Display panel and display device

Abstract

The invention relates to a display panel and a display device. The display panel comprises an array substrate; the light-emitting device layer is located on one side of the array substrate; the light-transmitting layer is located on the side, away from the array substrate, of the light-emitting device layer and comprises a first light-transmitting part and a second light-transmitting part, the first light-transmitting part is located in the central area, and the second light-transmitting part is located in the edge area; the thickness of the second light-transmitting part is gradually reduced from one end, close to the first light-transmitting part, of the second light-transmitting part to one end, far away from the first light-transmitting part, of the second light-transmitting part; the optical adhesive layer is located on the side, away from the array substrate, of the light-transmitting layer. The blocking piece comprises a first blocking part; the first blocking part and the second light-transmitting part are correspondingly arranged; the first blocking part is located between the corresponding second light-transmitting part and the optical adhesive layer. In conclusion, according to the display panel provided by the embodiment of the invention, the risk that splicing gaps are generated at the edge when the display panel is spliced can be reduced, and the probability that the display panel generates film sticking bubbles after the optical adhesive layer is stuck is reduced; and finally, the display effect of the display panel is improved.

Description

Technical Field

[0001] The present application relates to the field of display technology, and in particular to a display panel and a display device. Background Art

[0002] With the continuous advancement of science and technology, more and more display devices are widely used in people's daily life and work, bringing great convenience to people's daily life and work. The main component of a display device to achieve the display function is a display panel.

[0003] In the related art, multiple small-sized display panels are spliced ​​into a large-sized spliced ​​screen to meet the needs of large-screen display. The edges of the display panels are prone to obvious splicing gaps and film bubbles, which affect the display effect of the display panel. Summary of the Invention

[0004] Based on this, it is necessary to propose a display panel and a display device to address the problem that obvious splicing gaps and film bubbles are easily generated at the edges of current display panels.

[0005] A display panel comprises: a central area and an edge area partially surrounding the central area, the display panel comprising:

[0006] an array substrate;

[0007] a light emitting device layer, located on one side of the array substrate;

[0008] a light-transmitting layer located on a side of the light-emitting device layer away from the array substrate, the light-transmitting layer comprising a first light-transmitting portion and a second light-transmitting portion, the first light-transmitting portion being located in the central region, and the second light-transmitting portion being located in the edge region; the thickness of the second light-transmitting portion decreasing from an end of the second light-transmitting portion close to the first light-transmitting portion to an end of the second light-transmitting portion away from the first light-transmitting portion;

[0009] an optical adhesive layer, located on a side of the light-transmitting layer away from the array substrate;

[0010] The blocking member includes a first blocking portion; the first blocking portion is correspondingly arranged to the second light-transmitting portion; the first blocking portion is located between the corresponding second light-transmitting portion and the optical adhesive layer, and the side of the first blocking portion away from the array substrate is in contact with the side of the optical adhesive layer close to the array substrate; the side of the first blocking portion close to the array substrate is in contact with the side of the corresponding second light-transmitting portion away from the array substrate.

[0011] The present application also proposes a display device, comprising the display panel described above.

[0012] In the display panel and display device of this embodiment, since the first blocking portion is located between the corresponding second light-transmitting portion and the optical adhesive layer, the side of the first blocking portion away from the array substrate contacts the side of the optical adhesive layer close to the array substrate; and the side of the first blocking portion close to the array substrate contacts the side of the corresponding second light-transmitting portion away from the array substrate. Therefore, the first blocking portion can fill the gap between the side of the second light-transmitting portion away from the array substrate and the side of the optical adhesive layer close to the array substrate. Thus, the first blocking portion supports the optical adhesive layer during the process of laminating the optical adhesive layer to the light-transmitting layer, and prevents the optical adhesive layer from bending toward the second light-transmitting portion along the thickness direction of the second light-transmitting portion. By preventing the optical adhesive layer from bending toward the second light-transmitting portion along the thickness direction of the second light-transmitting portion, the flatness of the side of the optical adhesive layer away from the light-transmitting layer can be improved, ensuring that the edge of the optical adhesive layer is always flat, and avoiding the generation of a noticeable splicing gap when each display panel is spliced ​​with an adjacent display panel due to the uneven edge of the optical adhesive layer.

[0013] It should be noted that, due to the support of the first blocking part, the optical adhesive layer will not bend toward the second light-transmitting part along the thickness direction of the second light-transmitting part; therefore, the optical adhesive layer after bonding will not move in the direction away from the second light-transmitting part due to bending stress; the contact between the optical adhesive layer and the first blocking part will not be separated; the side of the optical adhesive layer close to the array substrate will always maintain close contact with the side of the first blocking part away from the array substrate; it is not easy to generate a gap between the first blocking part and the optical adhesive layer, and the risk of film bubbles generated between the first blocking part and the optical adhesive layer is lower.

[0014] In summary, the display panel and the display device in this embodiment can reduce the risk of splicing gaps at the edges when the display panels are spliced, and reduce the probability of film bubbles forming on the display panels after the optical adhesive layers are bonded, by having the first blocking portion located between the corresponding second light-transmitting portion and the optical adhesive layer; ultimately, this improves the display effect of the display panel and the display device. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] In order to more clearly illustrate the technical solutions in the embodiments or exemplary embodiments of the present application, the drawings required for use in the description of the embodiments or exemplary embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without any creative work.

[0016] Figure 1 FIG. 1 is a top view of a display device in an embodiment of the present application.

[0017] Figure 2 for Figure 1 A top view of any display panel in the display device shown.

[0018] Figure 3 for Figure 2 A cross-sectional view of the display panel at point M is shown.

[0019] Figure 4 for Figure 2 A cross-sectional view of a display panel at position N is shown.

[0020] Figure 5 For manufacturing Figure 3 Process flow diagram of the barrier shown in cross-section.

[0021] Figure 6 for Figure 2 A cross-sectional view of the display panel at point M is shown.

[0022] Figure 7 for Figure 2 A cross-sectional view of a display panel at position N is shown.

[0023] Figure 8 for Figure 2 A cross-sectional view of the display panel at point M is shown.

[0024] Figure 9 for Figure 2 A cross-sectional view of a display panel at position N is shown.

