the display device 40 also includes a signal line 140b that is substantially parallel to the signal lines 140 and 141. Furthermore, the inorganic insulating pattern 150 of the display device 40 may have an opening OP and a plurality of notches 151, and the signal lines 140, 141, and 140b may overlap with the plurality of notches 151, respectively. The opening OP may separate the inorganic insulating pattern 150 into physically separate inorganic insulating patterns 150a and 150b. The middle signal line 141 may completely overlap the opening OP. The opening OP may further connect to adjacent notches 151. The signal line 141 may not overlap the inorganic insulating patterns 150a and 150b. This ensures that the conductive layer 140′ does not remain between the signal lines 140 and 141, or between the signal lines 141 and 140b.

[0096] Figure 8 FIG. 5 is a partial top view of a display device 50 according to an embodiment of the present invention. Figure 8 In the embodiment, the display device 50 can be regarded as Figures 1A to 1G Another embodiment of the display device 10, and the display device 50 can have all the components of the display device 10, this embodiment continues to use the same Figures 1A to 1GThe display device 50 has an island area AI, a bridge area AB, and a connection area IE adjacent to the island area AI and connected to the bridge area AB. The display device 50 includes a pixel structure PS located in the island area AI, an inorganic insulating pattern 150 located in the connection area IE, and a signal line 140 and an inorganic insulating pattern 152 located in the bridge area AB. Figure 1G Compared with the U-shaped bridge area AB of the display device 10 shown, Figure 8 The difference of the illustrated display device 50 is mainly that the bridge area AB of the display device 50 may have a V-shaped contour.

[0097] Figure 9 FIG. 1 is a partial top view of a display device 60 according to an embodiment of the present invention. Figure 9 In the embodiment, the display device 60 can be regarded as Figures 1A to 1G Another embodiment of the display device 10, and the display device 60 can have all the components of the display device 10, this embodiment continues to use Figures 1A to 1G The display device 60 has an island area AI, a bridge area AB, and a connection area IE adjacent to the island area AI and connected to the bridge area AB. The display device 60 includes a pixel structure PS located in the island area AI, an inorganic insulating pattern 150 located in the connection area IE, and a signal line 140 and an inorganic insulating pattern 152 located in the bridge area AB. Figure 1G Compared with the U-shaped bridge area AB of the display device 10 shown, Figure 9 The difference of the illustrated display device 60 is mainly that the bridge region AB of the display device 60 may have an S-shaped contour.

[0098] In summary, the display device of the present invention, through the inorganic insulating pattern provided in the connection region, can improve the poor adhesion between the signal lines and the organic insulating layer, as well as between the substrate and the organic insulating layer, thereby enhancing the stretchability of the display device. Furthermore, by providing notches in the inorganic insulating pattern, conductive material is prevented from remaining between the signal lines, thereby improving the yield and reliability of the display device.

[0099] Although the present invention has been disclosed above with reference to the embodiments, they are not intended to limit the present invention. Any person skilled in the art may make slight changes and modifications without departing from the concept and scope of the present invention. Therefore, the scope of protection of the present invention shall be determined by the claims.

Claims

1. A display device comprising: A substrate having an island region, a bridge region, and a connection region, wherein the connection region is adjacent to the island region and connected to the bridge region; a pixel structure, disposed in the island region and comprising a light-emitting element; a signal line, located in the bridging region and extending to the connection region, and electrically connected to the pixel structure; as well as The first inorganic insulating pattern is located in the connection area and has a gap. The orthographic projection of the signal line on the substrate overlaps the orthographic projection of the gap on the substrate. The display device according to claim 1 , wherein the notch has an arc-shaped outline.

3. The display device according to claim 1, wherein a portion of the first inorganic insulating pattern overlapping the signal line has a first maximum size, a portion of the first inorganic insulating pattern not overlapping the signal line has a second maximum size, and the first maximum size is smaller than the second maximum size. 4 . The display device of claim 1 , wherein the first inorganic insulating pattern is located between the substrate and the signal line. 5 . The display device of claim 4 , further comprising an additional signal line, wherein the additional signal line is located between the substrate and the first inorganic insulating pattern. 6 . The display device of claim 1 , wherein the first inorganic insulating pattern has an opening, and the opening divides the first inorganic insulating pattern. The display device according to claim 6 , wherein the opening is connected to the notch. The display device according to claim 6 , wherein the signal line overlaps the opening. 9 . The display device according to claim 1 , wherein the signal line comprises a first signal line and a second signal line, and the first inorganic insulating pattern has a plurality of the gaps, wherein the first signal line and the second signal line respectively overlap a plurality of the gaps. 10 . The display device as claimed in claim 9 , wherein the first signal line and the second signal line are connected to a first signal source and a second signal source, respectively. 11 . The display device of claim 1 , further comprising a plurality of second inorganic insulating patterns, the plurality of second inorganic insulating patterns being located in the bridging region and physically separated from each other. 12 . The display device of claim 11 , wherein a portion of the second inorganic insulating patterns overlaps the signal line, and another portion of the second inorganic insulating patterns does not overlap the signal line. 13 . The display device of claim 11 , further comprising an organic insulating layer surrounding the signal line, the first inorganic insulating pattern, and the second inorganic insulating pattern.

14. The display device according to claim 1, wherein the light emitting element comprises a micro light emitting diode or an organic light emitting diode. 15 . The display device of claim 1 , wherein the island region has a rectangular outline, and the bridge region has a U-shaped, V-shaped, or S-shaped outline.

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