[0025] Reference numerals:

[0026] Display device 1;

[0027] Display panel 10, central area S1, edge area S2;

[0028] Array substrate 100 , first side surface 110 , first sub-side surface 111 , second sub-side surface 112 , first connecting surface 113 ;

[0029] Light-emitting device layer 200, light-emitting device 210;

[0030] Light-transmitting layer 300, first light-transmitting portion 310, second light-transmitting portion 320;

[0031] Optical adhesive layer 400;

[0032] Blocking member 500 , first blocking portion 510 , first surface 511 ;

[0033] Encapsulation layer 600;

[0034] Light shielding layer 700, through hole 710;

[0035] Side wiring 800, functional wiring 810, side wiring 820, fan-out wiring 830;

[0036] Package structure 900, routing package layer 910, filling package layer 920, light shielding package layer 930, main body 931, extension portion 932;

[0037] baffle 20;

[0038] Gap 30. DETAILED DESCRIPTION

[0039] To make the above-mentioned objects, features, and advantages of the present application more clearly understood, the specific embodiments of the present application are described in detail below with reference to the accompanying drawings. The following description sets forth many specific details to facilitate a full understanding of the present application. However, the present application can be implemented in many other ways than those described herein, and those skilled in the art can make similar improvements without violating the scope of the present application. Therefore, the present application is not limited to the specific embodiments disclosed below.

[0040] In the description of this application, it should be understood that if the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise", "axial", "radial", "circumferential", etc. appear, the orientation or position relationship indicated by these terms is based on the orientation or position relationship shown in the accompanying drawings, which is only for the convenience of describing this application and simplifying the description, and does not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on this application.

[0041] In addition, if the terms "first" or "second" appear, these terms are used for descriptive purposes only and should not be understood to indicate or imply relative importance or implicitly specify the number of technical features indicated. Therefore, a feature specified as "first" or "second" may explicitly or implicitly include at least one of such features. In the description of this application, if the term "plurality" appears, "plurality" means at least two, for example, two, three, etc., unless otherwise specifically defined.

[0042] In this application, unless otherwise specified or limited, the terms "mounted," "connected," "connected," "fixed," etc., should be interpreted broadly. For example, these terms may refer to fixed connections, removable connections, or integration; mechanical connections or electrical connections; direct connections or indirect connections through an intermediary; and internal communication between two components or interaction between two components, unless otherwise specified. Those skilled in the art will understand the specific meanings of these terms in this application based on the specific circumstances.

[0043] In this application, unless otherwise expressly specified or limited, if a first feature is described as being "above" or "below" a second feature, or similar descriptions, this may mean that the first and second features are in direct contact, or that the first and second features are in indirect contact through an intermediate medium. Furthermore, when a first feature is described as being "above," "above," or "above" a second feature, it may mean that the first feature is directly above or diagonally above the second feature, or simply means that the first feature is at a higher level than the second feature. When a first feature is described as being "below," "below," or "below" a second feature, it may mean that the first feature is directly below or diagonally below the second feature, or simply means that the first feature is at a lower level than the second feature.

[0044] It should be noted that if an element is referred to as being "fixed to" or "disposed on" another element, it may be directly on the other element or there may be an intermediate element. If an element is considered to be "connected to" another element, it may be directly connected to the other element or there may be an intermediate element. If any, the terms "vertical", "horizontal", "upper", "lower", "left", "right" and similar expressions used in this application are for illustrative purposes only and do not represent the only embodiment.

[0045] In the related art, a light-transmitting layer is provided on the side of the light-emitting device layer of the display panel away from the array substrate, and an optical adhesive layer is provided on the side of the light-transmitting layer away from the array substrate. The applicant found that when the thickness of the light-transmitting layer gradually decreases in the direction away from the center of the light-transmitting layer; after the optical adhesive layer is provided on the light-transmitting layer, the optical adhesive layer will bend toward the light-transmitting layer along the thickness direction of the light-transmitting layer, and the bending of the optical adhesive layer causes the edges of the two display panels that are arbitrarily spliced ​​to be uneven, and there is a significant splicing gap. In addition, the applicant found that the bent optical adhesive layer will return to a flat state after the display panel has been working for a period of time, and then a gap will be generated between itself and the part of the light-transmitting layer whose thickness is gradually decreasing, resulting in frequent film bubbles between the optical adhesive layer and the part of the light-transmitting layer whose thickness is gradually decreasing. Based on this, in order to solve the above technical problems, the applicant proposed a display panel 10.

[0046] See also Figures 1 to 3 , Figure 2A top view of any display panel in a display device according to an embodiment of the present application is shown. A display panel 10 provided in an embodiment of the present application includes a central region S1 and an edge region S2 partially surrounding the central region S1. The display panel 10 includes an array substrate 100, a light-emitting device layer 200, a light-transmitting layer 300, an optical adhesive layer 400, and a blocking member 500. The light-emitting device layer 200 is located on one side of the array substrate 100. The light-transmitting layer 300 is located on the side of the light-emitting device layer 200 away from the array substrate 100. The light-transmitting layer 300 includes a first light-transmitting portion 310 and a second light-transmitting portion 320. The first light-transmitting portion 310 is located in the central region S1, and the second light-transmitting portion 320 is located in the edge region S2. The thickness of the second light-transmitting portion 320 decreases from the end of the second light-transmitting portion 320 closest to the first light-transmitting portion 310 to the end of the second light-transmitting portion 320 away from the first light-transmitting portion 310. The optical adhesive layer 400 is located on the side of the light-transmitting layer 300 away from the array substrate 100. The blocking member 500 includes a first blocking portion 510; the first blocking portion 510 is arranged corresponding to the second light-transmitting portion 320; the first blocking portion 510 is located between the corresponding second light-transmitting portion 320 and the optical adhesive layer 400, and the side of the first blocking portion 510 away from the array substrate 100 contacts the side of the optical adhesive layer 400 close to the array substrate 100; the side of the first blocking portion 510 close to the array substrate 100 contacts the side of the corresponding second light-transmitting portion 320 away from the array substrate 100.

[0047] In the display panel 10 of this embodiment, since the first blocking portion 510 is located between the corresponding second light-transmitting portion 320 and the optical adhesive layer 400, the side of the first blocking portion 510 away from the array substrate 100 contacts the side of the optical adhesive layer 400 close to the array substrate 100; the side of the first blocking portion 510 close to the array substrate 100 contacts the side of the corresponding second light-transmitting portion 320 away from the array substrate 100. Therefore, the first blocking portion 510 can fill the gap between the side of the second light-transmitting portion 320 away from the array substrate 100 and the side of the optical adhesive layer 400 close to the array substrate 100. Therefore, the first blocking portion 510 can support the optical adhesive layer 400 during the process of attaching the optical adhesive layer 400 to the light-transmitting layer 300, and prevent the optical adhesive layer 400 from bending toward the second light-transmitting portion 320 along the thickness direction of the second light-transmitting portion 320. By preventing the optical adhesive layer 400 from bending toward the second light-transmitting portion 320 along the thickness direction of the second light-transmitting portion 320, the flatness of the side of the optical adhesive layer 400 away from the light-transmitting layer 300 can be improved, ensuring that the edge of the optical adhesive layer 400 is always flat; and avoiding the generation of obvious splicing gaps when each display panel 10 is spliced ​​with an adjacent display panel 10 due to the uneven edge of the optical adhesive layer 400.

[0048] It should be noted that, due to the support of the first blocking part 510, the optical adhesive layer 400 will not bend toward the second light-transmitting part 320 along the thickness direction of the second light-transmitting part 320; therefore, the optical adhesive layer 400 after bonding will not move in the direction away from the second light-transmitting part 320 due to bending stress; the contact between the optical adhesive layer 400 and the first blocking part 510 will not separate; the side of the optical adhesive layer 400 close to the array substrate 100 will always maintain close contact with the side of the first blocking part 510 away from the array substrate 100; it is not easy to generate a gap between the first blocking part 510 and the optical adhesive layer 400, and the risk of generating film bubbles between the first blocking part 510 and the optical adhesive layer 400 is lower.

[0049] In summary, the display panel 10 in this embodiment can reduce the risk of splicing gaps at the edges of the display panel 10 when splicing, and reduce the probability of film bubbles forming on the display panel 10 after the optical adhesive layer 400 is attached, by having the first blocking portion 510 located between the corresponding second light-transmitting portion 320 and the optical adhesive layer 400; ultimately, the display effect of the display panel 10 is improved.

[0050] See also Figure 2 and Figure 3 In some embodiments, the light-transmitting layer 300 includes two second light-transmitting portions 320, each located on opposite sides of the first light-transmitting portion 310 along a first direction parallel to the plane of the display panel 10. The blocking member 500 includes two first blocking portions 510, each corresponding to each of the two second light-transmitting portions 320. A portion of each first blocking portion 510 is located between the corresponding second light-transmitting portion 320 and the optical adhesive layer 400. The orthographic projection of each first blocking portion 510 on the array substrate 100 overlaps with the orthographic projection of the corresponding second light-transmitting portion 320 on the array substrate 100.

[0051] In this embodiment, since the two first blocking portions 510 correspond one-to-one with the two second light-transmitting portions 320, and a portion of each first blocking portion 510 is located between the corresponding second light-transmitting portion 320 and the optical adhesive layer 400, the two first blocking portions 510 can respectively fill the gap between the side of the two second light-transmitting portions 320 away from the array substrate 100 and the side of the optical adhesive layer 400 closer to the array substrate 100. This supports the two edges of the optical adhesive layer 400 along the first direction during the process of attaching the optical adhesive layer 400 to the light-transmitting layer 300, preventing the two edges of the optical adhesive layer 400 in the first direction from bending toward the second light-transmitting portions 320 along the thickness direction of the second light-transmitting portions 320. This prevents a noticeable splicing gap from forming when each display panel 10 is spliced ​​with two adjacent display panels 10 located on opposite sides of the display panel 10 along the first direction.

[0052] It should be noted that, under the support of the two first blocking parts 510, the two edges of the optical adhesive layer 400 along the first direction will not bend toward the second light-transmitting part 320 along the thickness direction of the second light-transmitting part 320; therefore, the optical adhesive layer 400 after bonding will not move in the direction away from the second light-transmitting part 320 due to bending stress; the contact between the optical adhesive layer 400 at the edge area S2 and the first blocking part 510 will not separate; the side of the optical adhesive layer 400 at the edge area S2 close to the array substrate 100 will always maintain close contact with the side of the first blocking part 510 away from the array substrate 100; it is not easy to generate a gap between the first blocking part 510 and the optical adhesive layer 400 at the edge area S2, and the risk of generating film bubbles between the first blocking part 510 and the optical adhesive layer 400 at the edge area S2 is lower.

[0053] See also Figure 3 and Figure 5 In some embodiments, a distance D2 between the side of the first blocking portion 510 away from the array substrate 100 and the array substrate 100 increases from an end of the first blocking portion 510 close to the first light-transmitting portion 310 along the first direction to an end of the first blocking portion 510 away from the first light-transmitting portion 310 along the first direction, and the first direction is parallel to the plane where the display panel 10 is located.

[0054] In this embodiment, since the distance D2 between the side of the first blocking portion 510 away from the array substrate 100 and the array substrate 100 increases gradually from the end of the first blocking portion 510 close to the first light-transmitting portion 310 along the first direction to the end of the first blocking portion 510 away from the first light-transmitting portion 310 along the first direction, when the light-transmitting layer 300 is formed on the side of the light-emitting device layer 200 away from the array substrate 100, the staff can set a baffle 20 on the side of the array substrate 100 close to the second light-transmitting portion 320 along the first direction, so that the baffle 20 extends out from the side of the light-emitting device layer 200 away from the array substrate 100 along the thickness direction of the array substrate 100; with the help of the gap 30 formed between the side of the baffle 20 close to the second light-transmitting portion 320 along the first direction and the side of the second light-transmitting portion 320 away from the light-emitting device layer 200; finally, by inclined dispensing, the first blocking portion 510 is formed on the side of the second light-transmitting portion 320 away from the light-emitting device layer 200, thereby simplifying the difficulty of dispensing the first blocking portion 510.

[0055] It should be noted that, see Figure 5 After the first blocking portion 510 is cured, the staff can remove the blocking portion 20 as needed to facilitate bonding other film layers on the side of the optical adhesive layer 400 away from the light-transmitting layer 300 .

[0056] See also Figure 2 and Figure 3In some embodiments, a surface of the first blocking portion 510 that is away from the array substrate 100 is a first surface 511 , and the first surface 511 is recessed toward a side close to the array substrate 100 .

[0057] In this embodiment, since the side surface of the first blocking portion 510 away from the array substrate 100 is the first surface 511, the first surface 511 is recessed toward the side close to the array substrate 100; therefore, the staff can set a baffle on the side of the array substrate 100 close to the second light-transmitting portion 320 along the first direction, so that the baffle extends out from the side of the light-emitting device layer 200 away from the array substrate 100 along the thickness direction of the array substrate 100; with the help of the gap formed between the side of the baffle close to the second light-transmitting portion 320 along the first direction and the side of the second light-transmitting portion 320 away from the light-emitting device layer 200; finally, the first blocking portion 510 is formed on the side of the second light-transmitting portion 320 away from the light-emitting device layer 200 by inclined dispensing.

[0058] See also Figure 2 and Figure 3 In some embodiments, along the arrangement direction of the first light-transmitting portion 310 and the second light-transmitting portion 320, the orthographic projection of the first blocking portion 510 on the side close to the first light-transmitting portion 310 on the array substrate 100 is located between the orthographic projections of the opposite sides of the second light-transmitting portion 320 on the array substrate 100.

[0059] In this embodiment, the orthographic projection of the side of the first blocking portion 510 closest to the first light-transmitting portion 310 on the array substrate 100 is located between the orthographic projections of the second light-transmitting portion 320 on opposite sides on the array substrate 100. This reduces the size of the first blocking portion 510 in the first direction, and the volume of the first blocking portion 510, thereby reducing the manufacturing cost during the dispensing process of the first blocking portion 510. Ultimately, the first blocking portion 510 can be manufactured at a low cost while ensuring support for the optical adhesive layer 400.

[0060] In some embodiments, along the arrangement direction of the first light-transmitting portion 310 and the second light-transmitting portion 320, the distance between the side of the first blocking portion 510 close to the first light-transmitting portion 310 and the center of the first light-transmitting portion 310 is greater than the distance between the side of the second light-transmitting portion 320 close to the first light-transmitting portion 310 and the center of the first light-transmitting portion 310.

[0061] See also Figure 2 and Figure 3 In some embodiments, the first light-transmitting portion 310 is configured as a uniform thickness portion. The ratio of the distance D2 between the side of the first blocking portion 510 away from the array substrate 100 and the array substrate 100 to the thickness D1 of the first light-transmitting portion 310 is between 0.5 and 1.5.

[0062] In this embodiment, by setting the ratio of the distance D2 between the side of the first blocking portion 510 away from the array substrate 100 and the array substrate 100 to the thickness D1 of the first light-transmitting portion 310 to be between 0.5 and 1.5, the height difference between the side of the first blocking portion 510 away from the array substrate 100 and the side of the first light-transmitting portion 310 away from the array substrate 100 can be reduced; and the flatness of the side of the optical adhesive layer 400 away from the array substrate 100 after the optical adhesive layer 400 is attached to the side of the first light-transmitting portion 310 away from the light-emitting device layer 200, the area on the side of the second light-transmitting portion 320 away from the light-emitting device layer 200 that is not covered by the first blocking portion 510, and the side of the first blocking portion 510 away from the light-emitting device layer 200 is improved.

[0063] See also Figure 2 and Figure 6 In some embodiments, the first blocking portion 510 is further located between the first light-transmitting portion 310 and the optical adhesive layer 400. Along the arrangement direction of the first light-transmitting portion 310 and the second light-transmitting portion 320, the orthographic projection of the first blocking portion 510 on the array substrate 100 is located near the first light-transmitting portion 310 and between the orthographic projections of the first light-transmitting portion 310 on the array substrate 100 on two opposite sides.

[0064] In this embodiment, along the arrangement direction of the first light-transmitting portion 310 and the second light-transmitting portion 320, the orthographic projection of the side of the first light-transmitting portion 510 close to the first light-transmitting portion 310 on the array substrate 100 is located between the orthographic projections of the opposite sides of the first light-transmitting portion 310 on the array substrate 100; the light-transmitting layer 300 can be bonded only to the side of the first light-transmitting portion 310 and the first blocking portion 510 away from the light-emitting device layer 200; thereby improving the flatness of the side of the optical adhesive layer 400 away from the array substrate 100.

[0065] In some embodiments, along the arrangement direction of the first light-transmitting portion 310 and the second light-transmitting portion 320, the distance between the side of the first blocking portion 510 close to the first light-transmitting portion 310 and the center of the first light-transmitting portion 310 is greater than the distance between the side of the second light-transmitting portion 320 close to the first light-transmitting portion 310 and the center of the first light-transmitting portion 310.

[0066] See also Figure 2 and Figure 6 In some embodiments, the first light-transmitting portion 310 is configured as a portion of uniform thickness. The ratio of the distance D2 between the side of the first blocking portion 510 away from the array substrate 100 and the array substrate 100 to the thickness D1 of the first light-transmitting portion 310 is greater than 1 and less than or equal to 1.5.

[0067] In this embodiment, by making the ratio of the distance D2 between the side of the first blocking portion 510 away from the array substrate 100 and the array substrate 100 to the thickness D1 of the first light-transmitting portion 310 greater than 1 and less than or equal to 1.5, the height difference between the side of the first blocking portion 510 away from the array substrate 100 and the side of the first light-transmitting portion 310 away from the array substrate 100 can be reduced; and the flatness of the side of the optical adhesive layer 400 away from the array substrate 100 after the optical adhesive layer 400 is attached to the first light-transmitting portion 310 and the side of the first blocking portion 510 away from the light-emitting device layer 200 is improved.

[0068] It should be noted that the distance D2 between the side of the first blocking portion 510 away from the array substrate 100 and the array substrate 100 specifically refers to the distance between the side of the first blocking portion 510 away from the array substrate 100 (the upper boundary of the first blocking portion 510) and the side of the first blocking portion 510 close to the array substrate 100 (the lower boundary of the first blocking portion 510).

[0069] See also Figure 2 and Figure 8 In some embodiments, the side surface of the first blocking portion 510 away from the array substrate 100 is a first surface 511; the first surface 511 is constructed as a plane, and the first surface 511 is flush with the side of the first light-transmitting portion 310 away from the array substrate 100.

[0070] In this embodiment, by constructing the first surface 511 into a plane, the first surface 511 is flush with the side of the first light-transmitting portion 310 away from the array substrate 100; the surface flatness of the side of the optical adhesive layer 400 away from the array substrate 100 can be improved after the optical adhesive layer 400 is bonded.

[0071] See also Figure 2 and Figure 8 In some embodiments, along the arrangement direction of the first light-transmitting portion 310 and the second light-transmitting portion 320 , a side of the first blocking portion 510 close to the first light-transmitting portion 310 is flush with a side of the second light-transmitting portion 320 close to the first light-transmitting portion 310 .

[0072] In this embodiment, since the side of the first blocking portion 510 proximate to the first light-transmitting portion 310 is flush with the side of the second light-transmitting portion 320 proximate to the first light-transmitting portion 310 along the arrangement direction of the first light-transmitting portion 310 and the second light-transmitting portion 320, the optical adhesive layer 400 is bonded only to the side of the first light-transmitting portion 310 and the first blocking portion 510 away from the array substrate 100. Furthermore, since the first surface 511 is constructed as a plane, the first surface 511 is flush with the side of the first light-transmitting portion 310 away from the array substrate 100. Therefore, after bonding the optical adhesive layer 400, the side of the optical adhesive layer 400 away from the array substrate 100 does not produce a protrusion due to the height difference between the first surface 511 and the side of the first light-transmitting portion 310 away from the array substrate 100. This improves the flatness of the side of the optical adhesive layer 400 away from the array substrate 100.

[0073] See also Figure 3 and Figure 4 In some embodiments, along the arrangement direction of the first light-transmitting portion 310 and the second light-transmitting portion 320, the optical adhesive layer 400 extends out from the side of the second light-transmitting portion 320 away from the first light-transmitting portion 310, and the first blocking portion 510 is also located on the side of the second light-transmitting portion 320 away from the first light-transmitting portion 310, and between the array substrate 100 and the portion of the optical adhesive layer 400 extending out from the side of the second light-transmitting portion 320 away from the first light-transmitting portion 310.

[0074] In this embodiment, the first blocking portion 510 can support the optical adhesive layer 400 extending from the side of the second light-transmitting portion 320 away from the first light-transmitting portion 310 along the arrangement direction of the first light-transmitting portion 310 and the second light-transmitting portion 320, and prevent the optical adhesive layer 400 extending from the side of the second light-transmitting portion 320 away from the first light-transmitting portion 310 along the arrangement direction of the first light-transmitting portion 310 and the second light-transmitting portion 320 from bending toward the array substrate 100. This can thereby improve the flatness of the side of the optical adhesive layer 400 away from the array substrate 100.

[0075] In some embodiments, a side of the optical adhesive layer 400 away from the array substrate 100 along the thickness direction of the array substrate 100 is parallel to a side of the array substrate 100 close to the optical adhesive layer 400 along its own thickness direction.

[0076] See also Figure 3 and Figure 4 In some embodiments, the display panel 10 includes an encapsulation layer 600, which is located on a side of the optical adhesive layer 400 away from the array substrate 100. Along the arrangement direction of the first light-transmitting portions 310 and the second light-transmitting portions 320, opposite sides of the encapsulation layer 600 are flush with opposite sides of the optical adhesive layer 400 in a one-to-one correspondence.

[0077] In this embodiment, the encapsulation layer 600 protects the optical adhesive layer 400 to prevent external moisture from corroding the optical adhesive layer 400.

[0078] In some embodiments, the encapsulation layer 600 is located away from the array substrate 100 along the thickness direction of the array substrate 100 and is parallel to the side of the array substrate 100 that is close to the optical adhesive layer 400 along its own thickness direction.

[0079] See also Figure 3 and Figure 4 In some embodiments, the display panel 10 includes a light shielding layer 700, which is located between the array substrate 100 and the light-transmitting layer 300. Along the arrangement direction of the first light-transmitting portions 310 and the second light-transmitting portions 320, opposite sides of the light shielding layer 700 are aligned with opposite sides of the light-transmitting layer 300. The light shielding layer 700 is provided with a plurality of through holes 710, each of which contains a light-emitting device 210.

[0080] In this embodiment, the light-shielding layer 700 can shield the metal film layer on the array substrate 100 to prevent metal reflection. The light-emitting device 210 is located in a sealed space enclosed by the light-transmitting layer 300, the wall of the through hole 710, and the array substrate 100. This makes it difficult for external moisture to enter the light-emitting device 210 and corrode it.

[0081] In other embodiments, the display panel 10 includes a light shielding layer 700, which is located between the array substrate 100 and the light-transmitting layer 300. Along the arrangement direction of the first light-transmitting portions 310 and the second light-transmitting portions 320, opposite sides of the light shielding layer 700 are aligned with opposite sides of the light-transmitting layer 300. A blind hole (not shown) is provided on a side of the light shielding layer 700 away from the array substrate 100, and the light-emitting device 210 is disposed in the blind hole.

[0082] See also Figure 3 and Figure 4 In some embodiments, the display panel 10 includes side wiring 800, which includes a functional wiring 810, a side wiring 820, and a fan-out wiring 830, which are electrically connected in sequence. The functional wiring 810 is disposed between the array substrate 100 and the light shielding layer 700 and is electrically connected to the array substrate 100; the side wiring 820 is located on one side of the array substrate 100 along a first direction; and the fan-out wiring 830 is located on a side of the array substrate 100 away from the light shielding layer 700. The first direction is parallel to the plane on which the display panel 10 is located.

[0083] In this embodiment, the functional traces 810 are used to connect to signal lines in the array substrate 100, such as the data lines DL, and transmit data signals to the data lines DL via the functional traces 810. The fan-out traces 830 can be bound to the control chip or the flexible printed circuit board. The side traces 820 are used to electrically connect the functional traces 810 and the fan-out traces 830, thereby achieving electrical connection between the signal lines in the array substrate 100 and the control chip or the flexible printed circuit board.

[0084] In some embodiments, the display panel 10 includes two side circuits 800 , and the side traces 820 in the two side circuits 800 are respectively located on two opposite sides of the array substrate 100 along the first direction.

[0085] See also Figure 3 and Figure 4 In some embodiments, the side of the array substrate 100 that contacts the side trace 820 is defined as the first side surface 110. The first side surface 110 includes a first sub-side surface 111, a second sub-side surface 112, and a first connection surface 113 connecting the first sub-side surface 111 and the second sub-side surface 112. The first sub-side surface 111 is connected to the side of the array substrate 100 that is close to the light-transmitting layer 300, and the second sub-side surface 112 is connected to the side of the array substrate 100 that is away from the light-transmitting layer 300. The angle between the first sub-side surface 111 and the side of the array substrate 100 that is close to the light-transmitting layer 300 is an obtuse angle; the angle between the second sub-side surface 112 and the side of the array substrate 100 that is away from the light-transmitting layer 300 is an obtuse angle. The first connection surface 113 is perpendicular to the light-emitting surface of the display panel 10.

[0086] In this embodiment, the first sub-side surface 111 and the second sub-side surface 112 can be considered to be obtained by chamfering the edges of the rectangular parallelepiped structure. When the side trace 820 connects the functional trace 810 and the fan-out trace 830, the side trace 820 will sequentially pass through the first sub-side surface 111, the first connection surface 113, and the second sub-side surface 112. The first sub-side surface 111 can serve as an inclined transition surface between the side of the array substrate 100 close to the light-emitting device layer 200 and the first connection surface 113. The second sub-side surface 112 can serve as an inclined transition surface between the first connection surface 113 and the side of the array substrate 100 away from the light-emitting device layer 200. In this way, when laying out the side trace 820, the side trace 820 is avoided from passing through sharp right-angled areas. Instead, it is routed in gently sloped obtuse angles or flat areas, which helps improve the adhesion reliability of the side trace 820 to the first side surface 110 and prevents the side trace 820 from breaking when passing through sharp right-angled areas.

[0087] In some embodiments, the side of the array substrate 100 that contacts each side trace 820 is defined as the first side surface 110. On each first side surface 110, the angle between the first sub-side surface 111 and the side of the array substrate 100 that is closer to the light-transmitting layer 300 is an obtuse angle; and the angle between the second sub-side surface 112 and the side of the array substrate 100 that is away from the light-transmitting layer 300 is an obtuse angle.

[0088] See also Figure 3 and Figure 4 In some embodiments, the angle between the first sub-side surface 111 and the side of the array substrate 100 close to the light-transmitting layer 300 is A; the angle between the second sub-side surface 112 and the side of the array substrate 100 away from the light-transmitting layer 300 is B, where A=B.

[0089] In this embodiment, by setting angle A equal to angle B, the wiring condition of the obtuse angle area through which the side trace 820 passes when extending from the side of the array substrate 100 close to the light-transmitting layer 300 to the first sub-side surface 111 is the same as the wiring condition of the obtuse angle area through which the side trace 820 passes when extending from the second sub-side surface 112 to the side of the array substrate 100 away from the light-transmitting layer 300. The force conditions of the side trace 820 are the same, which is beneficial to improving the overall force uniformity of the side trace 820 and improving the stability of the signal transmitted by the side trace 820.

[0090] See also Figure 3 and Figure 4 In some embodiments, the display panel 10 includes a packaging structure 900, and the packaging structure 900 includes a trace packaging layer 910. The trace packaging layer 910 includes a portion located on a side of the side traces 820 facing away from the array substrate 100, and the trace packaging layer 910 includes a portion located on a side of the functional traces 810 facing away from the array substrate 100, and a portion located on a side of the fan-out traces 830 facing away from the array substrate 100.

[0091] In this embodiment, the trace encapsulation layer 910 can reliably encapsulate the side traces 800, preventing or avoiding erosion of the side traces 800 by external moisture. The trace encapsulation layer 910 can be an insulating adhesive layer with good adhesion to the side traces 800. Optionally, the trace encapsulation layer 910 is a black or gray light-shielding material, which can avoid or reduce light leakage from the sides of the array substrate 100.

[0092] In some embodiments, the display panel 10 includes two packaging structures 900, and the two packaging structures 900 correspond one-to-one to the two side lines 800; each routing packaging layer 910 includes a portion located on the side of the corresponding side routing 820 away from the array substrate 100, and each routing packaging layer 910 includes a portion located on the side of the corresponding functional routing 810 away from the array substrate 100, and a portion located on the side of the corresponding fan-out routing 830 away from the array substrate 100.

[0093] In some embodiments, a side of the first blocking portion 510 away from the first light-transmitting portion 310 along the first direction is flush with a side of the trace encapsulation layer 910 away from the array substrate 100 along the first direction.

[0094] See also Figure 3 and Figure 4 In some embodiments, the trace encapsulation layer 910 is located on a portion of the side trace 820 facing away from the array substrate 100 , and is between the side trace 820 and the light shielding layer 700 .

[0095] See also Figure 3 and Figure 4 In some embodiments, the packaging structure 900 includes a filling packaging layer 920. The filling packaging layer 920 is located on the side of the optical adhesive layer 400 close to the array substrate 100. Furthermore, along the arrangement direction of the first light-transmitting portion 310 and the second light-transmitting portion 320, a portion of the filling packaging layer 920 is located on the side of the routing packaging layer 910 away from the array substrate 100, and on the side of the first blocking portion 510 away from the first light-transmitting portion 310.

[0096] In this embodiment, by positioning the filling encapsulation layer 920 on the side of the trace encapsulation layer 910 away from the array substrate 100, the filling encapsulation layer 920 and the trace encapsulation layer 910 can double encapsulate the first side surface 110, further improving the encapsulation reliability of the first side surface 110. Optionally, the filling encapsulation layer 920 can also be made of a light-absorbing material such as black or gray.

[0097] See also Figure 3 and Figure 4 In some embodiments, the packaging structure 900 includes a light-shielding packaging layer 930; the light-shielding packaging layer 930 includes an integrally formed main portion 931 and an extension portion 932. Along the arrangement direction of the first light-transmitting portion 310 and the second light-transmitting portion 320, the main portion 931 is at least partially located on a side of the filling packaging layer 920 facing away from the array substrate 100; the extension portion 932 is located on a side of the filling packaging layer 920 facing away from the optical adhesive layer 400, and on a side of the fan-out trace 830 facing away from the array substrate 100.

[0098] In this embodiment, the light-shielding packaging layer 930 is a black material or a material with high light absorption or high grayscale. On the one hand, the light-shielding packaging layer 930 can prevent the side leakage of light from the display panel 10. On the other hand, the light-shielding packaging layer 930 can also serve as a packaging layer to improve the packaging reliability of the display panel 10, and serve as a line of defense to prevent moisture and oxygen from infiltrating the side of the display panel 10.

[0099] The main body 931 and the extension 932 of the light-shielding encapsulation layer 930 are integrally formed, and the two can be made of the same material and in the same manufacturing process, which helps simplify the manufacturing process of the light-shielding encapsulation layer 930. In addition, when the main body 931 and the extension 932 are integrally formed, the adhesion between the extension 932 and the filling encapsulation layer 920 and the fan-out trace 830 is stronger. The extension 932 can provide a certain amount of traction for the main body 931, thereby preventing the main body 931 from peeling off from the side of the display panel 10.

[0100] It should be noted that because the extension 932 is located on the side of the filling encapsulation layer 920 facing away from the optical adhesive layer 400, and the fan-out trace 830 is located on the side facing away from the array substrate 100, the extension 932 does not extend directly above the light-emitting device 210, that is, in a direction perpendicular to the plane of the array substrate 100. The extension 932 does not block the forward light output of the light-emitting device 210. Forward light output of the light-emitting device 210 refers to light emitted by the light-emitting device 210 in a direction away from the array substrate 100.

[0101] See also Figure 1 , Figure 1 FIG2 shows a top view of a display device in an embodiment of the present application. An embodiment of the present application provides a display device 1, comprising the display panel 10 described above.

[0102] In the display device 1 of this embodiment, since the first blocking portion 510 is located between the corresponding second light-transmitting portion 320 and the optical adhesive layer 400, the side of the first blocking portion 510 away from the array substrate 100 contacts the side of the optical adhesive layer 400 close to the array substrate 100; and the side of the first blocking portion 510 close to the array substrate 100 contacts the side of the corresponding second light-transmitting portion 320 away from the array substrate 100. Therefore, the first blocking portion 510 can fill the gap between the side of the second light-transmitting portion 320 away from the array substrate 100 and the side of the optical adhesive layer 400 close to the array substrate 100. Therefore, the first blocking portion 510 can support the optical adhesive layer 400 during the process of attaching the optical adhesive layer 400 to the light-transmitting layer 300, and prevent the optical adhesive layer 400 from bending toward the second light-transmitting portion 320 along the thickness direction of the second light-transmitting portion 320. By preventing the optical adhesive layer 400 from bending toward the second light-transmitting portion 320 along the thickness direction of the second light-transmitting portion 320, the flatness of the side of the optical adhesive layer 400 away from the light-transmitting layer 300 can be improved, ensuring that the edge of the optical adhesive layer 400 is always flat; and avoiding the generation of obvious splicing gaps when each display panel 10 is spliced ​​with an adjacent display panel 10 due to the uneven edge of the optical adhesive layer 400.

[0103] It should be noted that, due to the support of the first blocking part 510, the optical adhesive layer 400 will not bend toward the second light-transmitting part 320 along the thickness direction of the second light-transmitting part 320; therefore, the optical adhesive layer 400 after bonding will not move in the direction away from the second light-transmitting part 320 due to bending stress; the contact between the optical adhesive layer 400 and the first blocking part 510 will not separate; the side of the optical adhesive layer 400 close to the array substrate 100 will always maintain close contact with the side of the first blocking part 510 away from the array substrate 100; it is not easy to generate a gap between the first blocking part 510 and the optical adhesive layer 400, and the risk of generating film bubbles between the first blocking part 510 and the optical adhesive layer 400 is lower.

[0104] In summary, the display device 1 in this embodiment can reduce the risk of splicing gaps at the edges of the display panels 10 when splicing, and reduce the probability of film bubbles forming on the display panels 10 after the optical adhesive layer 400 is attached, by having the first blocking portion 510 located between the corresponding second light-transmitting portion 320 and the optical adhesive layer 400; ultimately, the display effect of the display device 1 is improved.

[0105] The technical features of the above-mentioned embodiments can be combined arbitrarily. In order to make the description concise, not all possible combinations of the technical features in the above-mentioned embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0106] The above-described embodiments merely represent several implementation methods of the present application. While the descriptions are relatively specific and detailed, they should not be construed as limiting the scope of the patent application. It should be noted that a person of ordinary skill in the art may make various modifications and improvements without departing from the spirit of the present application, and these modifications and improvements fall within the scope of protection of the present application. Therefore, the scope of protection of the present patent application shall be determined by the appended claims.

Claims

1. A display panel, characterized in that: The display panel comprises a central area and an edge area partially surrounding the central area, and includes: an array substrate; a light emitting device layer, located on one side of the array substrate; a light-transmitting layer located on a side of the light-emitting device layer away from the array substrate, the light-transmitting layer comprising a first light-transmitting portion and a second light-transmitting portion, the first light-transmitting portion being located in the central region, and the second light-transmitting portion being located in the edge region; the thickness of the second light-transmitting portion decreasing from an end of the second light-transmitting portion close to the first light-transmitting portion to an end of the second light-transmitting portion away from the first light-transmitting portion; an optical adhesive layer, located on a side of the light-transmitting layer away from the array substrate; The blocking member includes a first blocking portion; the first blocking portion is correspondingly arranged to the second light-transmitting portion; the first blocking portion is located between the corresponding second light-transmitting portion and the optical adhesive layer, and the side of the first blocking portion away from the array substrate is in contact with the side of the optical adhesive layer close to the array substrate; the side of the first blocking portion close to the array substrate is in contact with the side of the corresponding second light-transmitting portion away from the array substrate.

2. The display panel according to claim 1, wherein: The light-transmitting layer includes two second light-transmitting portions, and the two second light-transmitting portions are respectively located on two opposite sides of the first light-transmitting portion along a first direction; the first direction is parallel to the plane where the display panel is located; The blocking member includes two first blocking portions, the two first blocking portions corresponding to the two second light-transmitting portions one-to-one; a portion of the first blocking portion is located between the corresponding second light-transmitting portion and the optical adhesive layer; An orthographic projection of the first blocking portion on the array substrate overlaps with an orthographic projection of the corresponding second light-transmitting portion on the array substrate.

3. The display panel according to claim 1, wherein: The distance between the side of the first blocking portion away from the array substrate and the array substrate increases gradually from an end of the first blocking portion close to the first light-transmitting portion along the first direction to an end of the first blocking portion away from the first light-transmitting portion along the first direction, and the first direction is parallel to the plane where the display panel is located.

4. The display panel according to claim 3, wherein: The first light-transmitting portion is configured as a portion of uniform thickness; A ratio of a distance between a side of the first blocking portion away from the array substrate and the array substrate to a thickness of the first light-transmitting portion is between 0.5 and 1.

5.

5. The display panel according to claim 1, wherein: A surface of the first blocking portion on a side away from the array substrate is a first surface, and the first surface is recessed toward a side close to the array substrate.

6. The display panel according to claim 5, wherein: Along the arrangement direction of the first light-transmitting portion and the second light-transmitting portion, the orthographic projection of the first blocking portion close to the first light-transmitting portion on the array substrate is located between the orthographic projections of the opposite sides of the second light-transmitting portion on the array substrate.

7. The display panel according to claim 1, wherein: The first blocking portion is also located between the first light-transmitting portion and the optical adhesive layer; Along the arrangement direction of the first light-transmitting portion and the second light-transmitting portion, the orthographic projection of the first blocking portion close to the first light-transmitting portion on the array substrate is located between the orthographic projections of the opposite sides of the first light-transmitting portion on the array substrate.

8. The display panel according to claim 7, wherein: The first light-transmitting portion is configured as a portion of uniform thickness; A ratio of a distance between a side of the first blocking portion away from the array substrate and the array substrate to a thickness of the first light-transmitting portion is greater than 1 and less than or equal to 1.

5.

9. The display panel according to claim 1, wherein: A surface of the first blocking portion away from the array substrate is a first surface; the first surface is configured as a plane, and is flush with a side of the first light-transmitting portion away from the array substrate.

10. The display panel according to claim 9, wherein: Along the arrangement direction of the first light-transmitting portion and the second light-transmitting portion, a side of the first blocking portion close to the first light-transmitting portion is flush with a side of the second light-transmitting portion close to the first light-transmitting portion.

11. The display panel according to claim 1, wherein Along the arrangement direction of the first light-transmitting portion and the second light-transmitting portion, the optical adhesive layer extends out from a side of the second light-transmitting portion away from the first light-transmitting portion; The first blocking portion is further located on a side of the second light-transmitting portion away from the first light-transmitting portion, and between the array substrate and a portion of the optical adhesive layer extending out from a side of the second light-transmitting portion away from the first light-transmitting portion.

12. The display panel according to claim 11, wherein: The display panel includes an encapsulation layer, and the encapsulation layer is located on a side of the optical adhesive layer away from the array substrate; Along the arrangement direction of the first light-transmitting portion and the second light-transmitting portion, opposite sides of the encapsulation layer are flush with opposite sides of the optical adhesive layer in a one-to-one correspondence.

13. The display panel according to claim 1, wherein The display panel includes a light shielding layer, and the light shielding layer is located between the array substrate and the light-transmitting layer; Along the arrangement direction of the first light-transmitting portion and the second light-transmitting portion, the opposite two sides of the light-shielding layer are flush with the opposite two sides of the light-transmitting layer in a one-to-one correspondence; Wherein, a plurality of through holes are provided on the light-shielding layer, and light-emitting devices are provided in the through holes.

14. The display panel according to claim 13, wherein: The display panel includes side wiring, and the side wiring includes a functional wiring, a side wiring, and a fan-out wiring that are electrically connected in sequence; The functional wiring is arranged between the array substrate and the light shielding layer, and the functional wiring is electrically connected to the array substrate; the side wiring is located on one side of the array substrate along the first direction; the fan-out wiring is located on the side of the array substrate away from the light shielding layer; The first direction is parallel to the plane where the display panel is located.

15. The display panel according to claim 14, wherein: A side of the array substrate in contact with the side trace is defined as a first side surface; the first side surface includes a first sub-side surface, a second sub-side surface, and a first connecting surface connecting the first sub-side surface and the second sub-side surface; In which, the first sub-side surface is connected to the side of the array substrate close to the light-transmitting layer, and the second sub-side surface is connected to the side of the array substrate away from the light-transmitting layer; the angle between the first sub-side surface and the side of the array substrate close to the light-transmitting layer is an obtuse angle; the angle between the second sub-side surface and the side of the array substrate away from the light-transmitting layer is an obtuse angle; and the first connecting surface is perpendicular to the light-emitting surface of the display panel.

16. The display panel according to claim 15, wherein: The angle between the first sub-side surface and the side of the array substrate close to the light-transmitting layer is A; the angle between the second sub-side surface and the side of the array substrate away from the light-transmitting layer is B, where A=B.

17. The display panel according to claim 14, wherein: The display panel includes a packaging structure, and the packaging structure includes a wiring packaging layer; The routing encapsulation layer includes a portion located on the side of the side routing away from the array substrate, and the routing encapsulation layer includes a portion located on the side of the functional routing away from the array substrate, and a portion located on the side of the fan-out routing away from the array substrate.

18. The display panel according to claim 17, wherein: The routing encapsulation layer is located at a portion of the side routing facing away from the array substrate, and is between the side routing and the light shielding layer.

19. The display panel according to claim 17, wherein: The packaging structure includes a filling packaging layer; The filling packaging layer is located on the side of the optical adhesive layer close to the array substrate; and along the arrangement direction of the first light-transmitting portion and the second light-transmitting portion, part of the filling packaging layer is located on the side of the routing packaging layer away from the array substrate, and the side of the first blocking portion away from the first light-transmitting portion.

20. The display panel according to claim 19, wherein The packaging structure includes a light-shielding packaging layer; the light-shielding packaging layer includes an integrally formed main body portion and an extension portion; Along the arrangement direction of the first light-transmitting portion and the second light-transmitting portion, the main body portion is at least partially located on a side of the filling packaging layer away from the array substrate; the extension portion is located on a side of the filling packaging layer away from the optical adhesive layer, and on a side of the fan-out wiring away from the array substrate.

21. A display device, characterized in that: The display panel comprises the display panel described in any one of claims 1 to 20.

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